A tin coating device for LED lamp production

Abstract

The application relates to a tin coating device, in particular to a tin coating device for LED lamp production. The tin coating device for LED lamp production can scrape the tin paste on the copper lacquer wire uniformly, and improves the tin coating effect. The tin coating device for LED lamp production comprises a mounting frame, a placing frame and a guide rod, etc. The placing frame for placing the mold with the copper lacquer wire is fixed between the front and rear sides of the bottom of the mounting frame. The guide rod is fixedly penetrated between the left and right sides of the upper rear side of the mounting frame. The mold with the copper lacquer wire is placed on the placing frame, the tin paste is sprayed on the copper lacquer wire by starting the paint applicator, then the servo motor is started to rotate, so that the storage box drives the paint applicator to move left to comprehensively tin the copper lacquer wire, and the storage box also drives the limiting frame to move left, so that the scraping plate moves left to scrape the tin paste on the copper lacquer wire uniformly, thereby improving the tin coating effect.

Description

Technical Field

[0001] This invention relates to a tin-coating apparatus, and more particularly to a tin-coating apparatus for LED lamp production. Background Technology

[0002] LED lights require multiple processing steps during production. Tinning the copper wires on the mold makes it easier to solder the LED chips onto them later.

[0003] Chinese patent CN206298633U discloses a tin-coating device for LED lamp production, which includes a machine base, a controller, and a tin box. The controller is set on the machine base, and a groove is provided in the middle of the machine base. Multiple mold limiting grooves for fixing molds are provided on the left and right side walls of the groove. Slider blocks are fitted on the columns. The left and right sides of the tin box are connected to the sliders through connecting blocks. The tin box is provided with multiple tin storage grooves, and multiple tin-coating holes are provided at the lower end of the tin storage grooves. Although the above patent can tin-coate copper wires through a tin-coating mesh, the tin-coating mesh is mesh-like, which can easily lead to uneven application of solder paste during the tin-coating process, affecting the tin-coating effect.

[0004] The present invention aims to solve the problems existing in the above-mentioned patents. To this end, a tinning device for LED lamp production is proposed, which can scrape the solder paste on the copper wire evenly and improve the tinning effect. Summary of the Invention

[0005] To overcome the shortcomings of the aforementioned patents, which, although capable of tinning copper wires using a tinning mesh, tend to result in uneven solder paste application during the tinning process, thus affecting the tinning effect, this invention provides a tinning device for LED lamp production that can evenly scrape the solder paste on copper wires, thereby improving the tinning effect.

[0006] This invention is achieved through the following technical means:

[0007] A soldering device for LED lamp production includes a mounting frame, a placement frame, a first lead screw, a guide rod, a storage box, and a solder applicator. The mounting frame has a placement frame fixedly connected between its bottom front and rear sides for placing a mold wound with copper-plated wire. A guide rod is fixedly connected between the upper rear sides of the left and right sides of the mounting frame. A storage box is slidably mounted on the guide rod. Three discharge ends of the storage box are connected to a solder applicator for applying solder paste to the copper-plated wire. A first lead screw is rotatably connected between the upper front sides of the left and right sides of the mounting frame to move the storage box. The first lead screw is threaded to the front side of the storage box. The device also includes a drive mechanism and a scraping mechanism. The placement frame has a drive mechanism for rotating the first lead screw, and the outside of the storage box has a scraping mechanism for evenly scraping the solder paste on the copper-plated wire.

[0008] Further explanation: The drive mechanism includes a fixed frame, a servo motor, and a transmission assembly. The fixed frame is fixedly connected to the middle of the top right side of the placement frame, and the servo motor is fixedly connected to the fixed frame. The transmission assembly is connected between the output shaft of the servo motor and the right side of the first lead screw.

[0009] Further explanation: The scraping mechanism includes a limit frame, guide posts, second lead screws, and scraper plates. The limit frame is fixed to the bottom of the storage box. Three guide posts are evenly spaced and slidably connected to the lower right side of the limit frame. The bottom ends of the three guide posts are fixed to scraper plates for evenly scraping the solder paste on the copper wire. The scraper plates are located on the right side of the solder applicator. The inner side of the scraper plates is hollow. Three second lead screws are evenly spaced and threaded to the lower left side of the limit frame for moving the scraper plates. The bottom ends of the three second lead screws are rotatably connected to the top of the three scraper plates, respectively.

[0010] Further explanation includes a cleaning mechanism for removing residual solder paste from the scraper. The cleaning mechanism includes a compression cylinder, a piston frame, a first spring, a one-way hose, and a trigger rod. Compression cylinders are fixedly connected at even intervals at the lower part of the limiting frame. The piston frame is slidably connected between the inner sides of the three compression cylinders. The first spring is connected between the inner top of the piston frame and the outer top of the three compression cylinders. The bottom of each of the three compression cylinders is connected to a one-way hose for venting air into the scraper. The tail ends of the three one-way hoses are fixedly connected to and communicate with the right side of the three scrapers, respectively. A trigger rod for driving the piston frame to move downward is symmetrically fixed to the upper part of the left side of the mounting frame. The right side of the trigger rod is an inclined surface.

[0011] Further explanation includes a positioning mechanism for clamping and fixing the mold with copper paint wire. The positioning mechanism includes a fixed plate, a guide rod, a second spring, and a pad. Fixed plates are evenly spaced and fixed to the upper part of the left and right sides of the outer side of the placement frame. Guide rods are slidably connected to the upper part of the six fixed plates. Pads for clamping and fixing the mold are fixed to the inner ends of the six guide rods. The outer side of the six pads is connected to the upper part of the inner side of the six fixed plates, and a second spring fitted on the guide rod is connected to the guide rod.

[0012] Further explanation includes the presence of filters, with evenly spaced filters fixedly inserted on the top left side of the rack to filter out impurities from the solder paste.

[0013] Further explanation includes a placement plate and a collection box. The placement plate is fixed between the lower left sides of the front and rear sides of the mounting bracket. A collection box for collecting fallen solder paste is placed on top of the placement plate. The collection box is located directly below the filter.

[0014] Further explanation includes the presence of rotating wheels, with rotating wheels fixed to the top of each of the three second lead screws.

[0015] The significant advancement of this invention lies in:

[0016] 1. Place the mold with the copper-coated wire on the placement rack, start the coating machine to spray solder paste onto the copper-coated wire, and then start the servo motor to rotate forward, which causes the storage box to move the coating machine to the left to fully coat the copper-coated wire with solder. The storage box also causes the limit frame to move to the left, which causes the scraper to move to the left to scrape the solder paste on the copper-coated wire evenly, thereby improving the soldering effect.

[0017] 2. Under the action of the cleaning mechanism, whenever the scraper finishes scraping the solder paste on the copper wire, the cleaning mechanism can remove the solder paste remaining on the scraper, which can prevent a large amount of solder paste remaining on the scraper from affecting subsequent use, thereby ensuring the normal use effect of the scraper.

[0018] 3. Under the action of the positioning mechanism, whenever the mold with copper paint wire is placed on the placement rack, the positioning mechanism can clamp and fix the mold, which can prevent the copper paint wire from moving and affecting the tinning, thus ensuring the normal tinning of the copper paint wire. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0020] Figure 2 This is a three-dimensional structural diagram of the mounting bracket of the present invention.

[0021] Figure 3 This is a three-dimensional structural diagram of the driving mechanism of the present invention.

[0022] Figure 4 This is a first-view three-dimensional structural diagram of the scraping mechanism of the present invention.

[0023] Figure 5 This is a second-view three-dimensional structural diagram of the scraping mechanism of the present invention.

[0024] Figure 6 This is a partial cross-sectional view of the material cleaning mechanism of the present invention.

[0025] Figure 7 This is an enlarged schematic diagram of part A of the present invention.

[0026] Figure 8 This is a three-dimensional structural diagram of the positioning mechanism of the present invention.

[0027] Figure 9 This is a three-dimensional structural diagram of the filter screen of the present invention.

[0028] Figure 10 This is a three-dimensional structural diagram of the collection box of the present invention.

[0029] In the attached diagram, the following labels are used: 1-mounting bracket, 2-placement bracket, 21-first lead screw, 22-guide rod, 3-storage box, 31-soldering device, 4-drive mechanism, 41-fixed bracket, 42-servo motor, 43-transmission assembly, 5-scraping mechanism, 51-limiting bracket, 52-guide post, 53-second lead screw, 54-scraper plate, 55-rotor, 6-cleaning mechanism, 61-compression cylinder, 62-piston frame, 63-first spring, 64-one-way hose, 65-trigger rod, 7-positioning mechanism, 71-fixed plate, 72-guide rod, 73-second spring, 74-pad, 8-filter screen, 9-placement plate, 10-collection box. Detailed Implementation

[0030] First, it should be noted that in different described embodiments, the same components are given the same reference numerals or the same component names. The disclosure contained throughout this specification can be applied semantically to the same components having the same reference numerals or the same component names. The location descriptions selected in the specification, such as upper, lower, and lateral, also refer to the directly described and illustrated figures and are semantically applied to the new location when the location changes.

[0031] Example 1

[0032] A tin-coating device for LED lamp production includes a mounting frame 1, a placement frame 2, a first lead screw 21, a guide rod 22, a storage box 3, a tin coater 31, a drive mechanism 4, and a scraping mechanism 5. (See also...) Figures 1-5 As shown, a placement frame 2 is installed between the front and rear sides of the bottom of the mounting frame 1 by welding. The placement frame 2 can place the mold with copper paint wire. A guide rod 22 is fixedly connected between the upper rear sides of the left and right sides of the mounting frame 1. A storage box 3 is slidably mounted on the guide rod 22. The three discharge ends of the storage box 3 are connected to a solder applicator 31. When the solder applicator 31 moves, it can apply solder paste to the copper paint wire. A first lead screw 21 is rotatably connected between the upper front sides of the left and right sides of the mounting frame 1. The first lead screw 21 is threaded to the front side of the storage box 3. When the first lead screw 21 rotates, it can drive the storage box 3 to move. A drive mechanism 4 is provided on the placement frame 2. When the drive mechanism 4 operates, it can drive the first lead screw 21 to rotate. A scraping mechanism 5 is provided on the outside of the storage box 3. When the scraping mechanism 5 operates, it can scrape the solder paste on the copper paint wire evenly.

[0033] The drive mechanism 4 includes a fixed frame 41, a servo motor 42, and a transmission assembly 43. Please refer to [link / reference]. Figure 1 and Figure 3As shown, a fixed frame 41 is installed in the middle of the top right side of the placement frame 2 by bolt connection. A servo motor 42 is fixedly connected to the fixed frame 41. A transmission assembly 43 is connected between the output shaft of the servo motor 42 and the right side of the first lead screw 21. The transmission assembly 43 consists of two pulleys and a flat belt. One pulley is fixedly mounted on the right side of the first lead screw 21, and the other pulley is fixedly mounted on the output shaft of the servo motor 42. The flat belt is wound between the two pulleys.

[0034] The scraping mechanism 5 includes a limit frame 51, a guide post 52, a second lead screw 53, a scraper 54, and a rotary wheel 55. Please refer to [link / reference]. Figure 1 , Figure 4 and Figure 5 As shown, a limit frame 51 is installed on the bottom of the storage box 3 by welding. Three guide posts 52 are evenly spaced and slidably connected to the lower right side of the limit frame 51. A scraper 54 is fixed to the bottom of the three guide posts 52. The scraper 54 is located on the right side of the solder applicator 31. When the scraper 54 moves, it can scrape the solder paste on the copper wire evenly. The inner side of the scraper 54 is hollow. Three second lead screws 53 are evenly threaded and connected to the lower left side of the limit frame 51. The bottom of the three second lead screws 53 is rotatably connected to the top of the three scraper 54 respectively. When the second lead screws 53 move, they can drive the scraper 54 to move. The top of each of the three second lead screws 53 is installed with a rotating wheel 55 by welding.

[0035] First, pour an appropriate amount of solder paste into the storage tank 3. The solder paste in the storage tank 3 is then discharged into the solder coater 31. Place three molds with copper wire wound on the placement rack 2. The copper wire is positioned below the solder coater 31 and in contact with the inner side of the scraper 54. Then, twist the rotating wheel 55 to drive the second lead screw 53 to rotate alternately in both directions. Due to the action of the rotating wheel 55, it is easier to twist the second lead screw 53 to rotate. The alternating rotation of the second lead screw 53 moves up and down through the screw thread. The up and down movement of the second lead screw 53 drives the scraper 54 to move up and down. When the scraper 54 moves up and down to the appropriate position to scrape the solder paste, stop twisting the rotating wheel 55 to drive the second lead screw 53 to rotate alternately in both directions. By adjusting the position of the scraper 54, the solder paste on the copper wire can be scraped off to the required thickness. Then, start the solder coater 31 to spray the solder paste onto the copper wire. Then, start the servo motor 42 to rotate forward. The forward rotation of the servo motor 42 drives the transmission component 43 to rotate forward. The forward rotation of the transmission component 43 drives... The first lead screw 21 rotates forward, causing the storage box 3 to move to the left. The leftward movement of the storage box 3 causes the solder coater 31 to move to the left, applying solder to the copper wire. At the same time, the leftward movement of the storage box 3 also causes the limit frame 51 to move to the left. The leftward movement of the limit frame 51, through the second lead screw 53, causes the scraper 54 to move to the left. The scraper 54 scrapes the solder paste evenly on the copper wire, ensuring that the solder paste is evenly distributed on the copper wire. When the scraper 54 moves to the left to its maximum stroke, it indicates that the soldering on the copper wire is complete. The solder coater 31 is then turned off, and the solder paste stops spraying. The servo motor 42 is started to reverse, causing the transmission component 43 to reverse. The reverse rotation of the transmission component 43 causes the first lead screw 21 to reverse, which causes the storage box 3 to move to the right and reset. The reset of the storage box 3 causes the solder coater 31 to move to the right and reset, and also causes the scraper 54 to move to the right and reset. Finally, the soldered copper wire is removed from the placement rack 2. Thus, the squeegee 54 can evenly scrape the solder paste on the copper wire, thereby improving the soldering effect.

[0036] Example 2

[0037] Based on Embodiment 1, a cleaning mechanism 6 is also included. The cleaning mechanism 6 includes a compression cylinder 61, a piston frame 62, a first spring 63, a one-way hose 64, and a trigger rod 65. Please refer to [link to previous document]. Figure 1 , Figure 6 and Figure 7As shown, compression cylinders 61 are evenly spaced at the bottom of the limiting frame 51 and connected by welding. Piston frames 62 are slidably connected between the inner sides of the three compression cylinders 61. A first spring 63 is connected between the inner top of the piston frame 62 and the outer top of the three compression cylinders 61. One-way hoses 64 are connected to the bottom of the three compression cylinders 61. The tail ends of the three one-way hoses 64 are fixedly connected to and connected to the right side of the three scraper plates 54 respectively. The one-way hoses 64 can discharge air into the scraper plates 54. Trigger rods 65 are symmetrically connected by welding on the upper left side of the mounting frame 1. The right side of the trigger rod 65 is inclined. When the piston frame 62 moves to the left and contacts the trigger rod 65, the trigger rod 65 can drive the piston frame 62 to move downward.

[0038] It also includes a positioning mechanism 7, which comprises a fixed plate 71, a guide rod 72, a second spring 73, and a pad 74. Please refer to [link / reference]. Figure 1 and Figure 8 As shown, fixed plates 71 are evenly spaced and welded together on the upper part of the left and right sides of the placement frame 2. Guide rods 72 are slidably connected to the upper part of each of the six fixed plates 71. A pad 74 is fixed to the inner end of each of the six guide rods 72. When the pad 74 contacts the mold, it can clamp and fix the mold. A second spring 73 fitted on the guide rod 72 is connected between the outer side of the six pads 74 and the upper part of the inner side of the six fixed plates 71.

[0039] When the servo motor 42 starts rotating forward, the limit bracket 51 moves to the left, which in turn drives the compression cylinder 61 to move to the left. The compression cylinder 61 moves to the left, which in turn drives the piston bracket 62 to move to the left. When the piston bracket 62 moves to the left and contacts the trigger rod 65, it indicates that the copper wire has been tinned. The tinneret 31 stops spraying solder paste, and the trigger rod 65 drives the piston bracket 62 to move downward. The first spring 63 is compressed, and the downward movement of the piston bracket 62 pushes the air in the compression cylinder 61 into the one-way hose 64. Air from component 4 is expelled into the scraper plate 54 and then ejected through it, removing residual solder paste. When the servo motor 42 starts reversing, the limit bracket 51 moves to the right, causing the compression cylinder 61 to move to the right and reset. The compression cylinder 61 then moves the piston frame 62 to the right and reset, disengaging it from the trigger rod 65. Due to the action of the first spring 63, the piston frame 62 moves upward and resets, drawing air into the compression cylinder 61. This prevents a large amount of residual solder paste on the scraper plate 54 from affecting subsequent use, thus ensuring the normal operation of the scraper plate 54.

[0040] First, pull the left and right guide rods 72 outwards. This outward movement of the guide rods 72 causes the left and right pads 74 to move outwards as well, compressing the second spring 73. When the pads 74 move to the appropriate position, place the mold with the copper-coated wire on the placement rack 2. Release the left and right guide rods 72. Due to the action of the second spring 73, the left and right pads 74 move inwards to contact the mold, clamping and fixing it in place. The tinning process for the copper-coated wire can then begin. After the copper-coated wire is tinned, remove the mold and proceed with subsequent processing. This prevents the movement of the mold from affecting the tinning process, ensuring proper tinning of the copper-coated wire.

[0041] Example 3

[0042] Based on Examples 1 and 2, a filter 8 is also included; please refer to Example 2. Figure 9 As shown, filters 8 are fixedly connected at even intervals on the top left side of the placement rack 2. The filters 8 can filter out impurities in the solder paste.

[0043] It also includes a placement board 9 and a collection box 10, please refer to [link / reference]. Figure 10 As shown, a placement plate 9 is installed between the lower left sides of the front and rear sides of the mounting bracket 1 by welding. A collection box 10 is placed on top of the placement plate 9. The collection box 10 is located directly below the filter screen 8 and can collect the fallen solder paste.

[0044] When air removes the solder paste from the scraper plate 54, the removed solder paste falls onto the filter screen 8. The filter screen 8 filters out impurities from the solder paste. The filtered solder paste then falls through the filter screen 8 and is collected by a collection container placed below the filter screen 8. The collection container is then removed for further processing of the solder paste. This method prevents the removed solder paste from falling onto the rack 2 and making it easier to collect and process.

[0045] When solder paste falls through the filter screen 8, it falls into the collection box 10. When the collection box 10 contains an appropriate amount of solder paste, it is removed from the placement plate 9 to process the solder paste. After all the solder paste has been poured out, the collection box 10 is placed back on the placement plate 9. In this way, there is no need to use an additional collection container to collect the fallen solder paste, making the collection and processing of fallen solder paste more convenient.

[0046] Finally, it is necessary to note that the above content is only used to help understand the technical solution of the present invention and should not be construed as a limitation on the scope of protection of the present invention; any non-essential improvements and adjustments made by those skilled in the art based on the above content of the present invention are all within the scope of protection claimed by the present invention.

Claims

1. A tin-coating device for LED lamp production, comprising a mounting frame (1), a placement frame (2), a first lead screw (21), a guide rod (22), a storage box (3), and a tin coater (31), wherein the mounting frame (1) is fixedly connected between the front and rear sides of the bottom of the mounting frame (1) for placing a mold wound with copper paint wire, the upper rear sides of the left and right sides of the mounting frame (1) are fixedly connected to the guide rod (22), the storage box (3) is slidably mounted on the guide rod (22), the three discharge ends of the storage box (3) are all connected to the tin coater (31) for applying solder paste to the copper paint wire, the upper front sides of the left and right sides of the mounting frame (1) are rotatably connected to the first lead screw (21) for moving the storage box (3), the first lead screw (21) is threadedly connected to the front side of the storage box (3), characterized in that, It also includes a drive mechanism (4) and a scraping mechanism (5). The placement rack (2) is equipped with a drive mechanism (4) for driving the first lead screw (21) to rotate. The storage box (3) is equipped with a scraping mechanism (5) for scraping the solder paste on the copper paint wire evenly. The scraping mechanism (5) includes a limit frame (51), guide posts (52), second screws (53) and scraper (54). The limit frame (51) is fixed to the bottom of the storage box (3). Three guide posts (52) are evenly spaced and slidably connected to the lower right side of the limit frame (51). The scraper (54) for scraping the solder paste on the copper wire evenly is fixed to the bottom of the three guide posts (52). The scraper (54) is located on the right side of the solder applicator (31). The inner side of the scraper (54) is hollow. Three second screws (53) for moving the scraper (54) are evenly spaced and threaded to the lower left side of the limit frame (51). The bottom of the three second screws (53) is rotatably connected to the top of the three scraper (54) respectively. It also includes a cleaning mechanism (6) for removing residual solder paste on the scraper plate (54). The cleaning mechanism (6) includes a compression cylinder (61), a piston frame (62), a first spring (63), a one-way hose (64), and a trigger rod (65). The compression cylinders (61) are fixedly connected at even intervals at the lower part of the limiting frame (51). The piston frame (62) is slidably connected between the inner sides of the three compression cylinders (61). The first spring (63) is connected between the inner top of the piston frame (62) and the outer top of the three compression cylinders (61). The bottom of the three compression cylinders (61) is connected to a one-way hose (64) for discharging air into the scraper plate (54). The tail ends of the three one-way hoses (64) are fixedly connected to the right side of the three scraper plates (54) respectively. The upper left side of the mounting frame (1) is symmetrically fixed with a trigger rod (65) for driving the piston frame (62) to move downward. The right side of the trigger rod (65) is an inclined surface. It also includes a positioning mechanism (7) for clamping and fixing the mold with copper paint wire. The positioning mechanism (7) includes a fixed plate (71), a guide rod (72), a second spring (73) and a pad (74). Fixed plates (71) are evenly spaced and fixed to the upper part of the left and right sides of the placement frame (2). Guide rods (72) are slidably connected to the upper part of the six fixed plates (71). The pads (74) for clamping and fixing the mold are fixed to the inner ends of the six guide rods (72). The outer side of the six pads (74) is connected to the upper part of the inner side of the six fixed plates (71) respectively by a second spring (73) fitted on the guide rod (72).

2. The tin-coating apparatus for LED lamp production according to claim 1, characterized in that, The drive mechanism (4) includes a fixed frame (41), a servo motor (42) and a transmission assembly (43). The fixed frame (41) is fixedly connected to the middle of the top right side of the placement frame (2). The servo motor (42) is fixedly connected to the fixed frame (41). The transmission assembly (43) is connected between the output shaft of the servo motor (42) and the right side of the first lead screw (21).

3. The tin-coating apparatus for LED lamp production according to claim 2, characterized in that, It also includes a filter screen (8), and the top left side of the placement rack (2) is fixedly connected with a filter screen (8) for filtering impurities in the solder paste.

4. A tin-coating apparatus for LED lamp production according to claim 3, characterized in that, It also includes a placement plate (9) and a collection box (10). The placement plate (9) is fixed between the lower left sides of the front and rear sides of the mounting bracket (1). The collection box (10) for collecting fallen solder paste is placed on the top of the placement plate (9). The collection box (10) is located directly below the filter screen (8).

5. A tin-coating apparatus for LED lamp production according to claim 4, characterized in that, It also includes a rotating wheel (55), and the tops of the three second lead screws (53) are all fixed with rotating wheels (55).

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