A measuring device for synchronously collecting spatial coordinates and temperature information

Abstract

The present application relates to a kind of measurement device of spatial coordinate and temperature information synchronous acquisition, including temperature measurement part and spatial coordinate measurement part, spatial coordinate measurement part is composed of target ball and bolt target seat matched with laser tracker;Temperature measurement part is composed of upper end cover, lithium battery, power supply and parameter switch, PCB circuit board, antenna interface, rotatable rubber stick antenna, aviation plug interface, surface mount sensor, cap shell contact sensor, lower end cover, bottom plate, paste composition.The present application has two kinds of temperature measurement mode, temperature data is transmitted by wireless communication, device temperature measurement part is connected with target seat thread, target ball is adsorbed to target seat by magnetic force, can simultaneously obtain the temperature data of measurement point spatial coordinate and its area.The present application is modular design as a whole, compact structure, the characteristics of cylindrical shape structure of modular assembly, wireless communication, multi-mode temperature measurement are widely applicable in large component assembly site environment, and strong reliability.

Description

Technical Field

[0001] This invention belongs to the field of object geometric measurement and relates to a measuring device for synchronously acquiring spatial coordinates and temperature information. Background Technology

[0002] A laser tracker is a large-scale precision measuring instrument that tracks and measures the three-dimensional coordinates of a moving target in space in real time. It offers advantages such as non-contact operation, high measurement accuracy, and ease of operation, and is widely used in the assembly of large components. The assembly environment for large components is often an open factory building, where the ambient temperature is unsteady and non-uniform, easily causing irregular thermal deformation of the tooling and components. This leads to displacement of the measurement points on the tooling, affecting the reliability of the measurement data and compromising assembly quality. Therefore, during on-site measurement, the laser tracker must monitor the temperature information of the measurement points.

[0003] Currently, laser trackers can only acquire the temperature at the instrument's location, not the temperature of the point being measured. Furthermore, there are many shortcomings in the measurement methods and data representation of the temperature at the point being measured. For example, patent CN202110506164.1, "A Temperature-Compensated Digital Tooling Aircraft Coordinate System Calibration Method," discloses a temperature-compensated digital tooling aircraft coordinate system calibration method that calibrates the coordinates of an ERS point group relative to the aircraft coordinate system at a reference temperature into a digital tooling. This method only acquires the spatial coordinates of the measuring point in the aircraft coordinate system and its ambient temperature. However, different measuring points distributed in the same environment have different temperatures. Directly using a single temperature as the actual temperature of other measuring points for temperature compensation results in incomplete temperature data and weakened compensation capabilities. In their article "Compensation Method for Thermal Deformation Error in Transfer Station Measurement of Variable Curvature Components" published in *Chinese Journal of Lasers*, Vol. 48, No. 115, 2021, Li Zhuyue et al. from Changchun University of Technology proposed a novel method for compensating thermal deformation error in large-scale transfer station measurement based on the global coordinate system thermal deformation coefficient. This method obtains three-dimensional position information of temperature and reference points using fiber Bragg gratings and laser trackers. However, this temperature measurement method is wired and only applicable to a few points. In actual working conditions, the spatial range is large and the temperature distribution is non-uniform. This wired temperature measurement method cannot characterize the entire field condition. Furthermore, this method has a limited range, complex wiring layout, and difficulty in accurately determining the location of temperature measurement points, leading to a mismatch between the spatial coordinates of the measurement points and the temperature. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of existing technologies and to develop a measuring device that simultaneously acquires spatial coordinates and temperature information. This device adopts a modular design, with the overall shape assembled into a cylindrical structure for easy carrying and transportation. It uses a laser tracker to simultaneously acquire temperature and spatial coordinate data of the measurement point, and employs both wireless communication and sensors for temperature measurement. The device consists of a spatial coordinate measurement section and a temperature measurement section. It has a wide range of applications and high reliability in large component assembly environments, serving the precision measurement of large components in long-term, high-temperature-difference environments, and has broad application prospects.

[0005] The technical solution adopted in this invention is a measuring device for synchronous acquisition of spatial coordinates and temperature information. The device is characterized by a modular design, with the overall shape assembled into a cylindrical structure. It employs both wireless communication and sensor-based temperature measurement methods. The device consists of a spatial coordinate measurement section and a temperature measurement section.

[0006] The spatial coordinate measurement part consists of a laser tracker 15, a target ball 1, and a target base 2 with bolts; the target ball 1 is adsorbed onto the target base 2, and the target base 2 with bolts is fixed to the threaded hole 3.1 of the upper end cover 3 by bolts;

[0007] The temperature measurement section consists of an upper cover 3, a lithium battery 4, a power supply and parameter switch 5, a PCB circuit board assembly, an antenna interface 7, a rotatable glue rod antenna 8, an aviation plug interface 9, a surface patch sensor 10, a cap-type contact sensor 11, a lower cover 12, a base plate 13, and an adhesive 14. The upper cover 3 is cylindrical, with a threaded center hole 3.1 machined in the center of the upper surface, a rectangular lithium battery mounting slot 3.2 and a power supply and parameter switch mounting slot 3.3 machined in the inner cavity, a square through hole 3.4 on the side of the upper cover, and an internal thread 3.5 machined in the bottom of the inner cavity of the upper cover 3.

[0008] The power module for temperature measurement consists of a lithium battery 4, lead wires 4.1, and an SM connector 4.2. The lithium battery 4 is fixed in the rectangular lithium battery mounting slot 3.2 of the upper cover. The lead wires are led out from the positive and negative terminals of the lithium battery and connected to the power interface 6.1 of the PCB board through the SM connector 4.2.

[0009] The control module consists of a power and parameter switch 5, lead wires 5.1, a power SM plug 5.2, and a microcontroller 6.5. The power and parameter switch 5 is installed in the power and parameter switch mounting slot 3.3 on the upper cover. The lead wires are led out from the switch and connected to the control signal interface 6.2 on the PCB board through the power SM plug 5.2. The microcontroller 6.5 is connected to the printed circuit on the PCB board. The switch part is exposed through the square through hole 3.4 on the side of the upper cover 3 for easy operation.

[0010] The signal conversion module consists of a PCB board 6, a microcontroller 6.5, and a wireless communication module 6.3. Both the microcontroller 6.5 and the wireless communication module 6.3 are located on the lower surface of the PCB board and are connected to other interfaces through printed circuits. Due to changes in ambient temperature, the resistance of the NTC thermistor changes, resulting in a slight change in current. This current change information is captured by the microcontroller 6.5 and converted into an electrical signal, which is then input to the wireless communication module 6.3.

[0011] The signal output module consists of a wireless communication module 6.3, an antenna interface 7, and a rotatable glue rod antenna 8. The antenna interface 7 is fixed in the through hole 12.1 on the left side of the lower end cover 12 and is connected to the output signal interface 6.6 on the PCB board by a lead wire. The rotatable glue rod antenna 8 is connected to the antenna interface 7 on the outside. The data measured by the temperature sensor is transmitted to the wireless communication module 6.3. The wireless communication module transmits the temperature signal through the rotatable glue rod antenna using 433MHz FSK radio frequency communication technology.

[0012] The surface mount sensor 10, the cap-type contact sensor 11, and the aviation plug interface 9 constitute the signal input module of the temperature measurement section. The cap-type contact sensor 11 is installed in the center countersunk bolt hole 12.6 of the lower end cover and the center hole 13.2 of the base plate. It is connected to the input signal interface 6.4 of the PCB board by a lead wire. Its lead wire protrudes from the through hole 12.4 on the right side to contact the temperature to be measured and is connected to the microcontroller 6.5.

[0013] The lower end cover 12 is cylindrical, with external threads 12.7 machined on its upper outer contour surface. The bottom of the lower end cover 12 has four evenly distributed short cylindrical bosses 12.2, each with a threaded hole in its center. The base plate 13 has four countersunk through holes 13.1, which are connected and fixed to the threaded holes on the four short cylindrical bosses by four screws. Two connecting screws 6.7 are used to fix the PCB board 6 to the two front and rear long cylindrical bosses 12.3 and 12.5 with screw holes inside the lower end cover 12 through the front and rear connecting holes 6.8 and 6.9 on the PCB board 6, respectively. The upper part of the lower end cover 12 is connected and fixed to the lower part of the upper end cover 3 by external threads 12.7 and internal threads 3.5.

[0014] There are two types of base plates 13: magnetic base plates and adhesive base plates. If the measuring point is on a ferromagnetic material surface, a magnetic base plate is used; if the measuring point is on a non-ferromagnetic material surface, an adhesive base plate is used. The two are interchangeable. The adhesive base plate 13 has a central through hole 13.2 and a circular groove 13.3. The adhesive 14 is attached to the circular groove 13.3 for easy replacement and development.

[0015] Compared with the prior art, the beneficial effects of this invention are as follows:

[0016] 1. When used in conjunction with a laser tracker, the device can simultaneously acquire the spatial coordinates of the point to be measured and the temperature data of the area at that point.

[0017] 2. This invention provides two temperature measurement methods. The first method involves fixing the device to the point to be measured and acquiring temperature information through contact between the sensor at the bottom and the point. This method is suitable for locations where the device can be placed. The second method involves attaching a patch sensor to the point to acquire temperature information. This method is suitable for situations where the location is complex and the device is not suitable for placement. These two temperature measurement methods ensure that the device can be used in various working environments.

[0018] 3. It adopts 433MHz low-power wireless technology, which has strong transmission capability, wide transmission range and low power consumption, ensuring that the signal transmitted from the device can be received by the receiving node to the maximum extent, resulting in longer battery life and longer device operating life.

[0019] 4. Replaceable base plates are adopted. For ferromagnetic materials, magnetic base plates are used; for non-ferromagnetic materials, adhesive base plates are used. Due to the replaceability of the base plates, different types of base plates can be developed according to different application conditions, which expands the applicability of the device and improves the convenience of application.

[0020] 5. The various parts of the device are connected by threads, which makes disassembly convenient, battery and accessory replacement easy, and testing and maintenance easy. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall connection and operation of the device of the present invention, wherein 1-target ball for laser tracker, 2-target base with bolts, 3-upper end cover, 5-power and parameter switch, 7-antenna interface, 8-rotatable glue rod antenna, 9-patch sensor interface, 10-surface patch sensor, 12-lower end cover, 13-adhesive base plate, and 15-laser tracker.

[0022] Figure 2 for Figure 1 Sectional view along the AA direction. Figure 3 for Figure 2 Partial sectional view of BB.

[0023] The components are as follows: 1-Target ball for laser tracker, 2-Target base with bolts, 3-Upper end cover, 3.1-Center threaded hole of upper end cover, 3.2-Rectangular lithium battery mounting slot, 3.5-Internal threaded opening, 4-Lithium battery, 4.2-SM plug, 5-Power and parameter switch, 6-PCB circuit board assembly, 6.1-Power interface, 6.3-Wireless communication module, 6.5-Microcontroller, 6.7-Connecting screw, 7-Antenna interface, 8-Rotating glue stick antenna, 9-Surface mount sensor interface, 10-Surface mount sensor, 11-Contact sensor, 12-Lower end cover, 12.2-Short cylindrical boss, 12.3-Front long cylindrical boss, 12.5-Rear long cylindrical boss, 12.7-External threaded opening, 13-Adhesive base plate, 14-Adhesive.

[0024] Figure 4 Schematic diagram of the connection and installation of lithium battery 4, power and parameter switch 5, and PCB circuit board 6. Wherein, 4-lithium battery, 4.1-lead wire, 4.2-SM plug, 5-power and parameter switch, 5.1-lead wire, 5.2-power SM switch plug, 6-PCB circuit board, 6.1-power interface, 6.2-control signal interface, 6.4-PCB board input signal interface, 6.7-connecting screw.

[0025] Figure 5 This is a mounting diagram of the lower surface of the PCB board assembly of the device of the present invention, wherein: 6-PCB board, 6.1-power interface, 6.3-wireless communication module, 6.5-microcontroller, 6.6-PCB board output signal interface, 6.8-front connection hole, 6.9-rear connection hole.

[0026] Figure 6 This is a structural diagram of the upper end cover in the device, where 3-upper end cover, 3.1-center threaded hole of the upper end cover, 3.3-power and parameter switch mounting slot, 3.4-square through hole on the side of the upper end cover, and 3.5-internal threaded opening.

[0027] Figure 7 The lower end cover structure diagram of the device of the present invention. Wherein, 12-lower end cover, 12.1-left side through hole of the lower end cover, 12.2-short cylindrical boss, 12.3-front long cylindrical boss, 12.4-right side through hole of the lower end cover, 12.5-rear long cylindrical boss, 12.6-center countersunk bolt hole, 12.7-external threaded opening.

[0028] Figure 8 This is a structural diagram of the adhesive base plate of the device of the present invention. In the diagram, 13-adhesive base plate, 13.1-countersunk through hole in the base plate, 13.2-annular groove, 13.3-center hole in the base plate. Detailed Implementation

[0029] The specific embodiments of the present invention will now be described in detail with reference to the technical solutions and accompanying drawings.

[0030] This invention discloses a measuring device for simultaneous spatial coordinate measurement and temperature information acquisition, see [link to invention]. Figure 1 , Figure 2 , Figure 3 The measuring device adopts a modular design, with the overall shape assembled into a cylindrical structure, making it easy to carry and transport. The device consists of a spatial coordinate measurement section and a temperature measurement section.

[0031] The spatial coordinate measurement section consists of a laser tracker 15, a target sphere 1, and a bolted target base 2. The target sphere 1 is attached to the bolted target base 2, which is fixed by a bottom bolt to the threaded hole 3.1 of the upper end cover. The target sphere 1 contains a coupling prism that receives and returns the laser beam. It is firmly attached to the center of the target base, and its spherical structure can rotate 360 ​​degrees around the Z-axis and 180 degrees around the X and Y axes. The measurement beam emitted by the laser tracker 15 hits the prism inside the target sphere 1, is reflected back to the laser tracker 15, and is received by the internal detection system of the laser tracker 15. The spatial coordinates of the target point are then calculated and displayed in the host computer software via wireless data transmission.

[0032] The temperature measurement section consists of a threaded upper cover 3, a lithium battery 4, a power and parameter switch 5, a PCB circuit board assembly 6, an antenna interface 7, a rotatable adhesive rod antenna 8, an aviation plug interface 9, a surface mount sensor 10, a cap-type contact sensor 11, a lower cover 12, a base plate 13, and an adhesive 14. (See attached...) Figure 1 , 2 Sections 3, 4, and 5 further illustrate the present invention. Figure 6 , 7 Drawings 1 and 8 are for the upper end cover 3, the lower end cover 12, and the adhesive base plate 13, respectively.

[0033] In the temperature measurement section, the upper cover 3 is cylindrical, with a threaded center hole 3.1 machined at the center of its upper surface. The inner cavity has a rectangular lithium battery mounting slot 3.2, a power and parameter switch mounting slot 3.3, a square through hole 3.4 on the side of the upper cover, and an internal thread 3.5 machined at the bottom of the inner cavity of the upper cover 3. The power module consists of a lithium battery 4, leads 4.1, and an SM connector 4.2. The lithium battery 4 is fixed in the rectangular lithium battery mounting slot 3.2 of the upper cover, and the leads are led out from the positive and negative terminals of the lithium battery and connected to the power interface 6.1 on the PCB board via the SM connector 4.2.

[0034] The control module consists of a power and parameter switch 5, lead wires 5.1, a power SM connector 5.2, and a microcontroller 6.5. The power and parameter switch 5 is installed in the power and parameter switch mounting slot 3.3 on the upper cover. The lead wires extend from the switch and connect to the control signal interface 6.2 on the PCB board via the power SM connector 5.2. The microcontroller 6.5 is connected via printed circuitry on the PCB board. The switch section is exposed through a square through-hole 3.4 on the side of the upper cover 3 for easy operation. See the structural installation details below. Figure 2 , Figure 3 , Figure 4 .

[0035] The signal input module consists of a surface mount sensor 10, a cap-type contact sensor 11, and an aviation plug interface 9. The cap-type contact sensor 11 is installed in the center countersunk bolt hole 12.6 of the lower end cover and the center hole 13.3 of the base plate, and is connected to the PCB board input signal interface 6.4 by a lead wire. The lead wire protrudes from the right-side through hole 12.4 to contact the temperature to be measured and is connected to the microcontroller 6.5. (See...) Figure 3 , Figure 4 .

[0036] The lower end cover 12 is cylindrical, with external threads 12.7 machined on the upper outer contour surface. The bottom of the lower end cover 12 has four evenly distributed short cylindrical bosses 12.2, each with a threaded hole in its center. The base plate 13 has four countersunk through holes 13.1, which are connected and fixed to the threaded holes on the four short cylindrical bosses by four screws. Two connecting screws 6.7 fix the PCB board 6 to the two front and rear long cylindrical bosses 12.3 and 12.5 with screw holes inside the lower end cover 12 through front and rear connecting holes 6.8 and 6.9. The upper part of the lower end cover 12 is connected and fixed to the lower part of the upper end cover 3 via external threads 12.7 and internal threads 3.5.

[0037] The signal conversion module consists of a PCB board 6, a microcontroller 6.5, and a wireless communication module 6.3. Both the microcontroller 6.5 and the wireless communication module 6.3 are located on the lower surface of the PCB board and connected to other interfaces via printed circuits. Due to changes in ambient temperature, the resistance of the NTC thermistor changes, resulting in a slight change in current. This current change information is captured by the microcontroller 6.5 and converted into an electrical signal, which is then input to the wireless communication module 6.3. The signal output module consists of the wireless communication module 6.3, an antenna interface 7, and a rotatable adhesive rod antenna 8. The antenna interface 7 is fixed in the through hole 12.1 on the left side of the lower end cover 12 and connected to the output signal interface 6.6 on the PCB board via a lead wire. The rotatable adhesive rod antenna 8 is connected to the antenna interface 7 on the outside. The data measured by the temperature sensor is transmitted to the wireless communication module 6.3, which then transmits the temperature signal using 433MHz FSK radio frequency communication technology via the rotatable adhesive rod antenna. See the installation instructions below. Figure 2 , Figure 3 , Figure 5, Figure 6 .

[0038] During temperature measurement, the cap-type contact sensor 11 is located at the bottom of the entire device and contacts the mounting surface to accurately acquire temperature data at the measuring point. The surface-mount sensor 10 is of the extended lead type and is attached to the measuring point to acquire temperature data in complex environments with harsh conditions such as confined spaces or uneven surfaces at the measuring point.

[0039] Three temperature data input methods are available: the first is to input the temperature signal measured by the cap-type contact sensor, the second is to input the temperature signal measured by the surface patch sensor, and the third is to input the temperature signals measured by both the surface patch sensor and the cap-type contact sensor simultaneously. The appropriate temperature measurement method can be selected according to different working requirements and conditions.

[0040] For ferromagnetic materials, a magnetic base plate is used; for non-ferromagnetic materials, an adhesive base plate is used. Due to the replaceability of the base plate, different types of base plates can be developed according to different application conditions, expanding the applicability of the device and improving its ease of use. This embodiment uses an adhesive base plate; the structural installation details are shown below. Figure 3 , Figure 8 .

[0041] The various parts of the device are connected by threads, making disassembly convenient, battery and accessory replacement easy, and testing and maintenance easy.

Claims

1. A measuring device for synchronously acquiring spatial coordinates and temperature information, characterized in that, The device adopts a modular design, consisting of a power module, a control module, a signal conversion module, a signal output module, and a signal input module. The overall shape of the device is assembled into a cylindrical structure, and it uses two temperature measurement methods: wireless communication and sensors. The device consists of a spatial coordinate measurement section and a temperature measurement section. The spatial coordinate measurement part consists of a laser tracker (15), a target ball (1) and a target seat with bolts (2); the target ball (1) is attached to the target seat (2), and the target seat with bolts (2) is fixed by bolts to the threaded hole (3.1) of the upper end cover (3); The temperature measurement section consists of an upper cover (3), a lithium battery (4), a power supply and parameter switch (5), a PCB circuit board assembly, an antenna interface (7), a rotatable glue rod antenna (8), an aviation plug interface (9), a surface patch sensor (10), a cap-type contact sensor (11), a lower cover (12), a base plate (13), and an adhesive (14). The upper cover (3) is cylindrical, with a threaded center hole (3.1) machined in the center of the upper surface, a rectangular lithium battery mounting slot (3.2) and a power supply and parameter switch mounting slot (3.3) machined in the inner cavity, a square through hole (3.4) on the side of the upper cover, and an internal thread (3.5) machined at the bottom of the inner cavity of the upper cover (3). The power module for temperature measurement consists of a lithium battery (4), leads (4.1), and an SM plug (4.2). The lithium battery (4) is fixed in the rectangular lithium battery mounting slot (3.2) of the upper cover. The leads are led out from the positive and negative terminals of the lithium battery and connected to the power interface (6.1) of the PCB board through the SM plug (4.2). The control module consists of a power and parameter switch (5), lead wires (5.1), a power SM plug (5.2), and a microcontroller (6.5). The power and parameter switch (5) is installed in the power and parameter switch mounting slot (3.3) on the upper cover. The lead wires are led out from the switch and connected to the control signal interface (6.2) on the PCB board through the power SM plug (5.2). The microcontroller (6.5) is connected to the printed circuit on the PCB board. The switch part is exposed through the square through hole (3.4) on the side of the upper cover (3) for easy operation. The signal conversion module consists of a PCB board (6), a microcontroller (6.5), and a wireless communication module (6.3). The microcontroller (6.5) and the wireless communication module (6.3) are both arranged on the lower surface of the PCB board and connected to other interfaces through printed circuits. Due to changes in ambient temperature, the resistance of the NTC thermistor changes, and the current changes slightly. The current change information is captured by the microcontroller (6.5) and converted into an electrical signal, which is then input to the wireless communication module (6.3). The signal output module consists of a wireless communication module (6.3), an antenna interface (7), and a rotatable glue rod antenna (8). The antenna interface (7) is fixed in the through hole (12.1) on the left side of the lower end cover (12) and is connected to the output signal interface (6.6) on the PCB board by a lead wire. The rotatable glue rod antenna (8) is connected to the antenna interface (7) on the outside. The data measured by the temperature sensor is transmitted to the wireless communication module (6.3). The wireless communication module transmits the temperature signal through the rotatable glue rod antenna using 433MHz FSK radio frequency communication technology. The surface mount sensor (10), the cap-type contact sensor (11), and the aviation plug interface (9) constitute the signal input module of the temperature measurement section. The cap-type contact sensor (11) is installed in the center countersunk bolt hole (12.6) of the lower end cover and the center hole (13.2) of the base plate. It is connected to the input signal interface (6.4) of the PCB board by a lead wire. Its lead wire protrudes from the through hole (12.4) on the right side to contact the temperature to be measured and is connected to the microcontroller (6.5). The lower end cover (12) is cylindrical, and its upper outer contour surface is machined with external threads (12.7). There are four evenly distributed short cylindrical bosses (12.2) at the bottom of the lower end cover (12). Each short cylindrical boss (12.2) has a threaded hole in the center. The base plate (13) has four countersunk through holes (13.1). The base plate (13) is connected and fixed to the threaded holes on the four short cylindrical bosses by four screws. Two connecting screws (6.7) are used to fix the PCB board (6) to the two front and rear long cylindrical bosses (12.3 and 12.5) with screw holes in the lower end cover (12) through the front and rear connecting holes (6.8 and 6.9) on the PCB board (6). The upper part of the lower end cover (12) is connected and fixed to the lower part of the upper end cover (3) by external threads (12.7) and internal threads (3.5). There are two types of base plates (13): magnetic base plates and adhesive base plates. If the measuring point is on a ferromagnetic material surface, a magnetic base plate is used; if the measuring point is on a non-ferromagnetic material surface, an adhesive base plate is used. The two are interchangeable. The adhesive base plate (13) has a central through hole (13.2) and a circular groove (13.3). The adhesive (14) is attached to the circular groove (13.3) for easy replacement and development. During temperature measurement, the cap-type contact sensor is located at the bottom of the entire device and contacts the mounting surface to acquire temperature data at the point to be measured. The surface patch sensor is of the extended lead type and is attached to the point to be measured to acquire temperature data in complex environments where the local space is confined and the plane where the point to be measured is uneven and the conditions are harsh. There are three temperature data input methods: the first is to input the temperature signal measured by the cap-type contact sensor, the second is to input the temperature signal measured by the surface patch sensor, and the third is to input the temperature signals measured by the surface patch sensor and the cap-type contact sensor at the same time. The appropriate temperature measurement method can be selected according to different working requirements and conditions.

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