Method and system for eliminating micro short circuit structures

Abstract

The application discloses a method for eliminating micro short circuit structure, which is used for eliminating the existing or potential micro short circuit structure in the circuit of electronic device. The method comprises the following steps: connecting the electrodes associated with the circuit part of the existing or potential micro short circuit structure by conductive material, so that a closed circuit structure is formed in the circuit by the conductive material and the existing or potential micro short circuit structure; arranging a coil with alternating current to be adjacent to the closed circuit structure for a period of time, so that the induced current generated in the closed circuit structure can eliminate the existing or potential micro short circuit structure, wherein the direction of the magnetic field generated by the coil is transverse to the plane where the closed circuit structure is located. The application also discloses a system for eliminating micro short circuit structure, which is used for executing the method for eliminating micro short circuit structure. The application is convenient, fast and effective, and is especially suitable for solving the micro short circuit problem in the circuit of packaged electronic device without damaging the package.

Description

Technical Field

[0001] This invention relates to the fabrication of electronic devices, and more particularly to a method and system for eliminating tiny short-circuit structures. Background Technology

[0002] In the manufacturing process of electronic devices, especially precision electronic devices, short-circuit detection is a crucial step. If an abnormally low-resistance connection (e.g., below a preset threshold) is detected between two points in the electronic device's circuitry, a short circuit is determined to exist between those two points. Because electronic devices with this short circuit will generate a large current (and thus heat) between these two points during operation, this will affect the device's function and may even cause damage. Therefore, electronic devices detected with short-circuit problems usually need to be reworked to correct the short circuit. However, when electronic devices are already packaged, reworking the circuitry requires breaking the package, which is usually not feasible or too costly, leading manufacturers to discard such electronic devices.

[0003] Short-circuit detection results for electronic devices are broadly categorized into two types: large short circuits, where the resistance detected between two points in the device's circuitry is close to that of a normal circuit, and small short circuits, where the resistance detected between two points in the device is significantly greater than that of a normal circuit. In this paper, the circuit structures causing these undesirable short circuits are referred to as large short-circuit structures and small short-circuit structures, respectively. The former is usually caused by manufacturing errors, while the latter is often due to factors such as process control and the manufacturing environment, including temperature, humidity, cleanliness, and the uniformity of materials used. Therefore, reworking electronic devices with small short-circuit structures is relatively simple in practice. However, if the device is already packaged, it becomes difficult to process and the device must be discarded, which not only increases manufacturing costs but is also detrimental to the environment.

[0004] Therefore, it would be highly beneficial to develop a method for eliminating minute short-circuit structures in packaged electronic devices without damaging the package. Additionally, it would also be advantageous to eliminate any potential minute short-circuit structures by pre-packaging the electronic device.

[0005] Those skilled in the art are dedicated to developing a method and system for eliminating tiny short-circuit structures, thereby solving the aforementioned technical problems. Summary of the Invention

[0006] To achieve the above objectives, the present invention provides, in a first aspect, a method for eliminating minute short-circuit structures, for eliminating minute short-circuit structures present in the circuit of an electronic device, wherein the electronic device is determined by short-circuit detection to have a minute short-circuit structure between a first electrode and a second electrode in its circuit, the method comprising:

[0007] The first electrode and the second electrode are electrically connected by a conductive material, thereby forming a closed circuit structure in the circuit through the conductive material and the micro short-circuit structure.

[0008] A coil carrying an alternating current is arranged adjacent to (but not in contact with) the closed circuit structure for a period of time, so that the induced current generated in the closed circuit structure can eliminate the small short circuit structure, wherein the direction of the magnetic field generated by the coil is transverse to the plane in which the closed circuit structure is located.

[0009] The phrase "the coil is adjacent to the closed circuit structure" means that the minimum distance from the center of the coil to the closed circuit structure is no greater than 1-30mm.

[0010] The statement that the direction of the magnetic field is transverse to the plane of the closed circuit structure means that the direction of the magnetic field lines at the center of the coil is approximately perpendicular to the plane of the closed circuit structure, for example, the angle between the direction of the magnetic field lines and the plane is no greater than 15°.

[0011] In a second aspect, the present invention provides a method for eliminating micro short-circuit structures, used to eliminate potential micro short-circuit structures in the circuitry of electronic devices, the method comprising:

[0012] All electrodes of the circuit are electrically connected by a conductive material, thereby forming a closed circuit structure in the circuit through the conductive material and the potential micro short-circuit structure.

[0013] A coil carrying an alternating current is arranged adjacent to (but not in contact with) the closed circuit structure for a period of time, so that the induced current generated in the closed circuit structure can eliminate the potential micro short circuit structure, wherein the direction of the magnetic field generated by the coil is transverse to the plane in which the closed circuit structure is located.

[0014] The phrase "the coil is adjacent to the closed circuit structure" means that the minimum distance from the center of the coil to the closed circuit structure is no greater than 1-30mm.

[0015] The statement that the direction of the magnetic field is transverse to the plane of the closed circuit structure means that the direction of the magnetic field lines at the center of the coil is approximately perpendicular to the plane of the closed circuit structure, for example, the angle between the direction of the magnetic field lines and the plane is no greater than 15°.

[0016] Here, "all electrodes" refers to the electrodes associated with the circuit portion of a potential micro-short-circuit structure in the circuit.

[0017] The closed circuit structure refers to the maximum closed circuit structure formed by the circuit portion of the potential micro short-circuit structure in the circuit, the associated electrode, the conductive material, and the potential micro short-circuit structure.

[0018] In a third aspect, the present invention provides a system for eliminating small short-circuit structures, used to perform the elimination methods described in the above two aspects, the system comprising:

[0019] Conductive materials, and means for applying conductive materials to electrodes;

[0020] A coil, and a means for holding the coil; and

[0021] The power source is used to provide alternating current to the coil.

[0022] The electronic devices used in this invention can be electronic devices with fine circuit structures, such as touch panels, displays, PCBs, FPCs, and chips, or electronic devices including touch panels, displays, PCBs, FPCs, and chips.

[0023] The method and system for eliminating micro short-circuit structures of the present invention are convenient, fast and effective, and are especially suitable for solving micro short-circuit problems in the circuits of packaged electronic devices without damaging their packaging.

[0024] The following will further explain the concept, specific structure, and technical effects of the present invention in conjunction with the accompanying drawings, so as to fully understand the purpose, features, and effects of the present invention. Attached Figure Description

[0025] Figure 1 The illustration shows an unpackaged touch panel, which is a double-sided touch panel.

[0026] Figure 2 and 3 Schematic illustration Figure 1 The touch panel module is formed by encapsulating the touch panel.

[0027] Figure 4 The invention illustrates, in some preferred embodiments, the electrodes on the encapsulated touch panel (where a small short-circuit structure is determined by short-circuit detection) are electrically connected to the panel using a strip-shaped conductive structure.

[0028] Figure 5 It shows the completion Figure 4 After the electrical connection is established, the closed circuit structure formed by the tiny short-circuit structure and the strip conductive structure in the circuit of the touch panel, as well as the coil carrying alternating current, are arranged adjacent to the closed circuit structure.

[0029] Figures 6-9 The principle of the method for eliminating the micro short-circuit structure of the present invention is illustrated schematically, wherein, Figure 6This illustrates that when circuit portions, such as electrodes, are electrically connected via a strip-shaped conductive structure, and a small short-circuit structure exists between adjacent electrodes, a coil carrying alternating current, arranged adjacent to the circuit, induces a current in the closed circuit structure formed by the aforementioned circuit portions, the small short-circuit structure, and the strip-shaped conductive structure. Figure 7 The schematic diagram illustrates the alternating current on the coil. Figure 8 This schematically illustrates the induced current in a closed circuit structure. Figure 9 This shows that no induced current will be generated in the circuit when there is no (minor) short circuit structure between the adjacent electrodes.

[0030] Figure 10 As shown in some preferred embodiments of the invention, the coils scan across closed circuit structures in the circuit.

[0031] Figure 11 The diagram illustrates a circuit in which, in another preferred embodiment of the invention, electrodes on a packaged touch panel are electrically connected by a strip-shaped conductive structure, and a coil carrying alternating current scans across the touch panel.

[0032] Figure 12 The diagram illustrates a circuit in which, in another preferred embodiment of the invention, electrodes on a packaged touch panel are electrically connected to the panel using a strip-shaped conductive structure, and a coil carrying alternating current traverses the touch panel in a different scanning manner.

[0033] Figure 13 The diagram illustrates a circuit in which, in another preferred embodiment of the invention, electrodes on a packaged touch panel are electrically connected by a strip-shaped conductive structure, and multiple coils carrying alternating currents scan across the touch panel.

[0034] Figure 14 The diagram illustrates a circuit in which, in another preferred embodiment of the invention, electrodes on a packaged touch panel are electrically connected to the panel using a strip-shaped conductive structure, and multiple coils carrying alternating currents are traversed across the touch panel in a different scanning manner.

[0035] Figure 15 The diagram illustrates a circuit in which, in another preferred embodiment of the invention, electrodes on a packaged touch panel are electrically connected to the touch panel using a strip-shaped conductive structure, and a plurality of coils carrying alternating current are placed adjacent to the touch panel. Detailed Implementation

[0036] In some embodiments, this invention provides a method for eliminating minute short-circuit structures, used to eliminate minute short-circuit structures present in the circuitry of electronic devices, particularly suitable for eliminating minute short-circuit structures present in the circuitry of packaged electronic devices. The electronic device can be an electronic device with a fine circuit structure, such as a touch panel, display screen, PCB, FPC, or chip, or an electronic device including, for example, touch panels, displays, PCBs, FPCs, and chips.

[0037] like Figure 1 The image shows an unpackaged touch panel 100, which is a double-sided capacitive touch panel, including a substrate 110 (see...). Figure 2 The substrate 110 is made of materials such as transparent glass or PET; on one surface of the substrate 110 ( Figure 1 An array of sensing units is formed on the surface of the substrate 110 facing the paper (i.e., the front side), specifically, multiple rows of sensing units patterned from, for example, ITO material, such as sensing unit rows 121 and 122; on the other surface of the substrate 110 ( Figure 1 An array of driving units (shown in dashed lines) is formed on the surface away from the paper (i.e., the back side), specifically multiple rows of driving units patterned from, for example, ITO material, such as driving unit row 123.

[0038] exist Figure 1 In the illustrated embodiment, one end of each row of sensing units is suspended, and the other end is connected to the corresponding sensing electrode via a corresponding electrode trace. For example, the right end of sensing unit rows 121 and 122 is suspended, and the left end is connected to sensing electrodes 131 and 132 via electrode traces. Similarly, one end of each column of driving units is suspended, and the other end is connected to the corresponding driving electrode via a corresponding electrode trace. For example, the upper end of driving unit column 123 is suspended, and the lower end is connected to driving electrode 133 via electrode traces. The materials used for the electrode traces, sensing electrodes, and driving electrodes include, for example, ITO, IGZO, PEDOT, silver nanowires, and metal mesh.

[0039] After being packaged, the touch panel 100 becomes a touch panel module, such as... Figure 2 , 3 As shown, for a double-sided touch panel 100, protection needs to be applied to both surfaces of the substrate 110, such as... Figure 2The cover plate 111 and the protective layer 112 are attached to the front side of the substrate 110 by an adhesive (e.g., OCA adhesive) 141 to protect the sensing unit array on the substrate 110 and their corresponding electrode traces, and expose the corresponding electrodes for subsequent electrical connection with external circuits; the protective layer 112, for example, is a peelable blue film, which is attached to the back side of the substrate 110 by an adhesive layer 142 thereon to protect the driving unit array on the substrate 110, their corresponding electrode traces and corresponding electrodes, until the touch panel is finally assembled with other components into a product (e.g., a touch screen) and the peelable blue film is peeled off.

[0040] The edge area of ​​the cover plate 111 can be coated with, for example, a black ink layer. After the cover plate 111 is attached to the front side of the substrate 110, the border of the ink layer covers the electrode traces, preventing the electrode traces from being seen by the user. This is the non-operable area of ​​the touch panel module. The middle of the border is the operable area of ​​the touch panel module. In this area, the user can touch the sensing unit array with their finger or a capacitive stylus through the cover plate 111.

[0041] Since there may be a long interval between completing the patterning of the sensing and driving unit array, electrode wiring, and sensing and driving electrodes on the surface of the touch panel 100 and performing the aforementioned encapsulation of the touch panel 100, or if patterning and encapsulation operations need to be performed in different locations, it is usually necessary to protect both surfaces of the touch panel 100 with a peelable blue film after the patterning of the touch panel 100 is completed, and remove the blue film on the front side and attach the cover plate 111 when encapsulation is possible. However, in practice, it has been found that even touch panels that pass the short-circuit test have a high probability of failing the short-circuit test after attaching and removing the peelable blue film and subsequently attaching the cover plate. For example, if the short-circuit test finds that adjacent sensing (driving) electrodes are not insulated, for example, their resistance is several KΩ to several hundred MΩ, then a small short circuit is considered to have occurred between the adjacent electrodes, that is, there is a small short circuit structure between the circuit parts associated with these two electrodes, such as... Figure 4 The diagram shows a tiny short-circuit structure S existing between rows 121 and 122 of the sensing units.

[0042] In the manufacturing process of precision products such as touch panels, micro-short circuits between circuit components frequently occur, affecting product functionality and leading to product defects. These micro-short circuits are generally caused by issues with the cleanliness of the production environment or inadequate etching. For example, a dirt spot may fall between circuit components, affecting the etching process and creating a micro-short circuit structure. Micro-short circuits have two significant characteristics: first, the physical length of the micro-short circuit structure is short (generally less than 50µm), while the impedance is high (ranging from a few kΩ to hundreds of MΩ); second, the exact location of the micro-short circuit structure is generally difficult to see with the naked eye, and the only solution is to completely repair (etch) the gap between the two circuit components where the micro-short circuit occurred.

[0043] If after electronic device packaging, for example for Figure 4 The discovery of minute short circuits in encapsulated touch panels (i.e., touch panel modules) or display modules, or in products including such encapsulated electronic devices, such as finished touch screens or displays, is difficult to resolve. Existing methods in the art typically involve disassembling the module or finished product (i.e., breaking the encapsulation), re-etching (e.g., laser etching) the gap between the two circuit sections with the minute short circuit, and then reassembling the product. However, product modules and products like touch screens and displays are generally difficult to disassemble, and the disassembly process can easily damage components, being time-consuming and labor-intensive. Furthermore, some modules are inherently difficult to disassemble, such as touch panel modules using bonding processes. If the minute short circuit occurs on the non-bonded surface of the touch panel module, it can be treated with laser etching; however, if the problem is on the bonded surface, such modules are essentially scrapped. These minute short circuits pose significant challenges to the production of precision electronic devices and increase production costs. Therefore, the problem to be solved by this invention is how to design a non-invasive solution to the micro short circuit problem that does not require disassembling the product.

[0044] The method for eliminating micro short-circuit structures provided in some embodiments of the present invention can solve the micro short-circuit problem in the circuit of an electronic device without damaging its package. In the example method for eliminating micro short-circuit structures, the method includes: Figure 4 As shown, two electrodes, namely sensing electrode 131 and sensing electrode 132, are electrically connected by conductive material 150 to form a tiny short-circuit structure between their associated circuit parts. Thus, the tiny short-circuit structure S, conductive material 150, sensing electrodes 131 and 132, partial sensing unit rows 121 and 122, and corresponding electrode traces constitute a closed circuit structure, as shown. Figure 5 As shown in the dashed box in the image; and, as shown in the image. Figure 5As shown, a coil 160 carrying alternating current is arranged adjacent to (but not in contact with) the closed circuit structure for a period of time, so that the induced current generated in the closed circuit structure can eliminate the small short circuit structure S, wherein the direction of the magnetic field generated by the coil is transverse to the plane where the closed circuit structure is located.

[0045] The principle of eliminating the micro short-circuit structure S using the above method will be explained in [reference needed]. Figures 6-9 The explanation is as follows.

[0046] like Figure 6 As shown, there is a small short-circuit structure S between electrodes 31 and 32. When electrodes 31 and 32 are electrically connected with conductive material 50, electrodes 31 and 32, conductive material 50, and the small short-circuit structure S will form a closed circuit structure (as described in this article). Figures 6-9 The description is for the purpose of describing the principle only, and therefore does not consider the special case where the conductive material coincides with the micro short-circuit structure.

[0047] The alternating current I will be passed through in (i.e., being supplied with alternating current I) in ,For example Figure 7 The rectified alternating current shown (e.g., through a coil 60 connected to an external power source) is arranged as follows: Figure 6 If the ground is adjacent to (but not in contact with) this closed circuit structure, an induced current I will be generated in the closed circuit structure. i ,like Figure 8 As shown. Since the resistance of the micro short-circuit structure S is much greater than that of electrodes 31 and 32 and conductive material 50, the alternating current I can be appropriately adjusted. in The amplitude of the induced current I flowing through the tiny short-circuit structure S i The heat generated can burn off or even destroy the tiny short-circuit structure S without affecting the electrodes 31, 32 and the conductive material 50.

[0048] For cases where there was originally no micro-short circuit structure between electrodes 31 and 32, such as Figure 9 As shown, electrodes 31 and 32 and conductive material 50 cannot form a closed circuit structure. Therefore, even if coil 60 is arranged in the same way, no induced current will be generated in electrodes 31 and 32 and conductive material 50.

[0049] Therefore, when Figure 5 As shown, the coil 160 carrying alternating current is arranged adjacent to a closed circuit structure consisting of a micro short-circuit structure S, conductive material 150, sensing electrodes 131, 132, partial sensing unit rows 121, 122 and corresponding electrode traces. The induced current generated in the closed circuit structure flows through the micro short-circuit structure S, which can burn out or even burn the micro short-circuit structure S without affecting the circuit of the touch panel 100.

[0050] Specifically, in such Figure 4 When conductive material 150 is used to electrically connect sensing electrodes 131 and 132, the conductive material 150 is a strip-shaped conductive material, such as a conductive wire like a metal wire, or a conductive adhesive strip, etc. It can be fixed to sensing electrodes 131 and 132 by means of bonding, pressing, or releasable adhesive, thereby ensuring that during the elimination of micro-short-circuit structures, the conductive material 150 is fixed in an appropriate position on the touch panel 100 and can be easily removed from the touch panel 100 after the detection is completed. Preferably, the conductive material 150 is applied to the surface of sensing electrodes 131 and 132 and the substrate 110 on which they are located, and covers the end of sensing electrodes 131 and 132 near the outer edge of the substrate 110.

[0051] exist Figure 5 The coil 160 shown is a planar coil, the size of which can be determined according to the shape and size parameters of the closed circuit structure. In this example, the touch panel 100 is a large-size touch panel, with a row spacing of 0.7 cm between each row of sensing units and a column spacing of 0.7 cm between each column of driving units. Accordingly, the size of the coil 50 used is preferably 1 cm. In other embodiments, any other type of coil can be used, such as a spiral coil, a single-layer or multi-layer coil, an air-core or iron-core coil, etc.

[0052] The coil 160 can be arranged adjacent to the closed circuit structure and the direction of the magnetic field generated by the coil 160 is transverse to the plane where the closed circuit structure is located, in the following manner: the coil plane of the coil 160 is approximately parallel to and adjacent to the aforementioned surface of the substrate 110, for example, the angle between the two is not greater than 15° and the distance between the two is not greater than 1-10 mm; and the minimum distance from the center of the coil 160 to the closed circuit structure is not greater than 1-30 mm.

[0053] Coil 160 is supplied with alternating current, as with coil 60 described above. In this example, rectified alternating current is used as the input to coil 160, i.e., input current I. in Its amplitude is, for example, 200mA, and its frequency is, for example, 450kHz. In other embodiments, other forms of alternating current can also be used, such as unrectified alternating current, pulse current, etc. Alternating current with different amplitudes and frequencies can also be used, as long as the input alternating current can cause the coil 160 to generate a changing magnetic field, thereby generating an induced current that can flow through the small short-circuit structure S.

[0054] Because short-circuit detection can only determine which two adjacent electrodes have a tiny short-circuit structure, for example, it can only determine that... Figure 4A tiny short-circuit structure S exists between the sensing electrodes 131 and 132. The exact location of this tiny short-circuit structure S is uncertain; in fact, it could exist anywhere between the sensing unit rows 121 and 122, or even between their corresponding electrode traces. However, those skilled in the art can determine the maximum closed circuit structure that can be formed using the tiny short-circuit structure S, the conductive material 150, the sensing electrodes 131 and 132, a portion of the sensing unit rows 121 and 122, and the corresponding electrode traces. Figure 4 When the tiny short-circuit structure S is formed between the two suspended ends of the sensing unit rows 121 and 122, i.e. the right end shown in the figure, the tiny short-circuit structure S, the conductive material 150, the sensing electrodes 131 and 132, part of the sensing unit rows 121 and 122 and the corresponding electrode traces can form the maximum closed circuit structure.

[0055] Therefore, in this paper, when the specific location of the micro short-circuit structure can be determined, the closed circuit structure mentioned refers to the closed circuit structure determined based on the specific location of the micro short-circuit structure; when it can only be determined that there is a micro short-circuit structure between the two electrodes of the electronic device but the specific location of the micro short-circuit structure cannot be determined, the closed circuit structure mentioned refers to the maximum closed circuit structure determined by considering the possible locations of the micro short-circuit structure.

[0056] To achieve better elimination of small short-circuit structures, in some embodiments of the invention, the coil 160 is kept adjacent to the defined closed circuit structure for a period of time, such as 20 seconds. In other embodiments, this period of time can be 10 seconds to 10 minutes.

[0057] Furthermore, for cases where the closed circuit structure occupies a large area, the coil can be held at different positions in different parts of the adjacent closed circuit structure for a period of time. For example, for Figure 4 , 5 If the touch panel 100 shown can only be determined to have a small short-circuit structure S between the sensing unit rows 121 and 122 or between their corresponding electrode traces, then the closed circuit structure is determined to be formed by the following connected parts: part of sensing unit row 121 - electrode trace of part of sensing unit row 121 - sensing electrode 131 - conductive material 150 - sensing electrode 132 - electrode trace of sensing unit row 122 - sensing unit row 122 - right end connection of sensing unit rows 121 and 122. If the touch panel 100 is a large-size touch panel with a length greater than 20 inches, then the above closed circuit structure is a long strip. In this case, in order to obtain a better elimination effect on the small short-circuit structure, the coil 160 can be held at different positions of the strip for a period of time, for example, in Figure 5The position shown is maintained for a period of time near the left side of the touch panel 100, near the right side of the touch panel 100, and near the middle of the touch panel 100.

[0058] Alternatively, the coil can be moved over a period of time (e.g., 20 seconds, or 10 seconds to 10 minutes) across at least a portion of the defined closed circuit structure. Figure 10 As shown, coil 160 moves across the entire closed circuit structure. Its movement path is shown in the figure as a line with an arrow, which indicates its direction of movement. The moving speed of coil 160 is, for example, 0.5 m / s.

[0059] In both of the above situations, it is necessary to maintain the coil plane of coil 160 before and after (or during) movement as approximately parallel to and adjacent to the aforementioned surface of substrate 110, for example, with an angle between them not exceeding 15° and a distance between them not exceeding 1-10 mm; and it is necessary to maintain the minimum distance from the center of coil 160 before and after (or during) movement to the closed circuit structure not exceeding 1-30 mm. The center of coil 160 before and after movement refers to the center position of coil 160 when it is in its original position and the center position of coil 160 when it has moved to a new position, and the minimum distance from these two or more center positions to the closed circuit structure is not greater than 1-30 mm; the center of coil 160 during movement refers to all center positions of coil 160 during the process of moving from its original position, and the minimum distance from these center positions to the closed circuit structure is not greater than 1-30 mm.

[0060] In some embodiments of the present invention, a system for eliminating micro-short-circuit structures can be constructed to perform the aforementioned method for eliminating micro-short-circuit structures, thereby eliminating the micro-short-circuit structure in an electronic device whose circuit has been determined to have a micro-short-circuit structure between two electrodes through short-circuit detection. The elimination system includes: a conductive material for electrically connecting the two electrodes; a coil for being arranged adjacent to (but not in contact with) the circuit; and a power source for providing alternating current to the coil.

[0061] Specifically, the elimination system may include means for fixing electronic devices, such as platforms or supports; means for applying conductive material to the two electrodes, such as clamps or pressure arms, to press the conductive wire into contact with the two electrodes; and means for holding the coil, such as clamps or platforms, which are preferably capable of moving the coil relative to the electronic devices.

[0062] While the above embodiments primarily describe methods and systems for eliminating minute short-circuit structures in the circuitry of packaged electronic devices, those skilled in the art will understand that these methods and systems can also be used for unpackaged electronic devices to eliminate minute short-circuit structures in their circuitry. Compared to the prior art method of re-etching (e.g., laser etching) the gap between two circuit sections with minute short-circuit problems, this invention is simpler and more practical.

[0063] In the embodiments described above, the electronic devices have been identified through, for example, short-circuit testing, to determine the presence of minute short-circuit structures in their circuits. For electronic devices that have not undergone short-circuit testing, the present invention provides, in some embodiments, a method for eliminating potential minute short-circuit structures in their circuits. In the following embodiments, a touch panel is also used as an example for illustration.

[0064] like Figure 11 The diagram shows a packaged touch panel 200, including a cover plate 210, which has not undergone short-circuit testing, and therefore it is impossible to determine whether there is a micro short-circuit structure in its circuit. That is, there may be a micro short-circuit structure in its circuit, i.e., a potential micro short-circuit structure. Therefore, it is necessary to solve the potential micro short-circuit problem in its circuit.

[0065] The method for eliminating the tiny short-circuit structure in the example includes: Figure 11 As shown, all sensing electrodes are electrically connected using conductive material 251, and all driving electrodes (shown as dashed lines on the back of the touch panel 200) are electrically connected using conductive material 252. This allows the potential micro-short-circuit structure to form a closed circuit structure with the conductive material 151 or 152 and the associated circuitry on the touch panel 200. It should be noted that although two conductive materials 251 and 252 are shown electrically connecting the electrodes on the circuitry of the two surfaces of the touch panel 200 respectively, it is also possible to electrically connect all these electrodes using only one conductive material.

[0066] As mentioned earlier, when the exact location of a micro-short-circuit structure cannot be determined, the closed circuit structure refers to the largest possible closed circuit structure. For simplification, only those parts of the circuit where micro-short-circuit structures may exist can be considered. In this example, each row of sensing units, each column of driving units, each electrode trace, each sensing electrode, and each driving electrode in the circuit of the touch panel 200 may have micro-short-circuit structures; therefore, the closed circuit structure is the circuit on both surfaces of the touch panel 200.

[0067] The method for eliminating tiny short-circuit structures in the example also includes, for example, Figure 11As shown, a coil 261 carrying alternating current is arranged adjacent to (but not in contact with) the circuit for a period of time, so that the induced current generated in the closed circuit structure can eliminate potential small short circuit structures, wherein the direction of the magnetic field generated by the coil is transverse to the plane of the circuit.

[0068] In such Figure 11 In the illustrated embodiment, conductive materials 251 and 252 are similar to the conductive material 150 used above, and coil 261 is similar to coil 160. The alternating current supplied to coil 261 is similar to that supplied to coil 160, and will not be described in detail here.

[0069] exist Figure 11 In the illustrated embodiment, coil 261 moves across the entire closed circuit structure (i.e., the circuitry on both surfaces of touch panel 200 in this example) over a period of time (e.g., 20 seconds). Its movement path is shown in the figure as an arrowed line, with the arrow indicating the direction of movement. The moving speed of coil 160 is, for example, 0.5 m / s. In other embodiments, coil 261 may move across the entire circuit in a different manner, such as... Figure 12 As shown in the image.

[0070] exist Figure 11 and Figure 12 In this example, considering the large area of ​​the touch panel 200, for example, its length is greater than 20 inches, the coil 261 is moved in an S-shape across the entire circuit. Similar to the previous embodiment, during the movement of the coil 261, the coil plane of the moving coil 160 needs to be kept approximately parallel to and adjacent to the surface of the substrate 110, for example, the angle between them is no greater than 15° and the distance between them is no greater than 1-10 mm; and the minimum distance between the center of the moving coil 160 and any part of the circuit needs to be kept no greater than 1-30 mm. The distance from the coil center to any part of the circuit refers to the distance from the coil center to any part of the circuit, for example, in this example, the distance from the coil center to each row of sensing units, each column of driving units, each electrode trace, each sensing electrode, and each driving electrode in the circuit of the touch panel 200. For simplification, only those parts of the circuit that may have minor short-circuit structures can be considered.

[0071] It should be noted that the touch panel 200 in this example is a double-sided touch panel, that is, there are circuits on both surfaces of its substrate. When eliminating potential small short circuits in the circuit, the above-mentioned moving scan can be performed on only one surface of the substrate adjacent to the coil 261, or the above-mentioned moving scan can be performed on both surfaces of the substrate respectively.

[0072] Alternatively, in other embodiments, a coil array formed by multiple coils can be used, such as... Figure 13The coil array shown is formed by coils 261-264, and Figure 14 The coil array formed by coils 265-268 shown is moved across the entire circuit at a speed v, as indicated in the figure, with a magnitude of, for example, 0.5 m / s. The required coil size and number can be determined based on the structural parameters of the circuit on the touch panel 200. It is necessary to maintain a minimum distance of no more than 1-30 mm between the center of each moving coil 261-264 and any part of the circuit. For example, for a large touch panel 200 with a length of 60 cm and a width of 40 cm, assuming that there may only be minor short circuits in the sensing unit rows and driving unit columns, considering only a sensing unit row line width of 0.3 cm and a row spacing of 0.7 cm, and a driving unit column line width of 0.3 cm and a column spacing of 0.7 cm, the corresponding size of coils 261-264 is 1 cm. The following estimation can be made:

[0073] While maintaining a minimum distance of no more than 30mm between the center of each moving coil 261-264 and any part of the circuit, Figure 13 The example shown uses a minimum of 7 coils. Figure 14 The example shown uses a minimum of 10 coils; while keeping the minimum distance between the center of each moving coil 261-264 and any part of the circuit no greater than 10 mm, Figure 13 The example shown uses a minimum of 20 coils. Figure 14 The example shown uses a minimum of 30 coils; while keeping the minimum distance between the center of each moving coil 261-264 and any part of the circuit no greater than 5mm, Figure 13 The example shown uses a minimum of 40 coils. Figure 14 The example shown uses a minimum of 60 coils.

[0074] Alternatively, in other embodiments, a coil array formed by multiple coils can be used, such as... Figure 15 The coil array 260 shown consists of 12 coils. This coil array 260 is placed near the circuitry of the touch panel 200 for a period of time, for example, 20 seconds. Similar to the previous embodiment, the required size and number of coils are determined based on the structural parameters of the circuitry on the touch panel 200, wherein it is necessary to maintain a minimum distance of no more than 1-30 mm between the center of each coil in the coil array 260 and any part of the circuitry.

[0075] Similarly, in some embodiments of the present invention, a system for eliminating small short-circuit structures can be constructed to perform the above-described method for eliminating potential small short-circuit structures in the circuitry of an electronic device. This elimination system includes: a conductive material for electrically connecting all electrodes of the electronic device; one or more coils arranged adjacent to (but not in contact with) the circuit; and a power source for providing alternating current to the one or more coils.

[0076] Specifically, the elimination system may include means for fixing electronic devices, such as platforms or supports; means for applying conductive material to electrodes, such as clamps or pressure arms, to press conductive wires into contact with these electrodes; and means for holding one or more coils, such as clamps or platforms, which are preferably capable of moving the one or more coils relative to the electronic devices.

[0077] Similarly, those skilled in the art will understand that the methods and systems described above for eliminating potential micro short-circuit structures in the circuits of packaged electronic devices can also be used for unpackaged electronic devices to eliminate potential micro short-circuit structures in their circuits.

[0078] Therefore, when manufacturing electronic devices with intricate circuit structures, such as touch panels, displays, PCBs, FPCs, and chips, or electronic devices including touch panels, displays, PCBs, FPCs, and chips, operators can use (preferably multiple times) the method and system for eliminating micro short-circuit structures of the present invention during the manufacturing process of the aforementioned electronic devices. For example, the method for eliminating micro short-circuit structures of the present invention can be performed on the electronic devices before and after packaging by using the micro short-circuit structure elimination system of the present invention, thereby significantly reducing the occurrence of micro short-circuit problems in electronic devices.

[0079] The preferred embodiments of the present invention have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of the present invention without creative effort. Therefore, any technical solution that can be obtained by those skilled in the art based on the concept of the present invention through logical analysis, reasoning, or limited experimentation on the basis of existing technology should be within the scope of protection defined by the claims.

Claims

1. A method for eliminating micro short-circuit structures, used to eliminate micro short-circuit structures present in the circuit of an electronic device, wherein the electronic device is determined by short-circuit detection to have a micro short-circuit structure between a first electrode and a second electrode in the circuit, characterized in that, The elimination method includes: The first electrode and the second electrode are electrically connected by a conductive material, thereby forming a closed circuit structure in the circuit through the conductive material and the micro short-circuit structure, wherein the conductive material is a metal wire or a conductive strip. A coil carrying an alternating current is arranged near the closed circuit structure for a period of time, so that the induced current generated in the closed circuit structure can eliminate the small short circuit structure, wherein the direction of the magnetic field generated by the coil is transverse to the plane where the closed circuit structure is located. Wherein, when the coil is adjacent to the closed circuit structure, the minimum distance from the center of the coil to the closed circuit structure is no more than 30mm; conductive material is applied to the surface of the sensing electrode and the substrate on which it is located, and covers the end of the sensing electrode near the outer edge of the substrate.

2. The elimination method as described in claim 1, wherein the time period is 10 seconds to 10 minutes.

3. The elimination method of claim 2, wherein during the time period, the coil remains stationary relative to the electronic device; or moves relative to the electronic device and passes over at least a portion of the closed circuit structure.

4. The elimination method as described in claim 3, wherein the electronic device is a packaged electronic device or an unpackaged electronic device.

5. The elimination method as described in claim 4, wherein the electronic device is a touch panel, a display screen, a PCB, an FPC, or a chip; or the electronic device includes a touch panel, a display screen, a PCB, an FPC, or a chip.

6. A method for eliminating micro short-circuit structures, used to eliminate potential micro short-circuit structures in the circuit of electronic devices, characterized in that, The elimination method includes: All electrodes of the circuit are electrically connected by a conductive material, thereby forming a closed circuit structure in the circuit through the conductive material and the potential micro short-circuit structure, wherein the conductive material is a metal wire or a conductive strip. A coil carrying an alternating current is arranged near the closed circuit structure for a period of time, so that the induced current generated in the closed circuit structure can eliminate the potential micro short circuit structure, wherein the direction of the magnetic field generated by the coil is transverse to the plane in which the closed circuit structure is located. Wherein, when the coil is adjacent to the closed circuit structure, the minimum distance from the center of the coil to the closed circuit structure is no more than 30mm; conductive material is applied to the surface of the sensing electrode and the substrate on which it is located, and covers the end of the sensing electrode near the outer edge of the substrate.

7. The elimination method as described in claim 6, wherein the time period is 10 seconds to 10 minutes.

8. The elimination method of claim 7, wherein during the time period, the coil remains stationary relative to the electronic device; or moves relative to the electronic device and passes over at least a portion of the closed circuit structure.

9. The elimination method of claim 8, wherein the electronic device is a packaged electronic device or an unpackaged electronic device.

10. The elimination method of claim 9, wherein the electronic device is a touch panel, a display screen, a PCB, an FPC, or a chip; or the electronic device includes a touch panel, a display screen, a PCB, an FPC, or a chip.

11. A system for eliminating small short-circuit structures, used to perform the elimination method according to any one of claims 1-10, characterized in that, The elimination system includes: The conductive material, and means for applying the conductive material to the electrode; The coil, as well as means for holding the coil and a power source, are used to provide the alternating current to the coil.

12. The elimination system of claim 11, further comprising means for fixing the electronic device.

13. The elimination system of claim 12, wherein the means for holding the coil is capable of moving the coil relative to the electronics.

14. The elimination system according to any one of claims 11-13, wherein the coil is one or more coils.

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