A flexible high-entropy alloy coating and its preparation method and application

Abstract

The application provides a flexible high-entropy alloy coating and a preparation method and application thereof, and belongs to the technical field of high-entropy alloys. The application changes the spatial layout and potential distribution of a vacuum chamber through magnetic filter cathode vacuum arc deposition, improves the plasma density, makes the element composition and content of the high-entropy alloy adjustable, and makes the prepared high-entropy coating have good tribology, corrosion and oxidation resistance. The ionization rate of the deposited particles after magnetic filtering is close to 100%, there are no large particles, the formed film is dense, smooth and good in corrosion resistance, and the film is well combined with the body. The application can prepare a variety of element films, can control the film thickness to be in the order of nanometers to obtain a nanometer multilayer film, and combines the design of a unary metal coating, a binary metal coating, a quaternary metal coating and a high-entropy coating, thereby avoiding the problems that the high-entropy coating prepared by traditional technology has large internal stress and is difficult to realize flexibility.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of high-entropy alloy, in particular to a flexible high-entropy alloy coating and a preparation method and application thereof. BACKGROUND

[0002] General high-entropy alloy preparation methods include sintering method, laser cladding method and magnetron sputtering method. In the case of low requirements for film layer density and defects, sintering method and laser cladding can realize the preparation of high-entropy alloy; but with more and more attention to film layer quality and defects, laser cladding and sintering method cannot be applied. Magnetron sputtering method is the most commonly used method for preparing high-entropy alloy thin film in recent years, but it also has a fatal defect, that is, the preparation of the target material itself is a difficulty, and the target material is difficult to prepare and has high cost; after the target material is prepared, the element composition of the film layer is difficult to control, which is not conducive to the diversified preparation of the film layer.

[0003] The high-entropy alloy coating prepared by the general traditional technology has large internal stress and is difficult to realize flexibility. SUMMARY

[0004] Therefore, the present application aims to provide a flexible high-entropy alloy coating and a preparation method and application thereof. The flexible high-entropy alloy coating prepared by the present application has small internal stress and good flexibility.

[0005] In order to achieve the above-mentioned application purposes, the present application provides the following technical solutions:

[0006] The present application provides a preparation method of a flexible high-entropy alloy coating, comprising the following steps:

[0007] Magnetic filter cathode vacuum arc deposition is performed on the surface of the monometallic coating to sequentially form a binary metal coating, a quaternary metal coating and a high-entropy coating, the number of element types in the high-entropy coating is not less than 5, and the atomic content of each element is independently 8-30%.

[0008] Preferably, the thickness of the high-entropy coating is 1-10 microns.

[0009] Preferably, the elements in the high-entropy coating include five or more of Ti, Cr, Co, Mo, Y, Ni, Au, Ag, Cu and Al.

[0010] Preferably, the monometallic coating is a Ni metal layer or a Cr metal layer.

[0011] Preferably, the thickness of the monometallic coating is not higher than 1 / 20 of the thickness of the flexible high-entropy alloy coating.

[0012] Preferably, the binary metal coating is a Cu-Ag metal layer or a Ni-Au metal layer.

[0013] Preferably, the thickness of the binary metal coating is not higher than 1 / 30 of the thickness of the flexible high-entropy alloy coating.

[0014] Preferably, the quaternary metal coating is a Cu-Ag-Mo-Y metal layer or a Ni-Au-Cr-Al metal layer.

[0015] The present application also provides the flexible high-entropy alloy coating as described in the technical solutions above, which comprises a monometallic coating, a binary metal coating, a quaternary metal coating and a high-entropy coating arranged in sequence.

[0016] The present application also provides the application of the flexible high-entropy alloy coating as described in the technical solutions above in the fields of aerospace and electronic communication.

[0017] The present application provides a preparation method of a flexible high-entropy alloy coating, comprising the following steps: performing magnetic filter cathode vacuum arc deposition on the surface of a monometallic coating to sequentially form a binary metal coating, a quaternary metal coating and a high-entropy coating, wherein the number of element types in the high-entropy coating is not less than 5, and the atomic content of each element is independently 8-30%.

[0018] The present application changes the spatial layout and potential distribution of the vacuum chamber by magnetic filter cathode vacuum arc deposition, improves the plasma density, adjusts the element composition and content of the high-entropy alloy, and prepares a high-entropy coating with good tribology, corrosion and oxidation resistance. The high-entropy coating is formed in an amorphous phase structure, which promotes the release of internal stress and achieves flexibility. The ionization rate of the deposited particles after magnetic filtering is close to 100%, there are no large particles, the formed film is dense, smooth and good in corrosion resistance, and the combination with the body is good. The method can prepare a thin film of multiple elements, control the film thickness in the nanometer level to obtain a nanometer multilayer film, and combine the design of the monometallic coating, the binary metal coating, the quaternary metal coating and the high-entropy coating to avoid the problem of large internal stress of the high-entropy coating prepared by traditional technology, which makes it difficult to achieve flexibility.

[0019] Further, the monometallic coating contains Ni and Cr metal elements with strong toughness, and when the thickness is 10-50 nm, the monometallic coating shows excellent folding resistance. When the deposition of Ni or Cr is greater than 50 nm, the nanocrystal size is too large, which affects the folding resistance. The monometallic coating is too thin to play a transition effect.

[0020] Further, the binary metal coating is selected as Cu-Ag or Ni-Au, which is selected according to the composition of the quaternary metal coating and the monometallic coating, and the selection standard is mainly the combination strength and good element compatibility. At the same time, the deposition of the monometallic coating can induce the binary metal coating to form a folding-resistant phase structure, and the binary metal coating can induce the quaternary metal coating to form a folding-resistant phase structure. The smaller the nanocrystal size of the folding-resistant phase is, the better it is, and it is best to form an amorphous phase.

[0021] Further, the quaternary metal coating is a stress release layer, the stress release layer is not higher than 1 / 10 of the overall thickness; at least two metals in the quaternary metal coating are incompatible, and the incompatible metals are prone to form single-phase, thereby improving the folding resistance.

[0022] The application further provides the flexible high-entropy alloy coating prepared by the preparation method. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 The figure is the bonding strength diagram of the coating of examples 1-4;

[0024] Figure 2 The figure is the internal stress diagram of the coating of examples 1-4;

[0025] Figure 3 The figure is the folding times diagram of the coating of examples 1-4;

[0026] Figure 4 The figure is the oxidation layer depth diagram of the coating of examples 1-4 under an aerobic environment, 600 DEG C for 30 min;

[0027] Figure 5 The figure is a schematic diagram of a vacuum chamber space structure, wherein 101 is a pulsed bias access port, 102 is a molecular pump, 103 is a bevel flange, 104 is a first magnetic filtering system and magnetic field system, 105 is a second magnetic filtering system and magnetic field system, 106 is a first extraction magnetic field system, 107 is a first magnetic field particle control system, 108 is a first cathode target, 109 is a second extraction magnetic field system, 110 is a second magnetic field particle control system, 111 is a second cathode target, 112 is a third magnetic field particle control system, 113 is a third extraction magnetic field system, 114 is a third cathode target, 115 is a fourth cathode target, 116 is a fourth magnetic field particle control system, 117 is a fourth extraction magnetic field system, 118 is a third magnetic filtering system and magnetic field system, 119 is a fourth magnetic filtering system and magnetic field system, 120 is a molecular pump, 121 is a vacuum chamber, and 122 is a rack. DETAILED DESCRIPTION

[0028] The application provides a preparation method of a flexible high-entropy alloy coating, comprising the following steps:

[0029] The surface of the unary metal coating is subjected to magnetic filtering cathode vacuum arc deposition to sequentially form a binary metal coating, a quaternary metal coating and a high-entropy coating, the number of element types in the high-entropy coating is not less than 5, and the atomic content of each element is independently 8-30%, preferably 10-25%.

[0030] In the present application, the thickness of the high-entropy coating is preferably 1-10 μm, more preferably 2-6 μm.

[0031] In the present application, the elements in the high-entropy coating preferably include five or more of Ti, Cr, Co, Mo, Y, Ni, Au, Ag, Cu and Al, more preferably a MoYNiAgCu coating or a MoNiYAgCu coating, and the film layer has a folding flexibility of greater than 5000 times without cracking.

[0032] In the present application, the high-entropy coating is formed by an amorphous phase structure, which promotes the release of internal stress and achieves the goal of flexibility.

[0033] In the present application, the negative pressure of the magnetic filter cathode vacuum arc deposition for depositing the high-entropy coating is preferably 10-50 kV, and the duty cycle is preferably 1-4%. The negative pressure of 10-50 kV can greatly improve the formation of the amorphous phase structure, further promote the release of internal stress, and further achieve the goal of flexibility. The duty cycle of 1-4% avoids the problem that the alloy phase is easily formed when the duty cycle exceeds 4%, which affects the folding performance.

[0034] In the present application, the angle between each magnetic filter extraction system and the normal line of the workpiece during the deposition of the high-entropy coating is preferably 40-60°, and the magnetic field directions of the four extraction system outlets are preferably N, S, N, S in turn. The magnetic fields of adjacent two outlets are preferably opposite. When used simultaneously, the plasma concentration of a single extraction is preferably greater than 20% of the magnetic filter system used alone. The deposition rate of the overall film layer is preferably not less than 5 μm / h.

[0035] In the present application, the magnetic filter cathode vacuum arc deposition for depositing the high-entropy coating includes a particle suppression magnetic field, an extraction magnetic field and a magnetic filter magnetic field. The particle suppression magnetic field is preferably a high-frequency magnetic field, the current of the high-frequency magnetic field is preferably 0-100 A, and the frequency is preferably 100-1 kHz. The extraction magnetic field is preferably a direct-current magnetic field, and the current of the direct-current magnetic field is preferably 0-5 A. The magnetic filter magnetic field is a high-frequency magnetic field, and the current is preferably 0-2 A, and the frequency is preferably 1-10 kHz.

[0036] In the present application, the plasma density extracted by the magnetic filter cathode vacuum arc deposition for depositing the high-entropy coating is higher, and the film layer has good compactness and few defects such as holes and the like.

[0037] In the present application, the arc current of each cathode target of the magnetic filter cathode vacuum arc deposition for depositing the high-entropy coating is preferably 20-180 A, preferably continuously adjustable, and the voltage is preferably 20-30 V.

[0038] In the present application, the monometallic metal coating is preferably a Ni metal layer or a Cr metal layer, and the film layer has a folding flexibility of greater than 5000 times without cracking.

[0039] In the present invention, the thickness of the unitary metal coating is preferably not greater than 1 / 20 of the thickness of the flexible high-entropy alloy coating.

[0040] In a specific embodiment of the present invention, the thickness of the monometallic coating is preferably 10 to 50 nm. The Ni and Cr metal elements have strong toughness and exhibit excellent folding resistance when the thickness is 10 to 50 nm. The Ni or Cr deposition is greater than 50 nm, and the nanocrystal size is too large. Too large a crystal size will affect the folding resistance, and too thin a layer cannot achieve a transition effect.

[0041] In the present invention, magnetic filtered cathode vacuum arc deposition is preferably performed to form the unitary metal coating.

[0042] In the present invention, the negative pressure during the magnetic filtered cathode vacuum arc deposition is preferably 800 V, and the duty cycle is preferably 20-50%.

[0043] In the present invention, the binary metal coating is preferably a Cu-Ag metal layer or a Ni-Au metal layer.

[0044] In the present invention, the thickness of the binary metal coating is preferably not greater than 1 / 30 of the thickness of the flexible high entropy alloy coating.

[0045] In a specific embodiment of the present invention, the thickness of the binary metal coating is preferably 20 to 30 nm, the binary metal coating is an amorphous phase without an alloy phase, the binary metal coating is selected as Cu-Ag or Ni-Au, and the film layer has a folding toughness greater than 5,000 times without cracking, which is selected based on the composition of the quaternary metal coating and the monolithic metal coating, and the selection criteria are mainly strong bonding strength and good element compatibility; at the same time, the deposition of the monolithic metal coating can induce the binary metal coating to form a phase structure as a folding-resistant phase, and the binary metal coating induces the quaternary metal coating to form a folding-resistant phase, and the folding-resistant phase has a nanocrystal size as small as possible until an amorphous phase is formed.

[0046] In the present invention, when depositing the binary metal coating, the negative pressure of the magnetic filtered cathode vacuum arc deposition is preferably 10 to 50 kV, and the duty cycle is preferably 5 to 10%. During deposition, it is preferred to select one cathode arc or two cathode arcs. The high negative pressure setting can provide sufficient energy to promote the formation of fine nanocrystals and amorphous phases, while promoting the generation of micro-area thermal peak effects and releasing internal stress, so that the internal stress is less than 100 MPa. Excessively high duty cycle will cause a sudden rise in the coating temperature, causing the grains to grow.

[0047] In the present invention, the quaternary metal coating is preferably a Cu-Ag-Mo-Y metal layer or a Ni-Au-Cr-Al metal layer, and the quaternary metal coating is an amorphous phase without an alloy phase; the atomic content of Cu in the Cu-Ag-Mo-Y metal layer is preferably 40% to 60%, the atomic content of Ag is preferably 20% to 35%, the atomic content of Mo is preferably 5% to 15%, and the atomic content of Y is preferably 3% to 9%; the atomic content of Ni in the Ni-Au-Cr-Al metal layer is preferably 20% to 60%, the atomic content of Au is preferably 10% to 15%, the atomic content of Cr is preferably 20% to 50%, and the atomic content of Al is preferably 10% to 15%.

[0048] In a specific embodiment of the present invention, the thickness of the quaternary metal coating is preferably 100-200 nm.

[0049] In the present invention, the quaternary metal coating is a stress release layer, and at least two metals in the quaternary metal coating are incompatible with each other. The incompatible metals easily form a single phase, thereby improving the folding resistance; the film layer has a folding toughness greater than 5,000 times without cracking.

[0050] In the present invention, the thickness of the quaternary metal coating is preferably not greater than 1 / 10 of the thickness of the flexible high entropy alloy coating.

[0051] In the present invention, when depositing the quaternary metal coating, the negative pressure of the magnetic filtered cathode vacuum arc deposition is preferably 10 to 50 kV, the duty cycle is preferably 5 to 10%, the overall film temperature is preferably controlled to be room temperature to 150°C, and two or three cathode arcs are preferably selected for co-deposition during deposition.

[0052] In the present invention, a high-density ion beam impacts the surface of the substrate to be deposited under the action of high-power bias acceleration, changes the surface structure of the substrate to be deposited, obtains a chemical bond interface, and effectively improves the film-substrate interface bonding condition; at the same time, due to the joint deposition of multiple cathode arcs, the spatial layout is more compact, so the deposition rate is greatly improved, and the preparation efficiency and the controllable range such as the element range and content range are also improved; the spatial layout and the high-power pulse bias system of the deposition greatly improve the energy of the ions and the migration ability on the workpiece surface, which can enable uniform coating of special-shaped workpieces.

[0053] In the present invention, the magnetic filtration cathode vacuum arc deposition device is preferably composed of a vacuum system, a high power pulse magnetic field system, a vacuum cathode arc deposition system and its control system. The vacuum chamber space layout of the vacuum system is as follows: Figure 5As shown, wherein 101 is a pulsed bias access port, 102 is a molecular pump, 103 is a bevel flange, 104 is a first magnetic filtering system and magnetic field system, 105 is a second magnetic filtering system and magnetic field system, 106 is a first extraction magnetic field system, 107 is a first magnetic field particle suppression control system, 108 is a first cathode target, 109 is a second extraction magnetic field system, 110 is a second magnetic field particle suppression control system, 111 is a second cathode target, 112 is a third magnetic field particle suppression control system, 113 is a third extraction magnetic field system, 114 is a third cathode target, 115 is a fourth cathode target, 116 is a fourth magnetic field particle suppression control system, 117 is a fourth extraction magnetic field system, 118 is a third magnetic filtering system and magnetic field system, 119 is a fourth magnetic filtering system and magnetic field system, 120 is a molecular pump, 121 is a vacuum chamber, and 122 is a gantry.

[0054] The application further provides the flexible high-entropy alloy coating.

[0055] In the application, the hardness of the flexible high-entropy alloy coating is preferably 10-20 Gpa, the internal stress is preferably 0-50 MPa, the thickness of the oxide layer at 600 DEG C for 30 min is preferably 0-50 nm, and the corrosion resistance current tested under 5% mass concentration HF is two orders of magnitude smaller than the corrosion current of 304 stainless steel.

[0056] The application further provides application of the flexible high-entropy alloy coating in the fields of aerospace and electronic communication.

[0057] In order to further illustrate the application, the flexible high-entropy alloy coating, the preparation method and the application thereof provided by the application are described in detail below with examples, but they should not be understood as limiting the protection scope of the application.

[0058] Example 1

[0059] 1) No deposition of a monometallic layer

[0060] 2) No deposition of a bimetallic layer

[0061] 3) The quaternary metal layer is a Cu-Ag-Mo-Y quaternary metal layer (atomic content: Cu 48%, Ag 32%, Mo 14%, and Y 6%), the deposition negative pressure is 50 kV, the duty cycle is 5%, and the deposition thickness is 200 nm; the particle suppression magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100 A, and the frequency is 100 Hz; the extraction magnetic field is a direct-current magnetic field, the extraction magnetic field current is 5 A; the magnetic filtering magnetic field is a high-frequency magnetic field, the current is 2 A, and the frequency is 1 kH;

[0062] 4) The high entropy coating is MoYNiAgCu (atomic content is Mo12%Y5%Ni17%Ag21%Cu45%), and four cathode arcs are selected to deposit Mo, NiY, Ag and copper together. The negative voltage during deposition is 10kV and the duty cycle is 4%; the particle magnetic field is suppressed by a high-frequency magnetic field, the high-frequency magnetic field current is 100A, and the frequency is 1kHz; the extraction magnetic field is a DC magnetic field, and the extraction magnetic field current is 5A; the magnetic filtration magnetic field is a high-frequency magnetic field, the current is 2A, the frequency is 10kHz, and the deposition thickness is 5μm.

[0063] Example 2

[0064] 1) The monolithic metal layer is a Ni metal layer, and the negative voltage during deposition is 800 V, the duty cycle is 50%, and the deposition thickness is 50 nm; the particle suppression magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100 A, and the frequency is 100 Hz; the extraction magnetic field is a DC magnetic field, and the extraction magnetic field current is 5 A; the magnetic filtration magnetic field is a high-frequency magnetic field, the current is 2 A, and the frequency is 10 kHz;

[0065] 2) The binary metal layer is a Cu-Ag binary metal layer (atomic content: Cu75% and Ag25%), the negative voltage during deposition is 50 kV, the duty cycle is 10%, and the deposition thickness is 100 nm; the particle suppression magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100 A, and the frequency is 1 kHz; the extraction magnetic field is a DC magnetic field, the extraction magnetic field current is 5 A; the magnetic filtration magnetic field is a high-frequency magnetic field, the current is 2 A, and the frequency is 10 kHz;

[0066] 3) The quaternary metal layer is a Cu-Ag-Mo-Y quaternary metal layer (atomic content: Cu48%, Ag32%, Mo14%, Y6%), the negative voltage during deposition is 50 kV, the duty cycle is 5%, and the deposition thickness is 200 nm; the particle suppression magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100 A, and the frequency is 1 kHz; the extraction magnetic field is a DC magnetic field, the extraction magnetic field current is 5 A; the magnetic filtration magnetic field is a high-frequency magnetic field, the current is 2 A, and the frequency is 10 kHz;

[0067] 4) The high entropy coating is MoYNiAgCu (atomic content is Mo12%Y5%Ni17%Ag21%Cu45%), and four cathode arcs are selected for co-deposition. The negative voltage during deposition is 10kV and the duty cycle is 1%; the particle magnetic field is suppressed by a high-frequency magnetic field, the high-frequency magnetic field current is 100A, and the frequency is 1kHz; the extraction magnetic field is a DC magnetic field, and the extraction magnetic field current is 2A; the magnetic filtration magnetic field is a high-frequency magnetic field, the current is 2A, the frequency is 10KHz, and the deposition thickness is 5μm.

[0068] Example 3

[0069] 1) The monolithic metal layer is a Ni metal layer, and the negative voltage during deposition is 800 V, the duty cycle is 20%, and the deposition thickness is 50 nm; the particle magnetic field suppression magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100 A, and the frequency is 100 Hz; the extraction magnetic field is a DC magnetic field, and the extraction magnetic field current is 5 A; the magnetic filtration magnetic field is a high-frequency magnetic field, the current is 2 A, and the frequency is 10 kHz;

[0070] 2) The binary metal layer is a Cu-Ag binary metal layer (atomic content: Cu75% and Ag25%), the negative voltage during deposition is 50 kV, the duty cycle is 5%, and the deposition thickness is 100 nm; the particle suppression magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100 A, and the frequency is 500 Hz; the extraction magnetic field is a DC magnetic field, the extraction magnetic field current is 5 A; the magnetic filtration magnetic field is a high-frequency magnetic field, the current is 2 A, and the frequency is 10 kHz;

[0071] 3) The quaternary metal layer is a Cu-Ag-Mo-Y quaternary metal layer (atomic content: Cu48%, Ag32%, Mo14%, Y6%), the negative voltage during deposition is 50 kV, the duty cycle is 10%, and the deposition thickness is 200 nm; the particle suppression magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100 A, and the frequency is 500 Hz; the extraction magnetic field is a DC magnetic field, and the extraction magnetic field current is 5 A; the magnetic filtration magnetic field is a high-frequency magnetic field, the current is 2 A, and the frequency is 5 kHz;

[0072] 4) The high entropy coating is MoYNiAgCu (atomic content is Mo12%Y5%Ni17%Ag21%Cu45%), and four cathode arcs are selected for co-deposition. The negative voltage during deposition is 20kV and the duty cycle is 4%; the particle magnetic field is suppressed by a high-frequency magnetic field, the high-frequency magnetic field current is 100A, and the frequency is 1kHz; the extraction magnetic field is a DC magnetic field, and the extraction magnetic field current is 2A; the magnetic filtration magnetic field is a high-frequency magnetic field, the current is 2A, the frequency is 10KHz, and the deposition thickness is 5μm.

[0073] Example 4

[0074] 1) The monolithic metal layer is a Ni metal layer, and the negative voltage during deposition is 800 V, the duty cycle is 30%, and the deposition thickness is 50 nm; the particle suppression magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100 A, and the frequency is 100 Hz; the extraction magnetic field is a DC magnetic field, and the extraction magnetic field current is 5 A; the magnetic filtration magnetic field is a high-frequency magnetic field, the current is 2 A, and the frequency is 10 kHz;

[0075] 2) The binary metal layer is a Cu-Ag binary metal layer (atomic content: Cu75% and Ag25%), the negative voltage during deposition is 30 kV, the duty cycle is 8%, and the deposition thickness is 100 nm; the particle suppression magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100 A, and the frequency is 500 Hz; the extraction magnetic field is a DC magnetic field, the extraction magnetic field current is 5 A; the magnetic filtration magnetic field is a high-frequency magnetic field, the current is 2 A, and the frequency is 10 kHz;

[0076] 3) The quaternary metal layer is a Cu-Ag-Mo-Y quaternary metal layer (atomic content: Cu48%, Ag32%, Mo14%, Y6%), the negative voltage during deposition is 10 kV, the duty cycle is 10%, and the deposition thickness is 200 nm; the particle suppression magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100 A, and the frequency is 500 Hz; the extraction magnetic field is a DC magnetic field, and the extraction magnetic field current is 5 A; the magnetic filtration magnetic field is a high-frequency magnetic field, the current is 2 A, and the frequency is 5 kHz;

[0077] 4) The high entropy coating is MoYNiAgCu (atomic content is Mo12%Y5%Ni17%Ag21%Cu45%), and four cathode arcs are selected for co-deposition. The negative voltage during deposition is 50kV and the duty cycle is 2%; the particle magnetic field is suppressed by a high-frequency magnetic field, the high-frequency magnetic field current is 100A, and the frequency is 1kHz; the extraction magnetic field is a DC magnetic field, and the extraction magnetic field current is 2A; the magnetic filtration magnetic field is a high-frequency magnetic field, the current is 2A, the frequency is 10KHz, and the deposition thickness is 5μm.

[0078] Figure 1 The bonding strength diagram of the coatings of Examples 1 to 4 is shown in FIG. Figure 1 It can be seen that the presence of unitary, binary, and quaternary metal transition layers can greatly improve the bonding strength, and when depositing high-entropy coatings, the higher the deposition negative bias voltage, the stronger the shallow ion injection effect, and thus the higher the bonding strength.

[0079] Figure 2 is the internal stress diagram of the coating of Examples 1 to 4, Figure 2 It can be seen that when high-entropy coatings are deposited, the higher the deposition negative pressure, the lower the internal stress. This is because the ultra-high negative bias voltage can form high-energy particle bombardment, produce thermal peak effects, etc., and effectively reduce the internal stress of the film layer.

[0080] Figure 3 The folding times of the coatings of Examples 1 to 4 are shown in the graph, and the test standard is GB / T457-2002. Figure 3 It can be seen that the higher the bonding strength of the coating, the lower the internal stress, the better the toughness and the higher the bending resistance.

[0081] The depth of the oxide layer obtained by holding at 600℃ for 30min in an oxygen environment is shown in the figure below. Figure 4 As shown by Figure 4It can be seen that the high-entropy thin films deposited by the magnetic filtering technology have high high-temperature oxidation resistance, but the higher the negative bias voltage, the stronger the high-energy ion bombardment deposition, the fewer the defects in the film layer, and the better the high-temperature oxidation resistance.

[0082] The above merely describes the preferred embodiments of the present application, and does not limit the present application in any form. It should be noted that, for those skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, and these improvements and refinements should also be considered as the protection scope of the present application.

Claims

1. A method for preparing a flexible high entropy alloy coating, characterized in that: The specific steps are as follows: Performing magnetic filtered cathode vacuum arc deposition on the surface of the monometallic coating to sequentially form a binary metal coating, a quaternary metal coating, and a high entropy coating, wherein the high entropy coating contains no less than five elements, and the atomic content of each element independently ranges from 8 to 30%; The binary metal coating is a Cu-Ag metal layer or a Ni-Au metal layer; The quaternary metal coating is a Cu-Ag-Mo-Y metal layer or a Ni-Au-Cr-Al metal layer; When depositing the high entropy coating, the negative pressure of the magnetic filtered cathode vacuum arc deposition is 10-50 kV, and the duty cycle is 1-4%.

2. The preparation method according to claim 1, characterized in that The thickness of the high entropy coating is 1-10 μm.

3. The preparation method according to claim 1 or 2, characterized in that The elements in the high entropy coating include five or more of Ti, Cr, Co, Mo, Y, Ni, Au, Ag, Cu and Al.

4. The preparation method according to claim 1, characterized in that The unitary metal coating is a Ni metal layer or a Cr metal layer.

5. The preparation method according to claim 1 or 4, characterized in that The thickness of the unitary metal coating is no greater than 1 / 20 of the thickness of the flexible high-entropy alloy coating.

6. The preparation method according to claim 1, characterized in that The thickness of the binary metal coating is no greater than 1 / 30 of the thickness of the flexible high entropy alloy coating.

7. The flexible high entropy alloy coating obtained by the preparation method according to any one of claims 1 to 6, characterized in that: It includes a unitary metal coating, a binary metal coating, a quaternary metal coating and a high entropy coating that are stacked in sequence.

8. Application of the flexible high entropy alloy coating according to claim 7 in the fields of aerospace and electronic communications.

Images