A multi-strand baseline-based electroplated diamond polygonal wire saw and a processing method thereof

Abstract

The present application relates to a kind of based on multi-strand baseline electroplated diamond polygonal wire saw and its processing method, belong to wire saw grinding field.It includes: by the matrix of multi-strand baseline weaving, brazing material and diamond electroplated coating, multiple polygonal matrix sections, multiple circular matrix sections and multiple circular arc transition sections are provided on the matrix, brazing material is arranged at the gap between multi-strand baseline on the circumferential surface of polygonal matrix section, polygonal matrix section and circular matrix section are alternately arranged in axial direction, circular arc transition section both ends are connected polygonal matrix section and circular matrix section one by one, multiple polygonal matrix sections are arranged in circumferential direction with displacement, diamond electroplated coating is arranged on polygonal matrix section, circular matrix section and circular arc transition section.The present application is favorable to make wire saw and workpiece processing contact area or orientation change to automatically adapt to the pressure required to be exerted by working diamond, to improve the sharpness of wire saw.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of wire saw grinding, in particular to a multi-strand baseline-based electroplated diamond polygonal wire saw and a processing method thereof. BACKGROUND

[0002] Currently, a wire saw using a multi-strand steel wire as a baseline as a diamond electroplated wire saw substrate is mainly used for a ring saw, and a single layer of diamond is plated on the surface of the substrate. Compared with a single-strand wire saw, the wire saw formed by the multi-strand baseline has good structural guarantee for chip removal and cooling. The single layer of diamond in the prior art adopts various layout modes, such as disordered, spiral ring, and circular ring, and the like. The diamond in the above modes is in the same maximum diameter range, and the diamond in contact with the workpiece on the wire saw is simultaneously worn, which causes the working surface area to increase, the pressure applied to the diamond in contact with the workpiece to decrease, and the cutting ability of the working diamond to decrease, that is, the sharpness of the wire saw decreases. In this state, the cutting trajectory of the wire saw is prone to present a horizontal cutting phenomenon of horizontal deviation, which causes the cutting seam to be inclined and the parallelism of the processed material to decrease. Due to the limitation of the strength of the wire saw, if the tension applied to the wire saw is increased, the substrate of the wire saw is prone to be broken, which causes the workpiece to be damaged and the yield of the workpiece to decrease. That is, in this state, it is difficult to increase the force applied to the diamond in contact with the workpiece by increasing the tension of the wire saw, and therefore the service life of the wire saw is reduced. SUMMARY

[0003] The technical problem to be solved by the present application is to provide a multi-strand baseline-based electroplated diamond polygonal wire saw and a processing method thereof to solve the above problems.

[0004] The technical solution of the present application to solve the above technical problems is as follows: a multi-strand baseline-based electroplated diamond polygonal wire saw, comprising a substrate woven by a plurality of strands, a brazing material, and a diamond electroplated plating layer, a plurality of polygonal substrate segments, a plurality of circular substrate segments, and a plurality of circular arc transition segments are arranged on the substrate, the brazing material is arranged at the gap between the plurality of strands on the circumferential surface of the polygonal substrate segment, the polygonal substrate segment and the circular substrate segment are arranged axially alternately, the circular arc transition segment is connected to the polygonal substrate segment and the circular substrate segment at both ends one by one, a plurality of the polygonal substrate segments are arranged in a circumferential direction, and the diamond electroplated plating layer is arranged on the polygonal substrate segment, the circular substrate segment, and the circular arc transition segment.

[0005] The beneficial effects of the present application are: the mechanical crushing effect of the polygonal wire saw is beneficial to reduce the proportion of grinding type processing in processing, and improve the processing efficiency; the polygonal wire saw naturally generates a functional structure for cooling and chip removal, so that the cooling water is more easily used, the rapid chip removal is more easily achieved, and the unnecessary wear of the diamond and the invalid power consumption of the cooling water are reduced; the clamping effect of the second working surface in the polygonal wire saw body makes it more difficult for the wire saw to laterally deviate, reduces the "cross-cutting" phenomenon, and is beneficial to obtaining higher parallelism of the workpiece cutting surface; under the same slit size conditions, the polygonal wire saw can adapt to smaller processing parameters of the tension force, and reduce the wire breakage rate of the wire saw; under the condition that the force acting on the working diamond does not change after the diamond is worn, the polygonal wire saw also has better cutting performance than the circular wire saw under the process parameters of moderately reducing the feed speed.

[0006] On the basis of the above technical solutions, the present application can also be improved as follows.

[0007] Further, the polygonal body section is circumferentially provided with a plurality of first working surfaces and a plurality of second working surfaces, and the two sides of each second working surface are correspondingly connected to two adjacent first working surfaces.

[0008] The beneficial effects of the above further scheme are: the second working surface is beneficial to reduce the area of the wire saw in contact with the workpiece, thereby increasing the pressure of the diamond in contact with the workpiece, improving the sharpness of the wire saw, and also making it more difficult for the wire saw to laterally deviate through the clamping effect of the second working surface, reducing the "cross-cutting" phenomenon, and obtaining higher parallelism of the workpiece cutting surface.

[0009] Further, the circumferential length of the first working surface on the radial polygonal cross section of the polygonal body section is greater than 70% of the diamond particle size.

[0010] The beneficial effects of the above further scheme are: the electroplated layer is beneficial to better hold the diamond, so that the diamond is not easily forced to fall off.

[0011] Further, the first working surface is a plane or an arc surface.

[0012] The beneficial effects of the above further scheme are: the arc surface of the working surface of the body is beneficial to reduce the manufacturing difficulty of the wire saw body.

[0013] Further, in any length section of the first working surface in the axial direction equal to the diamond particle size, the circumferential length of the first working surface on the radial polygonal cross section of the polygonal body section is plated with at most one complete working diamond particle.

[0014] The beneficial effects of the above further scheme are: when the diamond is arranged in an approximate straight line in the axial direction on the first working surface, it is beneficial to improve the service life and engraving efficiency of the diamond, and improve the sharpness of the wire saw.

[0015] A processing method for processing a gold-plated diamond polygonal wire saw based on multiple strands of a baseline, characterized in that it comprises the following steps:

[0016] S1: determining the number of edges, single-edge length, cross-sectional area of the radial polygonal cross section of the polygonal base section, the lengths of the polygonal base section and the circular base section, and the shape of the diamond plating area;

[0017] S2: manufacturing an extrusion die according to the number of edges, single-edge length, and cross-sectional area determined in S1, and setting a structure compatible with the circular arc transition section at both ends of the extrusion die;

[0018] S3: heating the part of the base with the length of the polygonal base section;

[0019] S4: adding brazing material that can be electroplated with nickel plating between the gaps between the multiple strands of the baseline at the heated part;

[0020] S5: extruding the heated part using the extrusion die manufactured in S2 and obtaining a polygonal base section by cooling, demolding, and heat treatment;

[0021] S6: repeating S3 and S4 after spacing a length of the circular base section;

[0022] S7: extruding the heated part after misaligning the extrusion die by a certain angle and obtaining a second polygonal base section by cooling, demolding, and heat treatment;

[0023] S8: repeating S6 and S7 to obtain a base with polygonal base sections and circular base sections arranged alternately;

[0024] S9: plating diamonds on the polygonal base sections, circular base sections, and circular arc transition sections by electroplating.

[0025] The beneficial effects of the present application are that the addition of brazing material in the gap of the circumferential surface of the multiple strands and heating facilitate the firm fixing of the polygonal base section formed by weaving the multiple strands, avoiding the rebound force of the multiple strands after the extrusion die is removed, which damages the polygonal base section and thus cannot form a polygonal base section. The present application optimizes the grinding performance of the wire saw, improves the service life and cutting force of the wire saw, reduces the wire saw breakage rate, improves the parallelism of the workpiece cutting surface, optimizes cooling and chip removal functions, etc. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 The processing method flowchart provided for the embodiments of the present application. DETAILED DESCRIPTION

[0027] The principles and features of the present application are described below, and the examples are used to explain the present application, but not to limit the scope of the present application.

[0028] A multi-strand baseline-based electroplated diamond polygonal wire saw comprises a substrate woven by multi-strand baseline, brazing material and diamond electroplated coating layer, a plurality of polygonal substrate segments, a plurality of circular substrate segments and a plurality of circular arc transition segments are arranged on the substrate, the brazing material is arranged at the gap between the multi-strand baseline on the circumferential surface of the polygonal substrate segment, the polygonal substrate segment and the circular substrate segment are arranged axially alternately, the circular arc transition segment is connected with the polygonal substrate segment and the circular substrate segment at both ends one by one, a plurality of the polygonal substrate segments are arranged in a staggered manner in the circumferential direction, and the diamond electroplated coating layer is arranged on the polygonal substrate segment, the circular substrate segment and the circular arc transition segment.

[0029] It should be understood that, because the substrate is woven by multi-strand baseline, the substrate presents discontinuous arrangement of multi-strand baseline in the circumferential direction of the radial section, and also presents discontinuous arrangement of multi-strand baseline in the axial section, and the polygonal substrate segment is a linear structure presenting approximate polygon in the radial section.

[0030] The working process of the wire saw grinding the workpiece is that, after the wire saw contacts the surface of the workpiece, the wire saw repeatedly moves forward and backward along the workpiece, and simultaneously moves vertically downward along the workpiece, because the plurality of polygonal substrate segments are arranged in a staggered manner, thus the position and area contacted by each polygonal substrate segment and the workpiece are changed.

[0031] The polygonal base section has different advantages and application scenarios when the number of edges of the polygonal cross section is more or less. Compared with the wire saw with a circular cross section in the prior art, under the condition of the same cross-sectional area, the fewer the number of edges, the more the maximum number of diamond particles that can be bonded on each edge, and the larger the wire saw cutting gap. In the grinding process, the random contact position between the wire saw and the workpiece is more obvious with the polygonal edge contact cutting (the random contact can refer to the description of the wire saw grinding process in the previous paragraph; the edge is the second working surface arranged circumferentially on the polygonal base section), which constitutes a plow type cutting. The mechanical crushing effect on the macro is more obvious, which reduces the proportion of grinding processing, reduces the load in the diamond processing process, and significantly improves the sharpness on the macro (the plow type cutting refers to the volume of the workpiece cut by the wire saw, in addition to the volume ground by the diamond, the volume of the crushed slag produced by the extrusion of the workpiece around the contact surface when the diamond around the contact surface is extruded by the diamond circumferentially arranged on the polygonal base section. This processing method is similar to plowing a field, so it is called "plow type cutting"; the mechanical crushing on the macro refers to the fewer the number of edges of the polygon, the larger the volume of the crushed slag produced by the extrusion; the sharpness on the macro refers to the fewer the number of edges of the polygon, the smaller the contact area between the wire saw and the workpiece, and the greater the pressure on the diamond in contact with the workpiece under the same applied force, so the wire saw is sharper). The more the number of edges, the fewer the maximum number of diamond particles that can be bonded on each edge, and the more the diamond particles tend to be arranged in order (the ordered arrangement refers to the limit state when the single edge length of the polygon can only bond one diamond particle, all the diamond particles on the first working surface are arranged in a straight line along the axis of the base), and the mechanical crushing effect on the micro is more obvious (the micro mechanical crushing refers to the more the number of edges of the polygon, the smaller the volume of the crushed slag produced by the extrusion of the polygon wire saw), and the service life of the diamond is improved obviously under the same consumption, which can be used to improve the micro sharpness of the wire saw by reducing the consumption of the diamond (this sentence means that the more the number of edges of the polygon, the more the diamond particles on the first working surface tend to be arranged in order, thereby reducing the unnecessary grinding wear caused by the multiple diamond particles on the first working surface, thereby improving the service life of the diamond. At the same time, due to the reduction of the number of diamond particles on the first working surface, the contact area between the wire saw and the workpiece is also reduced, and the pressure on the diamond in contact with the workpiece is greater under the same applied force, so the micro sharpness is greater). Therefore, when the sawing surface roughness requirement is high (i.e. the workpiece surface is smoother), the polygonal wire saw with more edges is preferred; when the sawing sharpness (here referring to the macro sharpness) requirement is high, the polygonal wire saw with fewer edges is preferred.

[0032] The polygonal wire saw is in a random position when working on a workpiece, and a great probability is that the corner (i.e. the second working surface arranged on the periphery of the polygonal base segment) first contacts the workpiece, at this time, the contact area is small, so the working diamond pressure on the contact surface of the wire saw is large, the corner quickly performs ploughing grinding on the workpiece and forms a clamping effect; the polygonal wire saw is not easy to rotate around the center of the circular wire saw as the circular wire saw works, but is balanced displacement grinding under the action of radial force, axial force, internal stress, and the force of the workpiece on the wire saw, the contact area of the wire saw and the workpiece changes during displacement grinding; the contact of the polygon in different positions and the workpiece causes the grinding contact area to be different, this feature makes the polygonal wire saw can ensure that the base line is within the safe force range of continuous line, and adaptively change the contact area of the workpiece and the wire saw base, so that there is enough pressure on the working diamond to realize cutting processing.

[0033] The polygonal wire saw has the advantages that: the mechanical crushing effect of the polygonal wire saw is beneficial to reduce the proportion of grinding type processing in processing, and improve the processing efficiency; the polygonal wire saw naturally generates a cooling and chip removal function structure, so that the cooling water is more easy to play a role, the rapid chip removal is more easy to realize, and the unnecessary wear of the diamond and the invalid power consumption of the cooling water are reduced; the clamping effect of the second working surface in the polygonal wire saw base makes it difficult to laterally deviate, reduces the "cross-cutting" phenomenon, and is beneficial to obtaining higher parallelism of the workpiece cutting surface; the polygonal wire saw can adapt to smaller tension force processing parameters under the same kerf size condition, and reduces the wire saw breakage rate; under the condition that the force acting on the working diamond is unchanged after the diamond is worn, the polygonal wire saw also has better cutting performance than the circular wire saw under the same condition by moderately reducing the process parameters of the feed speed.

[0034] Preferably, a plurality of first working surfaces and a plurality of second working surfaces are arranged on the periphery of the polygonal base segment, and the second working surfaces are one-to-one correspondingly connected with two adjacent first working surfaces.

[0035] It is understood that the second working surface is a circular arc surface that plays a role similar to that of an angular clamping, and the smaller the radius of the circular arc, the better, under the possible premise. The use of a minimum radius circular arc can reduce the contact area of the second working surface with the workpiece, and the working diamond in the contact surface can obtain a large pressure and easily form a clamping shape, reducing the "cross-cutting" phenomenon. The use of a polygonal substrate wire saw, the second working surface is more used, and under the condition of a small radius circular arc, the diamond of the second working surface has two adjacent first working surfaces extending to the second working surface, that is, the working diamond concentration is higher than that of the first working surface, which is beneficial to improve the wear resistance and service life of the second working surface. The second working surface arranged between two adjacent first working surfaces also helps to reduce the tip discharge during electroplating of the wire saw substrate and balance the thickness of the plating layer.

[0036] The beneficial effects of the above preferred scheme are that the second working surface helps to reduce the wire saw area in contact with the workpiece, thereby increasing the pressure of the diamond in contact with the workpiece, improving the sharpness of the wire saw, and also making it difficult for the wire saw to laterally deviate through the clamping effect of the second working surface, reducing the "cross-cutting" phenomenon and making the workpiece cutting surface have higher parallelism.

[0037] Preferably, the circumferential length of the first working surface on the radial polygonal cross section of the polygonal substrate segment is greater than 70% of the diamond particle size.

[0038] The beneficial effects of the above preferred scheme are that the electroplated plating layer can better hold the diamond, so that the diamond is not easily forced to fall off.

[0039] Preferably, the first working surface is a plane or an arc surface.

[0040] The beneficial effects of the above preferred scheme are that the arc surface of the substrate working surface helps to reduce the difficulty of manufacturing the wire saw substrate.

[0041] Preferably, in any length segment of the first working surface in the axial direction equal to the diamond particle size, the circumferential length of the first working surface on the radial polygonal cross section of the polygonal substrate segment is plated with at most one complete working diamond particle.

[0042] Wherein, it is understood that: in the preferred embodiment of the present application, in the axial direction of the first working surface, the circumferential side length of the first working surface on the radial polygonal cross section of the polygonal base section is plated with at most one complete working diamond particle, at this time, a polygonal wire saw with more sides can be selected, wherein "at most one complete working diamond particle" means that there can be one complete working diamond particle on the first working surface, while there can be multiple incomplete working diamond particles; there can be multiple incomplete working diamond particles; there can be no diamond. In other embodiments of the present application, in the axial direction of the first working surface, the circumferential side length of the first working surface on the radial polygonal cross section of the polygonal base section can be plated with two or more complete diamond particles side by side, at this time, a polygonal wire saw with fewer sides is selected, and the angle between the two first working surfaces of the wire saw base is smaller, which is suitable for the second working surface to quickly form a clamping effect on the workpiece and perform plow grinding.

[0043] The beneficial effects of the above preferred scheme are: when the diamond is arranged in a single particle in an approximate straight line in the axial direction on the first working plane, the service life and engraving efficiency of the diamond are improved, and the sharpness of the wire saw is improved.

[0044] As shown in Figure 1 A processing method for processing a plating diamond polygonal wire saw based on multiple base lines, the processing method comprises the following steps:

[0045] S1: determining the number of sides, single-side length, cross-sectional area of the radial polygonal cross section of the polygonal base section, the length of the polygonal base section and the circular base section, and the shape of the diamond plating area;

[0046] S2: manufacturing an extrusion die according to the number of sides, single-side length and cross-sectional area determined in S1, and setting a structure suitable for the circular arc transition section at both ends of the extrusion die;

[0047] S3: heating the part of the base with the length of the polygonal base section;

[0048] S4: adding a brazing material that can be electroplated with nickel to the gap between the multiple base lines in the heated part;

[0049] S5: extruding the heated part by using the extrusion die manufactured in S2 and obtaining a polygonal base section by cooling, demolding and heat treatment;

[0050] S6: repeating S3 and S4 after spacing a length of the circular base section;

[0051] S7: extruding the heated part after the extrusion die is misaligned by a certain angle, and obtaining a second polygonal substrate segment by cooling, demolding and heat treatment;

[0052] S8: repeating S6 and S7 to obtain a substrate in which polygonal substrate segments and circular substrate segments are arranged alternately;

[0053] S9: coating the diamond on the polygonal substrate segments, the circular substrate segments and the circular arc transition segments by electroplating.

[0054] It should be understood that in the processing method of the present application, the initial structure of the substrate is a structure in which a plurality of base lines are woven and the radial cross section is approximately circular, similar to a cable in which a plurality of wires are woven.

[0055] In S1, the number N of sides of the polygonal cross section, the single-side length B and the cross-sectional area S of the polygonal substrate segment need to be selected according to actual processing requirements, such as considering the cost of the wire saw substrate, the kerf of the wire saw (i.e. the diameter Φ of the circumscribed circle of the polygon on the radial cross section of the polygonal substrate segment), the particle size of the diamond and the maximum number of particles of the diamond bonded on each side of the polygonal cross section of the wire saw substrate, the number N of sides of the polygonal cross section, the single-side length B and the cross-sectional area S need to satisfy the following formula: S = N / 4 * B 2 *cot(π / 2N). The shape of the diamond coating area also needs to be set according to the actual processing process requirements, such as being set to disordered, spiral ring, circular ring, different particle size segments (i.e. the wire saw substrate is axially segmented to coat different numbers of diamonds), etc., to realize various functions, such as efficient cooling, rapid chip removal, ordered arrangement of diamonds, intermittent grinding, frequent or random changes in the grinding area (i.e. the contact area between the wire saw and the workpiece), etc.

[0056] In the preferred embodiment of the present application, the cross-sectional arc length of the second working surface also needs to be selected according to the actual processing requirements and the reference diamond particle size. When the selected diamond particle size is much smaller than the cross-sectional arc length of the second working surface, the second working surface is more likely to be coated with a relatively higher concentration of diamonds, which is beneficial to improve the wear resistance of the corner part of the wire saw substrate (i.e. the service life of the second working surface); when the selected diamond particle size is closer to the circumferential length of the first working surface, the second working surface is less likely to be coated with diamonds higher than the average concentration, but the second working surface is easily protected by the extension of the diamonds on the adjacent first working surface, and the first working surface is also more likely to obtain diamonds with ordered arrangement effect. This structure is beneficial to improve the sharpness of the wire saw by reducing the concentration of diamonds and increasing the pressure of the contact diamonds with the workpiece.

[0057] In S4, since the electroplating is to plate the electroplating material, such as nickel, on the peripheral surface of the substrate, the brazing material needs to be selected as the material that can be plated by the electroplating material, and the brazing material can be firmly fixed after the subsequent step of extrusion and cooling forming of the extrusion die to form the polygonal substrate segment with the multiple strands of the substrate.

[0058] In S5, the heat treatment is to eliminate the stress of the wire saw substrate after the extrusion and adjust the mechanical properties.

[0059] In S7, the angle X of the extrusion die misplacement is 360° / N / 2, where N is the number of sides.

[0060] After S9, if there are wastes left on the surface of the substrate during the cooling demolding and heat treatment, the outer wall of the substrate needs to be cleaned.

[0061] The beneficial effects of the present application are that the addition of the brazing material in the peripheral gap of the multiple strands of the substrate and the heating thereof are beneficial to firmly fix the polygonal substrate segment formed by the weaving of the multiple strands of the substrate, and avoid the rebound force of the multiple strands of the substrate after the removal of the extrusion die to destroy the polygonal substrate segment, so that the polygonal substrate segment cannot be formed. The present application optimizes the grinding performance of the wire saw, improves the service life and cutting force of the wire saw, reduces the wire saw breaking rate, improves the parallelism of the workpiece cutting surface, and optimizes the cooling and chip removal functions.

[0062] In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms “center”, “longitudinal”, “transverse”, “length”, “width”, “thickness”, “upper”, “lower”, “front”, “rear”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential” are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0063] In addition, the terms “first” and “second” are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with “first” and “second” can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of “multiple” is at least two, such as two, three, etc., unless otherwise specifically limited.

[0064] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0065] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0066] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0067] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A method of processing a multi-strand baseline based electroplated diamond polygonal wire saw, characterized by, The method comprises the following steps: S1: determining the number of edges, single-edge length, cross-sectional area of the radial polygonal cross section of the polygonal base section, the lengths of the polygonal base section and the circular base section, and the shape of the diamond plating area; S2: manufacturing an extrusion die according to the number of edges, single-edge length and cross-sectional area determined in S1, and setting a structure matching the circular arc transition section at both ends of the extrusion die; S3: heating the part of the base having the length of the polygonal base section; S4: adding a brazing material capable of being electroplated with nickel at the gap between the multiple strands of the base wire at the heated part; S5: extruding the heated part by using the extrusion die manufactured in S2 and obtaining a polygonal base section through cooling, demolding and heat treatment; S6: repeating S3 and S4 after spacing a length of the circular base section; S7: extruding the heated part after misaligning the extrusion die by a certain angle and obtaining a second polygonal base section through cooling, demolding and heat treatment; S8: repeating S6 and S7 to obtain a base in which the polygonal base sections and the circular base sections are alternately arranged; S9: plating diamonds on the polygonal base sections, the circular base sections and the circular arc transition sections by electroplating; The electroplated diamond polygonal wire saw based on multiple strands of base wires comprises a base woven by multiple strands of base wires, a brazing material and a diamond electroplated layer, the base is provided with multiple polygonal base sections, multiple circular base sections and multiple circular arc transition sections, the brazing material is arranged at the gap between the multiple strands of base wires on the peripheral surface of the polygonal base section, the polygonal base sections and the circular base sections are axially alternately arranged, the circular arc transition sections are one-to-one connected with the polygonal base sections and the circular base sections at both ends, the multiple polygonal base sections are misaligned in the peripheral direction, and the diamond electroplated layer is arranged on the polygonal base sections, the circular base sections and the circular arc transition sections.

2. The multi-strand baseline based electroplated diamond polygonal wire saw machining method according to claim 1, wherein, The polygonal base section is provided with multiple first working surfaces and multiple second working surfaces in the peripheral direction, and the second working surfaces are one-to-one connected with two adjacent first working surfaces at both sides.

3. The method of processing a multi-strand baseline based electroplated diamond polygonal wire saw according to claim 2, wherein, The peripheral length of the first working surface on the radial polygonal cross section of the polygonal base section is greater than 70% of the diamond particle size.

4. The method of processing a multi-strand baseline based electroplated diamond polygonal wire saw according to claim 2, wherein, The first working surface is a plane or an arc surface.

5. The method of processing a multi-strand baseline based electroplated diamond polygonal wire saw according to claim 2, wherein, In any length section of the first working surface in the axial direction equal to the diamond particle size, the peripheral length of the first working surface on the radial polygonal cross section of the polygonal base section is plated with at most one complete working diamond particle.

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