A manufacturing process for a positioning and bonding component

Abstract

This invention discloses a manufacturing process for a positioning and bonding process component, relating to the field of die-cutting technology. The process involves sequentially punching out the shapes of a backing layer, a product block, and a release film. The backing layer and product block are then bonded together to form a composite component. Finally, the composite component is bonded to the release film to obtain the finished positioning and bonding process component. In this manufacturing process, the product block and the process base film of the produced positioning and bonding process component have a backing layer. This backing layer is diagonally divided into two halves. The half of the backing layer closest to the peeling start position only covers 25% to 60% of the product layer area. Furthermore, the first backing layer has a special shape; when the protective layer is peeled off, the backing layer attached to it is peeled off first, effectively preventing the adhesive protective layer from lifting the product layer. This process uses asynchronous die-cutting, saving production costs and improving production efficiency.

Description

Technical Field

[0001] This invention relates to the field of die-cutting technology, specifically to a production process for a positioning and bonding component. Background Technology

[0002] Many consumer electronics products, due to their numerous components and complex structures, require process components during assembly to improve the accuracy and efficiency of product assembly. For example, a peelable adhesive protective layer is applied to a die-cut product to protect it before installation. However, due to various factors during production and transportation, the protective layer can sometimes be difficult to peel off, or even damage the product itself. In such cases, a positioning and bonding process component needs to be added between the product and its protective layer. Those skilled in the art have proposed a manufacturing process for such a positioning and bonding process component. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides a manufacturing process for positioning and bonding components, thus solving the problems mentioned in the background section.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] In a first aspect, the present invention proposes a manufacturing process for a positioning and bonding process component, comprising the following steps:

[0006] S1. According to the design shape of the reverse layer, the outline of the reverse layer is punched out on the reverse layer blank using a punching equipment.

[0007] S2. According to the preset arrangement template, asynchronously cut and arrange the product blocks in the left and right regions along the Y-axis direction;

[0008] S3. Arrange the product blocks of the upper and lower regions along the X-axis;

[0009] S4. According to the design shape of the product block, the outer contour of the product block is punched out on the product block blank using a punching equipment.

[0010] S5. Bond the reverse layer of S1 to the product block of S4 to obtain a composite component;

[0011] S6. According to the design shape of the release film, the outer contour of the release film is punched out on the release film blank using a punching equipment.

[0012] S7. Bond the composite component of S5 with the release film of S6 to obtain the positioning and bonding process component.

[0013] Furthermore, in S2, several slit product strips are first attached to the process support film to form a product strip. Then, the rotation speed of the die is controlled so that the rotation speed of the die is faster than the moving speed of the product strip, thereby asynchronously punching out product blocks arranged in the Y direction.

[0014] Furthermore, in S2, the width of the product strip bonded to the process base film is wider than the width of the final formed product block in the Y direction.

[0015] Furthermore, in S2, the asynchronously punched product block has a width on both sides in the X direction that is greater than that of the finished product block.

[0016] Furthermore, the gap between two adjacent product blocks in the X direction shall not be less than 2mm.

[0017] Secondly, the present invention also proposes a positioning and bonding process component produced by the above-mentioned manufacturing process, the structure of which includes:

[0018] The process base film has an adhesive side;

[0019] The reverse adhesive layer consists of several layers, one side of which is adhesive and the other side is non-adhesive;

[0020] The number of product blocks corresponds to the number of reverse-adhesive layers;

[0021] The release film is bonded to the process base film in the middle and overlapped with the product block at the edges.

[0022] Furthermore, the adhesive side of the reverse layer is bonded to the adhesive side of the process base film.

[0023] Furthermore, the non-adhesive side of the reverse layer will partially contact the product block, with the contact area accounting for 25% to 40% of the total surface area of ​​the product block. The part of the product block that does not contact the reverse layer will adhere to the adhesive side of the process base film.

[0024] Furthermore, the reverse adhesive layer includes a first reverse adhesive layer and a second reverse adhesive layer.

[0025] Furthermore, the positioning and bonding process component has a peeling start position at the corner. The product block closer to the glass start position uses the first reverse bonding layer, and the product block farther away from the glass start position uses the second reverse bonding layer.

[0026] Furthermore, the middle side of the reverse adhesive layer also has an inclined structure. A straight line a is drawn between the starting position of the peeling of the bottom film and the center line of the product block. Then, a perpendicular line b is drawn on a. With a as the Y-axis and b as the X-axis, a straight line c is drawn connecting the endpoints of the two adjacent sides of the inclined structure of the reverse adhesive layer. Let the slope of c be k1 and the slope of the extended line d of the inclined structure be k2. Then 0 ≤ k2 ≤ k1.

[0027] This invention provides a manufacturing process for components used in the positioning and bonding process. Compared with existing technologies, it has the following advantages:

[0028] The manufacturing process of this positioning and bonding process component involves a reverse adhesive layer between the product block and the process base film. This reverse adhesive layer is divided into two halves diagonally. The half of the reverse adhesive layer closest to the peeling start position covers only 25% to 60% of the product layer area. Furthermore, the first reverse adhesive layer has a special shape. When the protective layer is peeled off, the reverse adhesive layer attached to it will be peeled off first, effectively preventing the adhesive protective layer from lifting the product layer. This process uses asynchronous die-cutting technology, which saves production costs and improves production efficiency. Attached Figure Description

[0029] Figure 1 This is a schematic diagram illustrating the effect of asynchronous punching out product blocks in this invention;

[0030] Figure 2 This is an exploded structural diagram of the positioning and bonding process component in this invention;

[0031] Figure 3 This is a schematic diagram of the stacked structure of the positioning and bonding process component in this invention when it does not include a release film;

[0032] Figure 4 For the present invention Figure 3 Top view;

[0033] Figure 5 This is a schematic diagram showing the positions of auxiliary lines a, b, c, and d in this invention.

[0034] In the diagram: 1. Process base film; 2. Reverse adhesive layer; 21. First reverse adhesive layer; 22. Second reverse adhesive layer; 3. Product block. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example

[0036] This invention provides a technical solution: a manufacturing process for a positioning and bonding component, comprising the following steps:

[0037] S1. According to the design shape of the reverse layer, the outline of the reverse layer is punched out on the reverse layer blank using a punching equipment.

[0038] S2. According to the preset arrangement template, asynchronously cut and arrange the product blocks in the left and right regions along the Y-axis direction;

[0039] S3. Arrange the product blocks of the upper and lower regions along the X-axis;

[0040] S4. According to the design shape of the product block, the outer contour of the product block is punched out on the product block blank using a punching equipment.

[0041] S5. Bond the reverse layer of S1 to the product block of S4 to obtain a composite component;

[0042] S6. According to the design shape of the release film, the outer contour of the release film is punched out on the release film blank using a punching equipment.

[0043] S7. Bond the composite component of S5 with the release film of S6 to obtain the positioning and bonding process component.

[0044] Please see Figure 1 Specifically, in S2, several slit product strips are first bonded to the process base film to form a product strip. Then, the rotation speed of the die is controlled so that the rotation speed of the die is slightly faster than the moving speed of the product strip, thereby asynchronously punching out product blocks arranged in the Y direction. The width of the product strip bonded to the process base film is slightly wider than the width of the final product block in the Y direction (specifically, 2-2.5mm wider on each side of the finished double-sided adhesive block in the Y direction). The asynchronously punched product blocks are slightly wider on both sides of the finished product block in the X direction (specifically, 2-2.5mm wider on each side of the finished product block in the X direction). The gap between two adjacent product blocks in the X direction is not less than 2mm. Example

[0045] Please see Figure 2 , 3 4. According to the above production process, the positioning and bonding process component produced has a structure including a process base film 1, a reverse adhesive layer 2, a product block 3, and a release film 4. One side of the process base film 1 is adhesive. Several reverse adhesive layers 2 are provided. One side of the reverse adhesive layer 2 is adhesive, and the other side is not adhesive. The number of product blocks 3 corresponds to the number of reverse adhesive layers 2. The adhesive side of the reverse adhesive layer 2 is bonded to the adhesive side of the process base film 1. The non-adhesive side of the reverse adhesive layer 2 will partially contact the product block 3. The contact area accounts for 25% to 40% of the total surface area of ​​the product block 3. The part of the product block 3 that is not in contact with the reverse adhesive layer 2 will be bonded to the adhesive side of the process base film 1. The reverse adhesive layer 2 includes a first reverse adhesive layer 21 and a second reverse adhesive layer 22. The positioning and bonding process component has a peeling start position at the corner. The product block 3 near the glass start position uses the first reverse adhesive layer 21, and the product block 3 away from the glass start position uses the second reverse adhesive layer 22.

[0046] Please see Figure 5 The reverse layer 2 also has an inclined structure on one side of the middle. The starting position of the peeling of the process base film 1 is connected to the center line of the product block 3 by a straight line a. Then, a perpendicular line b is drawn on a. With a as the Y-axis and b as the X-axis, a straight line c is drawn connecting the endpoints of the two adjacent sides of the inclined structure of the reverse layer 2. Let the slope of c be k1 and the slope of the extended line d of the inclined structure be k2. Then 0 ≤ k2 ≤ k1.

[0047] In summary, the present invention discloses a manufacturing process for a positioning and bonding process component. The component has a reverse adhesive layer 2 between the product block 3 and the process base film 1. The reverse adhesive layer is divided into two halves diagonally. The half of the reverse adhesive layer near the peeling start position only covers 25% to 60% of the product layer area. Furthermore, the first reverse adhesive layer 21 has a special shape. When the protective layer is peeled off, the reverse adhesive layer attached to it will be peeled off first, effectively preventing the adhesive protective layer from lifting the product layer. This process uses an asynchronous die-cutting process, which saves production costs and improves production efficiency.

Claims

1. A manufacturing process for a positioning and bonding component, characterized in that, Includes the following steps: S1. According to the design shape of the reverse layer, the outline of the reverse layer is punched out on the reverse layer blank using a punching equipment. S2. According to the preset arrangement template, asynchronously cut and arrange the product blocks in the left and right regions along the Y-axis direction; S3. Arrange the product blocks of the upper and lower regions along the X-axis; S4. According to the design shape of the product block, the outer contour of the product block is punched out on the product block blank using a punching equipment. S5. Bond the reverse layer of S1 to the product block of S4 to obtain a composite component; S6. According to the design shape of the release film, the outer contour of the release film is punched out on the release film blank using a punching equipment. S7. Bond the composite component of S5 with the release film of S6 to obtain the positioning and bonding process component. The positioning and bonding process component produced by the aforementioned manufacturing process includes the following structure: The process base film (1) has an adhesive side; The reverse adhesive layer (2) is provided with several layers, one side of which is adhesive and the other side is not adhesive; The number of product blocks (3) corresponds to the number of reverse adhesive layers (2); Release film (4) is bonded to the process base film (1) in the middle and overlapped on the product block (3) at the edges; The non-adhesive side of the backing layer (2) will partially contact the product block (3), and the contact area accounts for 25% to 40% of the total surface area of ​​the product block (3). The part of the product block (3) that does not contact the backing layer (2) will adhere to the adhesive side of the process base film (1). The middle side of the reverse layer (2) also has an inclined structure. The peeling start position of the process bottom film (1) is connected to the center line of the product block (3) by a straight line a. Then, a perpendicular line b is drawn on a. With a as the Y-axis and b as the X-axis, a straight line c is drawn connecting the endpoints of the two adjacent sides of the inclined structure of the reverse layer (2). Let the slope of c be k1 and the slope of the extended line d of the inclined structure be k2. Then 0 ≤ k2 ≤ k1.

2. The manufacturing process of a positioning and bonding component according to claim 1, characterized in that, In S2, several slit product strips are first attached to the process support film to form a product strip. Then, the rotation speed of the die is controlled so that the rotation speed of the die is faster than the moving speed of the product strip, thereby asynchronously punching out product blocks arranged in the Y direction.

3. The manufacturing process of a positioning and bonding component according to claim 2, characterized in that, In S2, the width of the product strip bonded to the process base film is wider than the width of the final product block in the Y direction.

4. The manufacturing process of a positioning and bonding component according to claim 2, characterized in that, In S2, the asynchronously punched product block has a width on both sides in the X direction that is greater than that of the finished product block.

5. The manufacturing process of a positioning and bonding component according to claim 4, characterized in that, The gap between two adjacent product blocks in the X direction shall not be less than 2mm.

6. The manufacturing process of a positioning and bonding component according to claim 1, characterized in that, The adhesive side of the reverse layer (2) is bonded to the adhesive side of the process base film (1).

7. The manufacturing process of a positioning and bonding component according to claim 1, characterized in that, The reverse adhesive layer (2) includes a first reverse adhesive layer (21) and a second reverse adhesive layer (22). The positioning and bonding process component has a peeling start position at the corner. The product block (3) close to the glass start position uses the first reverse adhesive layer (21), and the product block (3) far from the glass start position uses the second reverse adhesive layer (22).

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