An apparatus and a packaging method for coupling an optical fiber array with an optoelectronic chip

Abstract

The application discloses a device for coupling and packaging of an optical fiber array and an optoelectronic chip, wherein when the device is used, the device and the chip are fixed by point gluing only once when the coupling loss between the optical fiber array and the optoelectronic chip is minimized, and the function of multiple insertion and extraction of the optical fiber array in the whole device and multiple efficient coupling and alignment between the optical fiber array and the optoelectronic chip without the aid of adjusting equipment can be realized, and the device can be directly used for packaging and reinforcing between the optical fiber array and the optoelectronic chip. The application also discloses a method for coupling, testing, packaging of the optical fiber array and the optoelectronic chip, wherein the process of switching the device generally required in the testing and packaging process is omitted, the risk of damage to the stability of the optical fiber array caused by artificial installation and removal of the clamp is avoided, the rapid connection of the processes from the coupling test of the optical fiber array and the optoelectronic chip to the packaging and then to the reinforcement is realized, the optical packaging method of the optical fiber array and the optoelectronic chip is optimized, and the success rate of the optical packaging is greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical coupling packaging of silicon-based optoelectronic chips, and particularly relates to a device and a packaging method for coupling and packaging of an optical fiber array and an optoelectronic chip. BACKGROUND

[0002] With the rapid development of the semiconductor industry, the integration of optoelectronic chips is becoming higher and higher, and the coupling test and packaging technology for optoelectronic chips is also constantly developing and updating. In the coupling test technology of the optical fiber array and the optical chip, the optical fiber array and the optical grating coupler need to be adjusted in multiple dimensions, and the coupling loss needs to be reduced to the minimum before the chip test and packaging can be carried out. At present, the test and packaging generally need to go through repeated coupling process, which lasts for a long time, and requires skilled coupling technology of the operator. Moreover, the optical fiber array also needs to be packaged and fixed after the test, and the general coupling test adjustment device cannot meet the requirements of both multiple coupling tests of the optical fiber array and the packaging and fixing of the optical fiber array and the optoelectronic chip after the test of the optoelectronic chip. The current optical fiber array packaging method is relatively single, that is, after the optical fiber array and the optoelectronic chip are pasted and solidified by UV glue, the fixture device of the optical fiber array is separated from the optical fiber array, and then the optical fiber array or the fiber of the optical fiber array is reinforced. This packaging method brings a series of stability problems to the packaging of the optical fiber array and the optoelectronic chip, such as (1) the fixture device of the optical fiber array needs to be separated manually after the UV glue is solidified, which increases the risk of increasing the coupling loss of the optical fiber array and the optoelectronic chip caused by the manual disassembly of the fixture, (2) the packaging method of removing the fixture device of the optical fiber array and then reinforcing the optical fiber array is relatively complex, which increases the influence of the dislocation and displacement of the optical fiber array from the optoelectronic chip caused by the stress of the fiber of the optical fiber array. Therefore, the improvement and perfection of the optical packaging method of the optical fiber array and the optoelectronic chip are also the key links to improve the success rate of the packaging of the optoelectronic chip. SUMMARY

[0003] In view of the deficiencies of the prior art, the present application provides a device and a packaging method for coupling and packaging of an optical fiber array and an optoelectronic chip. The device only needs to fix the entire device and the optoelectronic chip when the coupling loss of the optical fiber array and the optoelectronic chip is the lowest by using the adjusting equipment for the first time, so that the function of multiple insertion and extraction of the optical fiber array in the device and multiple efficient coupling and alignment between the optical fiber array and the optoelectronic chip can be realized without the adjusting equipment, and the success rate of packaging is high and the utilization rate of the device is high.

[0004] To achieve the above object, the present application provides the following technical scheme:

[0005] The utility model provides a device for optical fiber array and optoelectronic chip coupling package, including: casing, scotch yoke structure adjusting assembly one, sliding frame one, scotch yoke structure adjusting assembly two, sliding frame two, optical fiber array fixing assembly one and optical fiber array fixing assembly two,

[0006] The inside of the casing is provided with annular slide groove one and annular slide groove two arranged in parallel, the sliding frame one is arranged in the annular slide groove one and can slide in a small range along the annular slide groove one, and the sliding frame two is arranged in the annular slide groove two and can slide in a small range along the annular slide groove two.

[0007] The scotch yoke structure adjusting assembly one comprises an adjusting wheel, an adjusting ring and an adjusting handle, the adjusting handle is fixed on the adjusting wheel, one end of the adjusting handle extends out of the casing through the annular slide groove one to facilitate the user to rotate the adjusting handle, the other end of the adjusting handle passes through the adjusting ring, and the adjusting ring is fixedly connected with the sliding frame one.

[0008] The scotch yoke structure adjusting assembly two is completely same in structure with the scotch yoke structure adjusting assembly one, the scotch yoke structure adjusting assembly two and the scotch yoke structure adjusting assembly one are respectively arranged on two adjacent sides of the casing, and the adjusting handle of the scotch yoke structure adjusting assembly two is fixedly connected with the sliding frame two.

[0009] The optical fiber array fixing assembly one and the optical fiber array fixing assembly two are arranged on two opposite sides of the casing respectively to realize the fixation of the optical fiber array.

[0010] Further, the casing is made of transparent organic glass material, which facilitates observation during adjustment of the optical fiber array.

[0011] Further, the top end of the casing is provided with a chamfer, so that the entrance of the casing is enlarged, and the insertion and extraction of the optical fiber array are facilitated.

[0012] Further, the surfaces of the optical fiber array fixing assembly one and the optical fiber array fixing assembly two are provided with external threads, the two opposite sides of the casing are provided with threaded holes, the optical fiber array fixing assembly one and the optical fiber array fixing assembly two are advanced or retreated along the threaded fixing holes through cooperation of the external threads and the threaded holes, so that the fixation of the optical fiber array is realized.

[0013] Further, the optical fiber array fixing assembly one, the optical fiber array fixing assembly two, the scotch yoke structure adjusting assembly two and the scotch yoke structure adjusting assembly one are all made of aluminum material.

[0014] Further, the utility model further comprises a micro-differentiating head one detachably connected to the optical fiber array fixing assembly one.

[0015] Further, the differential head one is two, and the other is detachably connected to the optical fiber array fixing assembly two.

[0016] Further, the fine adjustment assembly one is two, and the other is detachably connected to the Scotch yoke structure adjustment assembly two.

[0017] Further, the fine adjustment assembly one is two, and the other is detachably connected to the Scotch yoke structure adjustment assembly two.

[0018] A packaging method for optical fiber array and optoelectronic chip coupling packaging is based on the device for optical fiber array and optoelectronic chip coupling packaging, and the method comprises the following steps:

[0019] Step one: place the optical fiber array to be coupled and tested in the shell, move the optical fiber array to the appropriate position by using the Scotch yoke structure adjustment assembly two and the Scotch yoke structure adjustment assembly one, and then fix the optical fiber array and the shell by using the optical fiber array fixing assembly one and the optical fiber array fixing assembly two.

[0020] Step two: install the fixed optical fiber array and shell on the electric displacement slide table for coupling test, so that they can be adjusted and moved.

[0021] Step three: couple the fixed optical fiber array and shell with the optical grating coupler on the optoelectronic chip by using the electric displacement slide table, and when the coupling loss is the lowest, fix the shell and the optoelectronic chip by using UV glue.

[0022] Step four: loosen the optical fiber array fixing assembly one and the optical fiber array fixing assembly two, and the optical fiber array can be disassembled multiple times without damage; next time, directly insert the optical fiber array into the shell, adjust the accurate position of the optical fiber array to the minimum coupling loss, and then fix the optical fiber array and the shell by using the optical fiber array fixing assembly one and the optical fiber array fixing assembly two.

[0023] Step five: after multiple test work is completed, directly pour appropriate amount of UV glue into the shell when the optical fiber array and the optoelectronic chip are optically packaged, and after curing, the whole optical fiber array packaging is completed.

[0024] The beneficial effects of the present application are:

[0025] (1) When using the device for coupling and packaging fiber arrays and optoelectronic chips according to the present invention, during packaging, only the device and the chip need to be fixed with adhesive after the coupling loss between the fiber array and the optoelectronic chip is minimized for the first time. This enables the fiber array to be repeatedly inserted and removed and efficiently coupled and aligned with the optoelectronic chip multiple times in the entire device without the adjustment equipment. Moreover, after the coupling test is completed, the packaging device can be directly used for packaging and reinforcing between fiber arrays and optoelectronic chips. The closed design of this device also makes the liquid UV adhesive used in the optical packaging process flow more concentrated and uniformly, reducing the impact of optical adhesive overflow on the rest of the optoelectronic chip and greatly improving the success rate of packaging.

[0026] (2) The device of the present invention for coupling and packaging of fiber array and optoelectronic chip can also be used in situations where multiple coupling tests are required but packaging is not required. In this case, the device can quickly and efficiently couple and align the fiber array with the optoelectronic chip multiple times, thereby improving the coupling test efficiency and the utilization rate of the optoelectronic chip and fiber array.

[0027] (3) The device and packaging method for coupling and packaging of fiber arrays and optoelectronic chips of the present invention eliminate the process of switching devices during testing and packaging, avoid the risk of damage to the stability of fiber arrays caused by manual installation and removal of fixtures, realize the rapid connection from coupling test of fiber arrays and optoelectronic chips to packaging and then to reinforcement process, optimize the optical packaging method of fiber arrays and optoelectronic chips, and greatly improve the success rate of optical packaging.

[0028] (4) The device for coupling and packaging of fiber arrays and optoelectronic chips of the present invention can be designed according to the size of the fiber array to be tested and packaged, and is suitable for coupling testing and packaging of fiber arrays and optoelectronic chips with multiple channels and multiple sizes. Attached Figure Description

[0029] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0030] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0031] The flowcharts shown in the drawings are merely illustrative, and are not necessarily required to include all the contents and operations / steps, nor are they necessarily executed in the order described. For example, some operations / steps can be further divided, and some operations / steps can be combined or partially combined, so the actual execution order can be changed according to actual conditions.

[0032] Figure 1 Structure diagram of the device for coupling and packaging of the optical fiber array and the optoelectronic chip.

[0033] Figure 2 Structure diagram of the internal structure after removing two surfaces of the shell.

[0034] Figure 3 Structure diagram of the device for coupling and packaging of the optical fiber array and the optoelectronic chip after adding the first micro-differentiation head and the first fine adjustment assembly.

[0035] Figure 4 Structure diagram of the first fine adjustment assembly after removing the protective shell.

[0036] Among them, the shell 1, the annular sliding groove one 101, the annular sliding groove two 102, the chamfer 103, the Scottish yoke structure adjustment assembly one 2, the adjustment wheel 201, the adjustment ring 202, the adjustment handle 203, the sliding frame one 3, the Scottish yoke structure adjustment assembly two 4, the sliding frame two 5, the optical fiber array fixing assembly one 6, the optical fiber array fixing assembly two 7, the first micro-differentiation head 8, the first fine adjustment assembly 9, the protective shell 901, the second micro-differentiation head 902, the rack 903, the gear 904. DETAILED DESCRIPTION

[0037] The exemplary embodiments will be described in detail hereinbelow with reference to the drawings. In the following description, the same numbers are used to denote the same elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not meant to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the present application as detailed in the appended claims.

[0038] The terminology used in the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0039] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0040] like Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a device for coupling and packaging fiber optic arrays and optoelectronic chips, comprising a housing 1, a Scottish yoke structure adjustment component 1 2, a sliding frame 1 3, a Scottish yoke structure adjustment component 2 4, a sliding frame 2 5, a fiber optic array fixing component 1 6, and a fiber optic array fixing component 2 7.

[0041] The shell 1 is hollow inside, and its side is provided with parallel annular sliding groove 101 and annular sliding groove 102. Sliding frame 1 3 is arranged in annular sliding groove 101 and can slide along annular sliding groove 101 within a small range; sliding frame 2 5 is arranged in annular sliding groove 2 102 and can slide along annular sliding groove 2 102 within a small range.

[0042] The Scottish yoke structure adjustment assembly 2 includes an adjustment wheel 201, an adjustment ring 202, and an adjustment handle 203. The adjustment handle 203 is fixed to the adjustment wheel 201, and one end of the adjustment handle 203 extends out of the housing 1 through the annular groove 101 for easy rotation by the user. The other end of the adjustment handle 203 passes through the adjustment ring 202, which is fixedly connected to the sliding frame 3. This allows the adjustment handle 203 to rotate the adjustment wheel 201 by a certain angle, and the adjustment ring 202 to convert the rotation of the adjustment wheel 201 into movement, causing the sliding frame 3, which is fixedly connected to the adjustment ring 202, to move a certain distance along the annular groove 101, thereby adjusting the position of the fiber optic array.

[0043] The Scottish yoke adjustment assembly 24 is structurally identical to the Scottish yoke adjustment assembly 12. The adjustment handle of the Scottish yoke adjustment assembly 24 cooperates with the sliding frame 25. The Scottish yoke adjustment assembly 12 and the Scottish yoke adjustment assembly 24 are installed on two adjacent side walls of the housing 1, thereby enabling the fiber array to move along two mutually perpendicular directions on the horizontal plane.

[0044] The fiber array fixing assembly one 6 and the fiber array fixing assembly two 7 are arranged in the threaded fixing holes of the opposite two sides of the shell 1, the fiber array fixing assembly one 6 and the fiber array fixing assembly two 7 are provided with threads on the surfaces, the fiber array fixing assembly one 6 and the fiber array fixing assembly two 7 are advanced or retreated along the threaded fixing holes through the thread cooperation with the threaded fixing holes, so that the fixing of the fiber array is realized.

[0045] In the embodiment, the shell 1 is made of transparent organic glass material, the observation during the adjustment of the fiber array is facilitated, the fiber array fixing assembly one 6 and the fiber array fixing assembly two 7 are made of aluminum material, the fixing strength is strengthened and the weight is reduced at the same time. The rotating wheel and the adjusting ring in the Scotch yoke adjusting assembly are made of aluminum material, and the load on the whole device can be reduced at the same time.

[0046] The top end of the shell 1 is provided with an inward chamfer, so that the entrance of the shell 1 is large, and the plug-in and plug-out processing of the fiber array is facilitated.

[0047] The embodiment of the application further discloses a method for coupling and packaging the fiber array and the optoelectronic chip, the method is realized based on the adjusting device for the fiber array packaging, and the method comprises the following steps:

[0048] Step one: placing the fiber array to be coupled and tested in the shell 1, moving the fiber array to a proper position by using the Scotch yoke adjusting assembly two 4 and the Scotch yoke adjusting assembly one 2, and fixing the fiber array and the shell 1 by using the fiber array fixing assembly one 6 and the fiber array fixing assembly two 7.

[0049] Step two: installing the fixed fiber array and the shell 1 on the electric displacement slide table for coupling and testing, so that the fiber array and the shell 1 can be adjusted and moved;

[0050] Step three: coupling the fixed fiber array and the shell 1 and the grating coupler on the optoelectronic chip by using the electric displacement slide table, when the coupling loss is the lowest, fixing the shell 1 and the optoelectronic chip by using UV glue. The fiber array in this state can be disassembled and assembled repeatedly, and only needs to be loosened by rotating the fiber array fixing assembly.

[0051] Step four: when the fiber array is coupled and tested next time, the electric displacement slide table device is not needed to be used for adjustment, only needs to be inserted into the shell 1, the Scotch yoke adjusting assembly two 4 and the Scotch yoke adjusting assembly one 2 are adjusted, the accurate position of the fiber array is adjusted to the minimum coupling loss, and the fiber array and the shell 1 are fixed by using the fiber array fixing assembly one 6 and the fiber array fixing assembly two 7.

[0052] Step five: after the multiple test work is completed, the optical fiber array and the optoelectronic chip are optically packaged, the appropriate UV glue is poured into the shell 1, and the whole optical fiber array is packaged after curing.

[0053] In the above embodiment, the optical fiber array fixing assembly one 6 and the optical fiber array fixing assembly two 7 are screwed in or out for adjustment, and the Scotch yoke structure adjustment assembly two 4 and the Scotch yoke structure adjustment assembly one 2 are adjusted by the adjustment handle, which are suitable for occasions where the adjustment accuracy is not high. When further requiring the adjustment accuracy, as shown in Figure 3 and Figure 4 , an optical fiber array adjustment differential head one 8 can be detachably fixed on the optical fiber array fixing assembly one 6 and the optical fiber array fixing assembly two 7, and the fine adjustment of screwing in and out is realized through the differential head one 8. Further, a fine adjustment assembly one 9 can be detachably connected on the Scotch yoke structure adjustment assembly two 4 and the Scotch yoke structure adjustment assembly one 2 to realize fine adjustment. The fine adjustment assembly one 9 includes a protective shell 901, a differential head two 902, a rack 903 and a gear 904, the rack 903 and the gear 904 are located in the protective shell 901, and the rack 903 and the gear 904 are engaged; one end of the differential head two 902 is fixed with the rack 903, and the other end extends out of the fine adjustment assembly one 9. The gear 904 is detachably connected on the adjustment handle 203. By rotating the differential head two 902, the rack 903 is driven to move, and since the rack 903 and the gear 904 are engaged, the gear 904 is driven to rotate, further driving the adjustment handle 203 fixed with the gear 904 to rotate.

[0054] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the application being indicated by the following claims.

Claims

1. An apparatus for fiber array and optoelectronic chip coupling package, characterized in that, The application relates to a fiber array adjusting device. The shell (1) is internally provided with annular sliding grooves (101) and (102) arranged in parallel, the sliding frame (3) is arranged in the annular sliding groove (101) and can slide in the annular sliding groove (101) in a small range, and the sliding frame (5) is arranged in the annular sliding groove (102) and can slide in the annular sliding groove (102) in a small range. The adjusting handle (203) is fixed on the adjusting wheel (201), one end of the adjusting handle (203) extends out of the shell (1) through the annular sliding groove (101) and is used for facilitating rotation of the adjusting handle (203) by a user, the other end of the adjusting handle (203) passes through the adjusting ring (202), and the adjusting ring (202) is further fixedly connected with the sliding frame (3). The adjusting handle (203) is fixed on the adjusting wheel (201), one end of the adjusting handle (203) extends out of the shell (1) through the annular sliding groove (101) and is used for facilitating rotation of the adjusting handle (203) by a user, the other end of the adjusting handle (203) passes through the adjusting ring (202), and the adjusting ring (202) is further fixedly connected with the sliding frame (3). The fiber array fixing assembly (6) and the fiber array fixing assembly (7) are arranged on two opposite sides of the shell (1) respectively and are used for fixing the fiber array. The shell (1) is made of transparent organic glass material, so that the fiber array can be observed during adjustment.

2. The apparatus for fiber array and optoelectronic chip coupling package of claim 1, wherein, The top end of the shell (1) is provided with a chamfer, so that the entrance of the shell (1) is enlarged, and the fiber array can be inserted and pulled out conveniently.

3. The apparatus for fiber array and optoelectronic chip coupling package of claim 1, wherein, The surfaces of the fiber array fixing assembly (6) and the fiber array fixing assembly (7) are provided with external threads, two opposite sides of the shell (1) are provided with threaded holes, the fiber array fixing assembly (6) and the fiber array fixing assembly (7) are advanced or retreated along the threaded fixing holes through cooperation of the external threads and the threaded holes, and the fiber array is fixed.

4. The apparatus for fiber array and optoelectronic chip coupling package of claim 1, wherein, The fiber array fixing assembly (6), the fiber array fixing assembly (7), the Scotland yoke structure adjusting assembly (4) and the Scotland yoke structure adjusting assembly (2) are all made of aluminum material.

5. The apparatus for fiber array and optoelectronic chip coupling package of claim 1, wherein, The device further comprises two detachable micro-differentiation heads (8) which are connected to the fiber array fixing assembly (6) and the fiber array fixing assembly (7) respectively.

6. The apparatus for fiber array and optoelectronic chip coupling package of claim 1, wherein, The device further comprises two detachable micro-differentiation heads (8) which are connected to the fiber array fixing assembly (6) and the fiber array fixing assembly (7) respectively.

7. The apparatus for fiber array and optoelectronic chip coupling package of claim 6, wherein, ​ 8. The apparatus for fiber array and optoelectronic chip coupling package of claim 7, wherein, The fine adjustment assembly one (9) is detachably connected to the Scotch yoke structure adjustment assembly one (2), and comprises a protective shell (901), a differential head two (902), a rack (903) and a gear (904). The rack (903) and the gear (904) are located in the protective shell (901) and are in engagement. One end of the differential head two (902) is fixedly connected to the rack (903), and the other end extends out of the fine adjustment assembly one (9). The gear (904) is detachably connected to the adjustment handle (203).

9. The apparatus for fiber array and optoelectronic chip coupling package of claim 8, wherein, The fine adjustment assembly one (9) is two, and the other is detachably connected to the Scotch yoke structure adjustment assembly two (4).

10. A packaging method for a fiber array and optoelectronic chip coupling package, characterized in that, The method is based on the device of claim 1, and comprises the following steps: Step one: placing the fiber array to be coupled and tested in the shell (1), moving the fiber array to a proper position by using the Scotch yoke structure adjustment assembly two (4) and the Scotch yoke structure adjustment assembly one (2), and fixing the fiber array and the shell (1) by using the fiber array fixing assembly one (6) and the fiber array fixing assembly two (7); Step two: installing the fixed fiber array and the shell (1) on the electric displacement slide table for coupling test, so that they can be adjusted and moved; Step three: coupling the fixed fiber array and the shell (1) and the grating coupler on the optoelectronic chip by using the electric displacement slide table, and fixing the shell (1) and the optoelectronic chip by using UV glue when the coupling loss is the lowest; Step four: loosening the fiber array fixing assembly one (6) and the fiber array fixing assembly two (7), so that the fiber array can be disassembled repeatedly; in the next test, the fiber array is directly inserted into the shell (1), the accurate position of the fiber array is adjusted to the lowest coupling loss, and the fiber array and the shell (1) are fixed by using the fiber array fixing assembly one (6) and the fiber array fixing assembly two (7); Step five: after the multiple test work is completed, when the fiber array and the optoelectronic chip are optically packaged, a proper amount of UV glue is poured into the shell (1), and after curing, the entire fiber array packaging is completed.

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