Light-emitting keyboard, backlight module and light-emitting lamp panel

Abstract

The application provides a light-emitting keyboard, a backlight module and a light-emitting lamp panel. The backlight module comprises a light-emitting unit, a light guide plate and a lamp panel. The light guide plate has a light guide plate hole for accommodating the light-emitting unit. The lamp panel has a pair of pads respectively connected to the light-emitting unit. The lamp panel comprises a first reflection layer surrounding the light-emitting unit and at least partially covering the pair of pads. Each of the pair of pads has a plurality of branch lines and at least one hollow area. The at least one hollow area overlaps at least a part of the light-emitting unit. The application can realize high uniformity of light-emitting brightness in a single key and an entire keyboard.

Description

Technical Field

[0001] This invention relates to an illuminated keyboard, a backlight module, and an illuminated light panel, and more particularly to an illuminated keyboard, a backlight module, and an illuminated light panel that can improve the overall consistency of illumination. Background Technology

[0002] With the development of technology, keyboard designs have become increasingly diverse. When choosing a keyboard, users consider not only its basic input functions but also its visual appeal. Currently, backlit keyboards are available on the market, which not only attract users visually but also allow for use at night or in poorly lit environments. However, existing backlit keyboards use low-brightness LEDs to illuminate each square key, which leads to the following problems: 1) The main symbols above the LEDs are too bright, while the corner symbols on the keycaps are too dark; 2) Inconsistent brightness around the keycaps; 3) Inconsistent illumination between single keys and multiple keys. Summary of the Invention

[0003] The present invention provides an illuminated keyboard, backlight module and light panel that can improve the overall consistency of light emission, so as to solve the above-mentioned technical problems.

[0004] To achieve the above objectives, the present invention proposes a backlight module for illuminating at least one keycap. The backlight module includes a light-emitting unit, a light guide plate, and a lamp plate. The light guide plate has a light guide plate hole to accommodate the light-emitting unit. The lamp plate has a pair of pads, which are respectively connected to the light-emitting unit. The lamp plate includes a first reflective layer that surrounds the light-emitting unit and at least partially covers the pair of pads. Each pad of the pair of pads has multiple branch lines and at least one cutout area, which overlaps with at least a portion of the light-emitting unit.

[0005] As an optional technical solution, the first reflective layer has an inner ring portion, which at least partially covers the plurality of branch lines and the at least one hollow area, and the inner ring portion reflects and diffuses the light emitted by the light-emitting unit.

[0006] As an optional technical solution, the light panel also includes a pair of microstructure regions spaced apart from each other, the pair of microstructure regions being located on the first reflective layer, the pair of microstructure regions together surrounding the pair of pads, the pair of microstructure regions reflecting and diffusing the light transmitted by the light-emitting unit through the light guide plate.

[0007] As an optional technical solution, the light panel also includes a pair of microstructure regions spaced apart from each other and two wires. The pair of microstructure regions are located on the first reflective layer, and the two wires are electrically connected to the pair of pads respectively. The pair of microstructure regions do not overlap with the two wires.

[0008] As an optional technical solution, at least one of the multiple branch lines of each pad is not completely covered by the first reflective layer, forming an exposed portion, which reflects and diffuses the light emitted by the light-emitting unit.

[0009] As an optional technical solution, at least a portion of the first reflective layer is located within the light guide plate hole.

[0010] As an optional technical solution, the backlight module also includes a light shield, which includes an internal reflective portion that overlaps with the first reflective layer.

[0011] As an optional technical solution, the multiple branch lines of each pad in the pair of pads form a pair of parallel flat edges, and the width of the short side of the light-emitting unit is smaller than the width of the pair of flat edges.

[0012] As an optional technical solution, at least one of the plurality of branch lines of each pad surrounds at least a portion of the light guide plate hole.

[0013] As an optional technical solution, the first reflective layer has a reflective layer hole, and the at least one cutout area of ​​each of the pair of pads surrounds the reflective layer hole and / or the at least one cutout area of ​​each of the pair of pads overlaps with the reflective layer hole.

[0014] As an optional technical solution, the first reflective layer has a reflective layer hole, which is located between the light-emitting unit and the light guide plate hole.

[0015] As an optional technical solution, the first reflective layer has a reflective layer hole, and a portion of the first reflective layer overlapping with the pair of pads is located between the reflective layer hole and the light guide plate hole.

[0016] As an optional technical solution, the light-emitting unit includes three crystals to provide three colors of light, and the three crystals are arranged side by side with their short sides connected.

[0017] As an optional technical solution, the lamp board has two wires that are electrically connected to the pair of pads, and the first reflective layer covers the two wires.

[0018] As an optional technical solution, the light panel also includes a pair of microstructure regions spaced apart from each other, the pair of microstructure regions being located on the first reflective layer, and the two wires being located between the pair of microstructure regions.

[0019] As an optional technical solution, the lamp board has two sub-wires that are electrically connected to the pair of pads respectively, and the lamp board also has two main wires that are electrically connected to the two sub-wires respectively.

[0020] As an optional technical solution, the light panel also includes a pair of external microstructure regions spaced apart from each other, the pair of external microstructure regions being located on the first reflective layer, and the pair of external microstructure regions being located outside the two main lines respectively.

[0021] Furthermore, the present invention also proposes a backlight module for illuminating at least one keycap. The backlight module includes a light guide plate, a light-emitting unit, and a lamp board. The backlight module defines multiple light-averaging zones to equalize the light emitted by the light-emitting unit. The multiple light-averaging zones include a first zone and a second zone. The first zone surrounds the light-emitting unit and includes an inner ring portion of a first reflective layer and a pair of pads. The pair of pads are located on the lamp board to connect to the light-emitting unit. The inner ring portion of the first reflective layer at least partially covers the pair of pads and reflects and diffuses the light emitted by the light-emitting unit. The second zone surrounds the first zone and includes a pair of spaced-apart microstructure regions located on the first reflective layer. The pair of microstructure regions together surround the pair of pads and reflect and diffuse the light transmitted by the light-emitting unit through the light guide plate.

[0022] Furthermore, the present invention also proposes an illuminated keyboard comprising a plurality of keys and a backlight module as described above. The plurality of keys have keycaps; the backlight module is located below the plurality of keys.

[0023] Furthermore, the present invention also proposes a light-emitting board comprising two non-intersecting wires, a plurality of microstructure regions, a light-emitting unit, and a pair of pads. Two of the plurality of microstructure regions are spaced apart from each other, and two of the plurality of microstructure regions do not overlap with the two non-intersecting wires. The light-emitting unit is located between two of the plurality of microstructure regions. The pair of pads electrically connects the two non-intersecting wires and the light-emitting unit, respectively. Each of the pair of pads has at least one branch line to form a pair of parallel flat edges. Each of the pair of pads also has at least one cutout area. The light-emitting unit overlaps with at least a portion of the at least one cutout area of ​​the pair of pads.

[0024] This invention provides an illuminated keyboard, a backlight module, and an illuminated light board. A protruding structure is formed between two non-intersecting conductors or multiple microstructure regions, with the position of the protruding structure corresponding to the position of the light-emitting unit. This increases the amount of light entering the light guide plate from the light-emitting unit, and utilizes specially configured microstructure regions on the illuminated light board to recover light or assist in light emission, thereby improving the overall consistency of light emission. Furthermore, this invention also solves the problems of connection stability of the light-emitting unit and excessive light concentration in the adjacent areas of the light-emitting unit. In addition to ensuring smooth connection of the light-emitting unit even when the component is misaligned by setting pads with hollow areas, this invention further utilizes the pads and their hollow areas in conjunction with a first reflective layer to form a light homogenization design in the first area. Moreover, by combining the internal microstructure region of the light board in the second area, the adhesive layer and the non-adhesive area in the third area, this invention provides different light homogenization schemes for different blocks along the light path outward from the light-emitting unit, which can be combined to achieve high homogenization across individual keys and the entire keyboard.

[0025] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of an illuminated keyboard according to an embodiment of the present invention;

[0027] Figure 2 for Figure 1 A partial top view of the backlit keyboard;

[0028] Figure 3 for Figure 1 A partially exploded view of the backlit keyboard in the image;

[0029] Figure 4 for Figure 1 A partial cross-sectional view of the backlit keyboard;

[0030] Figure 5 This is a partial top view of an illuminated keyboard according to another embodiment of the present invention;

[0031] Figure 6 for Figure 5 A partial cross-sectional view of the backlit keyboard;

[0032] Figure 7 This is a partial cross-sectional view of a backlit keyboard according to another embodiment of the present invention;

[0033] Figure 8 This is a partial cross-sectional view of a backlit keyboard according to another embodiment of the present invention;

[0034] Figure 9 This is a partial cross-sectional view of a backlit keyboard according to another embodiment of the present invention;

[0035] Figure 10 for Figure 1 Another partial top view of the illuminated keyboard;

[0036] Figure 11 for Figure 1 Another partial top view of the illuminated keyboard;

[0037] Figure 12A This is a top view schematic diagram of the end-to-end connection between the (sub) conductors of the light-emitting board and the pads and light-emitting units in another embodiment of the present invention;

[0038] Figure 12B for Figure 12A A partially enlarged schematic diagram of the embodiment;

[0039] Figure 12C for Figure 12A Top view of the side connection in the embodiment;

[0040] Figures 13A to 13F These are top views of the connection architecture between the (sub)wires of the light-emitting lamp board and the two pads and the light-emitting unit in different embodiments of the present invention.

[0041] Figure 14A This is a partial top view schematic diagram of the optical architecture of the backlight module in the area surrounding the light-emitting unit, according to another embodiment of the present invention.

[0042] Figure 14B for Figure 14A Partial cross-sectional view of the backlight module in the embodiment;

[0043] Figure 14C This is a partial top view of the optical architecture of the backlight module in the area surrounding the light-emitting unit, according to another embodiment of the present invention.

[0044] Figure 14D For the present invention Figure 14A A partial top view of the optical architecture of the backlight module in a derivative embodiment. Detailed Implementation

[0045] To more clearly illustrate the present invention, the following description, in conjunction with preferred embodiments and accompanying drawings, further explains the invention. Similar components in the drawings are indicated by the same reference numerals. Those skilled in the art should understand that the specific description below is illustrative rather than restrictive and should not be construed as limiting the scope of protection of the present invention.

[0046] Using low-power light-emitting units, such as Mini LEDs or Micro LEDs, in the backlight module can reduce power consumption, the total heat generated by the backlight module, and the overall thickness of the backlight module, contributing to further thinning of the overall illuminated keyboard. However, the limited light-emitting range of Mini LEDs or Micro LEDs poses a significant challenge to the uniformity of light emission on individual keys and the entire keyboard. This invention focuses on how to achieve a large proportion of light from the light-emitting units entering the light guide plate for lateral transmission, and how to effectively recover the light that exits the light guide plate during lateral transmission and reuse it.

[0047] Please see Figure 1 , Figure 1 This is a schematic diagram of an illuminated keyboard (LKB) according to an embodiment of the present invention. Figure 1 As shown, the backlit keyboard LKB includes a backlight module BLM and multiple keys KS. A base plate SUP is mounted on the backlight module BLM, and the multiple keys KS are mounted on the base plate SUP. Generally, the multiple keys KS may include square keys and multiplication keys (e.g., a space key). It should be noted that the number, size, and arrangement of the keys KS can be determined according to the actual application and are not limited to the embodiment shown in the figure.

[0048] The backlight module (BLM) includes a light-emitting plate (LCB), a light guide plate (LGP), and a light-shielding plate (SS). The light guide plate (LGP) is disposed on the light-emitting plate (LCB), and the light-shielding plate (SS) is disposed on the light guide plate (LGP). Each key (KS) on the backlit keyboard (LKB) corresponds to at least one light-emitting unit (e.g., a light-emitting diode) on the light-emitting plate (LCB) of the backlight module (BLM).

[0049] Please see Figures 2 to 4 , Figure 2 for Figure 1 A partial top view of the backlit keyboard LKB in the image. Figure 3 for Figure 1 A partial exploded view of the backlit keyboard LKB in the image. Figure 4 for Figure 1 A partial cross-sectional view of the backlit keyboard (LKB) in the image. (See image for details.) Figures 2 to 4As shown, the light-emitting board (LCB) includes two non-intersecting wires LT and HT, two more non-intersecting wires STa and STb, light-emitting units (LEDs), a first reflective layer RL1, and multiple microstructure regions MS. The LCB can be a lighting circuit board. The LEDs are connected between the two non-intersecting wires STa and STb, and are also connected to the two non-intersecting wires LT and HT via STa and STb. In this embodiment, the two non-intersecting wires LT and HT are the main driving lines for the LEDs, and the two non-intersecting wires STa and STb are the sub-driving lines for the LEDs. Wire LT can be a low-potential wire, and wire HT can be a high-potential wire. The LEDs can be white LEDs or a combination of red, green, and blue LEDs, depending on the application. Generally, the two non-intersecting wires LT and HT are the main conductors with larger cross-sectional areas, which can span multiple buttons KS. The two non-intersecting wires LT and HT do not intersect at least within the range of a single button KS, and they can also not intersect within multiple adjacent buttons KS and a large continuous area covering the gaps between the buttons. The pair of non-intersecting wires STa and STb set within the range of each single button KS are the sub-wires with smaller cross-sectional areas. Although they may be located on the same straight line, the ends of the two non-intersecting wires STa and STb are respectively connected to the two electrodes of the light-emitting unit LED, so the two non-intersecting wires STa and STb do not overlap.

[0050] A first reflective layer RL1 is disposed on two non-intersecting conductors LT and HT and two other non-intersecting conductors STa and STb. Multiple microstructure regions MS are formed on the first reflective layer RL1. In this embodiment, the microstructure regions MS can be concave-convex structures formed on the first reflective layer RL1. For example, the light-emitting board LCB can be made of a flexible circuit board, often using a copper mesh to enhance the board's support strength. Spraying reflective paint or coating a reflective film onto the surface of the flexible circuit board (including the copper mesh surface) can form the first reflective layer RL1. The mesh structure of the copper mesh causes the first reflective layer RL1 to form regular concave points (grid points) and convex areas (grid lines). These concave points and convex areas have reflective functions, reflecting light back to the light guide plate LGP. In practical applications, the copper wire regions (the two non-intersecting conductors LT and HT and the two other non-intersecting conductors STa and STb) can also become protruding linear reflective regions. In principle, the copper mesh should not overlap vertically with two non-intersecting conductors LT and HT on the flexible circuit board, nor should it be electrically connected to two non-intersecting conductors STa and STb. However, in practical applications, the copper mesh has a radio frequency interference shielding effect, so it may be connected to the ground wire of the drive circuit. However, in practical applications, not every reflective layer covering the copper mesh and circuitry can produce a concave-convex reflective structure. If the first reflective layer RL1 is an independent thin-film element, its thickness must be sufficiently thin, for example, less than the thickness of the copper foil substrate (including the adjacent flat copper mesh and copper wire areas), and the first reflective layer RL1 needs to be highly malleable to form a concave-convex microstructure in the copper mesh and copper wire areas when covering the copper foil substrate. If the first reflective layer RL1 is formed by ink coating, for example, the coating thickness, ink viscosity, and coating area must be strictly controlled; otherwise, the original perforations in the copper foil substrate are easily filled by ink flow, reducing the depth of the reflective microstructure and the reflective diffusion effect.

[0051] Furthermore, even if the circuitry of the light-emitting lamp board (LCB) is not based on copper foil, lacking both thick copper circuitry and copper mesh reinforcement to strengthen the LCB structure, microstructures with diffusion effects can still be formed on the first reflective layer RL1. For example, micro-dot ink can be printed on the first reflective layer RL1 to form concave / convex areas as microstructure regions MS; alternatively, ink with larger reflective particles can be used to simultaneously form concave / convex areas as microstructure regions MS during the spraying or printing of the first reflective layer RL1; or, if the first reflective layer RL1 is a reflective film, any reflective film surface with medium to low flatness and an uneven reflective surface can serve as a microstructure region MS.

[0052] In this embodiment, within the range of a single button KS, multiple microstructure regions MS include two internal microstructure regions IMS and two external microstructure regions OMS. The two internal microstructure regions IMS are located between two non-intersecting wires LT and HT, and the two external microstructure regions OMS are located outside the two non-intersecting wires LT and HT. The patterns of the two internal microstructure regions IMS may differ from the patterns of the two external microstructure regions OMS, but are not limited thereto. The light-emitting unit LED is located between the multiple microstructure regions MS; that is, the light-emitting unit LED is located between the two internal microstructure regions IMS and also between the two external microstructure regions OMS.

[0053] In this embodiment, two non-intersecting conductors STa and STb divide two internal microstructure regions IMS, and therefore the two non-intersecting conductors STa and STb are also located between the two internal microstructure regions IMS. Similarly, two non-intersecting conductors LT and HT divide one external microstructure region OMS and two internal microstructure regions IMS respectively, so it can also be said that the two non-intersecting conductors LT and HT are located between one external microstructure region OMS and two internal microstructure regions IMS respectively. In some embodiments, the aforementioned multiple microstructure regions MS, whether external microstructure regions OMS or internal microstructure regions IMS, do not overlap with the two non-intersecting conductors LT and HT, nor with the two non-intersecting conductors STa and STb; for example, this is the case when the circuit of the light-emitting board LCB is made of copper wires and copper mesh. If the microstructure regions MS on the first reflective layer RL1 are only surface treated and not formed from the copper mesh or other substrate below, the multiple microstructure regions MS / OMS / IMS may overlap with the two non-intersecting conductors LT and HT, or with the two non-intersecting conductors STa and STb. The light guide plate (LGP) has a light guide hole (L0), and the light-emitting unit (LED) is located within the light guide hole (L0). The top surface of the light guide plate (LGP) near the light guide hole (L0) may have adhesive surrounding the light guide hole (L0) to adhere the light shield (SS), and / or the bottom surface of the light guide plate (LGP) near the light guide hole (L0) may have adhesive surrounding the light guide hole (L0) to adhere the light-emitting lamp board (LCB). Furthermore, the light guide plate (LGP) also has multiple microstructure regions (LMS), the multiple microstructure regions (LMS) of the light guide plate (LGP) corresponding to the positions of the inner hole (Sc) and peripheral hole (SUPH) of the base plate (SUP), in order to guide the light transmitted within the light guide plate (LGP) upwards. Below the orthographic projection of the peripheral holes SUPH of the base plate SUP, the microstructure region LMS of the light guide plate LGP can at least partially overlap with multiple microstructure regions MS of the first reflective layer RL1 of the backlight plate LCB. In particular, this can increase the light emission effect through the inner hole Sc and the peripheral hole SUPH, and enhance the brightness of the corner symbol (outer light-transmitting area KC1) of the keycap KCC. The internal microstructure region IMS on the first reflective layer RL1 of the backlight plate LCB, near the light-emitting unit LED, can be used as an optical adjustment method. When the light emission near the light-emitting unit LED is excessively weakened, for example, when the area of ​​the inner shielding part ML0 of the shielding layer ML of the light shield SS is too large, or when the light transmittance of the inner reflective part RL0 of the second reflective layer RL2 is too low, the internal microstructure region IMS on the first reflective layer RL1 of the backlight plate LCB, near the light-emitting unit LED, can enhance the light emission effect through the inner hole Sc or the inner light-transmitting area KC0 of the keycap KCC.

[0054] A preferred approach to optimizing the configuration of the aforementioned multiple microstructure regions MS / OMS / IMS is to arrange the two non-intersecting wires STa and STb, along with the other two non-intersecting wires LT and HT, to overlap with any rib or frame area of ​​the base plate SUP (such as the annular rib Sr0, bridging rib Sr1, or support frame Sf). In this way, the aforementioned multiple microstructure regions MS / OMS / IMS can correspond to the microstructure region LMS of the light guide plate LGP, the peripheral hole SUPH or inner hole Sc of the base plate SUP, and even the internal light-transmitting area KC0 and the external light-transmitting area KC1 of the keycap KCC. Furthermore, the multiple microstructure regions MS / OMS / IMS may overlap with the annular rib Sr0, bridging rib Sr1, or support frame Sf of the base plate SUP. Although light cannot escape from these locations, the microstructure regions MS / OMS / IMS can assist in guiding the light escaping from the light guide plate LGP back into the light guide plate LGP for recycling, which helps the subsequent light emission effect of the outermost or even adjacent key KS. Of course, the aforementioned microstructure regions MS / OMS / IMS can also overlap with the second reflective layer RL2 of the light-shielding plate SS plate, including overlapping with the internal reflective part RL0 and the outer frame of the second reflective layer RL2, which helps to recover light into the light guide plate LGP.

[0055] A light-shielding plate SS is disposed above multiple microstructure regions MS. The light-shielding plate SS comprises a masking layer ML, a second reflective layer RL2, and a protective layer PL, wherein the masking layer ML, the second reflective layer RL2, and the protective layer PL can be stacked on top of each other in various ways. For example, any one of the masking layer ML, the second reflective layer RL2, and the protective layer PL can be stacked on top, in the middle, or at the bottom of the light-shielding plate SS to form the light-shielding plate SS. The masking layer ML is opaque. The second reflective layer RL2 can simultaneously possess reflective and translucent properties; that is, the second reflective layer RL2 can reflect some light while allowing some light to pass through. The masking layer ML can be black paint, and the second reflective layer RL2 can be white paint, but is not limited thereto. In this embodiment, the masking layer ML has a masking layer aperture MLH and an inner masking portion ML0 located within the masking layer aperture MLH, and the second reflective layer RL2 has a reflective layer aperture RLH and an inner reflective portion RL0 located within the reflective layer aperture RLH. The aperture MLH in the masking layer can be greater than, equal to, or smaller than the aperture RLH in the reflective layer, and the inner masking portion ML0 can be greater than, equal to, or smaller than the inner reflective portion RL0, depending on the desired light-emitting effect. Both the inner masking portion ML0 and the inner reflective portion RL0 are located above the light-emitting unit LED. In this embodiment, the inner masking portion ML0 and / or the inner reflective portion RL0 above the light-emitting unit LED are at least partially projected between two non-intersecting wires LT, HT or two non-intersecting wires STa, STb.

[0056] Each button KS comprises a portion of the base plate SUP. In this embodiment, the base plate SUP has an inner hole Sc, an annular rib Sr0, multiple bridging ribs Sr1, and a support frame Sf, wherein the annular rib Sr0 surrounds the inner hole Sc, and the multiple bridging ribs Sr1 connect the annular rib Sr0 and the support frame Sf. Furthermore, there are multiple peripheral holes SUPH between the bridging ribs Sr1, the annular rib Sr0, and the support frame Sf. In this embodiment, the two internal microstructure regions IMS at least partially overlap with the projections of the inner hole Sc, the annular rib Sr0, the multiple bridging ribs Sr1, and / or the support frame Sf. Furthermore, the two external microstructure regions OMS at least partially overlap with the projections of the annular rib Sr0, the multiple bridging ribs Sr1, and / or the support frame Sf.

[0057] The keycap KS comprises a keycap KCC, a support device SSR, a circuit board MEM, and a base plate SUP. The keycap KCC is positioned relative to the base plate SUP. The keycap KCC has an internal light-transmitting area KC0 and multiple external light-transmitting areas KC1, with the opaque area KC2 surrounding the internal light-transmitting area KC0 and the multiple external light-transmitting areas KC1. The positions of the internal light-transmitting area KC0 and the multiple external light-transmitting areas KC1 correspond to the positions of the inner hole Sc and the multiple peripheral holes SUPH of the base plate SUP, respectively, allowing the light emitted by the LED light-emitting unit to be projected from the internal light-transmitting area KC0 and the multiple external light-transmitting areas KC1 of the keycap KCC through the light guide plate LGP, the light shield SS, the inner hole Sc of the base plate SUP, and the multiple peripheral holes SUPH. The support device SSR is positioned between the keycap KCC and the base plate SUP. When the keycap KCC is pressed, the keycap KCC moves vertically towards the base plate SUP along with the support device SSR. In addition, a reset element (not shown in the figure) is provided between the keycap KCC and the base plate SUP, but this is not a limitation. The circuit board MEM has a switch corresponding to the key KS, such as a membrane switch or other trigger switch.

[0058] From a top view, the light-emitting unit (LED), the light guide plate hole L0, the internal reflective portion RL0, the internal shielding portion ML0, the inner hole Sc, the internal light-transmitting area KC0, and the adhesive around the light guide hole L0 can be located between two non-intersecting wires LT, HT and / or two non-intersecting wires STa, STb. In other words, the light-emitting unit (LED), the light guide plate hole L0, the internal reflective portion RL0, the internal shielding portion ML0, the inner hole Sc, the internal light-transmitting area KC0, and the adhesive around the light guide plate hole L0 can be located between two internal microstructure regions (IMS).

[0059] like Figure 4As shown, the backlight module BLM also includes a protruding structure BP, the position of which corresponds to the position of the light-emitting unit LED, and the protruding structure BP is located between two non-intersecting wires LT and HT. Furthermore, the protruding structure BP is also located between multiple microstructure regions MS, that is, between two internal microstructure regions IMS and between two external microstructure regions OMS. In this embodiment, the protruding structure BP is formed on the light-emitting plate LCB, and the protruding structure BP forms a groove IP to accommodate the light-emitting unit LED, such that the upper surface of the light-emitting unit LED is flush with the upper surface of the light guide plate LGP, or the upper surface of the light-emitting unit LED is lower than the upper surface of the light guide plate LGP but higher than the lower surface of the light guide plate LGP. Since the light-shielding plate SS is disposed on the light guide plate LGP, the upper surface of the light-emitting unit LED is also flush with or lower than the lower surface of the light-shielding plate SS, so that the light-shielding plate SS can remain flat and will not be pushed by the light-emitting unit LED and partially enter the inner hole Sc of the base plate SUP. This increases the amount of light entering the light guide plate LGP from the LEDs, thereby improving the overall consistency of light emission. Furthermore, the circuit board MEM can have a switch corresponding to the inner hole Sc of the base plate SUP, allowing the switch to partially enter the inner hole Sc of the base plate SUP without interfering with the SS light shield and the LEDs below it.

[0060] Please see Figure 5 as well as Figure 6 , Figure 5 This is a partial top view of an illuminated keyboard LKB according to another embodiment of the present invention. Figure 6 for Figure 5 A partial cross-sectional view of the backlit keyboard (LKB) in the image. (See image for details.) Figure 5 and Figure 6As shown, the base plate SUP may not have the aforementioned inner hole Sc. In this case, the light-shielding plate SS remains flat and will not be pushed by the light-emitting unit LED. When the base plate SUP does not have the inner hole Sc, the keycap KCC may not have an internal light-transmitting area KC0. However, if the keycap KCC has an internal light-transmitting area KC0, light can be emitted from the peripheral holes SUPH around the central area of ​​the keycap KCC, so that light is projected from the internal light-transmitting area KC0 without the inner hole Sc. In this embodiment, the two non-intersecting wires HT and LT may overlap with the projection of at least one of the projections of at least one of the external light-transmitting areas KC1. As long as the two non-intersecting wires HT and LT satisfy at least one of the following three conditions, the two non-intersecting wires HT and LT will not affect the light emission of the external light-transmitting area KC1 of the keycap KCC. Condition 1: The two non-intersecting wires HT and LT overlap with the projections of the annular rib Sr0, bridging rib Sr1 and / or support frame Sf of the base plate SUP. Condition 2: The projections of the two non-intersecting conductors HT and LT overlap with the projections of the shielding layer ML and / or the second reflective layer RL2 of the light-shielding plate SS. Condition 3: The projections of the two non-intersecting conductors HT and LT overlap with the projections of the opaque area KC2 of the keycap KCC.

[0061] Please see Figure 7 , Figure 7 This is a partial cross-sectional view of an illuminated keyboard LKB according to another embodiment of the present invention. Figure 7 As shown, the protruding structure SP of the backlight module BLM can be formed on the light shield SS, with the light-emitting unit LED located below the protruding structure SP. The position of the protruding structure SP corresponds to the position of the light-emitting unit LED, and the protruding structure SP is located between two non-intersecting wires LT and HT. Furthermore, the protruding structure SP is also located between multiple microstructure regions MS, that is, between two internal microstructure regions IMS and between two external microstructure regions OMS. In this embodiment, the protruding structure SP can be lower than or slightly inserted into the inner hole Sc of the base plate SUP, and the upper surface of the light-emitting unit LED is flush with the upper surface of the light guide plate LGP, or the upper surface of the light-emitting unit LED is lower than the upper surface of the light guide plate LGP, or the upper surface of the light-emitting unit LED is lower than the lower surface of the light shield SS. It should be noted that the protruding structure SP can be pressed back, so that the top of the light shield SS below the base plate SUP has a flat surface. Figure 7 In the process, the effect of the protruding structure SP formed on the light shield SS can be attributed to the fact that the internal reflective portion RL0 above the light-emitting unit LED on the light shield SS has an arc or slope due to the protruding structure SP. Because the reflection angle provided by the flat internal reflective portion RL0 is small, it is difficult to guide the upward-shielding light directly into the light guide plate LGP through the hole wall of the light guide plate L0.

[0062] Please see Figure 8 , Figure 8This is a partial cross-sectional view of an illuminated keyboard LKB according to another embodiment of the present invention. Figure 8 As shown, the upper surface of the light-emitting unit (LED) can be higher than the upper surface of the light guide plate (LGP) and lower than the lower surface of the light shield (SS). In other words, the upper surface of the LED can be located between the upper surface of the light guide plate (LGP) and the lower surface of the light shield (SS). Alternatively, if necessary, the upper surface of the LED can extend beyond the upper surface of the light guide plate (LGP). For example, the protruding structure (SP) can accommodate the thickness of the light shield (SS) itself and the thickness of its upper and lower adhesive layers to provide space for the LED. In this case, the upper surface of the LED will be located between the lower surface of the base plate (SUP) and the upper surface of the light guide plate (LGP). Therefore, when the upper surface of the LED is higher than the upper surface of the light guide plate (LGP), the protruding structure (SP) can provide space for the LED, preventing interference between the LED and the light shield (SS).

[0063] Please see Figure 9 , Figure 9 This is a partial cross-sectional view of an illuminated keyboard LKB according to another embodiment of the present invention. Figure 9 As shown, the backlit keyboard LKB may not include... Figure 4 The prominent structure BP shown is or Figure 7 The protruding structure SP is shown. In this embodiment, the upper surface of the light-emitting unit LED is flush with the upper surface of the light guide plate LGP, or the upper surface of the light-emitting unit LED is lower than the upper surface of the light guide plate LGP but higher than the lower surface of the light guide plate LGP. This increases the amount of light emitted by the light-emitting unit LED entering the light guide plate LGP, thereby improving the overall uniformity of light emission.

[0064] Please see Figure 10 , Figure 10 for Figure 1 Another partial top view of the backlit keyboard LKB. (See image below.) Figure 10As shown, multiple external microstructure regions (OMS) and multiple internal microstructure regions (IMS) at least partially overlap with the projections of the gaps Gx and Gy between any two adjacent buttons KS1, KS2, and KS3. Three adjacent buttons KS1, KS2, and KS3 may have three adjacent external microstructure regions (OMS), wherein the three adjacent external microstructure regions (OMS) are combined in the X and Y directions. Two external microstructure regions (OMS) located outside the two non-intersecting conductors of the light-emitting plate LCB below a button KS may have the same pattern, and may have the same size, shape, and distance (outside the conductors) in the two identical regions. Within the projection range of a single button KS (e.g., a square button), two external microstructure regions (OMS) may have different patterns defined by the button KS. For two adjacent buttons KS in the Y direction, two adjacent external microstructure regions (OMS) may have different patterns defined by the two adjacent buttons KS.

[0065] Please see Figure 11 , Figure 11 for Figure 1 Another partial top view of the backlit keyboard LKB. (See image below.) Figure 11As shown, a hole BH can be made on the light-emitting panel LCB, where the hole BH is used for fixing or heat dissipation. A shielding part MP can be provided on the light-emitting panel LCB, where the shielding part MP surrounds the hole BH to block and absorb light, preventing light leakage from the hole BH. In practical applications, the shielding part MP can be a light-absorbing or opaque substrate from the light-emitting panel LCB, that is, the first reflective layer RL1, the circuit layer, and the insulating layer (if necessary) above the substrate of the light-emitting panel LCB are all made with holes larger than the hole BH, so as to expose the shielding part MP surrounding the hole BH. Another approach in practical applications is to coat the upper surface of the first reflective layer RL1 of the light-emitting panel LCB with another layer of shielding part MP surrounding the hole BH, in which case the hole size of the first reflective layer RL1 is similar to that of the hole BH. The hole BH and the shielding part MP on the light-emitting panel LCB can correspond to the hole and the shielding part on the light-shielding plate SS (not shown in the figure). The adhesive HA on the light-emitting plate LCB can be disposed on the shielding portion MP and surround the plate hole BH. The pore HC does not overlap with the external microstructure region OMS or any microstructure. The pore HC without the first reflective layer RL1 can be defined between the first reflective layer RL1 and the plate hole BH. The pore HC without adhesive can be defined between the adhesive HA and the plate hole BH. The internal microstructure region IMS (between two non-intersecting wires HT, LT and / or two non-intersecting wires STa, STb) does not overlap with the plate hole BH, the adhesive HA, and / or the pore HC. Multiple buttons KS1, KS2, KS3 adjacent in the X and / or Y directions can have adjacent external microstructure regions OMS that collectively surround the shielding portion MP, the plate hole BH, the adhesive HA, and / or the pore HC. The masking portion MP, plate hole BH, adhesive HA, and / or aperture HC are located between the two non-intersecting wires HT and LT of the corresponding button KS1 and the two non-intersecting wires HT and LT of the corresponding buttons KS2 and KS3. More specifically, the masking portion MP, plate hole BH, adhesive HA, and / or aperture HC can be located between the wire LT of the corresponding button KS1 and the wire HT of the corresponding buttons KS2 and KS3. It should be noted that the masking portion MP, adhesive HA, and aperture HC are schematically illustrated in [the provided text]. Figure 11 The same location in the text. However, the definitions of the masking part MP, the pore adhesive HA, and the pores HC can be clearly understood from the above explanation.

[0066] In summary, this invention improves the overall light emission consistency by ensuring that multiple microstructure regions on the light panel do not overlap with two non-intersecting wires, thereby utilizing the specially configured microstructure regions on the light-emitting panel to recover light or assist in light emission. Furthermore, although this invention is designed to address the application problems of low-power light-emitting units, it is also applicable to the application of medium- and high-power light-emitting units in backlight modules.

[0067] Furthermore, due to the small size of low-power light-emitting units, their position can easily shift when mounted on the light-emitting board due to the melting of solder paste, resulting in a failure to achieve a smooth electrical connection between the light-emitting unit and the light-emitting board. The following embodiments of the present invention will introduce several technical solutions that, through special pad designs, ensure smooth connection of the light-emitting units even when they are misaligned during mounting, while simultaneously achieving uniform light distribution.

[0068] Please see Figure 12A , Figure 12B and Figure 12C , Figure 12A This is a top view schematic diagram showing the end-to-end connection between the (sub) conductors of the light-emitting board and the pads and light-emitting units according to another embodiment of the present invention. Figure 12B for Figure 12A A partially enlarged schematic diagram of the embodiment, Figure 12C for Figure 12A A top view of the side connection in the embodiment.

[0069] Figure 12A and Figure 12B In the middle, the two (sub) conductors STa / STb (see the aforementioned embodiment and...) Figure 3 The two (sub)wires STa / STb extend along the conductor direction Dt, with pads FP at their ends and a pad gap FG between them. Each pad FP can be integrally formed with the circuitry of the LED substrate (LCB) (such as conductors HT / LT / STa / STb) by printing conductive lines, or by etching copper foil substrates; however, each pad FP can also be formed in a secondary manner or with a different material than the circuitry of the LED substrate. The two pads FP have their endpoints IE as their outermost points, and the distance between the two endpoints IE is also the shortest distance between the two pads FP. The pad gap FG between the two endpoints IE is smaller than the long side width of the LED unit, for example, the gap between the two endpoints IE is close to 0.5 times the long side width of the LED unit or shorter. The endpoint IE can be the final point of the adjacent ends of the two pads FP, or it can be the geometric center point of the adjacent ends of the two pads FP. The two pads FP of the present invention each have at least two branch lines Br, which extend outward from the intersection endpoint IE to define at least one cutout area Ha / Hb. Figure 12A and Figure 12BIn this design, each pad FP has three branch lines Br. The middle branch line Br extends outward in a straight line from the intersection point IE to connect (sub) conductors STa / STb. The remaining two branch lines Br extend outward in an L-shaped path from the intersection point IE and also connect (sub) conductors STa / STb. The three branch lines Br of each pad FP together define two cutout areas Ha / Hb, and the border between the two cutout areas Ha / Hb extends along the middle branch line Br.

[0070] The positive and negative electrodes of the LED are electrically connected to two pads FP via a conductive layer CL, with the connection points located at the two intersection points IE or their adjacent areas. The conductive layer CL is implemented, for example, with solder paste or an alternative material. The thickness and area of ​​the conductive layer CL affect the degree of LED offset during component fabrication; therefore, the printing of the conductive layer CL must be concentrated as much as possible at the intersection points IE of the two pads FP, and extend to a limited extent with the branch line Br. The direction of the connection between the positive and negative electrodes of the LED, or the long side of the LED, is parallel to the direction Dt of the conductor. The width of the two pads FP (flat edges, or straight edges) can be set to be at least greater than or equal to 0.8-1.5 times the width of the short side of the LED. If the LED is offset along the normal direction Dn of the conductor STa / STb or along the short side direction of the LED, there is still a considerable chance that the positive and negative electrodes of the LED can still ensure electrical connection between the two pads FP. If the LED is offset along the conductor direction Dt of the conductors STa / STb or along the long side of the LED, the offset must exceed 0.5 times the length of the long side of the LED to prevent the LED from being electrically connected to both pads FP simultaneously. Regardless of the offset of the LED, the LED must at least partially overlap with one of the cutout areas Ha or Hb of one of the pads FP, for example, the corner or one side of the LED must overlap with at least one cutout area Ha or Hb. The overall size of the two pads FP (including the cutout areas Ha or Hb, branch lines Br, and pad gap FG) can be set to be at least 1.2 times larger than the size of the LED; or, the two pads FP each have at least one branch line Br forming a pair of flat edges, and the short side of the LED is preferably smaller than the width of the pair of parallel flat edges of the two pads FP. In one embodiment, the pair of flat edges are a pair of parallel flat edges. Thus, even with the maximum offset, the LED (on either side) does not exceed the outermost perimeter of either pad FP. In an ideal scenario without component misalignment, all four corners of the LED unit can overlap with the cutout area Ha or Hb, respectively. However, assuming highly stable process parameters, the flat edge of the pad FP may be less than or equal to the short side of the LED unit; even so, at least the LED unit (such as a side or corner) must be able to overlap the cutout area Ha / Hb to maintain a basic misalignment prevention mechanism.

[0071] The first significance of the cutout areas Ha / Hb is to provide at least two branch lines Br for each pad FP, which can be used to connect the positive and negative electrodes of the LED. Secondly, the intersection point IE of the branch lines Br (or the junction of the two cutout areas Ha / Hb) can serve as the positioning point for the LED in automated processes. Furthermore, the conductive layer CL tends to flow along the branch lines Br when molten; the presence of the cutout areas Ha / Hb significantly prevents this flow. Additionally, the width of each branch line Br can be only 0.5 times or less the width of the short side of the LED to limit the range / angle of the molten conductive layer CL from spreading, and thus limit the angle / path of the LED's offset. This ensures that the LED will offset along the branch lines Br, improving the yield of the LED's electrical connection between the two pads FP and the two conductors STa / STb.

[0072] Please also refer to Figure 12A , Figure 12B and Figure 12C , Figure 12A and Figure 12B In the diagram, the conductors STa / STb are in an end-to-end relative state, and their two cutout areas Ha and two cutout areas Hb are arranged perpendicular to the conductor direction Dt. Figure 12C Unlike other connections, the conductors STa / STb partially overlap in the direction perpendicular to the conductor Dt, forming an edge-to-edge arrangement. Therefore, when the two pads FP are rotated 90 degrees, the two cutout areas Ha and Hb are arranged along the conductor direction Dt. Regardless of whether the connection is end-to-end or edge-to-edge, the cutout areas Ha / Hb of the pads FP and the branch lines Br can effectively improve the yield of the LED electrical connection between the two pads FP and the two conductors STa / STb.

[0073] Please see Figures 13A to 13F Also refer to Figures 12A to 12C . Figures 13A to 13F These are top views of the connection architecture between the (sub) conductors STa / STb of the light-emitting lamp board LCB and the two pads FP and the light-emitting unit LED, respectively, in different embodiments of the present invention.

[0074] Figure 12A , Figure 12B and Figure 12C In the figure, three branch lines Br form a T shape, and each branch line Br is at least partially parallel to the short side and long side of the light-emitting unit LED, but the present invention is not limited thereto. Figure 13A In the diagram, each pad FP has only two branch lines Br extending obliquely outward from the intersection endpoint IE, and the two branch lines Br of each pad FP form an obtuse angle, finally defining a cutout area Ha / Hb with the two conductors STa / STb respectively. Although Figure 13A The LED in the center still overlaps, at least partially, with the cutout areas Ha and / or Hb. However, because the distance between the two branch lines Br on the same side of different pads FP increases as the LED shifts left and right along the normal direction Dn, the obtuse angle between the two branch lines Br of each pad FP should not be too small, for example, between 150 and 180 degrees, to avoid the LED shifting beyond the width of the two electrodes. A similar... Figure 13A However, better implementations include... Figure 13B As shown, similarly triangular pads FP, the flat side formed by the two triangular branch lines Br is opposite to the flat side formed by the branch line Br of another pad FP. This avoids the problem of varying spacing between the two branch lines Br on the same side of different pads FP when the LED is offset. Furthermore, Figure 13B The width of the intermediate conductors STa / STb is narrower (e.g., copper wires formed by etching a copper foil substrate), compared to Figure 13A The width of the middle conductors STa / STb is relatively wide (e.g., made by printing with a metal paste with lower conductivity than etched copper wires), and neither of them has a direct impact on the electrical connection between the pad FP and the light-emitting unit LED.

[0075] Figure 13C In the middle, both pads FP have three branch lines Br, and the configuration is also the same. Figure 12A , Figure 12B Similarly. The middle branch line Br extends outward in a straight line from the intersection point IE to the connecting (sub) conductors STa / STb. The remaining two left and right branch lines Br extend outward in a U-shaped path from the intersection point IE and also connect to the (sub) conductors STa / STb. Figure 13C The width of the middle conductor STa / STb is relatively narrow, in comparison. Figure 12A , Figure 12B The width of the conductors STa / STb is relatively wide, but as mentioned earlier, the width of the conductors STa / STb has little impact on the electrical connection between the pad FP and the light-emitting unit LED.

[0076] Figure 13D In the middle, both pads FP have three branch lines Br, and the configuration is also the same. Figure 13C similar. Figure 13D In the middle, the central branch line Br extends outward in a straight line from the intersection endpoint IE to connect (sub) conductors STa / STb. The remaining two left and right branch lines Br extend outward in a U-shaped path from the intersection endpoint IE, also connecting (sub) conductors STa / STb. The difference lies in the shape of the pad FP. Figure 13D The FP pad shape in the middle is closer to a semi-circle, that is, Figure 13D Both the left and right branch lines Br have curved chamfers, which corresponds more closely to the aforementioned... Figure 3Alternatively, the light guide plate hole L0 in Figure 14 could have more arcs, which would better match and increase the side light intake of the light guide plate LGP. Figure 13E Although each pad FP has multiple branch lines Br extending outwards from the intersection point IE with flat edges, only the central branch line Br connects to the (sub) conductors STa / STb. The left and right branch lines Br extend outwards from the intersection point IE in a straight line towards the normal direction Dn, without extending towards or connecting to the (sub) conductors STa / STb. However, the central branch line Br still defines cutout areas Ha / Hb with each of the left and right branch lines Br, ensuring that the light-emitting unit LED at least partially overlaps with one of the cutout areas Ha / Hb.

[0077] Figure 13F and Figure 13D The pads FP are similar, but the middle branch line Br is missing. There are only two branch lines Br on the left and right, which extend outward from the intersection point IE in a U-shaped path and also connect to the (sub) conductors STa / STb. Figure 13F The two pads FP and their branch lines Br also form a pair of parallel flat edges. Each of the two pads FP has only one cutout area Ha / Hb, so that the light-emitting unit LED overlaps at least partially with at least one of the cutout areas Ha / Hb (the two short edges). Figure 13F The shape of the two short sides of the central LED unit spanning the hollowed-out areas Ha / Hb is also similar to... Figure 13A and Figure 13B The triangular pad FP in the middle, but Figure 13F The pads FP and the cutout area Ha / Hb are both higher than those of the pads FP and cutout area Ha / Figure 13A , Figure 13B The middle is large. Furthermore, Figures 13A to 13F In the present invention, although each pair of pads (FP) is connected to the light-emitting unit (LED) in an end-to-end architecture, in practical applications, based on the descriptions of the foregoing embodiments, the present invention... Figures 13A to 13F Different types of pads (FP) can be applied to similar... Figure 12C An edge-to-edge lateral connection architecture.

[0078] Furthermore, the area surrounding the low-power light-emitting units is the brightest region. Expanding the light reflection angle in this area is key to increasing the amount of light entering the light guide plate from the side, improving the lateral transmission ratio, and promoting light emission uniformity. However, the area surrounding the light-emitting units is the physical connection area between the LEDs and the LCB circuitry of the light-emitting board. How to expand the light reflection angle while electrically connecting the LEDs to the LCB circuitry is a major challenge in the design of the LED electrical connection structure.

[0079] Please see Figures 14A to 14D , Figure 14AThis is a partial top view of the optical architecture of the backlight module in the area surrounding the light-emitting unit, according to another embodiment of the present invention. Figure 14B for Figure 14A A partial cross-sectional view of the backlight module in the embodiment. Figure 14C This is a partial top view of the optical architecture of the backlight module in the area surrounding the light-emitting unit, according to another embodiment of the present invention. Figure 14D For the present invention Figure 14A A partial top view of the optical architecture of the backlight module in a derivative embodiment.

[0080] Figure 14A and Figure 14B In this structure, the height difference between the six branch lines Br of the two pads FP and the four hollow areas Ha / Hb creates a concave-convex structure. Combined with the reflective first reflective layer RL1, this allows each pad FP to form a core microstructure region cMS surrounding at least a portion of the LED. The concave areas (hollow areas Ha / Hb) and convex areas (branch lines Br) can each function as microstructure regions MS. These pads FP and core microstructure regions cMS are located below the reflective portion RL0 inside the light-shielding plate SS. Even without special pads FP and their hollow areas Ha / Hb and branch lines Br, as long as the first reflective layer RL1 covering the LED has the aforementioned concave-convex structure, a core microstructure region cMS can still be formed around the LED. Therefore, one or more core microstructure regions cMS surrounding the LED can further reflect and diffuse the light reflected downwards from the reflective portion RL0 inside the light-shielding plate SS, increasing the amount of light entering the side of the light guide plate hole L0, thereby improving the lateral transmission ratio and promoting the overall uniformity of light emission for the key KS and the backlit keyboard LKB.

[0081] From an overall architectural perspective, with the light-emitting unit (LED) at its center, the backlight module (BLM) of this embodiment provides multiple light-averaging zones to achieve uniform light emission. These multiple light-averaging zones include at least a first zone Z1 and a second zone Z2. The first zone Z1 surrounds the LED and includes an inner ring portion RL1i of a first reflective layer RL1 and a pair of pads FP. The pads FP are located on the light-emitting lamp board (LCB) to connect to the LED. The inner ring portion RL1i of the first reflective layer RL1 at least partially covers the pads FP, allowing the inner ring portion RL1i to reflect and diffuse the light emitted by the LED. The second zone Z2 surrounds the first zone Z1 and includes a pair of spaced-apart microstructure regions MS. The pair of microstructure regions MS are located on the first reflective layer RL1 and together surround the pads FP. The pair of microstructure regions MS reflect and diffuse the light transmitted by the LED through the first zone Z1.

[0082] The first region Z1, closest to the LED light-emitting unit, is provided with one or more core microstructure regions cMS surrounding the LED through two pads FP on the light-emitting plate LCB and the first reflective layer RL1. The combination of branch lines Br and hollow areas Ha / Hb creates a concave-convex structure in the first region Z1. Since the pads FP and their core microstructure regions cMS overlap at least partially with the internal reflective portion RL0 of the light-shielding plate SS in the Z direction, they can be used to reflect, diffuse, and open the angle of light from the internal reflective portion RL0, allowing it to enter the light guide plate hole L0 from the side. In the first region Z1, the reflective layer hole RLH1 may overlap with the two pads FP and their hollow areas Ha / Hb, and the branch line Br and the core microstructure region cMS. Similarly, the light guide plate hole L0 may overlap with the two pads FP and their hollow areas Ha / Hb, and the branch line Br and the core microstructure region cMS.

[0083] Secondly, the second region Z2 surrounds the light-emitting unit LED at a greater distance, and also surrounds the light guide plate hole L0 and the reflective layer hole RLH1. The second region Z2 includes two internal microstructure regions IMS separated by a pair of non-intersecting (sub)wires STa / STb on the light-emitting plate LCB (refer to the foregoing embodiments and...). Figure 3 ( / 10 / 11) Two internal microstructure regions (IMS) are located on the upper surface of the first reflective layer RL1, and together they surround at least a portion of the first region Z1. Although the two internal microstructure regions (IMS) may only partially overlap with the internal reflective portion RL0 of the light-shielding plate SS, and less light directly from the internal reflective portion RL0 reaches the internal microstructure regions (IMS), during the lateral propagation of light in the light guide plate LGP, light rays with angles smaller than the critical angle will not be able to continue to undergo total internal reflection inside the light guide plate LGP and will pass through the lower surface of the light guide plate LGP. These passing light rays can be recovered by the two internal microstructure regions (IMS), and after reflection and diffusion, they will be re-injected into the light guide plate LGP to continue lateral propagation.

[0084] Furthermore, a third region Z3 can be set between the first region Z1 and the second region Z2 in the backlight module BLM. The third region Z3 can overlap with the first region Z1 and / or the second region Z2 in the Z direction. The third region Z3 mainly includes the region set in the first region Z1 and / or the second region Z2. Figure 14A The adhesive layer Ah above the central light panel LCB (e.g.) Figure 14B The adhesive layers Ah1 and / or Ah2). Although there is a need for adhesive positioning between the layers of the backlight module BLM, the adhesive should also be taken into consideration in the optical design; firstly, the adhesive layers Ah1 / Ah2 should be made of light-transmitting adhesive materials with good light coupling. Although excessive light concentration around the LED light-emitting unit is an inherent problem of low-brightness light-emitting units, overcorrection may occur during implementation, for example leading to... Figure 3The internal light-transmitting area KC0, which is closer to the center of the keycap KCC, has insufficient light emission. In this case, adhesive layers Ah1 / Ah2 can be used to fine-tune and increase the light emission intensity as a means of post-processing correction. Specifically, adhesive layer Ah1 can surround the light guide plate hole L0, the reflective layer hole RLH1, and the light-emitting unit LED and is located on the upper surface of the light guide plate LGP (or between the light guide plate LGP and the light shield SS). Adhesive layer Ah2 can surround the light guide plate hole L0, the reflective layer hole RLH1, and the light-emitting unit LED and is located on the lower surface of the light guide plate LGP (or between the light guide plate LGP and the light-emitting lamp board LCB).

[0085] The adhesive layers Ah / Ah1 / Ah2 are not suitable for being too close to the LED light-emitting unit. Firstly, the light coupling effect of the adhesive layers Ah / Ah1 / Ah2 will cause the light emitted by the LED to become too concentrated and unable to diffuse. Secondly, if the adhesive layers Ah / Ah1 / Ah2 come into contact with the LED during the manufacturing process, their adhesiveness may cause the LED to peel off. Therefore, the adhesive layers Ah / Ah1 / Ah2 must be used under proper control, including setting a glue-free zone CA or reducing the width of the adhesive layer. The glue-free zone CA can be set between the adhesive layers Ah / Ah1 / Ah2 and the light guide plate hole L0, or between the adhesive layers Ah / Ah1 / Ah2 and the reflective layer hole RLH1. In the Z direction, the glue-free zone CA can be set on the upper surface of the light guide plate LGP (or between the light guide plate LGP and the light shield SS), or on the lower surface of the light guide plate LGP (or between the light guide plate LGP and the light-emitting lamp plate LCB). In practical applications, adhesive layers Ah1 / Ah2 can be set individually or simultaneously. The adhesive notch AP is another adjustment method utilizing adhesive layers Ah1 / Ah2. If there is a need to increase the brightness of the keycap KCC outline halo or the outer characters (outer light-transmitting area KC1) in a certain location, an adhesive notch AP can be created in adhesive layers Ah1 / Ah2. The adhesive notch AP corresponds to the desired location or light-transmitting area, allowing more light to continue to pass smoothly outward laterally, thus increasing the brightness of the light emitted from that location.

[0086] Overall, from the Z-direction perspective, zones Z1, Z2, and Z3 respectively cover different blocks and areas of the LED light-emitting unit within a 360° range. Due to the different configurations of the optical components, the upward light emission of zones Z1, Z2, and Z3 can be relatively similar. In addition, other components can be used for adjustment. For example, the microstructure region MS on the surface of the light guide plate LGP can be used in conjunction with the core microstructure region cMS, internal microstructure region IMS, and external microstructure region oMS of the first reflective layer RL1 of the light-emitting lamp plate LCB to increase reflection and diffusion effects. Furthermore, covering the adhesive layers Ah1 / Ah2 with the internal reflective portion RL0 of the light-shielding plate SS can also reduce light loss caused by the adhesive layers Ah1 / Ah2 and recover light.

[0087] From the Z direction, Figure 14A , Figure 14B In this design, the light guide plate aperture L0 is larger than the reflective layer aperture RLH1 of the first reflective layer RL1, which in turn is larger than the light-emitting unit LED. This means the aperture wall of RLH1 surrounds the LED but does not completely cover the two pads FP. Alternatively, RLH1 is located between the LED and the light guide plate aperture L0, allowing a portion (the innermost ring area) of the first reflective layer RL1 to lie between RLH1 and L0. As a result, the two pads FP are at least partially exposed within RLH1. The exposed range of FP directly affects the range within which the LED can be successfully connected even if misalignment occurs during component assembly. Therefore, exposing more FP ensures a smooth connection between the LED and the pads FP. However, exposing FP means that the first reflective layer RL1 does not provide reflection, but this does not mean that RLH1 cannot provide a reflective diffusion effect. First, since the pads FP are made of copper or copper alloy (or other alternative metals), the branch lines Br exposed by the two pads FP (located between the LED and the reflective layer hole RLH1) can provide a reflective diffusion effect within the light guide plate hole L0. Second, the cutouts in the exposed areas of the two pads FP (including the cutout areas Ha / Hb and the pad gap FG) are usually the substrate of the exposed LED board LCB (located below the circuitry and pads FP). As long as the exposed upper surface of the substrate can reflect light, whether the upper surface of the substrate itself is reflective, or there is a metal solder / conductive layer, or there is an adhesive to ensure the LED is fixed, a reflective diffusion effect can still be provided.

[0088] refer to Figure 14CWhen mass production yield has stabilized and the assembly precision, assembly temperature, conductive layer flow, and assembly offset of the LED are well controlled, a smaller reflective layer aperture RLH1 can be used. The smaller the reflective layer aperture RLH1, even when the LED surrounds the aperture wall of RLH1 on all four sides, the more the first reflective layer RL1 can almost completely cover the light guide plate aperture L0 area of ​​the LED board LCB, preventing any part of the pad FP from being exposed. At this point, the two fully covered pads FP, with their branch lines Br and multiple cutout areas Ha / Hb, can form multiple microstructure regions with complete shapes and larger areas, constituting the core microstructure region cMS surrounding the LED. A larger core microstructure region cMS allows more light to be diffused in the early stages, enabling more light to enter smoothly from the sidewall of the light guide plate aperture L0. The core microstructure region cMS may be partially located within the light guide plate aperture L0 and partially outside the aperture wall. Of course, if the size and shape of the reflective layer hole RLH1 are similar to or slightly larger than the light-emitting unit LED, a similar effect can be achieved.

[0089] Based on the configuration of the foregoing embodiments, in Figures 14A to 14C In this embodiment, a portion of the multiple branch lines Br of the two pads FP together surround at least a portion of the light guide plate hole L0; multiple cutout areas Ha / Hb of the two pads FP together surround the reflective layer hole RLH1 and / or the multiple cutout areas Ha / Hb of the two pads FP overlap with the reflective layer hole RLH1; a portion of the inner ring portion RL1i of the first reflective layer RL1 located between the reflective layer hole RLH0 and the light guide plate hole L0 overlaps with at least a portion of the two pads FP respectively, which allows the local first reflective layer RL1 exposed in the light guide plate hole L0 to form a concave-convex reflective diffusion structure together with the local pads FP, such as the core microstructure region cMS. Finally, although each pad FP in the various embodiments of the present invention is taken as an example of connecting (sub)wires STa / STb, in practical applications, each pad FP can also selectively and directly connect to the aforementioned embodiments as needed. Figures 2 to 11 The (main) conductor HT / LT is mentioned.

[0090] refer to Figure 14DThe LED (Light Emitting Unit) encapsulates three-color chips to provide three colors of light (such as red, green, and blue). To achieve good light mixing effect for the three-color chips of the LED, the aforementioned core microstructure region cMS surrounding the LED is also formed in the inner ring portion RL1i of the first reflective layer RL1 (regardless of the presence or type of the aforementioned pad FP). This enhances the light mixing effect of the LED's three-color chips by improving reflection and diffusion. Furthermore, the three-color chips can be arranged with their long sides aligned consecutively. The advantage of this arrangement is that the LED is shorter, and the component offset is less likely to interfere with the small-sized light guide plate aperture L0. However, the disadvantage is poor light mixing effect because the long side of the chip with higher light output is blocked by the long side of the adjacent chip, making it difficult for different colors of light to be transmitted interchangeably. Another approach is as follows... Figure 14D As shown, the long side of each of the three-color chips is parallel to the long side of the entire LED light-emitting unit. In other words, the long sides of each of the three-color chips are arranged along the Y-direction, or their short sides are arranged consecutively. Thus, the long sides of the chips with higher light output and larger light output range overlap and intersect each other facing the X-direction in the diagram, achieving a better light mixing effect in two large fan-shaped areas in the X-direction. Simultaneously, in the Y-direction, because the short sides of the chips are adjacent, and the light output and light output range of the short sides are smaller, less light is blocked by the short sides, resulting in less polarization.

[0091] In summary, this invention provides a backlit keyboard, a backlight module, and a backlight board to solve the problems of connection stability of the light-emitting units and excessive light concentration in the adjacent areas of the light-emitting units. Besides ensuring smooth connection of the light-emitting units even when they are misaligned during component assembly by setting pads with hollowed-out areas, the invention further utilizes the pads and their hollowed-out areas in conjunction with a first reflective layer to form a light homogenization design in the first area. Furthermore, by combining the internal microstructure area of ​​the backlight board in the second area, the adhesive layer in the third area, and the adhesive-free area, this invention provides different light homogenization schemes for different blocks along the light path outward from the light-emitting units, allowing for a high degree of uniformity in the character brightness and keycap halo of individual keys, and even across the entire keyboard.

[0092] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all the implementation methods here. All obvious variations or modifications derived from the technical solutions of the present invention are still within the protection scope of the present invention.

Claims

1. A backlight module for illuminating at least one keycap, characterized in that, The backlight module includes: Light-emitting unit; A light guide plate having light guide plate holes to accommodate the light-emitting unit; and The lamp board has a pair of pads that are respectively connected to the light-emitting unit. The lamp board includes a first reflective layer that surrounds the light-emitting unit and at least partially covers the pair of pads. Each of the pair of pads has multiple branch lines and at least one cutout area, and the at least one cutout area overlaps with at least a portion of the light-emitting unit. The light panel also includes a pair of spaced-apart microstructure regions located on the first reflective layer. The pair of microstructure regions together surround the pair of pads. The pair of microstructure regions reflect and diffuse the light transmitted by the light-emitting unit through the light guide plate. Alternatively, the light panel also includes a pair of spaced-apart microstructure regions and two wires. The pair of microstructure regions are located on the first reflective layer, and the two wires are electrically connected to the pair of pads respectively. The pair of microstructure regions do not overlap with the two wires.

2. The backlight module as described in claim 1, characterized in that, The first reflective layer has an inner ring portion that at least partially covers the plurality of branch lines and the at least one hollow area, and the inner ring portion reflects and diffuses the light emitted by the light-emitting unit.

3. The backlight module as described in claim 1, characterized in that, At least one of the multiple branch lines of each pad is not completely covered by the first reflective layer, forming an exposed portion that reflects and diffuses the light emitted by the light-emitting unit.

4. The backlight module as described in claim 1, characterized in that, At least a portion of the first reflective layer is located within the light guide plate aperture.

5. The backlight module as described in claim 1, characterized in that, The backlight module also includes a light shield, which has an internal reflective portion that overlaps with the first reflective layer.

6. The backlight module as described in claim 1, characterized in that, The multiple branch lines of each pad in the pair of pads form a pair of parallel flat edges, and the width of the short side of the light-emitting unit is smaller than the width of the pair of flat edges.

7. The backlight module as described in claim 1, characterized in that, At least one of the plurality of branch lines of each pad surrounds at least a portion of the light guide plate hole.

8. The backlight module as described in claim 1, characterized in that, The first reflective layer has a reflective layer aperture, and the at least one cutout area of ​​each of the pair of pads surrounds the reflective layer aperture and / or the at least one cutout area of ​​each of the pair of pads overlaps with the reflective layer aperture.

9. The backlight module as described in claim 1, characterized in that, The first reflective layer has a reflective layer hole, which is located between the light-emitting unit and the light guide plate hole.

10. The backlight module as described in claim 1, characterized in that, The first reflective layer has a reflective layer hole, and a portion of the first reflective layer overlapping with the pair of pads is located between the reflective layer hole and the light guide plate hole.

11. The backlight module as described in claim 1, characterized in that, The light-emitting unit contains three crystals to provide three colors of light, and the three crystals are arranged side by side with their short sides connected.

12. The backlight module as described in claim 1, characterized in that, The light panel has two wires that are electrically connected to a pair of pads, and a first reflective layer covers the two wires.

13. The backlight module as described in claim 12, characterized in that, The two wires are located between the pair of microstructure regions.

14. The backlight module as described in claim 1, characterized in that, The light board includes two conductors, each of which has a sub-conductor, so that the light board has two sub-conductors. The two sub-conductors are electrically connected to the pair of pads. The two conductors also have a main conductor, so that the light board also has two main conductors. The two main conductors are electrically connected to the two sub-conductors.

15. The backlight module as described in claim 14, characterized in that, The pair of microstructure regions includes a pair of external microstructure regions spaced apart from each other, which are located on the first reflective layer and are respectively located outside the two dominant lines.

16. A backlight module for illuminating at least one keycap, characterized in that, The backlight module includes a light guide plate, a light-emitting unit, and a lamp plate. The backlight module defines multiple light-averaging zones to even out the light emitted by the light-emitting unit. These multiple light-averaging zones include: A first region, surrounding the light-emitting unit, includes an inner ring portion of a first reflective layer and a pair of pads located on the lamp board to connect the light-emitting unit. The inner ring portion of the first reflective layer at least partially covers the pair of pads, and reflects and diffuses the light emitted by the light-emitting unit. The second region, surrounding the first region, includes a pair of spaced-apart microstructure regions located on the first reflective layer. The pair of microstructure regions together surround the pair of pads and reflect and diffuse the light transmitted by the light-emitting unit through the light guide plate.

17. A backlit keyboard, characterized in that... Include: Multiple keys, with keycaps; and The backlight module as described in any one of claims 1 to 16, wherein the backlight module is located below the plurality of buttons.

18. A light-emitting panel, characterized in that... Include: Two non-intersecting conductors; Multiple microstructure regions, two of which are spaced apart from each other, and two of which do not overlap with the two non-intersecting conductors; The light-emitting unit is located between two of the multiple microstructure regions; as well as A pair of pads electrically connect the two non-intersecting wires to the light-emitting unit. Each pad in the pair of pads has at least one branch line to form a pair of parallel flat edges. Each pad in the pair of pads also has at least one cutout area. The light-emitting unit overlaps with at least a portion of the at least one cutout area of ​​each pad in the pair of pads.

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