An apparatus for feeding circuitry onto PCB substrates in a production line.

Abstract

This invention discloses a device for feeding circuit boards onto a PCB substrate production line. It includes a frame with a platform and a hopper mounted on the frame. The platform beneath the hopper has a cardboard drop opening that connects vertically. A substrate sliding opening is located on the front side of the cardboard drop opening. In application, stacked PCB substrates are placed into the hopper. The cardboard drop opening automatically separates the release liner from the interleaved PCB substrates. The hopper is then pushed forward at a uniform speed, causing the PCB substrates to slide onto the production line one by one. The hopper is a rectangular frame with open top and bottom, and the cardboard drop opening is rectangular. The upper surfaces of both sides of the cardboard drop opening have process edge side faces for supporting the process edges at both ends of the PCB substrates. Its advantages include the ability to directly place a stack of PCB substrates into the hopper at once; eliminating the need for a complex hopper circulation track setup; and significantly reducing the manufacturing and maintenance costs of the entire PCB substrate feeding device.

Description

Technical Field

[0001] This invention relates to a device for feeding circuit boards onto a PCB substrate in a production line, belonging to the field of PCB substrate loading circuit board production line technology. Background Technology

[0002] Modern electronic products cannot function without PCB substrates. Not only can various circuits be directly mounted on them, but also chips containing large-scale integrated circuits can be attached and connected to the corresponding circuits to give them specific functions.

[0003] The PCB substrate is manufactured in a cleanroom and vacuum-packed to ensure a clean environment during storage and transportation. The PCB substrate circuit loading and injection molding processes are also completed in a cleanroom.

[0004] The PCB substrates are packaged in multiple pieces together, with release paper used between adjacent PCB substrates to prevent the pressure generated by vacuum packaging from causing the two PCB substrates to immerse and stick together.

[0005] When PCB substrates are loaded with circuitry onto the production line, one traditional method involves unpacking the vacuum packaging and manually inserting stacks of PCB substrates one by one into a multi-layered loading bin. The loading bin is then placed in a dedicated upper and lower circulation channel, gradually rising in the lower channel. A ejector mechanism then launches one PCB substrate from one of the layers, which is on the same plane as the production line, onto the production line. The production line has two drive chains, left and right. The process edges on both sides of the PCB substrates entering the production line rest on these two drive chains, moving forward with them. As the loading bin rises, the ejector mechanism continuously launches PCB substrates onto the production line. Another traditional method uses a stacking machine, which automatically places the PCB substrates one by one onto the production line. However, this equipment cannot remove the release liner between the substrates.

[0006] From the completion of PCB substrate fabrication to the loading of circuits onto the PCB substrate and its entry into the production line, the traditional technical solutions used for vacuum packaging, unpacking, boxing, and loading onto the production line have the following drawbacks:

[0007] 1. Manual packing is slow and inefficient. With a large number of PCB substrates, manually loading them one by one into the loading bin is too time-consuming. Fully automated intelligent packing would be too costly and unsuitable for small and medium-sized enterprises.

[0008] Second, the feeding circulation channel has a complex structure and high manufacturing and maintenance costs.

[0009] Third, the single-use of vacuum packaging bags and release paper leads to waste. PCB substrates are widely used products in the electronics industry, with a very large usage. From the completion of production by upstream manufacturers or workshops to the loading and storage of circuits by downstream manufacturers or workshops, vacuum packaging and release paper are used as intermediaries. The single-use and discarded vacuum packaging bags and release paper cause serious waste.

[0010] Fourth, the stacking machine cannot remove the release paperboard between the two layers.

[0011] Through searching, a large number of patent documents were found that improved the PCB substrate feeding mechanism, but none of the improvements addressed the above-mentioned issues. Two of these documents are selected for further explanation.

[0012] Application number 202211732510.9, entitled "An Automatic PCB Loading and Unloading Machine for Use with Multiple Clip-Type Fixtures," relates to an automatic PCB loading and unloading machine for use with multiple clip-type fixtures. It includes a PCB feeding mechanism and a fixture loading and unloading lifting mechanism. The PCB feeding mechanism controls a push rod to move between different clip-type fixtures, pushing the PCB board into the fixture from the side. The fixture loading and unloading lifting mechanism controls the up-and-down movement of multiple parallel clip-type fixtures, facilitating the PCB feeding mechanism to select different slots within the same fixture. This automatic PCB loading and unloading machine can adapt to multiple clip-type fixtures and provides fully automatic loading and unloading of carriers and fixtures, successfully solving the problems of low efficiency caused by manual loading and applicability to single clip-type fixtures in existing equipment. During PCB feeding, the circuit boards are stored in the PCB carrier. The PCB board is removed from the carrier using a carrier opening and combination mechanism and a suction cup loading and unloading mechanism, and then transferred to the PCB feeding mechanism, ensuring that the circuit boards are not damaged.

[0013] Application number 202310551836.X, entitled "A Lead-Free Soldering System and Equipment for Circuit Boards," relates to the field of circuit board processing technology, specifically a lead-free soldering system and equipment for circuit boards. The system includes a workbench, a fixed frame, a soldering tank on the workbench, a lifting frame, two symmetrically sliding rotating rods on the inner wall of the soldering tank, a rotating plate rotatably mounted on the side of the carrying rack near the lifting frame, and an inclined surface on the workbench. A feeding assembly includes a rotating tube rotatably mounted on one side of the material box, with a first piston tube on the connecting plate. A guiding assembly includes movable plates movably disposed on both sides of the workbench, with guide plates fixedly mounted on the adjacent sides of the two movable plates. This solution features a feeding assembly on one side of the workbench. The rotating tube drives a suction cup to rotate between the material box and the workbench, transferring the circuit board material from the material box to the workbench, replacing manual feeding and improving feeding efficiency. Additionally, the inclined surface on the workbench allows the soldered circuit board material to slide down to the recycling rack under gravity, achieving automatic unloading.

[0014] As with all the patent documents found in the search, the two patents mentioned above both involve PCB substrate loading, but neither of them can solve the three problems mentioned above. Summary of the Invention

[0015] This application is one of several patent protections proposed to address the aforementioned problems in the prior art, and to make a series of technical improvements from the stacking of PCB substrates on the production line to the loading into the bin and into the circuit loading assembly line.

[0016] The technical problem to be solved by this invention is: how to design a device that supplies substrates to the production line conveyor belt when the PCB substrate is further loaded with circuits, and that can quickly load stacked substrates and automatically separate the release paper between the substrates.

[0017] To address the above problems, the technical solution proposed by this invention is as follows:

[0018] A device for feeding circuit boards onto a PCB substrate production line includes a frame with a platform and a hopper on the frame. The platform under the hopper has a cardboard drop opening that is open at both ends. The front side of the cardboard drop opening has a substrate sliding opening. In use, stacks of PCB substrates are placed into the hopper. The cardboard drop opening automatically separates the release cardboard from the PCB substrates. Then, the hopper is pushed forward at a uniform speed so that the PCB substrates slide down the production line one by one.

[0019] Furthermore, the material box is a rectangular frame with open top and bottom, the cardboard drop opening is rectangular, and the upper surfaces on both sides of the cardboard drop opening have process edge side facades for supporting the process edges at both ends of the PCB substrate.

[0020] Furthermore, the table surface of the platform has a downwardly recessed substrate sliding surface in the area from the cardboard drop port to the substrate sliding port, which allows the PCB substrate to slide sideways towards the substrate sliding port. The cardboard drop port to the substrate sliding port are both open on the substrate sliding surface. The two side walls formed by the two sides of the substrate sliding surface to the table surface are limiting side walls for laterally limiting the PCB substrate. The process edge side elevation is located on the substrate sliding surface between the edge of the cardboard drop port and the limiting side wall.

[0021] Furthermore, the material box has several vertically arranged substrate partition slots with symmetrically arranged slots facing each other on both sides, which are used to insert the PCB substrate from top to bottom to the process edge side surface at both ends. All substrate partition slots have the same width, and there is a partition plate between two adjacent substrate partition slots. The substrate partition slots have two variable states: wide and narrow. In the narrow state, the width of the substrate partition slot plus the thickness of the partition plate is equal to the thickness of the PCB substrate plus the thickness of the cardboard in the stacked state.

[0022] Furthermore, the rear end of the material box has an end plate, and the front two ends of the end plate are respectively fixed with sliding shaft plates that extend forward and whose plate surfaces are perpendicular to both the end plate and the table surface. A sliding shaft hole is provided in the center of the partition plate for the sliding shaft plate to pass through and slide. Several partition plates are sleeved on the sliding shaft plate through the sliding shaft hole. There are elastic elements in the middle area between two adjacent partition plates, so that the outer area between two adjacent partition plates forms a substrate partition groove. The wide and narrow states of the substrate partition groove can be realized by compressing and releasing the elastic elements.

[0023] Furthermore, a limiting block is provided on one side of the partition plate, and the thickness of the limiting block is equal to the width of the substrate partition groove in the narrow state.

[0024] Furthermore, a baffle is fixedly installed on the table behind the cardboard drop outlet to prevent the material box from moving backward. The baffle is a hollow rectangular frame with a hollow space, and the upper and lower frame edges of the baffle abut against the end plate of the material box.

[0025] Furthermore, it also includes a scaling mechanism for compressing and releasing the elastic elements. The scaling mechanism includes a rectangular frame that surrounds the material box from the outside and has an opening at the front end. The rectangular frame consists of a push plate at the rear end, side plates fixed to the push plate at right angles at both ends, and scaling plates that fold back towards each other at the front ends of the two side plates. When the rectangular frame is pulled backward, its rear end can pass through the hollow space of the retainer. The two scaling plates at its front end can simultaneously compress the elastic elements between several partition plates. The opening is located between the two scaling plates and is used to place and remove the retainer.

[0026] Furthermore, the scaling mechanism also includes an electric cylinder and its electric push rod. The electric cylinder is located at the rear end of the platform, and its electric push rod is fixedly connected to the push plate.

[0027] Furthermore, the substrate sliding port has a lower lip plate, and the lower lip plate has a guide surface that is inclined in alignment with the direction of the loading circuit pipeline drive. Beneficial effects

[0028] 1. It can directly put a stack of PCB substrates (more than 100 pieces) into the material box at one time, unlike existing technologies that require manual placement of PCB substrates one by one on the shelves of the material box. It can also automatically remove all release paper, while existing automatic feeding devices (such as automatic stacking machines) cannot automatically remove release paper.

[0029] 2. The structure of the feeding device is greatly simplified. Compared with the existing technology, the complex material box circulation and rotation track setting is eliminated, which significantly reduces the manufacturing and maintenance cost of the entire PCB substrate 33 feeding device;

[0030] 3. Release paperboard can be reused multiple times, which is more in line with the requirements of saving resources and environmental protection compared to the single-use release paper of existing technologies. Attached Figure Description

[0031] Figure 1 This is a three-dimensional schematic diagram of the feeding device, with arrow F1 pointing in the direction of forward.

[0032] Figure 2 This is a three-dimensional schematic diagram of a partial structure of the feeding device, mainly showing the end plate and sliding shaft plate in the material box;

[0033] Figure 3 This is a three-dimensional schematic diagram of a partial structure of the feeding device, mainly showing the baffle and other components.

[0034] Figure 4 This is a three-dimensional schematic diagram of the rectangular frame;

[0035] Figure 5 for Figure 1 A partial schematic diagram;

[0036] Figure 6 This is a three-dimensional schematic diagram of the partition plate and the elastic element;

[0037] Figure 7 A three-dimensional schematic diagram of the feeding device shows that the rectangular frame is pulled back and the substrate partition groove is in a narrow state.

[0038] Figure 8 This is a top view of the material bin;

[0039] Figure 9 This is a top view of the stacked PCB substrates placed into the material box when the substrate partition slots of the material box are in a narrow state.

[0040] Figure 10 for Figure 9 A partial schematic diagram;

[0041] Figure 11 A three-dimensional schematic diagram showing how a PCB substrate is held in a pre-defined stacked shape by a retainer;

[0042] Figure 12 for Figure 11 A partial schematic diagram;

[0043] Figure 13 This is a three-dimensional schematic diagram of the PCB substrate.

[0044] In the diagram: 1. Frame; 101. Platform; 2. Material box; 201. End plate; 202. Sliding shaft plate; 203. Divider plate; 204. Substrate dividing groove; 205. Elastic element; 3. Rectangular frame; 301. Push plate; 302. Side plate; 303. Scaling plate; 304. Opening; 4. Electric cylinder; 401. Electric push rod; 5. Holder; 501. End clamping element; 502. Side clamping element; 6. Substrate sliding opening; 601. Lower lip plate; 602. Guide surface; 7. Cardboard falling opening; 8. Substrate sliding surface; 801. Process edge side elevation; 802. Limiting side wall; 9. Sliding shaft hole; 10. Limiting block; 11. Stop; 1101. Hollow space; 12. Guide groove; 13. 131. PCB substrate; 132. Circuit loading surface; 133. Process edge; 14. Release paperboard; 15. Interphase groove; 100. Conveyor belt. Detailed Implementation

[0045] The present invention will be further described below with reference to embodiments and accompanying drawings:

[0046] like Figure 13 As shown, the PCB substrate described in this application is rectangular and has process edges 132 at at least at both ends for clamping during processing. The width of the process edges 132 is generally 4-6 mm. Between the process edges at both ends is the circuit loading surface 131 for loading ordinary circuits and large-scale integrated circuits.

[0047] like Figure 11 As shown in Figure 13, the preset style of the PCB substrate 13 stacking required by the technical solution claimed in this application, which is also one of the contents of the separate claim in this research and development, is as follows: the release paper between two adjacent PCB substrates 13 is made into a recyclable release paperboard 14 with a fixed shape; the release paperboard 14 is only pressed onto the circuit loading surface 131 between the process edges 132 at both ends of the PCB substrate 13, so that an inter-slot 15 without spacers is formed between the adjacent process edges 132 at both ends of the two adjacent PCB substrates 13, that is, the process edges 132 extend beyond the end face of the release paperboard 14; the PCB substrates 13 and the release paperboard 14 are stacked into a rectangular block.

[0048] The above-mentioned pattern is held by a retainer 5 protected in another application. The retainer 5 includes end clamps 501 at both ends and side clamps 502 on both sides. The end clamps 501 at both ends clamp the front and rear ends of a stack of stacked PCB substrates, and the side clamps 502 on both sides clamp the sides of the stack of stacked PCB substrates. The side clamps 502 only clamp the sides of the circuit loading surface 131, so that the process edges 132 at both ends are exposed.

[0049] The above style must be maintained until the PCB substrate is loaded into the material box before being used in the production line.

[0050] This application uses the terms "front," "back," "left," and "right" in many places to describe the orientation, which all refer to the orientation of the view and not the actual orientation of the object. Example 1

[0051] like Figure 1 , 2 As shown, a device for feeding circuit boards onto a PCB substrate assembly line includes a frame 1 with a platform 101 and a hopper 2 mounted on the frame 1. The platform 101 below the hopper 2 has a cardboard drop port 7 that communicates vertically. A substrate sliding port 6 is located at the front of the cardboard drop port 7. In application, stacked PCB substrates 13 are directly placed into the hopper 2. The release cardboard 14 is automatically separated from the adjacent PCB substrates 13 through the cardboard drop port 7. The hopper 2 is then pushed forward at a uniform speed, causing the PCB substrates 13 to slide down the assembly line one by one. This eliminates the need for manual placement of the PCB substrates 13 one by one on the hopper's shelves, and allows for the automatic removal of all release cardboard 14 at once. More importantly, compared to existing technologies, it eliminates the need for a complex hopper circulation track, significantly reducing the manufacturing and maintenance costs of the entire PCB substrate feeding device.

[0052] like Figure 1 , 2 As shown in 5, 6, 7, 8, 9, and 10, the material box 2 is a rectangular frame with open top and bottom, the cardboard drop opening 7 is rectangular, and the upper surfaces on both sides of the cardboard drop opening 7 have process edge side surfaces 801 for side-standing the process edges 132 at both ends of the PCB substrate 13.

[0053] The material box 2 has several vertically arranged symmetrical slots facing each other on both sides for inserting the PCB substrate from the process edges 132 to the process edge side surface 801 at both ends from top to bottom. All the substrate partition slots 204 have the same width, and there is a partition plate 203 between two adjacent substrate partition slots 204. The substrate partition slots 204 have two variable states: wide and narrow. In the narrow state, the width of the substrate partition slot 204 plus the thickness of the partition plate 203 is equal to the thickness of the PCB substrate plus the thickness of the cardboard in the stacked state.

[0054] The application principle of the above setup is as follows: In the narrow state, the stacked PCB substrates 13 clamped by the retainer 5 are directly placed into the material box from top to bottom. During placement, the process edges 132 at both ends of the stacked PCB substrates 13 are inserted into the substrate partition grooves 204 on both sides of the material box 2, while the partition plates 203 on both sides of the material box 2 are inserted into the inter-row grooves 15 between adjacent process edges 132, causing the stacked PCB substrates 13 to fall until the process edges 132 at both ends rest on the side surfaces 801 of the process edges on both sides, so that the release cardboard 14 is suspended directly above the cardboard drop opening 7. The retainer 5 is removed, and the substrate partition grooves 204 are widened, the clamped stacked PCB substrates 13 are released, and the release cardboard 14 clamped between adjacent PCB substrates 13 loses its clamping force and falls from the cardboard drop opening 7 under the action of gravity. In this way, the release liner 14 in the stacked PCB substrates 13 is removed, and each remaining PCB substrate 13 is kept upright by the substrate partition grooves 204 on both sides. When the front PCB substrate 13 is pushed to the substrate drop port 6, the process edges at both ends lose the support of the process edge side surfaces 801 and slide from the substrate drop port 6 onto the conveyor belt 100 of the circuit loading production line. In this way, the material box is continuously pushed forward at a uniform speed, so that the PCB substrates 13 slide onto the conveyor belt 100 at equal intervals, thereby realizing the feeding of the circuit loading production line.

[0055] The rear end of the material box 2 has an end plate 201. At the front ends of the end plate 201, two forward-extending sliding shaft plates 202 are fixed, their surfaces perpendicular to both the end plate 201 and the table surface 101. A sliding shaft hole 9 is provided in the center of the partition plate 203 for the sliding shaft plate 202 to pass through and slide. Several partition plates 203 are threaded onto the sliding shaft plates 202 through the sliding shaft holes 9. Elastic members 205 are interspersed in the middle region between adjacent partition plates 203, forming a substrate partition groove 204 in the outer region between adjacent partition plates 203. The substrate partition groove 204 can be wide or narrow by compressing and releasing the elastic members 205. This elastic member can be a spring or a rubber block with a sliding shaft hole 9 in the middle; the attached figure shows a preferred rubber block according to this application.

[0056] To facilitate precise control of the width of the substrate partition groove 204 in the narrow state, a limiting block 10 is provided on one side of the partition plate 203. The thickness of the limiting block 10 is equal to the width of the substrate partition groove 204 in the narrow state.

[0057] like Figure 1 , 3 As shown in Figure 5, there is a fixed baffle 11 on the table behind the cardboard drop port 7 to prevent the material box 2 from moving backward. The baffle 11 is a hollow rectangular frame. The upper and lower frame edges of the baffle 11 press against the end plate 201 of the material box 2 from front to back, thus preventing the material box 2 from sliding backward when the partition plate 203 is compressed from front to back.

[0058] like Figure 1 , 4 As shown, the device also includes a scaling mechanism for compressing and releasing the elastic elements 205. The scaling mechanism includes a rectangular frame 3 that surrounds the material box 2 from the outside and has an opening 304 at the front end. The rectangular frame 3 consists of a push plate 301 at the rear end, side plates 302 fixed to the push plate 301 at right angles at both ends, and scaling plates 303 that fold back towards each other at the front ends of the two side plates 302. When the rectangular frame 3 is pulled backward, its rear end can pass through the hollow space 1101 of the retainer 11, and the two scaling plates 303 at its front end can simultaneously compress the elastic elements 205 between several partition plates 203. The opening 304 is located between the two scaling plates 303 and is used to place and remove the retainer 5. The scaling mechanism also includes an electric cylinder 4 and its electric push rod 401. The electric cylinder 4 is located at the rear end of the platform 101, and its electric push rod 401 is fixedly connected to the push plate 301. When the electric push rod 401 pulls the rectangular frame 3 backward, its rear end can pass through the hollow space 1101 of the baffle 11, and the two scaling plates 303 at its front end can simultaneously compress the elastic elements 205 between several partition plates 203 until the substrate partition groove 204 is in a narrow state. When the electric push rod 401 pushes the rectangular frame 3 forward until the push plate 301 contacts the end plate 201, the elastic elements 205 are released, the substrate partition groove 204 is in a wide state, and the release paper 14 falls off. The electric push rod 401 pushes the rectangular frame 3 forward at a uniform speed, so that the material box 2 moves forward at a uniform speed, performing the task of supplying PCB substrate 13 to the circuit loading production line. Example 2

[0059] like Figure 7 As shown, the difference from Embodiment 1 is that the lower end face of the scaling plate 303 is pressed against the table surface of the table 101, and a guide groove 12 is provided on the table surface to allow the scaling plate 303 to extend and retract in a straight line. The bottom surface of the lower end of the scaling plate 303 is provided with a guide slide protrusion that inserts into the guide groove 12. The purpose of this measure is to ensure that the material box 2 is smoothly pushed forward in a straight line. Example 3

[0060] like Figure 2As shown, the difference from Embodiment 1 is that the table surface of the platform 101 has a downwardly recessed substrate sliding surface 8 in the area from the cardboard drop port 7 to the substrate sliding port 6, which allows the PCB substrate to slide sideways towards the substrate sliding port 6. Both the cardboard drop port 7 and the substrate sliding port 6 are open onto the substrate sliding surface 8. The two side walls formed by the substrate sliding surface 8 and the platform surface are limiting side walls 802 that laterally limit the PCB substrate. The process edge side surface 801 is located on the substrate sliding surface 8 between the edge of the cardboard drop port 7 and the limiting side wall 802. With this configuration, during packaging, the stacked PCB substrates 13 can be further lowered onto the substrate sliding surface 8, and the limiting side walls 802 on both sides of the substrate sliding surface 8 can laterally limit the PCB substrates 13, ensuring that the PCB substrates 13 slide normally towards the substrate sliding port 6. Example 4

[0061] like Figure 2 As shown, the substrate sliding port 6 further includes a lower lip plate 601, which has a guide surface 602 that is inclined in the direction of the loading circuit pipeline drive. Example 5

[0062] Furthermore, a high-frequency vibrator (not shown in the figure) is provided under the platform 101 to prevent the PCB substrate 13 from adhering to the contact surface and to ensure that the PCB substrate 13 slides normally into the substrate sliding opening 6.

[0063] The above embodiments are only used to describe the present invention more clearly, and should not be regarded as limiting the scope of protection covered by the present invention. Any equivalent modifications should be regarded as falling within the scope of protection covered by the present invention.

Claims

1. An apparatus for feeding circuitry onto a PCB substrate in a production line, comprising a frame (1) having a platform (101) and a hopper (2) disposed on the frame (1), characterized in that: The tray (101) under the hopper (2) has a cardboard drop opening (7) that is open at both the top and bottom. The front side of the cardboard drop opening (7) has a substrate sliding opening (6). In use, stacked PCB substrates (13) are placed into the hopper (2). The release cardboard (14) is automatically separated from the PCB substrates (13) by the cardboard drop opening (7). Then, the hopper (2) is pushed forward at a uniform speed so that the PCB substrates (13) slide down the conveyor belt (100) one by one. The substrate sliding opening (6) has a lower lip plate (601). The lower lip plate (601) is aligned with the loading circuit production line. The guide surface (602) is inclined in the transmission direction; the material box (2) has a number of vertically arranged slots (204) with symmetrically arranged slots facing each other on both sides, which are used to insert the PCB substrate from the process edge (132) at both ends to the process edge side surface (801) from top to bottom. All the substrate partition slots (204) are equal in width, and there is a partition plate (203) between two adjacent substrate partition slots (204). The substrate partition slots (204) have two states that can be varied: wide and narrow. In the narrow state, the width of the substrate partition slot (204) plus the thickness of the partition plate (203) is equal to the thickness of the PCB substrate plus the thickness of the cardboard in the stacked state.

2. The apparatus for feeding circuitry onto a PCB substrate in a production line according to claim 1, characterized in that: The material box is a rectangular frame with open top and bottom, the cardboard drop opening (7) is rectangular, and the upper surfaces on both sides of the cardboard drop opening (7) have process edge side facades (801) for side-standing the process edges (132) at both ends of the PCB substrate (13).

3. The apparatus for feeding circuitry onto a PCB substrate in a production line according to claim 2, characterized in that: The table surface (101) has a substrate sliding surface (8) that is recessed downward in the area from the cardboard drop port (7) to the substrate slide port (6) so that the PCB substrate can slide sideways to the substrate slide port (6). The cardboard drop port (7) to the substrate slide port (6) are both open on the substrate sliding surface (8). The two side walls formed by the two sides of the substrate sliding surface (8) to the table surface are limiting side walls (802) for lateral limiting of the PCB substrate. The process edge side surface (801) is located on the substrate sliding surface (8) between the edge of the cardboard drop port (7) and the limiting side wall (802).

4. The apparatus for feeding circuitry onto a PCB substrate according to claim 1, characterized in that: The material box (2) has an end plate (201) at the rear end. The two ends of the front side of the end plate (201) are respectively fixed with a sliding shaft plate (202) that extends forward and whose plate surface is perpendicular to both the end plate (201) and the table surface. A sliding shaft hole (9) is provided in the center of the partition plate (203) for the sliding shaft plate (202) to pass through and slide. Several partition plates (203) are sleeved on the sliding shaft plate (202) through the sliding shaft hole (9). There are elastic elements (205) in the middle area between two adjacent partition plates (203) to form a substrate partition groove (204) in the outer area between two adjacent partition plates (203). The substrate partition groove (204) can be wide or narrow by compressing and releasing the elastic elements (205).

5. The apparatus for feeding circuitry onto a PCB substrate in a production line according to claim 4, characterized in that: A limiting block (10) is provided on one side of the partition plate (203), and the thickness of the limiting block (10) is equal to the width of the substrate partition groove (204) in the narrow state.

6. The apparatus for feeding circuitry onto a PCB substrate in a production line according to claim 4, characterized in that: On the table behind the cardboard drop outlet (7), there is a fixed baffle (11) to prevent the material box (2) from moving backward. The baffle (11) is a hollow rectangular frame with a hollow space (1101). The upper and lower frame sides of the baffle (11) abut against the end plate (201) of the material box (2).

7. The apparatus for feeding circuitry onto a PCB substrate in a production line according to claim 6, characterized in that: It also includes a scaling mechanism for compressing and releasing elastic elements (205). The scaling mechanism includes a rectangular frame (3) that surrounds the material box (2) from the outside and has an opening (304) at the front end. The rectangular frame (3) is composed of a push plate (301) at the rear end, side plates (302) fixed at right angles to the push plate (301) at both ends of the push plate (301), and scaling plates (303) that fold back towards each other at the front ends of the two side plates (302). When the rectangular frame (3) is pulled backward, its rear end can pass through the hollow space (1101) of the retainer (11) and the two scaling plates (303) at its front end can simultaneously compress the elastic elements (205) between several partition plates (203). The opening (304) is located between the two scaling plates (303) and is used to place and remove the retainer (5).

8. The apparatus for feeding circuitry onto a PCB substrate in a production line according to claim 7, characterized in that: The scaling mechanism also includes an electric cylinder (4) and its electric push rod (401). The electric cylinder (4) is located at the rear end of the platform (101), and its electric push rod (401) is fixedly connected to the push plate (301).

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