Thermal interface material assembly, heat spreader, and device

Abstract

Thermal interface material assemblies, heat spreaders, and devices are disclosed as thermal interface solutions for sliding surfaces. In an example embodiment, a thermal interface material assembly includes a substrate having opposing first and second surfaces. A friction reducing layer is along the first surface of the substrate. A thermal interface material is along the second surface of the substrate such that the substrate is between the friction reducing layer and the thermal interface material. The friction reducing layer is configured to slide in contact with a first surface of a first component when the thermal interface material assembly is along a second surface of a second component and when the first and second surfaces are slidably movable relative to one another.

Description

TECHNICAL FIELD

[0001] The present disclosure relates generally to thermal interface material assemblies, heat spreaders, and devices as thermal interface solutions for sliding surfaces. BACKGROUND

[0002] This section provides background information to the present disclosure which is not necessarily prior art.

[0003] Electrical components, such as semiconductors, integrated circuit packages, transistors, etc., typically have a pre-designed temperature at which the electrical component optimally operates. Ideally, the pre-designed temperature is close to the temperature of the surrounding air. However, the operation of the electrical component generates heat. If the heat is not removed, the electrical component can operate at a temperature significantly higher than its normal or desired operating temperature. Such an excessively high temperature can adversely affect the operational characteristics of the electrical component and the associated device.

[0004] To avoid or at least reduce the adverse operational characteristics from the heat generation, the heat should be removed, e.g., by conducting the heat from the operating electrical component to a heat spreader. The heat spreader can then be cooled by conventional convection and / or radiation techniques. During the conduction, the heat can be transferred from the operating electrical component to the heat spreader through direct surface contact between the electrical component and the heat spreader and / or through contact of the electrical component and the heat spreader surface via an intermediate medium or thermal interface material (TIM). Thermal interface materials can be used to fill the gap between the heat transfer surfaces in order to increase the heat transfer efficiency compared to filling the gap with air, which is a relatively poor heat conductor. SUMMARY

[0005] This section provides a general summary of the present disclosure and not a comprehensive disclosure of its full scope or all of its features.

[0006] Exemplary embodiments of thermal interface solutions for sliding surfaces are disclosed herein. In exemplary embodiments, a thermal interface material assembly includes a substrate having opposing first and second surfaces. A friction reducing layer is along the first surface of the substrate. A thermal interface material is along the second surface of the substrate such that the substrate is between the friction reducing layer and the thermal interface material. The friction reducing layer is configured to slide in contact with a first surface of a first component when the thermal interface material assembly is along a second surface of a second component and when the first surface and the second surface are slidably movable relative to each other.

[0007] Other applicable fields will become apparent from the description provided herein. The description and specific examples in the summary are intended merely as an aid for understanding the scope of the present disclosure and are not intended to limit the scope of the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0008] The drawings described herein are for purposes of illustration only and are not intended to limit the scope of the present disclosure.

[0009] Figure 1 is a cross-sectional view of a substrate (e.g., a polyimide (PI) or other polymer substrate, a metal substrate, etc.) including a friction-reducing coating (e.g., a polytetrafluoroethylene (PTFE) and / or a molybdenum disulfide (M0S2)-like friction-reducing coating, etc.) along a first side of the substrate of an exemplary embodiment of a thermal solution or thermal interface material assembly.

[0010] Figure 2 is a cross-sectional view of a thermal solution or thermal interface material assembly of an exemplary embodiment, in which a thermal interface material (TIM) (e.g., a thermal phase change material (PCM), etc.) and a pressure sensitive adhesive (PSA) are along Figure 1 opposing second side of the substrate shown.

[0011] Figure 3 exemplary embodiments of a thermal interface material assembly applied to a base or platform of an example heat sink are shown.

[0012] Figure 4 , Figure 5 and Figure 6 exemplary embodiments of a heat sink including a base or platform on which a thermal interface material assembly shown Figure 2 may be applied are shown.

[0013] Figure 7 exemplary embodiments of a heat sink shown Figure 4 , Figure 5 and Figure 6 positioned along a top of a cage of a small form-factor pluggable (SFP) fiber optic transceiver are shown.

[0014] Figure 8 exemplary embodiments of a heat sink shown Figure 7 and an SFP cage are shown, and further show a connector plug within a cavity defined by the cage of the SFP transceiver.

[0015] Figure 9 exemplary embodiments of a heat sink shown Figure 4 , Figure 5 and Figure 6 and further show first and second strips of adhesive material (e.g., a pressure sensitive adhesive, etc.) along opposing first and second edge portions of a heat sink base. A thermal interface material (e.g., a thermal phase change material (PCM), etc.) is along the heat sink base, within a channel or region generally defined between the first and second strips of adhesive material.

[0016] In several views of the drawings, corresponding reference numerals indicate corresponding parts throughout the several views. DETAILED DESCRIPTION

[0017] Example embodiments will now be described in greater detail below with reference to the accompanying drawings.

[0018] As the power of optical transceivers increases with increasing data transmission rates, more effective thermal transfer solutions are needed to avoid higher failure rates / poor reliability of optical cassette modules. Thus, a low thermal resistance interface between the optical transceiver and the heat sink is important to reduce the core temperature of the module, which should be able to withstand various sliding motions, such as server cassette maintenance purposes, etc. For example, the optical module is slidably inserted into and slidably pulled out of the enclosure from time to time. But conventional thermal interface materials can not have sufficient wear resistance to avoid damage during repeated insertion and pulling out of the optical module. In this case, the thermal performance of the conventional thermal interface material can be negatively affected by damage caused by repeated insertion and pulling out of the optical module into and from the enclosure.

[0019] Example embodiments of a thermal interface solution for a sliding surface are disclosed herein. In example embodiments, a thermal interface material assembly includes a substrate (e.g., a polymeric substrate, a polyimide film, a metal substrate, etc.) having opposing first and second surfaces. A friction-reducing layer is along the first surface of the substrate. The friction-reducing layer can include polytetrafluoroethylene (PTFE), molybdenum disulfide (MoS2), graphite, polyethylene, polypropylene, aluminum oxide, boron nitride, calcium fluoride, tungsten carbide, and / or aluminum. For example, the friction-reducing layer can include a polytetrafluoroethylene (PTFE), molybdenum disulfide (MoS2), graphite, polyethylene, polypropylene, aluminum oxide, boron nitride, calcium fluoride, tungsten carbide, and / or aluminum-based friction-reducing coating along the first surface of the substrate. A thermal interface material (e.g., a thermal phase change material (PCM), etc.) is along the second surface of the substrate, such that the substrate is between the friction-reducing layer and the thermal interface material. The friction-reducing layer is configured to slide in contact with a first surface of a first component (e.g., a housing of a transceiver, an enclosure, etc.) when the thermal interface material assembly is along a second surface of a second component (e.g., a heat sink, a connector plug, etc.) (e.g., adhered to the second surface via a pressure sensitive adhesive (PSA), etc.), and when the first surface of the first component and the second surface move slidably relative to each other.

[0020] Reference will now be made to the drawings, Figure 1An exemplary embodiment substrate 102 is shown that includes a friction reducing layer 106 along a first or upper side of the substrate 102. The substrate 102 can include a polyimide (PI) substrate, other polymeric substrate, metal substrate, or other substrate disclosed herein, etc. In an exemplary embodiment, the substrate 102 can include a polyimide film. The polyimide film can have a thermal conductivity of about 0.1 Watts per meter per Kelvin (W / m-K) to about 2 W / m-K, and a thickness of about 3 micrometers (pm) to about 50 pm. For example, the substrate 102 can include a non-metalized thermally conductive dielectric polyimide film (e.g., KAPTON 150MT+ polyimide film, etc.) having a thermal conductivity of about 0.8 W / m-K and a thickness of about 38 pm. As another example, the substrate 102 can include a polyimide film without any fillers having a thermal conductivity of about 0.15 W / m-K and a thickness of about 3 pm to about 50 pm. As another example, the substrate 102 can include a polyimide film without any fillers and having a thickness of about 7 pm (e.g., KAPTON 30EN polyimide film, etc.). Table 1 below lists properties of example substrates that can be included in the thermal interface assembly 100.

[0021] Table 1

[0022]

[0023] The friction reducing layer 106 can include polytetrafluoroethylene (PTFE), molybdenum disulfide (M0S2), graphite, polyethylene, polypropylene, aluminum oxide, boron nitride, calcium fluoride, tungsten carbide, and / or aluminum. For example, the friction reducing layer 106 can include a polytetrafluoroethylene (PTFE), molybdenum disulfide (M0S2), graphite, polyethylene, polypropylene, aluminum oxide, boron nitride, calcium fluoride, tungsten carbide, and / or aluminum-based friction reducing coating along a first surface of the substrate. The friction reducing layer 106 preferably has a relatively low coefficient of friction. The friction reducing layer 106 is preferably configured to have a lower coefficient of friction than the substrate 102. Thus, the friction reducing layer 106 can be configured to reduce the frictional resistance that would otherwise occur between the substrate 102 and a sliding surface. For example, the friction reducing layer 106 can have a coefficient of friction of less than 0.25 based on ASTM G133 with the following test conditions: needle tip radius 6.35 millimeters (mm), normal force 0.98 Newtons (N), stroke length 20 mm, oscillation frequency 0.5 Hertz (Hz), sinusoidal velocity profile, and test duration 16 hours and 40 seconds.

[0024] Further, by way of example, the friction reducing layer can include a polytetrafluoroethylene (PTFE) and / or molybdenum disulfide (M0S2) type friction reducing coating (e.g., MOLYKOTE D-96 or D-6600 friction reducing coating, etc.) applied (e.g., via spraying, dip spinning, brushing, coating, etc.) along the first surface of the substrate such that the coating thickness is about 1 micron to about 30 microns, for example, a coating thickness of 2 microns, 3 microns, 4 microns, 5 microns, 10 microns, 15 microns, 20 microns, 25 microns, 30 microns, etc.

[0025] Figure 2 An exemplary embodiment of a thermal solution or thermal interface material assembly 100 is shown. As shown, a thermal interface material (TIM) 110 (e.g., a thermal phase change material (PCM), etc.) and a pressure sensitive adhesive (PSA) 114 along opposite second sides of a substrate 102. The pressure sensitive adhesive 114 can be used to adhere the thermal interface material assembly 100 to another component, such as a heat sink in direct contact with a heat source, etc. As shown, the pressure sensitive adhesive 114 can be used to attach the thermal interface material assembly 100 to a base or platform 108 of a heat sink 104. Figure 3

[0026] A variety of thermal interface materials can be used Figure 2 The thermal interface material 110 shown, such as a thermal gap filler, a thermal phase change material, a thermally conductive EMI absorber or hybrid thermal / EMI absorber, a thermal caulk, a thermal pad, a thermal paste, and other thermal interface materials disclosed herein, etc. In an exemplary embodiment, the thermal interface material 110 includes a thermal phase change material having a thermal conductivity of at least 3 W / m-K. For example, the thermal interface material 110 can include a thermal phase change material having a thermal conductivity of about 7.5 W / m-K. The thermal interface material can be naturally tacky and / or self-adhesive to another surface of a component.

[0027] The pressure sensitive adhesive 114 can include first and second pressure sensitive adhesive layers or coatings along opposite first and second sides of a polymeric film (e.g., a polyethylene terephthalate film, a thermoplastic polymeric film, an organic heat spreader film, a flame resistant meta-aramid film, other aramid films, etc.). For example, the pressure sensitive adhesive 114 can include first and second pressure sensitive adhesive layers or coatings along opposite first and second sides of a polyethylene terephthalate film. In the latter example, the polyethylene terephthalate film can have a thickness of about 50 microns and the pressure sensitive adhesive can have a thickness of about 25 microns along each side of the polyethylene terephthalate film.

[0028] ​As another example, the pressure-sensitive adhesive 114 may include an organic heat spreader comprising a polymer film coated with a thermally conductive pressure-sensitive adhesive. The organic heat spreader may be configured to have a relatively high in-plane thermal conductivity (e.g., an in-plane thermal conductivity of approximately 50 W / m·K, etc.) that is higher than a through-plane thermal conductivity (e.g., approximately 0.2 W / m·K, etc.) and a high resistivity (e.g., greater than 1015 watts per centimeter (W·cm), etc.). The pressure-sensitive adhesive 114 may include a pressure-sensitive adhesive having a thickness of approximately 80 μm to approximately 200 μm, for example, 100 μm, 125 μm, 140 μm, 150 μm, 160 μm, etc.

[0029] Figure 4 、 Figure 5 and Figure 6 An example of a heat sink 104 (broadly, a heat removal / dissipation structure) is shown that includes a base or platform 108 (broadly, a portion). The base 108 protrudes outwardly from a surface of a first side 112 of the heat sink 104. A plurality of fins 116 protrude outwardly from a second side 120 of the heat sink 104, opposite the first side 112.

[0030] Just as a further example, Figure 7 and Figure 8 The thermal interface material assembly 100 ( Figure 2 ) is an exemplary embodiment for use with a small form-factor pluggable (SFP) fiber optic transceiver 144 (broadly, a device or component). Figure 8 As shown, heat sink 104 is positioned along the top of SFP cage 148 (broadly, housing) with base 108 facing downward relative to the top of SFP cage 148. Heat sink 104 may be attached to SFP cage 148 via one or more spring clips, screws, other mechanical fasteners, etc.

[0031] like Figure 8 As shown, the thermal interface material assembly 100 along the base 108 thermally contacts the portion 152 of the SFP connector plug 156 (broadly, the connector) when the portion 152 of the SFP connector plug 156 is slidably inserted into the cavity 162 defined by or within the SFP cage 148.

[0032] Furthermore, when the SFP connector plug 156 is slidably inserted into and slidably withdrawn from the cavity 162 of the SFP cage 148, the friction reducing layer 106 ( Figure 2 ) slides in contact with portion 152 of the SFP connector plug 156. The substrate 102 ( Figure 2) can be defined on the thermal interface material 110 and the pressure sensitive adhesive 114 such that the wear resistant layer is located between the portion 152 of the SFP connector plug 156 and the thermal interface material 110 and the pressure sensitive adhesive 114.

[0033] When the SFP connector plug 156 is slidably inserted into or removed from the cavity 162, the friction reducing layer 106 intervenes between the portion 152 of the SFP connector plug 156 and the heat sink 104 along the substrate 102. Accordingly, the friction reducing layer 106 along the substrate 102 prevents direct contact (e.g., direct sliding friction, etc.) between the thermal interface material 110 and the portion 152 of the SFP connector plug 156. This, in turn, helps to avoid a reduction in thermal performance of the thermal interface material 110 due to wear of the thermal interface material 110. The friction reducing layer 106 along the substrate 102 can be in thermal contact (e.g., direct physical contact, etc.) with the portion 152 of the SFP connector plug 156 when the SFP connector plug 156 is slidably inserted into the cavity 162. The thermal contact of the friction reducing layer 106 with the portion 152 of the SFP connector plug 156 can reduce the thermal transfer resistance along the interface therebetween. With the reduced thermal transfer resistance, heat generated by the optical module or transceiver 144 can be improved and / or well transferred.

[0034] As an example, the pressure sensitive adhesive 114 can be disposed around an outer periphery of the thermal interface material 110 along an edge portion of the thermal interface material 110 such that the pressure sensitive adhesive 114 is located between the substrate 102 and the heat sink base 108 and adheres the substrate 102 to the heat sink base 108. The pressure sensitive adhesive 114 can be configured to provide a reinforcement along the edge portion of the thermal interface material 110 that is parallel to and / or perpendicular to a direction in which the portion 152 of the SFP connector plug 152 is slidably inserted into and removed from the cavity 162 of the SFP cage 148. The reinforcement along the edge portion of the thermal interface material 110 can absorb compression forces and help to confine the thermal interface material 110 within a channel or area generally defined between portions (e.g., strips, etc.) of the pressure sensitive adhesive material 114 when the portion 152 of the SFP connector plug 152 is slidably inserted into or removed from the cavity 162 of the SFP cage 148, thereby helping to maintain the integrity of the thermal interface material 110 and inhibit migration of the thermal interface material 110.

[0035] Continuing Figure 8In the example shown in FIG, when the connector plug 156 is within the housing 148, the thermal interface material assembly 100 can be generally positioned between the heat sink 104 and the connector plug 156. The thermal interface material assembly 100 and the heat sink 104 can collectively define or establish at least a portion of a thermally conductive heat path from the connector plug 156 to the heat sink 116 of the heat sink 104. Heat can be transferred along this thermally conductive heat path from the connector plug 156 to the thermal interface material assembly 100, from the thermal interface material assembly 100 to the heat sink 104, and from the heat sink 116 to another heat removal / dissipation structure (e.g., a heat spreader, etc.) and / or to the environment. The heat transfer can reduce the temperature of the housing 148 and the connector 156, thereby helping to maintain the temperature of the housing 148 and the connector 156 below a specified threshold, etc. The thermal interface material 110 and the heat sink 104 can include any suitable materials, constructions, etc. suitable for reducing the temperature of the housing 148 and the connector 156. For example, the materials and configurations can be selected so that the thermal interface material 110 and the heat sink 104 are capable of dissipating heat at a rate sufficient to maintain the temperature of the cage 148 and the connector 156 below a certain threshold temperature at which operation of the connector 156 would be impaired. The transfer of heat to the thermal interface material 110 can reduce the amount of heat transferred from the connector 156 to another component, such as a printed circuit board (PCB) of the SFP transceiver 144, thereby reducing the amount of heat that can be further dissipated from the PCB to more heat-sensitive components.

[0036] Thermal interface material assembly 100( Figure 2 ) of the pressure sensitive adhesive 114 may include, for example Figure 9 The first and second adhesive material strips 124, 128 are shown. The first and second adhesive material strips 124, 128 can be arranged along (eg, completely and continuously along without any gaps, etc.) the opposing first and second edges 132, 136 ( Figure 4 The first and second strips of adhesive material 124, 128 can be configured to provide reinforcement along edge portions of the thermal interface material 110, which helps confine the thermal interface material 110 to the area defined by the first and second reinforcement / adhesive material strips 124, 128, thereby inhibiting migration of the thermal interface material 110.

[0037] As an example, the first and second adhesive material strips 124, 128 may include a polyethylene terephthalate or polyimide film including a pressure-sensitive adhesive along opposing first and second sides of the film. Alternatively, other materials may be used for the adhesive materials 124, 128, such as a material that is harder, less compliant, more durable, and / or less susceptible to wear than the thermal interface material 110. Additionally, other exemplary embodiments may include adhesive material strips along a discontinuous pattern (e.g., spaced-apart strip portions with gaps therebetween, etc.) that is less than the entire length of the base edge and / or along the base edge and / or along other edges of the base. For example, another exemplary embodiment may include four adhesive material strips along each of the four edges of a rectangular base. Additionally, other exemplary embodiments may include a heat sink having a non-rectangular base and / or adhesive material strips that are not all made of the same material.

[0038] like Figure 9 As shown, thermal interface material 110 can be applied along heat sink base 108 in a channel or region generally defined between first and second reinforcement / adhesive material strips 124, 128. Substrate 102 can be disposed on thermal interface material 110 such that when portion 152 of SFP connector plug 156 is slidably inserted into cavity 162 defined by or within SFP cage 148, friction reducing layer 106 ( Figure 1 ) to make sliding contact with portion 152 of SFP connector plug 156 (broadly, connector). First and second reinforcement / adhesive material strips 124, 128 are located between substrate 102 and heat sink base 108 and adhered thereto.

[0039] The thermal interface material assembly disclosed herein (e.g., 100( Figure 2 ) can be used with a wide range of devices and components. Therefore, aspects of the present disclosure are not limited to use with only heat sinks, as the thermal interface material assemblies disclosed herein can be used with other heat removal / dissipation structures and / or components, such as heat removal / dissipation structures that are part of the housing or cover itself, heat pipes, vapor chambers, heat spreaders, cold plates, etc. The thermal interface material assemblies disclosed herein can be used with connector plugs, slidable portions of tablets or other modular portable devices, covers for transceivers, such as small form factor pluggable (SFP) transceivers, SFP+ transceivers, quad small form factor pluggable (QSFP) transceivers, QSFP+ transceivers, XFP transceivers, etc.

[0040] As background technology, small form factor pluggable (SFP) fiber optic transceiver is a compact hot-swappable transceiver that can be used for telecommunications, data communication applications, etc. SFP transceivers can interface network equipment motherboards (e.g., for switches, routers, media converters, etc.) to optical fiber or copper network cables. SFP transceivers can support communication standards including SONET, Gigabit Ethernet, Fibre Channel, etc. As used herein, small form factor pluggable (SFP) can also include other small form factor pluggables such as SFP+, quad (4-channel) small form factor pluggable (QSFP), QSFP+, etc., or use with reference to these devices.

[0041] A conventional SFP transceiver assembly may include a pluggable module or a connector plug and a receptacle assembly, which in turn is mounted on a printed circuit board (PCB). The pluggable module may be configured to be inserted into a front opening and a cavity defined by a cover of the receptacle assembly. The pluggable module may include a housing having a portion that is held against a heat sink (e.g., under moderate pressure, etc.) after the pluggable module is inserted into the cover. The pluggable module may then be removed from the cover of the receptacle assembly. The connector plug or pluggable module may be inserted into and removed from a cover (e.g., a QSFP cover, etc.) multiple times. Furthermore, the insertion / removal process may be performed at elevated temperatures, such as when the contact temperature is above 75 degrees Celsius (°C), etc.

[0042] hood (e.g., Figure 7 The housing (e.g., housing 148 in the drawings) can be any suitable housing capable of accommodating an SFP connector. The housing can have dimensions corresponding to the SFP connector, such that the SFP cable connector plug can be inserted into the housing. The housing can accommodate the cable connector plug via any suitable releasable engagement, including, but not limited to, a friction fit, a snap fit, etc. The housing can include an interface for transmitting and / or receiving signals via the SFP connector, such as an optical cable interface, an electrical cable interface, etc. The interface can enable communication from the cable connector to a motherboard, a printed circuit board (PCB), a network card, etc., mounted on a cage.

[0043] hood (e.g., Figure 7 The cover 148 in the embodiment (e.g., the cover 148 in the embodiment) may comprise any suitable material, including metal, etc. For example, the cover may comprise a material suitable for shielding noise generated by data transmission through the cable connector plug (e.g., electromagnetic interference (EMI) shielding, etc.). Alternative embodiments may include other devices, such as other transceivers (e.g., SFP+ transceivers, XFP transceivers, QSFP transceivers, QSFP+ transceivers, etc.), devices having a housing or cover configured for use with connectors other than SFP cable connectors, etc. Therefore, aspects of the present disclosure should not be limited to SFP transceivers and SFP cable connectors.

[0044] A wide range of thermal interface materials can be used for the thermal interface material 110, such as thermal gap fillers, thermal phase change materials, thermally conductive EMI absorbers or hybrid thermal / EMI absorbers, thermal putties, thermal pads, thermal pastes, etc. For example, the thermal interface material 110 preferably has a low effective thermal resistance (e.g., less than 2 °C / W, less than 0.2 °C / W, about 0.2 °C / W to about 2 °C / W, etc.). In example implementations, the thermal interface material 110 has a higher thermal conductivity than each of the substrate 102, the friction-reducing coating 106, and the reinforcing / adhesive material 114. The thermal interface material 110 can be softer, more compliant, less durable, and / or more prone to wear than the substrate 102 and the reinforcing / adhesive material 114. However, as disclosed herein, the thermal interface material assembly can provide sufficient durability and resistance to wear for the thermal interface material, allowing the thermal interface material to withstand and / or survive sliding operations (e.g., repeated connector plug insertion into and / or removal from a housing of a transceiver, sliding mounting of components, etc.) including at elevated temperatures (e.g., 75 °C or more, etc.).

[0045] In some implementations, the thermal interface material can include a silicone elastomer. The silicone elastomer can be filled with suitable thermally conductive materials, including ceramics, boron nitride, etc. In some implementations, the thermal interface material can include a graphite sheet; a metal foil; a multi-layer structure, such as a multi-layer structure of metal and plastic, a multi-layer structure of metal and graphite, or a multi-layer structure of metal, graphite, and plastic.

[0046] The thermal interface material can include an elastomer and / or ceramic particles, metal particles, ferrite EMI / RFI absorbing particles, metal or glass fiber mesh in a rubber, gel, or wax, etc. base. The thermal interface material can include a compliant or conformable silicone pad, a non-silicone-based material (e.g., a non-silicone-based gap filler, a thermoplastic and / or thermoset polymer, an elastomeric material, etc.), a wire mesh material, a polyurethane foam or gel, a thermally conductive additive, etc. The thermal interface material can be configured to have sufficient conformability, compliance, and / or flexibility (e.g., without necessarily undergoing a phase change or reflow, etc.) to adjust for tolerances or gaps and / or allow the thermal interface material to conform closely (e.g., in a relatively close match and package) to mating surfaces when in contact (e.g., pressed against, etc.) with the mating surfaces, including non-planar, curved, or uneven mating surfaces, by deflecting at low temperatures (e.g., room temperature of 20 °C to 25 °C, etc.).

[0047] The thermal interface material can include a soft thermal interface material formed from an elastomer and at least one thermally conductive metal, boron nitride, and / or ceramic filler, such that the soft thermal interface material is conformable even without undergoing a phase change or reflow. In some example implementations, the thermal interface material can include a ceramic-filled silicone elastomer, a boron nitride-filled silicone elastomer, or a thermal phase change material including a generally non-reinforced film.

[0048] Exemplary embodiments can include one or more thermal interface materials having high thermal conductivity (e.g., 1 W / m-K (watts per meter per Kelvin), 1.1 W / m-K, 1.2 W / m-K, 2.8 W / m-K, 3 W / m-K, 3.1 W / m-K, 3.8 W / m-K, 4 W / m-K, 4.7 W / m-K, 5 W / m-K, 5.4 W / m-K, 6 W / m-K, 7.5 W / m-K, etc.), depending on the particular materials used to manufacture the thermal interface material and the percentage loading of thermally conductive filler, if present. These thermal conductivities are merely examples, as other embodiments can include thermal interface materials having thermal conductivities higher than 7.5 W / m-K, less than 1 W / m-K, or other values and ranges between 1 W / m-K and 7.5 W / m-K. Accordingly, aspects of the present disclosure should not be limited to use with any particular thermal interface material, as exemplary embodiments can include a wide range of thermal interface materials.

[0049] Exemplary embodiments disclosed herein can provide or include one or more of the following advantageous effects or features (but not necessarily any or all). For example, the thermal interface solutions disclosed herein can reduce thermal resistance between a module and a heat sink, and provide temperature reduction for higher power transceivers, while also being able to withstand several hundred cycles (e.g., 500 cycles or more, etc.) of plugging and unplugging. Thermal performance of the thermal solutions disclosed herein (e.g., thermal interface material assembly 100 Figure 2 ) and the like) has been measured, which has shown unexpected synergistic effects: performance improvement of at least 5 °C temperature reduction at about 20 Watts, and ability to withstand 500 hundred cycles of plugging and unplugging. Accordingly, exemplary thermal interface solutions disclosed herein can provide higher temperature gain, better mechanical performance, and / or cost efficiency / synergies compared to conventional thermal interface materials.

[0050] Table 2 below includes thermal performance measurements for two exemplary thermal interface material assemblies (TIMAs) having a friction-reducing layer along a polymer layer. Table 2 also includes thermal performance measurements for a thermal interface material assembly (TIMA) that does not include a friction-reducing layer, for comparison purposes. Table 2 also includes thermal performance measurements for a test case (empty control) that does not include any thermal interface material assembly (TIMA) between the surfaces. Table 2 shows that the two exemplary thermal interface material assemblies have synergistic effects in terms of thermal performance (e.g., improvement of at least 5 °C temperature reduction at about 20 Watts) and ability to withstand 500 hundred cycles of plugging and unplugging.

[0051] For the thermal interface material assembly (TIMA) without a friction-reducing layer, the TIMA includes a 38-micron thick thermally conductive polyimide film (e.g., KAPTON 150MT+ polyimide film, etc.) and a pressure sensitive adhesive.

[0052] For a first exemplary thermal interface material assembly (TIM) with a friction reducing layer, the TIM includes a 3-micron thick friction reducing coating (e.g., MOLYKOTE D-96 friction reducing coating, etc.) on a 7-micron thick polyimide film (e.g., KAPTON 30EN polyimide film, etc.) without filler. The TIM also includes a pressure sensitive adhesive.

[0053] For a second exemplary thermal interface material assembly (TIM) with a friction reducing layer, the TIM includes a 3-micron thick friction reducing coating (e.g., MOLYKOTE D-96 friction reducing coating, etc.) on a 38-micron thick thermally conductive polyimide film (e.g., KAPTON 150MT+ polyimide film, etc.). The TIM also includes a pressure sensitive adhesive.

[0054] In Table 2 below, AT(Core-Rm) is the difference between the test case core temperature and room temperature. AT(TIMA-Blank Control) is the temperature gain of the thermal interface material assembly (TIM) relative to the blank control test.

[0055] Table 2

[0056]

[0057] Table 2 shows that the TIM assembly without any friction reducing layer between the surfaces provides only a -3.8 degree Celsius temperature reduction compared to the test case without any TIM assembly. By comparison, Table 2 shows that the TIM assembly with a friction reducing layer provides significantly higher temperature reductions of -5.4 and -5.3 degree Celsius compared to the test case without any TIM assembly. And, the TIM assembly with a friction reducing layer further provides temperature reduction improvements of 1.5 and 1.6 degree Celsius compared to the TIM assembly without any friction reducing layer. Thus, a thermal interface material assembly (e.g., 100, etc.) including a friction reducing layer as shown in Table 2 can greatly improve performance, reliability, and stability. Figure 2 Figure 8 Figure 2 Figure 9 Figure 4 Figure 9 Figure 1 Figure 2 Figure 7 Figure 7 Figure 2 Figure 2

[0058] ​The example implementations disclosed herein can provide or include one or more of the following advantageous effects or features (but not necessarily any or all). By placing (e.g., adhering, etc.) the thermal interface material assembly along or on a surface of the optical module (broadly, the second component), a friction-reducing layer of the thermal interface material assembly faces an inner surface of the cavity of the housing (broadly, the first component). The friction-reducing layer can thus contact (e.g., frictional contact, slidable contact, etc.) the inner surface of the cavity as the optical module is slidably inserted or slidably removed via the opening of the cavity, rather than having a surface of the optical module contact the inner surface of the cavity. Direct contact and direct friction between the optical module and the inner surface of the cavity of the housing is thereby avoided. This also reduces wear of the thermal interface material, which would otherwise reduce the thermal transfer capabilities of the thermal interface material. The friction-reducing layer can along the inner surface of the cavity (e.g., in direct thermal contact with the inner surface of the cavity, etc.) as the optical module is inserted into the cavity of the housing, which can help reduce the thermal resistance along the interface and transfer heat generated by the optical module to the inner surface, thereby providing good thermal performance.

[0059] Accordingly, example implementations of a thermal interface solution for a sliding surface are disclosed. In example implementations, a thermal interface material assembly includes a substrate having opposing first and second surfaces. A friction-reducing layer is along the first surface of the substrate. A thermal interface material is along the second surface of the substrate such that the substrate is between the friction-reducing layer and the thermal interface material. The friction-reducing layer is configured to slide in contact with a first surface of a first component as the thermal interface material assembly is along a second surface of a second component and as the first and second surfaces are slidably moved relative to one another.

[0060] In example implementations, the friction-reducing layer includes polytetrafluoroethylene (PTFE), molybdenum disulfide (MoS2), graphite, polyethylene, polypropylene, aluminum oxide, boron nitride, calcium fluoride, tungsten carbide, and / or aluminum. In such example implementations, the friction-reducing layer can include a friction-reducing coating of polytetrafluoroethylene (PTFE), molybdenum disulfide (MoS2), graphite, polyethylene, polypropylene, aluminum oxide, boron nitride, calcium fluoride, tungsten carbide, and / or aluminum along the first surface of the substrate. The friction-reducing layer is configured to have a lower coefficient of friction than the substrate. For example, the friction-reducing layer can be configured to have a coefficient of friction less than 0.25.

[0061] In example implementations, the friction-reducing layer includes polytetrafluoroethylene and / or molybdenum disulfide. For example, the friction-reducing layer can include a friction-reducing coating of polytetrafluoroethylene and / or molybdenum disulfide along the first surface of the substrate. The friction-reducing layer is configured to have a lower coefficient of friction than the substrate. For example, the friction-reducing layer can be configured to have a coefficient of friction less than 0.25.

[0062] In example embodiments, the substrate comprises a polymeric substrate or a metallic substrate. For example, the substrate can comprise a dielectric polyimide substrate.

[0063] In example embodiments, the substrate comprises a dielectric polyimide film. The friction reducing layer comprises a friction reducing coating along the first surface of the substrate. The friction reducing coating comprises polytetrafluoroethylene and / or molybdenum disulfide. The friction reducing layer has a coefficient of friction less than 0.25 and less than a coefficient of friction of the dielectric polyimide film. The thermal interface material comprises a thermal phase change material having a thermal conductivity of at least 3 Watts per meter per Kelvin. The thermal interface material assembly further comprises a pressure sensitive adhesive that adheres the thermal interface material assembly to the second surface of the second component.

[0064] In example embodiments, the thermal interface material comprises a thermal phase change material having a thermal conductivity of at least 3 Watts per meter per Kelvin.

[0065] In example embodiments, the thermal interface material assembly is adhered to the second surface of the second component. The thermal interface material assembly can be adhered to the second surface of the second component using a pressure sensitive adhesive. The pressure sensitive adhesive can comprise a first pressure sensitive adhesive layer and a second pressure sensitive adhesive layer along opposing first and second sides of a polymeric film (e.g., a polyethylene terephthalate film, etc.).

[0066] In example embodiments, the thermal interface material can comprise an edge portion defining an outer periphery. The pressure sensitive adhesive can be disposed along the edge portion of the thermal interface material around the outer periphery of the thermal interface material such that the pressure sensitive adhesive is interposed between and adheres the second surface of the substrate to the second surface of the second component. The pressure sensitive adhesive can provide or define a reinforcement along the edge portion of the thermal interface material that is parallel to and / or perpendicular to a direction in which the second surface of the second component is slidable relative to the first surface of the first component when the thermal interface material assembly is positioned between the first and second surfaces of the respective first and second components. The pressure sensitive adhesive can provide or define a reinforcement along the edge portion of the thermal interface material that helps to confine the thermal interface material within an area defined by the reinforcement, thereby inhibiting migration of the thermal interface material.

[0067] In example embodiments, the substrate defines an abrasion resistant layer over the thermal interface material.

[0068] In example embodiments, the thermal interface material is naturally tacky and / or self-adheres to the second surface of the second component.

[0069] In example embodiments, the substrate is adhered to the second surface of the second component such that the substrate is disposed over the thermal interface material, whereby the adherence of the substrate to the second surface of the second component maintains the positioning of the thermal interface material relative to the second surface of the second component.

[0070] In example embodiments, the substrate comprises a polyimide film. For example, the substrate can comprise a polyimide film having a thermal conductivity of 0.1 to 2 Watts per meter per Kelvin and a thickness of 3 micrometers to 130 micrometers.

[0071] In example embodiments, the thermal interface material is configured to have a thermal conductivity of at least 7.5 Watts per meter per Kelvin.

[0072] In example embodiments, the second component comprises a heat sink comprising a second surface along which the thermal interface material assembly is disposed.

[0073] In example embodiments, the thermal interface material is configured to provide a temperature reduction of at least 5°C at 20 Watts and improved performance through at least 500 plug cycles.

[0074] In example embodiments, the heat sink comprises the thermal interface material assembly.

[0075] In example embodiments, the heat sink comprises a protrusion projecting outwardly from a surface of a first side of the heat sink and one or more fins projecting outwardly from a second side of the heat sink opposite the first side. The thermal interface material assembly is along the protrusion of the heat sink.

[0076] In example embodiments, the device comprises a heat sink and a housing adapted to slidably receive a connector. A friction reducing layer of the thermal interface material assembly slidably contacts a portion of the connector when the connector is slidably received within the housing or removed from the housing. The thermal interface material assembly is positioned between the connector and the heat sink when the connector is slidably received within the housing, whereby the thermal interface material assembly defines at least a portion of a thermally conductive heat path between the connector and the heat sink.

[0077] In example embodiments, the device is a small form factor pluggable transceiver. The connector is a small form factor pluggable cable connector. The housing is a small form factor pluggable cover adapted to receive the small form factor pluggable cable connector.

[0078] In example embodiments, the device comprises a housing having a cavity, the housing comprising an opening and an inner surface within the cavity. The device further comprises a component having a surface corresponding to the inner surface within the cavity of the housing. The component is configured to be slidably inserted into and removed from the cavity through the opening. The thermal interface material assembly is along the surface of the component. The thermal interface material assembly is configured such that, when the component is within the cavity, a friction reducing layer of the thermal interface material assembly faces the inner surface within the cavity of the housing. The friction reducing layer contacts the inner surface within the cavity of the housing when the component is slidably inserted into or removed from the cavity through the opening.

[0079] In example embodiments, one or more fins project outwardly from a wall of the housing.

[0080] In an example embodiment, the component includes a connector. The housing includes a cover including a cavity configured to receive the connector.

[0081] In an example embodiment, the device is a small form-factor pluggable transceiver. The component includes a small form-factor pluggable cable connector. The housing is a small form-factor pluggable cover including a cavity configured to house the small form-factor pluggable cable connector.

[0082] In an example embodiment, the device is an opto-electrical conversion device. The component is an optical module including a surface corresponding to an inner surface within the cavity of the housing. The thermal interface material assembly is along the surface of the optical module.

[0083] The example embodiments are provided so that the present disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. Those skilled in the art will recognize, however, that the example embodiments can be practiced without the specific details given, that numerous implementation- specific decisions can be made to the example embodiments, and that the present disclosure is not to be limited by the specific details given. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail unless their understanding is critical to understanding the present disclosure. Additionally, advantages and improvements provided by one or more example embodiments can be provided for illustrative purposes only and are not limiting as to the scope of the present disclosure (as example embodiments disclosed herein can provide all or none of the advantages and improvements described and still fall within the scope of the present disclosure).

[0084] The particular dimensions, materials, and / or shapes disclosed herein are by way of example only and without limitation. The disclosure of particular values and particular ranges of values for a given parameter in this disclosure is not to be taken as an exclusion of other values and ranges of values for that parameter unless expressly identified as an exclusion. Moreover, it is contemplated that any two specifically recited values for a given parameter can define the endpoints of a range of values for that parameter (i.e., the disclosure of a first value and a second value for a given parameter can be interpreted as disclosing that the first value and the second value are the endpoints of a range of values that also includes any value therebetween). For example, if a parameter X is exemplified herein as having a value A and also as having a value Z, it is contemplated that parameter X can have a range of values from about A to about Z. Similarly, it is contemplated that the disclosure of two or more value ranges for a parameter, whether such ranges are nested, overlapping, or distinct, includes all possible combinations of the values within the ranges that can be used as endpoints for the ranges. For example, if a parameter X is exemplified herein as having a range of 1-10 or 2-9 or 3-8, it is also contemplated that parameter X can have other value ranges including 1-9, 1-8, 1-3, 1-2, 2-10, 2-8, 2-3, 3-10, and 3-9.

[0085] The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" can be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having," are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order

[0086] When an element or layer is referred to as being "on," "engaged to," "connected to," or "coupled to" another element or layer, it can be directly on, engaged, connected, or coupled to the other element or layer, or one or more intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in the same way (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0087] The term "about" when applied to a value indicates that the calculation or measurement is permitted to vary slightly from the nominal value (close to the name; near or reasonably near the value; almost). If for some reason the inaccuracy provided by "about" is not otherwise understood in the art in that ordinary sense, "about" as used herein indicates at least variation that can be caused by ordinary measurement methods or use of such parameters. For example, the terms "substantially," "about," and "approximately" can be used herein to mean within manufacturing tolerances.

[0088] Although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not connote an order, unless specifically stated otherwise. Thus, a first element, component, region, layer or section can later be referred to as a second element, component, region, layer or section without departing from the teachings of the example embodiments.

[0089] Spatially relative terms such as "inner," "outer," "beneath," "below," "lower," "above," "upper," and the like can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms can be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0090] The foregoing description of implementations has been presented for the purposes of exemplification and description. It is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Independent elements of a specific implementation can generally be interchanged with each other and the intended or described use or features of a particular implementation are generally not limited to that particular implementation, but instead are applicable in any other selected implementations, even if not specifically shown or described in that implementation. The same can hold true for the same or similar elements, features or uses. Such variations can not be elaborated on in the foregoing description and can be understood as within the scope of the disclosure.

Claims

1. A thermal interface material assembly comprising: a substrate having opposing first and second surfaces; a friction reducing layer along the first surface of the substrate; and a thermal interface material along a second surface of the substrate such that the substrate is positioned between the anti-friction layer and the thermal interface material, wherein the anti-friction layer is configured to have a lower coefficient of friction than the substrate, and the thermal interface material has a higher thermal conductivity than each of the substrate and the anti-friction layer, The anti-friction layer comprises an anti-friction coating based on polytetrafluoroethylene, molybdenum disulfide, graphite, polyethylene, polypropylene, aluminum oxide, boron nitride, calcium fluoride, tungsten carbide and / or aluminum along the first surface of the substrate, The substrate comprises a polymer substrate or a metal substrate, The thermal interface material comprises a thermal phase change material having a thermal conductivity of at least 3 watts per meter per kelvin, and The anti-friction layer is configured to contact the first surface of the first component and slide along the first surface of the first component when the thermal interface material assembly is along the second surface of the second component and when the first surface of the first component and the second surface of the second component are slidably moved relative to each other.

2. The thermal interface material assembly of claim 1, wherein: The anti-friction layer is configured to have a coefficient of friction less than 0.

25.

3. The thermal interface material assembly of claim 1, wherein: The anti-friction layer comprises an anti-friction coating based on polytetrafluoroethylene and / or molybdenum disulfide.

4. The thermal interface material assembly of claim 1, wherein: The anti-friction layer comprises polytetrafluoroethylene and / or molybdenum disulfide.

5. The thermal interface material assembly of claim 1, wherein: The friction-reducing layer comprises polytetrafluoroethylene, molybdenum disulfide, graphite, polyethylene, polypropylene, aluminum oxide, boron nitride, calcium fluoride, tungsten carbide and / or aluminum.

6. The thermal interface material assembly of claim 1, wherein: The friction-reducing layer comprises polytetrafluoroethylene and / or molybdenum disulfide; and The anti-friction layer is configured to have a coefficient of friction less than 0.25, which is lower than a coefficient of friction of the substrate.

7. The thermal interface material assembly of claim 1, wherein: The substrate includes a dielectric polyimide substrate.

8. The thermal interface material assembly of claim 1, wherein: The substrate includes a dielectric polyimide film; The anti-friction layer comprises an anti-friction coating along the first surface of the substrate, the anti-friction coating comprising polytetrafluoroethylene and / or molybdenum disulfide, the friction coefficient of the anti-friction layer being less than 0.25 and less than the friction coefficient of the dielectric polyimide film; The thermal interface material comprises a thermal phase change material having a thermal conductivity of at least 3 watts per meter per kelvin; and The thermal interface material assembly also includes a pressure sensitive adhesive that adheres the thermal interface material assembly to the second surface of the second component.

9. The thermal interface material assembly of claim 1, wherein: The thermal interface material includes a thermal phase change material having a thermal conductivity of at least 3 watts per meter per kelvin.

10. The thermal interface material assembly of claim 1, wherein: The thermal interface material assembly is adhered to the second surface of the second component.

11. The thermal interface material assembly of claim 10, further comprising a pressure sensitive adhesive adhering the thermal interface material assembly to the second surface of the second component.

12. The thermal interface material assembly of claim 11, wherein: The pressure sensitive adhesive includes first and second pressure sensitive adhesive layers along opposing first and second sides of a polymer film.

13. The thermal interface material assembly of claim 11, wherein: The pressure sensitive adhesive includes first and second pressure sensitive adhesive layers along opposing first and second sides of a polyethylene terephthalate film.

14. The thermal interface material assembly of claim 11, wherein: The thermal interface material includes an edge portion defining an outer perimeter; and The pressure sensitive adhesive is disposed around an outer perimeter of the thermal interface material along an edge portion of the thermal interface material such that the pressure sensitive adhesive is interposed between the second surface of the substrate and the second surface of the second component and adheres the second surface of the substrate to the second surface of the second component.

15. The thermal interface material assembly of claim 14, wherein: When the thermal interface material assembly is positioned between a first surface of a first component and a second surface of a second component, the pressure sensitive adhesive provides reinforcement along an edge portion of the thermal interface material that is parallel to and / or perpendicular to a direction in which the second surface of the second component is slidable relative to the first surface of the first component.

16. The assembly of claim 14, wherein: The pressure sensitive adhesive provides reinforcement along edge portions of the thermal interface material, helping to confine the thermal interface material within an area defined by the reinforcement, thereby inhibiting migration of the thermal interface material.

17. The thermal interface material assembly of claim 1, wherein: The substrate defines a wear resistant layer on the thermal interface material.

18. The thermal interface material assembly of claim 1, wherein: The thermal interface material is naturally tacky and / or self-adhering to the second surface of the second component.

19. The thermal interface material assembly of claim 1, wherein: The substrate is adhered to the second surface of the second component such that the substrate is disposed on the thermal interface material, whereby adhesion of the substrate to the second surface of the second component maintains positioning of the thermal interface material relative to the second surface of the second component.

20. The thermal interface material assembly of claim 1, wherein: The substrate includes a polyimide film having a thermal conductivity of 0.1 to 2 watts per meter per Kelvin and a thickness of 3 to 130 micrometers.

21. The thermal interface material assembly of claim 1, wherein: The thermal interface material is configured to have a thermal conductivity of at least 7.5 watts per meter per kelvin.

22. The thermal interface material assembly of claim 1, wherein: The second component includes a heat sink having a second surface, and the thermal interface material assembly is disposed along the second surface.

23. A heat sink comprising the thermal interface material assembly according to any one of claims 1 to 22.

24. The heat sink according to claim 23, wherein The heat sink includes: a protrusion protruding outward from a surface of a first side of the heat sink, and one or more fins protruding outward from a second side of the heat sink opposite to the first side; and The thermal interface material assembly is along the protrusion of the heat sink.

25. A device comprising a heat sink and a housing adapted to slidably receive a connector, the heat sink being the heat sink of claim 23, wherein: The anti-friction layer slidably contacts a portion of the connector when the connector is slidably received within or removed from the housing, and wherein the thermal interface material assembly is positioned between the connector and the heat sink when the connector is slidably received within the housing, whereby the thermal interface material assembly defines at least a portion of a thermally conductive heat path between the connector and the heat sink.

26. The apparatus of claim 25, wherein: The device is a small form factor pluggable transceiver; The connector is a small form-factor pluggable cable connector; and The housing is a small form-factor pluggable hood adapted to receive the small form-factor pluggable cable connector.

27. A device using the thermal interface material assembly according to any one of claims 1 to 22, comprising: a housing having a cavity, the housing including an opening and an inner surface within the cavity; a component having a surface corresponding to an interior surface within the cavity of the housing, the component being configured to be slidably inserted into and slidably removed from the cavity through the opening; and The thermal interface material assembly of any one of claims 1 to 22 along a surface of the component, the thermal interface material assembly being configured such that when the component is within the cavity, the anti-friction layer faces the inner surface within the cavity of the housing, whereby when the component is slidably inserted into or removed from the cavity through the opening, the anti-friction layer contacts the inner surface within the cavity of the housing.

28. The apparatus of claim 27, further comprising one or more cooling fins projecting outwardly from a wall of the housing.

29. The apparatus of claim 27, wherein: The component includes a connector; and The housing includes a shroud including a cavity configured to receive the connector.

30. The apparatus of claim 27, wherein: The device is a small form-factor pluggable transceiver, the component includes a small form-factor pluggable cable connector, and the housing is a small form-factor pluggable cage including a cavity configured to receive the small form-factor pluggable cable connector.

31. The apparatus of claim 27, wherein: The device is a photoelectric conversion device, the component is an optical module including a surface corresponding to an inner surface of the cavity of the housing, and the thermal interface material assembly is along the surface of the optical module.

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