A laser processing system and laser processing control method

Abstract

This invention provides a laser processing system and a laser processing control method. The laser processing system includes: a host computer module; a control module electrically connected to the host computer module; multiple galvanometer modules, each electrically connected to the control module; and a servo drive module electrically connected to the control module. The host computer module generates a processing trajectory code based on the shape data of the workpiece to be processed and transmits the processing trajectory code to the control module. The control module generates motion control information for the galvanometer modules and the servo drive modules based on the processing trajectory code. The control module collects the position information of the galvanometer modules and the servo drive modules, and controls the galvanometer modules and the servo drive modules to perform coordinated processing based on the position information and the motion control information. This invention can improve the accuracy of laser splicing processing while reducing the hardware cost of the laser processing system.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and in particular to a laser processing system and a laser processing control method. Background Technology

[0002] Laser galvanometer processing technology has been widely used in laser processing, polishing, and photopolymerization processes due to its high speed and precision.

[0003] In existing technologies, large-format laser cutting typically employs methods such as galvanometer splicing or dedicated control card linkage control. The galvanometer splicing method suffers from low processing efficiency and poor cutting accuracy at the splicing points. The dedicated control card linkage control method requires each galvanometer to be equipped with a separate dedicated control card, resulting in high cost, poor scalability, and compromised technology confidentiality. Therefore, improvements are needed. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a laser processing system and a laser processing control method to solve the problems of low efficiency, poor cutting accuracy and high hardware cost in the existing laser large-format cutting process.

[0005] To achieve the above and other related objectives, the present invention provides a laser processing system, comprising:

[0006] Host computer module;

[0007] The control module is electrically connected to the host computer module;

[0008] Multiple galvanometer modules, each of which is electrically connected to the control module; and

[0009] The servo drive module is electrically connected to the control module;

[0010] The host computer module generates a machining trajectory code based on the shape data of the workpiece to be processed, and transmits the machining trajectory code to the control module.

[0011] The control module generates motion control information for the galvanometer module and the servo drive module based on the machining trajectory code;

[0012] The control module acquires the position information of the galvanometer module and the servo drive module, and controls the galvanometer module and the servo drive module to perform linkage processing based on the position information and the motion control information.

[0013] In one embodiment of the present invention, the galvanometer module includes:

[0014] The galvanometer control unit is electrically connected to the control module;

[0015] The signal selection unit is electrically connected to the galvanometer control unit;

[0016] The galvanometer unit is electrically connected to the signal selection unit; and

[0017] The laser unit is electrically connected to the galvanometer control unit.

[0018] In one embodiment of the present invention, the control module includes a processing unit and a servo control unit, wherein the servo control unit is electrically connected to the servo drive module.

[0019] In one embodiment of the present invention, the servo drive module includes a plurality of lateral drive units and a longitudinal drive unit, wherein the plurality of lateral drive units and the longitudinal drive units are electrically connected to the servo control unit.

[0020] In one embodiment of the present invention, the servo drive module further includes:

[0021] A lateral grating ruler feedback unit is connected to the lateral drive unit; and

[0022] The longitudinal grating ruler feedback unit is connected to the longitudinal drive unit.

[0023] In one embodiment of the present invention, the transverse grating ruler feedback unit and the longitudinal grating ruler feedback unit are electrically connected to the servo control unit.

[0024] In one embodiment of the present invention, the control module is provided with a plurality of connection slots, and each galvanometer control unit is installed in one of the connection slots.

[0025] In one embodiment of the present invention, the number of galvanometer modules is between 1 and 8.

[0026] In one embodiment of the present invention, the communication protocol between the host computer module and the control module is the TCP / IP protocol.

[0027] The present invention also provides a laser cutting control method, applied to a laser processing system as described in any of the above claims, the control method comprising:

[0028] The host computer module generates a machining trajectory code based on the shape data of the workpiece to be processed, and transmits the machining trajectory code to the control module;

[0029] The control module generates motion control information for the galvanometer module and the servo drive module based on the machining trajectory code;

[0030] The control module acquires the position information of the galvanometer module and the servo drive module, and controls the galvanometer module and the servo drive module to perform linkage processing based on the position information and the motion control information.

[0031] As described above, the laser processing system and laser processing control method of the present invention have the following beneficial effects: The present invention realizes the linkage control of the galvanometer and the servo drive platform based on the PMAC control system, which can improve the laser splicing processing accuracy and reduce the hardware cost of the laser processing system. Attached Figure Description

[0032] Figure 1 The diagram shown is a structural schematic of a laser processing system provided by the present invention.

[0033] Figure 2 The diagram shows the hardware connection of a laser processing system according to an embodiment of the present invention.

[0034] Figure 3 The diagram shown is a flowchart of a laser processing control method provided by the present invention.

[0035] Component designation explanation

[0036] 100. Host computer module;

[0037] 200. Control module; 210. Processing unit; 220. Servo control unit;

[0038] 300. Galvanometer module; 310. Galvanometer control unit; 320. Signal selection unit; 330. Galvanometer unit; 340. Laser unit;

[0039] 400 Servo drive module; 410 Vertical drive unit; 420 Horizontal drive unit; 430 Vertical grating ruler feedback unit; 440 Horizontal grating ruler feedback unit. Detailed Implementation

[0040] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, unless otherwise specified, the following embodiments and features can be combined with each other. It should also be understood that the terminology used in the embodiments of the present invention is for describing specific implementation schemes and not for limiting the scope of protection of the present invention. Test methods in the following embodiments that do not specify specific conditions are generally performed under conventional conditions or according to the conditions recommended by the respective manufacturers.

[0041] Please refer to Figures 1 to 3 . It should be noted that the structures, proportions, sizes, etc. shown in the drawings of this specification are only used to match the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the conditions for the implementation of the present invention. Therefore, they do not have substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle", and "one" cited in this specification are only for the convenience of clear narration and are not used to limit the scope of implementation of the present invention. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope within which the present invention can be implemented.

[0042] Please refer to Figures 1 to 3 . The present invention provides a laser processing system and a laser processing control method, which relate to the technical field of laser processing. The present invention can be specifically applied to large-format laser cutting. The present invention realizes the linkage control of the galvanometer and the servo drive platform based on the PMAC control system, which can improve the laser processing accuracy and reduce the hardware cost. The following will be described in detail through specific embodiments.

[0043] Please refer to Figure 1 as shown Figure 1The diagram shown illustrates the structure of a laser processing system provided by this invention. In one embodiment, the laser processing system may include a host computer module 100, a control module 200, a galvanometer module 300, and a servo drive module 400. The host computer module 100 and the control module 200 are electrically connected, specifically communicating via TCP / IP (Transmission Control Protocol / Internet Protocol). The software built into the host computer module 100 can transmit data through the PDK (Process Design Kit) library file provided by the control module 200. The host computer module 100 can develop a UI control system based on the PDK library file of the control module 200, receiving user-input processing information and process parameters to achieve motion control of the entire system. The control module 200 may be a PMAC (Programmable Multi-Axis Controller). Multiple galvanometer modules 300 may be present, each electrically connected to the control module 200. The servo drive module 400 can be electrically connected to the control module 200. The servo drive module 400 can be used to move the workpiece in a plane. In this embodiment, the host computer module 100 can generate a machining trajectory code based on the shape data of the workpiece and transmit the machining trajectory code to the control module 200. The control module 200 can generate motion control information for the galvanometer module 300 and the servo drive module 400 based on the machining trajectory code. The control module 200 can also collect the position information of the galvanometer module 300 and the servo drive module 400, and control the galvanometer module 300 and the servo drive module 400 to perform coordinated machining based on the aforementioned motion control information.

[0044] Please see Figure 2 As shown, Figure 2This diagram illustrates the hardware connections of a laser processing system according to an embodiment of the present invention. In one embodiment, the control module 200 may include a processing unit 210 and a servo control unit 220. The processing unit 210 may be a CPU (Central Processing Unit) card, equipped with a running indicator light, a USB (Universal Serial Bus) interface, a network cable interface, and other data interfaces. The number of servo control units 220 may be one or more, and each servo control unit 220 may be electrically connected to the processing unit 210. The servo control unit 220 may also be electrically connected to the servo drive module 400. In this embodiment, the servo control unit 220 may be a servo control axis card, and its number may be between 1 and 13. The servo control unit 220 may use analog pulse control to move the servo drive module 400.

[0045] Please see Figure 2 As shown, in one embodiment of the present invention, the galvanometer module 300 may include a galvanometer control unit 310, a signal selection unit 320, a galvanometer unit 330, and a laser unit 340. The galvanometer control unit 310 may be a galvanometer control axis card. In this embodiment, the control module 200 is provided with multiple connection slots, and each galvanometer control unit 310 can be installed in one connection slot. The connection slot may be a PCI (Peripheral Component Interconnect) slot, and the processing unit 210 in the control module 200 can communicate with each galvanometer control unit 310 via a PCI bus. The signal selection unit 320 may be a signal selection board, which may be electrically connected to the galvanometer control unit 310. The galvanometer units 330 may be electrically connected to the signal selection units 320, and their number may correspond to the number of signal selection units 320, that is, every two galvanometer units 330 are electrically connected to one signal selection unit 320. The galvanometer unit 330 can be a Cannon GM1050 galvanometer. The laser unit 340 can be electrically connected to the galvanometer control unit 310. The galvanometer module 300 uses a corresponding number of galvanometer control units 310 in the control module 200, and controls the corresponding galvanometer units 330 through the signal selection unit 320. Specifically, the output port of the signal selection unit 320 can be connected to the control module 200 through an SL2-100 signal cable. The two input ports of the signal selection unit 320 can be connected to two galvanometer units 330 respectively through SL2-100 signal cables, and the signal selection unit 320 can switch signals according to digital signals. This enables the galvanometer control unit 310 to control the corresponding galvanometer units 330 through the SL2-100 signal cable. The 100 protocol independently controls two galvanometer units 330. The galvanometer control unit 310 can be connected to the laser unit 340 via a high-frequency control line. The galvanometer control unit 310 uses PWM (Pulse Width Modulation) signals to control the laser unit 340 to generate laser light. In this embodiment, the two galvanometer units 330 and the laser unit 340 can form a laser galvanometer. The signal output from the galvanometer control unit 310 drives the amplification circuit, enabling planar control of the laser beam deflection. The number of galvanometer modules 300 can be flexibly expanded according to processing requirements; for example, the number of galvanometer modules 300 can range from 1 to 8.

[0046] Please see Figure 2 As shown, in one embodiment of the present invention, the servo drive module 400 may include a longitudinal drive unit 410 and a plurality of transverse drive units 420. The number of transverse drive units 420 may be between 1 and 8. The longitudinal drive unit 410 and each transverse drive unit 420 may be electrically connected to one or more servo control units 220.

[0047] Furthermore, to obtain precise position information of the longitudinal drive unit 410 and each lateral drive unit 420, the servo drive module 400 is also equipped with incremental grating ruler feedback. Specifically, the servo drive module 400 may also include a longitudinal grating ruler feedback unit 430 and multiple lateral grating ruler feedback units 440. The longitudinal grating ruler feedback unit 430 and the lateral grating ruler feedback unit 440 can be high-precision grating ruler displacement sensors. The longitudinal grating ruler feedback unit 430 can be mounted on the longitudinal drive unit 410, and each lateral grating ruler feedback unit 440 can be mounted on one lateral drive unit 420. The longitudinal grating ruler feedback unit 430 and each lateral grating ruler feedback unit 440 can be electrically connected to one or more servo control units 220. In this embodiment, the control module 200 uses analog signals to control the longitudinal drive unit 410 and the multiple lateral drive units 420 in the servo drive module 400. The control module 200 also periodically acquires the real-time position information of the longitudinal drive unit 410 through the longitudinal grating ruler feedback unit 430, and the multiple transverse grating ruler feedback units 440 periodically acquire the real-time position information of each transverse drive unit 420. Closed-loop control can be realized in the control module 200, thereby realizing high-speed and high-precision motion control of the axis.

[0048] Therefore, it can be seen that the control module 200 in the laser processing system of the present invention realizes linkage control based on the PMAC control system. Specifically, the host computer module 100 is electrically connected to the control module 200, the galvanometer control unit 310 is inserted into the connection slot of the control module 200 and electrically connected to the laser unit 340, and the galvanometer control unit 310 is also electrically connected to a group of galvanometer units 330 through the signal selection unit 320. At the same time, the servo control unit 220 in the control module 200 is electrically connected to the longitudinal drive unit 410 and the transverse drive unit 420. Both the longitudinal drive unit 410 and the transverse drive unit 420 are equipped with grating ruler feedback units, and the longitudinal grating ruler feedback unit 430 and the transverse grating ruler feedback unit 440 are electrically connected to the servo control unit 220 and can periodically feed back position information to the control module 200. The control module 200 can simultaneously acquire the position information of the galvanometer unit 330 and the servo drive module 400. That is, the galvanometer module 300 and the servo drive module 400 are controlled by the same control module 200. While each galvanometer unit 330 moves, the longitudinal drive unit 410 and the transverse drive unit 420 in the servo drive module 400 move synchronously. All position parameters are fed back to the control module 200 in real time. This invention ensures that multiple sets of galvanometer units 330 and servo drive modules 400 form a closed-loop motion, achieving linked processing and avoiding problems such as splicing marks and splicing errors caused by splicing.

[0049] Please see Figure 3 As shown, Figure 3 The diagram shown illustrates a laser processing control method provided by this invention. This method can be applied to the aforementioned laser processing system and may include the following steps:

[0050] Step S100: The host computer module generates a machining trajectory code based on the shape data of the workpiece to be processed, and transmits the machining trajectory code to the control module.

[0051] Step S200: The control module generates motion control information for the galvanometer module and the servo drive module based on the machining trajectory code;

[0052] In step S300, the control module acquires the position information of the galvanometer module and the servo drive module, and controls the galvanometer module and the servo drive module to perform linkage processing based on the position information and motion control information.

[0053] In an embodiment of the present invention, when step S100 is executed, that is, the host computer module 100 generates a machining trajectory code according to the contour data of the workpiece to be machined and transmits the machining trajectory code to the control module 200. Specifically, a staff member inputs the contour data of the workpiece to be machined into the host computer module 100. The host computer module 100 generates a machining trajectory code according to the contour data of the workpiece to be machined and transmits the machining trajectory code to the control module 200 through communication using the TCP / IP protocol.

[0054] In an embodiment of the present invention, when step S200 is executed, that is, the control module 200 generates motion control information for the galvanometer module 300 and the servo drive module 400 based on the machining trajectory code. Specifically, the control module 200 performs conversion processing on the machining trajectory code to generate motion control information for multiple galvanometer modules 300 and servo drive modules 400. The control module 200 can convert the machining trajectory code into the position algorithm of the galvanometer module 300 itself and the motion control information of each drive unit in the servo drive module 400 through forward and inverse kinematic algorithms.

[0055] In an embodiment of the present invention, when step S300 is executed, that is, the control module 200 collects the position information of the galvanometer module 300 and the servo drive module 400, and controls the galvanometer module 300 and the servo drive module 400 to perform combined machining based on the position information and motion control information. Specifically, first, the control module 200 can collect the position information of each galvanometer unit 330 through multiple galvanometer control units 310, collect the position information of the longitudinal drive unit 410 through the longitudinal grating scale feedback unit 430, and collect the position information of each lateral drive unit 420 through multiple lateral grating scale feedback units 440. Then, the control module 200 controls the multiple galvanometer modules 300 and the servo drive module 400 to perform combined machining simultaneously according to the designed machining process parameters, based on the above-generated motion control information and the position information of each component.

[0056] In summary, the present invention provides a laser processing system and a laser processing control method, which relate to the technical field of laser processing. The present invention adopts the combined control of a PMAC controller, which can enable a single servo drive module to be combined with multiple galvanometer units simultaneously, avoid the precision error caused by stitching machining, and achieve large-area laser cutting. The present invention improves the machining precision and reduces the equipment hardware cost at the same time. Therefore, the present invention effectively overcomes various disadvantages in the prior art and has high industrial utilization value.

[0057] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

[0058] Therefore, many modifications can be made to adapt a particular environment or material to the essential scope and spirit of the invention. The invention is not intended to be limited to the specific terminology used in the following claims and / or the specific embodiments disclosed as the best mode contemplated for carrying out the invention, but the invention will include any and all embodiments and equivalents falling within the scope of the appended claims. Thus, the scope of the invention will be defined only by the appended claims.

Claims

1. A laser processing system characterized by, The laser processing system comprises: a host computer module; a control module electrically connected to the host computer module, wherein the control module is a programmable multi-axis controller; a plurality of galvanometer modules, each of which is electrically connected to the control module, wherein the galvanometer module comprises: a galvanometer control unit electrically connected to the control module; a signal selection unit electrically connected to the galvanometer control unit and performing signal switching according to a digital signal; two galvanometer units electrically connected to one signal selection unit, wherein the galvanometer control unit controls the two galvanometer units individually through an SL2-100 protocol; a laser unit electrically connected to the galvanometer control unit; and a servo drive module electrically connected to the control module, wherein the servo drive module comprises: a plurality of horizontal drive units and vertical drive units electrically connected to the control module; a horizontal grating ruler feedback unit connected to the horizontal drive unit, wherein the horizontal grating ruler feedback unit is an incremental grating ruler displacement sensor; and a vertical grating ruler feedback unit connected to the vertical drive unit, wherein the vertical grating ruler feedback unit is an incremental grating ruler displacement sensor. The host computer module generates a processing track code according to the shape data of a workpiece to be processed and transmits the processing track code to the control module. The control module generates motion control information of the galvanometer module and the servo drive module based on the processing track code, and controls the servo drive module through analog pulse. The control module collects position information of the galvanometer module and position information of the horizontal drive unit and the vertical drive unit through the horizontal grating ruler feedback unit and the vertical grating ruler feedback unit periodically, and controls the galvanometer module and the servo drive module to process in linkage based on the position information and the motion control information.

2. The laser processing system according to claim 1, characterized by, The control module comprises a processing unit and a servo control unit, wherein the servo control unit is electrically connected to the servo drive module.

3. The laser processing system of claim 2, wherein, The horizontal drive units and the vertical drive units are electrically connected to the servo control unit.

4. The laser processing system of claim 2, wherein, The horizontal grating ruler feedback unit and the vertical grating ruler feedback unit are electrically connected to the servo control unit.

5. The laser processing system of claim 1, wherein, The control module is provided with a plurality of connection card slots, and each galvanometer control unit is installed in one connection card slot.

6. The laser processing system of claim 1, wherein, The number of the galvanometer modules is in a range of 1-8.

7. The laser processing system of claim 1, wherein, The communication protocol between the host computer module and the control module is a TCP / IP protocol.

8. A laser cutting control method characterized by, The control method of the laser processing system comprises: The host computer module generates a processing track code according to the shape data of a workpiece to be processed and transmits the processing track code to the control module. The control module generates motion control information of the galvanometer module and the servo drive module based on the processing track code, wherein the control module is a programmable multi-axis controller; and The control method of the laser processing system comprises: The control module collects position information of the galvanometer module, and periodically collects position information of the transverse driving unit and the longitudinal driving unit through the transverse grating ruler feedback unit and the longitudinal grating ruler feedback unit, and controls the galvanometer module and the servo driving module to carry out linkage processing based on the position information and the motion control information; The galvanometer module comprises: A galvanometer control unit electrically connected to the control module; A signal selection unit electrically connected to the galvanometer control unit and performing signal switching according to a digital signal; Two galvanometer units electrically connected to one signal selection unit, wherein the galvanometer control unit controls the two galvanometer units individually through an SL2-100 protocol; and A laser unit electrically connected to the galvanometer control unit. The servo driving module comprises: A plurality of transverse driving units and longitudinal driving units, wherein the plurality of transverse driving units and longitudinal driving units are electrically connected to the control module; A transverse grating ruler feedback unit connected to the transverse driving unit, wherein the transverse grating ruler feedback unit is an incremental grating ruler displacement sensor; and A longitudinal grating ruler feedback unit connected to the longitudinal driving unit, wherein the longitudinal grating ruler feedback unit is an incremental grating ruler displacement sensor.

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