A ring-shaped laser processing system
The three-wave composite laser processing system uses a dichroic mirror to separate infrared, green, and ultraviolet light into ring-shaped spots, solving the problems of low efficiency of traditional lasers and high complexity and cost of existing systems, and achieving efficient and precise laser processing results.
Patent Information
- Application Number
- CN202311028692.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-15
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2043-08-15
AI Technical Summary
Traditional infrared lasers have low absorption rates for highly reflective materials, resulting in low welding and cutting efficiency. Furthermore, green and ultraviolet lasers are prone to causing spatter and workpiece deformation during processing. Existing ring light-assisted processing systems are complex and costly.
A single laser source generates a three-wave composite laser, which is converted into infrared, green, and ultraviolet light by an LBO/BBO crystal. A dichroic mirror is used to separate the beam and adjust it into a ring-shaped spot. The ultraviolet light is located in the central inner ring for main processing, the green light is located in the middle ring for auxiliary heating, and the infrared light is located in the outer ring for preheating, thus achieving efficient and precise laser processing.
It improves processing efficiency and precision, reduces spatter and workpiece deformation, lowers production costs, and is suitable for ultra-high precision industrial laser processing.
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Figure CN116967598B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of laser technology, and more specifically, to a ring-spot laser processing system. Background Technology
[0002] In recent years, with the booming demand from the new energy industry, higher requirements have been placed on front-end laser processing technology. Due to limitations in material absorption, traditional infrared lasers have a very low absorption rate for highly reflective materials, which can easily lead to spatter, low efficiency, and power limitations due to single-module limitations in welding, cutting, and other precision applications. As a result, they can no longer meet the welding and cutting requirements of highly reflective materials such as copper.
[0003] Green and ultraviolet lasers, due to the high absorption characteristics of copper for green and ultraviolet light, have significant advantages over infrared lasers, especially in ultraviolet laser processing applications, where only ultraviolet lasers can meet the processing requirements. However, like infrared lasers, green, ultraviolet, and infrared lasers have Gaussian beam distributions. During laser processing, excessively high temperatures at the processing center can still cause spatter that damages electronic components around the workpiece. Furthermore, the significant temperature difference between the processing center and its surroundings creates a temperature gradient, leading to uneven heating of the workpiece and making it prone to deformation, bubbles, cracks, and other problems.
[0004] Based on this, it is necessary to invent a ring-shaped spot laser processing system. The laser processing system outputs a composite light of infrared, green and ultraviolet light, and the composite light output is in the form of a ring-shaped spot with a near-Gaussian energy distribution, which can greatly improve processing efficiency and reduce spatter.
[0005] Currently, there are two common types of ring-beam assisted processing systems. One type involves directly setting up one or more ring-beam lasers to form a ring-shaped spot for auxiliary processing. The other type is a laser processing system with a ring fiber, developed by IPG. Specifically, the fiber structure of the laser includes a central fiber and a ring fiber. The laser controls the central fiber and the ring fiber to form a central beam and a ring beam, respectively. The central beam performs laser processing, while the ring beam provides auxiliary processing. Both of these common laser processing systems are relatively complex and have high production costs.
[0006] Therefore, it is necessary to invent a laser processing system that is simple in structure, low in cost, easy to operate, and has excellent spot quality, which can be used for ultra-high precision industrial processing. It can also alleviate problems such as workpiece curling, spattering, bubbles and cracks that occur during laser processing. Summary of the Invention
[0007] The purpose of this application is to provide a ring-spot laser processing system to solve the problems mentioned in the background art.
[0008] To achieve the above objectives, this application provides the following technical solution: a ring-shaped spot laser processing system, comprising a laser source, a first lens, a first laser crystal, a second laser crystal, a first dichroic mirror, a second lens, a second dichroic mirror, a third dichroic mirror, a fourth dichroic mirror, a fifth dichroic mirror, a sixth dichroic mirror, a galvanometer mechanism, a target workpiece, and a platform.
[0009] Laser light sources are mainly used to output infrared light of 1000-1100nm as the fundamental frequency beam.
[0010] The first lens is used to focus the energy of the fundamental frequency beam, thereby increasing the energy density or power density of the fundamental frequency beam.
[0011] The first laser crystal is an LBO / BBO or other frequency-doubled crystal, used to convert the fundamental frequency beam. When the 1000-1100nm fundamental frequency light passes through the crystal and the power density reaches the nonlinear threshold, a corresponding second harmonic, i.e., frequency-doubled light, will be generated. The frequency of the generated frequency-doubled light is half that of the fundamental frequency light, and the generated light is green light of 500-550nm.
[0012] The second laser crystal is an LBO / BBO or other frequency-doubled crystal, used to perform frequency conversion again on the dual-wavelength beam of 1000-1100nm fundamental frequency beam and 500-550nm frequency-doubled light. After conversion, the output light frequency is 3 times that of the fundamental frequency light, and the generated light is ultraviolet light of 330-367nm.
[0013] The first dichroic mirror primarily separates the 330–367 nm ultraviolet light generated after transformation by the first and second laser crystals from the residual 500–550 nm laser light and the 1000–1100 nm fundamental frequency light by coating a high-reflectivity film (330–367 nm) with anti-reflection films (500–550 nm and 1000–1100 nm). The separated 330–367 nm laser light forms the first laser beam, while the residual 500–550 nm and 1000–1100 nm laser lights form the second laser beam.
[0014] The second lens is positioned behind the laser beam reflected by the first dichroic mirror and is used to collimate and adjust the first laser beam of 330–367 nm reflected by the first dichroic mirror.
[0015] The second dichroic mirror mainly uses a high-reflectivity coating of 330–367 nm and anti-reflection coatings of 500–550 nm and 1000–1100 nm to reflect and redirect the 330–367 nm light beam after collimation by the second lens. At the same time, it filters out the 500–550 nm and 1000–1100 nm laser light that is not completely dichroically separated after passing through the second lens.
[0016] A third dichroic mirror is provided behind the transmitted laser of the first dichroic mirror. It is mainly used to separate the second laser beam after passing through the first dichroic mirror into a third laser beam of 500-550nm and a fourth laser beam of 1000-1100nm. Then, the third laser beam of 500-550nm is reflected and redirected, and the fourth laser beam of 1000-1100nm is separated by passing through the third dichroic mirror.
[0017] The third lens is positioned behind the laser beam reflected by the third dichroic mirror and is used to collimate and adjust the second laser beam reflected by the third dichroic mirror.
[0018] In a preferred embodiment, the optical path from the third lens to the second laser crystal is greater than the optical path from the second lens to the second laser crystal, and the optical path from the fourth lens to the second laser crystal is greater than the optical path from the third lens to the second laser crystal, so that the 330-367nm ultraviolet laser is a small spot laser beam distributed in the central inner ring region, the 500-550nm green laser is a medium spot laser beam distributed in the middle ring region (outer periphery of the central inner ring region), and the 1000-1100nm infrared laser is a large spot laser beam distributed in the outer ring region (outer periphery of the middle ring region).
[0019] The fourth dichroic mirror is located behind the third lens and can adjust the first laser beam and the third laser beam to the same laser output direction.
[0020] A fifth dichroic mirror is provided behind the transmitted laser of the third dichroic mirror. The fifth dichroic mirror reflects and redirects the fourth laser beam of 1000-1100nm after passing through the third dichroic mirror by coating a high-reflection film of 1000-1100nm and an anti-reflection film of 500-550nm and 330-367nm, and filters out the laser beam of 500-550nm and 330-367nm.
[0021] The fourth lens is positioned behind the laser beam reflected by the fifth dichroic mirror and is used to collimate and adjust the fourth laser beam reflected by the fifth dichroic mirror.
[0022] The sixth dichroic mirror is located behind the fourth lens and adjusts the first laser beam, the third laser beam, and the fourth laser beam to the same laser output direction.
[0023] A galvanometer mechanism is provided behind the sixth dichroic mirror. The galvanometer mechanism is mainly used to integrate the three-wave composite beam transmitted from the sixth dichroic mirror, so that the first laser beam, the third laser beam and the fourth laser beam act on the target workpiece according to the production requirements.
[0024] The target workpiece is the component that needs to be processed.
[0025] The platform is mainly used to support, clamp, and move the target workpiece to facilitate its processing.
[0026] The annular spot laser processing system provided in this application requires only one laser source to generate a three-wave composite laser, achieving ultra-high precision composite laser processing. During processing, the main laser can be a 330-367nm ultraviolet laser and / or a 500-550nm green laser. The ultraviolet laser beam output by this system is distributed in a ring shape, located in the central inner ring region, while the green laser is located in the middle ring region, which can be used for main laser processing or auxiliary heating. The auxiliary laser uses 1000-1100nm infrared light, located in the outer ring region (the outer ring region covers the inner ring region), mainly used for preheating and thermal transition of the target workpiece's working area, thereby improving the processing efficiency of the ultraviolet laser and / or green laser. The inner ring region has a higher power density than the middle ring region, and the middle ring region has a higher power density than the outer ring region. During operation, the inner ring region has a high energy density and performs thermal melting processing on the workpiece. The middle ring region can be used for thermal melting processing or auxiliary heating, depending on actual production needs. The outer ring region, due to its low power density, does not perform processing. The entire process is highly efficient with minimal splashing. The processing area completes processing quickly, and the non-target processing area has minimal heat impact, greatly improving workpiece processing accuracy, yield, and efficiency. It is especially suitable for ultra-high precision industrial laser processing. Furthermore, the laser's photo-to-photon conversion efficiency is extremely high, with virtually no other energy loss, greatly improving energy utilization and reducing manufacturing costs. Attached Figure Description
[0027] To more clearly illustrate the technical solutions of the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0028] Figure 1 This is a first structural schematic diagram of the annular spot laser processing system provided in this application;
[0029] Figure 2 This is a schematic diagram of the second structure of the ring-spot laser processing system provided in this application;
[0030] Figure 3 This is a schematic diagram of the third structure of the annular spot laser processing system provided in this application;
[0031] Figure 4 This is a schematic diagram of the fourth structure of the annular spot laser processing system provided in this application;
[0032] Figure 5 This is a fifth structural schematic diagram of the annular spot laser processing system provided in this application;
[0033] Figure 6 This is a sixth structural schematic diagram of the annular spot laser processing system provided in this application.
[0034] Reference numerals: 1. Laser source; 2. First lens; 3. First laser crystal; 4. First dichroic mirror; 5. Second lens; 6. First displacement mechanism; 7. Second dichroic mirror; 8. Third dichroic mirror; 9. Third lens; 10. Second displacement mechanism; 11. Fourth dichroic mirror; 12. Window; 13. Galvanometer mechanism; 14. Target workpiece; 15. Platform; 16. Second laser crystal; 17. Fifth dichroic mirror; 18. Fourth lens; 19. Sixth dichroic mirror; 20. Third displacement mechanism; 21. Seventh dichroic mirror; L. Fundamental frequency beam; L1. First laser beam; L2. Second laser beam; L3. Third laser beam; L4. Fourth laser beam. Detailed Implementation
[0035] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present application and are not intended to limit the scope of the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without inventive effort are within the scope of protection of the present application.
[0036] Please see Figure 1 , Figure 1 The first structural schematic diagram of the annular spot laser processing system provided in this application includes: a laser source 1, a first lens 2, a first laser crystal 3, a second laser crystal 16, a first dichroic mirror 4, a second lens 5, a second dichroic mirror 7, a third dichroic mirror 8, a third lens 9, a fourth dichroic mirror 11, a fifth dichroic mirror 17, a fourth lens 18, a sixth dichroic mirror 19, a galvanometer mechanism 13, a target workpiece 14, and a platform 15.
[0037] The laser source 1 is mainly used to output a fundamental frequency beam L of 1000-1100nm. The laser source 1 can be a fiber laser or a semiconductor laser.
[0038] The first lens 2 is used to focus the energy of the fundamental frequency beam L, thereby increasing the energy density or power density of the fundamental frequency beam L and improving the efficiency of subsequent frequency conversion. It is usually a plano-convex lens.
[0039] The first laser crystal 3 is an LBO / BBO or other frequency doubling crystal, used to convert the fundamental frequency beam L. When the 1000-1100nm fundamental frequency light passes through the crystal and the power density reaches the nonlinear threshold, a corresponding second harmonic, i.e., frequency doubling light, will be generated. The frequency of the generated frequency doubling light is half that of the fundamental frequency light, and the generated light is 500-550nm green light.
[0040] The second laser crystal 16 is an LBO / BBO or other frequency doubling crystal, used to perform frequency conversion again on the dual-wavelength beam of the 1000-1100nm fundamental frequency beam L and the 500-550nm frequency-doubled beam. After conversion, the output light frequency is 3 times that of the fundamental frequency beam, and the generated light is ultraviolet light of 330-367nm.
[0041] The first dichroic mirror 4 mainly separates the 330-367nm ultraviolet light generated after conversion by the first laser crystal 3 and the second laser crystal 16 from the residual 500-550nm laser light and the 1000-1100nm fundamental frequency light by coating a high-reflectivity film of 330-367nm and simultaneously coating anti-reflection films of 500-550nm and 1000-1100nm. The separated 330-367nm laser light is the first laser beam L1, and the residual 500-550nm and 1000-1100nm laser light is the second laser beam L2.
[0042] The second lens 5 is located behind the laser reflected by the first dichroic mirror 4 and is used to collimate and adjust the first laser beam L1 of 330-367nm reflected by the first dichroic mirror 4. The second lens 5 is a convex lens.
[0043] The second dichroic mirror 7 mainly reflects and redirects the 330-367nm laser beam after collimation by the second lens 5 by coating a high-reflection film of 330-367nm and an anti-reflection film of 500-550nm and 1000-1100nm. At the same time, it filters out the 500-550nm and 1000-1100nm laser beams that are not completely dichroically separated after passing through the second lens 5.
[0044] A third dichroic mirror 8 is provided behind the transmitted laser of the first dichroic mirror 4. The third dichroic mirror 8 is coated with a high reflective film of 500-550nm and an anti-reflective film of 1000-1100nm and 330-367nm. It is mainly used to separate the second laser beam L2 after passing through the first dichroic mirror 4 into a third laser beam L3 of 500-550nm and a fourth laser beam L4 of 1000-1100nm. The third laser beam L3 of 500-550nm is reflected and redirected, and the fourth laser beam L4 of 1000-1100nm is separated by passing through the third dichroic mirror 8.
[0045] The third lens 9 is located behind the laser reflected by the third dichroic mirror 8 and is used to collimate and adjust the third laser beam L3 reflected by the third dichroic mirror 8. The third lens 9 is also a convex lens.
[0046] Furthermore, the optical path from the third lens 9 to the second laser crystal 16 must be greater than the optical path from the second lens 5 to the second laser crystal 16, so as to achieve a small spot laser beam with the first laser beam L1 in the center and a medium spot ring laser beam with the third laser beam L3 on its outer side. This is because when processing highly reflective metal materials, the first laser beam L1 of 330-367nm has a better absorption rate of the laser beam compared to lasers of 500-550nm and 1000-1100nm, resulting in excellent processing accuracy and less thermal side effects.
[0047] The fourth dichroic mirror 11 is located behind the third lens 9, and adjusts the first laser beam L1 and the third laser beam L3 to the same laser output direction.
[0048] A fifth dichroic mirror 17 is provided behind the transmitted laser of the third dichroic mirror 8. The fifth dichroic mirror 17 is mainly used to reflect and redirect the fourth laser beam L4 of 1000-1100nm after passing through the third dichroic mirror 8 by coating a high reflective film of 1000-1100nm and an anti-reflection film of 500-550nm and 330-367nm, and to filter out the laser of 500-550nm and 330-367nm.
[0049] The fourth lens 18 is located behind the laser reflected by the fifth dichroic mirror 17 and is used to collimate and adjust the fourth laser beam L4 reflected by the fifth dichroic mirror 17. The fourth lens 18 is also a convex lens.
[0050] Furthermore, the optical path from the fourth lens 18 to the second laser crystal 16 must be greater than the optical path from the third lens 9 to the second laser crystal 16, so as to achieve the first laser beam L1 as a small spot laser beam in the center, the third laser beam L3 as a medium spot ring laser beam on its outer side, and the fourth laser beam L4 as the outermost large spot ring laser beam. This is because when processing highly reflective metallic materials, the first laser beam L1 of 330-367nm has a better absorption rate of the laser beam compared to lasers of 500-550nm and 1000-1100nm, resulting in excellent processing accuracy and less thermal side effects.
[0051] The ring-shaped laser processing system provided in this application outputs a three-ring beam with an inner, middle, and outer ring, exhibiting a Gaussian energy distribution. The inner ring, with a spot diameter of r1, primarily consists of 330–367 nm laser light, supplemented by 500–550 nm and 1000–1100 nm laser light. Therefore, the inner ring has the highest power density and is the first to be processed, along with the components. The main processing mechanism of the inner ring involves using a 330–367 nm ultraviolet beam for cold processing of difficult-to-machine materials, thereby disrupting the material's molecular structure and increasing the absorption of other beams. The middle ring primarily consists of a 500–550 nm laser light with a spot diameter of r2, supplemented by 1000–1100 nm laser light. After the inner ring is processed, the middle ring immediately begins its sequential processing. The outer ring laser primarily consists of a 1000-1100nm laser beam. When this portion constitutes a relatively small proportion, it typically does not perform processing operations and is mainly used for preheating and thermal transition to reduce processing difficulty and prevent irreversible damage to the workpiece caused by thermal effects during processing. When the 1000-1100nm laser beam constitutes a higher proportion in the outer ring, further processing of the material is possible; however, this is generally applicable when the conversion efficiencies of the first laser crystal 3 and the second laser crystal 16 are very low. Compared to a single-mode laser with normal output, the above-mentioned three-wave composite spot shape offers almost no spatter and higher processing efficiency, greatly benefiting ultra-high precision laser processing. Furthermore, this laser processing system can process materials that absorb almost no visible or infrared light, thus having a wider range of processing applications.
[0052] The sixth dichroic mirror 19 is located behind the fourth lens 18 and adjusts the first laser beam L1, the third laser beam L3 and the fourth laser beam L4 to the same laser output direction.
[0053] A galvanometer mechanism 13 is provided behind the sixth dichroic mirror 19. The galvanometer mechanism 13 is mainly used to integrate the three-wave composite beam transmitted from the sixth dichroic mirror 19. It uses optical scanning to control the first laser beam L1, the third laser beam L3, and the fourth laser beam L4 to move or deflect in two mutually perpendicular directions on a plane, so that the first laser beam L1, the third laser beam L3, and the fourth laser beam L4 act on the target workpiece 14 according to production requirements.
[0054] The target workpiece 14 is the component that needs to be processed.
[0055] The platform 15 is mainly used to support, clamp, and move the target workpiece 14 to facilitate the processing of the target workpiece 14.
[0056] Furthermore, in order to reduce the power loss of the system and improve the optical-to-optical conversion efficiency of the laser processing system, the first lens 2 can be coated with a 1000-1100nm anti-reflection film, the first laser crystal 3 is coated with a 1000-1100nm anti-reflection film on the side close to the first lens 2, and with a 500-550nm and 1000-1100nm anti-reflection film on the side away from the first lens 2, and the second laser crystal 16 is coated with a 500-550nm and 1000-1100nm anti-reflection film on the side close to the first laser crystal 3, and with a 330-367nm, 500-550nm and 1000-1100nm anti-reflection film on the side away from the first laser crystal 3.
[0057] Furthermore, the first dichroic mirror 4 has a high reflectivity film of 330-367nm and an antireflection film of 500-550nm and 1000-1100nm deposited on the side surface near the second laser crystal 16, while an antireflection film of 500-550nm and 1000-1100nm is deposited on the side surface away from the first laser crystal 3.
[0058] Furthermore, in order to reduce the power loss of the system and improve the optical-to-optical conversion efficiency of the laser processing system, the second lens 5 is coated with a 330-367nm anti-reflection film, the third lens 9 is coated with a 500-550nm anti-reflection film, and the fourth lens 18 is coated with a 1000-1100nm anti-reflection film.
[0059] Furthermore, the wavelength of the laser output by the second dichroic mirror 7 is 330-367nm. The second dichroic mirror 7 has a 330-367nm high reflectivity film and 500-550nm and 1000-1100nm antireflection films on the side surface near the second lens 5, and at the same time, it has an antireflection film of 500-550nm and 1000-1100nm on the side surface away from the second lens 5.
[0060] Furthermore, such as Figure 1 As shown, the fourth dichroic mirror 11 can adjust the first laser beam L1 and the third laser beam L3 to the same laser output direction by depositing a 500-550nm high reflectivity film and a 330-367nm antireflection film. The sixth dichroic mirror 19 can adjust the first laser beam L1, the third laser beam L3 and the fourth laser beam L4 to the same laser output direction by depositing antireflection films of 330-367nm and 500-550nm and a high reflectivity film of 1000-1100nm. (In other embodiments, the effect of adjusting the first laser beam L1 and the third laser beam L3 to the same laser output direction can also be achieved by depositing other film layers and using other placement angles.)
[0061] Please see Figure 2 , Figure 2This is a second structural schematic diagram of the annular spot laser processing system provided in this application. The annular spot laser processing system, in... Figure 1 Based on the laser processing system, it also includes a first displacement mechanism 6, a second displacement mechanism 10 and a third displacement mechanism 20.
[0062] The first displacement mechanism 6 connects to or carries the second lens 5, and can drive the second lens 5 to move back and forth along the direction parallel to the optical path. By driving the second lens 5 to move, the optical path between the second lens 5 and the second laser crystal 16 can be changed. At the same time, the output divergence angle and Rayleigh length of the first laser beam L1 (330-367nm) can be changed, thereby changing the spot size and focal position of the first laser beam L1 acting on the target workpiece 14, and thus adjusting the melting depth of the inner ring.
[0063] The second displacement mechanism 10 connects to or carries the third lens 9, and can drive the third lens 9 to move back and forth along the direction parallel to the optical path. By driving the third lens 9 to move, the optical path between the third lens 9 and the second laser crystal 16 can be changed. At the same time, the output divergence angle and Rayleigh length of the 500-550nm third laser beam L3 can also be changed, thereby changing the spot size and focal position of the third laser beam L3 acting on the target workpiece 14, and thus adjusting the melting depth of the middle ring.
[0064] The third displacement mechanism 20 connects to or carries the fourth lens 18, and can drive the fourth lens 18 to move back and forth along the direction parallel to the optical path. By moving the fourth lens 18, the optical path between the fourth lens 18 and the second laser crystal 16 can be changed. At the same time, the output divergence angle and Rayleigh length of the fourth laser beam L4 of 1000-1100nm can also be changed, thereby changing the spot size and focal position of the fourth laser beam L4 acting on the target workpiece 14, and thus adjusting the melting depth of the outer ring.
[0065] Furthermore, the power density of the first laser beam L1, the third laser beam L3, and the fourth laser beam L4 can also be autonomously adjusted by changing the conversion efficiency of the first laser crystal 3 and / or the second laser crystal 16. Typically, the conversion efficiency of the first laser crystal 3 and the second laser crystal 16 can only achieve the highest conversion efficiency under specific conditions. For example, the conversion efficiency can be changed by setting the angle of the first laser crystal 3 and the second laser crystal 16 and adjusting the temperature in their vicinity to meet different application requirements. Compared with existing composite laser processing systems, the laser processing system of this application does not require an additional power density adjustment mechanism.
[0066] Please see Figure 3 , Figure 3 This is a third structural schematic diagram of the annular spot laser processing system provided in this application. The annular spot laser processing system, in... Figure 2Based on the laser processing system, it also includes a window plate 12, which is located between the sixth dichroic mirror 19 and the galvanometer mechanism 13. It is mainly used to seal the annular spot laser processing system, isolate the composite light and annular light generation system from the external environment, and achieve a clean laser generation environment.
[0067] Furthermore, to reduce system losses, the window 12 is generally coated with antireflective films on both sides, including 1000-1100nm antireflective films, 500-550nm antireflective films, and 330-367nm antireflective films.
[0068] Furthermore, to reduce the impact on the output laser beam, the window 12 can be a double-ended planar lens. The beam output through the window 12 includes a first laser beam L1 located in the inner ring (330–367 nm), a third laser beam L3 located in the middle ring (500–550 nm), and a fourth laser beam L4 located in the outer ring (1000–1100 nm). The output spot diameter of the first laser beam L1 is r1, the output spot diameter of the third laser beam L3 is r2, and the output spot diameter of the fourth laser beam L4 is r3, where r3 > r2 > r1. In the laser processing system, the size differences of the inner, middle, and outer rings (r1, r2, and r3) can be designed accordingly by designing the optical path differences between the second lens 5, the third lens 9, the fourth lens 18, and the second laser crystal 16.
[0069] Please see Figure 4 , Figure 4 This is a fourth structural schematic diagram of the annular spot laser processing system provided in this application. The annular spot laser processing system, in... Figure 1 Based on the laser processing system shown, a seventh dichroic mirror 21 is also included. The seventh dichroic mirror 21 is located between the sixth dichroic mirror 19 and the galvanometer mechanism 13. It is mainly used to redirect the transmission direction of the three-wave composite laser beam to adapt to more application scenarios and facilitate the introduction of the laser beam into the target application system. It also further filters out stray light.
[0070] like Figure 4 As shown, the sixth dichroic mirror 19 is located behind the fourth lens 18. The sixth dichroic mirror 19 can be used to adjust the first laser beam L1, the third laser beam L3, and the fourth laser beam L4 to the same laser output direction by coating with a 330-367nm, 500-550nm high-reflection film and a 1000-1100nm anti-reflection film. (Here, the coating of the sixth dichroic mirror 19 and...) Figure 1 The sixth dichroic mirror 19 of the laser processing system is different, and the seventh dichroic mirror 21 is coated with a 330-367nm high reflectivity film, a 500-550nm high reflectivity film and a 1000-1100nm high reflectivity film.
[0071] Furthermore, to reduce the negative impact on the output laser beam, the seventh dichroic mirror 21 is a planar mirror.
[0072] Please see Figure 5 , Figure 5 This is a fifth structural schematic diagram of the annular spot laser processing system provided in this application. The annular spot laser processing system, in... Figure 1 Based on the laser processing system shown, it also includes a first displacement mechanism 6, a second displacement mechanism 10, and a third displacement mechanism 20. The working principles and effects of the first displacement mechanism 6, the second displacement mechanism 10, and the third displacement mechanism 20 are similar to... Figure 2 The same features are present in the laser processing system shown, and will not be repeated here.
[0073] Please see Figure 6 , Figure 6 This is a sixth structural schematic diagram of the annular spot laser processing system provided in this application. The annular spot laser processing system, in... Figure 5 The laser processing system shown also includes a window 12 located between the sixth dichroic mirror 19 and the seventh dichroic mirror 21. Similarly, in... Figure 6 The working principle and effect of window piece 12 in the middle Figure 3 The same features are present in the laser processing system shown, and will not be repeated here.
[0074] The laser processing system of this application has an adjustable melting depth. Since the output three-wave composite laser beams each have their own parameter adjustment systems such as divergence angle, the parameters of the laser processing system can be adjusted in real time through external control. By adjusting or compensating the processing parameters during the laser processing process, synchronous processing with different melting depths can be achieved, or dynamic processing with different melting depths can be achieved, which can meet the needs of various high-difficulty processing scenarios.
[0075] It should be noted that the technical solutions of the above embodiments of this application can be combined. If there is no inclusion relationship between the embodiments, unless there is an obvious contradiction, they are not limited to the scope described in a single embodiment, but can be combined to form new embodiments. In this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that the elements inherent in a process, method, article, or device that includes a list of elements are included. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or device that includes said element. In addition, the parts of the technical solutions provided in the embodiments of this application that are consistent with the implementation principles of corresponding technical solutions in the prior art have not been described in detail to avoid excessive elaboration.
[0076] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made to this application, as well as combinations of the various embodiments in this application, without departing from the principles of this application. These improvements, modifications, and combinations also fall within the protection scope of the claims of this application.
Claims
1. A ring-shaped spot laser processing system, characterized in that... The system includes: a laser source (1), a first lens (2), a first laser crystal (3), a second laser crystal (16), a first dichroic mirror (4), a second lens (5), a second dichroic mirror (7), a third dichroic mirror (8), a third lens (9), a fourth dichroic mirror (11), a fifth dichroic mirror (17), a fourth lens (18), a sixth dichroic mirror (19), a galvanometer mechanism (13), a target workpiece (14), and a platform (15). The laser source (1) is used to output a fundamental frequency beam (L) of 1000-1100nm. The first lens (2) is used to focus the energy of the fundamental frequency beam (L); The first laser crystal (3) is used to perform frequency conversion on the fundamental frequency beam (L) to generate frequency-doubled light of 500-550nm; The second laser crystal (16) is used to perform frequency conversion again on the dual-wavelength beam of 1000-1100nm fundamental frequency beam (L) and 500-550nm frequency-doubled light, and outputs 330-367nm ultraviolet light after conversion; The first dichroic mirror (4) is coated with a high-reflectivity film of 330-367nm and anti-reflection films of 500-550nm and 1000-1100nm. It separates the 330-367nm ultraviolet light generated after conversion by the first laser crystal (3) and the second laser crystal (16) from the residual 500-550nm laser and 1000-1100nm fundamental frequency light. The separated 330-367nm laser is the first laser beam (L1), and the residual 500-550nm and 1000-1100nm laser is the second laser beam (L2). The second lens (5) is located behind the laser reflected by the first dichroic mirror (4) and is used to collimate and adjust the first laser beam (L1) of 330-367nm reflected by the first dichroic mirror (4). The second dichroic mirror (7) is coated with a high-reflection film of 330-367nm and an anti-reflection film of 500-550nm and 1000-1100nm, which reflects and redirects the 330-367nm laser beam collimated by the second lens (5). A third dichroic mirror (8) is provided behind the transmitted laser of the first dichroic mirror (4) to separate the second laser beam (L2) after passing through the first dichroic mirror (4) into a third laser beam (L3) of 500-550nm and a fourth laser beam (L4) of 1000-1100nm. The third laser beam (L3) of 500-550nm is reflected and redirected, and the fourth laser beam (L4) of 1000-1100nm is separated by passing through the third dichroic mirror (8). The third lens (9) is located behind the laser reflected by the third dichroic mirror (8) and is used to collimate and adjust the third laser beam (L3) reflected by the third dichroic mirror (8). The fourth dichroic mirror (11) is located behind the third lens (9) to adjust the first laser beam (L1) and the third laser beam (L3) to the same laser output direction; A fifth dichroic mirror (17) is provided behind the transmitted laser of the third dichroic mirror (8). The fifth dichroic mirror (17) is used to reflect and redirect the fourth laser beam (L4) of 1000-1100nm after passing through the third dichroic mirror (8) by coating a high reflective film of 1000-1100nm and an anti-reflective film of 500-550nm and 330-367nm, thereby filtering out the laser of 500-550nm and 330-367nm. The fourth lens (18) is located behind the laser reflected by the fifth dichroic mirror (17) and is used to collimate and adjust the fourth laser beam (L4) reflected by the fifth dichroic mirror (17). The sixth dichroic mirror (19) is located behind the fourth lens (18) and adjusts the first laser beam (L1), the third laser beam (L3) and the fourth laser beam (L4) to the same laser output direction. A galvanometer mechanism (13) is provided behind the sixth dichroic mirror (19). The galvanometer mechanism (13) is mainly used to integrate the composite beam of the first laser beam (L1), the third laser beam (L3) and the fourth laser beam (L4) transmitted from the fourth dichroic mirror (11). The target workpiece (14) is the component that needs to be processed; The platform (15) is used to carry, clamp and move the target workpiece (14) to facilitate the processing of the target workpiece (14); The optical path from the fourth lens (18) to the second laser crystal (16) is greater than the optical path from the third lens (9) to the second laser crystal (16), and the optical path from the third lens (9) to the second laser crystal (16) is greater than the optical path from the second lens (5) to the second laser crystal (16). The output spot diameter of the first laser beam (L1) is r1, the output spot diameter of the third laser beam (L3) is r2, and the output spot diameter of the fourth laser beam (L4) is r3, where r3>r2>r1.
2. The ring-spot laser processing system according to claim 1, characterized in that... It also includes a first displacement mechanism (6), a second displacement mechanism (10) and a third displacement mechanism (20); The first displacement mechanism (6) connects to or carries the second lens (5), driving the second lens (5) to move back and forth along the direction parallel to the optical path; The second displacement mechanism (10) connects to or carries the third lens (9), driving the third lens (9) to move back and forth along the direction parallel to the optical path; The third displacement mechanism (20) connects to or carries the fourth lens (18), and can drive the fourth lens (18) to move back and forth along the direction parallel to the optical path.
3. The annular spot laser processing system according to claim 1, characterized in that, It also includes a window (12) located between the sixth dichroic mirror (19) and the galvanometer mechanism (13) for sealing the annular spot laser processing system.
4. The ring-spot laser processing system according to claim 1, characterized in that... The power density of the first laser beam (L1), the third laser beam (L3), and the fourth laser beam (L4) can be adjusted by changing the conversion efficiency of the first laser crystal (3) and / or the second laser crystal (16).
5. The ring-spot laser processing system according to claim 1, characterized in that... The fourth dichroic mirror (11) is coated with a high reflective film of 500-550nm and an anti-reflective film of 330-367nm. The sixth dichroic mirror (19) is coated with an anti-reflective film of 330-367nm, a high reflective film of 500-550nm and a high reflective film of 1000-1100nm.
6. The ring-spot laser processing system according to claim 1, characterized in that... It also includes a seventh dichroic mirror (21), which is located between the sixth dichroic mirror (19) and the galvanometer mechanism (13) and is used to redirect the transmission direction of the three-wave composite laser beam. The sixth dichroic mirror (19) adjusts the first laser beam (L1), the third laser beam (L3) and the fourth laser beam (L4) to the same laser output direction by coating with a high reflective film of 330-367nm and 500-550nm and an anti-reflective film of 1000-1100nm.
7. The annular spot laser processing system according to claim 1, characterized in that, The first lens (2) is coated with an anti-reflection film of 1000-1100nm. The first laser crystal (3) is coated with an anti-reflection film of 1000-1100nm on the side close to the first lens (2) and with anti-reflection films of 500-550nm and 1000-1100nm on the side away from the first lens (2). The second laser crystal (16) is coated with an anti-reflection film of 500-550nm and 1000-1100nm on the side close to the first laser crystal (3) and with anti-reflection films of 330-367nm, 500-550nm and 1000-1100nm on the side away from the first laser crystal (3).
8. The annular spot laser processing system according to claim 1, characterized in that, The second lens (5) is coated with an anti-reflection film of 330-367nm, the third lens (9) is coated with an anti-reflection film of 500-550nm, and the fourth lens (18) is coated with an anti-reflection film of 1000-1100nm.
9. The annular spot laser processing system according to claim 3, characterized in that, The second dichroic mirror (7) has a high reflectivity film of 330-367nm and an anti-reflection film of 500-550nm and 1000-1100nm on the side surface near the second lens (5), and an anti-reflection film of 500-550nm and 1000-1100nm on the side surface away from the second lens (5).
Citation Information
Patent Citations
Method for adjusting a laser light spot and laser assembly for carrying out the method
CN102642084A
Optical fiber laser annular light spot and semiconductor laser dual-wavelength composite welding head
CN114393297A