A device for screening gallium nitride semiconductor devices and a method of using the same

Abstract

The application provides a gallium nitride semiconductor device screening device and a use method thereof, and belongs to the technical field of gallium nitride semiconductor devices. The device comprises a support base, a shell is fixedly arranged above the support base, movement grooves are equidistantly arranged on the shell, the widths of the movement grooves increase from left to right, a track plate is arranged in the movement grooves, a first guide plate is arranged above the track plate, a second guide plate is arranged at the front end of the first guide plate, a connecting table is fixedly arranged on the shell, a first connecting plate and a second connecting plate are oppositely arranged above the connecting table, a storage box is fixedly connected between the first connecting plate and the second connecting plate, and an electric push rod is fixedly arranged in the storage box. The application can prevent the semiconductor device from falling off when the semiconductor device with the back upward is turned over, and can automatically adjust the conveying position after turning over.

Description

Technical Field

[0001] This invention relates to the field of gallium nitride semiconductor device technology, specifically to a gallium nitride semiconductor device screening device and its usage method. Background Technology

[0002] Gallium nitride (GaN) is a III-V compound semiconductor material with excellent electronic and optical properties, high thermal stability, and a large bandgap. Semiconductor devices based on gallium nitride have broad application prospects in power electronics, radio frequency electronics, and optoelectronics. Screening devices are required in the semiconductor device manufacturing process, but existing screening devices have some shortcomings.

[0003] For example, the automatic semiconductor device sorting device and its usage method disclosed in CN114130714A can automatically detect and sort semiconductor devices. This device boasts high speed, efficiency, and accuracy, and most importantly, it improves production efficiency while freeing up manpower and reducing labor costs. However, while this device can reduce labor costs, in actual use, it cannot automatically classify and transport semiconductor devices of different widths and lengths. Furthermore, existing semiconductor device sorting devices cannot prevent semiconductor devices from falling off when flipping them over (with the reverse side facing up), nor can they automatically adjust the transport position after flipping. Summary of the Invention

[0004] In view of the problems existing in the current semiconductor device screening device, the present invention is proposed.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a screening device for gallium nitride semiconductor devices, including a support base, a housing fixedly disposed above the support base, movable slots equally spaced on the housing, the width of each movable slot increasing from left to right, a track plate placed inside the movable slot, a first guide plate installed above the track plate, a second guide plate disposed at the front end of the first guide plate, a connecting platform fixedly disposed on the housing, a first connecting plate and a second connecting plate opposite each other above the connecting platform, a storage box fixedly connected between the first connecting plate and the second connecting plate, an electric push rod fixedly installed inside the storage box, a fixed plate connected to the left side of the electric push rod, a rubber plate fixedly disposed on the inner wall of the storage box, a driving assembly installed below the storage box, a guide cylinder installed on the driving assembly, a push plate fixedly connected to the bottom of the guide cylinder, and a discharge assembly installed on the storage box;

[0006] An industrial camera is installed inside the connecting platform, a mirror sensor is installed at the front end of the connecting platform, a front plate is fixedly connected to the connecting platform, a second motor is fixedly installed inside the front plate, a rotating plate is fixedly connected to the output shaft of the second motor, and a reflector is fixedly installed above the rotating plate.

[0007] An anti-detachment component is installed on the rotating plate. A first conveyor belt is installed at the front end of the front plate. A rotating roller is installed on the first conveyor belt. An actuating component is installed on the rotating roller. An adjusting component is provided below the first conveyor belt. A third screw is installed on the bearing on the track plate. A convex plate is installed on the middle thread of the third screw. The convex plate and the outer shell are fixedly connected.

[0008] As a preferred embodiment of the present invention, the driving assembly includes a first motor fixedly mounted on the first connecting plate, a first screw fixedly connected to the output shaft of the first motor, the first screw being rotatably connected to both the first connecting plate and the second connecting plate, the first screw being threadedly connected to the guide cylinder, a guide rod being disposed through the guide cylinder, and push plates being symmetrically distributed on the left and right sides of the guide cylinder.

[0009] As a preferred embodiment of the present invention, the rubber plates are symmetrically distributed on the front and rear sides inside the storage box, and the first connecting plate, the second connecting plate, the storage box and the rubber plates are a whole.

[0010] As a preferred embodiment of the present invention, the discharge assembly includes an opening formed on the storage box, an inner plate slidably installed inside the opening, a connecting rod fixedly connected to the left side of the inner plate, and the connecting rod being connected to the second connecting plate via a first spring.

[0011] As a preferred embodiment of the present invention, ball bearings are rotatably mounted on the front plate, and the ball bearings are evenly distributed on the front plate.

[0012] As a preferred embodiment of the present invention, the actuating assembly includes a lever fixedly installed below the rotating roller, a damping sleeve fixedly connected below the lever, a second screw threaded on the internal thread of the lever, a fixing block fixedly installed on the lever, a sliding sleeve slidably installed on the right side of the fixing block, a second spring fixedly installed on the right side of the fixing block, the right end of the second spring being connected to the sliding sleeve, and a leaf spring fixedly installed below the sliding sleeve.

[0013] As a preferred embodiment of the present invention, the fixing block, the sliding sleeve, the second spring, and the leaf spring constitute a clamping structure for the damping sleeve and the second screw, and the central axes of the lever, the damping sleeve, and the second screw are on the same straight line.

[0014] In one preferred embodiment of the present invention, the adjusting assembly includes a connecting shell fixedly mounted on a front plate. The connecting shell is sequentially fitted with a first connecting plate, a second connecting plate, and a third connecting plate from bottom to top. The second and third connecting plates are slidably connected to the connecting shell, while the first connecting plate is fixedly connected to the connecting shell. A protruding rod is fixedly provided on both the second and third connecting plates. A third spring is fixedly connected to both the second and third connecting plates and the connecting shell. A second conveyor belt is equidistantly installed inside the connecting shell, and a third conveyor belt is installed at the front end of the connecting shell. Guide blocks are fixedly provided on the surfaces of both the second and third connecting plates. When the lever rotates, it moves the protruding rod and the third connecting plate backward.

[0015] As a preferred embodiment of the present invention, the anti-detachment component includes a sliding plate that is limited and slidably installed inside the rotating plate, a fourth spring that is fixedly connected between the sliding plate and the rotating plate, a magnetic rod that is fixedly connected below the sliding plate, a magnetic block that is attracted below the magnetic rod, a sliding connection between the magnetic rod and the rotating plate, and a fixed connection between the magnetic block and the front plate.

[0016] A method of using a gallium nitride semiconductor device screening apparatus includes the following steps:

[0017] S1: The support base is used to support the entire device. Gallium nitride semiconductor devices are placed side by side inside the storage box. By extending the electric push rod, the gallium nitride semiconductor devices are pushed to the left by the fixing plate. The gallium nitride semiconductor devices squeeze the rubber plate, so that the gallium nitride semiconductor devices can move to the next set of rubber plates one by one until each gallium nitride semiconductor device moves to the far left of the storage box.

[0018] S2: The drive component drives the guide cylinder to move to the left, so that the guide cylinder acts on the discharge component, causing the discharge component to be pushed to the left. The gallium nitride semiconductor device falls into the interior of the guide cylinder. The drive component drives the guide cylinder to move to the right. The upper part of the gallium nitride semiconductor device is located inside the guide cylinder. The front and rear sides of the lower part of the guide cylinder are located between the second guide plate and the first guide plate, respectively. The front and rear positions of the track plate are adjusted by the third screw 28, changing the distance between the second guide plate and the first guide plate. The distance between each set of second guide plates and first guide plates increases from left to right. Gallium nitride semiconductor devices of different sizes are transported to moving slots of different widths and different distances between the second guide plate and the first guide plate.

[0019] S3: When the gallium nitride semiconductor device passes through the connecting table, the industrial camera on the connecting table identifies the front and back of the gallium nitride semiconductor device based on the edge contour of the gallium nitride semiconductor device. When the back of the gallium nitride semiconductor device is facing up, the mirror sensor does not receive the reflected light signal. At this time, the second motor drives the rotating plate to rotate on the front plate. When the rotating plate rotates, the anti-detachment component automatically protrudes to prevent the gallium nitride semiconductor device from detaching from the device when flipping. When the front of the gallium nitride semiconductor device is facing up, the gallium nitride semiconductor device moves to the surface of the first conveyor belt.

[0020] S4: The first conveyor belt transports the gallium nitride semiconductor device to the adjustment assembly. When the first conveyor belt is working, the rollers rotate continuously. The rollers drive the actuation assembly to rotate. The actuation assembly actuates the right side of the adjustment assembly. By changing the actuation position of the actuation assembly, the aligned gallium nitride semiconductor device is pushed outward from different positions of the adjustment assembly.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] 1. By setting up moving grooves with increasing width from left to right, in conjunction with retractable track plates and first guide plates, the spacing between each set of second guide plates and first guide plates is adjusted to increase from left to right. This allows semiconductor devices of corresponding sizes to automatically fall into the moving grooves and track plates at the corresponding positions when the guide cylinder on the device moves to the right. This achieves the function of automatically conveying and classifying semiconductor devices of different lengths and widths, solving the defect of existing screening devices that cannot automatically classify and convey semiconductor devices of different widths and lengths.

[0023] 2. By using the anti-detachment component on the device, when the industrial camera detects that the semiconductor device is facing up, the second motor drives the rotating plate to rotate. When the rotating plate rotates, the magnetic rod and magnetic block can be disengaged. The sliding plate automatically extends from the rotating plate under the action of the fourth spring. This allows the device to automatically block the back of the semiconductor device when flipping it over, solving the defect of the semiconductor device screening device that cannot prevent the semiconductor device from falling off when flipping the semiconductor device facing up.

[0024] 3. By adjusting the toggle and adjustment components, the device can adjust the extension of the second screw. The second screw acts on different numbers and positions of the protruding rods, so that the protruding rods can drive the first connecting plate, the second connecting plate and the third connecting plate to move backward, or act only on the first connecting plate, so that the first connecting plate moves backward. This allows the device to automatically adjust the conveying position after flipping, improving the convenience of using the device.

[0025] 4. By using the second spring and leaf spring, the second spring pulls the leaf spring, causing the leaf spring to press against the damping sleeve, which in turn presses against the second screw, thus achieving the function of adjusting and fixing the position of the second screw. After the length of the second screw is adjusted and fixed, the second screw can stably move the protruding rod at different positions, ensuring the stability of the device during use.

[0026] 5. By setting the discharge component, after the guide cylinder moves to the far left, the guide cylinder can abut against the protruding part under the inner plate. At this time, the inner plate and the connecting rod are pushed to the left, the first spring is stretched, and the opening is opened to realize the function of discharging one by one. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0028] Figure 1 This is a schematic diagram of the overall structure of a gallium nitride semiconductor device screening device according to the present invention;

[0029] Figure 2 yes Figure 1 Schematic diagram of the structure at point A in the middle;

[0030] Figure 3 This is a schematic diagram of the connection structure between the second motor and the rotating plate of the present invention;

[0031] Figure 4 This is a schematic diagram of the connection structure between the rotating plate and the anti-detachment component of the present invention;

[0032] Figure 5 This is a schematic diagram of the connection structure between the outer shell and the connecting platform of the present invention;

[0033] Figure 6 yes Figure 5 Schematic diagram of the structure at point B;

[0034] Figure 7 yes Figure 5 Schematic diagram of the structure at point C;

[0035] Figure 8 This is a schematic diagram of the connection structure between the guide rod and the guide cylinder of the present invention;

[0036] Figure 9 This is a schematic diagram of the connection structure between the guide cylinder and the push plate of the present invention;

[0037] Figure 10 This is a schematic diagram of the connection structure between the outer shell and the protruding plate of the present invention;

[0038] Figure 11 yes Figure 10 Schematic diagram of the structure at point D;

[0039] Figure 12 This is a schematic diagram of the connection structure between the front plate and the rotating plate of the present invention;

[0040] Figure 13 This is a schematic diagram of the connection structure between the rotating drum and the lever of the present invention;

[0041] Figure 14 yes Figure 13 Schematic diagram of the structure at point E in the middle.

[0042] Reference numerals: 1. Support base; 2. Outer shell; 3. Moving groove; 4. Track plate; 5. Connecting platform; 6. First connecting plate; 7. Drive assembly; 701. First motor; 702. First screw; 703. Guide rod; 8. Guide cylinder; 9. Push plate; 10. Second connecting plate; 11. Storage box; 12. Electric push rod; 13. Fixing plate; 14. Rubber plate; 15. Discharge assembly; 1501. Opening; 1502. Inner plate; 1503. Connecting rod; 1504. First spring; 16. Industrial camera; 17. Mirror sensor; 18. Front plate; 19. Reflector; 20. Rotating plate; 21. Ball bearing; 22. First conveyor belt; 23. Rotating roller; 24. Actuating assembly; 2401. 2402. Lever; 2403. Damping sleeve; 2404. Second screw; 2405. Fixing block; 2406. Sliding sleeve; 2407. Second spring; 2408. Leaf spring; 25. Adjusting assembly; 2501. Connecting shell; 2502. First connecting plate; 2503. Second connecting plate; 2504. Third connecting plate; 2505. Protruding rod; 2506. Third spring; 2507. Second conveyor belt; 2508. Third conveyor belt; 2509. Guide block; 26. Second motor; 27. Anti-detachment assembly; 2701. Slide plate; 2702. Fourth spring; 2703. Magnetic rod; 2704. Magnetic block; 28. Third screw; 29. ​​Protruding plate; 30. First guide plate; 31. Second guide plate. Detailed Implementation

[0043] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0044] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0045] Secondly, the present invention is described in detail with reference to the schematic diagrams. When describing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include the three-dimensional spatial dimensions of length, width, and depth. Example

[0046] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0047] like Figures 1-14 As shown, a gallium nitride semiconductor device screening device includes a support base 1, a housing 2 fixedly mounted above the support base 1, and movable grooves 3 evenly spaced on the housing 2. The width of each movable groove 3 increases from left to right. A track plate 4 is placed inside the movable groove 3, and a first guide plate 30 is mounted above the track plate 4. A second guide plate 31 is positioned at the front end of the first guide plate 30. Semiconductor devices fall between the first guide plate 30 and the second guide plate 31. By adjusting the front and rear positions of the first guide plate 30, semiconductor devices of different sizes can be automatically screened. A connecting platform 5 is fixedly mounted on the housing 2, and a first connecting plate 6 and a second connecting plate 10 are positioned opposite each other above the connecting platform 5. A storage box 11 is fixedly connected between the connecting plate 6 and the second connecting plate 10. An electric push rod 12 is fixedly installed inside the storage box 11. A fixed plate 13 is connected to the left side of the electric push rod 12. A rubber plate 14 is fixedly installed on the inner wall of the storage box 11. A drive assembly 7 is installed below the storage box 11. The electric push rod 12 pushes the fixed plate 13, which automatically moves multiple semiconductor devices in the storage box 11 to the left. A guide cylinder 8 is installed on the drive assembly 7. A push plate 9 is fixedly connected to the bottom of the guide cylinder 8. A discharge assembly 15 is installed on the storage box 11. When the drive assembly 7 drives the guide cylinder 8 to move to the leftmost position, the guide cylinder 8 can act on the discharge assembly 15 to realize the function of discharging one by one, ensuring that there is no confusion during screening.

[0048] An industrial camera 16 is installed inside the connecting platform 5. The industrial camera 16 monitors the front and back of the semiconductor device by scanning the outline of the semiconductor device. A mirror sensor 17 is installed at the front end of the connecting platform 5. A front plate 18 is fixedly connected to the connecting platform 5. A second motor 26 is fixedly installed inside the front plate 18. A rotating plate 20 is fixedly connected to the output shaft of the second motor 26. A reflector 19 is fixedly installed above the rotating plate 20. When the back of the semiconductor device is facing up and the reflector 19 is blocked so that the mirror sensor 17 cannot receive the reflected signal, the second motor 26 can drive the rotating plate 20 to rotate, thereby realizing the function of flipping the semiconductor device.

[0049] An anti-detachment component 27 is installed on the rotating plate 20. A first conveyor belt 22 is installed at the front end of the front plate 18. A rotating roller 23 is installed on the first conveyor belt 22. An actuating component 24 is installed on the rotating roller 23. An adjusting component 25 is set below the first conveyor belt 22. The actuating component 24 can adjust the position of its own actuating adjusting component 25, thereby adjusting the discharge position during the actuation of the adjusting component 25. A third screw 28 is installed on the bearing of the track plate 4. A convex plate 29 is installed on the middle thread of the third screw 28. The convex plate 29 and the outer shell 2 are fixedly connected. The third screw 28 is used to adjust the front and rear position of the track plate 4 so as to screen semiconductor devices of different lengths. The adjusting component 25 can adjust the discharge position of the semiconductor devices.

[0050] In this example, the drive assembly 7 includes a first motor 701 fixedly mounted on the first connecting plate 6. A first screw 702 is fixedly connected to the output shaft of the first motor 701. The first screw 702 is rotatably connected to both the first connecting plate 6 and the second connecting plate 10. The first screw 702 is threadedly connected to the guide cylinder 8. A guide rod 703 is provided through the guide cylinder 8. Push plates 9 are symmetrically distributed on the left and right sides of the guide cylinder 8. The first motor 701 can drive the first screw 702 to rotate. When the first screw 702 rotates, it can drive the guide cylinder 8 to move back and forth, so that the guide cylinder 8 can move back and forth and push the semiconductor device with the push plates 9, so as to realize the function of automatic screening of semiconductor devices.

[0051] In this example, the rubber plates 14 are symmetrically distributed on the front and rear sides inside the storage box 11. The first connecting plate 6, the second connecting plate 10, the storage box 11 and the rubber plates 14 are a whole, ensuring the overall stability of the device. The rubber plates 14 enable the semiconductor devices to be automatically separated when pushed to the left, improving the stability of the device during use.

[0052] In this example, the discharge assembly 15 includes an opening 1501 formed on the storage box 11. An inner plate 1502 is slidably installed inside the opening 1501. A connecting rod 1503 is fixedly connected to the left side of the inner plate 1502. The connecting rod 1503 is connected to the second connecting plate 10 through a first spring 1504. The inner plate 1502 can be pushed to the left, so that the connecting rod 1503 is pushed to the left, the first spring 1504 is stretched, and the opening 1501 is opened, realizing the function of discharging materials one by one, ensuring that the gallium nitride semiconductor devices are not confused during discharging.

[0053] In this example, a ball bearing 21 is rotatably mounted on the front plate 18. The ball bearing 21 is evenly distributed on the front plate 18. When the semiconductor device slides down the inclined plane, it will also slide off the front plate 18 through the ball bearing 21, which reduces the sliding resistance of the semiconductor device.

[0054] In this example, the actuating assembly 24 includes a lever 2401 fixedly installed below the rotating roller 23. A damping sleeve 2402 is fixedly connected below the lever 2401. A second screw 2403 is installed on the internal thread of the lever 2401. A fixing block 2404 is fixedly installed on the lever 2401. A sliding sleeve 2405 is slidably installed on the right side of the fixing block 2404. A second spring 2406 is fixedly installed on the right side of the fixing block 2404. The right end of the second spring 2406 is connected to the sliding sleeve 2405. A leaf spring 2407 is fixedly installed below the sliding sleeve 2405. When the rotating roller 23 rotates continuously, the lever 2401 and the second screw 2403 rotate counterclockwise. The second screw 2403 can adjust its own position so that the semiconductor device can fall to different positions, thereby realizing the function of adjusting the discharge position.

[0055] In this example, the fixed block 2404, the sliding sleeve 2405, the second spring 2406, and the leaf spring 2407 constitute a clamping structure for the damping sleeve 2402 and the second screw 2403. The central axes of the lever 2401, the damping sleeve 2402, and the second screw 2403 are on the same straight line. Through the clamping structure on the device, the second spring 2406 can pull the leaf spring 2407, thereby causing the leaf spring 2407 to press against the damping sleeve 2402 and the second screw 2403. This allows the second screw 2403 to remain fixed after adjusting its position, ensuring the overall stability of the device and preventing the second screw 2403 from shifting when it is turned.

[0056] In this example, the adjustment assembly 25 includes a connecting shell 2501 fixedly mounted on the front plate 18. From bottom to top, the connecting shell 2501 is sequentially fitted with a first connecting plate 2502, a second connecting plate 2503, and a third connecting plate 2504. The second connecting plate 2503 and the third connecting plate 2504 are slidably connected to the connecting shell 2501, while the first connecting plate 2502 is fixedly connected to the connecting shell 2501. Both the second connecting plate 2503 and the third connecting plate 2504 are fixedly provided with protruding rods 2505. A third spring 2506 is fixedly connected to both the second connecting plate 2503 and the third connecting plate 2504 and the connecting shell 2501. The interior of the housing 2501 is equidistantly equipped with second conveyor belts 2507 and third conveyor belts 2508. Guide blocks 2509 are fixedly provided on the surfaces of the second connecting plate 2503 and the third connecting plate 2504. When the lever 2401 rotates, it moves the protruding rod 2505 and the third connecting plate 2504 backward, so that the semiconductor device falling on the third connecting plate 2504 falls downward. The position of the lever can be adjusted so that the semiconductor device can fall on the second connecting plate 2503 or the third connecting plate 2504. Finally, it is discharged through the second conveyor belt 2507 and the third conveyor belt 2508 at the corresponding positions, so as to realize the function of adjusting the discharge position.

[0057] In this example, the anti-detachment component 27 includes a sliding plate 2701 that is limited and slidably installed inside the rotating plate 20. A fourth spring 2702 is fixedly connected between the sliding plate 2701 and the rotating plate 20. A magnetic rod 2703 is fixedly connected below the sliding plate 2701. A magnetic block 2704 is attracted below the magnetic rod 2703. The magnetic rod 2703 and the rotating plate 20 are slidably connected. The magnetic block 2704 and the front plate 18 are fixedly connected. When the rotating plate 20 rotates counterclockwise, the magnetic rod 2703 and the magnetic block 2704 are disengaged, thereby causing the fourth spring 2702 to lift the sliding plate 2701 and prevent the semiconductor device from falling off when flipping the semiconductor device.

[0058] It should be noted that this invention relates to a screening device for gallium nitride semiconductor devices and a method for using the same, such as... Figure 1 , Figure 2 and Figures 5-10 As shown, firstly, the support base 1 is used to support the outer shell 2. The first connecting plate 6 and the second connecting plate 10 are fixed to the top of the wall to suspend the storage box 11. The gallium nitride semiconductor devices are placed side by side inside the storage box 11. By extending the electric push rod 12, the gallium nitride semiconductor devices are pushed to the left by the fixing plate 13. The gallium nitride semiconductor devices squeeze the rubber plate 14, so that the gallium nitride semiconductor devices can move to the next set of rubber plates 14 one after another until each gallium nitride semiconductor device moves to the leftmost side of the storage box 11. Driven by drive assembly 7, guide cylinder 8 moves to the left. First motor 701 drives first screw 702 to rotate on first connecting plate 6 and second connecting plate 10. Guide cylinder 8 moves left and right under the limiting action of guide rod 703. During the movement, guide cylinder 8 acts on discharge assembly 15, pressing against inner plate 1502 and moving to the left. First spring 1504 on connecting rod 1503 is stretched, opening 1501, and gallium nitride semiconductor device falls into the interior of guide cylinder 8, realizing automatic material discharge. Drive assembly 7 then drives guide cylinder 8 to move to the right. The upper half of gallium nitride semiconductor device is located inside guide cylinder 8, and the lower half of guide cylinder 8 is located at the front and rear ends. The sides are located between the second guide plate 31 and the first guide plate 30, respectively. The front and rear positions of the track plate 4 are adjusted by the third screw 28, changing the distance between the second guide plate 31 and the first guide plate 30. The distance between each set of second guide plates 31 and first guide plates 30 is adjusted to increase from left to right. Since the width of each moving slot 3 and track plate 4 increases from left to right, when the push plate 9 moves the semiconductor device to the right, it can automatically transport gallium nitride semiconductor devices of different sizes to moving slots 3 of different widths and different distances between the second guide plate 31 and the first guide plate 30, realizing the function of automatic classification of gallium nitride semiconductor devices of different sizes.

[0059] like Figures 1-5 and Figures 8-14 As shown, when the gallium nitride semiconductor device passes through the connecting platform 5, the industrial camera 16 on the connecting platform 5 identifies the front and back of the gallium nitride semiconductor device based on the edge contour of the gallium nitride semiconductor device. When the back of the gallium nitride semiconductor device is facing up, and the gallium nitride semiconductor device moves to the reflector 19, the mirror sensor 17 does not receive the reflected light signal. At this time, the second motor 26 drives the rotating plate 20 to rotate on the front plate 18. When the rotating plate 20 rotates, it can cause the magnetic rod 2703 and the magnetic block 2704 to disengage from the adsorption state. The sliding plate 2701 automatically extends from the rotating plate 20 under the action of the fourth spring 2702, so that the device can automatically block the back of the semiconductor device when flipping the semiconductor device. This allows the semiconductor device screening device to prevent the semiconductor device from falling off when flipping the back of the semiconductor device. When the front of the gallium nitride semiconductor device is facing up, the gallium nitride semiconductor device moves to the surface of the first conveyor belt 22 via the ball bearing 21. The first conveyor belt 22 transports gallium nitride semiconductor devices to the adjustment assembly 25. During operation, the first conveyor belt 22 continuously rotates the roller 23, which drives the actuating assembly 24 to rotate. The actuating assembly 24 actuates the right side of the adjustment assembly 25. By changing the actuating position of the actuating assembly 24, the aligned gallium nitride semiconductor devices are pushed outward from different positions of the adjustment assembly 25. By adjusting the extension of the second screw 2403, the second screw 2403 below the lever 2401 acts on different numbers and positions of the protrusions 2505, so that the protrusions 2505 can drive the first connecting plate 2502, the second connecting plate 2503 and the third connecting plate to move backward, or act only on the first connecting plate 2502, so that the first connecting plate 2502 moves backward. This allows the device to automatically adjust the conveying position after flipping. The guide block 2509 can guide the semiconductor devices so that they can fall onto the second conveyor belt 2507 and the third conveyor belt 2508 at different positions. The second spring 2406 pulls the leaf spring 2407, causing the leaf spring 2407 to press against the damping sleeve 2402, which in turn causes the damping sleeve 2402 to press against the second screw 2403. After the length of the second screw 2403 is adjusted and fixed, the second screw 2403 can stably move the protruding rod 2505 at different positions, ensuring the stability of the device during use.

[0060] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the invention. In particular, as long as there is no structural conflict, the features in the disclosed embodiments can be combined with each other in any manner. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A screening device for gallium nitride semiconductor devices, comprising a support base (1), characterized in that: A housing (2) is fixedly installed above the support base (1). Equally spaced moving slots (3) are provided on the housing (2). The width of each moving slot (3) increases from left to right. A track plate (4) is placed inside each moving slot (3). A first guide plate (30) is installed above the track plate (4). A second guide plate (31) is provided at the front end of the first guide plate (30). A connecting platform (5) is fixedly installed on the housing (2). A first connecting plate (6) and a second connecting plate (10) are arranged opposite each other above the connecting platform (5). A storage box (11) is fixedly connected between the first connecting plate (6) and the second connecting plate (10). An electric push rod (12) is fixedly installed inside the storage box (11). A fixing plate (13) is connected to the left side of the electric push rod (12). A rubber plate (14) is fixedly installed on the inner wall of the storage box (11). A drive assembly (7) is installed below the storage box (11). A guide cylinder (8) is installed on the drive assembly (7). A push plate (9) is fixedly connected to the bottom of the guide cylinder (8). A discharge assembly (15) is installed on the storage box (11). An industrial camera (16) is installed inside the connecting platform (5). A mirror sensor (17) is installed at the front end of the connecting platform (5). A front plate (18) is fixedly connected to the connecting platform (5). A second motor (26) is fixedly installed inside the front plate (18). A rotating plate (20) is fixedly connected to the output shaft of the second motor (26). A reflector (19) is fixedly installed above the rotating plate (20). An anti-detachment component (27) is installed on the rotating plate (20). A first conveyor belt (22) is installed at the front end of the front plate (18). A rotating roller (23) is installed on the first conveyor belt (22). An actuating component (24) is installed on the rotating roller (23). An adjusting component (25) is provided below the first conveyor belt (22). A third screw (28) is installed on the bearing of the track plate (4). A convex plate (29) is installed on the middle thread of the third screw (28). The convex plate (29) and the outer shell (2) are fixedly connected.

2. The gallium nitride semiconductor device screening device according to claim 1, characterized in that: The drive assembly (7) includes a first motor (701) fixedly mounted on the first connecting plate (6). A first screw (702) is fixedly connected to the output shaft of the first motor (701). The first screw (702) is rotatably connected to the first connecting plate (6) and the second connecting plate (10). The first screw (702) is threadedly connected to the guide cylinder (8). A guide rod (703) is provided through the guide cylinder (8). The push plate (9) is symmetrically distributed on the left and right sides of the guide cylinder (8).

3. The gallium nitride semiconductor device screening device according to claim 1, characterized in that: The rubber plate (14) is symmetrically distributed on the front and rear sides inside the storage box (11), and the first connecting plate (6), the second connecting plate (10), the storage box (11) and the rubber plate (14) are a whole.

4. The gallium nitride semiconductor device screening device according to claim 1, characterized in that: The discharge assembly (15) includes an opening (1501) on the storage box (11), an inner plate (1502) is slidably installed inside the opening (1501), a connecting rod (1503) is fixedly connected to the left side of the inner plate (1502), and the connecting rod (1503) is connected to the second connecting plate (10) through a first spring (1504).

5. The gallium nitride semiconductor device screening device according to claim 1, characterized in that: Ball bearings (21) are rotatably mounted on the front plate (18), and the ball bearings (21) are evenly distributed on the front plate (18).

6. The gallium nitride semiconductor device screening device according to claim 1, characterized in that: The actuating assembly (24) includes a lever (2401) fixedly installed below the rotating roller (23), a damping sleeve (2402) fixedly connected below the lever (2401), a second screw (2403) installed on the internal thread of the lever (2401), a fixing block (2404) fixedly installed on the lever (2401), a sliding sleeve (2405) slidably installed on the right side of the fixing block (2404), a second spring (2406) fixedly installed on the right side of the fixing block (2404), the right end of the second spring (2406) being connected to the sliding sleeve (2405), and a leaf spring (2407) fixedly installed below the sliding sleeve (2405).

7. The gallium nitride semiconductor device screening device according to claim 6, characterized in that: The fixed block (2404), the sliding sleeve (2405), the second spring (2406) and the leaf spring (2407) constitute a pressing structure for the damping sleeve (2402) and the second screw (2403). The central axes of the lever (2401), the damping sleeve (2402) and the second screw (2403) are on the same straight line.

8. The gallium nitride semiconductor device screening device according to claim 6, characterized in that: The adjustment assembly (25) includes a connecting shell (2501) fixedly mounted on the front plate (18). The connecting shell (2501) has a first connecting plate (2502), a second connecting plate (2503), and a third connecting plate (2504) installed sequentially from bottom to top. The second connecting plate (2503) and the third connecting plate (2504) are slidably connected to the connecting shell (2501), while the first connecting plate (2502) is fixedly connected to the connecting shell (2501). Both the second connecting plate (2503) and the third connecting plate (2504) have protruding rods fixedly provided on them. 2505), the second connecting plate (2503) and the third connecting plate (2504) are all fixedly connected to the connecting shell (2501) with a third spring (2506), the second conveyor belt (2507) is installed at equal intervals inside the connecting shell (2501), the third conveyor belt (2508) is installed at the front end of the connecting shell (2501), the second connecting plate (2503) and the third connecting plate (2504) are all fixedly provided with guide blocks (2509), when the lever (2401) rotates, it pushes the protruding rod (2505) and the third connecting plate (2504) to move backward.

9. The gallium nitride semiconductor device screening device according to claim 1, characterized in that: The anti-detachment component (27) includes a sliding plate (2701) that is limited and slidably installed inside the rotating plate (20). A fourth spring (2702) is fixedly connected between the sliding plate (2701) and the rotating plate (20). A magnetic rod (2703) is fixedly connected below the sliding plate (2701). A magnetic block (2704) is attracted below the magnetic rod (2703). The magnetic rod (2703) and the rotating plate (20) are slidably connected. The magnetic block (2704) and the front plate (18) are fixedly connected.

10. A method of using a gallium nitride semiconductor device screening device, comprising the gallium nitride semiconductor device screening device as described in claim 1, characterized in that, Includes the following steps: S1: The support base (1) is used to support the whole device. The gallium nitride semiconductor devices are placed side by side inside the storage box (11). By extending the electric push rod (12), the gallium nitride semiconductor devices are pushed to the left by the fixing plate (13). The gallium nitride semiconductor devices squeeze the rubber plate (14), so that the gallium nitride semiconductor devices can move to the next set of rubber plates (14) one after another until each gallium nitride semiconductor device moves to the leftmost side of the storage box (11). S2: Drive the guide cylinder (8) to move to the left by the drive component (7), so that the guide cylinder (8) acts on the discharge component (15), so that the discharge component (15) is pushed to the left and the gallium nitride semiconductor device falls into the interior of the guide cylinder (8). Drive the guide cylinder (8) to move to the right by the drive component (7). The upper part of the gallium nitride semiconductor device is located inside the guide cylinder (8). The front and rear sides of the lower part of the guide cylinder (8) are located between the second guide plate (31) and the first guide plate (30) respectively. The front and rear positions of the track plate (4) are adjusted by the third screw (28) to change the distance between the second guide plate (31) and the first guide plate (30). The distance between each group of second guide plates (31) and first guide plates (30) increases from left to right. Gallium nitride semiconductor devices of different sizes are transported to the moving slots (3) with different widths and different distances between the second guide plates (31) and the first guide plates (30). S3: When the gallium nitride semiconductor device passes through the connecting platform (5), the industrial camera (16) on the connecting platform (5) identifies the front and back of the gallium nitride semiconductor device according to the edge contour of the gallium nitride semiconductor device. When the back of the gallium nitride semiconductor device is facing up, the mirror sensor (17) does not receive the reflected light signal when the gallium nitride semiconductor device moves to the reflector (19). At this time, the second motor (26) drives the turntable (20) to rotate on the front plate (18). When the turntable (20) rotates, the anti-detachment component (27) automatically protrudes to prevent the gallium nitride semiconductor device from detaching from the device when flipping. When the front of the gallium nitride semiconductor device is facing up, the gallium nitride semiconductor device moves to the surface of the first conveyor belt (22). S4: The first conveyor belt (22) transports the gallium nitride semiconductor device to the adjustment component (25). When the first conveyor belt (22) is working, the roller (23) rotates continuously. The roller (23) drives the actuation component (24) to rotate. The actuation component (24) actuates the right side of the adjustment component (25). By changing the actuation position of the actuation component (24), the aligned gallium nitride semiconductor device is pushed outward from different positions of the adjustment component (25).

Images