Thermally conductive silicone rubber cloth with low contact thermal resistance and preparation method thereof

Abstract

The application belongs to the technical field of heat-conducting interface materials, in particular to the field of B29C45 / 00, and more particularly to a low-contact-thermal-resistance heat-conducting silica gel cloth and a preparation method thereof. The preparation raw materials of the heat-conducting silica gel cloth at least include, in terms of mass fraction, 10-30 parts of silicone oil, 140-200 parts of heat-conducting compound powder, 0.1-0.6 parts of a dispersion aid, and 0.1-50 parts of a diluent. The preparation method includes two modes of coating and calendering. The prepared heat-conducting silica gel cloth has a low thermal resistance and a high thermal conductivity, and is particularly suitable for use in high-heating electronic products.

Description

TECHNICAL FIELD

[0001] The present scheme belongs to the technical field of heat-conducting interface materials, in particular to the field of B29C45 / 00, and more particularly to a low-contact-thermal-resistance heat-conducting silica gel cloth and a preparation method thereof. BACKGROUND

[0002] With the progress of society, intelligent and efficient products are constantly emerging, which have changed people's way of life and work. At present, the energy commonly used by most machines or electronic products in society is electricity. When electric current passes through resistance, heat is generated. With the accumulation of heat, if it cannot be dissipated in time, the machine or product may weaken in performance due to high internal temperature, and even cause the machine to crash due to high temperature, causing safety hazards. To solve these problems, people began to develop heat-conducting materials. Heat-conducting materials are a kind of heat-conducting medium materials that can effectively solve the problem of serious heat generation. They mainly act between heat sources and heat sinks and play their role as heat-conducting medium. Precise electronic equipment usually needs good insulation performance, can be very thin and has good mechanical properties. When the voltage on both sides of the insulator continues to increase, the electric charge in the insulator material is subjected to a greater electric field force, which easily leads to ion collision, and the insulator is broken down. This phenomenon is called insulation breakdown, which may cause certain safety hazards. Therefore, a material that can withstand high breakdown voltage, low contact resistance and heat conduction at the same time is needed. Heat-conducting silica gel cloth and tear-resistant silica gel cloth generally have a thickness of 0.2-0.5mm, reduce the thermal resistance between electronic components and heat sinks, and have high insulation, high dielectric strength and good thermal conductivity, which can avoid the problem of circuit short circuit caused by high voltage and piercing of metal parts. At the same time, the heat-conducting silica gel cloth has strong temperature resistance and can avoid aging and deterioration due to long-term overheating, so it is an excellent heat-conducting and insulating material.

[0003] In the electronic industry, the heat-conducting insulating silicone cloth is mainly used for the transfer interface between electronic equipment and heat sinks or product shells. Due to the high reliability, insulation, softness and elasticity, low contact thermal resistance and high thermal conductivity of the heat-conducting insulating silicone cloth, it is widely used in the fields of switching power supply, communication equipment, computer, flat panel television, mobile device, video equipment, network product and household appliance. The common preparation methods of the heat-conducting silicone cloth include calendering and coating. The disadvantages of calendering are that the thickness is easy to be uneven, the production efficiency is slow, and the precision of the calendering equipment is required. The advantages of calendering are that the surface of the product can be smooth, the thermal conductivity is high, and the contact thermal resistance is low. Some products use the coating method, which has the advantages of fast production efficiency, good thickness uniformity and thin thickness. However, the coating method requires low viscosity and small particle size before molding, which is beneficial to coating. The surface of the product prepared by the coating method is not very smooth, resulting in high contact thermal resistance. Based on the above problems, the technical problem to be solved by the present application is to produce a heat-conducting silicone cloth with low thermal resistance, good uniformity and high thermal conductivity by combining the two methods of blade coating and calendering.

[0004] The prior art CN210381717U discloses a composite heat-conducting gasket, which mainly adopts the technical scheme of coating a treatment agent on one side of the heat-conducting silicone cloth, and combining a low-hardness heat-conducting silicone layer, coating a glue layer on the other side, and arranging a release film away from the heat-conducting silicone cloth on the side of the heat-conducting silicone layer, and arranging a release layer away from the heat-conducting silicone cloth on the side of the glue layer. The prior art CN206170755U discloses a heat-conducting silicone cloth, which mainly adopts the technical scheme of connecting an insulating layer with a heat-conducting silicone layer at the bottom, connecting the heat-conducting silicone layer with a bonding layer at the bottom, and connecting the bonding layer with a glass fiber base layer at the bottom. The preparation methods of the above heat-conducting materials are all coating methods, which can improve the production efficiency and the thickness uniformity of the product. However, this method is not suitable for products with high thermal conductivity and low thermal resistance. SUMMARY

[0005] To solve the above problems, the first aspect of the present application provides a heat-conducting silicone cloth with low contact thermal resistance, which is prepared from raw materials including at least 10-30 parts of organic silicone oil, 140-200 parts of heat-conducting compound powder, 0.1-0.6 parts of dispersion aid and 0.1-50 parts of diluent.

[0006] Organic silicone oil

[0007] Preferably, the organic silicone oil is vinyl silicone oil.

[0008] Further preferably, the viscosity of the vinyl silicone oil is 20-500000 mPa·S at 25℃, and the vinyl content is 0.1-0.7%.

[0009] Further preferably, the viscosity of the vinyl silicone oil is 40-300000 mPa·S at 25℃, and the vinyl content is 0.32-0.57%.

[0010] The present applicant found in experiments that when the viscosity of the vinyl silicone oil is 20-500000 mPa·S at 25℃ and the vinyl content is 0.1-0.7%, the prepared heat-conducting silica gel cloth not only has a relatively high thermal conductivity, but also has a relatively small thermal resistance value. The present inventor speculates that when the viscosity of the vinyl silicone oil is too low and the vinyl content is too low, the distance between the heat-conducting compounded powders in the vinyl silicone oil is too large, and the contact between them is too small, which does not significantly improve the heat-conducting performance. When the viscosity of the vinyl silicone oil is too large and the vinyl content is too high, the distance between the heat-conducting compounded powders in the vinyl silicone oil is too small, which will significantly reduce the resistance of the heat-conducting silica gel cloth, which is not conducive to the insulation performance of the product. In addition, when the viscosity is too large, the dispersibility of the heat-conducting compounded powders in the preparation system is relatively poor, and there will be air holes in the interior. The air in the air holes has very poor heat-conducting ability, which will further reduce the heat-conducting performance of the heat-conducting silica gel cloth.

[0011] Thermally conductive compounded powder

[0012] Preferably, the preparation raw material of the heat-conducting compounded powder at least includes one of spherical alumina, boron nitride, non-spherical alumina, aluminum nitride, zinc oxide, magnesium oxide, silicon carbide, silicon nitride, and quartz powder.

[0013] Further preferably, the preparation raw material of the heat-conducting compounded powder includes spherical alumina, non-spherical alumina, and boron nitride.

[0014] Further preferably, the mass ratio of the spherical alumina, the non-spherical alumina, and the boron nitride is (100-120):(60-70):(10-15). As an implementable case, the mass ratio of the spherical alumina, the non-spherical alumina, and the boron nitride can include 100:60:10, 120:65:15, or 110:70:15.

[0015] Further preferably, the particle size of the non-spherical alumina is 0.5-3 μm. As an implementable case, the particle size of the non-spherical alumina can include 0.5 μm, 1 μm, 2 μm, or 3 μm.

[0016] Further preferably, the particle size of the non-spherical alumina at least includes 0.5 μm and 3 μm.

[0017] Further preferably, the mass ratio of the 3 μm non-spherical alumina and the 0.5 μm non-spherical alumina is (40-50):(10-30); as an implementable case, the mass ratio of the 3 μm non-spherical alumina and the 0.5 μm non-spherical alumina can include 40:20, 40:25, 45:20 or 45:25.

[0018] Further preferably, the particle size of the spherical alumina is 10-25 μm; as an implementable case, the particle size of the spherical alumina can include 10 μm, 15 μm, 20 μm or 25 μm.

[0019] Further preferably, the particle size of the boron nitride is 3-20 μm; as an implementable case, the particle size of the boron nitride can include 3 μm, 5 μm, 10 μm, 15 μm or 20 μm.

[0020] In the present application, when the preparation raw material of the heat-conducting compound powder includes spherical alumina, non-spherical alumina, boron nitride, and the mass ratio of the spherical alumina, the non-spherical alumina and the boron nitride is (100-120):(60-70):(10-15), the particle size of the non-spherical alumina at least includes 3 μm and 0.5 μm, the particle size of the spherical alumina is 10-25 μm, and the particle size of the boron nitride is 3-20 μm, the heat-conducting silicone cloth has a higher thermal conductivity and a lower resistance. The present inventor speculates that in the vinyl silicone oil, the spherical alumina is the main component in the heat-conducting filler, the particle size gap between the spherical alumina of a specific particle size can be better filled by the non-spherical alumina powder and the boron nitride, thereby reducing the gap content in the system. Since the thermal conductivity of air is poor and the insulation performance is good, the specific compound heat-conducting compound powder is beneficial to improve the thermal conductivity of the product and can better reduce the thermal resistance, so that the product applied with the heat-conducting silicone cloth will not appear insulation breakdown phenomenon, and the aging rate of the product will not be accelerated due to heat resistance problems.

[0021] Dispersing aid

[0022] Preferably, the dispersing aid at least includes one of modified organosiloxane, stearic acid, aluminate, silane coupling agent, organic bentonite, pentaerythritol ester, acrylate leveling agent and silicon dioxide.

[0023] Further preferably, the dispersing aid at least includes one of silane coupling agent, stearic acid and aluminate.

[0024] In the system of the present application, the specific dispersing aid can improve the dispersion uniformity of the heat-conducting compound powder in the preparation system, improve the processing performance of the product, obtain a higher thermal conductivity and a lower contact thermal resistance, and further improve the surface uniformity.

[0025] Diluent

[0026] Preferably, the diluent includes at least one of n-hexane, methanol, toluene, xylene, cyclohexanone, isopropyl alcohol, isoparaffin, acetone, butanol.

[0027] Further preferably, the diluent includes at least one of acetone, isoparaffin, n-hexane.

[0028] In the system of the present application, the specific diluent can improve the uniformity of the dispersion of the heat-conducting compound powder in the preparation system, so that the product has more suitable bonding and adhesion properties, and thus has a higher thermal conductivity and a lower resistance.

[0029] The second aspect of the present application provides a preparation method of a low-contact-thermal-resistance heat-conducting silicone cloth, including at least the following steps:

[0030] S1, the heat-conducting compound powder is baked in a 170-200℃ vacuum drying oven for 3-5h, and then naturally cooled to 25-30℃ to obtain the heat-conducting powder;

[0031] S2, the silicone oil and the dispersing aid are added and uniformly mixed, and then the diluent is added and uniformly mixed, and then the semi-finished product is obtained after defoaming and packaging;

[0032] S3, the semi-finished product is subjected to the coating process first, and the bottom film is a PI film, which is coated by a doctor blade to a thickness of 0.04-1mm, and then passes through an oven with a length of 3-15m and a speed of 3-20m / min at a temperature of 80-120℃; then the semi-finished product is subjected to the calendering process, and the upper film is a release film with a calendering thickness of 0.01-0.09mm, which passes through an oven with a length of 3-15m and a speed of 0.5-10m / min at a temperature of 80-120℃; after removing the release film, the low-contact-thermal-resistance heat-conducting silicone cloth is obtained after cutting and rewinding once.

[0033] Preferably, the defoaming pressure is a negative pressure of-0.05 to-0.2MPa, and the defoaming time is 20-30min; as an implementable case, the negative pressure can be-0.05MPa, -0.1MPa or-0.2MPa, and the defoaming time can be 20min, 25min or 30min.

[0034] In the application, in order to reduce the thickness and resistance of the heat-conducting silica gel cloth, and meanwhile make the heat-conducting silica gel cloth have higher thermal conductivity, the application adopts coating and calendering methods to prepare the heat-conducting silica gel cloth, the calendering forming can make the product surface smooth, high thermal conductivity, and low contact thermal resistance, but it is difficult to control the thickness; the coating method has fast production efficiency and good thickness uniformity, but this method is difficult to be applied to the preparation of the product with high thermal conductivity and low thermal resistance, and it needs low viscosity and small particle size before forming to be conducive to coating; the inventor creatively coats first and then calenders in the preparation of the heat-conducting silica gel cloth, which can not only improve the production efficiency, but also improve the uniformity of the preparation system, is conducive to the low resistance, high thermal conductivity and low thickness of the product, improves the actual use effect of the product, and is conducive to reducing the production cost.

[0035] Advantages

[0036] (I) In the application, through specific preparation raw materials including 10-30 parts of silicone oil; 140-200 parts of heat-conducting compound powder; 0.1-0.6 parts of dispersing aid; and 0.1-50 parts of diluent, the prepared product has lower resistance and thickness, and has higher dielectric strength and thermal conductivity.

[0037] (II) In the application, by using the vinyl silicone oil with specific viscosity and vinyl content, the prepared heat-conducting silica gel cloth has higher thermal conductivity and relatively small thermal resistance value.

[0038] (III) In the application, the heat-conducting compound powder is spherical alumina, non-spherical alumina and boron nitride, and the mass ratio of the spherical alumina, non-spherical alumina and boron nitride is (140-170):(15-25):(10-15), which can improve the uniformity of the system and reduce the contact thermal resistance of the product.

[0039] (IV) In the application, the particle size of the non-spherical alumina in the heat-conducting compound powder at least includes 3 μm and 0.5 μm, and the mass ratio is (40-50):(10-30), the particle size between the heat-conducting compound powder is smaller, which can reduce the porosity of the product, and further increase the thermal conductivity of the heat-conducting silica gel cloth.

[0040] (V) In the application, the coating and calendering methods are adopted to prepare the heat-conducting silica gel cloth, which can not only improve the production efficiency, but also improve the uniformity of the preparation system, is conducive to the low resistance, high thermal conductivity and low thickness of the product, and can also reduce the production cost. DETAILED DESCRIPTION

[0041] Example 1

[0042] The first aspect of the embodiment provides a low-contact thermal resistance heat-conducting silicone cloth, and raw materials for preparation are as follows in mass fraction: 15 parts of silicone oil; 180 parts of heat-conducting compound powder; 0.3 parts of dispersion aid; and 5 parts of diluent.

[0043] The silicone oil is vinyl silicone oil, the viscosity of which at 25 DEG C is 1500 cps, the vinyl content is 0.38%, and the model is Vs1500.

[0044] The heat-conducting compound powder is spherical alumina, non-spherical alumina and boron nitride; the mass ratio of the spherical alumina, non-spherical alumina and boron nitride is 100:60:10; the particle size of the non-spherical alumina is 3 μm and 0.5 μm, and the mass ratio of the non-spherical alumina with the particle size of 3 μm and 0.5 μm is 40:20; the particle size of the spherical alumina is 20 μm; and the particle size of the boron nitride is 10 μm.

[0045] The dispersion aid is silane coupling agent, and the model is dodecyl trimethoxysilane.

[0046] The diluent is n-hexane (CAS number: 110-54-3).

[0047] The second aspect of the embodiment provides a preparation method of low-contact thermal resistance heat-conducting silicone cloth.

[0048] S1, the heat-conducting compound powder is placed in a 180 DEG C vacuum drying oven, baked for 4 hours, and then naturally cooled to 25 DEG C to obtain heat-conducting powder;

[0049] S2, the silicone oil and the dispersion aid are further added, mixed uniformly, and then the diluent is added and mixed uniformly, and then defoaming and packaging are performed to obtain a semi-finished product; the defoaming pressure is negative pressure-0.1 MPa, and the defoaming time is 30 minutes;

[0050] S3, the semi-finished product is subjected to coating process first, the bottom film is PI film, and the thickness reaches 0.08 mm after being scraped by a doctor blade, and then the semi-finished product is subjected to a 120 DEG C oven, the oven is 12 m long, and the speed is 5 m / min; then the semi-finished product is subjected to calendering process, the upper film is selected to be release film, the calendering thickness is 0.05 mm, and then the semi-finished product is subjected to a 110 DEG C oven, the oven is 12 m long, and the speed is 5 m / min; after being cut, the release film is removed, and then rewinding is performed once to obtain the low-contact thermal resistance heat-conducting silicone cloth.

[0051] Example 2

[0052] The first aspect of the embodiment provides a low-contact thermal resistance heat-conducting silicone cloth, and raw materials for preparation are as follows in mass fraction: 15 parts of silicone oil; 180 parts of heat-conducting compound powder; 0.3 parts of dispersion aid; and 5 parts of diluent.

[0053] The organic silicone oil is a vinyl silicone oil, the viscosity of the vinyl silicone oil at 25℃ is 3000cps, the vinyl content is 0.34%, and the model is Vs3000.

[0054] The heat-conducting compound powder is spherical alumina, non-spherical alumina and boron nitride; the mass ratio of the spherical alumina, the non-spherical alumina and the boron nitride is 120:65:15; the particle size of the non-spherical alumina is 3μm and 0.5μm, and the mass ratio of the spherical alumina with the particle sizes of 3μm and 0.5μm is 45:20; the particle size of the spherical alumina is 20μm; and the particle size of the boron nitride is 10μm.

[0055] The dispersing aid is an aluminate, and the model is LD-B-1.

[0056] The diluent is n-hexane (CAS number: 110-54-3).

[0057] The second aspect of the embodiment provides a preparation method of the heat-conducting silicone cloth with low contact thermal resistance, and the preparation method is specifically as follows:

[0058] S1, the heat-conducting compound powder is placed in a vacuum drying oven at 180℃ and baked for 4h, and then naturally cooled to 25℃ to obtain the heat-conducting powder;

[0059] S2, the organic silicone oil and the dispersing aid are added, and then mixed uniformly, and then the diluent is added and mixed uniformly, and then defoaming and packaging are performed to obtain the semi-finished product; the defoaming pressure is negative pressure-0.1MPa, and the defoaming time is 30min;

[0060] S3, the semi-finished product is subjected to a coating process first, and the bottom film is a PI film, which is subjected to doctor blade coating to a thickness of 0.07mm, and then passes through an oven at 120℃, and the oven is 12m long and the speed is 4m / min; and then the semi-finished product is subjected to a calendering process, and the upper film is a release film, and the calendering thickness is 0.04mm, and then the semi-finished product passes through an oven at 110℃, and the oven is 12m long and the speed is 4m / min, and then the semi-finished product is cut and rewound to form a roll, and thus the heat-conducting silicone cloth with low contact thermal resistance is obtained.

[0061] Comparative Example 1

[0062] The first aspect of the present comparative example provides a heat-conducting silicone cloth with low contact thermal resistance, and the preparation raw materials are as follows in terms of mass fraction: 15 parts of organic silicone oil, 150 parts of heat-conducting compound powder, 0.3 parts of dispersing aid and 5 parts of diluent.

[0063] The organic silicone oil is a vinyl silicone oil, the viscosity of the vinyl silicone oil at 25℃ is 1000cps, the vinyl content is 0.45%, and the model is Vs1000.

[0064] The heat-conducting compound powder is spherical alumina, non-spherical alumina and boron nitride; the mass ratio of the spherical alumina, the non-spherical alumina and the boron nitride is 120:20:10; the particle size of the spherical alumina is 20 μm and 3 μm, and the mass ratio of the spherical alumina with the particle size of 20 μm and 3 μm is 80:40; the particle size of the non-spherical alumina is 0.5 μm; and the particle size of the boron nitride is 5 μm.

[0065] The dispersing aid is a silane coupling agent, and the model is octyl trimethoxysilane.

[0066] The diluent is acetone (CAS number: 67-64-1).

[0067] The second aspect of the embodiment provides a preparation method of the heat-conducting silicone cloth with low contact thermal resistance, and the preparation method is specifically as follows:

[0068] S1, the heat-conducting compound powder is placed in a vacuum drying oven at 180 ℃, baked for 4 h, and then naturally cooled to 25 ℃ to obtain the heat-conducting powder;

[0069] S2, the silicone oil, the dispersing aid and the diluent are added in sequence, mixed uniformly, and then defoamed and packaged to obtain the semi-finished product; the defoaming pressure is negative pressure-0.1 MPa, and the defoaming time is 30 min;

[0070] S3, the semi-finished product is subjected to the coating process first, the bottom film is a PI film, the thickness reaches 0.08 mm after the doctor blade coating, and then the coating is subjected to the oven at 120 ℃, the oven is 12 m long, and the speed is 5 m / min; then the coating is subjected to the calendering process, the upper film is a release film, the calendering thickness is 0.05 mm, the coating is subjected to the oven at 110 ℃, the oven is 12 m long, and the speed is 5 m / min, the coating is cut, the release film is removed, and then the coating is rewound to form a roll, thereby obtaining the heat-conducting silicone cloth with low contact thermal resistance.

[0071] Comparative Example 2

[0072] The first aspect of the example provides a heat-conducting silicone cloth with low contact thermal resistance, and the preparation raw materials are as follows in terms of mass fraction: 15 parts of silicone oil; 180 parts of heat-conducting compound powder; 0.3 parts of dispersing aid; and 2 parts of diluent.

[0073] The silicone oil is vinyl silicone oil, the viscosity of the vinyl silicone oil at 25 ℃ is 2500 cps, the vinyl content is 0.4%, and the model is Vs2500.

[0074] The heat-conducting compound powder is spherical alumina, non-spherical alumina and boron nitride; the mass ratio of the spherical alumina, the non-spherical alumina and the boron nitride is 100:60:20; the particle size of the non-spherical alumina is 0.5 μm and 3 μm, and the mass ratio of the spherical alumina with the particle size of 0.5 μm and 3 μm is 20:40; the particle size of the spherical alumina is 20 μm; and the particle size of the boron nitride is 10 μm.

[0075] The dispersant is a silane coupling agent, and the model number is octyl triethoxysilane.

[0076] The diluent is acetone (CAS number: 67-64-1).

[0077] The second aspect of the embodiment provides a preparation method of the low-contact-thermal-resistance heat-conducting silicone cloth.

[0078] S1, the heat-conducting compound powder is placed in a vacuum drying oven at 180℃, baked for 4h, and then naturally cooled to 25℃ to obtain the heat-conducting powder;

[0079] S2, the silicone oil, the dispersing aid, the diluent and the defoaming agent are added and mixed uniformly, and then defoaming and packaging are performed to obtain the semi-finished product; the defoaming pressure is negative pressure-0.1 MPa, and the defoaming time is 30 min;

[0080] S3, the calendering process is performed, the upper film uses the release film, the lower film uses the PI film, the calendering thickness is 0.05 mm, the oven is at 110℃, the length of the oven is 12 m, the speed is 1 m / min, after the release film is removed, cutting and rewinding are performed to obtain the low-contact-thermal-resistance heat-conducting silicone cloth.

[0081] Performance evaluation

[0082] Test object: the low-contact-thermal-resistance heat-conducting silicone cloth prepared by the examples 1-2 and the comparative examples 1-2

[0083] Test method and experimental results: see Table 1

[0084] Table 1

[0085]

Claims

1. A method for preparing a low-contact thermally conductive silicone cloth, characterized in that, At least the following steps are included: S1. Place the thermally conductive compound powder in a vacuum drying oven at 170-200℃ and bake for 3-5 hours, then let it cool naturally to 25-30℃ to obtain the thermally conductive powder. S2. Add silicone oil and dispersant, mix well, then add diluent, mix well, degas and package to obtain semi-finished product; S3. The semi-finished product is first coated with a PI film as the base film. The coating is done by a doctor blade to a thickness of 0.04-1mm. Then it is dried in an 80-120℃ drying tunnel for 3-15m in length at a speed of 3-20 m / min. Next, it is calendered with a release film as the top film. The calendering thickness is 0.01-0.09mm. It is dried in an 80-120℃ drying tunnel for 3-15m in length at a speed of 0.5-10 m / min. After removing the release film, it is cut and rewound once to obtain a low-contact thermally conductive silicone cloth. The raw materials for preparing the low contact thermal resistance thermally conductive silicone cloth include, by weight, at least: 10-30 parts of organosilicon oil; 140-200 parts of thermally conductive compound powder; 0.1-0.6 parts of dispersant; and 0.1-50 parts of diluent. The silicone oil mentioned is a vinyl silicone oil; The raw materials for preparing the thermally conductive composite powder include spherical alumina, non-spherical alumina, and boron nitride; The mass ratio of the spherical alumina, non-spherical alumina, and boron nitride is (100-120):(60-70):(10-15). The spherical alumina has a particle size of 3-25µm, the boron nitride has a particle size of 3-20µm, and the non-spherical alumina has a particle size of 0.5-3µm. The non-spherical alumina has a particle size of at least 0.5µm and 3µm, and the mass ratio of 3µm to 0.5µm non-spherical alumina is (40-50):(10-30). The vinyl silicone oil has a viscosity of 1500-3000 mPa·s at 25°C and a vinyl content of 0.34-0.38%.

2. The method for preparing the low contact thermal resistance thermally conductive silicone cloth according to claim 1, characterized in that: The dispersing agent includes at least one of the following: modified organosiloxane, stearic acid, aluminate, silane coupling agent, organobentonite, pentaerythritol ester, acrylate leveling agent, and silica.

3. The method for preparing the low contact thermal resistance thermally conductive silicone cloth according to claim 1, characterized in that: The diluent includes at least one of the following: n-hexane, methanol, toluene, xylene, cyclohexanone, isopropanol, isoparaffins, acetone, and butanol.

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