Liquid cooling system
By employing a sealed groove and cooling module design in the immersion cooling device, and utilizing a pump to drive liquid circulation, efficient heat dissipation and cost reduction are achieved, solving the problem of large liquid consumption in existing technologies.
Patent Information
- Application Number
- CN202210467918.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2022-04-26
- Filing Date
- 2022-04-29
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2042-04-29
AI Technical Summary
Existing immersion cooling devices are expensive to use because they require large amounts of non-conductive liquid.
The design employs a sealed tank and a cooling module, using a pump to drive the working fluid to circulate between the circulation layer and the phase change fluid tank, reducing the amount of working fluid used and achieving efficient heat dissipation through evaporation and condensation.
It reduces the amount of working fluid used, lowers operating costs, and improves heat dissipation efficiency and ease of assembly.
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Figure CN116997135B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a heat dissipation device, in particular to a liquid cooling system. BACKGROUND
[0002] Immersion cooling is to immerse electrical units (such as the mainboards of servers or computers) in non-conductive liquid, so that the high-temperature heat generated by the electrical units during operation can be directly absorbed by the non-conductive liquid, so that the electrical units can maintain a proper operating temperature to achieve the expected operating efficiency and service life.
[0003] A common existing immersion cooling device generally includes a cooling tank and a condenser. The cooling tank is filled with liquid non-conductive liquid, and the condenser is installed above the liquid non-conductive liquid. The electrical units that need to be cooled are immersed in the liquid non-conductive liquid. Since the boiling point of the non-conductive liquid is low, after absorbing the operating heat of the electrical units, part of the non-conductive liquid is converted into a gaseous state to form bubbles in the liquid non-conductive liquid and float upwards until it leaves the surface of the liquid non-conductive liquid and condenses back into a liquid state when it contacts the condenser and then drips downward.
[0004] However, in order to fully immerse the electrical units in the non-conductive liquid, the amount of non-conductive liquid in the cooling tank usually needs to be large, and the price of non-conductive liquid is high, which makes it difficult to reduce the use cost of the overall immersion cooling device.
[0005] Therefore, there is still a need to improve the existing immersion cooling device. SUMMARY
[0006] To solve the above problems, the purpose of the present application is to provide a liquid cooling system which can reduce the use cost.
[0007] Another purpose of the present application is to provide a liquid cooling system which can increase the heat dissipation efficiency.
[0008] Still another purpose of the present application is to provide a liquid cooling system which can facilitate assembly.
[0009] The directionality or its approximate terms described throughout the present application, such as "front", "back", "left", "right", "up (top)", "down (bottom)", "inside", "outside", "side", etc., mainly refer to the directions of the drawings. Each directionality or its approximate term is only used to assist in describing and understanding each embodiment of the present application, and is not intended to limit the present application.
[0010] The quantifier "one" or "an" used throughout the present disclosure is intended to convey the general sense of "one or at least one" and is not intended to limit the scope of the present disclosure to a single concept unless otherwise indicated. The singular is intended to include the plural unless otherwise indicated.
[0011] The approximate terms such as "combine", "combine" or "assemble" described throughout the present disclosure mainly include the type that can be separated without destroying the components after connection, or the type that makes the components inseparable after connection, which can be selected by the person skilled in the art according to the material of the components to be connected or the assembly requirements.
[0012] The liquid cooling system of the present disclosure comprises a sealed tank having a containing space, a circulating layer formed by a working liquid filled in the containing space, and a cooling module located in the containing space, the cooling module having a phase change fluid tank and a pump, the phase change fluid tank being thermally connected to a heat source, the phase change fluid tank not contacting the circulating layer, the phase change fluid tank having a vaporization port communicating with the containing space, the pump having a liquid inlet port communicating with the circulating layer, and the pump having a liquid outlet port communicating with the inside of the phase change fluid tank.
[0013] Therefore, the liquid cooling system of the present disclosure only needs to fill a small amount of working liquid to form the circulating layer, and the working liquid in the circulating layer is driven into the inside of the phase change fluid tank by the pump. The working liquid in the inside of the phase change fluid tank can absorb heat energy from the liquid state to evaporate into the gaseous state. The gaseous working liquid can evaporate upward through the vaporization port, then condense back to the liquid state and drop downward in the circulating layer or the inside of the phase change fluid tank, thereby enabling the working liquid to absorb the heat energy of the heat source. In this way, the amount of working liquid can be reduced, and the use cost can be reduced.
[0014] The sealed tank can have a tank cover combined with a tank body, and at least one condensing unit of the sealed tank can be combined with the outer surface of the tank cover. In this way, the condensing unit can take away the heat energy in the sealed tank, thereby increasing the heat dissipation efficiency.
[0015] The tank cover can have at least one basket space communicating with the containing space, and the at least one condensing unit can cover the basket space. In this way, the gaseous working liquid can contact the condensing unit through the basket space, thereby increasing the heat dissipation efficiency.
[0016] The vaporization port can be aligned with the condensing unit. In this way, the upwardly evaporated working liquid can directly transfer heat energy to the condensing unit, thereby increasing the heat dissipation efficiency.
[0017] The cooling module can have a liquid inlet pipe, which can be connected to the liquid inlet and the circulation layer. In this way, the structure is simple and easy to assemble, and has the effect of facilitating assembly.
[0018] The cooling module can have a liquid outlet pipe, which can be connected to the liquid outlet and the inside of the phase change fluid tank. In this way, the structure is simple and easy to assemble, and has the effect of facilitating assembly.
[0019] The cooling module can have at least two phase change fluid tanks, which can be located at different heights, and the liquid outlet pipe can have at least two sub-pipe sections, which are respectively connected to the at least two phase change fluid tanks. In this way, the pump can drive the working liquid in the circulation layer to enter the inside of each phase change fluid tank through the at least two sub-pipe sections, which has the effect of making the working liquid flow smoothly.
[0020] The liquid cooling system of the present application can further include an extension cover, the cooling module can have at least two phase change fluid tanks, which are located at different heights, the extension cover can be combined with the phase change fluid tank located at the lower position, and the inside of the extension cover can be connected to the evaporation port. In this way, the liquid level of the working liquid in the inside of the at least two phase change fluid tanks can be aligned with the at least two heat sources, which has the effect of good heat dissipation efficiency.
[0021] The extension cover can have an upper port, which can be no lower than the heat source corresponding to the phase change fluid tank located at the highest position. In this way, it can be ensured that the at least two heat sources are partially or completely covered by the working liquid, which has the effect of good heat dissipation efficiency.
[0022] The number of phase change fluid tanks and pumps can be multiple, respectively, and the liquid outlet of each pump is connected to the inside of each phase change fluid tank. In this way, each pump drives the working liquid in the circulation layer to enter the inside of each phase change fluid tank, so that the working liquid in each phase change fluid tank can absorb the heat energy of different heat sources, respectively, which has the effect of increasing heat dissipation efficiency.
[0023] The liquid cooling system of the present application can further include at least one electrical unit, which can have at least one heat source, and the heat source can be connected to a heat source connecting surface of the phase change fluid tank. In this way, the electrical unit can be cooled reliably, which has the effect of stable operation of the electrical unit.
[0024] The liquid cooling system of the present application can additionally comprise a guide located below a cover of the sealed tank, which can guide the condensed back to liquid working fluid to flow to the electrical unit. In this way, the condensed back to liquid working fluid can flush and spray the electronic components on the electrical unit, so that the electronic components can be cooled and have the effect of increasing the heat dissipation efficiency.
[0025] The sealed tank can have a cover combined with a tank body, and the electrical unit can be connected to a carrier plate in the tank body. In this way, the structure is simple and easy to assemble, and has the effect of facilitating assembly.
[0026] The sealed tank can have a cover combined with a tank body, and the number of electrical units can be multiple, and multiple electrical units can be respectively connected to a string plate in the tank body. In this way, multiple electrical units can be easily arranged in the accommodation space, and have the effect of meeting the configuration requirements of various installation spaces. BRIEF DESCRIPTION OF DRAWINGS
[0027] Figure 1 : exploded perspective view of the first embodiment of the present application;
[0028] Figure 2 : combined sectional view of the first embodiment of the present application;
[0029] Figure 3 : sectional view along the line A-A of Figure 2 ;
[0030] Figure 4 : use case diagram as shown in Figure 3 ;
[0031] Figure 5 : combined sectional view of the second embodiment of the present application;
[0032] Figure 6 : exploded perspective view of the third embodiment of the present application;
[0033] Figure 7 : combined sectional view of the third embodiment of the present application;
[0034] Figure 8 : use case diagram as shown in Figure 7 ;
[0035] Figure 9 : combined sectional view of the fourth embodiment of the present application.
[0036] REFERENCE NUMERALS
[0037]
THE PRESENT INVENTION
[0038] 1: sealed tank
[0039] 11: tank body
[0040] 111: opening
[0041] 12: tank cover
[0042] 121: basket space
[0043] 13: condensing unit
[0044] 2: circulation layer
[0045] 3: cooling module
[0046] 31: phase change fluid tank
[0047] 31a: heat source connecting surface
[0048] 32: pump
[0049] 32a: liquid inlet
[0050] 32b: liquid outlet
[0051] 33: liquid inlet pipe
[0052] 34: liquid outlet pipe
[0053] 34a: shunt pipe portion
[0054] 4: extension cover
[0055] 4a: upper port
[0056] 5: guide
[0057] B1: carrier plate
[0058] B2: series connection plate
[0059] E: electrical unit
[0060] E1: electronic component
[0061] H: heat source
[0062] L: working liquid
[0063] S: accommodation space
[0064] Q: vaporization port DETAILED DESCRIPTION
[0065] In order to make the above and other objects, features and advantages of the present application more comprehensible, preferred embodiments will be described in detail below with reference to the drawings, in which like reference numerals refer to like elements throughout. Moreover, the same reference numerals will be used to designate the same elements in different drawings, and the description thereof will be omitted.
[0066] Please refer to Figure 2As shown, it is the first embodiment of the liquid cooling system of the present application, comprising a sealed tank 1, a circulating layer 2 and a cooling module 3, the sealed tank 1 has a containing space S, the circulating layer 2 and the cooling module 3 are located in the containing space S.
[0067] Please refer to Figure 1 As shown, the type of the sealed tank 1 is not limited by the present application, in the embodiment, the sealed tank 1 can have a tank body 11 and a tank cover 12, the containing space S is located inside the tank body 11, the tank body 11 can have an opening 111 communicating with the containing space S, the opening 111 can be used to input liquid into the containing space S, or to take and place the object to be cooled; the tank cover 12 can cover the opening 111, the periphery of the tank cover 12 can be air-tight with the tank body 11, for example, by a rubber ring, to ensure that the gas or liquid in the containing space S will not leak from the periphery of the tank cover 12 to the outside. Wherein, the sealed tank 1 of the liquid cooling system of the present application can be in the shell of the electronic equipment such as e-sports computer, industrial computer, server or network communication equipment, or the liquid cooling system of the present application can be entirely set in the inside of the electronic equipment such as e-sports computer, industrial computer, server or network communication equipment, the present application is not limited.
[0068] Please refer to Figure 1 , Figure 2 As shown, and the tank cover 12 can have at least one basket empty part 121, the basket empty part 121 can communicate with the containing space S, the sealed tank 1 can also have at least one condensing unit 13, the condensing unit 13 can be combined with the outer surface of the tank cover 12 and cover the basket empty part 121, the present application does not limit the type of the condensing unit 13, the condensing unit 13 can be, for example, at least one heat dissipation fin, the condensing unit 13 can be made of metal material with high thermal conductivity.
[0069] The circulating layer 2 is formed by filling a working liquid L in the containing space S, the working liquid L can be selected as a non-conductive liquid.
[0070] Please refer to Figure 1 , Figure 3As shown, the cooling module 3 has a phase change fluid groove 31 which does not contact the circulating layer 2 (i.e. the phase change fluid groove 31 can be higher than the circulating layer 2), the phase change fluid groove 31 has a vaporization port Q which communicates with the accommodating space S, in particular, the phase change fluid groove 31 does not have an upper cover, so that the opening of the phase change fluid groove 31 forms the vaporization port Q, the vaporization port Q can be directed towards the groove cover 12, and the vaporization port Q is preferably aligned with the hollow portion 121. The phase change fluid groove 31 can have a heat source connecting surface 31a which is used to thermally connect a heat source H, the phase change fluid groove 31 can be made of a metal material with high thermal conductivity, such as copper or aluminum, or only the part of the phase change fluid groove 31 which contacts the heat source H (i.e. the heat source connecting surface 31a) is made of a metal material with high thermal conductivity, and the forming method of the phase change fluid groove 31 is not limited by the present application, for example, the phase change fluid groove 31 can be formed by stamping, which has the effect of simplifying the process.
[0071] The cooling module 3 has a pump 32 which can not contact the circulating layer 2, or can be entirely immersed in the circulating layer 2, or can have a part of the pump 32 contacting the circulating layer 2, and the present application does not limit this. In the present embodiment, the pump 32 does not contact the circulating layer 2, and the pump 32 can be located between the phase change fluid groove 31 and the circulating layer 2. The pump 32 has a liquid inlet port 32a and a liquid outlet port 32b, the liquid inlet port 32a communicates with the circulating layer 2, and the liquid outlet port 32b communicates with the inside of the phase change fluid groove 31, so that the pump 32 can drive the working liquid L located in the circulating layer 2 into the inside of the phase change fluid groove 31. Preferably, the cooling module 3 can have a liquid inlet pipe 33 and a liquid outlet pipe 34, the liquid inlet pipe 33 communicates the liquid inlet port 32a with the circulating layer 2, and the liquid outlet pipe 34 communicates the liquid outlet port 32b with the inside of the phase change fluid groove 31.
[0072] The immersion cooling system of the present application can further include at least one electrical unit E which is an object that needs to be cooled, the electrical unit E can be, for example, a motherboard, a communication interface board, a display adapter or a data storage board, etc., and the electrical unit E can be connected to a carrier board B1 in the groove body 11, the electrical unit E can have at least one heat source H which can be aligned with the heat source connecting surface 31a of the phase change fluid groove 31, so that the heat source connecting surface 31a can directly or indirectly thermally connect the heat source H.
[0073] Please refer to Figure 2 , Figure 4As shown, when the liquid cooling system is in operation, the heat source connecting surface 31a of the phase change fluid tank 31 can be thermally connected to the heat source H, the pump 32 can drive the working liquid L in the circulation layer 2 to flow, the working liquid L can sequentially enter the phase change fluid tank 31 through the liquid inlet pipe 33 and the liquid outlet pipe 34, the working liquid L in the phase change fluid tank 31 can absorb heat energy from the liquid state to evaporate into the gaseous state, so that the working liquid L can fully absorb the heat energy of the heat source H; the working liquid L in the gaseous state can evaporate upward through the evaporation port Q, then contact the condensing unit 13 through the hollow part 121, and after transferring heat energy to the condensing unit 13, it is condensed back to the liquid state and drips downward in the circulation layer 2 or the phase change fluid tank 31, then the pump 32 drives the working liquid L to enter the phase change fluid tank 31 again, which is continuously circulated to continuously absorb the heat energy of the heat source H. Therefore, the accommodation space S only needs to be filled with a small amount of working liquid L to form the circulation layer 2, and the working liquid L in the circulation layer 2 is driven by the pump 32 to enter the phase change fluid tank 31, so that the working liquid L in the phase change fluid tank 31 can absorb the heat energy of the heat source H, thereby reducing the amount of working liquid L and reducing the use cost.
[0074] Please refer to Figure 5 As shown, the second embodiment of the liquid cooling system of the present application is substantially the same as the first embodiment. In the second embodiment, the number of phase change fluid tanks 31 and pumps 32 can be multiple, the heat source connecting surface 31a of each phase change fluid tank 31 can be thermally connected to the heat source H of each electrical unit E, the liquid inlet 32a of each pump 32 is connected to the circulation layer 2, and the liquid outlet 32b of each pump 32 is connected to the inside of each phase change fluid tank 31. The plurality of electrical units E can be connected to a string of boards B2 in the tank body 11, so that the plurality of electrical units E can be easily arranged in the accommodation space S, and the plurality of electrical units E can be arranged side by side. In this way, each pump 32 can drive the working liquid L in the circulation layer 2 to enter each phase change fluid tank 31, the working liquid L in each phase change fluid tank 31 can absorb heat energy from the liquid state to evaporate into the gaseous state, so that the working liquid L can fully absorb the heat energy of the heat source H; the working liquid L in the gaseous state can evaporate upward through the evaporation port Q, then contact the condensing unit 13 through the hollow part 121, and after transferring heat energy to the condensing unit 13, it is condensed back to the liquid state and drips downward in the circulation layer 2 or the phase change fluid tank 31, then each pump 32 drives the working liquid L to enter each phase change fluid tank 31 again, which is continuously circulated to continuously absorb the heat energy of the heat source H.
[0075] Please refer to Figure 6 , Figure 7As shown, it is the third embodiment of the liquid cooling system of the present application, which is substantially the same as the first embodiment, in the third embodiment, the number of the hollows 121 and the condensing units 13 are both two, the two condensing units 13 cover the two hollows 121 respectively, the cooling module 3 can have at least two phase change fluid tanks 31, the at least two phase change fluid tanks 31 can be located at different heights, in the embodiment, the number of the phase change fluid tanks 31 is illustrated as two, that is, one of the phase change fluid tanks 31 is adjacent to the pump 32 than the other phase change fluid tank 31, so that the heat source connecting surfaces 31a of the two phase change fluid tanks 31 can be thermally connected to the heat sources H located at different heights, the outlet pipe 34 can have at least two branch pipe parts 34a, the two branch pipe parts 34a can be connected to the two phase change fluid tanks 31 respectively, so that the outlet pipe 34 can be in communication with the interiors of the two phase change fluid tanks 31 respectively, in the embodiment, the outlet pipe 34 can preferably form a Y-shaped shape. Moreover, the pump 32 can be entirely immersed in the circulating layer 2, so that the inlet 32a of the pump 32 can be directly in communication with the circulating layer 2, the pump 32 can drive the working liquid L located in the circulating layer 2 to enter the interiors of the two phase change fluid tanks 31 through the two branch pipe parts 34a respectively.
[0076] Please refer to Figure 7 、 Figure 8As shown, in addition, the liquid cooling system of the present application can further comprise an extension cover 4 combined with the phase change fluid tank 31 located at the lower position, the extension cover 4 is internally communicated with the evaporation port Q, the extension cover 4 can have an upper port 4a, which is preferably level with the phase change fluid tank 31 located at the highest position, the upper port 4a of the extension cover 4 can be not lower than the heat source H corresponding to the phase change fluid tank 31 located at the highest position, that is, the upper port 4a of the extension cover 4 can be higher than the heat source H located at the highest position, or level with the heat source H located at the highest position, in this way, according to the principle of communicating vessels (Evangelista Torricelli, the pressure of any two points of the same liquid and the same horizontal plane is equal), the liquid level of the working liquid L inside the two phase change fluid tanks 31 can be aligned with the two heat sources H, so as to ensure that the two heat sources H can be partially or completely covered by the working liquid L, the working liquid L inside the two phase change fluid tanks 31 can absorb heat energy from the liquid state to evaporate into the gaseous state, so that the working liquid L can effectively dissipate heat to the two heat sources H; the working liquid L in the gaseous state can evaporate upwards, then contact the two condensing units 13 through the two basket spaces 121, and after transferring heat to the two condensing units 13, condense back to the liquid state and drop downwards inside the circulation layer 2 or the two phase change fluid tanks 31, thereby achieving the effect of providing good heat dissipation efficiency. It is particularly pointed out that when the number of phase change fluid tanks 31 is three or more than four, the upper port 4a of the extension cover 4 is not lower than the heat source H corresponding to the phase change fluid tank 31 located at the highest position.
[0077] Please refer to Figure 9 As shown, in addition, the liquid cooling system of the present application can further comprise an extension cover 4 combined with the phase change fluid tank 31 located at the lower position, the extension cover 4 is internally communicated with the evaporation port Q, the extension cover 4 can have an upper port 4a, which is preferably level with the phase change fluid tank 31 located at the highest position, the upper port 4a of the extension cover 4 can be not lower than the heat source H corresponding to the phase change fluid tank 31 located at the highest position, that is, the upper port 4a of the extension cover 4 can be higher than the heat source H located at the highest position, or level with the heat source H located at the highest position, in this way, according to the principle of communicating vessels (Evangelista Torricelli, the pressure of any two points of the same liquid and the same horizontal plane is equal), the liquid level of the working liquid L inside the two phase change fluid tanks 31 can be aligned with the two heat sources H, so as to ensure that the two heat sources H can be partially or completely covered by the working liquid L, the working liquid L inside the two phase change fluid tanks 31 can absorb heat energy from the liquid state to evaporate into the gaseous state, so that the working liquid L can effectively dissipate heat to the two heat sources H; the working liquid L in the gaseous state can evaporate upwards, then contact the two condensing units 13 through the two basket spaces 121, and after transferring heat to the two condensing units 13, condense back to the liquid state and drop downwards inside the circulation layer 2 or the two phase change fluid tanks 31, thereby achieving the effect of providing good heat dissipation efficiency. It is particularly pointed out that when the number of phase change fluid tanks 31 is three or more than four, the upper port 4a of the extension cover 4 is not lower than the heat source H corresponding to the phase change fluid tank 31 located at the highest position.
[0078] In summary, the liquid cooling system of the present application only needs to fill a small amount of working liquid to form the circulating layer, and the working liquid in the circulating layer is driven by the pump into the phase change fluid tank. The working liquid in the phase change fluid tank can absorb heat energy from the liquid state to evaporate into the gaseous state. The gaseous working liquid can evaporate upward through the evaporation port, then condense back to the liquid state and drop downward to the circulating layer or the phase change fluid tank. In this way, the working liquid can absorb the heat energy of the heat source, thereby reducing the amount of working liquid and reducing the use cost.
Claims
1. A liquid cooling system, characterized by, Comprising: a sealed tank having a receiving space; a circulating layer formed by a working fluid filled in the receiving space; and a cooling module located in the receiving space, the cooling module having a phase change fluid tank and a pump, the phase change fluid tank being thermally connected to a heat source, the phase change fluid tank not contacting the circulating layer, the phase change fluid tank having a vaporization port communicating with the receiving space, the pump having an inlet port communicating with the circulating layer, the pump having an outlet port communicating with the phase change fluid tank; at least one electrical unit having at least one heat source, the heat source being located on a heat source connecting surface of the phase change fluid tank; and a guide located below a tank cover of the sealed tank, the guide guiding the condensed working fluid back to the electrical unit. The sealed tank has a tank cover combined with a tank body, at least one condensing unit of the sealed tank being combined with an outer surface of the tank cover.
2. The liquid cooling system of claim 1, wherein, The tank cover has at least one basket communicating with the receiving space, the at least one condensing unit covering the basket.
3. The liquid cooling system of claim 2, wherein, The vaporization port is located opposite the condensing unit.
4. The liquid cooling system of claim 3, wherein, The cooling module has an inlet pipe communicating the inlet port with the circulating layer.
5. The liquid cooling system of claim 1, wherein, The cooling module has an outlet pipe communicating the outlet port with the phase change fluid tank.
6. The liquid cooling system of claim 1, wherein, The cooling module has at least two phase change fluid tanks located at different heights, the outlet pipe has at least two branch pipes, the at least two branch pipes being connected to the at least two phase change fluid tanks respectively.
7. The liquid cooling system of claim 6, wherein, Further comprising an extension cover, the cooling module has at least two phase change fluid tanks located at different heights, the extension cover is combined with the phase change fluid tank located at the lowermost position, the extension cover is connected to the vaporization port.
8. The liquid cooling system of claim 6, wherein, The extension cover has an upper port, the upper port is not lower than the heat source corresponding to the phase change fluid tank located at the highest position.
9. The liquid cooling system of claim 8, wherein, The number of the phase change fluid tanks and the number of the pumps are plural, the outlet port of each pump is connected to the phase change fluid tank.
10. The liquid cooling system of claim 1, wherein, The sealed tank has a tank cover combined with a tank body, the electrical unit is connected to a carrier board in the tank body.
11. The liquid cooling system of claim 1, wherein, The sealed tank has a tank cover combined with a tank body, the number of the electrical units is plural, the plural electrical units are connected to a series board in the tank body respectively.
12. The liquid cooling system of claim 1, wherein,
Citation Information
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