Laser cutting system, laser cutting method, device and readable storage medium

Abstract

The application discloses a laser cutting system, a laser cutting method, equipment and a computer readable storage medium, and is applied to the technical field of laser cutting. The laser cutting system comprises a first scanning head, a second scanning head, a light source, a control device and a light splitting device. The light source provides laser beams for each scanning head. The light splitting device is used for splitting the laser beams provided by the light source into a first light beam and a second light beam. The first scanning head and the second scanning head are arranged in parallel. The control device is used for controlling the first scanning head to cut a first part in a sample to be cut through the first light beam, and in parallel, controlling the second scanning head to cut a second part in the sample to be cut through the second light beam. The application solves the technical problem of low laser cutting efficiency.

Description

Technical Field

[0001] This application relates to the field of laser cutting technology, and in particular to a laser cutting system, laser cutting method, equipment and computer-readable storage medium. Background Technology

[0002] With the rapid development of science and technology, laser cutting technology has become increasingly mature. Currently, laser cutting technology usually uses a single scanning head for laser cutting, which may result in low laser cutting efficiency. Summary of the Invention

[0003] The main objective of this application is to provide a laser cutting system, laser cutting method, equipment, and computer-readable storage medium, aiming to solve the technical problem of low efficiency in laser cutting in the prior art.

[0004] To achieve the above objectives, this application provides a laser cutting system, which includes a first scanning head, a second scanning head, a light source, a control device, and a beam splitting device. The light source provides a laser beam to each of the scanning heads, and the beam splitting device is used to split the laser beam provided by the light source into a first beam and a second beam. The first scanning head and the second scanning head are arranged in parallel. The control device is used to control the first scanning head to cut a first part of the sample to be cut using the first beam, and to control the second scanning head to cut a second part of the sample to be cut using the second beam.

[0005] Optionally, the beam splitter is a half-wave plate.

[0006] To achieve the above objectives, this application also provides a laser cutting method and a control device applied to a laser cutting system. The laser cutting system includes a first scanning head, a second scanning head, a light source, a control device, and a beam splitting device. The light source provides a laser beam to each of the scanning heads. The first scanning head and the second scanning head are arranged in parallel. The beam splitting device is used to split the laser beam provided by the light source into a first beam and a second beam. The laser cutting method includes:

[0007] Obtain the sample information of the material to be cut;

[0008] Based on the sample information, the first scanning head is controlled to cut the first part of the sample to be cut using the first beam, while the second scanning head is controlled to cut the second part of the sample to be cut using the second beam.

[0009] Optionally, the sample information includes sample drawing data and sample physical data.

[0010] The step of controlling the first scanning head to cut the first part of the sample to be cut using the first beam based on the sample information includes:

[0011] Based on the sample entity data, a cutting path corresponding to the first scanning head is generated;

[0012] Based on the difference between the sample drawing data and the sample physical data, the cutting speed corresponding to the first scanning head is generated;

[0013] Based on the cutting path and the cutting speed, the first scanning head is controlled to cut the first part of the sample to be cut using the first beam.

[0014] Optionally, the sample drawing data includes the position data of at least one drawing mark point in the first part of the sample to be cut, and the sample entity data includes the position data of at least one entity mark point in the first part of the sample to be cut, wherein each drawing mark point corresponds one-to-one with each entity mark point.

[0015] The step of generating the cutting speed corresponding to the first scanning head based on the difference between the sample drawing data and the sample physical data includes:

[0016] Based on the position data of each drawing mark point and the position data of each entity mark point in the first part, the deviation value between the actual cutting path and the simulated cutting path corresponding to the first scanning head is determined, wherein the actual cutting path is composed of each entity mark point and the simulated cutting path is composed of each drawing mark point;

[0017] Based on the deviation value, a cutting speed corresponding to the first scanning head is generated, wherein the larger the deviation value, the greater the cutting speed.

[0018] Optionally, the sample entity data includes the position data of at least one entity marker point in the first part of the sample to be cut.

[0019] The step of generating the cutting path corresponding to the first scanning head based on the sample entity data includes:

[0020] The position data of each entity marker point are connected sequentially to obtain the cutting path corresponding to the first scanning head.

[0021] Optionally, the sample information includes sample drawing data and sample physical data.

[0022] Before the step of controlling the first scanning head to cut the first portion of the sample to be cut using the first beam based on the sample information, the method further includes:

[0023] The rotation angle of the spectrophotometer is generated based on the sample drawing data and the sample physical data.

[0024] The beam splitting device is controlled to split the light at the specified rotation angle.

[0025] Optionally, the sample entity data includes the position data of at least one entity marker point in the first part of the sample to be cut and the position data of at least one entity marker point in the second part, wherein each drawing marker point corresponds one-to-one with each entity marker point.

[0026] The step of generating the rotation angle of the spectrometer based on the sample drawing data and the sample entity data includes:

[0027] The rotation angle of the beam splitter is generated based on the difference between the position data of each entity marker point in the first part and the position data of each entity marker point in the second part.

[0028] This application also provides a control device for a laser cutting system. The laser cutting system includes a first scanning head, a second scanning head, a light source, a control device, and a beam splitting device. The light source provides a laser beam to each of the scanning heads. The first scanning head and the second scanning head are arranged in parallel. The beam splitting device is used to split the laser beam provided by the light source into a first beam and a second beam. The control device in the laser cutting system includes:

[0029] The acquisition module is used to acquire sample information of the sample to be cut;

[0030] The control module is used to control the first scanning head to cut the first part of the sample to be cut by the first beam according to the sample information, and at the same time, control the second scanning head to cut the second part of the sample to be cut by the second beam.

[0031] This application also provides an electronic device, the electronic device comprising: a memory, a processor, and a program of the laser cutting method stored in the memory and executable on the processor, wherein when the program of the laser cutting method is executed by the processor, it can implement the steps of the laser cutting method as described above.

[0032] This application also provides a computer-readable storage medium storing a program for implementing a laser cutting method, wherein when the program for the laser cutting method is executed by a processor, it implements the steps of the laser cutting method as described above.

[0033] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the laser cutting method described above.

[0034] This application provides a laser cutting system, which includes a first scanning head, a second scanning head, a light source, a control device, and a beam splitting device. The light source provides a laser beam to each of the scanning heads. The beam splitting device is used to split the laser beam provided by the light source into a first beam and a second beam. The first scanning head and the second scanning head are arranged in parallel. The control device is used to control the first scanning head to cut a first part of the sample to be cut through the first beam, and to control the second scanning head to cut a second part of the sample to be cut through the second beam in parallel. Since the first scanning head and the second scanning head are controlled to cut in parallel, the laser cutting efficiency is improved. Attached Figure Description

[0035] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0036] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic flowchart of the first embodiment of the laser cutting method of this application;

[0038] Figure 2 This is a schematic diagram of the device structure involved in the laser cutting method in the embodiments of this application;

[0039] Figure 3 This is a schematic diagram of the equipment structure of the hardware operating environment involved in the laser cutting method in the embodiments of this application.

[0040] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0041] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] Example 1

[0043] This application provides a laser cutting method. In the first embodiment of the laser cutting method of this application, refer to... Figure 1 A control device for a laser cutting system, the laser cutting system comprising a first scanning head, a second scanning head, a light source, a control device, and a beam splitting device, wherein the light source provides a laser beam to each of the scanning heads, the first scanning head and the second scanning head are arranged in parallel, and the beam splitting device is used to split the laser beam provided by the light source into a first beam and a second beam; the laser cutting method includes:

[0044] Step S10: Obtain the sample information of the sample to be cut;

[0045] In this embodiment, it should be noted that the sample to be cut is a sample waiting to be laser cut.

[0046] Step S20: Based on the sample information, control the first scanning head to cut the first part of the sample to be cut using the first beam, and simultaneously control the second scanning head to cut the second part of the sample to be cut using the second beam.

[0047] In this embodiment, it should be noted that the scanning head can be a scanning head.

[0048] For example, the sample information includes sample entity data, which includes first entity data of the first part and second entity data of the second part; based on the first entity data, the first scanning head is controlled to cut the first part through the first beam, and at the same time, the second scanning head is controlled to cut the second part through the second beam.

[0049] In step S20, the sample information includes sample drawing data and sample entity data. The step of controlling the first scanning head to cut the first part of the sample to be cut using the first beam according to the sample information includes:

[0050] Step S21: Generate the cutting path corresponding to the first scanning head based on the sample entity data;

[0051] For example, the sample entity data includes the first entity data of the first part, and the cutting path corresponding to the first scanning head is generated based on the first entity data.

[0052] In one feasible embodiment, if the first entity data includes measurement data of at least two points on the first part, a cutting path of the first scanning head is generated based on the measurement data of each point on the first part. The measurement data can be coordinates or relative position data between points. The cutting path includes at least one cutting direction and a cutting length corresponding to each cutting direction.

[0053] In another feasible embodiment, if the first entity data includes image data corresponding to the first part, then the cutting path of the first scanning head is generated based on the image data corresponding to the first part, wherein the size of the image data corresponding to the first part is proportional to the size of the first part of the material to be cut.

[0054] In step S21, the sample entity data includes the position data of at least one entity marker point in the first part of the sample to be cut.

[0055] The step of generating the cutting path corresponding to the first scanning head based on the sample entity data includes:

[0056] Step B10: Connect the position data of each entity marker point sequentially to obtain the cutting path corresponding to the first scanning head.

[0057] For example, if the line connecting two adjacent entity markers is not a straight line, then each of the connecting lines is disassembled to obtain at least two disassembly lines, and the straight line between each disassembly line and the two adjacent entity markers is taken as the cutting path corresponding to the first scanning head.

[0058] Step S22: Based on the difference between the sample drawing data and the sample entity data, generate the cutting speed corresponding to the first scanning head;

[0059] For example, the cutting speed corresponding to the first scanning head is calculated based on the difference.

[0060] In step S22, the sample drawing data includes the position data of at least one drawing mark point in the first part of the sample to be cut, and the sample entity data includes the position data of at least one entity mark point in the first part of the sample to be cut, wherein each drawing mark point corresponds one-to-one with each entity mark point.

[0061] The step of generating the cutting speed corresponding to the first scanning head based on the difference between the sample drawing data and the sample physical data includes:

[0062] Step A10: Based on the position data of each drawing mark point and the position data of each entity mark point in the first part, determine the deviation value between the actual cutting path and the simulated cutting path corresponding to the first scanning head, wherein the actual cutting path is composed of each entity mark point and the simulated cutting path is composed of each drawing mark point;

[0063] In one feasible embodiment, a simulated cutting path corresponding to the first scanning head is generated based on the position data of each of the drawing marker points in the first part, and an actual cutting path corresponding to the first scanning head is generated based on the position data of each of the entity marker points in the first part; the path length difference between the actual cutting path and the simulated cutting path is used as the deviation value between the actual cutting path and the simulated cutting path.

[0064] In another feasible embodiment, the path length difference between the actual cutting path and the simulated cutting path is generated based on the difference in position data between each of the drawing markers in the first part and their corresponding entity markers.

[0065] Step A20: Based on the deviation value, generate the cutting speed corresponding to the first scanning head, wherein the larger the deviation value, the greater the cutting speed.

[0066] It is understood that the larger the deviation value, the greater the difference in path length between the actual cutting path and the simulated cutting path.

[0067] It is understandable that due to the existence of equipment manufacturing tolerances, there may be differences between the actual sample to be cut and the sample drawing data. If the sample to be cut is still cut using the sample drawing data, the sample cutting may be inaccurate. In order to ensure that the first scanning head and the second scanning head complete the work at the same time, it may be necessary to adjust the cutting speed of the first scanning head and / or the second scanning head.

[0068] For example, the preset total cutting time and the total path length corresponding to the actual cutting path in the first part are obtained, and the quotient between the total path length and the preset total cutting time is used as the cutting speed corresponding to the first scanning head.

[0069] Step S23: Based on the cutting path and the cutting speed, control the first scanning head to cut the first part of the sample to be cut using the first beam.

[0070] Optionally, the beam splitter is a half-wave plate.

[0071] Understandably, a half-wave plate can separate the linear polarization of a light source into S-polarization and P-polarization, filtering out a very small amount of perpendicular energy components, thereby maximizing the utilization rate of the light source's splitting energy.

[0072] Optionally, the specific implementation steps of controlling the second scanning head to cut the second part of the sample to be cut through the second beam can refer to the specific implementation content of steps S21 to S23, step B10 and steps A10 to A20 above, and will not be repeated here.

[0073] This application provides a laser cutting method and a control device applied to a laser cutting system. The laser cutting system includes a first scanning head, a second scanning head, a light source, a control device, and a beam splitting device. The light source provides a laser beam to each of the scanning heads. The first and second scanning heads are arranged in parallel. The beam splitting device is used to split the laser beam provided by the light source into a first beam and a second beam. By acquiring sample information of the sample to be cut, and based on the sample information, the first scanning head is controlled to cut a first part of the sample to be cut using the first beam, while the second scanning head is controlled to cut a second part of the sample to be cut using the second beam. This achieves parallel control of the first and second scanning heads, thereby improving the laser cutting efficiency.

[0074] Example 2

[0075] Furthermore, based on the first embodiment of this application, in another embodiment of this application, the same or similar content as in the first embodiment described above can be referred to the above description and will not be repeated hereafter. Based on this, in step S20, the sample information includes sample drawing data and sample entity data. Before the step of controlling the first scanning head to cut the first part of the sample to be cut using the first beam according to the sample information, the method further includes:

[0076] Step C10: Generate the rotation angle of the spectrophotometer based on the sample drawing data and the sample entity data;

[0077] It is understandable that the faster the cutting speed of the scanning head, the shallower the cutting depth, and the slower the cutting speed, the deeper the cut depth. When the cutting speeds of the first and second scanning heads are inconsistent, the cut depths of the first and second parts of the sample to be cut will be different, resulting in lower cutting accuracy of the material to be cut.

[0078] For example, based on the sample drawing data and the sample entity data, the first predicted cut depth of the first scanning head and the second predicted cut depth of the second scanning head are determined; based on the first predicted cut depth and the second predicted cut depth, the rotation angle of the beam splitter is generated.

[0079] In one feasible embodiment, the cutting speed corresponding to the first scanning head and the cutting speed corresponding to the second scanning head are obtained; based on the cutting speed corresponding to the first scanning head, a first predicted cut depth of the first scanning head is determined, and based on the cutting speed corresponding to the second scanning head, a second predicted cut depth of the second scanning head is determined. If the first predicted cut depth is greater than or equal to the second predicted cut depth, then the light energy allocated by the beam splitter to the first scanning head at the rotation angle is less than or equal to the light energy allocated to the second scanning head; if the first predicted cut depth is less than the second predicted cut depth, then the light energy allocated by the beam splitter to the first scanning head at the rotation angle is greater than the light energy allocated to the second scanning head.

[0080] In step C10, the sample entity data includes the position data of at least one entity marker point in the first part of the sample to be cut and the position data of at least one entity marker point in the second part, wherein each drawing marker point corresponds one-to-one with each entity marker point.

[0081] The step of generating the rotation angle of the spectrometer based on the sample drawing data and the sample entity data includes:

[0082] Step C11: Based on the difference between the position data of each entity marker point in the first part and the position data of each entity marker point in the second part, the rotation angle of the beam splitter is generated.

[0083] For example, based on the difference between the position data of each entity marker point in the first part and the position data of each entity marker point in the second part, the path length difference between the first path length of the actual cutting path corresponding to the first part and the second path length of the actual cutting path corresponding to the second part is calculated; based on the path length difference, the rotation angle is generated, wherein if the first path length is greater than the second path length, then the light energy allocated by the beam splitter to the first scanning head at the rotation angle is greater than the light energy allocated to the second scanning head; if the first path length is less than or equal to the second path length, then the light energy allocated by the beam splitter to the first scanning head at the rotation angle is less than or equal to the light energy allocated to the second scanning head.

[0084] Step C20: Control the beam splitting device to split the beam at the rotation angle.

[0085] This application provides a laser cutting method. The method generates the rotation angle of the beam splitter based on the sample drawing data and the sample entity data. The beam splitter is controlled to split the light at the specified rotation angle, ensuring that the rotation angle matches the sample drawing data and the sample entity data. This achieves a reasonable distribution of light source energy, making the cut depth of the first part of the sample to be cut by the first scanning head equal to the cut depth of the second part of the sample to be cut by the second scanning head, thereby guaranteeing the accuracy of sample cutting.

[0086] Example 3

[0087] This application also provides a control device for a laser cutting system, see reference. Figure 2 The laser cutting system includes a first scanning head, a second scanning head, a light source, a control device, and a beam splitting device. The light source provides a laser beam to each of the scanning heads. The first and second scanning heads are arranged in parallel. The beam splitting device is used to split the laser beam provided by the light source into a first beam and a second beam. The control device in the laser cutting system includes:

[0088] The acquisition module is used to acquire sample information of the sample to be cut;

[0089] The control module is used to control the first scanning head to cut the first part of the sample to be cut by the first beam according to the sample information, and at the same time, control the second scanning head to cut the second part of the sample to be cut by the second beam.

[0090] Optionally, the sample information includes sample drawing data and sample entity data, and the control module is further configured to:

[0091] Based on the sample entity data, a cutting path corresponding to the first scanning head is generated;

[0092] Based on the difference between the sample drawing data and the sample physical data, the cutting speed corresponding to the first scanning head is generated;

[0093] Based on the cutting path and the cutting speed, the first scanning head is controlled to cut the first part of the sample to be cut using the first beam.

[0094] Optionally, the sample drawing data includes the position data of at least one drawing mark point in the first part of the sample to be cut, and the sample entity data includes the position data of at least one entity mark point in the first part of the sample to be cut, wherein each drawing mark point corresponds one-to-one with each entity mark point, and the control module is further configured to:

[0095] Based on the position data of each drawing mark point and the position data of each entity mark point in the first part, the deviation value between the actual cutting path and the simulated cutting path corresponding to the first scanning head is determined, wherein the actual cutting path is composed of each entity mark point and the simulated cutting path is composed of each drawing mark point;

[0096] Based on the deviation value, a cutting speed corresponding to the first scanning head is generated, wherein the larger the deviation value, the greater the cutting speed.

[0097] Optionally, the sample entity data includes the position data of at least one entity marker point in the first part of the sample to be cut, and the control module is further configured to:

[0098] The position data of each entity marker point are connected sequentially to obtain the cutting path corresponding to the first scanning head.

[0099] Optionally, the sample information includes sample drawing data and sample physical data. Before the step of controlling the first scanning head to cut the first part of the sample to be cut using the first beam according to the sample information, the control device in the laser cutting system further includes:

[0100] The rotation angle of the spectrophotometer is generated based on the sample drawing data and the sample physical data.

[0101] The beam splitting device is controlled to split the light at the specified rotation angle.

[0102] Optionally, the sample entity data includes the position data of at least one entity marker point in the first part and the position data of at least one entity marker point in the second part of the sample to be cut, wherein each drawing marker point corresponds one-to-one with each entity marker point, and the control device in the laser cutting system further includes:

[0103] The rotation angle of the beam splitter is generated based on the difference between the position data of each entity marker point in the first part and the position data of each entity marker point in the second part.

[0104] The control device in the laser cutting system provided in this application adopts the laser cutting method in the above embodiments, solving the technical problem of low laser cutting efficiency. Compared with the prior art, the beneficial effects of the control device in the laser cutting system provided in this application are the same as the beneficial effects of the laser cutting method provided in the above embodiments, and other technical features in the control device in this laser cutting system are the same as the features disclosed in the methods of the above embodiments, and will not be repeated here.

[0105] Example 4

[0106] This application provides an electronic device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, which are executed by the at least one processor to enable the at least one processor to perform the laser cutting method described in the above embodiments.

[0107] The following is for reference. Figure 3 The diagram illustrates a structural schematic of an electronic device suitable for implementing embodiments of the present disclosure. The electronic devices in the embodiments of the present disclosure may include, but are not limited to, mobile terminals such as mobile phones, laptops, digital broadcast receivers (PDAs), tablet computers, portable media players (PMPs), in-vehicle terminals (e.g., in-vehicle navigation terminals), and fixed terminals such as digital TVs and desktop computers. Figure 3 The electronic device shown is merely an example and should not be construed as limiting the functionality and scope of the embodiments disclosed herein.

[0108] like Figure 3 As shown, an electronic device may include a processing unit (such as a central processing unit, graphics processing unit, etc.) that can perform various appropriate actions and processes based on programs stored in ROM (Read-Only Memory) or programs loaded from storage devices into RAM (Random Access Memory). RAM also stores various programs and data required for the operation of the electronic device. The processing unit, ROM, and RAM are interconnected via a bus. Input / output (I / O) ports are also connected to the bus.

[0109] Typically, the following systems can be connected to I / O ports: input devices including, for example, touchscreens, touchpads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, etc.; output devices including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices including, for example, magnetic tapes, hard disks, etc.; and communication devices. Communication devices allow electronic devices to communicate wirelessly or wiredly with other devices to exchange data. Although electronic devices with various systems are shown in the figures, it should be understood that it is not required to implement or possess all the systems shown. More or fewer systems may be implemented alternatively.

[0110] In particular, according to embodiments of this disclosure, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments of this disclosure include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from a storage device, or installed from a ROM. When the computer program is executed by a processing device, it performs the functions defined above in the methods of embodiments of this disclosure.

[0111] The electronic device provided in this application uses the laser cutting method described in the above embodiments, which solves the technical problem of low laser cutting efficiency. Compared with the prior art, the beneficial effects of the electronic device provided in this application are the same as those of the laser cutting method provided in the above embodiments, and other technical features of the electronic device are the same as those disclosed in the methods of the above embodiments, and will not be repeated here.

[0112] It should be understood that various parts of this disclosure can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0113] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0114] Example 5

[0115] This embodiment provides a computer-readable storage medium having computer-readable program instructions stored thereon, the computer-readable program instructions being used to perform the laser cutting method of the above embodiment.

[0116] The computer-readable storage medium provided in this application embodiment may be, for example, a USB flash drive, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections with one or more wires, portable computer disks, hard disks, RAM, ROM, EPROM (Erasable Programmable Read Only Memory) or flash memory, optical fiber, CD-ROM (compact disc read-only memory), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, system, or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0117] The aforementioned computer-readable storage medium may be included in an electronic device or may exist independently without being assembled into an electronic device.

[0118] The aforementioned computer-readable storage medium carries one or more programs that, when executed by an electronic device, cause the electronic device to: acquire sample information of a sample to be cut; and, based on the sample information, control the first scanning head to cut a first portion of the sample to be cut using the first light beam, while simultaneously controlling the second scanning head to cut a second portion of the sample to be cut using the second light beam.

[0119] Computer program code for performing the operations of this disclosure can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a LAN (Local Area Network) or a WAN (Wide Area Network)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0120] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0121] The modules described in the embodiments of this disclosure can be implemented in software or hardware. The names of the modules do not necessarily limit the functionality of the unit itself.

[0122] The computer-readable storage medium provided in this application stores computer-readable program instructions for executing the above-described laser cutting method, thus solving the technical problem of low efficiency in laser cutting. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as those of the laser cutting method provided in the above-described embodiments, and will not be repeated here.

[0123] Example 6

[0124] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the laser cutting method described above.

[0125] The computer program product provided in this application solves the technical problem of low efficiency in laser cutting. Compared with the prior art, the beneficial effects of the computer program product provided in this application are the same as the beneficial effects of the laser cutting method provided in the above embodiments, and will not be repeated here.

[0126] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent scope of this application.

Claims

1. A laser cutting method, characterized in that, A control device for a laser cutting system, the laser cutting system comprising a first scanning head, a second scanning head, a light source, a control device, and a beam splitting device, wherein the light source provides a laser beam to each of the scanning heads, the first scanning head and the second scanning head are arranged in parallel, and the beam splitting device is used to split the laser beam provided by the light source into a first beam and a second beam; the laser cutting method includes: Obtain sample information of the sample to be cut. The sample information includes sample drawing data and sample entity data. The sample drawing data includes the position data of at least one drawing mark point in the first part of the sample to be cut. The sample entity data includes the position data of at least one entity mark point in the first part of the sample to be cut. The sample entity data includes the position data of at least one entity mark point in the first part and the position data of at least one entity mark point in the second part of the sample to be cut. Each drawing mark point corresponds one-to-one with each entity mark point. Based on the sample information, the first scanning head is controlled to cut the first part of the sample to be cut using the first beam, while the second scanning head is controlled to cut the second part of the sample to be cut using the second beam. The step of controlling the first scanning head to cut the first part of the sample to be cut using the first beam based on the sample information includes: Based on the sample entity data, a cutting path corresponding to the first scanning head is generated; Based on the position data of each drawing mark point and the position data of each entity mark point in the first part, the deviation value between the actual cutting path and the simulated cutting path corresponding to the first scanning head is determined, wherein the actual cutting path is composed of each entity mark point and the simulated cutting path is composed of each drawing mark point; Based on the deviation value, a cutting speed corresponding to the first scanning head is generated, wherein the larger the deviation value, the greater the cutting speed; Based on the cutting path and the cutting speed, the first scanning head is controlled to cut the first part of the sample to be cut using the first beam; Before the step of controlling the first scanning head to cut the first portion of the sample to be cut using the first beam based on the sample information, the method further includes: Based on the difference between the position data of each entity marker point in the first part and the position data of each entity marker point in the second part, the path length difference between the first path length of the actual cutting path corresponding to the first part and the second path length of the actual cutting path corresponding to the second part is calculated. Based on the path length difference, the rotation angle of the beam splitter is generated, wherein if the first path length is greater than the second path length, then the light energy allocated by the beam splitter to the first scanning head at the rotation angle is greater than the light energy allocated to the second scanning head; if the first path length is less than or equal to the second path length, then the light energy allocated by the beam splitter to the first scanning head at the rotation angle is less than or equal to the light energy allocated to the second scanning head. The beam splitting device is controlled to split the light at the rotation angle.

2. The laser cutting method as described in claim 1, characterized in that, The sample entity data includes the position data of at least one entity marker point in the first part of the sample to be cut. The step of generating the cutting path corresponding to the first scanning head based on the sample entity data includes: The position data of each entity marker point are connected sequentially to obtain the cutting path corresponding to the first scanning head.

3. An electronic device, characterized in that, The electronic device includes: At least one processor; and, A memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the steps of the laser cutting method according to any one of claims 1 to 2.

4. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a program for implementing a laser cutting method, which is executed by a processor to implement the steps of the laser cutting method as described in any one of claims 1 to 2.

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