Laser drilling inspection equipment for chip substrates

Abstract

This invention discloses a laser drilling inspection device for chip substrates, relating to the field of semiconductor manufacturing technology. The device includes a frame, a material handling mechanism, a positioning and moving platform, a laser drilling and marking assembly, a vision inspection assembly, and an industrial control computer. The material handling mechanism is mounted on the frame for picking up and placing chip substrates. The positioning and moving platform moves the chip substrate to the drilling position. The laser drilling and marking assembly is located above the positioning and moving platform for drilling reference holes and marking on the chip substrate. The vision inspection assembly detects the image information of the reference holes and markings on the processed chip substrate. The industrial control computer is mounted on the frame to determine whether the processed chip substrate is qualified based on the image information. This invention provides a laser drilling inspection device for chip substrates, offering a consistent manufacturing benchmark and corresponding traceability for subsequent processes such as surface mount technology (SMT), wire bonding, and packaging, thereby improving production efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a laser drilling inspection device for chip substrates. Background Technology

[0002] Among semiconductor device packaging types, QFN (Quad Flat No-leads Package) is a relatively new surface-mount package. It features a large exposed pad at the center of the bottom for heat dissipation, and electrode contacts on all four sides. Unlike traditional SOIC (Small Outline Integrated Circuit Package) and TSOP (Thin Small Outline Package), which have gull-wing leads, QFN has a short conductive path between the internal leads and the pad, resulting in low self-inductance and low internal wiring resistance. This leads to excellent heat dissipation and electrical performance, along with advantages such as small size and light weight, leading to rapid growth in its application in recent years. To improve production efficiency and save costs, some chip manufacturers have increased the size of the device carrier substrate from 248×80mm to 320×310mm. This increases the number of devices that can be carried on the same area, reduces carrier waste, and shortens the manufacturing cycle to some extent. In existing technologies, a 248×80mm chip substrate is typically used. During production, a punching machine is first used to punch reference holes, and then a marking machine is used to mark them. However, punching and marking are completed by two separate machines, resulting in low chip manufacturing efficiency.

[0003] The existing mature process basically uses the standard lead frame produced by the front-end equipment. This conventional lead frame is also made of a variety of materials, and its size generally does not exceed 250×100mm. The reference holes on the lead frame are also formed by the front-end equipment through die stamping or chemical etching, and then the marking is done on the frame by another equipment. Summary of the Invention

[0004] The main objective of this invention is to provide a laser drilling inspection device for chip substrates, which aims to improve chip manufacturing efficiency and provide a common process manufacturing benchmark and corresponding traceability basis for subsequent processes such as chip mounting, wire bonding, and packaging.

[0005] To achieve the above objectives, the present invention proposes a laser drilling inspection device for chip substrates, comprising:

[0006] frame;

[0007] A material handling mechanism, located on the frame, is used for picking up and placing chip substrates;

[0008] A positioning and moving platform is mounted on the rack for moving the chip substrate to the drilling position;

[0009] A laser drilling and marking assembly is mounted on the frame and located above the positioning and moving platform for drilling reference holes and marking on the chip substrate.

[0010] A vision inspection component, mounted on the rack, is used to inspect image information of reference holes and codes on the processed chip substrate; and

[0011] An industrial control computer is mounted on the frame and connected by signals to the material handling mechanism, the positioning and moving platform, the laser drilling and marking component, and the vision inspection component, respectively, for determining whether the processed chip substrate is qualified based on the image information and controlling the operation of the material handling mechanism, the positioning and moving platform, the laser drilling and marking component, and the vision inspection component.

[0012] Optionally, the material handling mechanism is a robotic arm, which includes a mounting frame, a cable chain, a first driving component, a suction cup fixing block, and a vacuum suction cup. The mounting frame is fixed on the frame, the cable chain is disposed on the mounting frame and drivenly connected to the first driving component, and the vacuum suction cup is disposed on the cable chain through the suction cup fixing block. The vacuum suction cup is provided with a first material identification sensor for detecting the material type of the chip substrate.

[0013] Optionally, the chip substrate laser drilling inspection equipment further includes a platform mounted on the frame, the platform having at least two trays, one tray for placing the chip substrate to be processed, and the other tray for placing the processed chip substrate; each tray is equipped with a position sensor, a second material identification sensor, and a separator, the position sensor for detecting whether a chip substrate is placed there, the second material identification sensor for detecting the material type of the chip substrate, and the separator for separating any adhered chip substrates.

[0014] Optionally, the positioning and moving platform includes a precision moving module, an active material blocking mechanism, a passive material blocking mechanism, a cleaning component, a negative pressure material collector, and a dust collection component. The precision moving module is mounted on the frame and is used to drive the chip substrate to the drilling position. The active material blocking mechanism is located on one side of the precision moving module and is used to stop one side of the chip substrate. The passive material blocking mechanism is located at one end of the precision moving module and is used to stop the other side of the chip substrate. The cleaning component is located above the precision moving module and is used to clean the precision moving module. The negative pressure material collector is located below the precision moving module and is used to collect waste generated during the drilling process. The dust collection component is located above the drilling position and is used to suck up the dust generated during the drilling process.

[0015] Optionally, the precision moving module is provided with a negative pressure worktable, and the negative pressure worktable has multiple sets of negative pressure holes for adsorbing the chip substrate, and the multiple sets of negative pressure holes are connected to a vacuum generator.

[0016] Optionally, the active stop mechanism includes a second drive member, an eccentric wheel assembly, a stop rod, and a cross roller guide rail assembly. The second drive member is connected to the stop rod through the eccentric wheel assembly. A slider is provided on the cross roller guide rail assembly, and the stop rod is mounted on the slider through a tension spring.

[0017] Optionally, an ion fan is provided on one side of the negative pressure workbench to remove static electricity from the surface of the chip substrate.

[0018] Optionally, the negative pressure workbench is made of carbon steel and is hard chrome plated on the surface after quenching and tempering, and then mirror polished. The surface hardness of the negative pressure workbench is greater than 65HRC; and / or the stop bar is made of hard alloy material and is polished on the surface.

[0019] Optionally, the laser drilling and marking assembly includes a mounting base and a first laser marking machine and a second laser marking machine respectively mounted on the mounting base in a height-adjustable manner. The first laser marking machine is used to drill part of the reference holes on the chip substrate, and the second laser marking machine is used to drill and mark another part of the reference holes on the chip substrate.

[0020] Optionally, the visual inspection component includes a mounting base and at least two sets of image acquisition components. The mounting base is fixed to the frame, and the image acquisition components are movably disposed on the mounting base along a first direction and a second direction, wherein the first direction is perpendicular to the second direction. One set of the image acquisition components is used to detect the shape and position of the reference hole of the chip substrate, and the other set of the image acquisition components is used to detect the digital plaintext and QR code of the chip substrate.

[0021] In the technical solution of this invention, the chip substrate laser drilling inspection equipment includes a frame, a material handling mechanism, a positioning and moving platform, a laser drilling and marking component, a vision inspection component, and an industrial control computer. The material handling mechanism is mounted on the frame for picking up and placing chip substrates. The positioning and moving platform is mounted on the frame for moving the chip substrate to the drilling position. The laser drilling and marking component is mounted on the frame and located above the positioning and moving platform for drilling reference holes and marking on the chip substrate. The vision inspection component is mounted on the frame for detecting the image information of the reference holes and markings on the processed chip substrate. The industrial control computer is mounted on the frame and is signal-connected to the material handling mechanism, the positioning and moving platform, the laser drilling and marking component, and the vision inspection component, respectively, for determining whether the processed chip substrate is qualified based on the image information and controlling the operation of the material handling mechanism, the positioning and moving platform, the laser drilling and marking component, and the vision inspection component. In this way, by integrating laser drilling and marking processes onto the same equipment, chip manufacturing efficiency is greatly improved, and a common manufacturing benchmark and corresponding traceability basis are provided for subsequent processes such as surface mount technology (SMT), wire bonding, and packaging. Furthermore, by setting up a vision inspection component to detect the image information of the reference holes and markings on the processed chip substrate, the industrial control computer determines whether the processed chip substrate is qualified based on the image information, thereby screening out defective products and significantly improving the chip processing yield. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of chip substrate processing;

[0024] Figure 2 This is a schematic diagram of the internal structure of an embodiment of the laser drilling and inspection equipment for chip substrates of the present invention;

[0025] Figure 3 This is a schematic diagram of the positioning and moving platform in one embodiment of the chip substrate laser drilling and inspection equipment of the present invention;

[0026] Figure 4 This is a schematic diagram of the loading and unloading platform in one embodiment of the chip substrate laser drilling and inspection equipment of the present invention;

[0027] Figure 5 This is a schematic diagram of the positioning and moving platform in one embodiment of the chip substrate laser drilling and inspection equipment of the present invention;

[0028] Figure 6 This is a schematic diagram of the structure of the laser drilling and marking components in one embodiment of the laser drilling and inspection equipment for chip substrates of the present invention;

[0029] Figure 7 This is a schematic diagram of the structure of the vision inspection component in one embodiment of the chip substrate laser drilling inspection equipment of the present invention.

[0030] Explanation of icon numbers:

[0031] 10. Frame; 20. Material handling mechanism; 30. Positioning and moving platform; 40. Laser drilling and marking assembly; 50. Vision inspection assembly; 60. Industrial computer; 21. Mounting bracket; 22. Cable chain; 23. Suction cup fixing block; 24. Vacuum suction cup; 25. First material identification sensor; 71. Storage table; 72. Tray; 73. Position sensor; 74. Second material identification sensor; 75. Distributor; 31. Precision moving module; 32. Active stop. 33. Passive material blocking mechanism; 34. Cleaning assembly; 35. Negative pressure material receiver; 36. Dust collection assembly; 37. Negative pressure workbench; 38. Ion fan; 39. Protective light shield; 371. Vacuum generator; 41. Mounting base; 42. First laser marking machine; 43. Second laser marking machine; 51. Fixed base; 52. Image acquisition component; 100. Chip substrate; 101. Reference hole; 102. Plain code; 103. QR code.

[0032] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0034] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0035] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the word "and / or" throughout the text means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0036] This invention proposes a laser drilling inspection device for chip substrates.

[0037] Reference Figure 1 and Figure 2 In one embodiment of the present invention, the chip substrate laser drilling inspection equipment includes a frame 10, a material handling mechanism 20, a positioning and moving platform 30, a laser drilling and marking assembly 40, a vision inspection assembly 50, and an industrial control computer 60. The material handling mechanism 20 is disposed on the frame 10 for picking up and placing the chip substrate 100. The positioning and moving platform 30 is disposed on the frame 10 for moving the chip substrate 100 to the drilling position. The laser drilling and marking assembly 40 is mounted on the frame 10 and located above the positioning and moving platform 30 for marking the chip substrate 100. The reference hole 101 and the coding are installed on the frame 10. The vision inspection component 50 is installed on the frame 10 to inspect the image information of the reference hole 101 and the coding on the processed chip substrate 100. The industrial control computer 60 is installed on the frame 10 and is connected to the picking mechanism 20, the positioning moving platform 30, the laser drilling and coding component 40 and the vision inspection component 50 respectively. The computer is used to determine whether the processed chip substrate 100 is qualified according to the image information and to control the operation of the picking mechanism 20, the positioning moving platform 30, the laser drilling and coding component 40 and the vision inspection component 50.

[0038] In this embodiment, the material handling mechanism 20 may be a multi-axis robot or the like, which can pick up the chip substrate 100 by a suction cup or hold the chip substrate 100 by a clamping component, etc. No specific limitation is made here.

[0039] The positioning and moving platform 30 can adopt a precision moving module, etc., which can fix the chip substrate 100 by negative pressure adsorption or clamping the chip substrate 100 at the punched position. No specific limitation is made here.

[0040] The laser drilling and marking component 40 can be composed of two laser marking machines with different light sources, or other drilling devices and marking machines; there are no restrictions here.

[0041] The visual inspection component 50 can be a structured light camera, an infrared camera, a CCD or a CMOS camera, etc., whichever is more specific.

[0042] It is understood that this invention, by integrating laser drilling and marking processes onto the same equipment, greatly improves chip manufacturing efficiency and provides a consistent manufacturing benchmark and corresponding traceability basis for subsequent processes such as surface mount technology (SMT), wire bonding, and packaging. Furthermore, by setting up a vision inspection component 50 to detect the image information of the reference holes 101, digital clear codes 102, and QR codes 103 on the processed chip substrate 100, the industrial control computer 60 determines whether the processed chip substrate 100 is qualified based on the image information, thereby screening out defective products and significantly improving the chip processing yield.

[0043] To further improve production efficiency and avoid damage to the chip substrate 100, thereby further improving the yield of chip processing, the main references are as follows: Figure 3 In one embodiment, the material handling mechanism 20 is a robotic arm, which may include a mounting frame 21, a drag chain 22, a first driving component, a suction cup fixing block 23, and a vacuum suction cup 24. The mounting frame 21 is fixed on the frame 10, the drag chain 22 is disposed on the mounting frame 21 and drivenly connected to the first driving component, and the vacuum suction cup 24 is disposed on the drag chain 22 through the suction cup fixing block 23. The vacuum suction cup 24 is provided with a first material identification sensor 25 for detecting the material type of the chip substrate 100, so that the system can adjust the suction force of the vacuum suction cup 24 and / or the blowing pressure of the dispensing device 75 below according to the actual material type.

[0044] Among them, the vacuum suction cup 24 can be made of flexible materials such as silicone, the first driving component can be a servo motor, and the first material identification sensor 25 can be a background suppression sensor, etc., without limitation.

[0045] Furthermore, to improve the convenience of production and manufacturing, it mainly refers to Figure 4 The chip substrate laser drilling inspection equipment may also include a stage 71 mounted on the frame 10. The stage 71 is provided with at least two trays 72. One tray 72 is used to place the chip substrate 100 to be processed, and the other tray 72 is used to place the processed chip substrate 100. Each tray 72 is provided with a position sensor 73, a second material identification sensor 74, and a separator 75. The position sensor 73 is used to detect whether a chip substrate 100 is placed there. The second material identification sensor 74 detects the material type of the chip substrate 100. The separator 75 is used to separate the adhered chip substrates 100.

[0046] During production, the system will stop and alarm when it detects a defective chip substrate 100. The next step can only proceed after the operator manually enters the serial number of the chip substrate 100 into the equipment and confirms. A second material identification sensor 74 can be installed at each tray 72, performing non-contact detection from the bottom notch of the tray 72 upwards. Since the chip substrate 100 comes in various material specifications, including copper alloys and fiber composite materials, some materials are quite special and cannot be detected by ordinary fiber optic or photoelectric sensors; therefore, a background suppression type sensor is preferred. The distributor 75 can be a high-pressure distributor to prevent some fiber composite chip substrates 100 from sticking together under electrostatic effects. An electrostatic high-pressure air blowing group is installed on both sides of the chip substrate 100 to effectively prevent electrostatic adsorption and adhesion between the two chip substrates 100.

[0047] It should be noted that the main function of the robotic arm is to transport the chip substrate 100 from the tray 72 to the positioning and moving platform 30, and to apply a certain pressure through the torque mode of the servo motor to flatten the slightly deformed chip substrate 100 with silicone suction cups, so that it is flat and adsorbed on the positioning and moving platform 30. In addition, the robotic arm can also transport good products to the unloading tray 72 after visual inspection.

[0048] Reference Figure 2 and Figure 5 In one embodiment, the positioning and moving platform 30 may include a precision moving module 31, an active blocking mechanism 32, a passive blocking mechanism 33, a cleaning component 34, a negative pressure collector 35, and a dust collection component 36. The precision moving module 31 is mounted on the frame 10 and is used to drive the chip substrate 100 to the drilling position. The active blocking mechanism 32 is located on one side of the precision moving module 31 and is used to stop one side of the chip substrate 100. The passive blocking mechanism 33 is located at one end of the precision moving module 31 and is used to stop the other side of the chip substrate 100. The cleaning component 34 is located above the precision moving module 31 and is used to clean the precision moving module 31. The negative pressure collector 35 is located below the precision moving module 31 and is used to collect waste generated during the drilling process. The dust collection component 36 is located above the drilling position and is used to suck up the dust generated during the drilling process.

[0049] In this embodiment, the precision moving module 31 may be provided with a negative pressure worktable 37, and the negative pressure worktable 37 has multiple sets of negative pressure holes for adsorbing the chip substrate 100, and the multiple sets of negative pressure holes are connected to the vacuum generator 371.

[0050] The precision moving module 31 can be composed of a linear motor and a grating system to form a closed-loop high-precision moving module, wherein the grating system can provide real-time and accurate feedback on the speed and position of the load. To further improve the yield of the chip substrate 100 manufacturing, the positioning and repeatability accuracy of the precision moving module 31 needs to be less than 2 micrometers. The mounted negative pressure stage 37 can be made of high-quality carbon steel, and after heat treatment, the surface can be plated with hard chrome and then mirror polished to make its surface hardness greater than 65HRC. The surface of the negative pressure stage 37 has multiple evenly distributed negative pressure holes, which can be generated by the vacuum generator 371 to attract and flatten the chip substrate 100, so that the warped chip substrate 100 is tightly attached to the surface of the negative pressure stage 37. The flatness after adsorption can be less than 0.1mm, further improving the processing quality of the chip substrate 100.

[0051] Furthermore, mainly referring to Figure 5 The active stop mechanism 32 may include a second drive component, an eccentric wheel assembly, a stop bar, and a cross roller guide assembly. The second drive component is connected to the stop bar via the eccentric wheel assembly. A slider is provided on the cross roller guide assembly, and the stop bar is mounted on the slider via a tension spring. This prevents the chip substrate 100 from deviating from its processing position, thus avoiding misalignment of the reference hole 101 and the QR code 103.

[0052] Specifically, the active stop mechanism 32 can be composed of a stepper motor, an eccentric wheel group, and a cross roller guide rail group. Two sets of stop rods held by tension springs can be installed on the slider of the guide rail group. The stop rods can be made of hard alloy material and polished on the surface. The eccentric wheel is rotated to drive the stop rods to move and the flexible tension of the tension spring is used to adjust the chip substrate 100 horizontally.

[0053] In this embodiment, the passive blocking mechanism 33 is similar in principle to the active blocking mechanism 32 described above. The difference is that the passive blocking mechanism 33 can use the movement of the precision moving module 31 as the driving force to adjust the other direction of the chip substrate 100.

[0054] Reference Figure 5 In this embodiment, the cleaning component 34 can span across the negative pressure workbench 37, with one end being blown out by compressed air and the other end being connected to negative pressure suction, thereby keeping the negative pressure workbench 37 clean.

[0055] In this embodiment, the negative pressure receiver 35 can be located below the negative pressure worktable 37, and may include two separate horn-shaped material troughs to receive the waste material cut off by the laser during the substrate drilling process. The material troughs are connected to negative pressure to ensure that the waste material is sucked into the receiver.

[0056] In this embodiment, the dust collection component 36 can be a dust extraction hood or the like. When the laser performs drilling on the chip substrate 100, different substrate materials will generate different levels of dust. A dust extraction hood is set directly above the substrate processing position, and the dust generated during processing can be removed by negative pressure.

[0057] Please refer to Figure 5 In one embodiment, an ion fan 38 may be provided on one side of the negative pressure worktable 37 to remove static electricity from the surface of the chip substrate 100.

[0058] Before drilling holes in each chip substrate 100, an ion fan 38 must be used to remove static electricity from the surface of the chip substrate 100 to prevent sintering dust generated during the laser drilling process from adhering to the chip substrate 100 under the action of static electricity and becoming difficult to remove, thus affecting subsequent testing procedures.

[0059] Additionally, refer to Figure 5 To avoid damage to naked eyes from the laser emitted during laser processing, a special protective light shield can be installed 39.

[0060] To improve the efficiency of punching and coding, the main reference is... Figure 1 , Figure 2 and Figure 6 In one embodiment, the laser drilling and marking assembly 40 may include a mounting base 41 and a first laser marking machine 42 and a second laser marking machine 43 respectively mounted on the mounting base 41 in a height-reducible manner. The first laser marking machine 42 is used to drill part of the reference holes 101 on the chip substrate 100, and the second laser marking machine 43 is used to drill another part of the reference holes 101 on the chip substrate 100 and mark them.

[0061] In this embodiment, the laser drilling and marking component 40 is a dual-laser component, mainly composed of a gantry-type base and two laser marking machines with different light sources. The two laser marking machines can be equipped with independent cross roller guide rails to adjust the focal length of the laser marking machines. The gantry-type base has a high degree of verticality to the machine table to ensure that changes in focal length adjustment have minimal impact on laser processing when processing different materials.

[0062] To improve detection efficiency, refer to Figure 1 , Figure 2 and Figure 7In one embodiment, the visual inspection component 50 may include a mounting base 51 and at least two sets of image acquisition components 52. The mounting base 51 is fixed on the frame 10, and the image acquisition components 52 are movably disposed on the mounting base 51 along a first direction and a second direction, wherein the first direction is perpendicular to the second direction. One set of image acquisition components 52 is used to detect the shape and position of the reference hole 101 of the chip substrate 100, and the other set of image acquisition components 52 is used to detect the digital plain code 102 and the QR code 103 of the chip substrate 100.

[0063] The first direction can be the Y-axis of the machine tool, and the second direction can be the Z-axis of the machine tool; there is no limitation here.

[0064] In this embodiment, the main function of the image acquisition component 52 is to read the laser-printed digital code 102 and QR code 103, and to measure the shape and distance of the four sets of reference holes 101. The Y-axis direction of the fixed base 51 can be equipped with a cross roller guide to support the four sets of high-pixel cameras and make the whole system adjustable in the Y direction. Two sets of cameras are used to detect the shape and position of the reference holes 101, and the other two sets of cameras can detect the digital code 102 and QR code 103 respectively. In addition, each set of cameras can be equipped with a guide rail that can be adjusted in the Z direction to facilitate the adjustment of the camera's focal length.

[0065] In summary, the workflow of the chip substrate laser drilling inspection equipment of the present invention is roughly as follows: material is received by tray 72 - material is picked up by suction cup - material is separated by air blowing - back side code reading - material is received by platform - passive side-adjustment - active side-adjustment - substrate flattening - negative pressure suction - surface cleaning - static electricity removal - negative pressure cleaning - drilling the first set of reference holes 101 - drilling digital code 102 and QR code 103 - drilling the second set of reference holes 101 - removing smoke and dust - surface cleaning - code reading inspection - inspection of the first set of reference holes 101 - inspection of the second set of reference holes 101 - hole spacing inspection - material suction and air release - material is picked up by suction cup - material is unloaded from tray 72.

[0066] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A chip substrate laser drilling inspection apparatus, characterized by, The chip substrate laser drilling detection device comprises a rack, a material taking mechanism arranged on the rack and used for taking and placing a chip substrate, a positioning moving platform arranged on the rack and used for moving the chip substrate to a drilling position, a laser drilling and coding assembly installed on the rack and located above the positioning moving platform and used for drilling a reference hole and coding on the chip substrate, a visual detection assembly arranged on the rack and used for detecting image information of the reference hole and the code on the processed chip substrate, and an industrial computer arranged on the rack and signal connected with the material taking mechanism, the positioning moving platform, the laser drilling and coding assembly and the visual detection assembly respectively, and used for determining whether the processed chip substrate is qualified according to the image information and controlling the material taking mechanism, the positioning moving platform, the laser drilling and coding assembly and the visual detection assembly to work. The material taking mechanism is a manipulator used for carrying the chip substrate from a tray to the positioning moving platform, the tray is provided with a position sensor, a second material identification sensor and a material separator, the position sensor is used for detecting whether the chip substrate is placed, the second material identification sensor is used for detecting a material type of the chip substrate, and the material separator is used for separating the adhered chip substrates. The material taking mechanism is a manipulator, the manipulator comprises a mounting frame, a drag chain, a first driving member, a suction disc fixing block and a vacuum suction disc, the mounting frame is fixed to the rack, the drag chain is arranged on the mounting frame and is drivingly connected with the first driving member, and the vacuum suction disc is arranged on the drag chain through the suction disc fixing block; the vacuum suction disc is provided with a first material identification sensor for detecting the material type of the chip substrate. The chip substrate laser drilling detection device further comprises a placing table arranged on the rack, and the placing table is provided with at least two trays, one of the trays is used for placing the chip substrate to be processed, and the other of the trays is used for placing the processed chip substrate. The positioning moving platform comprises a precision moving module, an active material blocking mechanism, a passive material blocking mechanism, a cleaning assembly, a negative pressure material collector and a smoke dust collecting assembly, the precision moving module is arranged on the rack and is used for driving the chip substrate to move to the drilling position, the active material blocking mechanism is arranged on one side of the precision moving module and is used for stopping one side edge of the chip substrate, the passive material blocking mechanism is arranged on one end of the precision moving module and is used for stopping the other side edge of the chip substrate, the cleaning assembly is arranged above the precision moving module and is used for cleaning the precision moving module, the negative pressure material collector is arranged below the precision moving module and is used for collecting waste generated in the drilling process, and the smoke dust collecting assembly is arranged above the drilling position and is used for sucking smoke dust generated in the drilling process. A negative pressure workbench is arranged on the precision moving module, a plurality of negative pressure holes for adsorbing the chip substrate are formed in the negative pressure workbench, and the plurality of negative pressure holes are communicated with a vacuum generator. ​ ​ ​ 2. The chip substrate laser drilling inspection apparatus according to claim 1, wherein ​ 3. The chip substrate laser drilling inspection apparatus according to claim 1, wherein ​ 4. The chip substrate laser drilling inspection apparatus according to claim 1, wherein ​ 5. The chip substrate laser drilling inspection apparatus according to claim 4, wherein ​ 6. The chip substrate laser drilling inspection apparatus according to claim 5, wherein The active material blocking mechanism comprises a second driving member, an eccentric wheel set, a material blocking rod and a cross roller guide set, the second driving member is connected with the material blocking rod through the eccentric wheel set, the cross roller guide set is provided with a sliding block, and the material blocking rod is installed on the sliding block through a tension spring.

7. The chip substrate laser drilling inspection apparatus according to claim 5, wherein One side of the negative pressure workbench is provided with an ion fan for removing static electricity on the surface of the chip substrate.

8. The chip substrate laser drilling inspection apparatus according to claim 6, wherein The negative pressure workbench is made of carbon steel material, is subjected to quenching and tempering treatment, is plated with hard chromium on the surface and is subjected to mirror polishing treatment, the surface hardness of the negative pressure workbench is greater than 65HRC, and / or the material blocking rod is made of hard alloy material and is subjected to polishing treatment on the surface.

9. The chip substrate laser drilling inspection apparatus according to claim 1, wherein The laser drilling and coding assembly comprises a mounting seat and first and second laser marking machines which are respectively arranged on the mounting seat in a liftable manner, the first laser marking machine is used for marking part of the reference holes on the chip substrate, and the second laser marking machine is used for marking another part of the reference holes on the chip substrate and coding.

10. The chip substrate laser drilling inspection apparatus according to claim 1, wherein The visual detection assembly comprises a fixing seat and at least two groups of image acquisition components, the fixing seat is fixed on the rack, the image acquisition components are movably arranged on the fixing seat along a first direction and a second direction, the first direction is perpendicular to the second direction, one group of the image acquisition components is used for detecting the shape and position of the reference holes of the chip substrate, and the other group of the image acquisition components is used for detecting the digital plaintext code and the two-dimensional code of the chip substrate.

Images