Opto-mechanical system

Abstract

The embodiment of the application discloses an optical-mechanical system, which comprises a light emitting assembly, a light receiving assembly and a light scanning assembly. The light scanning assembly comprises a first light scanning element and a second light scanning element. The emitted light signal is transmitted by the first light scanning element and the second light scanning element in sequence and then emitted to a target object. Along a first straight line direction, the second light scanning element is located between the first light scanning element and the light emitting assembly. And / or, the echo light signal is transmitted by the second light scanning element and the first light scanning element in sequence and then reaches the light receiving assembly. Along the first straight line direction, the second light scanning element is located between the first light scanning element and the light receiving assembly. The optical-mechanical system can make the emission position of the emitted light signal and / or the incidence position of the echo light signal be located in the middle of the optical-mechanical system, which is beneficial to realize the calibration of the optical-mechanical system and the symmetry of the close-range point cloud.

Description

Technical Field

[0001] This application relates to the field of optical technology, and more particularly to an optomechanical system. Background Technology

[0002] Optomechanical systems are devices that transmit optical signals to external space targets, receive the echo signals, and analyze and compare the transmitted and echo signals to obtain information such as the target's distance. Due to the real-time, stable, and rich nature of their data, they have been widely used. However, the detection capabilities of optomechanical systems still need further improvement. Summary of the Invention

[0003] This application provides an optomechanical system to address the problem that the detection capability of optomechanical systems in related technologies needs further improvement. The technical solution is as follows;

[0004] In a first aspect, embodiments of this application provide an optomechanical system, including:

[0005] A light emitting component is used to emit light signals towards a target object;

[0006] An optical receiving component is used to receive the echo light signal reflected by the target object;

[0007] An optical scanning assembly includes a first optical scanning element and a second optical scanning element. The emitted optical signal is transmitted sequentially through the first optical scanning element and the second optical scanning element before being emitted to the target object. Along a first straight line direction, the second optical scanning element is located between the first optical scanning element and the optical emitting assembly. And / or, the echo optical signal is transmitted sequentially through the second optical scanning element and the first optical scanning element before reaching the optical receiving assembly. Along the first straight line direction, the second optical scanning element is located between the first optical scanning element and the optical receiving assembly.

[0008] In the optomechanical system of this embodiment, the emitted optical signal is exited via a second optical scanning element, which is located between the first optical scanning element and the optical emitting component. This arrangement helps to extend the transmission path of the emitted optical signal, reduce the divergence angle, and improve the ranging capability of the optomechanical system. Simultaneously, it allows the exit position of the emitted optical signal to be approximately located in the center of the optomechanical system, which is beneficial for the calibration of the optomechanical system and the symmetry of the near-field point cloud. The echo optical signal is incident on the optomechanical system via the second optical scanning element, which is located between the first optical scanning element and the optical receiving component. This arrangement helps to extend the transmission path of the echo optical signal, improve the ranging capability of the optomechanical system, and allow the incident position of the echo optical signal to be approximately located in the center of the optomechanical system, which is beneficial for the calibration of the optomechanical system and the symmetry of the near-field point cloud. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a schematic diagram of the structure of the optomechanical system provided in the first embodiment of this application;

[0011] Figure 2 This is a schematic diagram of the structure of the optomechanical system provided in the second embodiment of this application;

[0012] Figure 3 This is a schematic diagram of the optical-mechanical system provided in the third embodiment of this application;

[0013] Figure 4 This is a schematic diagram of the optical-mechanical system provided in the fourth embodiment of this application;

[0014] Figure 5 This is a schematic diagram of the structure of the optomechanical system provided in the fifth embodiment of this application;

[0015] Figure 6 This is a schematic diagram of the optical-mechanical system provided in the sixth embodiment of this application;

[0016] Figure 7 This is a schematic diagram of the optical-mechanical system provided in the seventh embodiment of this application;

[0017] Figure 8 This is a cross-sectional schematic diagram of the optomechanical system provided in the eighth embodiment of this application;

[0018] Figure 9 yes Figure 8 The diagram shows the structure of the optical emitting component, optical receiving component, optical scanning component, and isolator in the optomechanical system.

[0019] Figure 10 yes Figure 8 An exploded view of the isolation component in the optomechanical system is shown.

[0020] Figure 11 yes Figure 8 The diagram shown is an exploded view of the optomechanical system.

[0021] Figure 12 yes Figure 8 An exploded view of the optical receiving component in the optomechanical system is shown.

[0022] Figure 13 yes Figure 8 The diagram shows a top view of the optical emitting component, optical receiving component, optical scanning component, and housing in the optomechanical system.

[0023] Figure 14 yes Figure 8 A three-dimensional cross-sectional schematic diagram of a portion of the structure in the optomechanical system is shown.

[0024] Figure 15 yes Figure 8 A three-dimensional schematic diagram of the extinction fins in the optomechanical system is shown;

[0025] Figure 16 yes Figure 8 An enlarged schematic diagram of the structure at point A in the middle.

[0026] Figure Descriptions: 1. Optomechanical system; 10. Optical emitting assembly; 12. Emitting plate; 121. First plate surface; 122. Second plate surface; 13. Emitting shield; 131. Second through-hole; 20. Optical receiving assembly; 21. Optical receiver; 22. Receiving plate; 221. Third plate surface; 222. Fourth plate surface; 23. Receiving shield; 231. First through-hole; 232. First sub-shielding cover; 233. Second sub-shielding cover; 24. Shielding ring; 25. Filter; 261. First stray light channel; 262. Second stray light channel; 30. Optical scanning assembly; 31. First optical scanning element; 311. Galvanometer; 3111, First reflective surface; 32, Second optical scanning element; 321, Rotating mirror; 3211, Second reflective surface; 40, First optical path conversion assembly; 41, First reflective element; 411, One of the first emitting mirrors; 412, Another first reflective element; 50, Second optical path conversion assembly; 51, Second reflective element; 511, One of the second reflective elements; 512, Another second reflective element; 60, Optical collimation assembly; 61, Fast-axis collimating mirror; 62, Slow-axis collimating mirror; 70, Isolator; 71, Emitting light channel; 711, First light inlet; 712, First light outlet; 713, First sub-channel 714. Third sub-channel; 72. Echo light channel; 721. Second light inlet; 722. Second light outlet; 723. Second sub-channel; 724. Fourth sub-channel; 73. Enclosure; 731. Second receiving cavity; 732. First plate; 7321. First surface; 7322. First sub-surface; 7323. Second sub-surface; 7324. Clearance zone; 733. Second plate; 734. Third plate; 735. Fourth plate; 74. Partition; 75. First cover plate; 76. Second cover plate; 80. Housing; 81. First receiving cavity; 82. First plate; 821. Inner plate surface; 8211. 8212, Second Region; 8213, Third Region; 8214, Fourth Region; 83, Box Body; 84, Cover Body; 85, Baffle; 91, Main Board; 911, Fifth Panel; 912, Sixth Panel; 92, Electronic Control Board; 93, Interface Board; 941, First Heat Conductor; 942, Second Heat Conductor; 9421, First Sub-Heat Conductor; 9422, Second Sub-Heat Conductor; 9423, Third Sub-Heat Conductor; 943, Light Blocking Plate; 944, Light-Absorbing Fin; 9441, Light-Absorbing Cylinder; 9442, Carrier Plate; m, First Straight Direction; n, Second Straight Direction; p, First Rotating Shaft; q, Second Rotating Shaft. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0028] In the following description, when referring to the accompanying drawings, the same numbers in different drawings denote the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0029] Please see Figure 1 This application provides an optomechanical system 1. The optomechanical system 1 can be a lidar system, etc., and can be used for navigation and obstacle avoidance in products such as automobiles, robots, logistics vehicles, and inspection vehicles, realizing functions such as obstacle recognition, distance measurement, speed measurement, and autonomous driving. This application does not limit this specific application.

[0030] Specifically, the optomechanical system 1 includes a light emitting component 10 and a light receiving component 20. The light emitting component 10 is used to emit a emitted light signal to the target object, and the light receiving component 20 is used to receive the echo light signal reflected by the target object. By comparing the echo light signal with the emitted light signal and performing appropriate processing, information such as the distance to the target object can be obtained.

[0031] In this embodiment, the optomechanical system 1 further includes an optical scanning component 30. The optical scanning component 30 can be used to transmit the emitted light signal from the light emitting component 10 to multiple directions. The optical scanning component 30 can also be used to transmit the echo light signals from multiple directions to the light receiving component 20, thereby increasing the detection field of view of the optomechanical system 1 and realizing distance detection between target objects in different directions and the optomechanical system 1. Specifically, the optical scanning component 30 may include a first optical scanning element 31 and a second optical scanning element 32. The first optical scanning element 31 and the second optical scanning element 32 are used in conjunction to realize the emission of the emitted light signal to multiple directions and / or the reception of echo light signals from multiple directions.

[0032] Optionally, the emitted optical signal is transmitted sequentially through the first optical scanning element 31 and the second optical scanning element 32 before being emitted to the target object along the first straight line direction m. The second optical scanning element 32 is located between the first optical scanning element 31 and the optical emitting component 10. Since the emitted optical signal is emitted through the second optical scanning element 32, and the second optical scanning element 32 is located between the first optical scanning element 31 and the optical emitting component 10, the emission position of the emitted optical signal can be approximately located in the middle of the optomechanical system 1, which is beneficial for achieving the calibration of the optomechanical system 1 and the symmetry of the near-field point cloud.

[0033] In this configuration, along the first straight line direction m, the second optical scanning element 32 is located between the first optical scanning element 31 and the optical emitting component 10. This extends the transmission path of the emitted light signal from the optical emitting component 10 to the first optical scanning element 31, which helps to reduce the divergence angle and improve the ranging capability of the optomechanical system 1. Specifically, the optomechanical system 1 satisfies the following condition (Equation 1): Where SNR is the signal-to-noise ratio of the echo optical signal, P t For total output power, A rec Receiving section, A FOV As for the receiving field of view, it can be seen from the above conditional equation 1 that the receiving field of view angle A is... FOV The size of the field of view A determines the amount of noise in the echo signal. FOV The larger the field of view A, the greater the noise received; therefore, it is necessary to reduce the receiving field of view A. FOV The receiving field of view A FOV The size of the light receiver 21 in the light receiving assembly 20 and the focal length of the receiving lens are related; for example, if the divergence angle δθ is 0.2°*0.2°, the size of the light receiver 21 or the focal length of the receiving lens can be customized so that the receiving field of view A FOV Slightly greater than 0.2°*0.2° to ensure that all echo light signals can be received by the optical receiver 21, avoiding signal loss; combined with the following conditional equation 2 of the optomechanical system 1: δθ=L / f, where δθ is the divergence angle of the emitted light signal, L is the emitting area of ​​the optical emitting component 10, and f is the focal length of the emitting lens in the optical emitting component 10, it can be seen from the above conditional equation 2 that the telephoto system can reduce the divergence angle δθ, and after the divergence angle δθ is reduced, the receiving field of view A can be increased. FOV By making it very small, noise is reduced, thereby improving the detection capability of the optomechanical system 1. In addition, extending the transmission path of the emitted optical signal can also reduce crosstalk between channels.

[0034] It should be noted that, along the first straight line direction m, the second optical scanning element 32 is located between the first optical scanning element 31 and the optical emitting component 10. The emitted optical signal emitted by the optical emitting component 10 passes through the first optical scanning element 31 and the second optical scanning element 32 in sequence. Therefore, the emitted optical signal emitted by the optical emitting component 10 may be blocked by the second optical scanning element 32 in the process of reaching the first optical scanning element 31. In this regard, the optomechanical system 1 of this application embodiment may also include a first optical path conversion component 40. Along the transmission path of the emitted optical signal, the first optical path conversion component 40 is disposed between the optical emitting component 10 and the first optical scanning element 31. The arrangement of the first optical path conversion component 40 changes the transmission path of the emitted optical signal from the optical emitting component 10 from sequentially passing through the first optical scanning element 31 and the second optical scanning element 32 to sequentially passing through the first optical path conversion component 40, the first optical scanning element 31 and the second optical scanning element 32. This ensures that the emitted optical signal is not obstructed by the second optical scanning element 32 during the process from the optical emitting component 10 to the first optical path conversion component 40 and from the first optical path conversion component 40 to the first optical scanning element 31, thus ensuring the normal transmission of the emitted optical signal.

[0035] Optionally, the first optical path conversion component 40 includes at least one first reflective element 41, and the transmission path of the emitted optical signal can be deflected by the reflective surface of the first reflective element 41 to ensure that the emitted optical signal can be smoothly transmitted to the first optical scanning element 31.

[0036] It should be noted that the above-described "along the first straight line direction m, the second optical scanning element 32 is located between the first optical scanning element 31 and the optical emitting component 10" can mean that the second optical scanning element 32, the first optical scanning element 31 and the optical emitting component 10 are all approximately on the same straight line and the second optical scanning element 32 is located between the first optical scanning element 31 and the optical emitting component 10. Alternatively, it can mean that the projection of the second optical scanning element 32, the first optical scanning element 31 and the optical emitting component 10 on the same straight line satisfies that the second optical scanning element 32 is located between the first optical scanning element 31 and the optical emitting component 10, so as to reduce the assembly accuracy requirements of the second optical scanning element 32, the first optical scanning element 31 and the optical emitting component 10 and reduce the assembly difficulty.

[0037] Optionally, along the second straight direction n, the light emitting component 10 can be located on the side of the second light scanning element 32 facing away from the target object, as shown in the reference. Figure 1 The light emitting component 10 can also be located on the side of the second light scanning element 32 closer to the target object, as shown in the reference. Figure 2 The second straight line direction n intersects the first straight line direction m. (Combined) Figure 1When the light emitting component 10 is located on the side of the second light scanning element 32 away from the target object along the second straight line direction n, optionally, one of the first reflective elements 41 of the first optical path conversion component 40 can be distributed along the second straight line direction n with the first light scanning element 31 and located on the side of the first light scanning element 31 away from the target object. In this embodiment, the first reflective element 411 is designated as 411 to facilitate differentiation from the designations 41 of other first reflective elements 41 when the first optical path conversion component 40 includes multiple first reflective elements 41. It should be noted that, at this time, the first optical path conversion component 40 may also include only one first reflective element 41.

[0038] Combination Figure 2 When the light emitting component 10 is located on the side of the second light scanning element 32 close to the target object along the second straight direction n, optionally, of all the first reflective elements 41, one first reflective element 411 can be distributed along the second straight direction n with the first light scanning element 31 and located on the side of the first light scanning element 31 away from the target object, and another first reflective element 412 can be distributed along the second straight direction n with the second light scanning element 32 and located on the side of the second light scanning element 32 away from the target object. Along the transmission path of the emitted light signal, another first reflective element 412 is located between the light emitting component 10 and one of the first reflective elements 411. In this embodiment, one of the first reflective elements 411 is labeled as 411, and another of the first reflective elements 412 is labeled as 412 for distinction.

[0039] It should be noted that the reflective element 41 can also be replaced by a refractive element, etc. The specific structural design of the first optical path conversion component 40 is not limited in the embodiments of this application.

[0040] Optionally, the echo light signal is transmitted sequentially through the second optical scanning element 32 and the first optical scanning element 31 before reaching the optical receiving component 20. Along the first straight line direction m, the second optical scanning element 32 is located between the first optical scanning element 31 and the optical receiving component 20. The echo light signal enters the optomechanical system 1 via the second optical scanning element 32. Since the second optical scanning element 32 is located between the first optical scanning element 31 and the optical receiving component 20, the entry position of the echo light signal can be approximately located in the middle of the optomechanical system 1, which is beneficial for achieving the calibration of the optomechanical system 1 and the symmetry of the near-field point cloud.

[0041] In this system, the second optical scanning element 32 is located between the first optical scanning element 31 and the optical receiving component 20 along the first straight line direction m. This extends the transmission path of the echo light signal from the first optical scanning element 31 to the optical receiving component 20, which helps reduce the noise received by the optical receiver 21 and improves the ranging capability of the optomechanical system 1. Specifically, due to manufacturing tolerances or cost considerations, the photosensitive surface of the optical receiver 21 is generally around 0.5mm. For systems with a small divergence angle, a short focal length design results in a large redundancy in the receiving field of view corresponding to the 0.5mm photosensitive surface, leading to increased noise. However, the focal length of the optomechanical system 1 of this application can be above 50mm to reduce the receiving field of view. The arrangement of the second optical path conversion component 50 and / or the first optical path conversion component 40 also improves the overall space utilization and makes the structure more compact.

[0042] When applied to autonomous driving, the optomechanical system 1 of this application can achieve a detection capability of 250m@10% and a resolution of less than 0.1°, meeting the requirements for high-precision imaging.

[0043] It should be noted that, along the first straight line direction m, the second optical scanning element 32 is located between the first optical scanning element 31 and the optical receiving component 20. The echo light signal passes through the second optical scanning element 32 and the first optical scanning element 31 in sequence before reaching the optical receiving component 20. Therefore, the echo light signal may be obstructed by the second optical scanning element 32 during its journey from the first optical scanning element 31 to the optical receiving component 20. In this regard, the optomechanical system 1 of this application embodiment may also include a second optical path conversion component 50, which is located between the optical receiving component 20 and the first optical scanning element 31 along the transmission path of the echo light signal. The second optical path conversion component 50 is configured such that the transmission path of the echo optical signal is changed from passing through the first optical scanning element 31 to reaching the optical receiving component 20, to passing through the first optical scanning element 31 and the second optical path conversion component 50 to reach the optical receiving component 20. This ensures that the echo optical signal is not obstructed by the second optical scanning element 32 during the process from the first optical scanning element 31 to the second optical path conversion component 50 and from the second optical path conversion component 50 to the optical receiving component 20, thus ensuring the normal transmission of the echo optical signal.

[0044] Optionally, the second optical path conversion component 50 includes at least one second reflective element 51, and the transmission path of the echo optical signal can be deflected by the reflective surface of the second reflective element 51 to ensure that the echo optical signal can be smoothly transmitted to the optical receiving component 20.

[0045] It should be noted that the above-described "along the first straight line direction m, the second optical scanning element 32 is located between the first optical scanning element 31 and the optical receiving component 20" can mean that the second optical scanning element 32, the first optical scanning element 31, and the optical receiving component 20 are all approximately on the same straight line and the second optical scanning element 32 is located between the first optical scanning element 31 and the optical receiving component 20. Alternatively, it can mean that the projection of the second optical scanning element 32, the first optical scanning element 31, and the optical receiving component 20 on the same straight line satisfies the condition that the second optical scanning element 32 is located between the first optical scanning element 31 and the optical receiving component 20, so as to reduce the assembly accuracy requirements of the second optical scanning element 32, the first optical scanning element 31, and the optical receiving component 20 and reduce the assembly difficulty.

[0046] Optionally, along the second straight direction n, the light receiving component 20 can be located on the side of the second light scanning element 32 closer to the target object, as shown in the reference. Figure 1 and Figure 2 The light receiving component 20 can also be located on the side of the second light scanning element 32 away from the target object, as shown in the reference. Figure 3 and Figure 4 Combining Figure 1 and Figure 2 When the light receiving component 20 is located on the side of the second light scanning element 32 close to the target object along the second straight direction n, optionally, among all the second reflective elements 51 included in the second optical path conversion component 50, one second reflective element 511 can be distributed along the second straight direction n with the first light scanning element 31 and located on the side of the first light scanning element 31 away from the target object, and another second reflective element 512 can be distributed along the second straight direction n with the second light scanning element 32 and located on the side of the second light scanning element 32 away from the target object. Along the transmission path of the echo light signal, another second reflective element 512 is located between one of the second reflective elements 511 and the light receiving component 20. In the embodiments of this application, one of the second reflective elements 511 is labeled as 511, and another second reflective element 512 is labeled as 512 for distinction.

[0047] Combination Figure 3 and Figure 4When the light receiving component 20 is located on the side of the second light scanning element 32 away from the target object along the second straight direction n, optionally, one of the second reflective elements 51 can be distributed along the second straight direction n with the first light scanning element 31 and located on the side of the first light scanning element 31 away from the target object. In this embodiment, the designation of one of the second reflective elements 511 is 511, which facilitates differentiation from the designations 51 of other second reflective elements 51 when the second optical path conversion component 50 includes multiple second reflective elements 51. It should be noted that, at this time, the second optical path conversion component 50 may also include only one second reflective element 51.

[0048] Optionally, along the second straight direction n, when one of the second reflective elements 511 is located between one of the first reflective elements 411 and the first optical scanning element 31, in order to prevent one of the second reflective elements 511 from blocking the emitted light signal from reaching the first optical scanning element 31, one of the second reflective elements 511 may be provided with a second light-transmitting hole (not shown in the figure), so that the emitted light signal can pass through the second light-transmitting hole to reach the first optical scanning element 31.

[0049] Optionally, please refer to Figure 5 Along the second straight direction n, when one of the first reflective elements 411 is located between one of the second reflective elements 511 and the first optical scanning element 31, in order to prevent one of the first reflective elements 411 from blocking the echo light signal from the first optical scanning element 31 to one of the second reflective elements 511, one of the first reflective elements 411 may be provided with a first light-transmitting hole (not shown in the figure), so that the echo light signal can pass through the first light-transmitting hole and reach one of the second reflective elements 511.

[0050] It should be noted that, in one exemplary embodiment, along the first straight line direction m, the second optical scanning element 32 can be located both between the first optical scanning element 31 and the light emitting component 10, and simultaneously, along the first straight line direction m, the second optical scanning element 32 can also be located between the first optical scanning element 31 and the light receiving component 20. In another exemplary embodiment, please refer to... Figure 6In one exemplary embodiment, the second optical scanning element 32 can be located between the first optical scanning element 31 and the optical emitting component 10 along the first straight line direction m. Simultaneously, the second optical scanning element 32 is also located between the optical emitting component 10 and the optical receiving component 20 along the first straight line direction m. Furthermore, when the second optical scanning element 32 is located between the optical emitting component 10 and the optical receiving component 20 along the first straight line direction m, the distance between the optical emitting component 10 and the optical receiving component 20 can be sufficiently large, facilitating heat dissipation.

[0051] It should be noted that those skilled in the art should know that the positions of the light emitting component 10 and the light receiving component 20 in all the figures of the embodiments of this application can be interchanged.

[0052] Both the first optical scanning element 31 and the second optical scanning element 32 can be of a reflective structure; for example, the first optical scanning element 31 can be a galvanometer or a rotating mirror, and the second optical scanning element 32 can be a galvanometer or a rotating mirror. Please refer again to the embodiments in this application. Figure 5 The first optical scanning element 31 includes a galvanometer 311, and the second optical scanning element 32 includes a rotating mirror 321. Specifically, the galvanometer 311 has a first reflective surface 3111 for transmitting emitted optical signals and / or echo optical signals. The galvanometer 311 is rotatable about a first rotation axis p, and the first reflective surface 3111 faces the second optical scanning element 32. The rotating mirror 321 has a plurality of second reflective surfaces 3211 for transmitting emitted optical signals and / or echo optical signals. The rotating mirror 321 is rotatable about a second rotation axis q, and the plurality of second reflective surfaces 3211 surround the periphery of the second rotation axis q, such that when the rotating mirror 321 rotates about the second rotation axis q, at least one second reflective surface 3211 faces the first reflective surface 3111 of the first optical scanning element 31.

[0053] The reflective surface (e.g., the first reflective surface 3111 and the second reflective surface 3211) can reflect the optical signal (e.g., the emitted optical signal and the echo optical signal), change the transmission direction of the optical signal, and enable the optical signal to be transmitted smoothly backward.

[0054] Optionally, the first rotation axis p can be perpendicular to the second rotation axis q. The rotation of the galvanometer 311 around the first rotation axis p allows for adjustment of the field of view in one direction, while the rotation of the rotating mirror 321 around the second rotation axis q allows for adjustment of the field of view in another direction. When the first rotation axis p and the second rotation axis q are perpendicular, the two field of view adjustment directions are perpendicular. For example, the rotation of the galvanometer 311 around the first rotation axis p can adjust the longitudinal field of view, and the rotation of the rotating mirror 321 around the second rotation axis q can adjust the lateral field of view. In this embodiment, the rotating mirror 321 can achieve a 120° lateral field of view scan, and the galvanometer 311 can achieve a 25° longitudinal field of view scan, thus completing a 120°*25° scan of the entire field of view space.

[0055] Optionally, please refer to Figure 7 The optomechanical system 1 also includes an optical collimation component 60, which is located between the optical emitting component 10 and the first optical scanning element 31 along the transmission path of the emitted optical signal. The optical collimation component 60 allows the emitted optical signal from the optomechanical system 1 to maintain a high power density when illuminating a distant target object. Optionally, the optical collimation component 60 includes a fast-axis collimating lens 61 and a slow-axis collimating lens 62. The fast-axis collimating lens 61 is located between a first reflecting element 41 and the optical emitting component 10, and the slow-axis collimating lens 62 is located between the first reflecting element 41 and the first optical scanning element 31. The fast-axis collimating lens 61 and the slow-axis collimating lens 62 can collimate the fast and slow axes, enhancing the collimation effect and increasing the output brightness of the emitted optical signal.

[0056] Optionally, the optomechanical system 1 further includes an isolator 70, which forms an emission optical channel 71 and an echo optical channel 72. The emission optical channel 71 is used to transmit the emitted optical signal, reducing or even avoiding interference from stray light on the emitted optical signal; the echo optical channel 72 is used to transmit the echo optical signal, reducing or even avoiding interference from stray light on the echo optical signal.

[0057] Specifically, the light transmission channel 71 has a first light inlet 711 and a first light outlet 712. The light emitting component 10 is configured corresponding to the first light inlet 711, and the first light scanning element 31 is configured corresponding to the first light outlet 712, so that the emitted light signal emitted by the light emitting component 10 can enter the light transmission channel 71 in a timely manner, and reach the first light scanning element 31 after being transmitted in the light transmission channel 71, thereby reducing or even avoiding interference from stray light.

[0058] The echo optical channel 72 has a second light inlet 721 and a second light outlet 722. The first optical scanning element 31 is also configured corresponding to the second light inlet 721, and the optical receiving component 20 is configured corresponding to the second light outlet 722, so that the echo optical signal transmitted by the first optical scanning element 31 can enter the echo optical channel 72 in a timely manner, and reach the optical receiving component 20 after being transmitted in the echo optical channel 72, thereby reducing or even avoiding interference from stray light.

[0059] Optionally, please refer to Figure 8 and Figure 9 Both the light emitting component 10 and the light receiving component 20 can be connected and fixed to the isolator 70.

[0060] Optionally, the optomechanical system 1 also includes a housing 80, which has a first receiving cavity 81. The isolator 70, the light emitting component 10, the light receiving component 20, and the light scanning component 30 can all be disposed in the first receiving cavity 81 of the housing 80.

[0061] Optionally, the isolator 70 includes a surrounding plate 73 and a partition 74. The surrounding plate 73 is located within the first receiving cavity 81 and forms a second receiving cavity 731, a first light inlet 711, a first light outlet 712, a second light inlet 721, and a second light outlet 722 communicating with the second receiving cavity 731. The partition 74 is located within the second receiving cavity 731 and divides the second receiving cavity 731 into a transmit light channel 71 and an echo light channel 72. At least a portion of the transmit light channel 71 and at least a portion of the echo light channel 72 are separated by the partition 74, thereby improving the independence of the transmit light channel 71 and the echo light channel 72 and reducing crosstalk between the transmitted and received light signals.

[0062] It should be noted that the transmitting light channel 71 can be partially separated from the echo light channel 72 by a partition 74, and the transmitting light channel 71 as a whole can also be separated from the echo light channel 72 as a whole by a partition 74. This application embodiment does not limit this, and can be flexibly adjusted according to specific needs.

[0063] Specifically, when the portion of the transmit optical channel 71 is separated from the portion of the echo optical channel 72, optionally, one end of the partition 74 can be connected to the portion of the enclosure 73 located between the first light inlet 711 and the second light outlet 722, and the other end can be located within the second receiving cavity 731 and spaced apart from the enclosure 73. This allows the first sub-channel 713 in the transmit optical channel 71 near the light emitting component 10 and the second sub-channel 723 in the echo optical channel 72 near the light receiving component 20 to be separated by the partition 74, thus preventing interference from the transmit optical signal emitted by the light emitting component 10 to the echo optical signal received at the light receiving component 20. Meanwhile, the third sub-channel 714 in the transmit optical channel 71 away from the light emitting component 10 is connected to the fourth sub-channel 724 in the echo optical channel 72 away from the light receiving component 20. In this configuration, the first light outlet 712 and the second light inlet 721 can be connected.

[0064] Specifically, when the entire emission light channel 71 is separated from the entire echo light channel 72, optionally, one end of the partition 74 can be connected to the portion of the enclosure 73 located between the second light inlet 721 and the first light outlet 712, and the other end can be connected to the portion of the enclosure 73 located between the first light outlet 712 and the second light inlet 721, so that the entire emission light channel 71 and the entire echo light channel 72 are separated by the partition 74.

[0065] Optionally, the enclosure 73 may include a first plate 732, which has a first light outlet 712 and a second light inlet 721. The first plate 732 is recessed into the second receiving cavity 731 to form a clearance interval 7324. The second optical scanning element 32 is disposed in the clearance interval 7324, making the structure of the optomechanical system 1 more compact and realizing the miniaturization design of the optomechanical system 1.

[0066] Optionally, the enclosure 73 further includes a second plate 733, a third plate 734, and a fourth plate 735. The second plate 733 is spaced apart from the first plate 732. The third plate 734 is connected to the first plate 732 and extends towards the second plate 733. The fourth plate 735 is connected to the second plate 733 and extends towards the first plate 732. The fourth plate 735, the first plate 732, the second plate 733, and the third plate 734 enclose a second receiving cavity 731. A first light inlet 711 is located on the second plate 733 near the third plate 734, and a second light outlet 722 is located on the first plate 732 near the third plate 734. The partition 74 is connected to the third plate 734 and is spaced apart from both the second plate 733 and the first plate 732. The enclosure 73 of this embodiment is generally formed by four plates, which has a relatively simple structure and is easy to manufacture.

[0067] It should be noted that the shapes of the first plate 732, the second plate 733, the third plate 734 and the fourth plate 735 can be arbitrary, and the embodiments of this application do not limit them.

[0068] Optionally, the light emitting component 10 is attached to and connected to the surface of the partition 74 opposite to the first plate 732 to increase the connection area between the light emitting component 10 and the isolation member 70 and improve the connection stability between the two.

[0069] Optionally, the second light inlet 721 and the first light outlet 712 are both located on the first plate 732 and are connected to each other, thereby simplifying the structural design of the isolator 70. Optionally, the first light outlet 712 can be located on the first plate 732 near the fourth plate 735. Combined with the first light inlet 711 being located on the second plate 733 near the third plate 734, the distance between the first light inlet 711 and the first light outlet 712 can be increased, extending the transmission path of the emitted optical signal and achieving a reduction in divergence angle, an improvement in ranging capability, and a reduction in optical crosstalk. Optionally, the second light inlet 721 can be located on the first plate 732 near the fourth plate 735. Combined with the second light outlet 722 being located on the first plate 732 near the third plate 734, the distance between the second light inlet 721 and the second light outlet 722 can be increased, extending the transmission path of the echo optical signal and achieving an improvement in ranging capability.

[0070] The first plate 732 has a first surface 7321 facing away from the second plate 733. The first surface 7321 includes a first sub-surface 7322 near the third plate 734 and a second sub-surface 7323 near the fourth plate 735. The second sub-surface 7323 is located between the first sub-surface 7322 and the second plate 733, such that a clearance interval 7324 for setting the second optical scanning element 32 is formed between the first sub-surface 7322 and the second sub-surface 7323. The first light outlet 712 and the second light inlet 721 are set corresponding to the second sub-surface 7323, and the second light outlet 722 is set corresponding to the first sub-surface 7322.

[0071] Optionally, please refer to Figure 10 The isolation member 70 also includes a first cover plate 75 and a second cover plate 76. The first cover plate 75 and the second cover plate 76 are located on opposite sides of the surrounding plate 73 and connected to the surrounding plate 73 to form a second receiving cavity 731 together with the surrounding plate 73. This improves the light-shielding performance of the second receiving cavity 731 and reduces the interference of stray light on the emitted light signal and the echo light signal. Optionally, the connection method between the first cover plate 75, the second cover plate 76 and the surrounding plate 73 can be arbitrary, such as a snap-fit ​​connection, adhesive bonding, etc. This application embodiment does not limit this. Optionally, in this application embodiment, the first cover plate 75 and the surrounding plate 73 can be directly formed as an integral structure, and the second cover plate 76 and the surrounding plate 73 can be snap-fit ​​connected through a slot, insert, or other structure.

[0072] Optionally, please refer to Figure 11 The optical-mechanical system 1 also includes a motherboard 91, which can be disposed in the first receiving cavity 81 of the housing 80. The motherboard 91 is electrically connected to the light emitting component 10 and is used to control the light emitting component 10 to emit light signals to the target object. The motherboard 91 is also electrically connected to the light receiving component 20 and is used to control the light receiving component 20 to receive the echo light signals reflected by the target object.

[0073] Optionally, the optomechanical system 1 further includes an electrical control board 92. The electrical control board 92 can be disposed within the first receiving cavity 81 of the housing 80. The electrical control board 92 is separately disposed from the main board 91 but electrically connected to the main board 91. The electrical control board 92 is also electrically connected to the first optical scanning element 31 for controlling the movement of the first optical scanning element 31. The electrical control board 92 is also electrically connected to the second optical scanning element 32 for controlling the movement of the second optical scanning element 32. For example, when the first optical scanning element 31 includes a galvanometer 311, the electrical control board 92 can be electrically connected to the galvanometer 311 and used to control the galvanometer 311 to rotate around a first rotating axis p. When the second optical scanning element 32 includes a rotating mirror 321, the electrical control board 92 is electrically connected to the rotating mirror 321 and used to control the rotating mirror 321 to rotate around a second rotating axis q.

[0074] In this embodiment, the electronic control board 92 and the motherboard 91 are set separately. Compared with the integrated setting, the heat dissipation performance of the optical engine system 1 can be improved. Moreover, when the product needs to be upgraded or the customer's needs are inconsistent, only the electronic control board 92 needs to be disassembled and replaced, which can reduce the replacement cost and improve the replacement efficiency.

[0075] Optionally, the control board 92 and the main board 91 can be respectively located on opposite sides of the optical scanning assembly 30 to increase the distance between the control board 92 and the main board 91 and improve the heat dissipation performance of the optical-mechanical system 1. Optionally, the control board 92 can be set corresponding to the first optical scanning element 31.

[0076] Optionally, the housing 80 may include a box body 83 and a cover 84 connected to the box body 83. The box body 83 and the cover 84 together define a first receiving cavity 81. The electronic control board 92 may be disposed near the cover 84, and the main board 91 may be disposed near the bottom of the box body 83. Furthermore, the cover 84 may be provided with a viewing window corresponding to the electronic control board 92, so that operators can observe the operation of the electronic control board 92 and detect faults in a timely manner.

[0077] Optionally, the light emitting assembly 10 includes a light emitter (not shown) and an emitting board 12. The light emitter is mounted on and electrically connected to the emitting board 12. The emitting board 12 is separate from and electrically connected to the motherboard 91. Optionally, the light receiving assembly 20 includes a light receiver 21 and a receiving board 22. The light receiver 21 is mounted on and electrically connected to the receiving board 22. The receiving board 22 is separate from and electrically connected to the motherboard 91. Separating the emitting board 12, the receiving board 22, and the motherboard 91 can further improve the heat dissipation performance of the optomechanical system 1 and facilitate the replacement of the emitting board 12 and the receiving board 22.

[0078] Optionally, the optomechanical system 1 also includes an interface board 93, which is separate from and electrically connected to the motherboard 91. The interface board 93 provides power signals to at least one of the optical emitting component 10, the optical receiving component 20, the first optical scanning element 31, and the second optical scanning element 32. Since users' interface requirements may vary, separating the interface board 93 from the motherboard 91 facilitates the replacement or maintenance of the interface board 93 and further improves the heat dissipation performance of the optomechanical system 1.

[0079] Preferably, the motherboard 91, the electronic control board 92, the transmitter board 12, the receiver board 22, and the interface board 93 are all set separately from each other, so that when the product needs to be upgraded or the user needs are inconsistent, only some of the circuit boards need to be updated and redesigned, saving costs and time, and the heat dissipation effect is better.

[0080] Optionally, the transmitter 12 includes a substrate and a conductive layer disposed on the substrate. The substrate can be a plate with good heat dissipation performance, for example, a ceramic plate.

[0081] Optionally, a first heat-conducting element 941 is disposed between the emitting plate 12 and the housing 80. Further optionally, the emitting plate 12 has a first plate surface 121 and a second plate surface 122 opposite to the first plate surface 121. A light emitter is mounted on the first plate surface 121, and the first heat-conducting element 941 is disposed between the second plate surface 122 and the insulating member 70, so that the heat generated by the emitting plate 12 can be transferred to the insulating member 70 through the first heat-conducting element 941, and then transferred from the insulating member 70 to the housing 80, and then dissipated outwards. The first heat-conducting element 941 may include a graphene layer and a thermally conductive gel layer.

[0082] Optionally, please refer to Figure 11 and Figure 12A second heat-conducting element 942 is provided between the receiving plate 22 and the housing 80. Optionally, the optical receiving assembly 20 further includes a receiving shield 23 covering the optical receiver 21 and the receiving plate 22. The receiving shield 23 has a first through hole 231 corresponding to the optical receiver 21. The receiving plate 22 has a third plate surface 221 and a fourth plate surface 222 opposite to the third plate surface 221. The optical receiver 21 is mounted on the third plate surface 221. A first sub-heat-conducting element 9421 is provided between the third plate surface 221 and the receiving shield 23. A second sub-heat-conducting element 9422 is provided between the fourth plate surface 222 and the receiving shield 23. A third sub-heat-conducting element 9423 is provided between the receiving shield 23 and the isolation member 70. The second heat-conducting element 942 includes the first sub-heat-conducting element 9421, the second sub-heat-conducting element 9422 and the third sub-heat-conducting element 9423, so that the heat generated by the receiving plate 22 can be transferred to the isolation member 70 through the second heat-conducting element 942, and then transferred to the housing 80 by the isolation member 70, and then dissipated outward. The first sub-thermal conductive element 9421 and the second sub-thermal conductive element 9422 may each include a thermally conductive gel layer, and the third sub-thermal conductive element 9423 includes a graphene layer and a thermally conductive gel layer.

[0083] Optionally, the receiving shield 23 may include a first sub-shield 232 located on the side of the third plate 221 and a second sub-shield 233 located on the side of the fourth plate 222, and both the first sub-shield 232 and the second sub-shield 233 are connected to the receiving plate 22.

[0084] Optionally, a third heat-conducting element (not shown in the figure) is provided between the main board 91 and the housing 80, so that the heat generated by the main board 91 can be directly dissipated to the outside of the housing 80 through the third heat-conducting element. Optionally, a fourth heat-conducting element (not shown in the figure) is provided between the electronic control board 92 and the housing 80, so that the heat generated by the electronic control board 92 can be directly dissipated to the outside of the housing 80 through the fourth heat-conducting element. Optionally, a fifth heat-conducting element (not shown in the figure) is provided between the interface board 93 and the housing 80, so that the heat generated by the interface board 93 can be directly dissipated to the outside of the housing 80 through the fifth heat-conducting element. Optionally, a sixth heat-conducting element (not shown in the figure) is provided between the isolator 70 and the housing 80, so that the heat generated by the transmitter board 12 and the heat generated by the receiver board 22 can both be dissipated to the outside of the housing 80 through the sixth heat-conducting element on the isolator 70.

[0085] Optionally, the third, fourth, fifth, and sixth thermal conductive elements all include a thermally conductive gel layer.

[0086] Optionally, please refer to [the relevant document / reference]. Figure 11The housing 80 includes a first plate 82, which has an inner plate surface 821 forming a first receiving cavity 81. The inner plate surface 821 includes a first region 8211, and a main board 91 is disposed corresponding to the first region 8211. An isolator 70 is located inside the first receiving cavity 81 and is disposed on the side of the main board 91 opposite to the inner plate surface 821. The isolator 70 covers at least a portion of the main board 91. Both the isolator 70 and the first plate 82 are made of metal. By designing both the isolator 70 and the first plate 82 to be made of metal, an electromagnetic shielding structure for the main board 91 can be formed. This shields the main board 91 from the electromagnetic radiation outside the isolator 70 and the first plate 82, and also prevents interference generated by the main board 91 during operation from propagating outside the isolator 70 and the first plate 82. Compared to related technologies where the entire housing 80 is made of metal to form the electromagnetic shielding structure of the whole device, this avoids electromagnetic interference between the internal components such as the light emitting component 10 and the light receiving component 20 inside the housing 80 and the main board 91.

[0087] It should be noted that, apart from the first plate 82 being made of metal, the entire housing 80 can also be made of metal to ensure the electromagnetic shielding performance of the whole machine.

[0088] Optionally, the first cover plate 75 is disposed between the second cover plate 76 and the first plate 82. The aforementioned "isolation member 70 is a metal part" can mean that only the first cover plate 75 is a metal part, or that the entire isolation member 70 is a metal part. When only the first cover plate 75 is a metal part, the isolation member 70 can be formed by combining metal parts and non-metal parts to reduce the overall weight of the isolation member 70 and reduce manufacturing costs; for example, the isolation member 70 can be formed by a two-color injection molding process of metal parts and non-metal parts, or by mechanical assembly of metal parts and non-metal parts, etc.

[0089] Optionally, the motherboard 91 includes a fifth board surface 911 facing the first board 82 and a sixth board surface 912 opposite to the fifth board surface 911. The first board 82 can cover the entire fifth board surface 911, and the isolator 70 can cover part of the sixth board surface 912 or cover the entire sixth board surface 912. When the isolator 70 covers part of the sixth board surface 912, the isolator 70 can cover the area where the electronic components are located on the sixth board surface 912, while exposing the area where the electrical interfaces are located on the sixth board surface 912. This achieves both improved electromagnetic shielding performance at the electronic components and ensures normal electrical connection between the motherboard 91 and other components.

[0090] Optionally, the optical emitting assembly 10 further includes an emission shield 13, which covers the optical emitter and has a second through-hole 131 for the transmitted light signal to pass through. The emission shield 13 prevents crosstalk between the electromagnetic signals generated by the optical emitting assembly 10 and the electromagnetic signals generated by the motherboard 91. Similarly, when the optical receiving assembly 20 includes a receiving shield 23, the receiving shield 23 also prevents crosstalk between the electromagnetic signals generated by the optical receiving assembly 20 and the electromagnetic signals generated by the motherboard 91.

[0091] Optionally, please refer to Figure 13 The inner panel 821 also includes a second region 8212 connecting the first region 8211, with the light emitting component 10 positioned corresponding to the second region 8212; and / or, the inner panel 821 also includes a third region 8213 connecting the first region 8211, with the light receiving component 20 positioned corresponding to the third region 8213. This arrangement allows the light emitting component 10, the light receiving component 20, the main board 91, and the insulating component 70 covering the main board 91 to be distributed at different positions on the inner panel 821, making assembly more convenient and the overall layout more reasonable, thus improving the space utilization of the optical engine system 1.

[0092] Optionally, the inner panel 821 also includes a fourth region 8214 that connects to the first region 8211. The optical scanning component 30 is set in the fourth region 8214, so that the optical scanning component 30 and the isolation component 70 covering the motherboard 91 are distributed at different positions on the inner panel 821, which facilitates assembly.

[0093] Please refer to it again. Figure 8 The optomechanical system 1 also includes a light-blocking plate 943, which is located in the first receiving cavity 81 and disposed on the side of the second optical scanning element 32 near the isolator 70. One end of the light-blocking plate 943 is located between the second optical scanning element 32 and the first optical scanning element 31, and the other end extends toward the second optical scanning element 32 in a direction away from the first optical scanning element 31 and connects to the housing 80. The combination of the light-blocking plate 943 and the isolator 70 can further improve the anti-interference ability of the transmitted optical signal and / or the echo optical signal during transmission.

[0094] Optionally, the optomechanical system 1 further includes an extinction fin 944, which is located in the first receiving cavity 81 and is disposed corresponding to the first light exit port 712 and the second light entrance port 721. The extinction fin 944 can reflect stray light multiple times, reduce the intensity of stray light, and thus reduce the interference of stray light on the optical signal in the working band.

[0095] Alternatively, see [link to relevant documentation] Figure 14The extinguishing fin 944 is located on the side of the first cover plate 75 of the isolation member 70 away from the second cover plate 76 or on the side of the second cover plate 76 away from the first cover plate 75, so that the extinguishing fin 944 is not likely to enter the second light inlet 721 after multiple reflections of stray light, and is not likely to interfere with the optical signal of the working band.

[0096] Optionally, the housing 80 includes a baffle 85, and a first cover plate 75 is located between the inner plate surface 821 and the second cover plate 76. The baffle 85 is located between the light-absorbing fin 944 and the isolator 70, with one end connected to the inner plate surface 821 of the first plate 82, and the other end extending towards the second cover plate 76. The surface of the baffle 85 facing away from the inner plate surface 821 is located on the side of the light-absorbing fin 944 away from the inner plate surface 821, so as to further reduce the interference of stray light on the working band optical signal transmitted in the isolator 70. Optionally, the surface of the baffle 85 facing away from the inner plate surface 821 is located on the side of the first cover plate 75 facing away from the inner plate surface 821.

[0097] Optionally, the light-absorbing fin 944 includes a plurality of light-absorbing tubes 9441, each with a light-absorbing hole, the hole extending from the first cover plate 75 to the second cover plate 76, allowing stray light to undergo multiple reflections within the light-absorbing hole. Optionally, the plurality of light-absorbing tubes 9441 may be distributed in a roughly honeycomb pattern.

[0098] Optionally, see Figure 15 The matting fin 944 also includes a carrier plate 9442, which is attached to the inner plate surface 821 of the first plate 82 and the multiple matting cylinders 9441 are all connected to the carrier plate 9442 to facilitate the assembly of the matting fin 944 and the housing 80.

[0099] Optionally, see Figure 16 The optical receiving assembly 20 also includes a shielding ring 24 disposed around the optical receiver 21 and a filter 25 disposed on the light-incident side of the optical receiver 21. Since stray light may reach the optical receiver 21 through the assembly gaps during product assembly, the shielding ring 24 is designed to block stray light from transmitting towards the optical receiver 21 through the gaps; for example, combined with... Figure 16 The optical receiving assembly 20 also includes a filter 25 disposed on the light-incident side of the optical receiver 21. The gap between the filter 25 and the isolator 70 and the receiving shield 23 may form a first stray light channel 261, and the gap between the receiving shield 23 and the receiving plate 22 may form a second stray light channel 262. At this time, the blocking ring 24 can be disposed on the periphery of the optical receiver 21 and its two ends abut against the surface of the receiving plate 22 on which the optical receiver 21 is mounted and the surface of the filter facing the optical receiver 21, respectively, so as to block the first stray light channel 261 and the second stray light channel 262.

[0100] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, in the description of this application, unless otherwise stated, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0101] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Therefore, any equivalent variations made in accordance with the claims of this application shall still fall within the scope of this application.

Claims

1. An optomechanical system, characterized by, include: A light emitting component is used to emit light signals towards a target object; An optical receiving component is used to receive the echo light signal reflected by the target object; An optical scanning assembly includes a first optical scanning element and a second optical scanning element. The emitted optical signal is transmitted sequentially through the first optical scanning element and the second optical scanning element before being emitted to the target object. Along a first straight line direction, the second optical scanning element is located between the first optical scanning element and the optical emitting assembly. And / or, the echo optical signal is transmitted sequentially through the second optical scanning element and the first optical scanning element before reaching the optical receiving assembly. Along the first straight line direction, the second optical scanning element is located between the first optical scanning element and the optical receiving component; A first optical path conversion component is disposed between the light emitting component and the first optical scanning element along the transmission path of the emitted light signal. The first optical path conversion component includes at least one first reflective element. Among all the first reflective elements, one of the first reflective elements is distributed along a second straight line direction with the first optical scanning element and is located on the side of the first optical scanning element away from the target object. The second straight line direction intersects with the first straight line direction.

2. The optomechanical system of claim 1, wherein, The first optical scanning element includes a galvanometer, the galvanometer having a first reflective surface for transmitting the emitted optical signal and / or the echo optical signal, the galvanometer being rotatable about a first axis, and the first reflective surface facing the second optical scanning element.

3. The optomechanical system of claim 2, wherein, The second optical scanning element includes a rotating mirror having a plurality of second reflective surfaces for transmitting the emitted optical signal and / or the echo optical signal. The rotating mirror is rotatable about a second rotating axis, and the plurality of second reflective surfaces surround the periphery of the second rotating axis, such that when the rotating mirror rotates about the second rotating axis, at least one of the second reflective surfaces faces the first reflective surface of the first optical scanning element.

4. The optomechanical system according to claim 3, characterized in that, The first rotating shaft is perpendicular to the second rotating shaft.

5. The optomechanical system according to claim 1, characterized in that, The optomechanical system further includes a second optical path conversion component, which is located between the optical receiving component and the first optical scanning element along the transmission path of the echo optical signal. The second optical path conversion component includes at least one second reflective element.

6. The optomechanical system according to claim 5, characterized in that, Of all the first reflective elements, one more first reflective element is distributed along a second straight line with the second optical scanning element and is located on the side of the second optical scanning element away from the target object; the light emitting assembly is located on the side of the second optical scanning element closer to the target object, along the transmission path of the emitted light signal; and the other more first reflective element is located between the light emitting assembly and one of the first reflective elements; and / or Along the second straight line direction, one of the first reflective elements is located between one of the second reflective elements and the first optical scanning element. One of the first reflective elements is provided with a first light-transmitting hole, and the echo light signal can pass through the first light-transmitting hole to reach one of the second reflective elements.

7. The optomechanical system according to claim 5, characterized in that, Of all the second reflective elements, one of the second reflective elements is distributed along a second straight line direction with the first light scanning element and is located on the side of the first light scanning element away from the target object, and the second straight line direction intersects with the first straight line direction.

8. The optomechanical system according to claim 7, characterized in that, Of all the second reflective elements, one more second reflective element is distributed along a second straight line with the second optical scanning element and is located on the side of the second optical scanning element away from the target object. The optical receiving component is located on the side of the second optical scanning element closer to the target object. Along the transmission path of the echo light signal, the other second reflective element is located between one of the second reflective elements and the optical receiving component; and / or Along the second straight line direction, one of the second reflective elements is located between one of the first reflective elements and the first optical scanning element, and the one of the second reflective elements is provided with a second light-transmitting hole, through which the emitted light signal can pass to the first optical scanning element.

9. The optomechanical system according to claim 1, characterized in that, The optomechanical system further includes an optical collimation component, which is located between the optical emitting component and the first optical scanning element along the transmission path of the emitted optical signal; the optical collimation component includes: A fast-axis collimating lens is located between the first reflecting element and the light emitting component; A slow-axis collimating lens is located between the first reflecting element and the first optical scanning element.

10. The optomechanical system according to claim 1, characterized in that, The optomechanical system also includes: An isolator is formed with an emission light channel and an echo light channel. The emission light channel has a first light inlet and a first light outlet. The echo light channel has a second light inlet and a second light outlet. The light emitting component is configured corresponding to the first light inlet. The first light scanning element is configured corresponding to the first light outlet. The first light scanning element is also configured corresponding to the second light inlet. The light receiving component is configured corresponding to the second light outlet.

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