A temperature control method, system, storage medium and device of a semiconductor light source

Abstract

The application discloses a temperature control method, system, storage medium and equipment of a semiconductor light source, adopts a first relationship line and a second relationship line matched with current temperature data to construct a temperature control model, controls a TEC driving current through the temperature control model, thereby realizing semiconductor light source temperature control, can improve the temperature control steady state precision of the semiconductor light source under different environmental temperatures, and can improve the transient control precision and response speed of the light source temperature change caused by the change of the environmental temperature or the self heating of the semiconductor light source, that is, the inhibition ability to temperature interference is improved, compared with the prior art, and the temperature control can reach the expected effect.

Description

Technical Field

[0001] This invention relates to a method, system, storage medium, and device for temperature control of a semiconductor light source, and belongs to the field of this invention. Background Technology

[0002] Semiconductor light sources are widely used in optical sensing systems, and their stability directly affects the overall system performance. Semiconductor light sources are semiconductor devices that use PN junctions made of semiconductor materials as their working medium. PN junctions are extremely sensitive to temperature; temperature changes directly affect the stability of the threshold current and output optical power of the semiconductor light source, severely impacting its operating characteristics. Besides the heat generated by the light source itself during operation, another direct cause is changes in the external ambient temperature. Therefore, in practical engineering applications, a common method to ensure the stability of the light source temperature is to use semiconductor cooling devices (TECs) to control the temperature.

[0003] TEC (Thermal Temperature Regulator) utilizes the Peltier effect to generate heat absorption or release at corresponding contact surfaces. The Peltier heat is related to the current flowing through it and the terminal temperature, with the ratio depending on the conductor material. In practice, due to heat conduction and radiation, the temperature control process of TEC exhibits nonlinearity and a large time delay. As a temperature controller for light sources, its primary purpose is to stabilize the light source temperature at the desired set value. By changing its driving current, it can output different amounts of cooling or heating, thereby stabilizing the light source temperature.

[0004] The PID algorithm is a traditional algorithm for temperature control using TEC. This algorithm uses a linear combination of proportional (P), integral (I), and derivative (D) to obtain the control quantity from the deviation between the measured actual value and the set value, and then controls the controlled term. Its coefficients are usually obtained by the critical proportional method or empirical trial and error method and are fixed in the control algorithm. In practical applications, it has advantages such as simple structure and good stability.

[0005] Related studies have shown that changes in ambient temperature affect the operation of the TEC (Dynamic Temperature Controller), meaning that the operating characteristic parameters of the TEC will change under different ambient temperatures. Therefore, when faced with situations where the ambient temperature varies significantly, using fixed PID parameters for temperature control will result in large errors, and the temperature control effect will not meet expectations. Summary of the Invention

[0006] This invention provides a method, system, storage medium, and device for temperature control of a semiconductor light source, which solves the problems disclosed in the background art.

[0007] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0008] A method for temperature control of a semiconductor light source, comprising:

[0009] Acquire temperature data at the current control moment; the temperature data includes ambient temperature and semiconductor light source temperature;

[0010] In response to the inconsistency between the temperature data at the current control moment and the temperature data at the previous control moment, the first relationship line and the second relationship line that match the temperature data at the current control moment are obtained from the pre-constructed first relationship line group and the second relationship line group, respectively; wherein, the first relationship line is the relationship line between the TEC driving current and the ambient temperature under the condition that the semiconductor light source temperature is constant, and the second relationship line is the relationship line between the semiconductor light source temperature and the ambient temperature under the condition that the TEC driving current is constant.

[0011] Based on the first and second relationship lines that match the temperature data at the current control moment, construct the temperature control model for the current control moment;

[0012] Based on the temperature data and temperature control model at the current control moment, the TEC drive current at the current control moment is controlled, thereby controlling the semiconductor light source temperature at the current control moment.

[0013] Constructing the first and second relationship lines includes:

[0014] The TEC drive current was collected at a series of ambient temperature points when the temperature of the semiconductor light source was stabilized at a set value, and the first relationship line was constructed using the least squares method.

[0015] The temperature of a semiconductor light source under a defined TEC driving current is collected at a series of ambient temperature points, and a second relationship line is constructed using the least squares method.

[0016] The temperature control model at the current control moment is:

[0017] I0=f(T a )

[0018] ΔI=k a (T a -T0)·ρ

[0019] I = I0 + ΔI

[0020] In the formula, f is the first relational line function that matches the temperature data at the current control moment, and T a I0 is the ambient temperature at the current control moment, and I0 is the value in the first relationship line related to T. a The corresponding TEC drive current, k a ρ is the slope of the first relationship line that matches the temperature data at the current control time, ρ is the slope of the second relationship line that matches the temperature data at the current control time, ΔI is the TEC drive current correction amount, I is the TEC drive current at the current control time, and T0 is the temperature threshold.

[0021] After acquiring the temperature data at the current control moment, the method further includes the following steps:

[0022] In response to the temperature data at the current control moment being consistent with the temperature data at the previous control moment, and the semiconductor light source temperature at the current control moment not being T0, the TEC drive current at the current control moment is equal to the TEC drive current at the previous control moment plus the ΔI corresponding to the previous control moment.

[0023] A temperature control system for a semiconductor light source includes,

[0024] The acquisition module acquires the temperature data at the current control moment; the temperature data includes the ambient temperature and the semiconductor light source temperature.

[0025] The matching module, in response to the inconsistency between the temperature data at the current control moment and the temperature data at the previous control moment, obtains the first relationship line and the second relationship line that match the temperature data at the current control moment from the pre-constructed first relationship line group and the second relationship line group respectively; wherein, the first relationship line is the relationship line between the TEC driving current and the ambient temperature under the condition that the semiconductor light source temperature is constant, and the second relationship line is the relationship line between the semiconductor light source temperature and the ambient temperature under the condition that the TEC driving current is constant.

[0026] The model building module constructs a temperature control model for the current control moment based on the first and second relationship lines that match the temperature data at the current control moment.

[0027] The first drive current module controls the TEC drive current at the current control moment based on the temperature data and the temperature control model at the current control moment, thereby controlling the semiconductor light source temperature at the current control moment.

[0028] It also includes pre-built modules that construct the first and second relationship lines, including:

[0029] The TEC drive current was collected at a series of ambient temperature points when the temperature of the semiconductor light source was stabilized at a set value, and the first relationship line was constructed using the least squares method.

[0030] The temperature of a semiconductor light source under a defined TEC driving current is collected at a series of ambient temperature points, and a second relationship line is constructed using the least squares method.

[0031] In the model building module, the temperature control model at the current control moment is:

[0032] I0=f(T a )

[0033] ΔI=k a (Ta -T0)·ρ

[0034] I = I0 + ΔI

[0035] In the formula, f is the first relational line function that matches the temperature data at the current control moment, and T a I0 is the ambient temperature at the current control moment, and I0 is the value in the first relationship line related to T. a The corresponding TEC drive current, k a ρ is the slope of the first relationship line that matches the temperature data at the current control time, ρ is the slope of the second relationship line that matches the temperature data at the current control time, ΔI is the TEC drive current correction amount, I is the TEC drive current at the current control time, and T0 is the temperature threshold.

[0036] It also includes a second drive current module;

[0037] The second drive current module responds to the fact that the temperature data at the current control moment is consistent with the temperature data at the previous control moment, and the semiconductor light source temperature at the current control moment is not T0. The TEC drive current at the current control moment is equal to the TEC drive current at the previous control moment plus the ΔI corresponding to the previous control moment.

[0038] A computer-readable storage medium storing one or more programs, the one or more programs including instructions that, when executed by a computing device, cause the computing device to perform a temperature control method for a semiconductor light source.

[0039] A computing device includes one or more processors, a memory, and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the one or more processors, and the one or more programs include instructions for performing a temperature control method for a semiconductor light source.

[0040] The beneficial effects achieved by this invention are as follows: This invention constructs a temperature control model using a first and second relationship line that matches the current temperature data. By controlling the TEC drive current through the temperature control model, the temperature control of the semiconductor light source is realized. This can improve the steady-state accuracy of temperature control of the semiconductor light source under different ambient temperatures, as well as improve the transient control accuracy and response speed for temperature changes caused by changes in ambient temperature or the semiconductor light source's own heating. In other words, it improves the ability to suppress temperature interference. Compared with existing methods, it can achieve the expected temperature control effect. Attached Figure Description

[0041] Figure 1 A flowchart of a temperature control method for a semiconductor light source;

[0042] Figure 2 Block diagram of a temperature control device for a semiconductor light source

[0043] Figure 3 Fitting a line graph to the simulation results of the relationship between TEC drive current and ambient temperature;

[0044] Figure 4 Fit a line graph to the simulation results of the relationship between ambient temperature and semiconductor light source temperature;

[0045] Figure 5 A fitted line graph showing the experimental results of the relationship between TEC drive current and ambient temperature;

[0046] Figure 6 A line graph fitting was created to show the experimental results of the relationship between ambient temperature and light source temperature.

[0047] Figure 7 This is a detailed flowchart of the temperature control method. Detailed Implementation

[0048] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.

[0049] like Figure 1 As shown, a method for temperature control of a semiconductor light source includes the following steps:

[0050] Step 1: Obtain the temperature data at the current control moment; the temperature data includes the ambient temperature and the semiconductor light source temperature.

[0051] Step 2: In response to the inconsistency between the temperature data at the current control moment and the temperature data at the previous control moment, obtain the first relationship line and the second relationship line that match the temperature data at the current control moment from the pre-constructed first relationship line group and the second relationship line group respectively; wherein, the first relationship line is the relationship line between the TEC driving current and the ambient temperature under the condition that the semiconductor light source temperature is constant, and the second relationship line is the relationship line between the semiconductor light source temperature and the ambient temperature under the condition that the TEC driving current is constant.

[0052] Step 3: Construct the temperature control model for the current control moment based on the first and second relationship lines that match the temperature data at the current control moment.

[0053] Step 4: Based on the temperature data and temperature control model at the current control moment, control the TEC drive current at the current control moment, thereby controlling the semiconductor light source temperature at the current control moment.

[0054] The above method constructs a temperature control model using a first and second relationship line that matches the current temperature data. The temperature control model controls the TEC drive current, thereby achieving temperature control of the semiconductor light source. This method can improve the steady-state accuracy of temperature control of the semiconductor light source under different ambient temperatures, as well as improve the transient control accuracy and response speed for temperature changes caused by changes in ambient temperature or the semiconductor light source's own heating. In other words, it improves the ability to suppress temperature interference. Compared with existing methods, it can achieve the expected temperature control effect.

[0055] The apparatus corresponding to the implementation of the above method is as follows: Figure 2 As shown, it includes a light source module, a main control module, a TEC drive module, and an ambient temperature monitoring module.

[0056] The light source module includes a semiconductor light source, a thermoelectric cooler (TEC), a heat sink, a fan, and a temperature sensor. The semiconductor light source is powered by a digitally controlled constant current source. The temperature sensor and the semiconductor light source are placed together on the TEC for temperature control, and a high thermal conductivity material is used as a heat sink for heat transfer. The heat sink is used to dissipate heat at the other end of the TEC, and the fan is used to increase the airflow around the heat sink to accelerate heat dissipation.

[0057] The main control module includes a data acquisition unit for real-time acquisition of ambient temperature and semiconductor light source temperature. The temperature control calculation unit implements the above method to output the TEC drive current. The signal output unit converts the output of the temperature control calculation unit into a control signal to control the TEC drive module. Optionally, the signal output unit can use PWM wave output, adjusting the PWM wave duty cycle to output the result information.

[0058] The TEC driver module includes an adjustable constant current source, used to receive control signals from the main control module and output corresponding drive current to the thermoelectric cooler (TEC). Since the TEC is a high-power device, the TEC driver module requires a large output current and output power. This example outputs a PWM wave, so the corresponding drive current can be output based on its duty cycle.

[0059] The ambient temperature monitoring module includes an ambient temperature sensor, which is connected to the main control module and is used to acquire and transmit ambient temperature data to the main control module in real time.

[0060] Before implementing the above method, it is necessary to simulate and design experiments for the semiconductor light source in advance, and set a series of ambient temperature points for temperature cycling tests. Different test conditions should be set and corresponding simulation and experimental data should be collected. Based on these data, relationship lines should be fitted, as follows:

[0061] Using finite element simulation software, a semiconductor light source including a heat sink, a thermoelectric cooler (TEC), and a heat collector is constructed based on actual conditions. The ambient temperature parameters are simulated and set. The temperature of the light source is obtained by using the software's built-in temperature probe as a temperature sensor. The airflow parameters are set to simulate the function of a fan.

[0062] By continuously adjusting the TEC drive current and performing simulations, the TEC drive current corresponding to the stable semiconductor light source temperature at the set temperature value is obtained. After obtaining the TEC drive current at a series of ambient temperatures that stabilize the light source temperature at the set temperature value, these data are fitted using the least squares method to construct a relationship line between the TEC drive current and the ambient temperature under the condition of stable light source temperature. That is, the TEC drive current at a series of ambient temperature points that stabilize the semiconductor light source temperature at the set value is collected, and the first relationship line is constructed using the least squares method. The TEC drive current corresponding to different ambient temperatures in this relationship line is called the reference current value I0 at that ambient temperature, and the slope of the corresponding relationship line is called the adjustment coefficient k at that ambient temperature. a This coefficient reflects the ability of the TEC drive current to adjust to changes in ambient temperature. An example simulation result is shown below. Figure 3 As shown.

[0063] By stabilizing the TEC drive current and performing simulations, a series of light source temperatures at ambient temperatures were obtained. These temperatures showed an approximately linear relationship. Therefore, these data were fitted with a straight line to construct a relationship line between the semiconductor light source temperature and ambient temperature under stable TEC drive current conditions. Specifically, the semiconductor light source temperature under a fixed TEC drive current was collected at a series of ambient temperature points, and a second relationship line was constructed using the least squares method. The slope of this second relationship line is called the correction coefficient ρ, which reflects the direct impact of ambient temperature changes on the semiconductor light source temperature. An example simulation result is shown below. Figure 4 As shown.

[0064] The above simulation can obtain the first and second relationship line groups. By collecting the temperature data at the current control moment, namely the ambient temperature and semiconductor light source temperature at the current control moment, the temperature data at the current control moment is inconsistent with the temperature data at the previous control moment. The matching first and second relationship lines can be obtained from the relationship line groups. Based on the two relationship lines, the temperature control model at the current control moment can be constructed.

[0065] Since there is always a certain quantitative gap between simulation calculations and actual work, experiments can be designed in actual environments based on the simulation model to obtain a more accurate light source control model. At the same time, qualitative analysis can be used to compare simulation and experimental results to further verify the reliability of the model established by this method.

[0066] In a practical environment, an STM32 microcontroller can be used as the main control module, and a motor driver with a maximum output current of 10A and a maximum output power of 600W controlled by PWM can be selected as the TEC drive module. The simulated temperature control model is imported into the main control module. A series of ambient temperature points are set, and the light source temperature values ​​when the TEC drive current is constant under different ambient temperatures are collected, along with the TEC drive current values ​​obtained by actual control using the temperature control model to stabilize the light source temperature at the set value. After updating both sets of data, curves are fitted to obtain the light source control model under experimental conditions. Regarding the two sets of relationship curves under experimental conditions, one experimental result is as follows: Figure 5 and Figure 6 As shown.

[0067] The specific temperature control model available at the current control moment is as follows:

[0068] I0=f(T a )

[0069] k a =f′(T a )

[0070] ΔI=k a (T a -T0)·ρ

[0071] I = I0 + ΔI

[0072] In the formula, f is the first relational line function that matches the temperature data at the current control moment, and T a I0 is the ambient temperature at the current control moment, and I0 is the value in the first relationship line related to T. a The corresponding TEC drive current, k a Let ρ be the slope of the first relationship line matching the temperature data at the current control moment, ρ be the slope of the second relationship line matching the temperature data at the current control moment, ΔI be the TEC drive current correction amount, I be the TEC drive current at the current control moment, and T0 be the temperature threshold. This model calculates the control amount by using correction and adjustment coefficients to measure the difference between the real-time semiconductor light source temperature and the set temperature, and applies this control amount to the reference TEC drive current to obtain the real-time adjusted TEC drive current.

[0073] Based on the temperature data and temperature control model at the current control moment, the TEC drive current at the current control moment is controlled, thereby controlling the semiconductor light source temperature at the current control moment. That is, the temperature data at the current control moment is input into the temperature control model to obtain the TEC drive current at the current control moment, and the semiconductor light source temperature is further controlled by the TEC drive current.

[0074] like Figure 7As shown, after a period of control, the temperature data at the current control moment will be consistent with the temperature data at the previous control moment, and the semiconductor light source temperature at the current control moment will not be T0. In this case, another control model will be adopted, as follows:

[0075] I t+1 =I t +ΔI

[0076] That is, the TEC drive current at the current control time t+1 is equal to the TEC drive current at the previous control time t plus the ΔI corresponding to the previous control time.

[0077] Based on the same technical solution, this invention also discloses a virtual system for the above method, a temperature control system for a semiconductor light source, comprising:

[0078] The acquisition module acquires the temperature data at the current control moment; the temperature data includes the ambient temperature and the semiconductor light source temperature.

[0079] The matching module, in response to the inconsistency between the temperature data at the current control moment and the temperature data at the previous control moment, obtains the first relationship line and the second relationship line that match the temperature data at the current control moment from the pre-constructed first relationship line group and the second relationship line group, respectively; wherein, the first relationship line is the relationship line between the TEC driving current and the ambient temperature under the condition that the semiconductor light source temperature is constant, and the second relationship line is the relationship line between the semiconductor light source temperature and the ambient temperature under the condition that the TEC driving current is constant.

[0080] The model building module constructs a temperature control model for the current control moment based on the first and second relationship lines that match the temperature data at the current control moment; the temperature control model for the current control moment is as follows:

[0081] I0=f(T a )

[0082] ΔI=k a (T a -T0)·ρ

[0083] I = I0 + ΔI

[0084] In the formula, f is the first relational line function that matches the temperature data at the current control moment, and T a I0 is the ambient temperature at the current control moment, and I0 is the value in the first relationship line related to T. a The corresponding TEC drive current, k a ρ is the slope of the first relationship line that matches the temperature data at the current control time, ρ is the slope of the second relationship line that matches the temperature data at the current control time, ΔI is the TEC drive current correction amount, I is the TEC drive current at the current control time, and T0 is the temperature threshold.

[0085] The first drive current module controls the TEC drive current at the current control moment based on the temperature data and the temperature control model at the current control moment, thereby controlling the semiconductor light source temperature at the current control moment.

[0086] The pre-built module constructs the first and second relationship lines, including:

[0087] The TEC drive current was collected at a series of ambient temperature points when the temperature of the semiconductor light source was stabilized at a set value, and the first relationship line was constructed using the least squares method.

[0088] The temperature of a semiconductor light source under a defined TEC driving current is collected at a series of ambient temperature points, and a second relationship line is constructed using the least squares method.

[0089] The second drive current module responds to the fact that the temperature data at the current control moment is consistent with the temperature data at the previous control moment, and the semiconductor light source temperature at the current control moment is not T0. The TEC drive current at the current control moment is equal to the TEC drive current at the previous control moment plus the ΔI corresponding to the previous control moment.

[0090] The above system is a software system, loaded into the temperature control calculation unit, to achieve the same technical effect as the method.

[0091] Based on the same technical solution, the present invention also discloses a computer-readable storage medium storing one or more programs, the one or more programs including instructions that, when executed by a computing device, cause the computing device to perform a temperature control method for a semiconductor light source.

[0092] Based on the same technical solution, the present invention also discloses a computing device, including one or more processors, a memory, and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the one or more processors, and the one or more programs include instructions for performing a temperature control method for a semiconductor light source.

[0093] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0094] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0095] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0096] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0097] The above are merely embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention are included within the scope of the claims of the present invention pending approval.

Claims

1. A method for temperature control of a semiconductor light source, characterized in that: include, Acquire temperature data at the current control moment; the temperature data includes ambient temperature and semiconductor light source temperature; In response to the inconsistency between the temperature data at the current control moment and the temperature data at the previous control moment, the first relationship line and the second relationship line that match the temperature data at the current control moment are obtained from the pre-constructed first relationship line group and the second relationship line group, respectively; wherein, the first relationship line is the relationship line between the TEC driving current and the ambient temperature under the condition that the semiconductor light source temperature is constant, and the second relationship line is the relationship line between the semiconductor light source temperature and the ambient temperature under the condition that the TEC driving current is constant. Based on the first and second relationship lines that match the temperature data at the current control moment, construct the temperature control model for the current control moment; Based on the temperature data and temperature control model at the current control moment, the TEC drive current at the current control moment is controlled, thereby controlling the semiconductor light source temperature at the current control moment.

2. The temperature control method for a semiconductor light source according to claim 1, characterized in that: Constructing the first and second relationship lines includes: The TEC drive current was collected at a series of ambient temperature points when the temperature of the semiconductor light source was stabilized at a set value, and the first relationship line was constructed using the least squares method. The temperature of a semiconductor light source under a defined TEC driving current is collected at a series of ambient temperature points, and a second relationship line is constructed using the least squares method.

3. The temperature control method for a semiconductor light source according to claim 1, characterized in that: The temperature control model at the current control moment is: I0=f(T a ) ΔI=k a (T a -T0)·ρ I = I0 + ΔI In the formula, f is the first relational line function that matches the temperature data at the current control moment, and T a I0 is the ambient temperature at the current control moment, and I0 is the value in the first relationship line related to T. a The corresponding TEC drive current, k a ρ is the slope of the first relationship line that matches the temperature data at the current control time, ρ is the slope of the second relationship line that matches the temperature data at the current control time, ΔI is the TEC drive current correction amount, I is the TEC drive current at the current control time, and T0 is the temperature threshold.

4. The temperature control method for a semiconductor light source according to claim 3, characterized in that: After acquiring the temperature data at the current control moment, the method further includes the following steps: In response to the temperature data at the current control moment being consistent with the temperature data at the previous control moment, and the semiconductor light source temperature at the current control moment not being T0, the TEC drive current at the current control moment is equal to the TEC drive current at the previous control moment plus the ΔI corresponding to the previous control moment.

5. A temperature control system for a semiconductor light source, characterized in that: include, The acquisition module acquires the temperature data at the current control moment; the temperature data includes the ambient temperature and the semiconductor light source temperature. The matching module, in response to the inconsistency between the temperature data at the current control moment and the temperature data at the previous control moment, obtains the first relationship line and the second relationship line that match the temperature data at the current control moment from the pre-constructed first relationship line group and the second relationship line group respectively; wherein, the first relationship line is the relationship line between the TEC driving current and the ambient temperature under the condition that the semiconductor light source temperature is constant, and the second relationship line is the relationship line between the semiconductor light source temperature and the ambient temperature under the condition that the TEC driving current is constant. The model building module constructs a temperature control model for the current control moment based on the first and second relationship lines that match the temperature data at the current control moment. The first drive current module controls the TEC drive current at the current control moment based on the temperature data and the temperature control model at the current control moment, thereby controlling the semiconductor light source temperature at the current control moment.

6. The temperature control system for the semiconductor light source according to claim 5, characterized in that: It also includes pre-built modules that construct the first and second relationship lines, including: The TEC drive current was collected at a series of ambient temperature points when the temperature of the semiconductor light source was stabilized at a set value, and the first relationship line was constructed using the least squares method. The temperature of a semiconductor light source under a defined TEC driving current is collected at a series of ambient temperature points, and a second relationship line is constructed using the least squares method.

7. The temperature control system for the semiconductor light source according to claim 5, characterized in that: In the model building module, the temperature control model at the current control moment is: I0=f(T a ) ΔI=k a (T a -T0)·ρ I = I0 + ΔI In the formula, f is the first relational line function that matches the temperature data at the current control moment, and T a I0 is the ambient temperature at the current control moment, and I0 is the value in the first relationship line related to T. a The corresponding TEC drive current, k a ρ is the slope of the first relationship line that matches the temperature data at the current control time, ρ is the slope of the second relationship line that matches the temperature data at the current control time, ΔI is the TEC drive current correction amount, I is the TEC drive current at the current control time, and T0 is the temperature threshold.

8. The temperature control system for the semiconductor light source according to claim 7, characterized in that: It also includes a second drive current module; The second drive current module responds to the fact that the temperature data at the current control moment is consistent with the temperature data at the previous control moment, and the semiconductor light source temperature at the current control moment is not T0. The TEC drive current at the current control moment is equal to the TEC drive current at the previous control moment plus the ΔI corresponding to the previous control moment.

9. A computer-readable storage medium for storing one or more programs, characterized in that: The one or more programs include instructions that, when executed by a computing device, cause the computing device to perform any of the methods according to claims 1 to 4.

10. A computing device, characterized in that: include, One or more processors, a memory, and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the one or more processors, the one or more programs including instructions for performing any of the methods according to claims 1 to 4.

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