Housings and housing components for electronic devices

Abstract

The present disclosure relates to a housing and housing assembly for an electronic device. The housing includes: a housing that at least partially defines an internal volume, the housing including: a top panel, a bottom panel, a left panel, and a right panel; the left and right panels at least partially define the outer surface of the electronic device and at least partially define the internal volume; a tubular frame, which includes: a first pair of tubular support members extending from the bottom panel; a second pair of tubular support members extending from the bottom panel; a first tubular top frame member, the first tubular top frame member is disposed outside the internal volume and connected to an end of each of the first pair of tubular support members through an opening defined by the top panel; a second tubular top frame member, the second tubular top frame member is disposed outside the internal volume and connected to an end of each of the second pair of tubular support members through an opening defined by the top panel; at least one of the left or right panels is configured to be removable from the tubular frame and a portion of the housing.

Description

[0001] This divisional application is a divisional application based on the Chinese patent application with application number 202010116712.5, application date February 25, 2020, and invention name “Computer Tower Architecture”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This patent application claims priority to U.S. Provisional Patent Application No. 62 / 842,378, filed on May 2, 2019, entitled “COMPUTER TOWER ARCHITECTURE,” the entire disclosure of which is hereby incorporated by reference into this document. Technical Field

[0004] The described embodiments generally relate to housings. More specifically, the present embodiments relate to housings for electronic devices. Background Art

[0005] Components of electronic devices (e.g., processors of electronic devices) may generate heat during regular use. The performance of these components, as well as the overall performance of the electronic device itself, may depend on the operating temperatures of the various components. Therefore, it may be desirable to remove or redistribute the thermal energy generated by the components of the electronic device in order to maintain a desired operating temperature and ensure a desired level of device performance.

[0006] Continuous advancements in electronic devices and their components have resulted in considerable improvements in performance. However, existing components and structures of electronic devices may limit the performance levels of such devices. For example, existing electronic device housings may limit the performance of electronic devices by failing to effectively disperse or remove heat generated by electronic device components to the surrounding environment. Furthermore, some solutions for dispersing or removing heat generated by electronic devices may be undesirably noisy, bulky, complex to manufacture, or have other undesirable properties. Therefore, it may be desirable to further adjust the arrangement of components of electronic devices to provide additional or enhanced functionality without introducing or increasing undesirable device properties. Summary of the invention

[0007] A housing for an electronic device is provided, comprising: a shell, the shell at least partially defining an internal volume, the shell comprising: a top panel, a bottom panel, a left panel and a right panel; the left panel and the right panel at least partially defining the outer surface of the electronic device and at least partially defining the internal volume; a tubular frame, the tubular frame comprising: a first pair of tubular support members extending from the bottom panel; a second pair of tubular support members extending from the bottom panel; a first tubular top frame member, the first tubular top frame member is arranged outside the internal volume and connected to the end of each of the first pair of tubular support members through an opening defined by the top panel; a second tubular top frame member, the second tubular top frame member is arranged outside the internal volume and connected to the end of each of the second pair of tubular support members through an opening defined by the top panel; and at least one of the left panel or the right panel is configured to be removable from the tubular frame and part of the shell.

[0008] A housing assembly for an electronic device is provided, comprising: a tubular frame configured to receive and support a computing component; a base plate attached to the tubular frame and at least partially defining an outer surface of the electronic device; a top panel attached to the tubular frame, at least a portion of the tubular frame extending through an opening defined by the top panel; an interface panel attached to the tubular frame and at least partially defining the outer surface, the interface panel including a data port; and left and right panels, the left and right panels at least partially defining the outer surface and at least partially defining an internal volume and at least a portion of the tubular frame, the left and right panels being removably attached to the tubular frame.

[0009] A housing assembly for an electronic device is provided, comprising: a tubular frame; a front panel, the front panel defining a first plurality of holes extending through the front panel; a rear panel, the rear panel defining a second plurality of holes extending through the rear panel; a left panel; a right panel; a bottom panel; and a top panel, the top panel defining an opening through which a portion of the tubular frame extends; the front panel, the rear panel, the left panel, the right panel, the top panel and the bottom panel defining an outer surface and an inner volume of the electronic device, at least the left panel and the rear panel being removably coupled to the tubular frame.

[0010] An exemplary electronic device includes a housing defining an internal volume. A component is disposed in the internal volume, which divides the internal volume into a first volume and a second volume. The component includes a hole that provides fluid communication between the first volume and the second volume. A seal is disposed on the component, and the seal substantially fluidly isolates the first volume and the second volume except at the hole. The electronic device may also include an air movement system to generate a positive air pressure in the first volume and a negative air pressure in the second volume.

[0011] The air moving system of the exemplary electronic device may also include a first air moving device that generates positive air pressure in the first volume by moving air from the surrounding environment into the first volume, and a second air moving device that generates negative air pressure in the second volume by moving air from the second volume into the surrounding environment. The air moving system moves air between the first volume and the second volume through the aperture.

[0012] The first air moving device may include at least one fan disposed in the first volume, and the second air moving device may include a blower disposed in the second volume. In one example, the first air moving device includes a first fan, a second fan disposed above the first fan, and a third fan disposed above the second fan, wherein the first fan, the second fan, and the third fan cooperate to extend substantially along the entire height of the housing.

[0013] The electronic device may include a main logic board. The main logic board may include a first surface and a second surface positioned opposite the first surface, wherein the first electronic component is disposed on the first surface and the second electronic component is disposed on the second surface. In one example, the main logic board includes a plurality of ports or interconnects.

[0014] In one example, the second component may be disposed within the first volume and positioned at the hole of the first component. The second component may include a power supply unit. In one example, the first volume and the second volume occupy substantially the entire internal volume.

[0015] An exemplary housing for an electronic device may include a frame configured to receive and support one or more electronic components, and may include one or more tubular support members extending from a base plate (the base plate defines at least a portion of the outer surface of the housing) and a port panel including one or more ports. The port panel may be coupled to the base plate and arranged perpendicular to the base plate, and may define at least a portion of the outer surface of the housing. The housing may also include a shell defining an internal volume, which is sized to cover one or more electronic components and is configured to couple with the frame and engage the base plate and the port panel to define the outer surface of the housing. The housing is removable from the frame as a whole, and includes a first panel and a second panel, wherein the first panel at least partially defines the outer surface of the housing and defines a plurality of holes extending therethrough, and the second panel is arranged opposite to the first panel and at least partially defines the outer surface of the housing. The second panel may define a plurality of holes extending therethrough, and may also define a slit, the size of which is set to substantially surround and engage the perimeter of the port panel.

[0016] The shell may also include a first mesh coupled to a surface of the first panel that at least partially defines the internal volume, and a second mesh component coupled to a surface of the second panel that at least partially defines the internal volume. The shell may also include a top panel that at least partially defines the outer surface of the shell and defines a hole that is sized to allow a portion of the frame to extend through it when the shell is coupled to the frame. The portion of the frame may include a handle. The handle may include a first end of a first tubular support member coupled to the frame and a second end of a second tubular support member coupled to the frame. The frame may also include one or more feet extending from the base plate and configured to physically support the shell. The shell may be coupled to the frame by a locking mechanism having a locked state and an unlocked state, the locked state retaining the shell on the frame, and the unlocked state allowing the shell to be removed integrally from the frame, wherein the locking mechanism can be moved between the locked state and the unlocked state by a user.

[0017] Yet another exemplary electronic device includes a housing defining an interior volume, a computing component positioned within the interior volume, the computing component dividing the interior volume into a first region and a second region, the component further defining an aperture providing fluid communication between the first region and the second region. The housing and the computing component may define an airflow channel from an ambient environment into the first region, from the first region through the aperture in the computing component to the second region, and from the second region to the ambient environment, and an air movement system moves air through the airflow channel, wherein the air movement system establishes a positive air pressure in the first region and a negative air pressure in the second region.

[0018] An exemplary electronic device may also include a seal that at least partially surrounds the computing component and cooperates with the housing to fluidly isolate the first region from the second region (except at the aperture).

[0019] In another exemplary electronic device, an air movement system includes a fan in a first region and a blower in a second region. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present disclosure will be readily understood through the following detailed description in conjunction with the accompanying drawings, in which like reference numerals refer to like structural elements, and in which:

[0021] Figure 1 A perspective system view of a computing system including an electronic device is shown.

[0022] Figure 2 A front perspective view of an electronic device is shown.

[0023] Figure 3 Shows Figure 2 Rear perspective view of an electronic device.

[0024] Figure 4 A cross-sectional schematic diagram of an electronic device is shown.

[0025] Figure 5 Shows Figure 4 Schematic cross-section of an electronic device.

[0026] Figure 6 Shows Figure 4 Schematic top view of an electronic device.

[0027] Figure 7 A perspective view of components of an electronic device is shown.

[0028] Figure 8 Shows Figure 7 A rear perspective view of components of an electronic device.

[0029] Fig. 9 Shows Figure 7 Perspective view of the interior of an electronic device.

[0030] Fig.10 Shows Figure 7 Perspective view of the interior of an electronic device.

[0031] Fig.11 An exploded top perspective view of an electronic device is shown.

[0032] Fig.12 A side perspective view of components of an electronic device is shown.

[0033] Fig.13 Shows Fig.12 A side perspective view of the components.

[0034] Fig.14A perspective view of components of an electronic device is shown.

[0035] Fig.15 Shows Fig.14 Side view of the components.

[0036] Fig.16 Shows Fig.14 Top view of components.

[0037] Fig.17 A schematic cross-sectional view of an electronic device is shown, including arrows showing air flow.

[0038] Fig.18 Shows Fig.17 Schematic cross-sectional view of an electronic device including arrows illustrating airflow.

[0039] Fig.19 Shows Fig.17 Schematic top view of an electronic device including arrows showing airflow.

[0040] Fig. 20 A side view of the interior of an electronic device is shown, including arrows showing air flow.

[0041] Fig.21 Shows Fig. 20 A side view of the interior of an electronic device, including arrows showing airflow.

[0042] Fig.22A and Fig. 22B Shows Fig. 20 A top schematic diagram of an electronic device including arrows showing airflow. DETAILED DESCRIPTION

[0043] This specification provides examples and does not limit the scope, applicability or configuration set forth in the claims. Therefore, it should be understood that the functions and arrangements of the elements discussed may be changed without departing from the spirit and scope of the present disclosure, and various embodiments may appropriately omit, replace or add other programs or components. For example, the described method may be performed in an order different from the order described, and various steps may be added, omitted or combined. In addition, in other embodiments, the features described with respect to some embodiments may be combined.

[0044] One aspect of the present disclosure relates to an electronic device comprising a housing defining an internal volume. The electronic device may include computing components within the internal volume, such as a processor, a circuit board, a memory, a power supply unit, and / or a driver. Computing components such as a logic board positioned within the internal volume may divide the internal volume into a first volume and a second volume. In some examples, the first volume and the second volume may occupy substantially the entire internal volume. The component may substantially fluidically isolate the first volume and the second volume except at one or more holes defined by the component (through which the volumes can be fluidically connected). The electronic device may also include a first air moving device (e.g., one or more fans) that generates positive pressure in the first volume, and a second air moving device (e.g., a blower) that generates negative pressure in the second volume.

[0045] Thus, the components of an electronic device may be arranged and coordinated so that airflow paths into, through, and out of the electronic device provide a desired amount of heat dispersion and removal while maintaining a compact and efficient spatial arrangement and without generating undesirably high levels of noise. In contrast, conventional components for electronic devices, such as housings and circuit boards, and conventional arrangements of these components may create airflow paths that do not promote efficient redispersion or removal of heat from the device. Typically, multiple fans are housed within an electronic device to move relatively cool air from the surrounding environment into the device, where the air may be heated by the components of the device and then exhausted back into the surrounding environment, out of the device.

[0046] These components and their arrangement within the internal volume of a typical electronic device can produce airflow dead spots within the internal volume. That is, there may be positions in the internal volume where the airflow is insufficient to fully remove heat from the device. These dead spots may be caused by the spatial arrangement of the components within the electronic device, or by eliminating interference between the airflows from competing fans. Therefore, these dead spots may require additional or more powerful fans to be incorporated into the device to achieve the required performance level. However, the use of additional or more powerful fans may increase the noise generated by the electronic device, or may require more space to accommodate the fan, thereby undesirably increasing the overall size of the electronic device. Traditionally, another way to enhance airflow and heat dissipation in electronic devices is to provide more space within the internal volume so that air flows between the components that need to be cooled. However, adding space in the internal volume to allow air flow may also undesirably increase the total volume of the electronic device.

[0047] It is therefore desirable to design and arrange the components of an electronic device to create airflow paths that can effectively remove or redistribute heat from the electronic device without significantly increasing the internal volume of the electronic device or without implementing a high-power and noisy air movement system, for example by including an undesirably large number of fans.

[0048] Users of electronic devices, such as desktop computers, often seek to replace one or more internal components of the computer. For example, if advances in technology result in a more powerful graphics processing unit (GPU), a user may seek to replace an existing GPU within their electronic device with the more powerful GPU. Therefore, it may be desirable for components of the electronic device to be easily accessible and replaceable by a user or technician. Therefore, in addition to the desired airflow and heat dissipation features described herein, the arrangement and design of components of the electronic device, such as a housing, may also provide the user with access to one or more components of the electronic device.

[0049] Conventional desktop computers typically only provide access to internal components on one side of the device. Therefore, conventional components are arranged within a desktop computer so that they can be accessed and removed from a single side of the device. However, such an arrangement may be incompatible with a space-efficient arrangement of components that produces a desired amount of airflow through or within the electronic device. This conflict between accessibility and thermal management can again result in dead spots and the need for larger housings or undesirably large numbers of fans, thereby increasing the size of the device or causing the device to generate high levels of noise during operation.

[0050] In some examples, the components and methods for forming and assembling the components described herein can be used to provide an electronic device that utilizes multiple isolated volumes or areas that can cooperate to produce a desired level of thermal management without requiring extremely powerful or bulky air movement systems while still providing access to the components to a user or technician of the electronic device.

[0051] In addition, the components of the electronic device can be formed and arranged to allow high configurability, modularity, and accessibility while minimizing the overall volume and size of the electronic device. In some examples, multiple areas of the electronic device can be isolated by a seal, but can be connected at selected locations to effectively control and direct the airflow provided by the air movement system. For example, one area can have a positive air pressure relative to the surrounding environment, while another area can have a negative air pressure relative to the surrounding environment. The pressure in each area can be controlled by the air movement system to provide airflow in, out, and between areas to achieve a desired level of thermal management of the electronic device components.

[0052] Figure 1 A computing system including an electronic device 100 is shown. Figure 1The electronic device 100 shown is a computer, such as a desktop computer, and can be connected to a display or monitor 110. However, this is only a representative example of a device that can be used in conjunction with the concepts disclosed herein. For example, the electronic device 100 can correspond to a portable media player, a media storage device, a portable digital assistant ("PDA"), a tablet computer, a display, a mobile communication device, a GPS unit, a remote control device, and similar electronic devices. The electronic device 100 can be referred to as an electronic device or a consumer device. As shown, the electronic device 100 can also be connected to any number of input devices, such as a keyboard 120, a mouse 130, a tracking pad, a stylus, a microphone, or any combination of known input devices. Figure 2 More details of the electronic device 100 are illustrated in FIG.

[0053] Figure 2 For example, in Figure 1 An electronic device 200 used in a computing system shown. The electronic device 200 may be connected to a display and one or more input devices. The electronic device 200 is configured to be placed on, under or near a work surface such as a table or desk. In some examples, the electronic device 200 of the computing system may be referred to as a desktop computer. The electronic device 200 may include a plurality of internal electronic components, including at least a central processing unit (CPU) (located on one or more logic boards, such as a main logic board in some examples), one or more graphics processing unit (GPU) boards, and other main internal components and auxiliary internal components. The electronic device 200 may also include a housing 201, which may define the internal volume of the electronic device 200 and may at least partially define the outer surface of the electronic device 200. Although the housing 201 of the electronic device 200 is shown as having a generally rectangular shape, in some examples, the electronic device 200 and the housing 201 may be substantially any shape as needed. In some embodiments, the electronic device may also be coupled to other electronic devices to form a multi-computer system, which may be used, for example, as a server computer system (such as in a data farm) or as a network computing system with each electronic device 200 as a node (or multiple nodes).

[0054] In some examples, the electronic device 200 may include a housing 201 that may define an internal volume, and the internal components of the electronic device are disposed within the internal volume. The housing 201 may be easily removed for user access or maintenance. The housing 201 may include a metal material, such as aluminum. In some examples, the housing 201 may have an anodized aluminum oxide layer that both protects the housing 201 and promotes heat transfer for cooling the internal volume. In some examples where the housing 201 includes a metal such as aluminum, the electrical conductivity of the housing 201 may provide grounding for the internal electronic components, which are arranged to fit and operate within the housing 201. The housing 201 may also provide electromagnetic interference (EMI) shielding to protect sensitive electronic components from external electromagnetic energy, and to reduce the amount of electromagnetic energy from internal components within the electronic device that penetrates the housing 201, thereby providing a desired level of electromagnetic compatibility (EMC).

[0055] The housing 201 may include a mechanism 214, such as a mechanical latch, which can be used to securely couple the housing 201 of the electronic device 200 to the internal structure of the electronic device 200, as further described herein. The mechanism 214 can take the form of a twist latch or other such operable mechanism that can be manually engaged and disengaged, for example, by a user or a technician. In this way, the housing 201 can be easily removed to expose the internal components and structures of the electronic device 200 for user maintenance, upgrading, or repair by a technician. In some examples, a detection circuit (not shown) of the electronic device 200 can be used to detect whether the housing 201 is correctly positioned in the appropriate position relative to the internal components and structures. The detection circuit can play a useful role because the thermal management strategy of the electronic device 200 can rely on the correct placement and use of the housing 201, combined with the arrangement of the internal components and air movement system within the internal volume defined by the housing 201.

[0056] In some examples, the detection circuitry may determine that the housing 201 is not properly placed or aligned relative to the internal structures or components of the electronic device 200, and the detection circuitry may prevent the electronic device 200 from operating, or at least fully operating. In some examples, the detection circuitry may include a magnetic sensor (such as a Hall effect device) positioned to detect one or more magnets disposed on the housing 201 when the outer housing 201 is properly placed and aligned on the electronic device 200. The housing 201 may also include one or more features, such as a handle 212, which may allow a user or technician to pick up or transport the electronic device 200.

[0057] The housing 201 may also include one or more support features 216, such as in the form of feet. The support features 216 may be used to provide physical support to the electronic device 200 when it is resting on a surface, and may also prevent large surfaces of the housing 201 from directly contacting the surface on which it rests. In this way, the support features 216 may provide space between the housing 201 and the surface to allow air to flow through, thereby aiding in thermal management of the electronic device 200.

[0058] A plurality of holes, apertures, perforations, or channels 210 may be formed in the front surface of housing 201 that may provide fluid communication between the surrounding environment and the interior volume defined by housing 201. Holes 210 may be substantially any shape, but in some examples, may be circular or spherical as described herein. In some examples, holes 210 may allow direct fluid communication between the surrounding environment and the interior volume. However, in some examples, holes 210 may allow fluid communication between the surrounding environment and the interior volume through one or more components, such as an air moving device or system described herein.

[0059] In some examples, the holes or holes 210 may be in the form of a three-dimensional structure that may include spherical grooves that interfere or intersect with each other to produce through holes 210 arranged in a specified pattern. The spherical grooves may have a basic form of three spherical grooves that at least partially intersect or interfere with each other in a common plane, and a fourth spherical groove that intersects or interferes with each of the three spherical grooves on an adjacent plane to generate a network of interconnected through holes 210. This basic form can then be propagated or repeated throughout the structure to form a clustered three-dimensional structure. For example, in some examples where the housing 201 includes such a three-dimensional structure, the structure can maximize the surface area for heat transfer and the distribution of holes 210 while maintaining a robust structural grid. That is, the housing 201 including interconnected through holes 210 can optimize its ability to disperse or remove heat from the electronic device 200 while remaining light and strong, thereby improving the performance of the electronic device 200 compared to traditional single or closed continuous structures. Reference is made below Figure 3 Additional views detailing the electronic device.

[0060] like Figure 3As shown, in some examples, the housing 201 of the electronic device 200 may include, for example, an interface panel 220 located on the rear surface of the housing 201. The interface panel 220 may include various ports 222 that can be used to transmit data and / or power between the electronic device 200 and various external systems. For example, the interface panel 220 may include a group of audio ports that can be used to provide an audio stream to an external audio system such as headphones, speakers, or an audio processor. The group of audio ports can also be used to receive an audio stream from an external audio system such as a microphone or an audio recording device. The interface panel 220 may also include one or more ports, including one or more bus ports, one or more high-speed expansion ports, one or more networking ports, and one or more video ports. The data port can be used to transmit data and / or power between one or more external circuits and the electronic device 200. The data port can be used to adapt to a wide range of data connections according to different wired data communication protocols, such as one or more universal serial bus (USB) ports, one or more Thunderbolt high-speed expansion ports, one or more Ethernet networking ports, one or more high-definition media interface (HDMI) ports, and other data ports.

[0061] The electronic device 200 can be interconnected to other computing systems via one or more data ports provided on the interface panel 220 (e.g., to data storage devices, portable media players, and / or video devices) to form a network of computing systems. Thus, the interface panel 220 and associated data ports of the electronic device 200 can be used to form connections from the electronic device 200 to a large number and variety of external computing systems and circuits, which can prove particularly useful when a large number of computing resources are required. In addition, in some representative embodiments and uses, the size and shape of the electronic device 200 can be helpful in space-efficient computing networks or data farms.

[0062] Interface panel 220 may also include a video port that can be used to transmit high-speed video between electronic device 200 and an external video monitor or other external video processing circuitry, such as Figure 1 The interface panel 220 may include an alternating current (AC) power input port 224, which may be sized and shaped to receive a power plug suitable for transmitting external power, such as through a power supply unit described herein, to operating electronic components within the housing 201. In some examples, the electronic device 200 may include an internal power source (such as a battery) that may be charged and recharged based on the power delivered through the power input port 224.

[0063] The housing 201 may also include a power switch (not shown) that can be easily touched by a user to initiate a power-on sequence (including, for example, a boot process) and a power-off sequence. In some embodiments, the power switch may be illuminated and provide an active indication to the user, for example, under software control of a processing unit in the electronic device 200.

[0064] The housing 201 may also include or define a plurality of holes, apertures, perforations, or channels 211, such as formed in a rear surface of the housing 201. The holes 211 may be substantially similar to the holes 211 in relation to the housing 201. Figure 2 The aperture 210 described herein can provide fluid communication between the surrounding environment and the interior volume defined by the housing 201. The aperture 211 can be substantially any shape, but in some examples, can be circular or spherical as described herein. In some examples, the aperture 211 can allow direct fluid communication between the surrounding environment and the interior volume. However, in some examples, the aperture 211 can allow fluid communication between the surrounding environment and the interior volume through one or more components (such as the air moving devices or systems described herein).

[0065] As described herein, any number or variety of components may be included in an electronic device. The components may include any combination of the features described herein, and may be arranged in any of the various configurations described herein. The structure and arrangement of an electronic device including a housing defining an internal volume (divided into one or more regions by one or more components within the internal volume), and the concepts regarding regional pressures and airflows may apply not only to the specific examples discussed herein, but to any combination of any number of embodiments. Figure 4-Figure 6 Various embodiments of electronic devices are described that include components having various features in various arrangements.

[0066] Figure 4 A schematic cross-sectional view of an electronic device 300 taken along one side (e.g., the right side of the electronic device 300) is shown. The electronic device 300 is merely one representative example of a device that can be used in conjunction with the systems and concepts disclosed herein. The electronic device 300 can be, for example, a desktop computer and can be substantially similar to and can include any of the features of the electronic devices 100, 200 described herein.

[0067] As with electronic device 200, electronic device 300 may include housing 301 that defines an interior volume of electronic device 300 and may at least partially define an exterior surface of electronic device 300. The interior volume defined by housing 301 may include components of electronic device 300 therein. In some examples, and as described below with respect to Figure 5 and Figure 6As described, the internal volume defined by the housing 301 may be divided into one or more regions, zones, or volumes by one or more components of the device 300. These regions or volumes may also be referred to as thermal regions or pressure regions. In this example, a logic board such as a main logic board 330 may divide and separate the internal volume into a first region 302 and a second region 303.

[0068] In this example, the main logic board 330 is sized and positioned within the internal volume defined by the housing 301 such that the main logic board 330 extends substantially the entire height and width of the internal volume, thereby dividing the internal volume into a first area 302 located on one side of the main logic board 330 and a second area 303 located on the other opposite side of the main logic board 330. Figure 4 , a first region 302 is shown, while a second region 303 is positioned behind a main logic board 330 within the internal volume.

[0069] A plurality of electronic components, electrical components, and other components of the electronic device 300 may be disposed within a first area 302 defined by the housing 301 and the main logic board 330. In this example, the first area 302 may include one or more central processing units (CPUs) such as CPU 312, one or more graphics processing units (GPUs) such as GPUs 314 and 316, a power supply unit 318, a first air moving device 320, and other components not shown. In some examples, one or more components may be electrically connected to the main logic board 330, for example, directly by soldering or by connecting to one or more ports on the main logic board 330.

[0070] In some examples, first area 302 can be positioned and configured so that when housing 301 is removed from electronic device 300, a user or technician can easily access any components therein, as described herein. Figure 4 As shown, when the housing 301 is removed from the electronic device 300, the entire height and width of the first region 302 can be exposed, thereby allowing a user or technician to adjust, remove, or otherwise access any components positioned therein. In some examples, the GPUs 314, 316 can be removably connected to the main logic board 330, for example, via one or more ports in the main logic board 330. The configuration of these components and the first region 302 allows the GPUs 314, 316 to be easily removed and replaced by the user as needed without having to remove or replace other components of the electronic device 300.

[0071] Thus, the architecture of the electronic device 300 and housing 301 enables a highly modular and configurable design with respect to the components of the electronic device 300. One or more components may be selectively replaced, for example, with more powerful or alternative components, without disturbing other components of the electronic device 300. Furthermore, because such a large amount of the internal volume is exposed when the housing 301 is removed from the electronic device 300, it is easy and straightforward for a user or technician to remove and replace components, thereby allowing the electronic device 300 to be highly modular and adaptable to the needs of a particular user as needed.

[0072] The electronic device 300 may also include an air movement system to move air from the surrounding environment into the housing 301 of the electronic device 300; to move air within the interior volume defined by the housing 301, such as between the first area 302 and the second area 303; and to move air from the interior volume defined by the housing 301 into the surrounding environment. As described herein, the air movement system may control the air pressure of each area of ​​the interior volume relative to the surrounding environment as desired, such as generating positive or negative air pressure in a particular area. In some examples, the air movement system may include a first air moving device 320 that may be positioned entirely within the first area 302, but in some other examples, one or more components of the first air moving device 320 may be positioned outside the first area 302 or the interior volume defined by the housing 301.

[0073] Air moving devices 320 may be designed to optimize the balance between fan sound level and air volume distributed throughout first area 302. According to one example, three air moving components (e.g., fans) may be combined adjacent to first area 302 to create a positive pressure relative to the surrounding environment in first area 302. However, any number of fans or fan designs may be used to achieve the desired fan sound level and air volume distribution.

[0074] As shown, the first air moving device 320 may include one or more air moving components that can cooperate to move air, such as fans, as described herein. In some examples, any suitable components capable of moving air or generating airflow may be included in the first air moving device 320. In this example, the air moving system 320 may move air from the surrounding environment into the first area 302 through (for example) holes in the housing 301 to generate a positive air pressure in the first area 302 relative to the surrounding environment. The first air moving device 320 may include a first fan 322, a second fan 324, and a third fan 326. Although described herein as including three fans, the first air moving device 320 may include any number or type of air moving components as needed. In some examples, each of the fans 322, 324, 326 may be the same size, but in other examples, the fans may be different sizes and may have variable sizes relative to each other as needed. For example, as shown, the first air moving device 320 may extend substantially the entire height of the first volume 302, thereby effectively moving a wall of air into the first area 302. In some examples, the speed of each fan 322, 324, 326 can be independently controlled, for example by a processor of the electronic device 300, to produce a desired location and amount of airflow into the first volume 302. Figure 5 The second region or volume 303 is detailed.

[0075] Figure 5 The electronic device 300 is shown with Figure 4 Schematic cross-sectional view of the opposite side, and showing a second region 303 of the interior volume defined by the housing 301 and the main logic board 330. In some examples, the electronic device 300 may include one or more memory modules 332, 334, 336, such as a dual in-line memory module (DIMM), which may be constructed from a substrate having a plurality of memory chips mounted thereon. The memory modules 332, 334, 336 may be positioned and electrically connected to the main logic board 330. Importantly, while certain components of the electronic device 300 may be positioned on and connected to a first surface of the main logic board 330 such that they are located within the first region 302, other components such as memory modules 332, 334, 336 may be disposed on and connected to a second surface of the main logic board 330 such that they are disposed in the second region 303. As described herein, including components of the electronic device 300 in multiple regions and the configuration of the components in the regions may allow the air movement system of the electronic device 300 to provide a desired level of airflow for each component.

[0076] The air movement system of the electronic device 300 may also include, for example, a second air moving device 328 positioned within the second area 303. As with the first air moving device 320, the second air moving device 328 may be positioned entirely within the second area 303, but in some other examples, one or more components of the second air moving device 328 may be positioned outside of the second area 303 or the interior volume defined by the housing 301. In this example, the second air moving device 328 may include a blower 328 to move air from the second area 303 to the surrounding environment through the housing 301, such as through holes formed in the housing 301. In this manner, the second air moving device 328 may create a negative air pressure in the second area relative to the surrounding environment. Although the second air moving device 328 is a blower in this example, in some examples, substantially any component capable of moving air or creating airflow may be included in the second air moving device 328. Reference is made below to Figure 6 Details of a main logic board 330 that separates the internal volume of the electronic device 300 into a first area and a second area are provided.

[0077] Figure 6 A schematic diagram of the top of an electronic device 300 is shown, including a housing 301 defining its internal volume. As can be seen, a component such as a main logic board 330 can divide and separate the internal volume into at least a first area 302 and a second area 303. The electronic device 300 may also include an air movement system, which may include a first air moving device 320 and a second air moving device 328, which can be used to generate positive pressure areas and negative pressure areas, as described herein. Although the electronic device 300 of the present invention includes a component having a relatively planar geometry (in this example, the main logic board 330), other component geometries are explicitly contemplated and can be used to divide the internal volume into any number or configuration of areas as desired. In addition, in some examples, as desired, multiple components can cooperate to divide the internal volume into two or more areas.

[0078] Importantly, as described herein, a partitioned component such as the main logic board 330 may include electrical components disposed in each zone of the internal volume. While conventional electronic device architectures include substantially all components in a single zone, the use of multiple zones allows for selective control of airflow and pressure in each zone to provide the desired level of thermal management while allowing a user or technician to access modular components on either side of the electronic device 300. Figure 7-Figure 11 Additional embodiments of electronic devices are described that include components having various features in various arrangements.

[0079] Figure 7A perspective view of an electronic device 400 is shown including a housing component 401 separated from a frame or base component 440. The electronic device 400 may be, for example, a desktop computer, and may be substantially similar to and include any of the features of the electronic devices 100, 200, and 300 described herein. The housing of the electronic device 400 may be substantially similar to the housings 201, 301 described herein, which may define an interior volume and an exterior surface of the electronic device 400.

[0080] like Figure 7 As shown, the housing may include a shell 401 that may define an interior volume sized to encompass portions of a frame 440 and electronic components housed and supported by the frame 440, as described herein. The shell 401 may be coupled to the frame 440 to define an exterior surface of the housing. Figure 7 In some examples shown, the housing 401 can be removed from the frame 440 as a whole, for example by a user. In some examples, the housing 401 can be coupled to the frame 440 by a locking mechanism, which can have a locked state and an unlocked state. In the locked state, for example, Figure 2 As shown, the housing 401 is retained on the frame 440. In the unlocked state, the housing 401 can be selectively removed from the frame by lifting or sliding the housing 401 off the frame 440 as desired.

[0081] The housing 401 may include a top panel 402 that may at least partially define an outer surface of the housing, such as its top surface. In some examples, the top panel 402 may include or define one or more holes 403 that may allow a portion of the frame 440 to extend therethrough. For example, the frame 440 may include one or more handles 409 that may pass through the holes 403 of the top panel 402 and may be exposed to the external environment. The housing 401 may also include a plurality of panels coupled to the top panel 402 or otherwise attached to the top panel. Each panel may extend from the top panel 402. For example, each panel may extend from the top panel 402 and be perpendicular to the top panel. The housing 401 may include a first panel or front panel 404 that may be substantially the entire height of the electronic device 400. In some examples, the front panel 404 may define a plurality of holes, holes, perforations, or channels 410 that extend therethrough and may provide fluid communication between the surrounding environment and the internal volume defined by the housing 401. In some examples, the aperture 410 can be substantially similar to the aperture 210 described herein.

[0082] In some examples, housing 401 may also include a mesh or perforated member 408 that may be coupled to or positioned substantially adjacent to a surface of front panel 404 that at least partially defines the interior volume. In some examples, the mesh may substantially cover aperture 410 such that any fluid, such as air, that passes through aperture 410 must also pass through mesh 408. The mesh may include apertures or perforations of substantially any size, shape, or distribution.

[0083] Figure 8 A rear perspective view of an electronic device 400 including a housing 401 separated from a frame 440 is shown. As shown, the frame 440 may include a port or interface panel 442, which may include one or more ports and may be substantially similar to the interface panel 220. The frame 440 may also include a base plate or bottom panel 444, which may at least partially define the internal volume of the device and the outer surface of the device. When the housing 401 is positioned on the frame 440, it may, for example, engage with the bottom panel 444 at the periphery to at least partially define the outer surface and internal volume of the device. The interface panel 442 may be coupled to the bottom panel 444 and arranged to be substantially perpendicular to the bottom panel, and may also define the outer surface and internal volume of the device.

[0084] The housing 401 may include a second panel or back panel 405 that may be substantially the entire height of the electronic device 400. In some examples, the back panel 404 may define a plurality of holes, apertures, perforations, or channels 410 that extend therethrough and may provide fluid communication between the surrounding environment and the interior volume defined by the housing 401. In some examples, the apertures 410 may be substantially similar to the apertures 210 described herein. The back panel 405 may also define an engagement gap or mating gap 406 that may be sized to accommodate and engage or mate with the perimeter of the interface panel 442. Thus, the housing 401, the interface panel 442, and the bottom panel 444 of the frame 440 may cooperate to define the exterior surface and interior volume of the electronic device.

[0085] In some examples, the housing 401 may further include a mesh or perforated member 408 that may be coupled to or positioned substantially adjacent to the surface of the rear panel 405 that at least partially defines the internal volume. In some examples, the mesh may substantially cover the hole 410 so that any fluid, such as air, that passes through the hole 410 must also pass through the mesh 408. The mesh may include holes or perforations of substantially any size, shape, or distribution. In some examples, the front panel 404 and the rear panel 405 of the housing may be coupled to or otherwise connected to the side panels 407 and the top panel 402 to form a housing 401 that can be removed integrally.

[0086] Fig. 9A perspective view of the interior of the electronic device 400 is shown. The electronic device 400 is merely a representative example of a device that can be used in conjunction with the systems and concepts disclosed herein. In this example, the housing of the housing (which can be similar to the housing 201 described herein) is not shown. As shown, the frame 440 may include one or more support members 446 that extend from the bottom panel 444 and may be substantially perpendicular to the bottom panel. In some examples, the support member 446 may be a tubular support member and may be substantially hollow. In some examples, the frame 440 may include four tubular support members 446, each of which may be arranged to be approximately adjacent to or near the corner of the bottom panel 444. In some examples, one or more tubular support members 446 may be connected or joined together by another component such as a handle 409. Therefore, in some examples, the handle 409 may include a first end connected to the first tubular support member 446 and a second end connected to the second tubular support member 446.

[0087] The electronic device 400 may include a frame or base 440 that can be connected to the housing and at least partially support the housing when the housing is secured to the electronic device 400. The base 440 may also define a lower or bottom outer surface of the device 400. The housing 401 and the base 440 together may be considered a housing and may substantially define an outer surface of the device 400. The base 440 may also provide structural support for the electronic device 400. Components of the electronic device 400 may be attached to the housing and / or base 440 via inner surfaces formed to, extending to, or otherwise forming part of the housing and / or base, attachment features, threaded connectors, studs, posts, and other fastening systems.

[0088] In this example, the main logic board 430 may divide and separate the internal volume into a plurality of regions, such as a first region and a second region. Fig. 9 A view of a first region of an interior volume of an electronic device 400 is provided. In this example, a main logic board 430 is sized and positioned within the interior volume defined by the housing such that the main logic board 430 extends substantially the entire height and width of the interior volume, thereby dividing the interior volume into a first region located on one side of the main logic board 430 and a second region located on another opposing side of the main logic board 430, e.g., as shown relative to Figure 4-Figure 6 described.

[0089] A plurality of electronic components, electrical components, and other components of the electronic device 400 may be disposed within the first area and may be connected to a first surface or first side of the main logic board 430. In this example, the CPU 412, one or more graphics processing units (GPUs) such as GPUs 414 and 416, a power supply unit 418, and a first air moving device 420 are connected to a first side of the main logic board 430. In some examples, one or more components may be directly connected to the main logic board 430, for example, by soldering or by connecting to one or more ports such as PCIe ports on the main logic board 430. The electronic device 400 may include additional electronic components connected to the main logic board 430, for example, through ports disposed on the main logic board 430. In some examples, the ports may include one or more ports to connect components such as expansion cards to the electronic device 400 through an expansion bus. Thus, in some examples, the main logic board 430 may include one or more computer expansion bus interconnects, such as serial computer expansion bus interconnects, such as PCIe slots. The interconnects may allow a user to add additional components such as components 411 and 413 to the electronic device 400 to implement additional functionality as desired.

[0090] Furthermore, the configuration of the components within both the internal volume and the first area and the location of the expansion slots on the main logic board 430 allow for a high level of access to the components when the housing is removed from the electronic device 400, as shown. Thus, a user or technician may easily add, remove, or replace components of the electronic device 400 when the housing has been removed.

[0091] As described with respect to electronic device 300, electronic device 400 may include a first air moving device 420, which may include one or more air moving components, such as fans. In this example, air moving system 420 may move air from the surrounding environment into the first area through (for example) holes in the housing to create a positive air pressure in the first area relative to the surrounding environment. First air moving device 420 may include a first fan 422, a second fan 424, and a third fan 426. Fans 422, 424, 426 may be attached together to a component fixed to, for example, base 440. According to one example, first air moving device 420 may extend substantially the entire height of electronic device 400, effectively moving a wall of air into the first area and passing through the components located therein. In some examples, the speed of each fan 422, 424, 426 may be independently controlled, for example, by a processor of electronic device 400 to generate a desired location and amount of airflow into the first volume. In some examples, the fan blade diameter of fans 422, 424, 426 may be about 140 mm.

[0092] The arrangement of the first air moving device 420 relative to the components and expansion slots in the first area allows various components to be added or removed from the electronic device 400 without substantially affecting the airflow path through the electronic device 400. While adding components to a conventionally configured computer may result in airflow blockages and dead spots, the use of the area and the first air moving device 420 extending substantially the entire height of the first area allows airflow to be provided to the components regardless of whether additional components have been added or removed, thereby achieving a desired level of airflow and heat dissipation compatible with a highly modular and customizable design. Fig.10 Additional details of the interior of electronic device 400 are provided.

[0093] Fig.10 A perspective view of the interior of the electronic device 400 is shown. Fig. 9 The right side of the electronic device 400 including the first area is shown, Fig.10 The left side of the electronic device 400 including the second area is shown. Figure 4-Figure 6 As described above, components such as the main logic board 430 may divide the internal volume into multiple areas. Fig. 9 The components described are connected to one side or surface of the main logic board 430, but the electronic device 400 may include components disposed in the second region and connected to a second different side of the main logic board 430. In some examples, the electronic device 400 may include one or more memory modules 432, 434, 436, such as dual in-line memory modules (DIMMs). The memory modules 432, 434, 436 may be positioned and electrically connected to the main logic board 430. The electronic device 400 may also include a storage device, for example in the form of a drive such as a solid state drive (SSD) 438. The SSD 438 may be disposed in the second region and may also be positioned on the main logic board 430. The SSD may be electrically connected to one or more other components of the electronic device 400.

[0094] The air movement system of the electronic device 400 may also include a second air moving device 428 positioned in the second area. In this example, the second air moving device 428 may include a blower 428 to move air from the second area to the surrounding environment through the housing, such as through a hole formed in the housing. In this way, the second air moving device 428 can generate a negative air pressure in the second area relative to the surrounding environment. Generating a negative air pressure in the second area causes air to flow between components in the second area. Although the second air moving device 428 is described as a blower, in some examples, any suitable component capable of moving air or generating airflow may be included in the first air moving device 420. As used herein, the term blower may refer to a centrifugal fan, which may include, for example, an impeller and a duct housing to guide the air moved by the impeller.

[0095] The electronic device 400 may include an interface panel 442, which may be substantially similar to the interface panel 442 of the embodiment of the present invention. Figure 3 The interface panel 220 described above. The interface panel 442 may also include various ports that can be used to transfer data and / or power between the electronic device 400 and various external systems. For example, the interface panel 442 may include an alternating current (AC) power input port 419, which may be sized and shaped to receive a power plug of a power supply unit 418 suitable for transmitting external power to the electronic device 400. The interface panel 442 may also include one or more holes, holes, or perforations that allow air to move through the interface panel 442. For example, the interface panel may be located at an edge of an area such as the first area, and air may be moved from the first area to the surrounding environment through the interface panel 442. Refer to the following Fig.11 Additional details of the regions and modular nature of the electronic device 400 are provided.

[0096] Fig.11 An exploded view of an electronic device 400 including a base 440, components disposed in an internal volume, and an air movement system is shown. As described herein, a component (in this example, a main logic board 430 disposed within the internal volume) can be used to divide the internal volume into multiple regions. In this example, the main logic board 430 spans two major dimensions of the internal volume defined by the housing, thereby dividing the internal volume into two regions. In addition, the first region and the second region can be fluidly isolated from each other except at one or more desired locations.

[0097] In some examples, the electronic device 400 may also include one or more seals that prevent airflow at undesirable locations, such as locations between regions defined by the main logic board 430. In use, when the housing is located on the electronic device, the main logic board 430 and the housing together prevent airflow between regions by providing a physical barrier to airflow. Therefore, it may not be desirable to have unexpected or unintentional gaps or spaces where the housing and the main logic board 430 meet, because these gaps may allow undesirable airflow and inhibit the generation of pressure differences between these regions, as described herein. In order to ensure that the regions are fluidly isolated from each other except for the desired location, one or more sealing components may be used to form an airtight seal at the desired location between the housing and the main logic board 430. In this example, the seal or sealing component 452 may at least partially surround the main logic board 430, and in some examples may substantially surround the entire perimeter of the main logic board 430. The seal 452 may include any compressible or compliant material as desired, such as a polymer material such as rubber that is capable of forming a substantially airtight seal between components of the electronic device 400. The alignment of the housing and components, such as main logic board 430, can cooperate with seal 452 to form a substantially airtight barrier when the housing is positioned on electronic device 400. For example, the housing and main logic board 430 can apply pressure to seal 452 to form a substantially airtight barrier.

[0098] In some examples, electronic device 400 can include one or more additional sealing components, for example, at any location in device 400 where airflow is not desired. In some examples, seal 454 can at least partially surround one or more other components of electronic device 400, such as first air moving device 420. In this example, seal 454 substantially surrounds first air moving device 420 and cooperates with the housing to prevent airflow from the first area from returning to the surrounding environment at that location. In some examples, where the first area has positive air pressure, a seal such as seal 454 can help prevent or inhibit backflow, i.e., airflow from the first area to the surrounding environment at an undesirable location.

[0099] In some examples, the regions may be fluidly isolated by a main logic board 430 that is substantially impermeable to airflow except at one or more desired locations. In this way, the main logic board 430 is used to selectively inhibit the movement of air between the first region and the second region except at desired locations. Therefore, in some examples, components such as the main logic board 430 may include or be composed of a material that is substantially impermeable to airflow. In order to control the airflow between the regions, the main logic board 430 may include a hole or through hole 460 that can be used to fluidly connect the first region and the second region and allow air to flow predictably between the regions through the hole 460. As further described herein, in some examples, one region may have a positive air pressure and another region may have a negative air pressure. Therefore, the relative pressure of each region will drive the air to flow from the positive air pressure region to the negative air pressure region, and the hole 460 provides a path of least resistance for such flow to occur, thereby controlling the position of the airflow between the regions.

[0100] Fig.11 Also shown, the arrangement of components (e.g., components 411, 413, 414, 416, and 418) in the first region of the interior volume can maximize or increase the surface area of ​​the components exposed to air moved by the first air moving device 420. In some examples, one or more of these components can include a heat sink, such as a heat sink in the form of a highly thermally conductive material that can transfer heat between an operating portion of the component and the air passing therethrough. The orientation of these components relative to the airflow driven by, for example, the first air moving device 420 (enabled by the dual-sided configuration of the main logic board 430) can allow for the maximization of the heat sink surface area exposed to the flowing air, as compared to conventional computer and electronic device architectures. Referring to FIG. 4B , FIG. 4B , FIG. 4C , FIG. 4D ... Figure 12-13 Additional embodiments of the structure and arrangement of an electronic device including a housing defining an interior volume divided into one or more regions by one or more components within the interior volume are described.

[0101] Fig.12 A perspective view of a component of an electronic device, such as a main logic board 530, is shown. In some examples, the electronic device can be substantially similar to and include some or all of the features of electronic devices 100, 200, 300, and 400 described herein. Additionally, the main logic board 530 can be substantially similar to and include some or all of the features of components 330 and 430 described herein.

[0102] In this example, the main logic board 530 may be, for example, a printed circuit board including a polymer substrate. In some examples, the main logic board 530 may include any substrate material as desired, such as a composite material such as a fiberglass material, a polymer-based composite material, a metal, and combinations thereof. The main logic board 530 may include a first surface 532 and a second surface 534 disposed opposite the first surface 532. However, in some examples, the main logic board 530 may have substantially any shape and amount or orientation of surfaces as desired.

[0103] As shown, in some examples, one or more components of the air movement system of the electronic device may be attached to or otherwise connected to the first surface 532 of the main logic board 530. In some examples, the first air moving device 520 (including the first fan 522, the second fan 524, and the third fan 526) may be connected to the main logic board 530. In this way, the main logic board 530 and the first air moving device 520 can cooperate to fluidly isolate the first area from the second area and the surrounding environment. As described herein, other components of the electronic device may be directly connected to the first surface 532 of the main logic board 530, for example, by welding or other fixing methods. In some examples, the first surface 532 of the main logic board 530 may include one or more expansion slots. For example, the first surface 532 of the main logic board 530 may include one or more computer expansion bus interconnects. In some examples, the computer expansion interconnect may be a serial or parallel computer expansion bus interconnect, such as a PCI or PCIe slot. Interconnects 561, 562, 563, 564, 565, 566, 567, 568, 569, and 570 may allow a user to add and connect additional components to the electronic device as needed to implement additional functionality. Fig.12 A specific arrangement of interconnects 561, 562, 563, 564, 565, 566, 567, 568, 569, and 570 is shown, but it should be understood that they can be arranged on the first surface 532 of the main logic board 530 in substantially any orientation. In some examples, the arrangement of interconnects 561, 562, 563, 564, 565, 566, 567, 568, 569, and 570 can allow one or more components to be easily removed, added, or replaced as described herein, thereby providing modularity and configurability for the electronic device. In some examples, the main logic board 530 can therefore include 10 interconnects, 11 interconnects, 12 interconnects, or even more.

[0104] The main logic board 530 may define a hole or through hole 560. The hole 560 can be used to provide a fluid communication path between pressure areas on either side of the main logic board 530, as described herein. In some examples, the hole 560 can have a substantially rectangular shape, as shown. In some examples, the hole 560 can have any shape or size as desired, determined by, for example, the desired level of airflow through the hole 560. In some examples, the main logic board 530 can define multiple holes as desired. In some examples, multiple holes can be located at the approximate location of the hole 560, or can be positioned anywhere on the main logic board 530 as needed to provide a desired level of airflow therethrough. Refer to the following Fig.13 Additional details of the main logic board 530 are provided.

[0105] Fig.13 Another perspective view of the main logic board 530 is shown, showing a second surface 534 disposed substantially opposite the first surface 532. As described herein, the main logic board 530 can include electronic components disposed on two opposing sides, thereby allowing components of the electronic device to be positioned in different pressure zones for optimal cooling and thermal management while still providing easy access for a user or technician. While components such as the CPU and GPU can be connected to the first surface 532 of the main logic board 530, other components such as memory components can be positioned on the second surface 534.

[0106] In some examples, the main logic board 530 may include a plurality of slots 571 or connections that may accommodate modules, such as memory modules that may be connected to the electronic device. In some examples, one or more memory modules 572, such as dual in-line memory modules (DIMMs), may be connected to the main logic board 530. The main logic board 530 may also include components such as a heat sink 574 disposed on the second surface 534. Likewise, the location of components such as the heat sink 574 on the second surface 534 allows air to flow through the heat sink 574 to provide cooling and thermal management without interrupting or obstructing airflow to other components, such as those located on the first surface 532. As discussed, the air movement system of the electronic device may include a second air moving device, such as a blower 528. In some examples, the blower 528 may be connected or attached to the main logic board 530, such as via any manner of attachment features in the blower housing and / or the main logic board 530. In some examples, the blower 528 may be at least partially positioned above all or some of the holes 560 of the main logic board 530 or may cover or enclose all or some of the holes of the main logic board. In this way, the blower 528 can move air from the first area into the second area and away from the electronic device. That is, the blower 528 can draw or suck air from the first area through the holes 560 as described herein to generate airflow between the areas, as well as provide negative air pressure in the second area. The second air moving device may also include a panel 580, which can be used to further seal or isolate the second area when in use, for example by preventing air from the surrounding environment at the location of the panel 580 from flowing into the second area. The panel 580 may also include a cutout, through hole or hole 575, which can be aligned with the exhaust port of the blower 528 to allow the blower to exhaust air from the second area into the surrounding environment. Reference is made below Figure 14-16 Exemplary embodiments of components that may be incorporated into the electronic devices detailed above are described.

[0107] Fig.14 A perspective view of a component of an electronic device, in this example a power supply unit 600, is shown. The power supply unit 600 can be a component of any electronic device described herein, including electronic devices 100, 200, 300, and 400. The power supply unit 600 can also be substantially similar to and include any of the features of the power supply units 318 and 418 described herein.

[0108] As will be further explained herein, in some examples, it may be desirable to flow air directly over or through ultra-high power components of an electronic device. In some examples, such components may be positioned directly in an airflow path within the internal volume of the electronic device, such as at a location of communication between a positive air pressure region and a negative air pressure region. In this way, a relatively large volume of air may be moved over or through the components to provide a desired level of thermal energy removal and thermal management for the components (such as power supply unit 600) and the entire electronic device.

[0109] In some examples, as described herein, the power supply unit 600 may be positioned in an airflow channel because it is typically the densest component of the electronic device and prevents the greatest obstruction to airflow. Therefore, it may be desirable to position the power supply unit 600 in a high-volume airflow channel. Additionally, in some examples, the power supply unit 600 may be responsible for up to about 10% of the power, and therefore up to about 10% of the generated heat energy, for components within the internal volume of the electronic device. Therefore, in some examples, it may be desirable to provide a high level of airflow to the power supply unit 600, thereby providing a high level of cooling.

[0110] The power supply unit 600 may include a housing or body 606 that may define an outer surface of the power supply unit 600. The power supply unit 600 may also include a connector 602 that may, for example, be connected to an expansion slot or other interface on a main logic board as described herein. Such a connection may allow the electronic device to control the power supply unit 600 and the power distributed from the power supply unit 600. The alternating current (AC) power input port 604 of the power supply unit 600 may be used to connect to an external source of AC power, which the power supply unit may convert to DC power for use by components of the electronic device. Fig.15 and Fig.16 Further details of the power supply unit 600 are provided.

[0111] Fig.15 A side view of a power supply unit 600 including a heat sink 608 is shown. The heat sink 608 can be thermally connected to the power supply unit to help distribute heat energy generated by the power supply unit 600 to air flowing through the power supply unit 600. In some examples, the heat sink 608 can include any high thermal conductivity material, such as a metallic material, such as copper, aluminum, and other metals or alloys. In use, when air moved by an air movement system of an electronic device moves over the heat sink 608, the heat energy is transferred to the air, and the air is then exhausted from the electronic device into the surrounding environment, thereby cooling the power supply unit 600 and the device.

[0112] Fig.16A top view of a power supply unit 600 is shown. As can be seen, in some examples, the heat sink 608 can be recessed in the body 606 of the power supply unit 600. The recess can provide a path for air to flow to the heat sink 608 and through the power supply unit 600, thereby facilitating thermal management. In some examples, the recess can align with a hole in a main logic board of an electronic device to provide an airflow path between pressure areas of the device.

[0113] As described above, any number or variety of components may be included in an electronic device. The components may include any combination of the features described herein, and may be arranged in any of the configurations described herein. The structure and arrangement of an electronic device including a housing defining an internal volume (divided into one or more regions by one or more components within the internal volume), and the concepts regarding regional pressures and airflows may apply not only to the specific examples discussed herein, but to any combination of any number of embodiments. Figure 17-Figure 19 Various embodiments of electronic devices are described that include components having various features in various arrangements.

[0114] Fig.17 Shown with Figure 4 Schematic cross-sectional view of electronic device 700 similar to electronic device 300 shown. Like electronic device 300, electronic device 700 may include housing 701 similar to housing 201 described herein, and a component 730 that can divide the internal volume defined by housing 701 into a first volume or area (702, as shown) and a second volume or area 703, as shown. Fig.18 and Fig.19 Component 730 may define holes 760 that provide fluid communication between the regions. In some examples, component 718 may be positioned to at least partially cover or obscure hole 760 so that air is forced through or around component 718 to pass through hole 760. Electronic device 700 may also include a first air moving device 720 that includes a first fan 722, a second fan 724, and a third fan 726 that are substantially similar to first air moving device 320.

[0115] Fig.17 Black arrows are included to show the direction of airflow into and within the electronic device 700. In this example, the first air moving device 720 pushes air from the surrounding environment into the first area 702 through the housing 701. The air from the surrounding environment can pass through various holes or holes in the surface of the housing, as described herein. The pushed air can then flow through the first area 702, where it can pass through and be heated by the components in the first area 702. The first air moving device 720 that pushes air into the first area can cause the first area to have a positive air pressure relative to the surrounding environment.

[0116] In some examples, some of the air within the first region 702 may then continue to flow through the first region where the air may be returned to the surrounding environment, for example, through holes or apertures in the housing positioned opposite the first air moving device 720, as described herein. When the air is heated by the components within the first region 702, the removal of air from the interior volume of the electronic device 700 also results in the removal of heat energy, thereby cooling the electronic device 700. In some examples, some of the air in the first region 702 may pass through the holes 760 defined by the components 730 and enter the second region 703. This airflow is Figure 17 to Figure 18 Indicated by dotted lines.

[0117] Fig.18 Shown with Figure 5 A schematic cross-sectional view of an electronic device 700 similar to the electronic device 300 is shown. Fig.18 Black arrows are included to show the direction of airflow into and within the electronic device 700. In this example, the second air moving device 728 draws air from the first region 702 and the surrounding environment into the second region 703, and then exhausts it to the surrounding environment through the housing 701, such as through the holes or apertures described herein. The second air moving device 728 can create a negative air pressure in the second region 703 relative to the surrounding environment, thereby drawing air into the second region 703 through the housing 701, wherein the air can pass over and be heated by components in the second region 703 before exiting the second region 703 through the housing. The second air moving device 728 can also move air from the first region 702 to the surrounding environment through the aperture 760, which can be at least partially aligned with the inlet of the second air moving device 728. Reference is made below to Fig.19 Additional details of airflow within electronic device 700 are provided.

[0118] Fig.19 700 is a schematic top view of an electronic device including a housing 701 defining an interior volume thereof and a component 730 dividing the interior volume into a first area 702 and a second area 703 as described herein. Likewise, the electronic device 700 may be substantially similar to Figure 6 An electronic device 300 is shown. Fig.19 The dashed thick arrows shown in the figure show that Fig.17 and Fig.18As described, airflow into, out of, and through the electronic device 700. That is, as shown, the first air moving device 720 and the second air moving device 728 cooperate to provide airflow through the area of ​​the device 700 and generate positive air pressure in the first area 702 and negative air pressure in the second area 703. The first area 702 and the second area 703 are substantially fluidly isolated from each other by the component 730 except at the desired location of the hole 760, where air can flow from the positive pressure first area 702 to the negative pressure second area 703 to assist in thermal management of the electronic device 700. hereinafter referred to as Figure 20-22B Additional examples of electronic devices are described that include components having various features in various arrangements.

[0119] Fig. 20 800 according to an example. The electronic device 800 may be substantially similar to, and may include, Figure 7-Figure 11 Any combination of the features and components of the electronic device 400 described above. As with the electronic device 400, the electronic device 800 may include a housing (not shown) that may substantially surround and enclose the components of the electronic device 800 and may define an internal volume in which the components reside. The electronic device 800 may include a main logic board 830 that may divide and separate the internal volume into one or more regions, such as a first region and a second region. Fig. 20 A view of a first region of an interior volume of an electronic device 800 is provided. In this example, a main logic board 830 is sized and positioned within the interior volume defined by the housing such that the main logic board 830 extends substantially the entire height and width of the interior volume, thereby dividing the interior volume into a first region located on one side of the main logic board 830 and a second region located on another opposing side of the main logic board 830, e.g., as shown relative to Figure 4-Figure 6 and Figure 7-Figure 11 The main logic board 830 may define holes 860 that provide fluid communication between the regions. In some examples, components such as the power supply unit 818 may be positioned to at least partially cover or shield the holes 860 so that air is forced through or around the power supply unit 818 to pass through the holes 860.

[0120] As described with respect to electronic device 400, electronic device 800 may include a first air moving device 820, which may include one or more air moving components, such as fans. In this example, air moving system 820 may move air from the surrounding environment, through some or all of air moving system 820, through holes in a housing, for example, to create a positive air pressure in the first area relative to the surrounding environment. First air moving device 820 may include a first fan 822, a second fan 824, and a third fan 826. Fans 822, 824, 826 may be attached together and secured to electronic device 800. For example, as shown, first air moving device 820 may extend substantially the entire height of electronic device 800, thereby effectively moving a wall of air into the first area. In some examples, first air moving device 820 may move air past and / or through some or all of the components located in the first area, such as Fig. 20 In some examples, the speed of each fan 822, 824, 826 can be independently controlled, for example, by a processor of the electronic device 800, to produce a desired location and amount of airflow into the first volume. In some examples, some of the air in the first region can pass through the hole 860 defined by the power supply unit 818 and enter the second region, for example, into the inlet of a blower disposed in the second region described herein. Fig.21 Details are provided regarding the air flow in the second region.

[0121] Fig.21 Shown with Figure 7-Figure 11 The electronic device 800 is similar to the electronic device 400 shown and includes a schematic cross-sectional view with arrows depicting airflow. In this example, a second air moving device (e.g., a blower 828) draws air from the first area and the surrounding environment into the second area and through the second area. In some examples, the blower 828 may also push air from the second area into the surrounding environment through the housing, such as through a hole or aperture, as described herein. The blower 828 may create a negative air pressure in the second area relative to the surrounding environment, thereby drawing air into the second area through the housing, wherein the air may pass over and be heated by components in the second area before exiting the second area through the housing, such as through an exhaust outlet 875 of the blower 828. The blower 828 may also move air from the first area to the surrounding environment through an aperture 860, which may be at least partially aligned with an inlet of the blower 828. Reference is made below to Fig.22A and Fig. 22B Details regarding combined airflow patterns within electronic device 800 are provided.

[0122] Fig.22A and Fig. 22B800 is shown as a schematic top view of an electronic device including a housing 801 defining an interior volume thereof and a main logic board 830 dividing the interior volume into a first area 802 and a second area 803 as described herein. Likewise, the electronic device 800 may be substantially similar to Figure 7-Figure 11 An electronic device 400 is shown. Fig.22A and Fig. 22B The dashed thick arrows shown in FIG. 1 show the Fig. 20 and Fig.21 As described, airflow into, out of, and through the electronic device 800. The fans and blowers 828 of the first air moving device 820 can cooperate to provide airflow through the areas of the device 800 and create a positive air pressure in the first area 802 combined with a negative air pressure in the second area 803. The first area 802 and the second area 803 are substantially fluidly isolated from each other by the main logic board 830 except at the desired location of the hole 860, where air can flow from the positive pressure first area 802, through the power supply unit 818, into the negative pressure second area 803 to assist in thermal management of the electronic device 800, for example, thermal management of components such as the MIMM 815.

[0123] As mentioned above, one aspect of the present technology is to collect and use data from various sources. The disclosure contemplates that, in some instances, these collected data may include personal information data that uniquely identifies or can be used to contact or locate a specific person. Such personal information data may include demographic data, location-based data, phone numbers, email addresses, twitter IDs, home addresses, data or records related to the user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other identifying information or personal information.

[0124] The present disclosure recognizes that the use of such personal information data in the present technology can be used to benefit the user. In addition, the present disclosure also anticipates other uses of personal information data that benefit the user. For example, health and fitness data can be used to provide insights into the user's overall health or can be used as positive feedback to individuals using technology to pursue health goals.

[0125] This disclosure envisions that entities responsible for collecting, analyzing, disclosing, transmitting, storing or otherwise using such personal information data will comply with established privacy policies and / or privacy practices. Specifically, such entities should implement and adhere to privacy policies and practices that are recognized as meeting or exceeding industry or government requirements for maintaining the privacy and security of personal information data. Such policies should be easily accessible to users and should be updated as the collection and / or use of data changes. Personal information from users should be collected for legitimate and reasonable purposes of the entity and not shared or sold outside of these legitimate uses. In addition, such collection / sharing should be performed after receiving the user's informed consent. In addition, such entities should consider taking any necessary steps to defend and safeguard access to such personal information data and ensure that others who have access to personal information data comply with their privacy policies and processes. In addition, such entities may subject themselves to third-party assessments to demonstrate their compliance with widely accepted privacy policies and practices. In addition, policies and practices should be adjusted to specific types of personal information data collected and / or accessed, and to applicable laws and standards including specific considerations of jurisdiction. For example, in the United States, the collection or access of certain health data may be governed by federal and / or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA), while health data in other countries may be subject to other regulations and policies and should be handled accordingly. Therefore, different privacy practices should be maintained in each country for different types of personal data.

[0126] Regardless of the foregoing, the present disclosure also contemplates implementation schemes in which users selectively block the use or access of personal information data. That is, the present disclosure contemplates providing hardware elements and / or software elements to prevent or block access to such personal information data. For example, the present technology may be configured to allow users to “opt in” or “opt out” of participating in the collection of personal information data at any time during or after registration for a service. In addition to providing “opt in” and “opt out” options, the present disclosure contemplates providing notifications related to access or use of personal information. For example, a user may be notified that their personal information data will be accessed when downloading an application, and then be reminded again just before the personal information data is accessed by the application.

[0127] In addition, it is an object of the present disclosure that personal information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use. Risks can be minimized by limiting data collection and deleting data once it is no longer needed. In addition, and when applicable, including in certain health-related applications, data de-identification can be used to protect the privacy of users. De-identification can be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at the city level rather than at the address level), controlling how data is stored (e.g., aggregating data between users), and / or other methods when appropriate.

[0128] Therefore, while the present disclosure broadly covers the use of personal information data to implement one or more of the various disclosed embodiments, the present disclosure also contemplates that various embodiments may be implemented without access to such personal information data. That is, various embodiments of the present technology will not fail to function properly due to the lack of all or part of such personal information data.

[0129] As used herein, the terms exterior, outside, interior, inside, top, and bottom are used for reference purposes only. An exterior portion or exterior portion of a component may form a portion of an exterior surface of a component, but may not necessarily form the entire exterior of the exterior surface of the component. Similarly, an interior portion or interior portion of a component may form or define an interior portion or interior portion of a component, but may also form or define a portion of an exterior surface or exterior surface of a component. In some orientations of a component, a top portion of a component may be located above a bottom portion of the component, but may also be in line with, below, or in other spatial relationships to the bottom portion depending on the orientation of the component.

[0130] Various inventions are described herein with reference to certain specific embodiments and examples. However, those skilled in the art will recognize that many variations may be made without departing from the scope and spirit of the invention disclosed herein, as those inventions set forth in the following claims are intended to cover all variations and modifications disclosed herein without departing from the spirit of the invention. The terms "including" and "having" as used in the specification and claims shall have the same meaning as the term "comprising".

[0131] For the purpose of illustration, the foregoing description uses specific nomenclature to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that the embodiments can be practiced without specific details. Therefore, for the purpose of illustration and description, the foregoing description of the specific embodiments described herein is presented. They are not intended to be exhaustive or to limit the embodiments to the precise form disclosed. It will be apparent to those of ordinary skill in the art that, in view of the above teachings, many modifications and variations are feasible.

Claims

1. A housing for an electronic device, comprising: a housing at least partially defining an interior volume, the housing comprising: top panel, bottom panel, left panel, and right panel; The left panel and the right panel at least partially define an exterior surface of the electronic device and at least partially define the interior volume; A tubular frame, the tubular frame comprising: a first pair of tubular support members extending from the bottom panel and disposed within the interior volume; a second pair of tubular support members extending from the bottom panel and disposed within the interior volume; a first tubular top frame member disposed outside the interior volume and connected to an end of each of the first pair of tubular support members through an opening defined by the top panel; a second tubular top frame member disposed outside the interior volume and connected to an end of each of the second pair of tubular support members through an opening defined by the top panel; and At least one of the left panel or the right panel is configured to be removable from the tubular frame and portions of the housing.

2. The housing according to claim 1, wherein the housing further comprises: a front panel at least partially defining the exterior surface, the front panel defining a first plurality of apertures extending therethrough; and A rear panel is disposed opposite the front panel and at least partially defines the exterior surface, the rear panel defining a second plurality of apertures extending therethrough.

3. The housing according to claim 2, wherein: The left panel and the right panel are disposed between the front panel and the rear panel to at least partially define the outer surface.

4. The housing according to claim 2, wherein: At least one of the front panel or the back panel includes a three-dimensional structure including a plurality of spherical grooves defining the first plurality of holes or the second plurality of holes.

5. The housing according to claim 1, wherein The tubular frame also includes an interface panel that at least partially defines an exterior surface of the electronic device, the interface panel including at least one data port.

6. The housing according to claim 1, wherein The first tubular top frame member includes a handle.

7. The housing according to claim 1, wherein: The first tubular top frame member is integral with the first pair of tubular support members.

8. The housing according to claim 1, wherein: The first tubular top frame is a separate component from the first pair of tubular support members.

9. A housing assembly for an electronic device, comprising: a tubular frame configured to receive and support a computing component; a base plate attached to the tubular frame and at least partially defining an exterior surface of the electronic device; a top panel attached to the tubular frame, at least a portion of the tubular frame extending through an opening defined by the top panel; an interface panel attached to the tubular frame and at least partially defining the exterior surface, the interface panel including a data port; and a left panel and a right panel at least partially defining the exterior surface and at least partially defining an interior volume and at least a portion of the tubular frame, the left panel and the right panel being removably attached to the tubular frame, Wherein, the tubular frame is disposed within the internal volume.

10. The housing assembly of claim 9, further comprising a front panel defining a plurality of interconnected through holes in communication with the interior volume.

11. The housing assembly according to claim 9, wherein: The tubular frame includes a tubular support member extending from the base plate into the interior volume.

12. The housing assembly according to claim 11, wherein: The tubular frame includes at least four tubular support members, each tubular support member being disposed proximate a corner of the base plate.

13. The housing assembly according to claim 9, wherein: The left panel and the right panel include aluminum.

14. The housing assembly according to claim 9, wherein: The tubular frame includes a foot configured to support the electronic device, the foot extending through an opening defined by the base plate.

15. A housing assembly for an electronic device, comprising: Tubular frame; a front panel defining a first plurality of apertures extending therethrough; a rear panel defining a second plurality of apertures extending therethrough; Left panel; right panel; Bottom panel; and a top panel defining an opening through which a portion of the tubular frame extends; The front panel, the rear panel, the left panel, the right panel, the top panel and the bottom panel define an outer surface and an inner volume of the electronic device, at least the left panel and the rear panel are removably coupled to the tubular frame, Wherein, the tubular frame is disposed within the internal volume.

16. The housing assembly of claim 15, wherein: The first plurality of pores comprises an interconnected network of channels in communication with the interior volume.

17. The housing assembly of claim 15, wherein: The rear panel includes a first portion including one or more data ports and a second portion removably coupled to the housing assembly and the first portion.

18. The housing assembly of claim 15, wherein: The tubular frame is at least partially disposed within the interior volume and is configured to receive and support a plurality of electronic components.

19. The housing assembly of claim 18, wherein: The portion of the tubular frame at least partially defines a handle.

20. The housing assembly of claim 15, wherein: The first plurality of apertures and the second plurality of apertures allow air to move from an external environment through the interior volume.

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