Circuit board defect image verification display method, device, equipment and storage medium

Abstract

The application discloses a circuit board defect image verification display method and device, equipment and a storage medium, and relates to the field of image detection. In response to receiving a selection operation of a target defect image in a re-inspection interface, the target defect image is enlarged, and a defect enlarged image is displayed in a defect display area. In response to the enlargement operation of the target defect image, a target pcs corresponding to the target defect image is determined, and is displayed by being marked on a panoramic material image of the re-inspection interface. In response to receiving a verification display operation of the target defect image, a no-defect verification image corresponding to the target pcs is displayed in the defect display area, and is synchronously displayed with the defect enlarged image. According to the scheme, the defect image, the corresponding no-defect verification image and the panoramic material image are displayed on the re-inspection page, and the defect is marked and displayed on the panoramic material image, so that the material defect condition can be directly observed and verified, and the re-inspection efficiency and the re-inspection accuracy are effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of image display, and in particular to a circuit board defect image verification display method and device, equipment and a storage medium. BACKGROUND

[0002] In the production process of semiconductor chips, a strip material plate is punched on a produced PCB circuit board, and a plurality of pcs particles are distributed on the material plate. The pcs is the smallest component particle or the smallest component unit of the PCB, and a plurality of electronic components are included in the area. However, due to environmental and equipment precision problems, defects, spots and defects will inevitably occur in the pcs particle punching production process. Although the material plate needs to be automatically scanned and filtered by a machine in the early production stage, the defects identified by the machine need to be rechecked by manual operation in the later stage to screen the qualified PCBs for subsequent production processes.

[0003] In the related art, the operation process of manual rechecking needs personnel to check the images identified by the machine one by one. Specifically, the defect image is enlarged and processed, and then matched and verified with the on-site material plate to ensure the detection accuracy. This manual rechecking method needs to consider the size of the material plate and the image display accuracy. The operator needs to continuously adjust the camera and observe the actual material plate image and the defect image, which is low in operation efficiency and low in rechecking accuracy. SUMMARY

[0004] The embodiments of the present application provide a circuit board defect image verification display method, device, equipment and storage medium, which solves the problem of low efficiency of manual verification.

[0005] In one aspect, the present application provides a circuit board defect image verification display method, which comprises:

[0006] In response to receiving a selection operation of a target defect image in a rechecking interface, the target defect image is enlarged, and a defect enlarged image is displayed in a defect display area. The target defect image is a pcs defect image scanned on a material plate by a line scanning camera and identified by a machine. Each target defect image includes at least one defect point.

[0007] In response to the enlargement operation of the target defect image, a target pcs corresponding to the target defect image is determined, and a target pcs corresponding to the target defect image is displayed on a panoramic material image of the rechecking interface.

[0008] In response to receiving a verification display operation of the target defect image, a non-defect verification image corresponding to the target pcs is displayed in the defect display area, and the non-defect verification image is displayed synchronously with the defect enlarged image. The non-defect verification image and the target pcs with defects have a one-to-one correspondence.

[0009] Further, the review interface is provided with a material display area, wherein a panoramic material image scanned and transmitted by the line scan camera is displayed, and the panoramic material image displays a plurality of pcs images, and the target defect image is obtained by intercepting a defect point identified in the panoramic material image.

[0010] Further, the review interface is further provided with an image display list, and the image display list includes all pcs defect images identified and intercepted from the panoramic material image.

[0011] In response to receiving a selection operation of the target defect image in the image display list, the defect zoomed-in image is displayed in the defect display area.

[0012] Further, the image display list further includes pcs number information, picture classification information, defect type information and identification results; the pcs number information is used to indicate the position number of the pcs on the material plate, the picture classification information is used to indicate the position area of the defect on the pcs, the defect type information is used to indicate the type of the defect identified by the machine, and the identification result is used to indicate that the target pcs is a defective material, for the operator to review and screen.

[0013] Further, all pcs defect images in the image display list are established with position index tags based on the pcs number information and the picture classification information; in response to receiving the selection operation of the target defect image, the target position index tag corresponding to the target defect image is positioned and marked on the panoramic material image.

[0014] Further, the review interface is further provided with a verification display control for the operator to perform a verification display operation.

[0015] In response to receiving the verification display operation of the target defect image, the material number of the panoramic material image is used to query a panoramic image database to obtain a defect-free panoramic image matched with the panoramic material image.

[0016] Based on the target defect image and the position index tag corresponding to the target pcs, the defect-free verification image with a coordinate position matched with the target defect image is intercepted from the defect-free panoramic image.

[0017] The defect-free verification image is set to have the same resolution and size as the target defect image, and the defect-free verification image and the defect zoomed-in image are synchronously displayed in the defect display area.

[0018] Further, the review interface is further provided with a verification display control for the operator to perform a verification display operation.

[0019] In response to receiving the check display operation of the target defect map, a defect-free pcs check map matching the target is obtained according to the material number and pcs number information corresponding to the target defect map, wherein the pcs image database stores a plurality of defect-free pcs image check lists, the pcs image check lists are classified according to the material number, and each pcs image check list contains all pcs images on the corresponding material;

[0020] The defect-free check map is intercepted from the defect-free pcs check map to adapt to the coordinate position of the target defect map.

[0021] The defect-free check map is set to the same resolution and size as the target defect map, and the defect-free check map and the defect magnified map are synchronously displayed in the defect display area.

[0022] In another aspect, the application provides a circuit board defect image check display device, the device comprising:

[0023] The magnification display module is configured to, in response to receiving a selection operation of a target defect map in the review interface, magnify the target defect map and display a defect magnified map in the defect display area, wherein the target defect map is a pcs defect image scanned on a material board by a line scan camera and machine-recognized, and each target defect image contains at least one defect point.

[0024] The annotation display module is configured to, in response to the magnification operation of the target defect map, determine a target pcs corresponding to the target defect map and display an annotation on a panoramic material map of the review interface.

[0025] The check display module is configured to, in response to receiving a check display operation of the target defect map, display a defect-free check map corresponding to the target pcs in the defect display area synchronously with the defect magnified map, wherein the defect-free check map and the target pcs with defects have a one-to-one correspondence.

[0026] In yet another aspect, the application provides a computer device comprising a processor and a memory, wherein the memory stores at least one instruction, at least one program, a code set or an instruction set, and the at least one instruction, the at least one program, the code set or the instruction set is loaded and executed by the processor to implement the circuit board defect image check display method of the above-mentioned aspects.

[0027] In yet another aspect, the present application provides a computer readable storage medium, wherein the readable storage medium stores at least one instruction, at least one program, a code set or an instruction set, which are loaded and executed by a processor to implement the circuit board defect image verification display method in the above aspect.

[0028] The technical scheme provided by the embodiments of the present application has at least the following beneficial effects: by setting a panoramic display area and a defect display area in the re-inspection interface, the defect display area displays and enlarges the target defect image selected by the operator, and the panoramic display area displays and marks the panoramic material image according to the enlargement operation on the target defect image, so that the operator can clearly know the specific position of the defect on the material board; and in order to improve the accuracy of defect re-inspection, the defect-free verification image corresponding to the target defect image is displayed side by side in the defect display area, and the defect-free verification image represents the image of a normal defect-free target pcs, and thus can be used as a defect contrast for the target defect image, so as to realize re-inspection and verification of the machine recognition result, and improve the re-inspection efficiency and accuracy. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a scene schematic diagram of a re-inspection system for strip material re-inspection;

[0030] Figure 2 is a flowchart of the circuit board defect image verification display method provided by the embodiments of the present application;

[0031] Figure 3 is an interface schematic diagram of displaying a defect enlarged image in a re-inspection interface;

[0032] Figure 4 is an interface schematic diagram of marking a defect pcs in a panoramic material image in a re-inspection interface;

[0033] Figure 5 is an interface schematic diagram of displaying an image display list in a re-inspection interface;

[0034] Figure 6 is an interface schematic diagram of starting synchronous verification display through a verification display control;

[0035] Figure 7 is a structural schematic diagram of the circuit board defect image verification display device provided by the embodiments of the present application;

[0036] Figure 8 is a structural block diagram of a computer device provided by an exemplary embodiment of the present application. DETAILED DESCRIPTION

[0037] For the purpose, technical solutions and advantages of the present application to be clearer, the embodiments of the present application will be described in further detail below with reference to the drawings.

[0038] "Multiple" referred to herein means two or more. "And / or", describing the relationship between the associated objects, means that there can be three relationships, for example, A and / or B, which can mean that A exists alone, A and B exist together, and B exists alone. The character " / " generally represents that the associated objects before and after are in an "or" relationship.

[0039] Figure 1 is a scene diagram of a re-inspection system for strip material re-inspection provided by the embodiments of the present application, which includes a computer device, a database and a line scanning camera. The line scanning camera is located above the strip material on the assembly line, and is used to scan the panoramic image of each material, i.e. the panoramic material image. The computer device runs the re-inspection system, and is linked with the line scanning camera and the database. The panoramic material image contains a plurality of pcs images. For the pcs with defects, the re-inspection system will find the pcs defect image obtained by cutting during the defect detection process, and transmit it to the re-inspection system for storage and display, for manual re-inspection by the operator. The database is a server or other computer device for storing defect-free images, and its purpose is to perform defect matching verification. Because the layout and structure of different models of materials on the assembly line are different, the operator needs to manually check the defects recognized by the machine, and the defect-free comparison object is the key to matching verification, so as to avoid false detection by the machine.

[0040] Figure 2 is a flowchart of a circuit board defect image verification display method provided by the embodiments of the present application, which includes the following steps:

[0041] Step 201, in response to receiving the selection operation of the target defect image in the re-inspection interface, the target defect image is enlarged, and the defect enlarged image is displayed in the defect display area.

[0042] The target defect image is a pcs defect image scanned by the line scanning camera on the material board and recognized by the machine. Each target defect image corresponds to a pcs, and contains at least one defect point. The defect point or defect area is recognized by the machine, and needs to be manually re-inspected to ensure product yield.

[0043] The re-inspection interface contains at least two parts, which are respectively used to display the panoramic material image and the defect enlarged image transmitted by the line scanning camera. The area for displaying the panoramic material image is the panoramic display area, and the area for displaying the defect enlarged image is the defect display area. After the operator inputs or selects a target defect image, the target defect image will be enlarged and generated in the defect display area. Because the area of the panoramic material image is large, the details of the displayed image cannot be seen clearly, so the defect position in the area needs to be cut out and displayed separately.

[0044] In a possible implementation, the intercepted defect magnified image is intercepted with the defect point as the geometric center, that is, the defect point is at the center of the image, so that the normal area picture around the defect point can be observed to the maximum extent. Figure 3 The medium resolution is under the target size of 900*900, and the pcs defect image of the missing element is placed in the center of the picture.

[0045] In step 202, in response to the magnification operation of the target defect map, the target pcs corresponding to the target defect map is determined, and the target pcs is marked and displayed on the panoramic material map of the review interface.

[0046] The purpose of displaying the panoramic material map is to enable the operator to know the location of the defect while reviewing the defect, because the pcs are arranged in an array on the strip material plate, and the overall structure thereof can be the same or different. After the marking and display on the panoramic material map, the operator can know the location of the defect, have a general understanding of the defect condition of the production batch or the strip material plate, and facilitate the subsequent production process and review focus control.

[0047] As shown in Figure 4 Because the pcs in the target defect map and the panoramic material map are one-to-one corresponding, after selecting and magnifying a certain target defect map, the location marking can be performed in the panoramic material map. The marking manner can frame the entire pcs area, or mark the area range of the target defect map. Figure 4 Taking the frame of the entire pcs range as an example, after selecting and displaying the defect magnified image on the right side, and marking the corresponding target pcs in the left and right array images on the strip material plate, the operator can directly see the location of the target pcs with defects.

[0048] In step 203, in response to receiving the verification display operation of the target defect map, the non-defective verification map corresponding to the target pcs is displayed in the defect display area, and the non-defective verification map is displayed synchronously with the defect magnified image; the non-defective verification map and the target pcs with defects are in one-to-one corresponding relationship.

[0049] Because only the defect magnified image is displayed in the right defect display area, the operator can directly determine in the case of obvious defects, such as damage, missing elements, position deviation and tilting, etc. However, for different models and contents of the strip material plate, the operator cannot clearly understand all the details and characteristics, such as missing printing of text, multiple printing of elements and text, deviation of element placement direction, etc. These may affect the normal work of the chip or affect the acceptance, and the machine defines it as a pcs defect image, so the operator must perform defect verification. Therefore, the non-defective verification map is introduced again in the present scheme.

[0050] As shown inFigure 4 As shown, the defect-free check image is located in the computer or in the database. It is displayed when a comparison check is needed. The database stores all strip material plate models and all pcs images in the material plate, and is a defect-free image specially used for operators to call check. Specifically, the defect-free check image corresponding to the target pcs is displayed in the defect display area, and is displayed synchronously with the defect magnified image. Figure 4 As shown, the defect-free check image is located in the computer or in the database. It is displayed when a comparison check is needed. The database stores all strip material plate models and all pcs images in the material plate, and is a defect-free image specially used for operators to call check. Specifically, the defect-free check image corresponding to the target pcs is displayed in the defect display area, and is displayed synchronously with the defect magnified image.

[0051] In summary, the present application sets a panoramic display area and a defect display area in the re-inspection interface. The defect display area displays and magnifies the target defect image selected by the operator, and the panoramic display area displays and marks the panoramic material image according to the magnification operation on the target defect image, so that the operator can clearly know the specific position of the defect on the material plate. In order to improve the accuracy of defect re-inspection, the defect-free check image corresponding to the target defect image is displayed side by side in the defect display area. The defect-free check image represents the image of the normal defect-free target pcs, and can be used as a defect comparison for the target defect image, so as to re-inspect and check the machine recognition result, and improve the re-inspection efficiency and accuracy.

[0052] In some scenarios, if multiple pcs defect images are detected on a strip material plate, the operator needs to select or selectively select and view the magnified pcs defect image when performing matching check in the re-inspection interface. Therefore, the present application selects to set an image display list in the re-inspection interface, which contains all the pcs defect images identified and intercepted from the panoramic material image. Specifically, the image display list can be displayed in a tabular form or in an image preview form, i.e. displaying a thumbnail of the pcs defect image in the defect display area or at the bottom of the re-inspection interface. In response to receiving a selection operation on a target defect image in the image display list, the defect magnified image is displayed in the defect display area.

[0053] As shown, the defect-free check image is located in the computer or in the database. It is displayed when a comparison check is needed. The database stores all strip material plate models and all pcs images in the material plate, and is a defect-free image specially used for operators to call check. Specifically, the defect-free check image corresponding to the target pcs is displayed in the defect display area, and is displayed synchronously with the defect magnified image. Figure 5 As shown, the defect-free check image is located in the computer or in the database. It is displayed when a comparison check is needed. The database stores all strip material plate models and all pcs images in the material plate, and is a defect-free image specially used for operators to call check. Specifically, the defect-free check image corresponding to the target pcs is displayed in the defect display area, and is displayed synchronously with the defect magnified image.

[0054] Considering that the strip material plate contains many pcs arrays, if you want to mark and display the panoramic material image when a target defect image is selected, you must position the panoramic material image. The following strategies are adopted:

[0055] When the strip material is scanned by the line scan camera, a number or coordinate is set for each pcs or the pcs with a defect identified, because the defect detection process needs to describe all defects, that is, set pcs number information, picture classification information, defect type information, and identification result information for each pcs defect image. Correspondingly, when the target defect image is selected, these information is displayed in the defect display area for the operator to review. The pcs number information is used to indicate the position number of the pcs on the material plate; the picture classification information is used to indicate the position area of the defect on the pcs; the defect type information is used to indicate the type of the defect identified by the machine, and the identification result is used to indicate that the target pcs is a defective material, which is used for the operator to review and screen.

[0056] For example, referring to Figure 5 As shown, it is assumed that the pcs with number 005 identifies a defect, and the defect type is device missing, so the picture classification is that the defect is located in the device area, and the resolution of the enlarged display image is 900*900.

[0057] When the review system receives the pcs defect image, all pcs defect images are indexed according to the pcs number information and the picture classification information;

[0058] In response to receiving the selection operation on the target defect image, the target position index tag corresponding to the target defect image is located and marked on the panoramic material image. Specifically, the pcs number and the position are determined.

[0059] In some embodiments, the following functions can also be implemented for the defect comparison function:

[0060] a. The review interface also has a verification display control for the operator to perform a verification display operation;

[0061] b. In response to receiving the verification display operation on the target defect image, the material number of the panoramic material image is queried from the panoramic image database to obtain a defect-free panoramic image matched with the panoramic material image;

[0062] c. Based on the target defect image and the position index tag of the corresponding target pcs, a defect-free verification image that matches the coordinate position of the target defect image is cut from the defect-free panoramic image;

[0063] d. The defect-free verification image is set to the same resolution and size as the target defect image, and the defect-free verification image and the defect enlarged image are synchronously displayed in the defect display area.

[0064] For example, Figure 6As shown, the above steps rely on the database function, and the panorama of all normal and defect-free strip material plates is stored in the database in advance. When the check display operation is started, the panorama image database is matched based on the current strip material model. After the consistent panorama is matched, the position index label of the target pcs is used to cut the defect-free check image corresponding to the coordinate position of the target defect image from the defect-free panorama, and then the defect-free check image is enlarged to the same resolution and size as the target defect image.

[0065] Of course, the above process needs to identify the pcs and cut from the complete panorama material image, which increases the image recognition operation amount in the case of a large number. In some possible implementation manners, the defect-free strip material can be scanned and stored in advance, specifically as follows:

[0066] e, in response to receiving the check display operation of the target defect image, querying the pcs image database according to the material number and the pcs number information corresponding to the target defect image to obtain the defect-free pcs check image matched with the target;

[0067] The scheme is to scan the strip material plates of each model in advance, scan all pcs on the plate into images, store and number the images, and then directly extract according to the strip material plate model after starting the comparison and checking. That is, the pcs image database stores a plurality of defect-free pcs image check lists, the pcs image check lists are classified according to the material number, the number of specific lists is equal to the number of strip models, and each pcs image check list contains all pcs images on the corresponding material. In this way, the corresponding defect-free pcs check image can be extracted by searching the pcs number from the list.

[0068] f, cutting the defect-free check image corresponding to the coordinate position of the target defect image from the defect-free pcs check image;

[0069] g, setting the defect-free check image to the same resolution and size as the target defect image, and synchronously displaying the defect-free check image and the defect enlarged image in the defect display area.

[0070] Compared with the scheme of cutting from the panorama, the operation amount of the query display check scheme is relatively small, and the response speed is faster.

[0071] Figure 7 The circuit board defect image check display device provided by the embodiment of the application is shown, and the device comprises:

[0072] The zoom display module is configured to zoom the target defect image in response to receiving a selection operation of the target defect image in the review interface, and display a zoomed-in defect image in a defect display area; the target defect image is a pcs defect image scanned by a line scan camera on a material board and machine-recognized, and each target defect image contains at least one defect point;

[0073] The annotation display module is configured to determine a target pcs corresponding to the target defect image in response to a zoom operation of the target defect image, and display an annotation on a panoramic material image of the review interface.

[0074] The verification display module is configured to display a defect-free verification image corresponding to the target pcs in the defect display area in response to receiving a verification display operation of the target defect image, and synchronously display the zoomed-in defect image; the defect-free verification image and the target pcs with defects have a one-to-one correspondence.

[0075] In addition, the present application also provides a computer device, which comprises a processor and a memory, and the memory stores at least one instruction, at least one program, a code set or an instruction set, and the at least one instruction, the at least one program, the code set or the instruction set is loaded and executed by the processor to implement the circuit board defect image verification display method in the above aspect.

[0076] In addition, the present application also provides a computer readable storage medium, which stores at least one instruction, at least one program, a code set or an instruction set, and the at least one instruction, the at least one program, the code set or the instruction set is loaded and executed by the processor to implement the circuit board defect image verification display method in the above aspect.

[0077] The circuit board defect image verification display device provided by the embodiments of the present application can be applied to the circuit board defect image verification display method provided in the above embodiments, and the related details are referred to the above method embodiments, which have similar implementation principles and technical effects, and will not be described here.

[0078] It should be noted that the circuit board defect image verification display device provided in the embodiments of the present application is only exemplified by the above division of each functional module / functional unit when performing the caliper operation, and in actual application, the above functions can be completed by different functional modules / functional units according to needs, that is, the internal structure of the circuit board defect image verification display device is divided into different functional modules / functional units to complete all or part of the functions described above. In addition, the implementation of the circuit board defect image verification display method provided by the method embodiments belongs to the same concept as the implementation of the circuit board defect image verification display device provided by the present embodiment, and the specific implementation process of the circuit board defect image verification display device provided by the present embodiment is described above. The method embodiments, and will not be repeated here.

[0079] Figure 8 A structural block diagram of a computer device provided by an example embodiment of the present application is shown. The computer device can be a desktop computer, a notebook computer, a palm computer, a cloud server, and the like. The computer device can include, but is not limited to, a processor and a memory. The processor and the memory can be connected by a bus or other means. The processor can be a central processing unit (CPU). The processor can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs) or other programmable logic devices, graphics processing units (GPUs), embedded neural network processing units (NPUs) or other dedicated deep learning coprocessors, discrete gates or transistor logic devices, discrete hardware components, and the like chips, or combinations of the above chips.

[0080] The processor can include one or more processing cores, such as a 4-core processor, an 8-core processor, and the like. The processor can be implemented in the form of at least one of a DSP (Digital Signal Processing), an FPGA (Field-Programmable Gate Array), a PLA (Programmable Logic Array). The processor 1701 can also include a main processor and a co-processor, the main processor being a processor for processing data in an awake state, also referred to as a CPU (Central Processing Unit), and the co-processor being a low-power processor for processing data in a standby state. In some embodiments, the processor can be integrated with a GPU (Graphics Processing Unit) for rendering and drawing content required to be displayed by the display screen. In some embodiments, the processor can also include an AI (Artificial Intelligence) processor for processing computing operations related to machine learning.

[0081] The memory, as a non-transitory computer readable storage medium, can be used to store non-transitory software programs, non-transitory computer executable programs and modules, such as program instructions / modules corresponding to the methods in the above embodiments of the present application. The processor executes various functions and data processing of the processor by running the non-transitory software programs, instructions and modules stored in the memory, i.e. implements the methods in the above method embodiments. The memory can include a program storage area and a data storage area, wherein the program storage area can store an operating system and at least one application required by a function; the data storage area can store data created by the processor, and the like. In addition, the memory can include a high-speed random access memory, and can also include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state memory device. In some embodiments, the memory can optionally include a memory disposed remotely with respect to the processor, and these remote memories can be connected to the processor through a network. Examples of the above network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0082] In some embodiments, the computer device can also optionally include a peripheral device interface and at least one peripheral device. The processor, the memory and the peripheral device interface can be connected through a bus or a signal line. Each peripheral device can be connected to the peripheral device interface through a bus, a signal line or a circuit board. Specifically, the peripheral device includes at least one of a radio frequency circuit, a display screen, a keyboard.

[0083] The peripheral interface can be used to connect at least one I / O (Input / Output) related peripheral device to the processor and the memory. In some embodiments, the processor, the memory and the peripheral interface are integrated on the same chip or circuit board; in some other embodiments, any one or two of the processor, the memory and the peripheral interface can be implemented on a separate chip or circuit board, to which the present embodiments are not limited.

[0084] The display screen is used to display a UI (User Interface). The UI can include graphics, text, icons, video, and any combination thereof. When the display screen is a touch display screen, the display screen also has the ability to collect touch signals on or above the surface of the display screen. The touch signals can be input as control signals to the processor for processing. At this time, the display screen can also be used to provide virtual buttons and / or virtual keyboards, also known as soft buttons and / or soft keyboards. In some embodiments, the display screen can be one, arranged on the front panel of the computer device; in some other embodiments, the display screen can be at least two, arranged on different surfaces of the computer device or in a folding design; in some other embodiments, the display screen can be a flexible display screen, arranged on a curved surface or a folding surface of the computer device. Even, the display screen can also be arranged in an irregular shape other than a rectangle, i.e. a special-shaped screen. The display screen can be made of materials such as LCD (Liquid Crystal Display), OLED (Organic Light-Emitting Diode), etc.

[0085] The power supply is used to supply power to various components in the computer device. The power supply can be alternating current, direct current, disposable battery or rechargeable battery. When the power supply includes a rechargeable battery, the rechargeable battery can be a wired rechargeable battery or a wireless rechargeable battery. The wired rechargeable battery is a battery charged through a wired line, and the wireless rechargeable battery is a battery charged through a wireless coil. The rechargeable battery can also be used to support fast charging technology.

[0086] Those skilled in the art can understand that, Figure 8 The structure shown in the above embodiments does not constitute a limitation on the computer device, and can include more or fewer components than shown, or combine certain components, or use different component arrangements.

[0087] The embodiments of the present application further disclose a computer readable storage medium. Specifically, the computer readable storage medium is used to store a computer program, and the computer program is executed by a processor to implement the method in the above method embodiments. Those skilled in the art can understand that all or part of the processes in the above method embodiments of the present application can be completed by a computer program to instruct related hardware, and the program can be stored in a computer readable storage medium. When the program is executed, the program can include the processes of the above method embodiments. The storage medium can be a magnetic disc, an optical disc, a read-only memory (ROM), a random access memory (RAM), a flash memory, a hard disk drive (HDD) or a solid-state drive (SSD), etc. The storage medium can also include a combination of the above types of memories.

[0088] The specific embodiments are only an explanation of the present application, and are not a limitation of the present application. Those skilled in the art can make modifications to the embodiments according to the needs after reading the present specification, and the modifications do not contribute to the creativity, but are protected by the patent law as long as the modifications are within the scope of the claims of the present application.

Claims

1. A circuit board defect image verification and display method, characterized in that: The method comprises: In response to receiving a selection operation of a target defect image in the re-inspection interface, the target defect image is magnified and the magnified defect image is displayed in the defect display area; the target defect image is a PCS defect image scanned on the material board by a line scan camera and machine-recognized, and each target defect image contains at least one defect point; In response to a zoom-in operation on the target defect image, target PCs corresponding to the target defect image are determined and marked and displayed on the panoramic material image of the re-inspection interface; A verification display control is provided in the re-inspection interface for an operator to perform a verification display operation. In response to receiving the verification display operation for the target defect image, a panoramic image database is queried according to the material number of the panoramic material image to obtain a defect-free panoramic image that matches the panoramic material image. Based on the target defect image and the position index tags corresponding to the target PCs, a defect-free verification image corresponding to the coordinate position of the target defect image is intercepted from the defect-free panoramic image; The defect-free verification image is set to the same resolution and size as the target defect image, and the defect-free verification image and the defect magnified image are displayed synchronously in the defect display area; the defect-free verification image and the defective target PCs are in a one-to-one correspondence.

2. The method according to claim 1, characterized in that The re-inspection interface is provided with a material display area, in which a panoramic material image scanned and transmitted by a line scan camera is displayed. The panoramic material image displays several pcs images, and the target defect image is obtained by intercepting the defect points identified in the panoramic material image.

3. The method according to claim 2, characterized in that The re-inspection interface is also provided with an image display list, which contains all PCS defect images identified and captured from the panoramic material image; In response to receiving a selection operation of the target defect image in the image display list, an enlarged defect image is displayed in the defect display area.

4. The method according to claim 3, characterized in that The image display list also includes pcs number information, picture classification information, defect type information and recognition results; the pcs number information is used to indicate the position number of the pcs corresponding to the material board, the picture classification information is used to indicate the location area of ​​the defect on the pcs, the defect type information is used to indicate the type of defect recognized by the machine, and the recognition result is used to indicate that the target pcs is a defective material, which is used for the operator to re-inspect and screen.

5. The method according to claim 4, characterized in that All the PCS defect images in the image display list are given position index labels based on PCS number information and image classification information; In response to receiving a selection operation on the target defect map, the target position index label corresponding to the target defect map is positioned and marked on the panoramic material map.

6. A circuit board defect image verification and display device, characterized in that: The device comprises: The magnification display module is configured to, in response to a selection operation of a target defect image in the re-inspection interface, magnify the target defect image and display the magnified defect image in the defect display area; the target defect image is a PCS defect image scanned on the material board by a line scan camera and machine-recognized, and each target defect image contains at least one defect point; a marking and displaying module, configured to determine target PCs corresponding to the target defect image in response to a zoom-in operation on the target defect image, and mark and display the target PCs on the panoramic material image of the re-inspection interface; The verification display module is configured to provide a verification display control for an operator to perform a verification display operation in the re-inspection interface, and in response to receiving a verification display operation for a target defect image, querying a panoramic image database according to the material number of the panoramic material image to obtain a defect-free panoramic image that matches the panoramic material image; Based on the target defect image and the position index tags corresponding to the target PCs, a defect-free verification image corresponding to the coordinate position of the target defect image is intercepted from the defect-free panoramic image; The defect-free verification image is set to the same resolution and size as the target defect image, and the defect-free verification image and the defect magnified image are displayed synchronously in the defect display area; the defect-free verification image and the defective target PCs are in a one-to-one correspondence.

7. A computer device, characterized in that: The computer device includes a processor and a memory, wherein the memory stores at least one instruction, at least one program, a code set or an instruction set, and the at least one instruction, the at least one program, the code set or the instruction set is loaded and executed by the processor to implement the circuit board defect image verification and display method as described in any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that The readable storage medium stores at least one instruction, at least one program, a code set or an instruction set, and the at least one instruction, the at least one program, the code set or the instruction set is loaded and executed by the processor to implement the circuit board defect image verification and display method as described in any one of claims 1 to 5.

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