Electromagnetic shielding structure and its manufacturing method

Abstract

This disclosure provides an electromagnetic shielding structure and a method for fabricating such a structure, relating to the field of semiconductor packaging technology. The electromagnetic shielding structure includes a substrate, a first electronic device, a shielding barrier layer, a reinforcing shielding layer, a molding compound, and a metal layer. A grounding pad is provided on the substrate. The first electronic device is disposed on the substrate and electrically connected to it. The first electronic device is located within the barrier area enclosed by the shielding barrier layer. The shielding barrier layer has corner portions. The reinforcing shielding layer is disposed at the corner portions and electrically connected to the grounding pad. The molding compound is disposed on the substrate and covers the first electronic device, the shielding barrier layer, and the reinforcing shielding layer. The metal layer is disposed on the molding compound and electrically connected to both the shielding barrier layer and the reinforcing shielding layer. This structure provides good electromagnetic shielding and effectively prevents noise interference.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and more specifically, to an electromagnetic shielding structure and a method for manufacturing the electromagnetic shielding structure. Background Technology

[0002] With the rapid development of the semiconductor industry, System-in-Package (SIP) modules are widely used. They stack different functional chips after packaging, offering advantages such as high-density integration, small package size, superior performance, and high signal transmission frequency. As electronic products increasingly utilize high-frequency signals in communication, they require zoned electromagnetic shielding to prevent electromagnetic interference generated by various chips and components. Existing zoned EMI shielding technologies primarily involve using wire bonding or metal pillars to create shielding structures. However, at the edges and corners of these structures, there are often wire-wound clutter waves in the X and Y directions. When the shielding structure is segmented to divide the wire-wound wavelengths, this clutter tends to accumulate at the corners. This accumulated clutter may then penetrate the shielding structure, leading to a decrease in electromagnetic shielding effectiveness. Summary of the Invention

[0003] The present invention aims to provide, for example, an electromagnetic shielding structure and a method for manufacturing the electromagnetic shielding structure, which can enhance the electromagnetic shielding effect and prevent noise interference.

[0004] The embodiments of the present invention can be implemented as follows:

[0005] In a first aspect, the present invention provides an electromagnetic shielding structure, comprising:

[0006] A substrate having a grounding pad on it;

[0007] A first electronic device, which is disposed on the substrate and electrically connected to the substrate;

[0008] A shielding barrier layer, wherein the first electronic device is located within the barrier area enclosed by the shielding barrier layer; the shielding barrier layer is provided with corner portions;

[0009] An enhanced shielding layer is provided at the corner portion and is electrically connected to the grounding pad;

[0010] A molding compound, wherein the molding compound is disposed on the substrate and covers the first electronic device, the shielding barrier layer and the enhanced shielding layer;

[0011] A metal layer is disposed on the encapsulation body, and the metal layer is electrically connected to the shielding barrier layer and the reinforcing shielding layer, respectively.

[0012] In an optional embodiment, the shielding barrier layer includes a plurality of metal pillars evenly spaced apart, the metal pillars being arranged along at least two different directions, and the corner portion being located at the intersection of the two directions.

[0013] In an optional embodiment, the enhanced shielding layer includes a first shielding arc, and the grounding pad includes a first pad and a second pad, with one end of the first shielding arc connected to the first pad and the other end connected to the second pad.

[0014] In an optional embodiment, the first shielding arc is located on the side of the corner away from the first electronic device.

[0015] In an optional embodiment, the distance between the first pad and the shielding barrier layer in a first direction is a first distance, and the distance between the second pad and the shielding barrier layer in a second direction is a second distance, wherein the first distance and the second distance are equal; and the first direction and the second direction are different.

[0016] In an optional implementation, the distance between two adjacent metal pillars in the first direction is a first distance, and the distance between two adjacent metal pillars in the second direction is also a first distance.

[0017] In an optional embodiment, the first shielding arc includes at least one crest, the height of which is higher than the height of the metal pillar.

[0018] In an optional embodiment, the first shielding arc includes at least one trough, and the trough is at a predetermined distance from the substrate.

[0019] In an optional embodiment, the enhanced shielding layer further includes a reinforcing conductive pillar located on the side of the corner closest to the first electronic device;

[0020] And / or the reinforcing conductive post is located on the side of the corner away from the first electronic device.

[0021] In an optional embodiment, the enhanced shielding layer further includes a second shielding arc located on the side of the corner closer to the first electronic device.

[0022] In an optional embodiment, the metal layer covers the reinforcing shielding layer and the shielding barrier layer.

[0023] In an optional embodiment, the shielding barrier layer is electrically connected to the grounding pad.

[0024] In an optional embodiment, a second electronic device is further included, the second electronic device being disposed on the side of the substrate where the shielding barrier layer is provided, and / or the second electronic device being disposed on the side of the substrate away from the shielding barrier layer.

[0025] In an optional embodiment, the substrate is further provided with a bottom protective adhesive, which is used to protect the end of the shielding barrier layer near the substrate and the end of the reinforcing shielding layer near the substrate.

[0026] In an optional embodiment, a transition block is protruding on the substrate, and a wire bonding pad connected to the shielding barrier layer is provided on the substrate, with the grounding pad and / or the wire bonding pad located on the transition block.

[0027] Optionally, at least one side of the shielding barrier layer adopts a double-layer design, and the two shielding barrier layers are aligned or staggered.

[0028] In an optional embodiment, the shielding barrier layer is arranged in the shape of a square, rectangle, rhombus, triangle or polygon around the outer periphery of the first electronic device.

[0029] Optionally, the molding compound has a groove, and the shielding barrier layer and / or the reinforcing shielding layer are exposed in the groove; a conductive layer is provided in the groove, and the conductive layer is connected to the shielding barrier layer and / or the reinforcing shielding layer respectively; the metal layer and the conductive layer are electrically connected.

[0030] Optionally, the conductive layer may partially or completely fill the groove.

[0031] Optionally, the conductive layer is disposed along the sidewalls and bottomwalls of the groove and the surface of the shielding barrier layer and / or the reinforcing shielding layer, so that the surface of the conductive layer is irregular.

[0032] Secondly, the present invention provides an electromagnetic shielding structure, comprising:

[0033] A substrate having a grounding pad on it;

[0034] A first electronic device, which is disposed on the substrate and electrically connected to the substrate;

[0035] A shielding barrier layer is provided, wherein the first electronic device is located within the barrier area enclosed by the shielding barrier layer; the shielding barrier layer is provided with a corner portion; the shielding barrier layer includes a plurality of spaced metal pillars, the metal pillars being connected to the grounding pad;

[0036] The corner section includes a reference post, a first metal post, and a second metal post; the reference post and the first metal post are separated by a first length, the reference post and the second metal post are separated by a second length, and the first metal post and the second metal post are separated by a third length, wherein the third length is less than or equal to the first length or the second length; wherein, the first metal post is the metal post adjacent to the reference post among a plurality of metal posts arranged along a first direction, the second metal post is the metal post adjacent to the reference post among a plurality of metal posts arranged along a second direction, and the reference post is located at the intersection of the first direction and the second direction;

[0037] A molding compound, wherein the molding compound is disposed on the substrate and covers the first electronic device and the shielding barrier layer;

[0038] A metal layer is disposed on the encapsulation body and is electrically connected to the shielding barrier layer.

[0039] Optionally, the first length is equal to the second length.

[0040] Optionally, the shielding barrier layer is triangular in shape.

[0041] Optionally, an enhanced shielding layer is provided on the side of the corner portion that is close to and / or far from the first electronic device.

[0042] Optionally, at least one side of the shielding barrier layer adopts a double-layer design, and the two shielding barrier layers are aligned or staggered.

[0043] Optionally, the molding compound has a groove, and the shielding barrier layer and / or the reinforcing shielding layer are exposed in the groove; a conductive layer is provided in the groove, and the conductive layer is connected to the shielding barrier layer and / or the reinforcing shielding layer respectively; the metal layer and the conductive layer are electrically connected.

[0044] Optionally, the conductive layer may partially or completely fill the groove.

[0045] Optionally, the conductive layer is disposed along the sidewalls and bottomwalls of the groove and the surface of the shielding barrier layer and / or the reinforcing shielding layer, so that the surface of the conductive layer is irregular.

[0046] Thirdly, the present invention provides a method for manufacturing an electromagnetic shielding structure, comprising:

[0047] A first electronic device is mounted on a substrate; wherein, the substrate is provided with a grounding pad;

[0048] A shielding barrier layer is provided on the outer periphery of the first electronic device; wherein the shielding barrier layer has a corner portion;

[0049] The reinforcing shielding layer is provided at the corner; wherein the reinforcing shielding layer is electrically connected to the grounding pad;

[0050] A molding compound is formed on the substrate to protect the first electronic device, the shielding barrier layer, and the enhanced shielding layer;

[0051] A metal layer is disposed on the molding compound; wherein the metal layer is electrically connected to the shielding barrier layer and the reinforcing shielding layer respectively.

[0052] In an optional embodiment, the grounding pad includes a first pad and a second pad; wires are punched on the first pad and the second pad to form a first shielding arc; wherein the height of the first shielding arc is not less than the height of the enhanced shielding layer.

[0053] Optionally, the encapsulation may be ground to expose the first shielding arc and the shielding barrier layer.

[0054] In an optional embodiment, the method further includes: planting balls on the side of the substrate away from the molding compound; cutting the molding compound and the substrate to form a single product; and the step of forming a metal layer on the molding compound includes: forming a metal layer on the single product.

[0055] In an optional embodiment, the substrate is arranged in a double row; the method further includes: planting balls on the side of the substrate away from the molding compound; forming a metal layer on the molding compound; and cutting the metal layer, the molding compound, and the substrate to form a single product.

[0056] The beneficial effects of the embodiments of the present invention include, for example:

[0057] The electromagnetic shielding structure and its manufacturing method provided in this embodiment of the invention provide an enhanced shielding layer at the corner of the shielding barrier layer, and the enhanced shielding layer is connected to the grounding pad on the substrate. This can effectively prevent clutter from passing through the shielding barrier layer after accumulating at the corner, thereby enhancing the electromagnetic shielding effect and preventing clutter from interfering with the first electronic device. Attached Figure Description

[0058] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0059] Figure 1 This is a schematic diagram of the first structure of the electromagnetic shielding structure provided in the embodiment of the present invention;

[0060] Figure 2 This is a top view schematic diagram of the electromagnetic shielding structure provided in an embodiment of the present invention;

[0061] Figure 3 This is a schematic diagram of a first shielding arc provided in an embodiment of the present invention;

[0062] Figure 4 Another structural schematic diagram of the first shielding arc provided in an embodiment of the present invention;

[0063] Figure 5 This is a schematic diagram of the structure in which the first shielding arc in the electromagnetic shielding structure provided in the embodiment of the present invention adopts a multi-segment arc;

[0064] Figure 6 This is a schematic diagram of a second structure of the electromagnetic shielding structure provided in an embodiment of the present invention;

[0065] Figure 7 This is a schematic diagram of a third type of electromagnetic shielding structure provided in an embodiment of the present invention;

[0066] Figure 8 This is a schematic diagram of a fourth type of electromagnetic shielding structure provided in an embodiment of the present invention;

[0067] Figure 9 This is a schematic diagram of the fifth structure of the electromagnetic shielding structure provided in the embodiments of the present invention;

[0068] Figure 10 This is a schematic diagram of the sixth structure of the electromagnetic shielding structure provided in the embodiments of the present invention;

[0069] Figure 11 This is a schematic diagram of the seventh structure of the electromagnetic shielding structure provided in the embodiments of the present invention;

[0070] Figure 12 A schematic diagram of the electromagnetic shielding structure provided in an embodiment of the present invention, showing that the shielding barrier layer is distributed in a triangular pattern.

[0071] Figure 13 Another schematic diagram of the electromagnetic shielding structure provided in this embodiment of the invention shows that the shielding barrier layer is distributed in a triangular pattern.

[0072] Figure 14 A schematic diagram of a two-layer structure in which the shielding barrier layer of the electromagnetic shielding structure provided in an embodiment of the present invention is distributed in a triangular pattern;

[0073] Figure 15 A schematic diagram of the electromagnetic shielding structure provided in this embodiment of the invention, showing that the shielding barrier layer is distributed in a parallelogram shape;

[0074] Figure 16 This is a schematic diagram of the eighth structure of the electromagnetic shielding structure provided in the embodiments of the present invention;

[0075] Figure 17 This is a schematic diagram of the ninth structure of the electromagnetic shielding structure provided in the embodiments of the present invention;

[0076] Figure 18 This is a schematic diagram of the tenth structure of the electromagnetic shielding structure provided in the embodiments of the present invention;

[0077] Figure 19 This is an eleventh structural schematic diagram of the electromagnetic shielding structure provided in the embodiments of the present invention;

[0078] Figure 20 This is a schematic diagram of the twelfth structure of the electromagnetic shielding structure provided in the embodiments of the present invention;

[0079] Figure 21 and Figure 22 This is a schematic diagram illustrating the manufacturing process of the electromagnetic shielding structure provided in an embodiment of the present invention;

[0080] Figure 23 This is a schematic diagram illustrating another manufacturing process of the electromagnetic shielding structure provided in an embodiment of the present invention.

[0081] Icons: 100 - Electromagnetic shielding structure; 110 - Substrate; 111 - Grounding pad; 112 - Conductive via; 113 - First pad; 115 - Second pad; 116 - Wire bonding pad; 117 - Adapter block; 118 - Series wiring layer; 120 - First electronic component; 121 - First chip; 123 - Second chip; 130 - Shielding barrier layer; 131 - Corner; 133 - Metal pillar; 135 - Reference pillar; 140 - Reinforced shielding layer; 141 - First shielding arc; 143 - Reinforced conductive pillar; 150 - Molded enclosure; 151 - Groove; 153 - Conductive layer; 160 - Metal layer; 170 - Bottom protective adhesive; 180 - Second electronic component; 190 - Solder ball; 191 - Grounding line layer; 193 - Grounding point. Detailed Implementation

[0082] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0083] It should be noted that similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the figures, or the orientation or positional relationship commonly used when the product is in use, they are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, if terms such as "first" or "second" appear, they are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0084] It should be noted that, where there is no conflict, the features in the embodiments of the present invention can be combined with each other.

[0085] First Embodiment

[0086] Please refer to Figure 1 and Figure 2 This embodiment provides an electromagnetic shielding structure 100, including a substrate 110, a first electronic device 120, a shielding barrier layer 130, an enhanced shielding layer 140, a molding compound 150, and a metal layer 160. The substrate 110 is provided with a grounding pad 111 and a wire bonding pad 116. The first electronic device 120 is disposed on the substrate 110 and electrically connected to the substrate 110. The first electronic device 120 is located within the shielding area enclosed by the shielding layer 130. The shielding layer 130 is connected to the wire bonding pad 116 and has a corner portion 131. The reinforcing shielding layer 140 is located at the corner portion 131 and is electrically connected to the grounding pad 111. The molding compound 150 is located on the substrate 110 and covers the first electronic device 120, the shielding layer 130, and the reinforcing shielding layer 140. The metal layer 160 is located on the molding compound 150 and is electrically connected to both the shielding layer 130 and the reinforcing shielding layer 140. This structure provides good electromagnetic shielding and effectively prevents interference from noise.

[0087] It is easy to understand that the substrate 110 has multiple chips or components. Depending on their function and application, some chips and components have electromagnetic shielding requirements and need to be partitioned for shielding, i.e., a shielding structure needs to be set up. For other chips and components that do not have electromagnetic shielding requirements, no electromagnetic shielding structure 100 is required. In this embodiment, the first electronic device 120 refers to an electronic device with electromagnetic shielding requirements, including but not limited to chips, components, and electronic modules, etc., where components include capacitors, resistors, or inductors. Depending on actual needs, each first electronic device 120 can be provided with a shielding structure, or multiple first electronic devices 120 can share a shielding structure. The number and type of the first electronic devices 120 are not specifically limited here.

[0088] In one embodiment, the first electronic device 120 includes a first chip 121. A first chip 121 and a second chip 123, spaced apart from each other, are disposed on a substrate 110. A shielding structure is provided around the first chip 121, namely, a shielding barrier layer 130 and an enhanced shielding layer 140. Thus, the first chip 121 is not affected by external noise interference, nor by interference from the second chip 123. It is understood that the shielding structure can be a closed ring structure completely surrounding the first electronic device 120. Of course, depending on actual needs, the shielding structure can also be open, such as semi-circular, U-shaped, C-shaped, straight, or L-shaped, or other arbitrary irregular shapes, partially surrounding the first electronic device 120 to shield electromagnetic waves in a localized direction. Preferably, if a straight shape is used, the straight shielding structure should be located on the side of the first chip 121 closest to the second chip 123. If the shielding structure has an opening, the opening should be located on the side of the first chip 121 furthest from the second chip 123. That is, in locations where the shielding requirement is low, the shielding barrier layer 130 and the reinforcing shielding layer 140 may not be required.

[0089] If an open structure is adopted, the opening of the shielding structure can be set at any location of the shielding barrier layer, such as at a corner or on any side, and the shape and size of the opening are not limited.

[0090] The shielding layer 130 includes a plurality of uniformly spaced metal pillars 133 arranged along at least two different directions, with corner portions 131 located at the intersection of the two directions. The heights of the plurality of metal pillars 133 may be equal or unequal. Optionally, the shielding layer 130 is rectangular and surrounds the outer periphery of the first chip 121, and the shielding layer 130 has four corner portions 131. Taking one corner portion 131 as an example, one column of metal pillars 133 is arranged at intervals along a first direction, i.e., the X direction. Another column of metal pillars 133 is arranged at intervals along a second direction, i.e., the Y direction. The distance between two adjacent metal pillars 133 in the X direction is L2, and the distance between two adjacent metal pillars 133 in the Y direction is L2, which can effectively prevent electromagnetic wave interference with wavelengths greater than L2. Taking the metal pillar 133 at the top corner as the reference pillar 135, the first metal pillar B near the reference pillar 135 in the X direction and the first metal pillar C near the reference pillar 135 in the Y direction are separated by a distance L1.

[0091] Optionally, the enhanced shielding layer 140 includes a first shielding arc 141, and the grounding pad 111 includes a first pad 113 and a second pad 115. One end of the first shielding arc 141 is connected to the first pad 113, and the other end is connected to the second pad 115. Taking the corner 131 at the lower left corner as an example, the first pad 113 is located in the opposite direction of the X direction, and the second pad 115 is located in the opposite direction of the Y direction, that is, the first shielding arc 141 is located on the side of the corner 131 away from the first electronic device 120.

[0092] Optionally, the distance between the first pad 113 and the shielding barrier layer 130 in the first direction is a first distance L3, and the distance between the second pad 115 and the shielding barrier layer 130 in the second direction is a second distance L4. The first distance and the second distance are equal; the first direction and the second direction are different. The first direction and the second direction can be 90 degrees to each other, or they can be set at an acute angle or an obtuse angle, which is not specifically limited here. In this embodiment, the distance between two adjacent metal pillars 133 in the first direction is the first distance, and the distance between two adjacent metal pillars 133 in the second direction is the first distance. That is, L2, L3 and L4 are equal. The straight-line distance between the first pad 113 and the second pad 115 is approximately equal to L1, that is, the width of the first shielding arc 141 is approximately L1. In this way, it can effectively prevent clutter from gathering and passing through the shielding barrier layer 130 to interfere with the first chip 121.

[0093] It is understandable that the winding clutter in the X and Y directions tends to accumulate at the corners, and the wavelength of the accumulated clutter tends to form clutter with a wavelength of L1. The wavelength of L1 clutter is much larger than the normal short wavelength of L2, so the clutter can easily lead to a decrease in the electromagnetic shielding effect.

[0094] It should be noted that each shielding barrier layer 130 may have multiple corner sections 131, and each corner section 131 is provided with an enhanced shielding layer 140. The structure of the enhanced shielding layer 140 on each corner section 131 is similar, and will not be described in detail here.

[0095] Combination Figure 3 Optionally, the first shielding arc 141 includes at least one peak, the height of which is higher than the height of the metal pillar 133. This arrangement effectively prevents bridging between the metal pillar 133 and the first shielding arc 141. Bridging could alter the spacing between the metal pillars 133, thus affecting the electromagnetic shielding effect. Furthermore, in the subsequent metal layer 160 formation process, the molding compound 150 needs to be ground. Making the height of the first shielding arc 141 higher than the height of the metal pillar 133 allows for layered grinding, reducing the grinding area and improving grinding efficiency.

[0096] Combination Figure 4 and Figure 5 Optionally, the first shielding arc 141 includes at least one trough, with a predetermined distance between the trough and the substrate 110 to prevent the first shielding arc 141 from touching the substrate 110. The first shielding arc 141 has multiple peaks or troughs, which can further increase the arc density and thus improve the electromagnetic shielding effect. The first shielding arc 141 can be any arc, regular or irregular, without specific limitations. Preferably, the first shielding arc 141 includes two vertical line segments perpendicular to the substrate 110 and an arc line segment connecting the two vertical line segments. Of the two vertical line segments, one is vertically connected to the first pad 113, and the other is vertically connected to the second pad 115. With this configuration, in subsequent processes, grinding removes the arc line segment, leaving the vertical line segment, which enhances the shielding performance. The height of the vertical line segment is different from the height of the metal pillar 133, which can be a high-low pillar structure. Of course, the heights of the two can also be kept consistent after grinding. The two vertical line segments in the same first shielding arc 141 can be equal or unequal. The vertical segments in multiple first shielding arcs 141 may be equal or unequal.

[0097] Preferably, the reference post 135 is located on the center line of the line connecting the first pad 113 and the second pad 115, which can achieve better electromagnetic shielding and better prevent noise interference.

[0098] Combination Figure 6In some embodiments, the reinforced shielding layer 140 further includes reinforcing conductive pillars 143, which are located on the side of the corner 131 closer to the first electronic device 120; and / or, the reinforcing conductive pillars 143 are located on the side of the corner 131 away from the first electronic device 120. In other words, the reinforcing conductive pillars 143 can be located on the inner side of the corner 131, or on the outer side of the corner 131, or both the inner and outer sides of the corner 131 are provided with reinforcing conductive pillars 143. It can be understood that when the reinforcing conductive pillars 143 are located on the inner side, the reinforcing conductive pillars 143, metal pillar B, metal pillar C, and reference pillar 135 are located exactly at the four vertices of the square. If the reinforcing conductive pillars 143 are located on the outer side, then the reinforcing conductive pillars 143, the first pad 113, the second pad 115, and the reference pillar 135 are located exactly at the four vertices of the square. The reinforcing conductive pillars 143, metal pillars 133, and vertical line segments can be arranged in a high-low pillar structure or a pillar structure of equal height.

[0099] Optionally, the reinforced shielding layer 140 further includes a second shielding arc (not shown), located on the side of the corner 131 closest to the first electronic device 120, i.e., on the inner side of the corner 131. Specifically, the second shielding arc is located on the inner side of the corner 131, where a third pad and a fourth pad with grounding characteristics are provided, and the second shielding arc is electrically connected to the third pad and the fourth pad. The structure and wiring method of the second shielding arc are similar to those of the first shielding arc 141.

[0100] It is understood that in some embodiments, the reinforcing conductive post 143 and the second shielding arc can coexist, the first shielding arc 141 and the second shielding arc can coexist, and the first shielding arc 141 and the reinforcing conductive post 143 can coexist to improve the electromagnetic shielding effect. Of course, the above-mentioned features can be arbitrarily combined to form more embodiments, which are not specifically limited here.

[0101] It is understandable that the grounding pad 111 can also be set below the reinforcing conductive post 143, or on at least one of the first pad 113, the second pad 115, the third pad and the fourth pad, as long as one of them is set as the grounding terminal.

[0102] The shielding layer 130 is electrically connected to the grounding pad 111. The shielding layer 130 and the grounding pad 111 can be directly or indirectly connected. Preferably, in this embodiment, an indirect connection is used. Figure 7 For example, the metal pillar 133 is electrically connected through the metal layer 160 on the encapsulation body 150, the first shielding arc 141 and the grounding pad 111 on the substrate 110, thereby playing an electromagnetic shielding role.

[0103] Alternatively, there are other indirect connection methods, such as connecting the grounding pad 111 to the grounding line layer 191 within the substrate 110, or connecting the wire bonding pad 116 to the grounding pad 111 in series to achieve grounding of the shielding barrier layer 130. Combined with... Figure 8 The grounding point 193 of the grounding line layer 191 can extend to the sidewall of the substrate 110. The grounding point 193 of the sidewall is connected to the metal layer 160. The metal layer 160 is connected to the shielding barrier layer 130 and the reinforcing shielding layer 140 respectively, so that the shielding barrier layer 130 and the reinforcing shielding layer 140 are grounded, thereby achieving electromagnetic shielding.

[0104] It is understandable that the ground pad 111 is connected to the grounding layer 191 through the conductive via 112, and the ground pad 111 is connected to the wire bonding pad 116 through the series wiring layer 118, thus simplifying the wiring layer routing. Furthermore, the series circuit requires both the wire bonding pad 116 and the ground pad 111 to be connected simultaneously for circuit conduction. Alternatively, the ground point 193 can be designed on the outer layer of the wiring layer substrate. After cutting, the ground point 193 can be exposed, and then a metal layer 160 can be sputtered to achieve electromagnetic shielding. The metal layer 160 is connected to the wire bonding pad 116 and the ground pad 111 respectively through wire bonding metal posts. In this way, the ground pad 111 on the surface of the substrate 110 can be omitted, and only the series circuit can be used.

[0105] Alternatively, in some embodiments, the grounding pad 111, the wire bonding pad 116, and the pad below the reinforcing conductive post 143 are connected in series.

[0106] Easy to understand, combined Figure 7 and Figure 8 In this embodiment, the first pad 113 and the second pad 115 enable the first shielding arc 141 to be grounded, and the metal pillar 133 is not directly connected to the grounding pad 111, that is, the metal pillar 133 does not connect to the grounding pad 111. This reduces the routing distance of the grounding wiring layer, thereby reducing the number of wiring layers on the substrate 110, reducing the package size, and reducing the distance between wiring layers, thereby reducing problems such as parasitic inductance and parasitic capacitance between circuit layers.

[0107] The ground metal pillar 133 and the first shielding arc 141 can be at the same height and flush with the surface of the molding compound 150. Alternatively, they can be combined. Figure 9 After grinding, the height of the metal pillar 133 is different from the height of the vertical segment of the first shielding arc 141. The metal pillar 133 can be higher or lower; no specific limitation is made here. The higher of the vertical segment and the metal pillar 133 is electrically connected to the metal layer 160, while the other is spaced apart from the metal layer 160. The grounding pad 111 and the wire bonding pad 116 are connected in series through the series wiring layer 118, thus achieving grounding and shielding effects for both.

[0108] Alternatively, among multiple vertical segments, one or more of the taller vertical segments may be electrically connected to metal layer 160. Alternatively, among multiple metal posts 133, one or more of the taller metal posts 133 may be electrically connected to metal layer 160. The grounding design is not limited to using series wiring layer 118 or grounding pad 111, as long as the shielding effect is ensured.

[0109] The metal layer 160 can cover the entire upper surface of the molding compound 150, or it can cover only a portion of the upper surface of the molding compound 150, such as... Figure 10 As shown, the metal layer 160 covers the shielding area formed by the reinforcing shielding layer 140 and the shielding barrier layer 130. In this way, it can achieve local electromagnetic shielding function, while reducing the use of raw materials for the metal layer 160, saving costs, reducing the coverage area, improving process efficiency, reducing product weight, and improving heat dissipation performance.

[0110] Combination Figure 11 Optionally, a second electronic device 180 is also provided on the substrate 110. The second electronic device 180 is located on the side of the substrate 110 where the shielding barrier layer 130 is provided, and / or the second electronic device 180 is located on the side of the substrate 110 away from the shielding barrier layer 130. It can be understood that the second electronic device 180 and the first electronic device 120 are located on the same side, that is, single-sided packaging of the substrate 110 is achieved. If the second electronic device 180 is located on the side of the substrate 110 away from the shielding barrier layer 130, double-sided packaging of the substrate 110 can be achieved, improving integration, making the structure more compact, and enriching the functions. According to actual needs, shielding structures can be provided on both sides of the substrate 110, and one or more shielding structures can be provided on each side according to actual needs.

[0111] The substrate 110 also has a bottom protective adhesive 170, which protects the end of the shielding barrier layer 130 near the substrate 110 and the end of the reinforcing shielding layer 140 near the substrate 110. The bottom protective adhesive 170 is applied in a circumferential pattern along the shielding structure, which improves the stability and reliability of the shielding structure and increases its strength. After curing, the bottom protective adhesive 170 forms a blocking block at the corner 131, which helps improve the electromagnetic shielding effect. The bottom protective adhesive 170 can be either conductive or non-conductive; no specific limitation is made here.

[0112] It should be noted that the metal pillars 133 can be formed using a vertical wire bonding method. The first shielding arc 141 reduces the impact of the molding flow on the metal pillars 133, preventing deformation of the metal pillars 133 due to the impact of the molding flow, which would increase the gaps between the metal pillars 133. If the gaps become larger, noise can easily pass through them, affecting the electromagnetic shielding effect, especially at the corners 131 where the first chip 121 is easily subject to noise interference. In addition, the first shielding arc 141 enhances the capillary effect of the bottom protective adhesive 170, improves the fluidity of the adhesive, improves filling performance, and makes the structure more reliable.

[0113] The shielding layer 130 can be square, rectangular, rhomboid, triangular, or any polygon surrounding the first electronic device 120, or it can be arranged in an open structure. The first electronic device 120 is located within the shielding area enclosed by the shielding layer 130. Preferably, the first electronic device 120 is located in the center of the shielding area for better electromagnetic shielding. Of course, in some embodiments, the first electronic device 120 can also be located at any other position within the shielding area.

[0114] Combination Figure 12 If the shielding layer 130 is arranged in a triangle, the first shielding arc 141 is located on the outside of the three vertices of the triangle. Taking one vertex as an example, the vertex of the triangle has a reference post 135, a metal post M adjacent to the reference post 135, and a metal post N. The metal post M, the metal post N, and the reference post 135 are located at the three vertices of an equilateral triangle. The first pad 113 and the second pad 115 are symmetrically arranged with respect to the reference post 135, with respect to the metal post N and the metal post M, respectively. The first shielding arc 141 is electrically connected to the first pad 113 and the second pad 115. This arrangement can further improve the electromagnetic shielding effect of the shielding structure and effectively prevent interference from clutter penetration.

[0115] Combination Figure 13 If the shielding layer 130 is arranged in an acute-angled triangle, such as an equilateral triangle or an isosceles acute-angled triangle, the distance between metal pillar N and metal pillar M at the corner 131 is smaller, less than or equal to L1, that is, less than or equal to the distance between the reference pillar 135 and metal pillar N, and also less than or equal to the distance between the reference pillar 135 and metal pillar M. In this case, the shielding layer 130 itself has a built-in shielding enhancement effect, and clutter cannot bypass the corner 131 to penetrate the interior of the shielding layer 130. Therefore, in this case, the enhanced shielding layer 140 is not required. The grounding point can be located below the metal pillar 133 or on the side wall of the substrate 110 to achieve electromagnetic shielding.

[0116] Specifically, the electromagnetic shielding structure 100 includes a shielding barrier layer 130, a substrate 110, a first electronic device 120, a molding compound 150, and a metal layer 160. A grounding pad 111 is provided on the substrate 110. The first electronic device 120 is disposed on the substrate 110 and electrically connected to it. The first electronic device 120 is located within the barrier area enclosed by the shielding barrier layer 130. The shielding barrier layer 130 has a corner portion 131. The shielding barrier layer 130 includes a plurality of spaced-apart metal pillars 133, which are connected to the grounding pad 111. The corner portion 131 includes a reference post 135, a first metal post M, and a second metal post N. The reference post 135 and the first metal post M are separated by a first length, the reference post 135 and the second metal post N are separated by a second length, and the first metal post M and the second metal post N are separated by a third length, the third length being less than or equal to the first length or the second length; that is, the apex of the corner portion 131 is an acute angle, and the reinforcing shielding layer 140 may not be provided. The first metal post M is the metal post 133 adjacent to the reference post 135 among a plurality of metal posts 133 arranged along a first direction, and the second metal post N is the metal post 133 adjacent to the reference post 135 among a plurality of metal posts 133 arranged along a second direction. The reference post 135 is located at the intersection of the first direction and the second direction. A molding compound 150 is disposed on the substrate 110 and covers the first electronic device 120 and the shielding barrier layer 130. A metal layer 160 is disposed on the molding compound 150 and is electrically connected to the shielding barrier layer 130. Optionally, the first length is equal to the second length.

[0117] It is understood that in some embodiments, an enhanced shielding layer 140 is provided on the side of the corner portion 131 that is close to and / or far from the first electronic device 120. That is, the enhanced shielding layer 140 may be provided on the inner and outer sides of the corner portion 131 respectively, or the enhanced shielding layer 140 may be provided on only one side.

[0118] Optionally, combined Figure 14 If at least one side of the shielding barrier layer 130 can adopt a double-row design, that is, at least one side of the first chip 121 is provided with a double-layer shielding barrier layer 130, the two shielding barrier layers 130 can be aligned or staggered, both of which can enhance the shielding performance. Preferably, the two shielding barrier layers 130 are staggered.

[0119] It is easy to understand that in this embodiment, after the enhanced shielding layer 140 is provided, at least two punched wires (two vertical line segments of the first shielding arc 141) are provided on the outside of the corner portion 131. In this way, the entire shielding structure can be an open structure on the outside of the corner portion 131.

[0120] Combination Figure 15If the shielding layer 130 is arranged in a parallelogram shape, it is preferably arranged in a rhombus shape. At the acute vertices of the rhombus, the arrangement of the enhanced shielding layer 140 is similar to that of the acute triangle in the figure, and will not be described again here. At the obtuse vertices of the rhombus, taking the upper left corner as an example, on the side of the corner 131 away from the first chip 121, i.e., on the outer side, the first pad 113 and the second pad 115 are arranged. At the obtuse vertices, there is a reference post 135, a metal post H adjacent to the reference post 135, and a metal post K. The first pad 113 is located in the opposite direction of the first direction, and the second pad 115 is located on the extension line of the second direction. The first pad 113, the metal post H, and the reference post 135 are exactly located at the three vertices of an equilateral triangle. The second pad 115, the metal post K, and the reference post 135 are exactly located at the three vertices of an equilateral triangle. This arrangement can further improve the electromagnetic shielding effect of the shielding structure and effectively prevent interference from clutter penetration. Of course, taking the top left corner as an example, a reinforcing conductive post 143 can also be provided on the inner side of the corner portion 131, that is, on the side closer to the first chip 121. There is no specific limitation here. Preferably, the reinforcing conductive post 143 can be provided on the center line of the line connecting the metal posts H and K, and can be symmetrically distributed with the reference post 135 about the line connecting the metal posts H and K.

[0121] It is easy to understand that in this embodiment, if the apex angle of the corner portion 131 is an acute angle, the reinforcing shielding layer 140 may not be provided. If the apex angle of the corner portion 131 is a right angle or an obtuse angle, the reinforcing shielding layer 140 may be provided on the outer side of the corner portion 131, or on the inner side of the corner portion 131, or on both the inner and outer sides respectively.

[0122] Combination Figure 16 Optionally, a transition block 117 protrudes from the substrate 110, and at least one of the grounding pad 111 and the wire bonding pad 116 is disposed on the transition block 117. The transition block 117 protrudes from the surface of the substrate 110, forming a bump structure, which can increase the starting point of the wire bonding of the shielding structure. In this embodiment, both the grounding pad 111 and the wire bonding pad 116 are located on the transition block 117, which can shorten the wire bonding height of the metal pillar 133 and the wire bonding height of the first shielding arc 141. Optionally, the grounding pad 111 and the wire bonding pad 116 can be embedded in the transition block 117, so that the upper surfaces of the grounding pad 111 and the wire bonding pad 116 are flush with the upper surface of the transition block 117, which can also protect the grounding pad 111 and the wire bonding pad 116.

[0123] Combination Figure 17In this embodiment, the electromagnetic shielding structure 100, regardless of which of the aforementioned structural forms is used, can have a groove 151 formed on the encapsulation body 150, with the shielding barrier layer 130 and / or the reinforcing shielding layer 140 exposed in the groove 151. A conductive layer 153 is provided within the groove 151, and the conductive layer 153 is connected to the shielding barrier layer 130 and / or the reinforcing shielding layer 140 respectively. The metal layer 160 and the conductive layer 153 are electrically connected. Optionally, shielding metal pillars are exposed from the groove 151. These shielding metal pillars can be one or more metal pillars 133 in the shielding barrier layer 130, or they can be one or more vertical metal lines retained after grinding in the first shielding arc 141. The direction of the groove 151 is not limited; it can be located on the same side of the first electronic device 120 or span different sides of the first electronic device 120. Furthermore, the type and number of shielding metal pillars exposed in the groove 151 are not limited. The conductive layer 153 can be used to connect at least two metal pillars 133, or to connect at least two first shielding arcs 141, or to connect the metal pillars 133 and the first shielding arcs 141 respectively.

[0124] The conductive layer 153 may partially or completely fill the groove 151. The conductive layer 153 may fill only a portion of the groove 151, without completely filling it, such as... Figure 17 and Figure 18 As shown. Alternatively, the conductive layer 153 can be designed to fill the entire groove 151, making the surface of the conductive layer 153 flush with the surface of the encapsulant 150, such as... Figure 19 As shown, the groove 151 and conductive layer 153 improve the bonding force between the metal layer 160 and the molding compound 150, and enhance the electrical connection stability and reliability between the metal layer 160 and the shielding metal pillar. Furthermore, the groove 151 facilitates the release of the internal magnetic field, enhancing the shielding effect for low-frequency signals, while the metal layer 160 primarily shields high-frequency signals. Simultaneously, the groove 151 also relieves some of the structural stress in the molding compound 150, mitigating warping.

[0125] Optionally, combined Figure 17 The conductive layer 153 is disposed along the sidewalls and bottom wall of the groove 151 and the surface of the shielding barrier layer 130 and / or the reinforcing shielding layer 140, so that the surface of the conductive layer 153 is uneven. Multiple shielding metal pillars can be covered by metal sputtering to improve the conductivity between the shielding metal pillars, enabling the connection between the grounding pad 111 and the wire bonding pad 116. The conductive layer 153 can also serve as a seed layer to improve the sputtering adhesion of the metal layers, and the structure of the groove 151 can be used to improve the adhesion of the metal layer 160. Optionally, the surface of the metal layer 160 can be a flat surface or an uneven surface. Preferably, the unevenness of the surface of the metal layer 160 is consistent with the unevenness of the conductive layer 153.

[0126] Combination Figure 18The conductive layer 153, made of metal sputtering, electroplating, or conductive adhesive material, fills the bottom of the groove 151, forming a platform structure at its bottom. This means the surface of the conductive layer 153 is flat and lower than the surface of the molding compound 150. The conductive layer 153 protects the exposed wire bonding structure, specifically the shielding metal pillars exposed from the groove 151. It also improves electrical connection stability and bonding strength.

[0127] Combination Figure 19 The conductive layer 153, made of metal sputtering, electroplating, or conductive adhesive, fills the entire groove 151. The surface of the conductive layer 153 is flat and flush with the surface of the molding compound 150. The conductive layer 153 protects the exposed wire bonding structure, specifically the shielding metal pillars exposed from the groove 151. It also improves electrical connection stability and bonding strength.

[0128] The conductive layer 153 can be made of conductive adhesive or metal material. The metal material includes, but is not limited to, Ni-Fe alloy, Cu-Ni-Fe alloy, copper-silver-iron alloy, etc. The metal layer 160 can be made of similar metal material, such as at least one of Ni-Fe alloy, Cu-Ni-Fe alloy, copper-silver-iron alloy, etc.

[0129] It is easy to understand that the groove 151 can be created after grinding the encapsulated body 150, that is, after grinding the first shielding arc 141, the groove 151 can be created.

[0130] Combination Figure 20 The shielding barrier layer 130 and the reinforcing shielding layer 140 are exposed at different heights in the groove 151. That is, the heights of the metal pillars 133 exposed in the groove 151 and the vertical segments in the first shielding arc 141 are not equal, forming a high-low pillar structure. Alternatively, the heights of multiple metal pillars 133 in the shielding barrier layer 130 exposed in the groove 151 are not equal; or the heights of multiple vertical segments in the reinforcing shielding layer 140 exposed in the groove 151 are not equal. In this embodiment, a conductive layer 153 may or may not be provided. If a conductive layer 153 is provided, it connects the metal pillars 133 of different heights and the first shielding arc 141, and the surface of the conductive layer 153 may also have an uneven, bumpy structure.

[0131] It should be understood that the above-mentioned structural features can be arbitrarily combined to obtain an electromagnetic shielding structure 100 suitable for various scenarios, which will not be described in detail here.

[0132] Second Embodiment

[0133] Combination Figure 21 and Figure 22 This invention provides a method for manufacturing an electromagnetic shielding structure, comprising:

[0134] S1: Attach the first electronic device 120 on the substrate 110; wherein, the substrate 110 is provided with a grounding pad 111.

[0135] The substrate 110 can be a substrate, silicon substrate, PCB board, MIS substrate, or ceramic substrate, etc. Grounding pads 111 and wire bonding pads 116 are designed on the surface of the substrate 110 in areas requiring partitioned shielding. The grounding pads 111 are used for electrical connection with the shielding structure, and the wire bonding pads 116 are used for vertical wire bonding to form metal pillars 133. The first electronic device 120 can be a chip, such as an RF chip requiring shielding, or other components. It can be understood that, in addition to the shielding area, functional pads can also be provided on the substrate 110 for mounting the first electronic device 120 and the second electronic device 180. The second electronic device 180 can be chips and components that do not require shielding, such as power amplifier chips.

[0136] S2: A shielding barrier layer 130 is provided on the outer periphery of the first electronic device 120; wherein the shielding barrier layer 130 has a corner portion 131. Optionally, a plurality of metal pillars 133 surrounding the outer side of the first electronic device 120 are formed by vertical wiring. The metal pillars 133 can be arranged in any shape such as rectangle, triangle, parallelogram, U-shape, L-shape or T-shape.

[0137] Optionally, the metal pillars 133 can be formed by crossing arcs, specifically, with both ends of the crossing arc connected to two wire bonding pads 116 respectively. The crossing direction can be any direction; for example, the two wire bonding pads 116 can be on the same side, adjacent side, or opposite side of the first chip 121, without limitation. Preferably, the crossing arc includes two vertical line segments and an arc segment connecting the two vertical line segments. In subsequent processes, the arc segment can be removed by grinding, retaining the vertical line segments to form the spaced metal pillars 133.

[0138] S3: An enhanced shielding layer 140 is provided at the corner 131; wherein the enhanced shielding layer 140 is electrically connected to the grounding pad 111. The grounding pad 111 includes a first pad 113 and a second pad 115. Optionally, the first pad 113 is on the reverse extension line of the metal pillars 133 arranged in the first direction, and the second pad 115 is on the reverse extension line of the metal pillars 133 arranged in the second direction, i.e., located outside the corner 131. Wires are punched on the first pad 113 and the second pad 115 to form a first shielding arc 141. Preferably, the highest point of the first shielding arc 141 is higher than the metal pillars 133. The two ends of the first shielding arc 141 are respectively connected to the first pad 113 and the second pad 115, which have grounding characteristics. By providing the first shielding arc 141, the electromagnetic shielding effect of the corner 131 can be improved. The first pad 113 is on the reverse extension line of the metal pillars 133 arranged in the first direction, and the second pad 115 is on the reverse extension line of the metal pillars 133 arranged in the second direction, thereby forming a first shielding arc 141 with a width of L1 at the corner 131, effectively blocking the winding noise of the corner 131 and improving the electromagnetic shielding effect.

[0139] S4: Dispensing. The dispensing process is performed along the shielding barrier layer 130 and the reinforcing shielding layer 140, forming a bottom protective adhesive 170 on the substrate 110. The adhesive enhances the bonding strength of the metal pillars 133 and the shielding arcs. The adhesive forms a barrier at the corner 131, further improving the electromagnetic shielding effect in the corner area. It can be understood that the placement of the first shielding arc 141 also improves the capillary effect of the adhesive, enhancing its flowability and improving dispensing efficiency and quality.

[0140] S5: A molding compound 150 is formed on the substrate 110 to protect the first electronic device 120, the shielding barrier layer 130, and the reinforcing shielding layer 140. The molding process is used for encapsulation. High thermal conductivity molding compounds can be used, such as epoxy-based resins or silicone-based resins, with the addition of high thermal conductivity materials, such as alumina thermally conductive powder or nano-alumina, to achieve high thermal conductivity characteristics in the product. The first shielding arc 141 can block the molding flow during the molding process, preventing the metal pillars 133 from deforming due to the impact of the molding flow. This helps maintain the uniformity and stability of the density of the metal pillars 133, thereby improving the electromagnetic shielding effect.

[0141] A ball-planting process is performed on the side of the substrate 110 away from the molding compound 150 to form solder balls 190 on the back side. It is easy to understand that a grounding layer 191 is provided within the substrate 110, and the grounding function of the corresponding solder balls 190 is achieved through grounding pins on the substrate 110. Of the solder balls 190 on the substrate 110, some are grounding solder balls, and some are functional connection solder balls.

[0142] Optionally, the molding compound 150 is ground to expose the first shielding arc 141 and the metal pillar 133 from the surface of the molding compound 150. During grinding, the grinding depth must reach the point where the first shielding arc 141 is cut off, i.e., a portion of the peak of the first shielding arc 141 is removed, thereby dividing the first shielding arc 141 into at least two arc structures. It can be understood that if the height of the first shielding arc 141 is higher than the metal pillar 133, the height difference between the two only needs to be ground away to expose both the shielding arc and the metal pillar 133 simultaneously. In other words, after grinding, the metal pillar 133 and the first shielding arc 141 are at the same height and located on the same plane. If the height of the first shielding arc 141 is lower than or equal to the height of the metal pillar 133, the metal pillar 133 must be ground first, followed by the first shielding arc 141, increasing the grinding area, reducing grinding efficiency, and potentially causing deformation of the metal pillar 133, resulting in bridging between the metal pillar 133 and the first shielding arc 141, affecting the electromagnetic shielding function. In this embodiment, the height of the first shielding arc 141 is higher than that of the metal pillar 133, which can overcome the above-mentioned disadvantages.

[0143] Optionally, after grinding, a groove 151 is formed on the encapsulation body 150, through which the shielding metal pillars are exposed. A conductive layer 153 is disposed within the groove 151 to connect multiple shielding metal pillars. Then, a metal layer 160 is formed on the surface of the encapsulation body 150, and the metal layer 160 is electrically connected to the conductive layer 153. This arrangement can improve the bonding force of the metal layer 160, improve the stability and reliability of the electrical connection, reduce resistance, and enhance the shielding effect, especially the shielding effect for low-frequency signals.

[0144] The molding compound 150 and the substrate 110 are cut to form a single product. Metal sputtering is performed on the upper surface and four sidewalls of the molding compound 150 of the single product to form a metal layer 160. The metal layer 160 is electrically connected to the shielding barrier layer 130 and the reinforcing shielding layer 140, respectively. Specifically, the metal layer 160 is connected to the upper end face of the metal pillar 133 and the ground first shielding arc 141 to achieve zoned electromagnetic shielding.

[0145] Of course, the specific production methods are not limited to those described above. (Combined with...) Figure 23In some embodiments, the substrate 110 may be arranged in a double row. After chip mounting, wire bonding, adhesive scribing, molding, grinding, and ball bonding, a metal layer 160 is first deposited on the molding compound 150, and then the metal layer 160, the molding compound 150, and the substrate 110 are cut to form a single product. This can significantly improve the efficiency of metal layer 160 placement, completing the placement of the metal layer 160 on the entire substrate 110 in one go. It can be understood that on the double-row substrate 110, at least two groups of packaged products are symmetrically distributed, that is, the first electronic device 120 of one group and the first electronic device 120 of another group are symmetrically distributed; the second electronic device 180 of one group and the second electronic device 180 of another group are symmetrically distributed.

[0146] Of course, the metal layer 160 can be formed by sputtering, electroplating, attaching metal film or conductive film, etc., and no specific limitation is made here.

[0147] Other parts not mentioned in this embodiment are similar to those described in the first embodiment and will not be repeated here.

[0148] In summary, the electromagnetic shielding structure 100 and its manufacturing method provided by the embodiments of the present invention have the following beneficial effects:

[0149] The electromagnetic shielding structure 100 and its manufacturing method provided in this embodiment of the invention include an enhanced shielding layer 140 at the corner 131 of the shielding barrier layer 130. The enhanced shielding layer 140 is connected to the grounding pad 111 on the substrate 110, which can effectively prevent clutter from accumulating at the corner 131 and passing through the shielding barrier layer 130, thereby enhancing the electromagnetic shielding effect and preventing clutter from interfering with the first electronic device 120. Furthermore, the first shielding arc 141 can block the impact deformation of the molding flow on the metal pillar 133, resulting in a stable structure and good electromagnetic shielding effect.

[0150] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An electromagnetic shielding structure, characterized in that, include: A substrate having a grounding pad on it; A first electronic device, which is disposed on the substrate and electrically connected to the substrate; A shielding barrier layer, wherein the first electronic device is located within the barrier area enclosed by the shielding barrier layer; The shielding barrier layer is provided with a corner section; An enhanced shielding layer is provided at the corner portion and is electrically connected to the grounding pad; The enhanced shielding layer includes a first shielding arc, and the grounding pad includes a first pad and a second pad. One end of the first shielding arc is connected to the first pad, and the other end is connected to the second pad. A molding compound, wherein the molding compound is disposed on the substrate and covers the first electronic device, the shielding barrier layer and the enhanced shielding layer; A metal layer is disposed on the encapsulation body, and the metal layer is electrically connected to the shielding barrier layer and the reinforcing shielding layer, respectively.

2. The electromagnetic shielding structure according to claim 1, characterized in that, The shielding barrier layer includes a plurality of metal pillars evenly spaced apart, the metal pillars being arranged along at least two different directions, and the corner portion being located at the intersection of the two directions.

3. The electromagnetic shielding structure according to claim 2, characterized in that, The heights of the multiple metal pillars may be equal or unequal.

4. The electromagnetic shielding structure according to claim 2, characterized in that, The first shielding arc is located on the side of the corner away from the first electronic device.

5. The electromagnetic shielding structure according to claim 4, characterized in that, The distance between the first pad and the shielding barrier layer in the first direction is a first distance, and the distance between the second pad and the shielding barrier layer in the second direction is a second distance. The first distance and the second distance are equal; the first direction and the second direction are different.

6. The electromagnetic shielding structure according to claim 5, characterized in that, The distance between two adjacent metal pillars in the first direction is a first distance, and the distance between two adjacent metal pillars in the second direction is a first distance.

7. The electromagnetic shielding structure according to claim 2, characterized in that, The first shielding arc includes at least one crest, the height of which is higher than the height of the metal pillar.

8. The electromagnetic shielding structure according to claim 1, characterized in that, The first shielding arc includes at least one trough, and there is a predetermined distance between the trough and the substrate.

9. The electromagnetic shielding structure according to claim 2, characterized in that, The first shielding arc includes two vertical line segments perpendicular to the substrate and an arc segment connecting the two vertical line segments; the height of the vertical line segments is different from the height of the metal pillar.

10. The electromagnetic shielding structure according to claim 9, characterized in that, The substrate is provided with wire bonding pads, and the shielding barrier layer and the wire bonding pads are electrically connected; of the vertical line segment and the metal pillar, the higher one is electrically connected to the metal layer, and the grounding pad and the wire bonding pad are connected in series through a series wiring layer; Alternatively, one or more of the higher vertical segments are electrically connected to the metal layer. Alternatively, one or more of the higher metal pillars are electrically connected to the metal layer.

11. The electromagnetic shielding structure according to claim 1, characterized in that, The enhanced shielding layer also includes reinforced conductive pillars, which are located on the side of the corner closest to the first electronic device; And / or the reinforcing conductive post is located on the side of the corner away from the first electronic device.

12. The electromagnetic shielding structure according to claim 1, characterized in that, The enhanced shielding layer also includes a second shielding arc, which is located on the side of the corner closer to the first electronic device.

13. The electromagnetic shielding structure according to claim 1, characterized in that, The metal layer covers the reinforcing shielding layer and the shielding barrier layer.

14. The electromagnetic shielding structure according to claim 1, characterized in that, The shielding barrier layer is electrically connected to the grounding pad.

15. The electromagnetic shielding structure according to claim 1, characterized in that, It also includes a second electronic device, which is disposed on the side of the substrate where the shielding barrier layer is provided, and / or the second electronic device is disposed on the side of the substrate away from the shielding barrier layer.

16. The electromagnetic shielding structure according to claim 1, characterized in that, The substrate is also provided with a bottom protective adhesive, which is used to protect the end of the shielding barrier layer near the substrate and the end of the reinforcing shielding layer near the substrate.

17. The electromagnetic shielding structure according to claim 1, characterized in that, The substrate has a protruding adapter block, and the substrate has a wire bonding pad connected to the shielding barrier layer. The grounding pad and / or the wire bonding pad are located on the adapter block.

18. The electromagnetic shielding structure according to claim 1, characterized in that, At least one side of the shielding barrier layer adopts a double-layer design, and the two shielding barrier layers are aligned or staggered.

19. The electromagnetic shielding structure according to any one of claims 1 to 18, characterized in that, The shielding barrier layer is polygonal and surrounds the outer periphery of the first electronic device.

20. The electromagnetic shielding structure according to claim 19, characterized in that, The shielding barrier layer is in the shape of a rhombus, square, rectangle or triangle and is disposed on the outer periphery of the first electronic device.

21. The electromagnetic shielding structure according to any one of claims 1 to 18, characterized in that, The encapsulation body has a groove, and the shielding barrier layer and / or the reinforcing shielding layer are exposed in the groove.

22. The electromagnetic shielding structure according to claim 21, characterized in that, A conductive layer is provided in the groove, and the conductive layer is connected to the shielding barrier layer and / or the reinforcing shielding layer respectively; the metal layer and the conductive layer are electrically connected.

23. The electromagnetic shielding structure according to claim 22, characterized in that, The conductive layer may partially or completely fill the groove.

24. The electromagnetic shielding structure according to claim 22, characterized in that, The conductive layer is disposed along the sidewalls and bottomwalls of the groove, as well as the surface of the shielding barrier layer and / or the reinforcing shielding layer, so that the surface of the conductive layer is irregular.

25. The electromagnetic shielding structure according to claim 24, characterized in that, The surface of the metal layer is irregularly shaped, and the irregularity of the metal layer is consistent with that of the conductive layer.

26. The electromagnetic shielding structure according to claim 21, characterized in that, The heights at which the shielding barrier layer and the reinforcing shield layer are exposed in the groove are inconsistent; or the heights at which multiple metal pillars in the shielding barrier layer are exposed in the groove are inconsistent; or the heights at which multiple vertical line segments in the reinforcing shield layer are exposed in the groove are inconsistent.

27. An electromagnetic shielding structure, characterized in that, include: A substrate having a grounding pad on it; A first electronic device, which is disposed on the substrate and electrically connected to the substrate; A shielding barrier layer is provided, wherein the first electronic device is located within the barrier area enclosed by the shielding barrier layer; the shielding barrier layer is provided with a corner portion; the shielding barrier layer includes a plurality of spaced metal pillars, the metal pillars being connected to the grounding pad; The corner section includes a reference post, a first metal post, and a second metal post; the reference post and the first metal post are separated by a first length, the reference post and the second metal post are separated by a second length, and the first metal post and the second metal post are separated by a third length, wherein the third length is less than or equal to the first length or the second length; wherein, the first metal post is the metal post adjacent to the reference post among a plurality of metal posts arranged along a first direction, the second metal post is the metal post adjacent to the reference post among a plurality of metal posts arranged along a second direction, and the reference post is located at the intersection of the first direction and the second direction; An enhanced shielding layer is provided on the side of the corner portion that is close to and / or far from the first electronic device; A molding compound is disposed on the substrate and covers the first electronic device and the shielding barrier layer; the molding compound has a groove, and the shielding barrier layer and / or the reinforced shielding layer are exposed in the groove; A metal layer is disposed on the encapsulation body and is electrically connected to the shielding barrier layer.

28. The electromagnetic shielding structure according to claim 27, characterized in that, The first length is equal to the second length.

29. The electromagnetic shielding structure according to claim 27, characterized in that, The shielding barrier layer is triangular in shape.

30. The electromagnetic shielding structure according to claim 27, characterized in that, At least one side of the shielding barrier layer adopts a double-layer design, and the two shielding barrier layers are aligned or staggered.

31. The electromagnetic shielding structure according to claim 27, characterized in that, The heights at which the shielding barrier layer and the reinforcing shield layer are exposed in the groove are inconsistent; or the heights at which multiple metal pillars in the shielding barrier layer are exposed in the groove are inconsistent; or the heights at which multiple vertical line segments in the reinforcing shield layer are exposed in the groove are inconsistent.

32. The electromagnetic shielding structure according to claim 27, characterized in that, A conductive layer is provided in the groove, and the conductive layer is connected to the shielding barrier layer and / or the reinforcing shielding layer respectively; the metal layer and the conductive layer are electrically connected.

33. The electromagnetic shielding structure according to claim 32, characterized in that, The conductive layer may partially or completely fill the groove.

34. The electromagnetic shielding structure according to claim 32, characterized in that, The conductive layer is disposed along the sidewalls and bottomwalls of the groove, as well as the surface of the shielding barrier layer and / or the reinforcing shielding layer, so that the surface of the conductive layer is irregular.

35. A method for manufacturing an electromagnetic shielding structure, characterized in that, include: A first electronic device is mounted on a substrate; wherein, the substrate is provided with a ground pad; the ground pad includes a first pad and a second pad; A shielding barrier layer is provided on the outer periphery of the first electronic device; wherein the shielding barrier layer has a corner portion; An enhanced shielding layer is provided at the corner; wherein the enhanced shielding layer is electrically connected to the grounding pad; wires are punched on the first pad and the second pad to form a first shielding arc; wherein the height of the first shielding arc is not less than the height of the enhanced shielding layer; A molding compound is formed on the substrate to protect the first electronic device, the shielding barrier layer, and the enhanced shielding layer; A metal layer is disposed on the molding compound; wherein the metal layer is electrically connected to the shielding barrier layer and the reinforcing shielding layer respectively.

36. The method for manufacturing an electromagnetic shielding structure according to claim 35, characterized in that, The height of the first shielding arc is higher than the height of the enhanced shielding layer; after the step of forming the encapsulation on the substrate, the encapsulation is ground to expose the first shielding arc and the shielding barrier layer.

37. The method for manufacturing an electromagnetic shielding structure according to claim 35, characterized in that, Also includes: Balls are implanted on the side of the substrate away from the encapsulation body; Cut the encapsulation body and the substrate to form a single product; The step of setting a metal layer on the encapsulated body includes: forming a metal layer on a single product.

38. The method for manufacturing an electromagnetic shielding structure according to claim 35, characterized in that, The substrate is arranged in a double row; the method further includes: Balls are implanted on the side of the substrate away from the encapsulation body; A metal layer is provided on the molding compound; The metal layer, the molding compound, and the substrate are cut to form a single product.

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