Hardware acceleration device and electronic device

Abstract

The application provides a hardware acceleration device and an electronic device, relates to the technical field of electronic devices, and aims to solve the problem of single function of a hardware accelerator in the prior art.The hardware acceleration device comprises a power-on component, an interchangeable heat dissipation component and a fan component integrated in a shell;the fan component and the power-on component are arranged on the inner wall surface of the shell at intervals;the fan component is arranged close to the open end of the shell;and the interchangeable heat dissipation component is arranged on the power-on component.The power-on component is configured to perform electric energy transmission on multiple electric elements in the shell;and the interchangeable heat dissipation component is configured to perform heat dissipation treatment on the surface of the power-on component.The application integrates multiple structures in the same shell and reasonably arranges the multiple structures, so that different functions of the multiple structures can be realized simultaneously on the basis of ensuring normal work of the hardware acceleration device, thereby meeting the integrated mode of high heat, large current and high reliability.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and more particularly to a hardware acceleration device and an electronic device. Background Technology

[0002] Electronic devices are composed of electronic components such as integrated circuits, transistors, and vacuum tubes, including computers, mobile communication products, and video recorders. With the rapid development of electronic technology, users' requirements are also increasing, and the operating speed of electronic devices needs to be further improved to meet these requirements, thus leading to the emergence of hardware accelerators.

[0003] Hardware accelerators utilize hardware modules to replace algorithms, fully leveraging the inherent speed of hardware. Taking a computer as an example, a hardware accelerator is assembled in the computer case. During manufacturing, multiple chips are first made into hardware accelerator cards, and multiple hardware accelerator cards are integrated together to form a hardware accelerator, thereby providing the computer with highly agile, highly reliable, and high-performance computing power.

[0004] However, the hardware accelerators in related technologies have relatively limited functionality. Summary of the Invention

[0005] To address the problems mentioned in the background art, this application provides a hardware acceleration device and an electronic device. By integrating multiple structures into the same housing and arranging them in a reasonable manner, the hardware acceleration device can achieve different functions of multiple structures while ensuring normal operation. This satisfies the integration requirements of high heat, high current, and high reliability, and solves the problem of the relatively limited functionality of hardware accelerators in related technologies.

[0006] To achieve the above objectives, a first aspect of the embodiments of this application provides a hardware acceleration device, including a power-conducting component, an interchangeable heat dissipation component, and a fan component integrated in the housing, wherein the fan component and the interchangeable heat dissipation component are both electrically connected to the power-conducting component;

[0007] The fan assembly and the power supply assembly are spaced apart on the bottom wall surface of the housing, the fan assembly is located near the end of the housing, and the interchangeable heat dissipation assembly is located on the power supply assembly;

[0008] The power-conducting component is configured to transmit electrical energy to a plurality of electrical components in the housing, and the interchangeable heat dissipation component is configured to dissipate heat from the surface of the power-conducting component when the surface temperature of the power-conducting component exceeds a preset temperature.

[0009] The fan assembly is configured to blow air onto the surface of the energized component when the surface temperature of the energized component exceeds a preset temperature.

[0010] A second aspect of this application provides an electronic device including a housing and the aforementioned hardware acceleration device; the housing has a cavity, and the hardware acceleration device is disposed in the cavity.

[0011] The hardware acceleration device and electronic device provided in this application embodiment, by including a power-conducting component, enable power transfer between multiple electrical components within the housing, thereby maintaining the power balance and supply requirements of the hardware acceleration device, ensuring its stability and high reliability. By including an interchangeable heat dissipation component, on the one hand, the heat dissipation component is used to dissipate heat from the surface of the power-conducting component to maintain the thermal balance of the hardware acceleration device, preventing burnout due to excessive heat and ensuring normal operation even when the heat is too low; on the other hand, the heat dissipation component is interchangeable, allowing the user to choose the appropriate type based on their needs. Choosing any heat dissipation component based on real-world scenarios broadens the application range and improves the user experience. By incorporating a fan assembly, the surface of the powered component can be promptly ventilated, further ensuring the thermal balance and stability of the hardware acceleration device. Integrating the powered component, interchangeable heat dissipation component, and fan assembly into a single housing, and rationally arranging them, allows for the simultaneous realization of various structural functions while ensuring the normal operation of the hardware acceleration device. This satisfies the requirements of high heat generation, high current, and high reliability in integrated solutions, addressing the issue of limited functionality in related hardware accelerators.

[0012] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the hardware acceleration device and electronic device provided by the embodiments of this application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the hardware acceleration device provided in the embodiments of this application;

[0015] Figure 2 An exploded view of the hardware acceleration device provided in the embodiments of this application;

[0016] Figure 3 This is a schematic diagram of the structure of the fan assembly provided in an embodiment of this application;

[0017] Figure 4 This is a schematic diagram of the fan assembly assembled in the housing according to an embodiment of this application;

[0018] Figure 5 Exploded view of the mounting box and fan provided in the embodiments of this application;

[0019] Figure 6 This is a schematic diagram of the fan assembly in the mounting box provided in an embodiment of this application;

[0020] Figure 7 A schematic diagram of the anti-backflow plate, reset elastic element, and fan in one state provided in an embodiment of this application;

[0021] Figure 8 A schematic diagram of the anti-backflow plate, reset elastic element, and fan in another state provided in an embodiment of this application;

[0022] Figure 9 An exploded view of a conductive connector with a first structure provided in the embodiments of this application;

[0023] Figure 10 A schematic diagram of the assembled conductive connector of the first structure provided in the embodiments of this application;

[0024] Figure 11 A schematic diagram of the assembled structure of the power-conducting component of the first structure provided in the embodiments of this application;

[0025] Figure 12 This is a schematic diagram of the structure of the conductive connector with the second structure provided in the embodiments of this application;

[0026] Figure 13 A schematic diagram of the assembled power-conducting component of the second structure provided in the embodiments of this application;

[0027] Figure 14 An exploded view of the conductive connector with the third structure provided in the embodiments of this application;

[0028] Figure 15 A schematic diagram of the assembled conductive connector of the third structure provided in the embodiments of this application;

[0029] Figure 16 A schematic diagram of the assembled structure of the power-conducting component of the third structure provided in the embodiments of this application;

[0030] Figure 17This is a schematic diagram of the liquid-cooled heat sink provided in an embodiment of this application.

[0031] Explanation of reference numerals in the attached figures:

[0032] 100 - Hardware acceleration device;

[0033] 110 - Power supply components; 111 - Power supply components; 112 - Electrical components;

[0034] 113-Conductive connector; 1131-First conductive connector; 11311-First connecting part;

[0035] 113111-Card slot; 11312-Second connecting part; 113121-Clamping part;

[0036] 1132 - Second conductive connector; 11321 - First extension section; 11322 - Second extension section;

[0037] 11323 - Connecting section; 1133 - Third conductive connector; 11331 - First mounting part;

[0038] 113311-Slider; 11332-Second mounting part; 113321-Groove;

[0039] 120 - Interchangeable heat dissipation components; 121 - Air-cooled radiator; 122 - Liquid-cooled radiator;

[0040] 1221 - Circuit board; 1222 - Liquid cooling plate; 1223 - Leakage detection board;

[0041] 1224 - Rear window; 1225 - Connecting pipes; 1226 - Pipe clamp;

[0042] 1227 - Pipe clamp section; 1228 - Pipe clamp area; 130 - Fan assembly;

[0043] 131-Mounting box; 1311-Mounting section; 1312-Mounting cavity;

[0044] 132-Fan; 133-Anti-backflow plate; 134-Reset elastic element;

[0045] 200 - Electronic device; 210 - Housing; 211 - Cavity. Detailed Implementation

[0046] Hardware accelerators utilize hardware modules to replace algorithms, fully leveraging the inherent speed of hardware and making reasonable use of its characteristics to enable users to experience faster speeds and higher efficiency.

[0047] Taking a computer as an example, a hardware accelerator is installed in the computer case. During the manufacturing process, multiple chips are first made into hardware accelerator cards. Multiple hardware accelerator cards are integrated together to form a hardware accelerator, thereby providing the computer with highly agile, highly reliable, and high-performance computing power. However, the functions of hardware accelerators in related technologies are relatively simple and cannot meet the integration requirements of high heat, high current, and high reliability.

[0048] To address the aforementioned technical problems, this application provides a hardware acceleration device and an electronic device. By including a power-conducting component, power transfer between multiple electrical components within the housing can be achieved, thereby maintaining the power balance and supply requirements of the hardware acceleration device, ensuring its stability and high reliability. Furthermore, by including an interchangeable heat dissipation component, on the one hand, the heat dissipation component is used to dissipate heat from the surface of the power-conducting component to maintain the thermal balance of the hardware acceleration device, preventing burnout due to excessive heat and ensuring normal operation even when the heat is too low; on the other hand, the heat dissipation component is interchangeable, allowing users to... Any heat dissipation component can be selected according to the actual scenario, making its application range wider and improving the user experience. By setting up a fan component, the surface of the powered component can be ventilated in a timely manner, thereby further ensuring the thermal balance and stability of the hardware acceleration device. By integrating the powered component, interchangeable heat dissipation component, and fan component into the housing and rationally arranging them, the hardware acceleration device can simultaneously achieve different functions of multiple structures while ensuring normal operation. This meets the requirements of high heat, high current, and high reliability integration, solving the problem of the relatively single function of hardware accelerators in related technologies.

[0049] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0050] Example 1

[0051] See Figure 1 and Figure 2 As shown, this application embodiment provides a hardware acceleration device 100, which is disposed in the housing 210 of an electronic device 200. It includes a power supply component 110, an interchangeable heat dissipation component 120 and a fan component 130 integrated in the housing 210. The fan component 130 and the interchangeable heat dissipation component 120 are both electrically connected to the power supply component 110.

[0052] In this embodiment, the power supply components 110 are spaced apart on the bottom wall of the housing 210 and are configured to transmit electrical energy between multiple electrical components in the housing 210. That is, the power supply components 110 may include power supply components 111 and power consumption components 112. In this way, the power supply components 111 provide the required electrical energy to the power consumption components 112, thereby maintaining the power balance and power supply requirements of the hardware acceleration device 100, and ensuring the stability and high reliability of the hardware acceleration device 100.

[0053] In this embodiment, the interchangeable heat dissipation component 120 is disposed on the power-on component 110. The interchangeable heat dissipation component 120 is configured to dissipate heat from the surface of the power-on component 110 when the surface temperature exceeds a preset temperature. On the one hand, when the heat dissipation component is disposed, it is used to dissipate heat from the surface of the power-on component 110 to maintain the thermal balance of the hardware acceleration device 100, thereby avoiding the problem of the hardware acceleration device 100 burning out due to excessive heat, and avoiding the problem of the hardware acceleration device 100 affecting normal operation due to excessively low heat. On the other hand, the heat dissipation component in this embodiment is interchangeable and can include air-cooled heat sinks and liquid-cooled heat sinks. That is, users can choose any heat dissipation component according to the actual scenario, which has a wider range of applications and a better user experience.

[0054] In this embodiment, the fan assembly 130 is disposed on the bottom wall of the housing 210 and is located near the end of the housing 210. By disposing of the fan assembly 130, the surface of the powered component 110 can be ventilated in a timely manner, thereby further ensuring the heat balance and stability of the hardware acceleration device 100. In addition, by placing the fan assembly 130 near the end, it is easy to install and will not interfere with other components.

[0055] In this embodiment, the power-conducting component 110, the interchangeable heat dissipation component 120, and the fan component 130 are integrated into the housing 210, and the power-conducting component 110, the interchangeable heat dissipation component 120, and the fan component 130 are arranged in a reasonable manner. It should be noted that integration means integrating structures with multiple functions into one structure, or combining various parts of the same structure together to reflect the different functions of multiple structures. In addition, the specific implementation method of reasonable arrangement is not further limited, and can be set according to actual needs, usage scenarios, or usage functions.

[0056] In this way, while ensuring the normal operation of the hardware acceleration device 100, it can also realize the different functions of multiple structures at the same time, thereby meeting the requirements of high heat, high current and high reliability integration, and solving the problem of the relatively single function of hardware accelerators in related technologies.

[0057] In one possible approach, see [link to relevant documentation] Figures 3 to 6 As shown, the fan assembly 130 includes a mounting housing 131 and a fan 132, wherein the mounting housing 131 is disposed near the end of the housing 210 (see details). Figure 4 As shown, the mounting box 131 has a mounting cavity 1312, and the fan 132 is disposed in the mounting cavity 1312. By setting up the mounting box 131, on the one hand, it is convenient to install the fan 132; on the other hand, it can also protect the fan 132 and prevent the fan 132 from interfering with other components.

[0058] Specifically, the fan 132 has an air inlet and an air outlet. The air inlet is located on the side of the fan 132 closer to the energized component 110, and the air outlet is located on the side of the fan 132 away from the energized component 110. The air inlet and the air outlet are connected, and the air outlet is connected to the outside. The air inlet is used to draw in heat from the surface of the energized component 110 and conduct it to the air outlet. The air outlet is used to carry the heat out to the outside. Thus, the heat dissipation of the energized component 110 can be completed through the above process.

[0059] In one feasible manner, see [link to relevant documentation]. Figure 7 and Figure 8 As shown, the fan assembly 130 also includes an anti-backflow plate 133 and a reset elastic member 134. The anti-backflow plate 133 is disposed in the mounting box 131 and is located between the fan 132 and the top wall of the mounting box 131. The reset elastic member 134 is located between the anti-backflow plate 133 and the top wall of the mounting box 131, and the anti-backflow plate 133 is connected to the top wall of the mounting box 131 through the reset elastic member 134.

[0060] It should be added that, in this embodiment, when the fan 132 needs to be replaced, the fan 132 is pulled out of the mounting box 131. This will cause the airflow inside the housing 210 to flow back. Specifically, the airflow will flow back into the housing 210 along the gap where the fan 132 was pulled out, thereby affecting the normal operation of the system.

[0061] Therefore, in this embodiment, by providing an anti-backflow plate 133 and a reset elastic element 134, when the fan 132 is pulled out, the anti-backflow plate 133 springs down under the action of the reset elastic element 134. The anti-backflow plate 133 blocks the opening of the mounting cavity 1312, thereby preventing airflow leakage and preventing external airflow from flowing back into the housing 210, thus protecting the normal operation of the system. For details on the state of the anti-backflow plate 133 when it springs down, please refer to... Figure 7 As shown.

[0062] Similarly, while assembling the fan 132 into the mounting box 131, the fan 132 presses against the anti-backflow plate 133, so that the anti-backflow plate 133 is firmly attached to the top wall of the mounting box 131. See details below. Figure 8 As shown.

[0063] It should be noted that the specific structure of the reset elastic element 134 is not further limited. For example, the reset elastic element 134 can be a spring. In addition, the connection method between the reset elastic element 134 and the anti-backflow plate 133 and the top wall of the mounting box 131 is not further limited. It can be connected by a snap-fit ​​or by other means.

[0064] In one possible implementation, the mounting box 131 may include a plurality of mounting parts 1311, which are arranged sequentially in the mounting box 131. It should be noted that the arrangement order of the plurality of mounting parts 1311 is not further limited. For example, they can be arranged horizontally or vertically in sequence. In this embodiment, two horizontal rows and five vertical rows are specifically used as an example for explanation.

[0065] The mounting cavity 1312 is formed in the mounting box 131. There are multiple fans 132, and the multiple fans 132 are installed in the mounting part 1311 one by one. There are multiple anti-backflow plates 133 and multiple reset elastic members 134. The multiple anti-backflow plates 133 are disposed between the fans 132 and the top wall of the mounting box 131, and the multiple reset elastic members 134 are disposed between the anti-backflow plates 133 and the top wall of the mounting box 131.

[0066] It should be noted that the number of fans 132, anti-backflow plates 133, and reset elastic elements 134 is not further limited. For example, there can be two, three, or more. In this embodiment, ten fans 132, ten anti-backflow plates 133, and ten reset elastic elements 134 are specifically used as an example for explanation. This can maximize the heat dissipation of the energized component 110, solve the system operation of the electronic device 200 under high current and high energy consumption conditions, and prevent airflow leakage to the greatest extent.

[0067] In addition, in this embodiment, by independently assembling multiple fans 132 in the mounting cavity 1312, and the multiple mounting cavities 1312 forming a large mounting box 131, the above-mentioned modular design facilitates the installation and disassembly of the fans 132, making it convenient for users to use, highly operable, and improving the user experience; on the other hand, it is easier to realize in processing and manufacturing.

[0068] In one possible approach, see [link to relevant documentation] Figures 9 to 16As shown, the power-conducting assembly 110 includes a power supply component 111 and a power consumption component 112, which are electrically connected. The power supply component 111 is disposed on the bottom wall surface of the housing 210. The assembly relationship between the power consumption component 112 and the power supply component 111 is not limited. For example, one possible arrangement is that the power consumption component 112 is connected to the power supply component 111 (see details). Figure 11 (as shown); another possible method is to arrange the power supply component 111 and the electrical component 112 at intervals (see details). Figure 13 and Figure 16 As shown, the power supply unit 111 is configured to provide electrical energy to the power consumption unit 112.

[0069] Specifically, in this embodiment, the power supply component 111 can be a PDB, also known as a power distribution board. The PDB, as the power supply component 111 of this application, can provide power to other power-consuming components 112. In addition, the power-consuming components 112 in this embodiment can be HDB and BA. HDB is also known as a hard disk backplane, and BA is also known as a battery.

[0070] In one possible approach, see [link to relevant documentation] Figures 9 to 16 As shown, the power-conducting assembly 110 also includes a conductive connector 113, which is located between the power supply component 111 and the power consumption component 112. Specifically, one end of the conductive connector 113 is connected to the power supply component 111, and the other end of the conductive connector 113 is connected to the power consumption component 112.

[0071] The conductive connector 113 is electrically connected to both the power supply component 111 and the power consumption component 112. The conductive connector 113 is used to conduct electrical energy from the power supply component 111 to the power consumption component 112. The materials of the conductive connector 113, the power supply component 111, and the power consumption component 112 are not specifically limited. In this embodiment, the same material is often used for electrical connection, which makes it less likely to cause potential corrosion. Conversely, if different materials are used, potential corrosion and blackening are likely to occur, which is not conducive to the normal operation of the system.

[0072] It should be noted that in this embodiment, the arrangement of the power-consuming component 112 and the power-supplying component 111, as well as the structure of the conductive connector 113, are not further limited. The following three implementation methods are used as examples for illustration:

[0073] The first possible method is as follows: See Figure 11 As shown, the power supply component 112 is connected to the power supply component 111, and the power supply component 112 is vertically connected to the end of the power supply component 111.

[0074] For details, see Figure 9 and Figure 10 As shown, the conductive connector 113 includes a first conductive connector 1131, which is a T-shaped component. The first conductive connector 1131 includes a first connecting portion 11311 and a second connecting portion 11312 that are vertically connected. One of the first connecting portion 11311 and the second connecting portion 11312 is connected to the power supply component 111, and the other of the first connecting portion 11311 and the second connecting portion 11312 is connected to the power consumption component 112. In this embodiment, the example of the first connecting portion 11311 being connected to the power supply component 111 and the second connecting portion 11312 being connected to the power consumption component 112 is used for illustration.

[0075] By setting the first conductive connector 1131 as a T-shaped part, it is easier to assemble with the power-consuming component 112 and the power supply component 111. In addition, the T-shaped part has a large area, which on the one hand, makes the contact area between the first connector 11311 and the power supply component 111, and the contact area between the second connector 11312 and the power-consuming component 112 larger, thereby realizing the characteristic of high current transmission. On the other hand, the large contact area can ensure the stability of current transmission and avoid the problem of overheating and burning due to poor connection or failure to make contact, further improving the working stability of the system and ensuring the high reliability and trustworthiness of the system.

[0076] Furthermore, during the assembly of the first conductive connector 1131, one of the first connecting portion 11311 and the second connecting portion 11312 is provided with a locking member 113121, and the other of the first connecting portion 11311 and the second connecting portion 11312 is provided with a slot 113111. In this embodiment, the example of the slot 113111 being located on the first connecting portion 11311 and the locking member 113121 being located on the second connecting portion 11312 is described. The locking member 113121 is correspondingly positioned in the slot 113111, and the locking member 113121 engages in the slot 113111 to complete the assembly of the first conductive connector 1131. This arrangement method offers high reliability, facilitates assembly and disassembly, and provides strong operability.

[0077] The second possible method is as follows: See Figure 12 and Figure 13 As shown, the power supply component 112 and the power supply component 111 are arranged at intervals, with the power supply component 112 located on the side of the power supply component 111 away from the bottom wall.

[0078] For details, see Figure 12As shown, the conductive connector 113 includes a second conductive connector 1132, which includes a first extension 11321, a second extension 11322, and a connecting segment 11323 located between the first extension 11321 and the second extension 11322. One of the first extension 11321 and the second extension 11322 is connected to the power supply component 111, and the other of the first extension 11321 and the second extension 11322 is connected to the power consumption component 112. In this embodiment, the first extension 11321 is connected to the power supply component 111, the second extension 11322 is connected to the power consumption component 112, and the connecting segment 11323 connects the first extension 11321 and the second extension 11322. The connecting segment 11323 is a flexible component.

[0079] It should be noted that in this embodiment, the power-consuming component 112 and the power supply component 111 are arranged in parallel. During assembly, there are often certain assembly tolerances, which may lead to poor connection or lack of contact, resulting in overheating and burnout. Therefore, in this embodiment, by setting the connecting segment 11323 as a flexible component, the flexible component has a certain ability to withstand bending. Thus, when certain assembly tolerances occur during assembly, the connecting segment 11323 of the flexible component can withstand the tolerance, thereby avoiding poor connection or lack of contact, and maximizing the working stability of the system, as well as ensuring the high reliability and trustworthiness of the system.

[0080] The third possible method is as follows: See Figures 14 to 16 As shown, the power supply component 112 and the power supply component 111 are arranged at intervals, with the power supply component 112 located on the side of the power supply component 111 away from the bottom wall.

[0081] For details, see Figure 14 and Figure 15 As shown, the conductive connector 113 includes a third conductive connector 1133, which includes a first mounting portion 11331 and a second mounting portion 11332. One of the first mounting portion 11331 and the second mounting portion 11332 is connected to the power supply component 111, and the other of the first mounting portion 11331 and the second mounting portion 11332 is connected to the power consumption component 112. In this embodiment, the example of the first mounting portion 11331 being connected to the power supply component 111 and the second mounting portion 11332 being connected to the power consumption component 112 is used for illustration.

[0082] When assembling the third conductive connector 1133, a slider 113311 is provided on one of the first mounting portion 11331 and the second mounting portion 11332, and a groove 113321 is provided on the other of the first mounting portion 11331 and the second mounting portion 11332. In this embodiment, the slider 113311 is specifically provided on the first mounting portion 11331, and the groove 113321 is provided on the second mounting portion 11332. The slider 113311 and the groove 113321 are correspondingly arranged, and the slider 113311 slides relative to the groove 113321, stopping when it reaches a designated position. The first mounting portion 11331 is connected to the power supply component 111, and the second mounting portion 11332 is connected to the power consumption component 112, thereby completing the assembly of the third conductive connector 1133. This assembly method has high reliability, is easy to assemble and disassemble, and is highly operable.

[0083] It should be noted that the arrangement of the power supply component 112 and the power supply component 111, as well as the structure of the conductive connector 113, include, but are not limited to, the three implementation methods mentioned above.

[0084] In one possible implementation, the interchangeable heat dissipation assembly 120 includes an air-cooled radiator 121 and a liquid-cooled radiator 122, either of which is disposed on the power-conducting assembly 110 and is used to dissipate heat from the surface of the power-conducting assembly 110.

[0085] In practical use, in the first application scenario, such as when using the air-cooled heatsink 121, the air-cooled heatsink 121 is placed on the powered component 110 to dissipate heat from its surface. In the second application scenario, such as when using the liquid-cooled heatsink 122, the air-cooled heatsink 121 is first removed from the powered component 110, and the liquid-cooled heatsink 122 is placed on top to dissipate heat from its surface. Conversely, the assembly order of the two components can be interchanged. Therefore, users can choose any heat dissipation component according to the actual scenario, resulting in a wider range of applications and a better user experience.

[0086] In addition, the differences between the air-cooled radiator 121 and the water-cooled radiator are as follows: First, the heat dissipation modes are different. Air cooling uses the fan 132 and the radiator to exchange heat and dissipate heat by airflow, while water cooling uses a water tower to circulate water for heat dissipation. Second, the heat dissipation media are different. The heat dissipation media for air cooling is air, while the heat dissipation media for water cooling is water. Third, the application scenarios are different. Air cooling is often used in residential air conditioners, while water cooling is often used in commercial air conditioners.

[0087] The advantages of the 121 air-cooled radiator are: it is relatively easy to install, quiet, consumes less power, and is inexpensive; the disadvantage is: its heat dissipation effect is not good enough.

[0088] The advantages of water-cooled radiators are: better heat dissipation performance and faster heat dissipation speed; the disadvantages are: higher power consumption, louder noise, and more complicated installation.

[0089] One possible approach is as follows: When using an air-cooled heat sink 121, the air-cooled heat sink 121 has a heat absorption end and a heat dissipation end. The heat absorption end is located at the end of the air-cooled heat sink 121 closer to the power supply component, and the heat dissipation end is located at the end of the air-cooled heat sink 121 furthest from the power supply component. The heat absorption end and the heat dissipation end are connected, and the heat dissipation end is connected to the outside. The heat absorption end is used to absorb heat from the surface of the energized component 110 and conduct it to the heat dissipation end. The heat dissipation end is used to carry the heat out to the outside. Thus, the heat dissipation of the energized component 110 can be completed through the above process.

[0090] The second possible method is as follows: when using a liquid-cooled radiator 122, the liquid-cooled radiator 122 includes a board 1221, a liquid-cooled plate 1222 and a leakage detection board 1223, and the board 1221, the liquid-cooled plate 1222 and the leakage detection board 1223 are electrically connected to each other.

[0091] Specifically, by setting up board 1221, it is convenient to install liquid cooling plate 1222 and leakage detection plate 1223. Board 1221 is set on power supply component 110 and electrically connected to power supply component 110. Liquid cooling plate 1222 and leakage detection plate 1223 are spaced apart on board 1221 and located on the same side of board 1221. This facilitates the connection of connecting pipes and facilitates the removal of liquid.

[0092] The leakage detection plate 1223 is configured to detect whether there is liquid on the surface of the energized component 110 and transmit the signal to the liquid cooling plate 1222. The liquid cooling plate 1222 is configured to carry the liquid along with heat to the outside when it receives the signal that there is liquid, thereby completing the heat dissipation of the energized component 110.

[0093] In this embodiment, the liquid-cooled radiator 122 further includes a rear window 1224 and a connecting pipe 1225. The rear window 1224, the liquid-cooled plate 1222, and the leakage detection plate 1223 are located on the same side of the board 1221. The liquid-cooled plate 1222 is located between the leakage detection plate 1223 and the rear window 1224. The rear window 1224 is connected to the outside.

[0094] During assembly, through holes are provided on the board 1221, liquid cooling plate 1222, leakage detection plate 1223 and rear window 1224 respectively. One end of the connecting pipe 1225 is electrically connected to the power-conducting component 110, and the other end of the connecting pipe 1225 is sequentially passed through the through holes and electrically connected to the outside, thereby completing the heat dissipation of the power-conducting component 110.

[0095] In addition, in this embodiment, the liquid cooling radiator 122 may also include a pipe clamp plate 1226 and a pipe clamp portion 1227. Both the pipe clamp plate 1226 and the pipe clamp portion 1227 are located on the side of the connecting pipe 1225 near the board 1221, and the pipe clamp portion 1227 is disposed on the pipe clamp plate 1226.

[0096] There are multiple connecting pipes 1225 and multiple pipe clamps 1227. Adjacent pipe clamps 1227 form a pipe clamp area 1228. The connecting pipes 1225 are clamped in the pipe clamp area 1228 one by one. In this way, the pipe clamps 1227 can clamp the connecting pipes 1225 and constrain multiple connecting pipes 1225 to avoid tangling. At the same time, it is also convenient to organize the connecting pipes 1225.

[0097] Example 2

[0098] Based on the above embodiment one, embodiment two of this application also provides an electronic device 200, including a housing 210 and the above-mentioned hardware acceleration device 100, wherein the housing 210 has a cavity 211, and the hardware acceleration device 100 is disposed in the cavity 211. By providing the housing 210, on the one hand, it is convenient to install the hardware acceleration device 100; on the other hand, it can also protect the hardware acceleration device 100, preventing external water stains and dirt from contaminating the hardware acceleration device 100, thereby ensuring safety during use to the greatest extent.

[0099] Other technical features are the same as in Embodiment 1 and can achieve the same technical effect, so they will not be described in detail here.

[0100] The electronic device 200 provided in this embodiment includes a power-conducting component 110, which enables power transfer between multiple electrical components within the housing 210, thereby maintaining the power balance and supply requirements of the hardware acceleration device 100, ensuring the stability and high reliability of the hardware acceleration device 100. It also includes an interchangeable heat dissipation component 120. On one hand, the heat dissipation component is used to dissipate heat from the surface of the power-conducting component 110 to maintain the thermal balance of the hardware acceleration device 100, preventing burnout due to excessive heat or disruption of normal operation due to insufficient heat. On the other hand, the heat dissipation component is interchangeable, allowing users to select the appropriate component based on their specific needs. Choosing any heat dissipation component broadens the application range and improves the user experience. By setting up the fan assembly 130, the surface of the powered component 110 can be ventilated in a timely manner, thereby further ensuring the thermal balance and stability of the hardware acceleration device 100. By integrating the powered component 110, the interchangeable heat dissipation component 120, and the fan assembly 130 into the housing 210, and by rationally arranging the powered component 110, the hardware acceleration device 100 can simultaneously achieve different functions of multiple structures while ensuring normal operation. This satisfies the integration requirements of high heat, high current, and high reliability, and solves the problem of the relatively limited functionality of hardware accelerators in related technologies.

[0101] In the description of this application, it should be understood that the terms “center,” “length,” “width,” “thickness,” “top,” “bottom,” “upper,” “lower,” “left,” “right,” “front,” “rear,” “vertical,” “horizontal,” “inner,” “outer,” “axial,” and “circumferential” used to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the location or original must have a specific orientation, or a specific construction and operation, and therefore should not be construed as a limitation of this application.

[0102] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0103] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0104] The foregoing can be better understood in accordance with the following terms:

[0105] Clause A1. A hardware acceleration device disposed in the housing of an electronic device, comprising a power-conducting component, an interchangeable heat dissipation component, and a fan component integrated in the housing, wherein the fan component and the interchangeable heat dissipation component are electrically connected to the power-conducting component;

[0106] The fan assembly and the power supply assembly are spaced apart on the inner wall of the housing. The fan assembly is located near the opening end of the housing, and the interchangeable heat dissipation assembly is located on the power supply assembly.

[0107] The power-conducting component is configured to transmit electrical energy to multiple electrical components in the housing, and the interchangeable heat dissipation component is configured to dissipate heat from the surface of the power-conducting component when the surface temperature of the power-conducting component exceeds a preset temperature.

[0108] The fan assembly is configured to blow air onto the surface of the powered component when the surface temperature of the powered component exceeds a preset temperature.

[0109] Clause A2. According to the hardware acceleration device of Clause A1, the fan assembly includes a mounting box and a fan, the mounting box being disposed at an end near the housing, the mounting box having a mounting cavity, and the fan being disposed in the mounting cavity;

[0110] The fan has an air inlet and an air outlet. The air inlet is located on the side of the fan closer to the power-conducting component, and the air outlet is located on the side of the fan furthest from the power-conducting component. The air inlet and air outlet are connected, and the air outlet is connected to the outside.

[0111] Clause A3. According to the hardware acceleration device of Clause A2, the fan assembly also includes an anti-backflow plate and a reset spring;

[0112] The anti-backflow plate is installed in the mounting box, and the anti-backflow plate is located between the fan and the preset wall of the mounting box;

[0113] The reset elastic element is located between the anti-backflow plate and the preset wall surface of the mounting box, and the anti-backflow plate is connected to the preset wall surface of the mounting box through the reset elastic element.

[0114] Clause A4. According to the hardware acceleration device of Clause A3, the mounting box includes multiple mounting parts arranged sequentially in the mounting cavity; there are multiple fans, and each fan is installed in one of the multiple mounting parts.

[0115] There are multiple anti-backflow plates and multiple reset elastic elements. The multiple anti-backflow plates are all set between the fan and the preset wall surface of the mounting box, and the multiple reset elastic elements are set one-to-one between the multiple anti-backflow plates and the preset wall surface of the mounting box.

[0116] Clause A5. The hardware acceleration device according to any one of Clauses A1-A4 includes a power supply component and a power consumption component, which are electrically connected;

[0117] The power supply component is installed on the bottom wall of the housing, and the power supply component is connected to the power supply component, or the power supply component and the power supply component are spaced apart;

[0118] The power supply unit is configured to provide electrical energy to the power consumption unit.

[0119] Clause A6. According to the hardware acceleration device of Clause A5, the power-on component also includes a conductive connector located between the power supply component and the power consumption component;

[0120] One end of the conductive connector is connected to the power supply component, and the other end of the conductive connector is connected to the power consumption component;

[0121] The conductive connector is electrically connected to both the power supply component and the power consumption component.

[0122] Clause A7. According to Clause A6, the hardware acceleration device is connected to the power supply device, and the extension direction of the power supply device is perpendicular to the extension direction of the power supply device.

[0123] The conductive connector includes a first conductive connector, which includes a first connecting portion and a second connecting portion connected together. The extending direction of the first connecting portion and the extending direction of the second connecting portion are perpendicular. One of the first connecting portion and the second connecting portion is connected to a power supply component, and the other of the first connecting portion and the second connecting portion is connected to a power consumption component.

[0124] The first connecting part and the second connecting part are snapped together.

[0125] Clause A8. According to Clause A6, the hardware acceleration device shall have the power supply component and the power supply component arranged at intervals, with the power supply component located on the side of the power supply component away from the bottom wall surface;

[0126] The conductive connector includes a second conductive connector, which includes a first extension, a second extension, and a connecting segment located between the first extension and the second extension.

[0127] One of the first extension section and the second extension section is connected to the power supply component, and the other of the first extension section and the second extension section is connected to the power consumption component.

[0128] The connecting segment connects the first extension segment and the second extension segment, and the connecting segment is a flexible component.

[0129] Clause A9. According to Clause A6, the hardware acceleration device shall have the power supply component and the power supply component arranged at intervals, with the power supply component located on the side of the power supply component away from the bottom wall surface;

[0130] The conductive connector includes a third conductive connector, which includes a first mounting portion and a second mounting portion. One of the first mounting portion and the second mounting portion is connected to the power supply component, and the other of the first mounting portion and the second mounting portion is connected to the power consumption component.

[0131] The first mounting section and the second mounting section are slidably connected.

[0132] Clause A10. For any of the hardware acceleration devices pursuant to Clauses A1-A4, interchangeable heat dissipation components include air-cooled radiators and liquid-cooled radiators;

[0133] Either an air-cooled radiator or a liquid-cooled radiator is installed on the power-conducting component, and the surface of the power-conducting component is treated to dissipate heat.

[0134] Clause A11. According to Clause A10, the air-cooled heat sink has a heat absorption end and a heat dissipation end;

[0135] The heat absorption end is located at the end of the air-cooled radiator closest to the power-conducting component, and the heat dissipation end is located at the end of the air-cooled radiator furthest from the power-conducting component. The heat absorption end and the heat dissipation end are connected, and the heat dissipation end is connected to the outside.

[0136] The heat-absorbing end is used to absorb heat from the surface of the energized component and conduct it to the heat-dissipating end, which is used to carry the heat out to the outside.

[0137] Clause A12. According to the hardware acceleration device of Clause A10, the liquid cooling heat sink includes a board, a liquid cooling plate and a leakage detection board, and the board, the liquid cooling plate and the leakage detection board are electrically connected to each other.

[0138] The board is mounted on the power-on component and is electrically connected to the power-on component. The liquid cooling plate and the leakage detection plate are mounted on the board at intervals and are located on the same side of the board.

[0139] The leakage detection plate is configured to detect whether there is liquid on the surface of the energized component and transmit the detected signal to the liquid cooling plate, which is configured to receive the signal and carry the liquid along with heat to the outside according to the signal.

[0140] Clause A13. According to the hardware acceleration device of Clause A12, the liquid cooling radiator also includes a rear window and connecting pipes;

[0141] The rear window, liquid cooling plate, and leakage detection plate are located on the same side of the board. The liquid cooling plate is located between the leakage detection plate and the rear window. The rear window is connected to the outside.

[0142] Through holes are provided on the circuit board, liquid cooling plate, leakage detection plate and rear window respectively. One end of the connecting pipe is electrically connected to the power supply component, and the other end of the connecting pipe passes through the through holes of the circuit board, liquid cooling plate, leakage detection plate and rear window in sequence, and is electrically connected to the outside.

[0143] And / or, the liquid cooling radiator also includes a tube clamp plate and a tube clamp part, both of which are located on the side of the connecting pipe closer to the circuit board, with the tube clamp part disposed on the tube clamp plate;

[0144] There are multiple connecting pipes and multiple pipe clamps. Adjacent pipe clamps form a pipe clamp area, and the connecting pipes are clamped in the pipe clamp area one by one.

[0145] Clause A14. An electronic device comprising a housing and a hardware acceleration device of any one of Clauses A1-A13, the housing having a cavity in which the hardware acceleration device is disposed.

[0146] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A hardware acceleration device disposed in a housing of an electronic device, comprising: The power supply assembly, the interchangeable heat dissipation assembly and the fan assembly are integrated in the shell, and the fan assembly and the interchangeable heat dissipation assembly are electrically connected with the power supply assembly; The fan assembly and the power supply assembly are arranged on the inner wall surface of the shell, and the fan assembly is arranged close to the open end of the shell, and the interchangeable heat dissipation assembly is arranged on the power supply assembly; The power supply assembly is configured to perform electric energy transmission on a plurality of electric appliance elements in the shell, and the interchangeable heat dissipation assembly is configured to perform heat dissipation treatment on the surface of the power supply assembly when the surface temperature of the power supply assembly exceeds a preset temperature; The fan assembly is configured to perform air blowing treatment on the surface of the power supply assembly when the surface temperature of the power supply assembly exceeds a preset temperature; The fan assembly comprises a mounting box and a fan, the mounting box is arranged close to the end of the shell, and the mounting box has a mounting cavity, and the fan is arranged in the mounting cavity; The fan has an air inlet end and an air outlet end, the air inlet end is located on the side of the fan close to the power supply assembly, the air outlet end is located on the side of the fan away from the power supply assembly, the air inlet end is in communication with the air outlet end, and the air outlet end is in communication with the outside; the air inlet end is used for sucking heat from the surface of the power supply assembly and conducting the heat to the air outlet end, and the air outlet end is used for taking the heat out to the outside; The fan assembly further comprises an anti-backflow plate and a reset elastic member; The anti-backflow plate is arranged in the mounting box, and the anti-backflow plate is located between the fan and the preset wall surface of the mounting box; The reset elastic member is located between the anti-backflow plate and the preset wall surface of the mounting box, and the anti-backflow plate is connected to the preset wall surface of the mounting box through the reset elastic member; When the fan is pulled out, the anti-backflow plate blocks the cavity opening position of the mounting cavity under the action of the reset elastic member to prevent air overflow and external air from flowing back into the shell.

2. The hardware acceleration device of claim 1, wherein, The mounting box comprises a plurality of mounting portions, and the plurality of mounting portions are arranged in the mounting cavity in sequence; the fan is a plurality of fans, and the plurality of fans are installed in the plurality of mounting portions one by one; The anti-backflow plate is a plurality of anti-backflow plates, and the reset elastic member is a plurality of reset elastic members, the plurality of anti-backflow plates are arranged between the fan and the preset wall surface of the mounting box, and the plurality of reset elastic members are arranged between the plurality of anti-backflow plates and the preset wall surface of the mounting box one by one.

3. The hardware acceleration apparatus according to claim 1 or 2, characterized in that, The power supply assembly comprises a power supply element and a power consumption element, and the power supply element and the power consumption element are electrically connected; The power supply element is arranged on the bottom wall surface of the shell, and the power consumption element is connected with the power supply element or is arranged apart from the power supply element; The power supply element is configured to provide electric energy to the power consumption element.

4. The hardware acceleration apparatus of claim 3, wherein, The power supply assembly further comprises a conductive connecting element, and the conductive connecting element is located between the power supply element and the power consumption element; One end of the conductive connecting element is connected to the power supply element, and the other end of the conductive connecting element is connected to the power consumption element; The conductive connecting element is electrically connected with the power supply element and the power consumption element.

5. The hardware acceleration apparatus of claim 4, wherein, The power consumer is connected to the power supply, and the extension direction of the power consumer is perpendicular to the extension direction of the power supply; The conductive connecting piece includes a first conductive connecting piece, the first conductive connecting piece includes a first connecting part and a second connecting part connected to each other, the extension direction of the first connecting part is perpendicular to the extension direction of the second connecting part, one of the first connecting part and the second connecting part is connected to the power supply, and the other of the first connecting part and the second connecting part is connected to the power consumer; The first connecting part and the second connecting part are connected in clamping mode.

6. The hardware acceleration apparatus of claim 4, wherein, The power consumer is arranged apart from the power supply, and the power consumer is located on the side of the power supply away from the bottom wall surface; The conductive connecting piece includes a second conductive connecting piece, the second conductive connecting piece includes a first extension section, a second extension section, and a connecting section located between the first extension section and the second extension section; One of the first extension section and the second extension section is connected to the power supply, and the other of the first extension section and the second extension section is connected to the power consumer; The connecting section connects the first extension section and the second extension section, and the connecting section is a flexible piece.

7. The hardware acceleration apparatus of claim 4, wherein, The power consumer is arranged apart from the power supply, and the power consumer is located on the side of the power supply away from the bottom wall surface; The conductive connecting piece includes a third conductive connecting piece, the third conductive connecting piece includes a first mounting part and a second mounting part, one of the first mounting part and the second mounting part is connected to the power supply, and the other of the first mounting part and the second mounting part is connected to the power consumer; The first mounting part and the second mounting part are connected in sliding mode.

8. The hardware acceleration apparatus of claim 1 or 2, wherein, The interchangeable heat dissipation assembly includes an air-cooled heat sink and a liquid-cooled heat sink; Any one of the air-cooled heat sink and the liquid-cooled heat sink is arranged on the energized component and performs heat dissipation treatment on the surface of the energized component.

9. The hardware acceleration apparatus of claim 8, wherein, The air-cooled heat sink has a heat absorption end and a heat discharge end; The heat absorption end is located at one end of the air-cooled heat sink close to the energized component, the heat discharge end is located at one end of the air-cooled heat sink away from the energized component, the heat absorption end is in communication with the heat discharge end, and the heat discharge end is in communication with the outside; The heat absorption end is used for absorbing heat from the surface of the energized component and conducting to the heat discharge end, and the heat discharge end is used for taking out heat to the outside.

10. The hardware acceleration device of claim 8, wherein, The liquid-cooled heat sink includes a board card, a liquid-cooled plate, and a liquid leakage detection plate, and any two of the board card, the liquid-cooled plate, and the liquid leakage detection plate are electrically connected; The board card is arranged on the energized component, the board card is electrically connected to the energized component, the liquid-cooled plate and the liquid leakage detection plate are arranged apart on the board card, and the liquid-cooled plate and the liquid leakage detection plate are located on the same side of the board card; The liquid leakage detection plate is configured to detect whether the surface of the energized component has liquid and transmit a detected signal to the liquid-cooled plate, and the liquid-cooled plate is configured to receive the signal and take out the liquid together with heat to the outside according to the signal.

11. The hardware acceleration apparatus of claim 10, wherein, The liquid-cooled heat sink further includes a rear window and a connecting pipeline; The rear window is located on the same side of the board card as the liquid cooling plate and the liquid leakage detection plate, the liquid cooling plate is located between the liquid leakage detection plate and the rear window, and the rear window is in communication with the outside; The board card, the liquid cooling plate, the liquid leakage detection plate and the rear window are all provided with a through hole, one end of the connecting pipeline is electrically connected to the power supply component, the other end of the connecting pipeline is sequentially arranged through the through holes of the board card, the liquid cooling plate, the liquid leakage detection plate and the rear window, and is electrically connected to the outside; And / or, the liquid cooling radiator further comprises a pipe clamp plate and a pipe clamp part, the pipe clamp plate and the pipe clamp part are located on the side of the connecting pipeline close to the board card, and the pipe clamp part is arranged on the pipe clamp plate; The connecting pipeline is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp part is a plurality of, the pipe clamp 12. An electronic device, comprising: ​

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