A magnetron sputtering composite coating method

Abstract

This invention relates to a magnetron sputtering composite coating method. The magnetron sputtering composite coating equipment used in this method includes a dual-target gun system and an optical monitor. The dual-target gun system includes a first target gun and a second target gun. The first target gun is used to coat a high reflectivity (HR) film, and the second target gun is used to coat an antireflection (AR) film. The HR and AR films are grown alternately to adjust different thickness combinations and different numbers of layers of the two materials to obtain composite optical films (films) with different properties. The optical monitor is used to monitor and view the coating quality in real time. The optical monitor includes an emitter, a secondary film, and a receiver. The secondary film is positioned at the center of the workpiece disk. During composite coating, the optical controller is activated, the emitter emits light of a preset wavelength to the secondary film, and the receiver receives the reflectivity value of the secondary film, thereby determining the coating quality of the composite film layer.

Description

Technical Field

[0001] This invention belongs to the field of magnetron sputtering technology. Specifically, it relates to a magnetron sputtering composite coating method. Background Technology

[0002] Magnetron sputtering is a type of physical vapor deposition (PVD). Its working principle involves electrons, under the influence of an electric field, colliding with argon atoms as they fly towards the substrate. This ionization produces Ar ions and new electrons. The new electrons fly towards the substrate, while the Ar ions, accelerated by the electric field, fly towards the cathode target and bombard the target surface with high energy, causing sputtering of the target material. In the sputtered particles, neutral target atoms or molecules are deposited on the substrate to form a thin film. The generated secondary electrons are affected by electric and magnetic fields, resulting in E×B drift, and their trajectory approximates a cycloid. If a toroidal magnetic field is used, the electrons move in a circular motion on the target surface in an approximate cycloid manner. Their path is not only long but also confined to a plasma region near the target surface, where they ionize a large amount of Ar to bombard the target material, thus achieving a high deposition rate. As the number of collisions increases, the energy of the secondary electrons is exhausted, and they gradually move away from the target surface, eventually depositing on the substrate under the influence of the electric field E.

[0003] Existing reactive magnetron sputtering equipment represents a new generation of technology in magnetron sputtering systems. It typically employs an ion source in conjunction with magnetron sputtering to obtain precise optical films. Its advantages include high film quality, high throughput, good process stability, high deposition rate, and low maintenance costs. Regarding the ion source's location, it is generally placed inside the main process chamber. The disadvantage of this placement is that, due to variations in equipment manufacturing and angle adjustment between different batches, the consistency and stability of the deposition quality can vary. Furthermore, the control lines, power lines, process gas pipes, and cooling water pipes of the ion source located in the main process chamber are subject to atmospheric conditions (10⁻⁶) during reactive magnetron sputtering. 5 Pa) to process vacuum (10 -4 With a change of 9 orders of magnitude or under high temperature heating in a vacuum chamber, some existing precipitates or impurities on the ion source's control lines, power lines, process gas pipes, and cooling water pipes may release some molecules or ions, affecting the purity of the process environment and indirectly affecting the purity of the compound's film. Summary of the Invention

[0004] To address the problems existing in the current technology, the present invention provides a magnetron sputtering composite coating method.

[0005] The complete technical solution of this invention includes:

[0006] A magnetron sputtering composite coating method is provided. The magnetron sputtering composite coating equipment used in the method includes a dual-target gun system and an optical monitor. The dual-target gun system includes a first target gun and a second target gun. The first target gun is used to deposit a high reflectivity (HR) film, and the second target gun is used to deposit an antireflection (AR) film. The HR and AR films are grown alternately to adjust different thickness combinations and different numbers of layers of the two materials to obtain composite optical films (films) with different properties.

[0007] An optical monitor is used to monitor and view the quality of the coating in real time. The optical monitor includes a transmitter, a substrate, and a receiver. The substrate is positioned at the center of the workpiece disk. During composite coating, the optical controller is activated, the transmitter emits light of a preset wavelength to the substrate, and the receiver receives the reflectivity value of the substrate, thereby determining the coating quality of the composite film.

[0008] Furthermore, the first and second target guns are mounted on the target gun mounting surface via target gun mounting flanges. The target gun system is equipped with a target gun angle adjustment device, and the target gun is equipped with an anode cover and a target gun baffle. Below the target gun mounting surface, there is a target gun baffle control valve and an electrical wiring cover.

[0009] Furthermore, the magnetron sputtering composite coating method uses a magnetron sputtering composite coating equipment that also includes a process chamber, with a workpiece disk above the process chamber, and an ion source and a dual-target gun system inside the process chamber.

[0010] Furthermore, the process chamber used has a ship-shaped structure, including a top surface, a bottom surface, a first side surface perpendicular to the top and bottom surfaces, a half side surface perpendicular to the top surface, and an inclined surface connecting the half side surface and the bottom surface. An installation port for installing an ion source is designed on the inclined surface, and the ion source is installed on the inclined surface through the port.

[0011] Furthermore, the magnetron sputtering composite coating method specifically includes the following steps:

[0012] (1) Workpiece loading: 4-inch workpieces are used, and the coating materials are silicon and titanium, respectively.

[0013] (2) Use a vacuum system to evacuate the main process chamber to 5E-6 Torr and set the coating parameters of the composite film.

[0014] (3) Process parameter settings:

[0015] Set the workpiece disk rotation speed to 8 revolutions per minute, the oxygen flow rate of the ion source to 10 sccm, the oxygen flow rate in the main process chamber to 18 sccm, the argon flow rate to 25 sccm, the ion source power to 500W, start the ion source, set the RF power of the Si target gun and Ti target gun to 2000W, start the target gun RF power supply (pre-start pressure 40mTorr), set the coating pressure to 2.3mTorr, open the high valve halfway, and start the composite coating process.

[0016] Furthermore, in step (1), for equipment without a sample inlet chamber, the main process chamber door is opened, and a 4-inch workpiece is loaded onto the workpiece stage using a workpiece tray.

[0017] Furthermore, it also includes a multi-plate system for the sample inlet, which is designed with a robotic arm and a fixture for the workpiece, allowing multiple workpieces to be loaded at once.

[0018] Furthermore, in step (1), for equipment containing only multiple injection chambers, a 4-inch workpiece is loaded onto the injection chamber robot using a workpiece tray, the injection chamber door is closed, and both the injection chamber and the main process chamber are evacuated to the corresponding vacuum. The robot then transfers the workpiece tray carrying the workpiece to the workpiece stage in the main process chamber.

[0019] Furthermore, in step (1), for a device that contains multiple sample inlet chambers and transfer chambers, the workpiece tray carrying the workpiece is placed on the multi-piece stage of the sample inlet chamber, the sample inlet chamber door is closed, the sample inlet chamber, the transfer chamber and the main process chamber are evacuated to the corresponding vacuum, and the transfer system is used to transfer the workpiece tray carrying the workpiece to the workpiece stage of the corresponding main process chamber.

[0020] The advantages of this invention over the prior art are:

[0021] 1. By using a dual-target gun system for alternating composite coating, different combinations of thicknesses and layers of the two materials can be adjusted to obtain composite films (optical films) with different properties. This can be applied to a variety of complex customized film production processes, thus expanding the range of applications.

[0022] 2. An optical monitor is used to monitor the quality of the coating. It is programmable for program control and uses optical performance indicators to monitor the surface quality in real time by switching between two compound coatings. The data of the coating process can be monitored and adjusted in real time, which improves the coating quality.

[0023] 3. The traditional rectangular main process chamber is redesigned as a boat-shaped structure to enhance the consistency of coating quality across different batches, reduce outgassing sources within the main process chamber, and maintain a pure process environment to ensure the purity of the coating quality. Multiple boat-shaped main process chambers are configured within the same equipment to meet the requirements for batch processing of magnetron sputtering evaporation. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the dual-target gun system of the present invention.

[0025] Figure 2 This is a schematic diagram of the overall magnetron sputtering composite coating equipment.

[0026] In the figure, 1-target gun mounting surface, 2-target gun mounting flange, 3-target gun angle adjustment device, 4-anode cover, 5-target gun baffle device, 6-target gun baffle control valve, 7-electrical wiring cover, 8-ship-shaped process chamber, 9-workpiece tray, 10-ion source, 11-dual target gun system, 12-optical monitor transmitter, 13-optical monitor receiver, 14-half side, 15-sloping surface. Detailed Implementation

[0027] The present invention will now be described in detail with reference to embodiments and accompanying drawings. However, it should be understood that the embodiments and drawings are for illustrative purposes only and do not constitute any limitation on the scope of protection of the present invention. All reasonable modifications and combinations included within the inventive spirit of the present invention fall within the scope of protection of the present invention.

[0028] This invention discloses a magnetron sputtering composite coating method, which employs a dual-target gun system to complete the coating process, such as... Figure 1 As shown, the dual-target gun system includes two target guns, which are mounted on the target gun mounting surface 1 via the target gun mounting flange 2. The target gun system is equipped with a target gun angle adjustment device 3, which allows the two target guns to adjust their angles in multiple degrees of freedom. An anode cover 4 and a target gun baffle 5 are provided outside the target gun. A target gun baffle control valve 6 and an electrical wiring cover 7 are provided below the target gun mounting surface 1.

[0029] In the dual-target gun system, one target gun deposits a high reflectivity (HR) film, and the other deposits an antireflection (AR) film. By alternating the growth of HR and AR films, a film system is formed. Adjusting the thickness combination and number of layers of the two materials yields composite films (optical films) with different properties. An optical monitor is designed within the ship-shaped main process chamber where the composite film layer is fabricated using the dual-target gun system. This monitor is programmable for program control, allowing real-time monitoring and viewing of the coating process data. The optical monitor consists of a transmitter 12, a secondary film, and a receiver 13, with the secondary film positioned at the center of the workpiece tray. The operation is as follows: The optical controller is activated, the transmitter emits light of a set wavelength towards the secondary film, and the receiver receives the reflectivity value of the secondary film, thus determining the coating quality of the composite film layer. For example, a monitoring example of SiO2 and NB2O5 (substrate Si wafer), 1310nm±30nm@R<0.3%, the reflectance of the uncoated wafer is 5%, after single-layer coating it will be reduced to 2%, and after multi-layer composite film it will be reduced to less than 0.3%. The surface quality is monitored in real time by using optical performance indicators to alternate between the two compound coatings.

[0030] The method for performing composite coating using the composite coating equipment described in this invention includes:

[0031] (1) Workpiece loading: 4-inch workpieces are used, and the coating materials are silicon and titanium, respectively.

[0032] For equipment without a sample inlet chamber, open the main process chamber door and load the 4-inch workpiece onto the workpiece stage using a workpiece tray.

[0033] For equipment containing only a sample inlet chamber, a 4-inch workpiece is loaded onto the sample inlet chamber robot using a workpiece tray. The sample inlet chamber door is closed, and both the sample inlet chamber and the main process chamber are evacuated to the corresponding vacuum levels. The robot then transfers the workpiece tray carrying the workpiece to the workpiece stage in the main process chamber.

[0034] For equipment containing both an injection chamber and a transfer chamber, the workpiece tray carrying the workpiece is placed on the multi-stage platform of the injection chamber, the injection chamber door is closed, and the injection chamber, transfer chamber, and main process chamber are evacuated to their respective vacuum levels. The transfer system is then used to transfer the workpiece tray carrying the workpiece to the corresponding workpiece stage in the main process chamber.

[0035] (2) Using a vacuum system, the vacuum level of the main process chamber is evacuated to 5E-6 Torr, and the coating parameters of the composite film are set as shown in the table below:

[0036] membrane <![CDATA[SiO2(KA)]]> <![CDATA[TiO2(KA)]]> logarithm AR 1.13 7.76 1 HR 1.36 0.89 6

[0037] (3) Process parameter settings:

[0038] Set the workpiece disk rotation speed to 8 revolutions per minute, the oxygen flow rate of the ion source to 10 sccm, the oxygen flow rate in the main process chamber to 18 sccm, the argon flow rate to 25 sccm, the ion source power to 500W, start the ion source, set the RF power of the Si target gun and Ti target gun to 2000W, start the target gun RF power supply (pre-start pressure 40mTorr), set the coating pressure to 2.3mTorr, open the high valve halfway, and start the composite coating process.

[0039] In addition, such as Figure 2 As shown, the magnetron sputtering composite coating equipment used in this invention also includes a boat-shaped process chamber 8, with a front-opening door at the front of the process chamber 8, a workpiece tray 9 above the process chamber, an ion source system 10 inside the process chamber, and a dual-target gun system 11 below. The workpiece tray system includes a workpiece tray 9 and a rotating mechanism. The workpiece tray is used to load workpieces, and the rotating mechanism makes the workpiece tray rotate uniformly at a set speed.

[0040] The process chamber used in this invention has a boat-shaped structure. In its longitudinal section, it includes a top surface, a bottom surface, a first side surface perpendicular to the top and bottom surfaces, a half-side surface 14 perpendicular to the top surface, and an inclined surface 15 connecting the half-side surface and the bottom surface. The inclined surface 15 is designed with an installation port for mounting an ion source 10, through which the ion source 10 is mounted. The ion source system provides ions of the reaction gas. The ion source is installed in a semi-embedded manner, with the control lines, power lines, process gas pipes, and cooling water pipes of the ion source connected to the exposed portion of the ion source. The design of this invention differs from existing designs where all wires and tubes of the ion source are located within the main process chamber. In actual magnetron reactive sputtering, the heat generated during sputtering or the required heating temperature results in high temperatures within the chamber. Various control and power cables, gas pipes, and water pipes act as venting sources, and their materials include polymers and other materials. Due to the high temperature within the chamber during sputtering, some materials inevitably vaporize and diffuse within the chamber, while some condense on the sputtered surface of the workpiece, thus reducing sputtering quality. Furthermore, since different batches of sputtering require multiple vacuuming processes, the gases released from the control and power cables, gas pipes, and water pipes also increase the vacuuming time, affecting coating quality. Therefore, this invention employs a semi-embedded installation of the ion source, with the control lines, power lines, process gas pipes, and cooling water pipes of the ion source connected to the exposed portion of the ion source. When using a process chamber reactive magnetron sputtering system for coating, the ions from the process gas supplied by the ion source directly reach the surface of the rotating workpiece disk. The ions supplied by the ion source are evenly distributed on the workpiece disk surface, allowing for a full reaction between the ions from the target material and the ions from the process gas. Compared to designs where the ion source's pipes and wires are placed within the chamber, this invention reduces the outgassing sources in the process chamber, maintains the purity of the process environment, and yields a purer compound film. The quality and stability of the compound films produced by different equipment and batches show minimal variation and good consistency.

[0041] On the other hand, since this invention changes the traditional rectangular chamber into a boat-shaped process chamber with a sloping surface, the support stability of the chamber is different from that of the traditional chamber. Therefore, in terms of the design of the size and angle of the sloping surface, it is necessary to comprehensively consider the size and weight of the overall chamber and the ion source, the angle and distance between the ion source and the workpiece disk, and the weight of each component, so as to ensure the support stability of the chamber during the coating process and extend the service life of the equipment.

[0042] Among the parameters mentioned above, since the ray emitted from the center of the ion source reaches a point at 2 / 3 of the radius starting from the center of the workpiece disk 9, the angle between the inclined plane and the ground, as well as the distance between the ion source and the workpiece disk, are fixed values. Specifically: the angle between the inclined plane and the bottom surface is 120°; the measured distance between the center point of the ion source surface and the point at 2 / 3 of the radius starting from the center of the workpiece disk is 225mm; and the angle between the straight line between the center point of the ion source surface and the point at 2 / 3 of the radius starting from the center of the workpiece disk and the horizontal direction of the workpiece disk is 30°. Furthermore, the ion source is installed on the inclined plane at a distance of 160mm from the starting point of the bottom edge of the inclined plane to the center of the inclined plane.

[0043] Under the above constraints, for different parameters of the chamber, the height ratios of the top, bottom, and side surfaces of the chamber, the weight of the ion source, and the overall weight of the chamber were designed during the actual coating process. The support stability of the chamber during each coating process was recorded, and the recorded big data was analyzed to select reasonable process parameters. After analysis, the following determination method was selected:

[0044]

[0045] In the formula, L1 is the side length of the top surface of the chamber, L2 is the side length of the bottom surface of the chamber, H is the height of the chamber, W1 is the weight of the ion source, W2 is the weight of the chamber, and k is a coefficient with a value ranging from 9 to 11, preferably 9.72.

[0046] Based on the above principles and the actual space conditions of the workshop, the design is carried out with the following dimensions: upper L1 is 690mm, lower L2 is 535mm, chamber height H is 450mm, ion source weight w1 is 40KG, and chamber weight W2 is 540KG.

[0047] The process chamber also includes a vacuum system, a heating system, a process gas system, and a power supply system.

[0048] In this invention, the composite coating equipment can be a single-piece boat-shaped composite film reactive magnetron sputtering system, a single-piece boat-shaped composite film reactive magnetron sputtering system with a sample inlet chamber, a multi-piece boat-shaped composite film reactive magnetron sputtering system with a sample inlet chamber, or a multi-cavity boat-shaped process chamber composite film reactive magnetron sputtering system (multiple sample inlet chambers + transfer chamber + multiple boat-shaped process chambers (number of chambers greater than or equal to 2)). The sputtering method can be upward or downward.

[0049] The single-piece boat-shaped composite film reactive magnetron sputtering system includes a boat-shaped main process chamber, a workpiece disk rotation system, a dual target gun system, an optical monitoring system, a vacuum system, a power supply system, a semi-embedded ion source system, and a process gas system.

[0050] When using a ship-shaped main process chamber reactive magnetron sputtering system for coating, the ions from the process gas supplied by the ion source directly reach the surface of the rotating workpiece disk. The ions supplied by the ion source are evenly distributed on the surface of the workpiece disk, allowing the ions from the target material and the ions from the process gas to react fully. Compared to the case where the ion source is placed inside the chamber, this reduces the outgassing source in the main process chamber, resulting in a purer compound film. The quality and stability of the compound films obtained from different equipment show little difference, i.e., good consistency.

[0051] The system operation process is as follows: Load the workpiece onto the workpiece tray, and then load the workpiece tray onto the workpiece stage. Close the main process chamber door, and use the vacuum system to evacuate the main process chamber to the required process vacuum. Set the optical parameters and other process parameters of the optical monitor according to the process. Start the target gun, optical monitor, and ion source. The target ions ionized from the target gun material and the ions of the reaction process gas provided by the ion source form a compound film on the workpiece surface. According to the set process requirements, the optical controller uses optical principles to monitor the coating quality online in real time during the coating process. It can check the reflectivity of the substrate and judge the coating quality of the composite film according to the standard corresponding to the coating material. When the first compound film reaches the set optical index, the first target gun is turned off, and the second target gun is switched to perform coating. This alternating coating process continues until the coating process is completed.

[0052] The single-piece boat-shaped composite film reactive magnetron sputtering system includes a boat-shaped main process chamber, a sample inlet transfer system, a workpiece disk rotation system, a dual target gun system, an optical monitoring system, a vacuum system, a power supply system, a semi-embedded ion source system, and a process gas system.

[0053] Sample inlet chamber transfer system: includes a transfer robot for loading workpieces (from sample inlet chamber to main process chamber) and unloading workpieces (from main process chamber to sample inlet chamber). A high-vacuum isolation valve separates the sample inlet chamber and the main process chamber.

[0054] Workpiece disk rotation system: The workpiece disk can rotate evenly according to the set parameters, so that the ions provided by the ion source and the ions ionized on the target material can fully react, resulting in good uniformity of the compound film.

[0055] Dual-target gun system: A system that provides a different target ion and can alternately grow two films with different optical properties to form a composite film system.

[0056] Optical monitoring system: Using optical principles, the optical properties of two compound films are monitored in real time during the coating process. When the reactive sputtered film of one compound reaches the set optical properties, the monitoring switches to the reactive sputtering of the other compound. This process is repeated until the coating is completed.

[0057] Vacuum System: The sample injection chamber and the main process chamber each have their own independent vacuum. The sample injection chamber is equipped with a low-vacuum evacuation system, while the boat-shaped main process chamber is equipped with both low-vacuum and high-vacuum evacuation systems. These evacuation systems are collectively referred to as the vacuum system. Power System: Provides power to the equipment. Semi-Embedded Ion Source System: Provides ions for the reaction gases. Process Gas System: Provides the process gases.

[0058] A ship-shaped reactive magnetron sputtering system with a sample inlet chamber can load and unload workpieces within the chamber, maintaining the main process chamber under relative vacuum. The time required to evacuate the sample inlet chamber to a low vacuum level is relatively short. Generally, in existing technologies, during multi-batch coating processes, after completing one batch and before sampling and loading the sample to proceed with the next batch of workpiece coating, the main process chamber needs to be evacuated from atmospheric pressure to a switching vacuum level P using a low-vacuum pumping system. S Subsequently, a high-vacuum pumping system was used to achieve the high vacuum level P required for the process. D This process usually takes about 30 minutes.

[0059] In this invention, when performing multiple batches of coating processes, taking a structure of multiple sample inlet chambers plus a main process chamber as an example, after completing one batch of coating processes, the vacuum level in the main process chamber is the process high vacuum level P. D The vacuum level in the sample injection chamber is the second vacuum level, P2. At this point, the high-vacuum isolation valve between the process chamber and the sample injection chamber is opened, and the workpiece is transferred. The coated workpiece is transferred from the main process chamber to the multi-piece device in the sample injection chamber, and the next workpiece to be coated is transferred to the main chamber. After the transfer is complete, the high-vacuum isolation valve is closed. During this process, gas exchange occurs between the process chamber and the sample injection chamber, and the vacuum level in the main process chamber decreases to a level between P2 and P2. D The vacuum level P3 is between P2 and P3. Before performing the coating process on the next workpiece, the vacuum level P3 is restored from the current low vacuum P3 to the high vacuum P required for the process. D The time can be shortened to 3-5 minutes or less. In specific magnetron sputtering processes, the selectable parameter is P. D P1 is 5E-6 Torr, P2 is 4E-2 Torr, and P3 is 5E-4 Torr. The overall design saves time and has high production efficiency. The compound films deposited by different equipment have good purity and consistency with small deviations.

[0060] The coating process of the composite film is monitored by an optical monitor, and the real-time parameters of the coating process can be viewed in real time. The quality of the film is judged according to the corresponding standards by comparing the reflectivity of the optical monitor.

[0061] The multi-plate ship-shaped composite film reactive magnetron sputtering system with a sample inlet chamber has a multi-plate system inlet chamber. The multi-plate system inlet chamber is designed with a robot arm and a fixture for the workpiece. Multiple workpieces can be loaded at once, and batch coating can be completed under relative vacuum, resulting in high production efficiency and relatively better coating quality stability.

[0062] This multi-chamber reactive magnetron sputtering system for composite films comprises a multi-element sample inlet system, including multiple main process chambers (at least two) capable of configuring composite film processes. Transfer chambers are located within the multiple sample inlet chambers and each main process chamber. The multi-element sample inlet system ensures that each main process chamber and transfer chamber operates under independent vacuum, enabling efficient mass production. In this configuration, the sample inlet chambers load the workpieces, while the transfer chambers contain robotic arms responsible for transferring the workpieces between the sample inlet chambers and the main process chambers.

[0063] The above-described embodiments are merely some implementation methods of this application. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this application, and these all fall within the protection scope of this application.

Claims

1. A magnetron sputter composite coating method, characterized in that The magnetron sputtering composite coating method adopts a magnetron sputtering composite coating device, which comprises a process chamber, a double-target gun system and an optical monitor, a workpiece disc is arranged above the process chamber, an ion source and the double-target gun system are arranged in the process chamber, the double-target gun system comprises a first target gun and a second target gun, the first target gun is used to coat a high reflectivity HR film, the second target gun is used to coat an anti-reflection AR film, the HR and AR films are alternately grown to adjust the different thickness combinations and different layer numbers of the two materials to obtain a composite optical film with different performances; The optical monitor is used for real-time monitoring and viewing the coating quality, and comprises an emitter, a wafer and a receiver, wherein the wafer is arranged at the center of the workpiece disc, during the composite coating, the optical monitor is started, the emitter emits light of a preset wavelength to the wafer, and the receiver receives the reflectivity value of the wafer, so as to judge the coating quality of the composite film layer. The process chamber has a boat-shaped structure, comprising a top surface, a bottom surface, a first side surface perpendicular to the top surface and the bottom surface, a half side surface perpendicular to the top surface, an inclined surface connecting the half side surface and the bottom surface, and a mounting caliber designed on the inclined surface for mounting the ion source, and the ion source is mounted on the inclined surface through the caliber; the ion source is designed to be mounted at a position where a radius of 2 / 3 of a circle with the center of the workpiece disc as the starting point is reached by a ray emitted from the center of the ion source; The angle between the inclined surface and the bottom surface is 120°, the distance between the center point of the surface of the ion source and two points at 2 / 3 of the radius of the circle with the center of the workpiece disc as the starting point is 225 mm, the angle between the straight line between the two points at 2 / 3 of the radius of the circle with the center of the workpiece disc as the starting point and the horizontal direction of the workpiece disc is 30°, and the ion source is mounted on the inclined surface at a position 160 mm away from the starting point of the bottom inclined surface to the center of the inclined surface.

2. The magnetron sputter composite coating method according to claim 1, characterized in that The first target gun and the second target gun are mounted on the target gun mounting surface through a target gun mounting flange, the target gun system is provided with a target gun angle adjusting device, the target gun is externally provided with an anode cover and a target gun baffle, and the lower portion of the target gun mounting surface is provided with a target gun baffle control valve and an electrical wiring cover.

3. The magnetron sputter composite coating method according to claim 1, characterized in that The method comprises the following steps: (1) Workpiece loading: 4-inch workpieces are used, and the coating materials are silicon and titanium respectively, (2) The vacuum degree of the main process chamber is extracted to 5E-6 Torr by using an evacuation system, and the coating parameters of the composite film layer are set; (3) Process parameter setting: The workpiece disc rotation speed is set to 8 revolutions per minute, the ion source oxygen flow is set to 10 sccm, the main process chamber oxygen flow is set to 18 sccm, the argon flow is set to 25 sccm, the ion source power is set to 500 W, the ion source is started, the Si target gun and the Ti target gun radio frequency power is set to 2000 W, the target gun radio frequency power is started (pressure is held to 40 mTorr before starting), the coating pressure is set to 2.3 mTorr, the high valve is opened half, and the composite coating process is started.

4. The magnetron sputter composite coating method according to claim 3, characterized in that In step (1), for the device without a sample cavity, the main process chamber door is opened, and the 4-inch workpieces are loaded on the workpiece table using the workpiece disc.

5. The magnetron sputter composite coating method according to claim 3, characterized in that In step (1), for the equipment with only a loading chamber, the workpiece is loaded on the workpiece tray of the loading chamber robot through a 4-inch workpiece, the loading chamber door is closed, and the loading chamber and the main process chamber are pumped to the corresponding vacuum. The workpiece tray carrying the workpiece is transferred to the workpiece table of the main process chamber by the robot.

6. The magnetron sputter composite coating method according to claim 3, characterized in that In step (1), for the equipment with both a loading chamber and a transfer chamber, the workpiece tray carrying the workpiece is placed on the multi-piece table of the loading chamber, the loading chamber door is closed, and the loading chamber, the transfer chamber and the main process chamber are pumped to the corresponding vacuum. The workpiece tray carrying the workpiece is transferred to the corresponding workpiece table of the main process chamber by the transfer system.

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