System and method for the production of edible fungi substrate by scattered electron beam sterilization, inoculation and packaging

Abstract

This invention provides a production system and method for the production of loose-layer electron beam sterilization, inoculation, and packaging of edible fungi substrate, belonging to the field of industrialized edible fungi cultivation. The system comprises an electron accelerator system, an edible fungi substrate batching device, a feeding device, an electron beam irradiation transmission and cleanliness control device, and an integrated automatic inoculation and packaging device. This invention simplifies the industrialized edible fungi cultivation process by replacing the existing method of high-temperature steam sterilization, forced cooling, and inoculation of the substrate after packaging with a method that uses loose-layer electron beam sterilization of the substrate at room temperature followed by automatic integrated inoculation and packaging. This significantly reduces carbon emissions, energy consumption, and wastewater / waste heat emissions per unit of production capacity, significantly shortens the edible fungi mycelium growth cycle, reduces land resource and facility construction investment, and yields outstanding comprehensive economic and environmental benefits.

Description

Technical Field

[0001] This invention belongs to the field of industrialized cultivation and production technology of edible fungi, specifically relating to a system and method for the production of edible fungi substrate by loose electron beam sterilization, inoculation and packaging. Background Technology

[0002] Edible fungi are rich in protein, amino acids, and many other nutrients, and are low in fat, low in calories, and easily digestible, meeting the needs of a healthy human diet and have become one of the staple foods for humans. In recent years, the industrialized cultivation and production model of edible fungi has gradually matured, and the scale of factories has become increasingly larger. The general process of industrialized edible fungi cultivation and production is as follows: preparation of edible fungi cultivation substrate—packaging of cultivation substrate to form spawn bags—high-temperature sterilization of spawn bags—forced cooling of spawn bags—inoculation of spawn bags—mycelium growth and cultivation of spawn bags—fruiting management—harvesting, packaging, and delivery. As of the end of 2022, there were more than 400 industrialized edible fungi production enterprises nationwide, and the number is increasing by no less than 10% annually or undergoing capacity upgrades. Continuously replacing and upgrading existing industrialized edible fungi production technologies and models with new technologies and models has significant socio-economic and ecological implications. High-temperature sterilization and inoculation of edible mushroom spawn bags are key aspects of quality control in edible mushroom production. However, they also suffer from pain points and technical defects such as high energy consumption, high pollution, high cost, and limited production efficiency. Specifically: After the edible mushroom cultivation substrate is bagged into spawn bags, it is then sterilized at high temperatures. High-temperature sterilization of spawn bags generally uses high-temperature steam generated by heating water with natural gas, which consumes a lot of energy, has high carbon emissions, a long sterilization cycle, and generates wastewater and waste heat. After high-temperature sterilization, the spawn bags need to be cooled down by strong air cooling to quickly reach the temperature required for inoculation, resulting in secondary energy consumption, extended production cycle, and the need for dedicated refrigeration and purification workshops. Inoculation of spawn bags often uses perforation, which results in a small inoculation area, a long mycelium growth cycle, requires a large amount of purification workshop, and determines the efficiency of the edible mushroom production and supply cycle.

[0003] Irradiation technology is a modern high-tech application that utilizes the strong penetrating power of ionizing radiation (gamma rays, electron beams, or X-rays) on matter, and the physical, chemical, and biological effects produced by its interaction with matter within the penetration depth to achieve processing purposes. Irradiation sterilization technology is one application of irradiation technology; it is a non-thermal sterilization technique that kills microorganisms by irradiating matter with appropriate ionizing radiation. Since the beginning of the 20th century, irradiation sterilization technology has been gradually applied in the sterilization of food, pharmaceuticals, and medical and health products, and has now achieved widespread commercial and industrial application in most countries worldwide.

[0004] Chinese utility model patent CN214902650U discloses an integrated bagging and inoculation machine for edible and medicinal fungi culture media. This device can automatically inoculate and bag sterilized, room-temperature loose edible fungi substrate. Inoculation is performed by simultaneously spraying liquid spawn onto the surface of the culture bag and the middle of the substrate. Compared to existing inoculation techniques, this increases the inoculation area by several tens of times, allowing the spawn to germinate simultaneously from both the inside and surface of the substrate during the subsequent mycelial growth process. This rapid mycelial growth significantly shortens the time required for the mycelial growth stage and improves the efficiency of edible fungi cultivation. The industrial application of this patented technology requires a front-end production system capable of providing high-efficiency, low-energy-consumption, high-capacity, and continuous sterilization of loose edible fungi substrate. Among the six commonly used sterilization methods and new sterilization technologies in the industrial field: High-temperature steam moist heat sterilization for loose edible mushroom substrates suffers from adverse effects such as nutrient loss, excessive water absorption, and the need for secondary cooling due to direct steam contact with the substrate, making it unsuitable for large-scale industrial sterilization of loose edible mushroom substrates; intermittent moist heat steam sterilization faces similar problems to moist heat sterilization; microwave sterilization and ultra-high pressure sterilization have not achieved effective progress in this industry due to issues with sterilization uniformity, cost-effectiveness, and production capacity; filtration sterilization, chemical sterilization, and dry heat sterilization using flames or dry air are also unsuitable for the sterilization of loose edible mushroom substrates; ionizing radiation sterilization, conducted at room temperature or low temperature with minimal temperature rise, helps maintain the product's nutritional components and leaves no residue, making it a viable method for large-scale industrial sterilization of loose edible mushroom substrates. Currently, there are no existing technologies for sterilizing loose edible fungi substrates using industrial processing ionizing radiation (electron beams with energy not exceeding 10 MeV, X-rays with energy not exceeding 5 MeV, and cobalt-source gamma rays).

[0005] Chinese invention patent CN109601252A discloses a method for green production of edible mushroom substrate bags. The method aims to sterilize unsterilized mushroom bags by using gamma-ray irradiation or electron beam irradiation combined with ozone water treatment, thus changing the traditional method of high-temperature, long-duration steam sterilization. Compared to heat sterilization, the sterilization time is reduced by approximately 30 hours, and energy consumption is reduced by 60-80%. However, this technology requires the edible mushroom substrate to be bagged before sterilization, which has certain drawbacks: the large size and high water content of the mushroom bags necessitate the use of penetrating rays with strong penetration capabilities, such as 10MeV high-energy electron beams or gamma rays; the sterilization equipment is expensive, the initial investment cost is high, and the cost of generating ionizing radiation required for the same sterilization level is high; furthermore, the technology's applicability is limited due to the significant differences in the style and size of mushroom bags among different edible mushroom varieties. This technology does not provide a method for sterilizing loose edible fungi substrates and cannot be used for industrial-scale sterilization of loose edible fungi substrates that is compatible with the integrated bagging and inoculation machine for edible and medicinal fungi culture materials disclosed in Chinese Utility Model Patent CN214902650U.

[0006] In summary, there is an urgent need in the field of industrialized edible mushroom cultivation and production technology for a technical solution that can significantly reduce energy consumption and costs in the large-scale industrialized sterilization of edible mushroom substrates and the preparation of substrate bags, while greatly increasing production efficiency and capacity. Summary of the Invention

[0007] The technical problem solved by this invention is to provide a production system and method for bulk electron beam sterilization, inoculation, and packaging of edible fungi substrate. The purpose of this invention is to combine electron beam sterilization with existing integrated bagging and inoculation machines for edible and medicinal fungi culture media to form a complete device and technology for bulk sterilization of edible fungi substrate before inoculation and packaging. This applies high-power, medium-low energy electron beam irradiation sterilization technology to the sterilization stage of large-scale industrial production of edible fungi cultivation substrates. By replacing the existing high-temperature steam sterilization method after packaging with room-temperature electron beam irradiation sterilization of bulk edible fungi substrate, the production process can significantly reduce sterilization-related costs. The reduction of unit production energy consumption and economic costs in this process helps to reduce carbon emissions and wastewater and waste heat emissions, and improve the green and environmentally friendly nature of industrial production. Through reasonable process design, it is possible to achieve fully automated integrated operation of first sterilizing the edible fungus substrate in bulk state by electron beam irradiation, and then spraying, inoculating and bagging the sterilized edible fungus substrate under clean conditions. The application can significantly reduce the production cost of edible fungus bags, improve production capacity and efficiency, and significantly increase the mycelium growth rate of edible fungus bags due to the significant increase in the inoculation area of ​​the bags, further saving the initial hardware investment, land space occupation and operating costs of the mycelium growth workshop.

[0008] To achieve the above objectives, the present invention adopts the following technical solution:

[0009] An edible fungus substrate bulk electron beam sterilization and inoculation packaging production system, which includes an electron accelerator system, an edible fungus substrate batching device, a feeding device, an electron beam irradiation transmission and cleanliness control device, and an automatic inoculation and packaging integrated device.

[0010] The electron accelerator system includes an electron accelerator system, a radiation safety protection and shielding system, and an ozone extraction and smoke detection system. The radiation safety protection and shielding system internally comprises a shielding maze and a shielding irradiation hall, with the shielding maze connecting to both sides of the shielding irradiation hall. The electron accelerator system is located within the shielding structure and is used to generate the electron beam required for sterilization of the edible fungi substrate. The ozone extraction and smoke detection system is located within the shielding maze, connecting the radiation safety protection and shielding system to the outside environment, and is used to extract ozone and nitrogen oxides generated by the electron beam ionizing the air.

[0011] The edible fungus substrate batching device is used to prepare the required edible fungus substrate and to deliver the edible fungus substrate to the feeding device;

[0012] The feeding device is embedded in the shielding labyrinth on one side of the entrance. The feeding device enters from the entrance side of the shielding labyrinth. The feeding device is connected to the edible fungus substrate batching device and is used to transport the loose edible fungus substrate sent out by the edible fungus substrate batching device to the electron beam irradiation transmission and cleanliness control device in a normal air cleanliness environment.

[0013] The electron beam irradiation transmission and cleanliness control device is installed after the feeding device and extends from the outlet of the shielded labyrinth on the outlet side through the shielded irradiation hall to connect to the automatic inoculation and packaging integrated device; the electron beam irradiation transmission and cleanliness control device is used to transfer the loose edible fungus substrate given by the feeding device from the ordinary air cleanliness environment to the thousand-level air cleanliness environment, and continue to be transmitted in the thousand-level air cleanliness environment through the electron beam scanning area generated by the electron accelerator system to complete the irradiation sterilization treatment until it reaches the automatic inoculation and packaging integrated device.

[0014] The automated inoculation and packaging integrated device is installed in a Class 1000 cleanroom environment and is used to inoculate and package the sterile edible fungus substrate obtained after electron beam irradiation sterilization.

[0015] In the above technical solution, the electron accelerator system includes an electron beam scanning window and an electron beam scanning window cooling air knife. The electron beam is ejected from the vacuum system into the air through the electron beam scanning window to form an electron beam scanning area. The electron beam scanning window cooling air knife blows air onto the electron beam scanning window to cool the electron beam scanning window.

[0016] The electron accelerator system is selected as an industrial electron accelerator system capable of generating an electron beam energy of no more than 10 MeV; specifically, the electron accelerator system parameters are as follows: electron beam energy 2-5 MeV, beam current power no less than 100 kW, electron beam scanning non-uniformity less than 5%, electron beam output power to electron accelerator system power consumption ratio no less than 40%, and stable and reliable full-power operation time no less than 7000 hours / year.

[0017] In the above technical solution, the shielding labyrinth and shielding irradiation hall of the radiation safety protection and shielding system are ordinary clean environments;

[0018] The ozone extraction and smoke detection system includes an ozone extraction port, which is located near the entrance of the shielded maze. An environmental isolation fire door is provided on the entrance side of the shielded maze to prevent air from entering the maze from that side. A positive wind pressure and airflow direction are formed in the shielded maze and the shielded irradiation hall from the maze exit side to the ozone extraction port, so that the air in the shielded maze and the shielded irradiation hall does not enter the electron beam irradiation transmission and cleanliness control device.

[0019] In the above technical solution, the feeding device selects a suitable material conveying method and system, such as a trough spiral conveyor, a pipeline chain conveyor, a belt conveyor, a pallet chain conveyor, or a pallet roller conveyor.

[0020] In the above technical solution, the electron beam irradiation transmission and cleanliness control device includes an edible fungus substrate spreading mechanism, an edible fungus substrate irradiation transmission mechanism, an edible fungus substrate post-irradiation transmission mechanism, and a cleanliness control mechanism.

[0021] The edible mushroom substrate spreading mechanism and the edible mushroom substrate irradiation transmission mechanism are embedded in the shielded irradiation hall. The inlet of the edible mushroom substrate spreading mechanism is connected to the outlet of the feeding device, and the inlet of the edible mushroom substrate irradiation transmission mechanism is connected to the outlet of the edible mushroom substrate spreading mechanism. The edible mushroom substrate irradiation transmission mechanism is embedded in the shielded irradiation hall and the shielded labyrinth on the discharge side. The edible mushroom substrate irradiation transmission mechanism connects the outlet of the edible mushroom substrate irradiation transmission mechanism to the automatic inoculation and packaging integrated device, and connects the automatic inoculation and packaging integrated device to the inlet of the edible mushroom substrate spreading mechanism. A cleanliness control mechanism is provided on the outside of the edible mushroom substrate irradiation transmission mechanism.

[0022] In the above technical solution, the materials used to manufacture the electron beam irradiation transmission and cleanliness control device are all stainless steel materials with high tolerance to irradiation, ozone and humid environments.

[0023] The edible fungus substrate spreading mechanism is used to spread the edible fungus substrate delivered by the feeding device evenly on the material conveying surface of the edible fungus substrate irradiation transmission mechanism according to the required thickness.

[0024] The edible mushroom substrate irradiation transmission mechanism is linked to the edible mushroom substrate spreading mechanism. The edible mushroom substrate irradiation transmission mechanism starts 3-5 meters before the electron beam scanning area generated by the electron accelerator system. The material transport surface of the edible mushroom substrate irradiation transmission mechanism is a series of stainless steel trays of the same specifications and with a certain depth. The material width of the stainless steel trays is smaller than the electron beam scanning width at which they reach. The edible mushroom substrate spreading mechanism spreads the edible mushroom substrate evenly into the empty stainless steel trays according to the required thickness. The edible mushroom substrate irradiation transmission mechanism then sequentially and uniformly transports each stainless steel tray with edible mushroom substrate through the electron beam scanning area generated by the electron accelerator system to complete the sterilization treatment with a certain electron beam irradiation dose.

[0025] The edible fungus substrate irradiation transmission mechanism adopts a suitable material conveying method and system, such as belt conveyor, pallet chain conveyor, or pallet roller conveyor.

[0026] The edible fungus substrate irradiation transmission mechanism uniformly transports each stainless steel tray containing edible fungus substrate through the electron beam scanning area generated by the electron accelerator system. The speed stability is controlled within 2%, and the gap between each stainless steel tray is no more than 2cm.

[0027] The edible fungus substrate irradiation transmission mechanism is equipped with an electron beam heat exchange target under the electron beam scanning area generated by the electron accelerator system.

[0028] Furthermore, the thickness of the edible mushroom substrate laid by the edible mushroom substrate spreading mechanism on the material transport surface of the edible mushroom substrate irradiation transport mechanism, and the thickness of the edible mushroom substrate during the process of the edible mushroom substrate on the material transport surface being uniformly transported through the electron beam scanning area generated by the electron accelerator system, are determined based on the fact that the electron beam can penetrate the edible mushroom substrate to achieve effective sterilization of the edible mushroom substrate and the surface of the material transport surface. Therefore, a maximum limit H of the edible mushroom substrate spreading thickness is defined. opt :

[0029] Based on the dose depth distribution pattern when an electron beam penetrates a homogeneous material, the maximum thickness H of the edible mushroom substrate layer is determined when the irradiation dose received at the bottom of the substrate is the same as the irradiation dose received at the surface. opt This value can be calculated initially before testing and verification using the following empirical formula.

[0030] H opt =(0.404E-0.161) / ρ

[0031] In the formula, H optThe unit for electron beam energy E is cm, the unit for electron beam energy E is MeV, and the unit for edible fungus substrate density ρ is g / cm³. 3 ;

[0032] The edible fungus substrate spreading mechanism spreads the edible fungus substrate at a depth not exceeding the maximum spreading thickness H of the edible fungus substrate. opt The substrate is evenly spread into each of the stainless steel trays. To maximize electron beam utilization efficiency, the thickness of the edible mushroom substrate spread into the stainless steel trays should not be less than the maximum thickness H of the edible mushroom substrate. opt 80%;

[0033] To ensure that the sterilization level of the edible mushroom substrate irradiated by electron beam meets the quality control requirements of the production process, it is necessary to determine the minimum effective sterilization dose D of the edible mushroom substrate by scattered electron beam irradiation through production validation. eff Unit: kGy; The process electron beam irradiation dose D received by the edible fungus substrate during production. pro Appropriately greater than the minimum effective sterilization dose D eff To maximize the efficiency and cost-effectiveness of electron beam utilization, the process electron beam irradiation dose D received by the edible fungi substrate during production should be ensured. pro Not greater than the minimum effective sterilization dose D eff 120% of;

[0034] The width of the edible fungus substrate carrier transport surface is smaller than the electron beam scanning width. Electron beams extending beyond both ends of the width of the edible fungus substrate carrier transport surface directly strike the heat exchange target under the electron beam. The heat exchange target under the electron beam is a heat exchanger with internal circulating water cooling. The heat accumulated on the surface of the heat exchange target by the electron beam can be carried away by the circulating cooling water in time to prevent deformation of the heat exchange target structure. The circulating cooling water of the heat exchange target under the electron beam is tap water. After absorbing energy and heating up, the circulating cooling water is cooled down by a cooling tower installed outdoors.

[0035] Furthermore, the edible fungus substrate irradiation post-transfer mechanism is used to continue transporting the edible fungus substrate that has undergone electron beam irradiation sterilization from the edible fungus substrate irradiation post-transfer mechanism to the automatic inoculation and packaging integrated device. The edible fungus substrate irradiation post-transfer mechanism is reasonably arranged along the bend of the shielding labyrinth at the outlet side. The edible fungus substrate irradiation post-transfer mechanism adopts a suitable material conveying method and system such as pipe groove spiral conveying, pipe chain conveying, belt conveying, pallet chain conveying or pallet roller conveying.

[0036] The edible mushroom substrate irradiation transmission mechanism is matched with the material conveying method of the edible mushroom substrate irradiation transmission mechanism, and consists of two parts: a full-tray transmission mechanism and an empty-tray return mechanism; wherein, the transmission speed of the full-tray transmission mechanism is 1.5-3 times the transmission speed of the edible mushroom substrate irradiation transmission mechanism for the stainless steel pallet.

[0037] After the full-tray transfer mechanism transports each material-carrying stainless steel tray to the automatic inoculation and packaging integrated device, it flips each material-carrying stainless steel tray so that all the edible fungus substrate in each material-carrying stainless steel tray is poured into the storage unit of the automatic inoculation and packaging integrated device. Finally, the empty material-carrying stainless steel trays are sequentially transferred back to the edible fungus substrate spreading mechanism by the empty tray return mechanism.

[0038] Furthermore, the cleanliness control mechanism includes a main clean air duct, a main clean air inlet, a secondary clean air supply duct, several booster fans, a secondary clean air outlet, a pre-irradiation transmission mechanism cleaning machine, and several clean transmission mechanism sterilizers.

[0039] The main clean air duct is a pipe with a certain inner diameter, which covers the edible fungus substrate irradiation transmission mechanism, electron beam scanning window, electron beam heat exchange target, and full-disc transmission mechanism of the edible fungus substrate irradiation transmission mechanism. It also covers a part of the front section of the empty disk return transmission mechanism. The clean air pressure in the main clean air duct is kept positive relative to the air pressure in the shielding labyrinth and the shielding irradiation hall to prevent unclean gas from entering the main clean air duct through any gaps or openings. The specific clean air pressure, air volume, humidity parameters, and the settings of the main clean air inlet, clean air makeup duct, booster fan, and clean air outlet in the main clean air duct are set and adjusted according to actual production needs.

[0040] The ventilation cross section of the main clean air duct is circular or elliptical; a main clean air inlet is set at the interface between the main clean air duct and the automatic inoculation and packaging integrated device, a clean air outlet is set at the beginning of the edible fungus substrate irradiation transmission mechanism, and a clean air outlet is set at a distance of 3-5 meters from the beginning of the empty tray return mechanism. A certain flow rate of clean air is formed in the main clean air duct, which is opposite to the transmission direction of the full tray transmission mechanism and the same as the transmission direction of the empty tray return mechanism.

[0041] The clean air supply pipe provides clean air to the cooling air knife of the electron beam scanning window, and the air blowing direction of the cooling air knife of the electron beam scanning window is opposite to the transmission direction of the edible fungus substrate irradiation transmission mechanism.

[0042] A booster fan is installed 1-2 meters away from the clean air outlet at the beginning of the edible fungus substrate irradiation transmission mechanism in the main clean air duct to increase the airflow power of the clean air exhaust in the main clean air duct, straighten the airflow direction of the clean air, and form an air barrier to prevent unclean air from the shielded irradiation hall from entering the main clean air duct.

[0043] The pre-irradiation transmission mechanism cleaning machine is installed between the clean air outlet and the booster fan at the beginning of the edible fungus substrate irradiation transmission mechanism. It cleans the metal surface by high-pressure water washing, scraper cleaning or exhaust dust removal. The pre-irradiation transmission mechanism cleaning machine cleans the metal surface of the edible fungus substrate irradiation transmission mechanism other than the material transport surface before entering the main clean air duct and reaching the electron beam scanning area generated by the electron accelerator system.

[0044] One set of the aforementioned clean transport mechanism sterilizers is installed between the booster fan and the electron beam scanning area generated by the electron accelerator system; another set of the aforementioned clean transport mechanism sterilizers is installed between the edible fungus substrate irradiation transport mechanism and the edible fungus substrate post-irradiation transport mechanism. The clean transport mechanism sterilizers achieve their function by means of electromagnetic heating sterilization, strong ultraviolet light sterilization, ozone sterilization, or low-energy electron beam surface irradiation sterilization. The aforementioned clean transport mechanism sterilizers are used to sterilize the metal surface parts other than the material transport surface of the edible fungus substrate irradiation transport mechanism, i.e., the parts that cannot be irradiated by the electron beam generated by the electron accelerator system, and the surface of the edible fungus substrate post-irradiation transport mechanism, as well as to limit the overall environment and the microbial load level of the object surface within the cleanliness control mechanism.

[0045] The working method of the edible fungi substrate loose electron beam sterilization and inoculation packaging production system includes the following steps:

[0046] S1: Set the system operating parameters according to the production process requirements, start the production system, and ensure that all equipment in the production system is in a stable operating state, and that the environmental cleanliness level in the electron beam irradiation transmission and cleanliness control device and the automatic inoculation and packaging integrated device meets the requirements.

[0047] S2: Input various cultivation substrate raw materials into the edible fungus substrate mixing device and stir to form the required edible fungus substrate in bulk state;

[0048] S3: The edible fungus substrate batching device delivers the edible fungus substrate to the feeding device;

[0049] S4: The feeding device transports the edible mushroom substrate to the edible mushroom substrate spreading mechanism;

[0050] S5: The edible fungus substrate spreading mechanism spreads the edible fungus substrate evenly on the material conveying surface of the edible fungus substrate irradiation transmission mechanism according to the required thickness;

[0051] S6: The edible fungus substrate irradiation transmission mechanism transports the edible fungus substrate on the material transport surface at a certain thickness and at a uniform speed through the electron beam scanning area generated by the electron accelerator system, so that it is subjected to a certain electron beam irradiation dose for sterilization treatment to become a sterile edible fungus substrate. Then, in the clean environment provided by the cleanliness control mechanism, the sterile edible fungus substrate is transported to the edible fungus substrate irradiation transmission mechanism.

[0052] S7: The irradiated edible fungus substrate transport mechanism continues to transport the sterile edible fungus substrate to the automatic inoculation and packaging integrated device in a clean environment provided by the cleanliness control mechanism.

[0053] S8: The automatic inoculation and packaging integrated device performs inoculation and packaging of sterile edible fungi substrate in an integrated manner and produces fungi bags, which are then output to the downstream edible fungi bag mycelium growth and cultivation production process.

[0054] S2 to S8 are cyclical repeating steps.

[0055] Advantages of this invention compared to existing technologies:

[0056] 1. This solution simplifies the production process and improves automation and intelligence: It adopts a production technology solution that first sterilizes the edible fungus substrate in bulk state, and then simultaneously bags (or bottles) and inoculates the edible fungus substrate. Compared with the current production technology solution in industrialized edible fungus production, which involves filling the substrate into bags first and then sterilizing it with high-temperature steam, this solution eliminates the need for large boiler heating and insulation and strong cooling in clean workshops, thus greatly reducing the production process and improving the degree of automation. It also reduces the footprint of production facilities and the amount of manual labor required.

[0057] 2. This solution improves production efficiency and flexibility: The electron beam irradiation sterilization method can complete the sterilization of edible fungi substrate in seconds, and can continuously supply subsequent operations. The sterilization capacity of edible fungi substrate per unit hour can reach ten tons, meeting the efficiency and scale requirements of large-scale factory production of more than 100,000 mushroom bags per day; the traditional high-temperature sterilization method of edible fungi bags requires several hours for the sterilization process alone, and the sterilization equipment cannot operate continuously and needs to be cooled after sterilization before subsequent operations can be carried out.

[0058] 3. This solution significantly reduces production costs and achieves energy conservation and emission reduction: Ionizing radiation sterilization utilizes the strong biological effects of ionizing radiation to achieve low-energy sterilization, which is an internationally recognized green technology. The high-power, medium-low energy electron beam irradiation sterilization method adopted is one of the most energy-efficient ionizing radiation sterilization methods, as the generation of the electron beam only consumes electricity. This technical solution can achieve a power consumption of less than 50 kWh per ton of edible mushroom substrate for sterilization, which translates to a direct sterilization cost of approximately 30 yuan / ton. Simultaneously, the sterilization process does not generate high temperatures requiring secondary cooling, direct carbon emissions, or direct wastewater and waste heat emissions. Existing high-temperature steam sterilization heat sources for edible mushroom bags mostly use natural gas combustion or electric heating. After high-temperature sterilization, the edible mushroom bags need to be transferred to a clean environment for forced rapid cooling, with a comprehensive cost of around 300 yuan / ton. Furthermore, this method results in high energy consumption, wastewater and waste heat emissions, and poor ecological benefits. In contrast, this system can significantly reduce unit production energy consumption and carbon emissions in sterilization-related processes, reducing the direct cost per unit capacity by more than 70%.

[0059] 4. This solution improves the efficiency of the mycelium growth process and shortens the overall cultivation cycle: Electron beam irradiation is used to treat the edible fungi substrate, which sterilizes the substrate and degrades complex macromolecules such as cellulose and lignin to a certain extent, making it more conducive to the growth and absorption of edible fungi mycelia, shortening the mycelium growth cycle of edible fungi, increasing the fruiting speed, and shortening the edible fungi production cycle by more than 40%.

[0060] 5. This solution leverages the role of a comprehensive sterilization center to improve the return on investment of facilities: Through further rational planning, this system can be used for the sterilization of raw materials and consumables such as sterile water, sterile substrate packaging materials, clean work clothes, and clean operating tools consumed in large quantities by edible fungi factories. It can also undertake certain irradiation sterilization and irradiation material modification businesses for other products, both internally and externally, thereby leveraging the role of a comprehensive sterilization center and improving operational efficiency. Attached Figure Description

[0061] Figure 1 This is a schematic diagram of the production system of the present invention;

[0062] Figure 2 This is a cross-sectional schematic diagram of a portion of the production system in the electron beam scanning region in this invention, showing the vertical transmission direction.

[0063] Figure 3 This is a schematic diagram of the electron beam irradiation transmission and cleanliness control device in this invention. Detailed Implementation

[0064] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0065] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0066] Please see Figure 1-3 The embodiments of the present invention are described in detail below.

[0067] Example 1: A production system for the sterilization, inoculation, and packaging of edible fungi substrate using scattered electron beams (see [reference needed]). Figure 1 As shown, the system includes an electron accelerator system 1, an edible fungus substrate preparation device 2, a feeding device 3, an electron beam irradiation transmission and cleanliness control device 4, and an automatic inoculation and packaging integrated device 5.

[0068] The electron accelerator system 1 generates an electron beam with parameters such as scanning width, scanning uniformity, energy stability, beam current stability, and long-term continuous reliability required for the sterilization of edible fungi substrate, which meet the requirements for continuous industrial automation. This electron beam penetrates downwards and irradiates the edible fungi substrate transmitted through its scanning area, thus sterilizing it. The electron accelerator system 1 includes an electron accelerator system 101, a radiation safety protection and shielding system 102, and an ozone extraction and smoke detection system 103. The radiation safety protection and shielding system 102 has a shielding labyrinth 1021 and a shielding irradiation hall 1022 inside, with the shielding labyrinth 1021 connected to both sides of the shielding irradiation hall 1022. The electron accelerator system 101 is located in the shielding and is used to generate the electron beam required for the sterilization of edible fungi substrate. The ozone extraction and smoke detection system 103 is located in the shielding labyrinth 1021 and connects the radiation safety protection and shielding system 102 to the outside world, and is used to extract ozone and nitrogen oxides generated by the electron beam ionizing the air.

[0069] The edible fungus substrate mixing device 2 is used to fully and evenly mix the various cultivation substrate raw materials required for the cultivation of edible fungi according to a certain formula ratio to form the required edible fungus substrate in a bulk state with uniform parameters such as dry matter composition, dry matter content, moisture content, air permeability, pH, and density distribution, and uniformity higher than 95%, and then send the edible fungus substrate to the feeding device 3.

[0070] The feeding device 3 is embedded in the shielding labyrinth 1021 on one side of the entrance. The feeding device 3 enters from the entrance side of the shielding labyrinth 1021. The feeding device 3 is connected to the edible fungus substrate batching device 2 and is used to transport the loose edible fungus substrate sent out by the edible fungus substrate batching device 2 to the electron beam irradiation transmission and cleanliness control device 4 in a normal air cleanliness environment.

[0071] The electron beam irradiation transmission and cleanliness control device 4 is installed after the feeding device 3 and extends from the outlet of the shielded labyrinth 1021 on the outlet side through the shielded irradiation hall 1022 to connect to the automatic inoculation and packaging integrated device 5. The electron beam irradiation transmission and cleanliness control device 4 is used to transfer the loose edible fungus substrate given by the feeding device 3 from the ordinary air cleanliness environment to the thousand-level air cleanliness environment, and continue to be transmitted in the thousand-level air cleanliness environment through the electron beam scanning area generated by the electron accelerator system 101 to complete the irradiation sterilization treatment until it reaches the automatic inoculation and packaging integrated device 5.

[0072] The automatic inoculation and packaging integrated device 5 is installed in a Class 1000 cleanroom environment. It is used to complete the integrated work of inoculating and packaging the sterile edible fungus substrate obtained after electron beam irradiation sterilization to make fungus bags and output them to the downstream edible fungus bag inoculation and cultivation production process. The device has self-cleaning and self-sterilization functions.

[0073] It also includes a system power supply and automatic control device 6, which is used to transmit and distribute power and automatically control the process of all parts of the production system, and consists of related hardware and software.

[0074] In one embodiment, see Figure 2 As shown, the electron accelerator system 101 includes an electron beam scanning window 1011 and an electron beam scanning window cooling air knife 1012. The electron beam is ejected from the vacuum system into the air through the electron beam scanning window 1011 to form an electron beam scanning area. The electron beam scanning window cooling air knife 1012 blows air onto the electron beam scanning window 1011 to cool the electron beam scanning window 1011.

[0075] Preferably, the electron accelerator system 101 is an industrial electron accelerator system capable of generating electron beam energies not exceeding 10 MeV.

[0076] More preferably, the electron accelerator system 101 has the following performance parameters: electron beam energy of 2-5 MeV, beam current power of not less than 100 kW, electron beam scanning non-uniformity of less than 5%, electron beam output power to electron accelerator system power consumption ratio of not less than 40%, and stable and reliable full-power operation time of not less than 7000 hours / year.

[0077] In one embodiment, the shielding labyrinth 1021 and the shielding irradiation hall 1022 of the radiation safety protection and shielding system 102 are ordinary clean environments.

[0078] The ozone extraction and smoke detection system 103 includes an ozone extraction port 1031, which is located at a certain distance from the entrance of the shielded maze 1021. An environmental isolation fire door is provided on the entrance side of the shielded maze 1021 to prevent air from entering the maze from that side. A positive wind pressure and airflow direction are formed in the shielded maze 1021 and the shielded irradiation hall 1022 from the maze exit side to the ozone extraction port 1031, so that the air in the shielded maze 1021 and the shielded irradiation hall 1022 does not enter the electron beam irradiation transmission and cleanliness control device 4.

[0079] In one embodiment, the feeding device 3 is selected from suitable material conveying methods and systems such as trough spiral conveying, pipeline chain conveying, belt conveying, pallet chain conveying or pallet roller conveying.

[0080] In one embodiment, see Figure 1 and 3 As shown, the electron beam irradiation transmission and cleanliness control device 4 includes an edible mushroom substrate spreading mechanism 401, an edible mushroom substrate irradiation transmission mechanism 402, an edible mushroom substrate post-irradiation transmission mechanism 403, and a cleanliness control mechanism 404. The edible mushroom substrate spreading mechanism 401 and the edible mushroom substrate irradiation transmission mechanism 402 are embedded in the shielded irradiation hall 1022. The inlet of the edible mushroom substrate spreading mechanism 401 is connected to the outlet of the feeding device 3, and the inlet of the edible mushroom substrate irradiation transmission mechanism 402 is connected to the edible mushroom substrate... The outlet of the substrate spreading mechanism 401 is connected, and the edible fungus substrate irradiation transmission mechanism 403 is embedded in the shielded irradiation hall 1022 and the shielded labyrinth 1021 on the discharge side. The edible fungus substrate irradiation transmission mechanism 403 connects the outlet of the edible fungus substrate irradiation transmission mechanism 402 and the automatic inoculation and packaging integrated device 5, and connects the automatic inoculation and packaging integrated device 5 to the inlet of the edible fungus substrate spreading mechanism 401. The edible fungus substrate irradiation transmission mechanism 402 is provided with a cleanliness control mechanism 404 on the outside.

[0081] Preferably, the electron beam irradiation transmission and cleanliness control device 4 is made of stainless steel, which has high tolerance to ionizing radiation, ozone and humid environments.

[0082] The edible fungus substrate spreading mechanism 401 is used to spread the edible fungus substrate delivered by the feeding device 3 evenly on the material conveying surface of the edible fungus substrate irradiation transmission mechanism 402 according to the required thickness. The specific device structure design can be carried out using existing solid bulk material quantitative feeding and spreading and sorting related industrial technologies.

[0083] The edible fungus substrate irradiation transmission mechanism 402 is linked to the edible fungus substrate spreading mechanism 401. The edible fungus substrate irradiation transmission mechanism 402 starts 3-5 meters before the electron beam scanning area generated by the electron accelerator system 101. The material conveying surface of the edible fungus substrate irradiation transmission mechanism 402 is a series of stainless steel trays 4022 of the same specification and a certain depth. The material width of the stainless steel trays 4022 should be smaller than the electron beam scanning width reaching them. The edible fungus substrate spreading mechanism 401 spreads the edible fungus substrate evenly into the empty stainless steel trays 4022 according to the required thickness. The edible fungus substrate irradiation transmission mechanism 402 transports each stainless steel tray 4022 with edible fungus substrate through the electron beam scanning area generated by the electron accelerator system 101 at a uniform speed to complete the sterilization treatment with a certain electron beam irradiation dose.

[0084] The edible fungus substrate irradiation transmission mechanism 402 can adopt a suitable material conveying method and system such as belt conveyor, pallet chain conveyor or pallet roller conveyor; preferably, the material conveying method of the edible fungus substrate irradiation transmission mechanism 402 is a combination of pallet chain and pallet roller conveyor.

[0085] The edible fungus substrate irradiation transmission mechanism 402 uniformly transports each material-carrying stainless steel tray 4022 covered with edible fungus substrate through the electron beam scanning area generated by the electron accelerator system 101. The speed stability is controlled within 2%, and the gap between each material-carrying stainless steel tray 4022 is no more than 2cm.

[0086] The edible fungus substrate irradiation transmission mechanism 402 is equipped with an electron beam heat exchange target 4021 under the electron beam scanning area generated by the electron accelerator system 101.

[0087] In one embodiment, the thickness of the edible mushroom substrate laid by the edible mushroom substrate spreading mechanism 401 on the material transport surface of the edible mushroom substrate irradiation transport mechanism 402, and the thickness of the edible mushroom substrate during the process of the edible mushroom substrate on the material transport surface being uniformly transported by the edible mushroom substrate irradiation transport mechanism 402 through the electron beam scanning area generated by the electron accelerator system 101, are determined based on the fact that the electron beam can penetrate the edible mushroom substrate to achieve effective sterilization of the edible mushroom substrate and the surface of the material transport surface. Therefore, a maximum limit H of the edible mushroom substrate spreading thickness is defined. opt :

[0088] Based on the dose depth distribution pattern when an electron beam penetrates a homogeneous material, the maximum thickness H of the edible mushroom substrate layer is determined when the irradiation dose received at the bottom of the substrate is the same as the irradiation dose received at the surface. opt This value can be calculated initially before testing and verification using the following empirical formula.

[0089] H opt =(0.404E-0.161) / ρ

[0090] In the formula, H opt The unit for electron beam energy E is cm, the unit for electron beam energy E is MeV, and the unit for edible fungus substrate density ρ is g / cm³. 3 ;

[0091] Preferably, the edible mushroom substrate spreading mechanism 401 spreads the edible mushroom substrate at a depth not exceeding the maximum possible thickness H of the edible mushroom substrate spreading layer. opt The substrate is evenly spread into each of the stainless steel trays 4022. To maximize electron beam utilization efficiency, the thickness of the edible mushroom substrate spread into the stainless steel trays 4022 shall not be less than the maximum thickness H of the edible mushroom substrate. opt 80%;

[0092] To ensure that the sterilization level of the edible mushroom substrate irradiated by electron beam meets the quality control requirements of the production process, it is necessary to determine the minimum effective sterilization dose D of the edible mushroom substrate by scattered electron beam irradiation through production validation. eff Unit: kGy; The process electron beam irradiation dose D received by the edible fungus substrate during production. pro Appropriately greater than the minimum effective sterilization dose D eff To maximize the efficiency and cost-effectiveness of electron beam utilization, the process electron beam irradiation dose D received by the edible fungi substrate during production should be ensured. pro Not greater than the minimum effective sterilization dose D eff 120% of;

[0093] The width of the edible fungus substrate carrier transport surface is smaller than the electron beam scanning width. Electron beams extending beyond both ends of the width direction of the edible fungus substrate carrier transport surface directly strike the heat exchange target 4021 under the electron beam. The heat exchange target 4021 under the electron beam is a heat exchanger with internal circulating water cooling. The heat accumulated on the surface of the heat exchange target by the electron beam can be carried away by the circulating cooling water in time to prevent deformation of the heat exchange target structure. The circulating cooling water of the heat exchange target 4021 under the electron beam is tap water. After absorbing energy and heating up, the circulating cooling water is cooled down by a cooling tower installed outdoors.

[0094] In one embodiment, the edible fungus substrate irradiation transmission mechanism 403 is used to continue to transport the edible fungus substrate that has undergone electron beam irradiation sterilization from the edible fungus substrate irradiation transmission mechanism 402 to the automatic inoculation and packaging integrated device 5. The edible fungus substrate irradiation transmission mechanism 403 is reasonably arranged along the bending direction of the shielding labyrinth 1021 at the outlet edge. The edible fungus substrate irradiation transmission mechanism 403 adopts a suitable material conveying method and system such as pipe groove spiral conveying, pipe chain conveying, belt conveying, pallet chain conveying or pallet roller conveying.

[0095] The material conveying mechanism 403 after irradiation of the edible fungus substrate is matched with the material conveying mechanism 402 of the edible fungus substrate irradiation conveying mechanism, and consists of two parts: a full-tray conveying mechanism 4031 and an empty-tray return mechanism 4032. The conveying speed of the full-tray conveying mechanism 4031 is 1.5-3 times the conveying speed of the stainless steel trays 4022 of the edible fungus substrate irradiation conveying mechanism 402. The effect is that after being transferred from the edible fungus substrate irradiation conveying mechanism 402 to the full-tray conveying mechanism 4031, the stainless steel trays 4022 are spaced a certain distance apart, so that they do not interfere with each other when passing through the bends of the shielded maze 1021 from the shielded irradiation hall 1022, and at the bends within the shielded maze 1021.

[0096] After the full-tray transfer mechanism 4031 transports each material-carrying stainless steel tray 4022 to the automatic inoculation and packaging integrated device 5, it flips each material-carrying stainless steel tray 4022 so that all the edible fungus substrate in each material-carrying stainless steel tray 4022 is poured into the storage unit of the automatic inoculation and packaging integrated device 5. Finally, the empty material-carrying stainless steel tray 4022 is sequentially transferred back to the edible fungus substrate spreading mechanism 401 by the empty tray return mechanism 4032.

[0097] In one embodiment, the cleanliness control mechanism 404 provides a clean environment for the process of transmitting the sterile edible fungus substrate obtained after electron beam sterilization into the automatic inoculation and packaging integrated device 5 through the irradiation transmission mechanism 402 and the post-irradiation transmission mechanism 403, ensuring that the sterile edible fungus substrate obtained after electron beam sterilization is not subject to secondary contamination. The cleanliness control mechanism 404 includes a main clean air duct 4041, a main clean air inlet 4042, a secondary clean air supply duct 4043, several booster fans 4044, secondary clean air outlets 4045, a pre-irradiation transmission mechanism cleaning machine 4046, and several clean transmission mechanism sterilizers 4047.

[0098] The main clean air duct 4041 is a pipe with a certain inner diameter, which covers the edible fungus substrate irradiation transmission mechanism 402, electron beam scanning window 1011, electron beam heat exchange target 4021, and full-disc transmission mechanism 4031 of edible fungus substrate irradiation transmission mechanism 403. It also covers a portion of the front section of empty disk return mechanism 4032. The clean air pressure in the main clean air duct 4041 is kept positive relative to the air pressure in the shielding labyrinth 1021 and the shielding irradiation hall 1022 to prevent unclean gas from entering the main clean air duct 4041 through any gaps or openings. The specific clean air pressure, air volume, humidity parameters in the main clean air duct 4041, as well as the settings of the main clean air inlet 4042, clean air makeup pipe 4043, booster fan 4044, and clean air outlet 4045, are set and adjusted according to actual production needs.

[0099] The ventilation cross-section of the main clean air duct 4041 is circular or elliptical, and the ventilation cross-sectional area should be reasonably feasible and as small as possible. The main clean air duct 4041 should be easy to disassemble and assemble, and the sealing performance should be well maintained after repeated disassembly and assembly to reduce the energy consumption of clean air supply and facilitate the maintenance of the main air duct 4041 and its internal mechanisms. A main clean air inlet 4042 is provided at the interface between the main clean air duct 4041 and the automatic inoculation and packaging integrated device 5. A clean air outlet 4045 is provided at the beginning of the edible fungus substrate irradiation transmission mechanism 402 and a clean air outlet 4045 is provided 3-5 meters away from the beginning of the empty tray return mechanism 4032. A certain flow rate of clean air is formed in the main clean air duct 4041, which is opposite to the transmission direction of the full tray transmission mechanism 4031 and the same as the transmission direction of the empty tray return mechanism 4032.

[0100] The clean air supply pipe 4043 provides a certain flow of clean air to the electron beam scanning window cooling air knife 1012 to meet the cooling requirements of the electron beam scanning window 1011. The blowing direction of the electron beam scanning window cooling air knife 1012 is opposite to the transmission direction of the edible fungus substrate irradiation transmission mechanism 402.

[0101] A booster fan 4044 is installed 1-2 meters away from the clean air outlet 4045 at the beginning of the edible fungus substrate irradiation transmission mechanism 402 in the main clean air duct 4041 to increase the airflow power of the clean air exhaust in the main clean air duct 4041, straighten the airflow direction of the clean air, and form an air barrier to prevent unclean air from the shielded irradiation hall 1022 from entering the main clean air duct 4041.

[0102] The pre-irradiation transmission mechanism cleaning machine 4046 is installed between the clean air outlet 4045 and the booster fan 4044 at the beginning of the edible fungus substrate irradiation transmission mechanism 402. It can clean the metal surface by high-pressure water washing, scraper cleaning, or exhaust dust collection. The pre-irradiation transmission mechanism cleaning machine 4046 cleans the metal surface of the edible fungus substrate irradiation transmission mechanism 402 other than the material transport surface before entering the main clean air duct 4041 and reaching the electron beam scanning area generated by the electron accelerator system 101.

[0103] A set of the clean transport mechanism sterilizers 4047 is installed between the booster fan 4044 and the electron beam scanning area generated by the electron accelerator system 101; a set of the clean transport mechanism sterilizers 4047 is installed between the edible fungus substrate irradiation transport mechanism 402 and the edible fungus substrate irradiation post-transport mechanism 403; preferably, the clean transport mechanism sterilizers 4047 achieve their function by electromagnetic heating sterilization, strong ultraviolet light sterilization, ozone sterilization or low-energy electron beam surface irradiation sterilization.

[0104] The aforementioned sterilizers 4047 are used to sterilize the metal surface of the edible fungus substrate irradiation transmission mechanism 402 outside the material transport surface, i.e., the part that cannot be irradiated by the electron beam generated by the electron accelerator system 101, and the surface of the transmission mechanism 403 after irradiation of the edible fungus substrate, and to limit the overall environment and the microbial load level of the object surface within the cleanliness control mechanism 404. Several sets are set at appropriate positions within the main clean air duct 4041 as needed.

[0105] In this embodiment, the automatic inoculation and packaging integrated device 5 is configured for applicability based on the integrated inoculation and packaging technology of edible and medicinal fungi culture medium disclosed in Chinese Utility Model Patent CN214902650U.

[0106] The working method of the edible fungi substrate loose electron beam sterilization and inoculation packaging production system includes the following steps:

[0107] S1: Set the system operating parameters according to the production process requirements, start the production system, and ensure that all equipment in the production system is in a stable operating state. The environmental cleanliness level of the electron beam irradiation transmission and cleanliness control device 4 and the automatic inoculation and packaging integrated device 5 meets the requirements.

[0108] S2: Input various cultivation substrate raw materials into the edible fungus substrate mixing device 2 and stir to form the required edible fungus substrate in bulk state;

[0109] S3: Edible mushroom substrate batching device 2 delivers edible mushroom substrate to feeding device 3;

[0110] S4: The feeding device 3 transports the edible fungus substrate to the edible fungus substrate spreading mechanism 401;

[0111] S5: The edible fungus substrate spreading mechanism 401 spreads the edible fungus substrate evenly on the material conveying surface of the edible fungus substrate irradiation transmission mechanism 402 according to the required thickness.

[0112] S6: The edible fungus substrate irradiation transmission mechanism 402 transports the edible fungus substrate on the material transport surface at a certain thickness and at a uniform speed through the electron beam scanning area generated by the electron accelerator system 101, so that it is subjected to a certain electron beam irradiation dose for sterilization treatment to become a sterile edible fungus substrate. Then, in the clean environment provided by the cleanliness control mechanism 404, the sterile edible fungus substrate is transported to the edible fungus substrate irradiation transmission mechanism 403.

[0113] S7: The irradiated edible fungus substrate transmission mechanism 403 continues to transport the sterile edible fungus substrate to the automatic inoculation and packaging integrated device 5 in a clean environment provided by the cleanliness control mechanism 404.

[0114] S8: Automatic inoculation and packaging integrated device 5 performs integrated inoculation and packaging of sterile edible fungi substrate to produce fungi bags, which are then output to the downstream edible fungi bag mycelium growth and cultivation production process.

[0115] S2 to S8 are cyclical repeating steps.

[0116] Example 2: This example uses the production of black fungus as an example: Various raw materials are mixed evenly with water in a mixer to form a black fungus matrix. The black fungus matrix is ​​then conveyed by a stainless steel conveyor belt into an electron beam irradiation shield to receive electron beam irradiation (irradiation dose is indicated). After irradiation, the black fungus matrix is ​​conveyed by a conveyor belt in the sterile area into a sterile black fungus matrix collection tank. The sterile black fungus matrix collection tank then uses a screw conveyor to send the raw materials into the hopper of a bagging and inoculation integrated machine. Bagging is carried out under program control. Simultaneously, the prepared liquid inoculum is connected to the bagging machine through pipes to concentrate and evenly inoculate the liquid onto the surface and center of the bags, with 60 ml inoculated per bag. After bagging, the bags are sealed with a sponge, placed in frames, and sent to a constant temperature incubation room for 15 days of cultivation.

[0117] In summary, the system of this invention, together with the existing integrated bagging and inoculation machine for edible and medicinal fungi culture substrates, forms a complete set of devices and technologies. It applies high-power, medium-low energy electron beam irradiation sterilization technology to the sterilization process in the large-scale industrial production of edible fungi cultivation substrates. By replacing the existing production method of high-temperature steam sterilization of edible fungi substrates after packaging with room-temperature electron beam irradiation sterilization of loose edible fungi substrates, it can significantly reduce the unit production energy consumption and economic costs of sterilization-related processes, which is conducive to reducing carbon emissions and wastewater and waste heat emissions, and improving the green and environmentally friendly nature of industrial production.

[0118] This invention, through a rationally designed process flow, enables a fully automated integrated operation that first sterilizes the edible mushroom substrate by electron beam irradiation in its bulk state, and then sprays, inoculates, and bags the sterilized substrate under clean conditions. The application of this invention significantly reduces the production cost of edible mushroom spawn bags, increases production capacity and efficiency, and significantly improves the mycelium growth rate due to the significantly increased inoculation area of ​​the spawn bags, further saving on initial hardware investment, land occupation, and operating costs in the mycelium growth workshop.

[0119] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention, and no reference numerals in the claims should be construed as limiting the scope of the claims.

[0120] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A production system for the sterilization, inoculation, and packaging of edible fungi substrate using scattered electron beams, characterized in that: The system includes an electron accelerator system (1), an edible fungus substrate preparation device (2), a feeding device (3), an electron beam irradiation transmission and cleanliness control device (4), and an automatic inoculation and packaging integrated device (5). The electron accelerator system device (1) includes an electron accelerator system (101), a radiation safety protection and shielding system (102), and an ozone extraction and smoke detection system (103). The radiation safety protection and shielding system (102) is equipped with a shielding maze (1021) and a shielding irradiation hall (1022) inside. The shielding irradiation hall (1022) is connected to the shielding maze (1021) on both sides. The electron accelerator system (101) is located in the shielding body and is used to generate the electron beam required for the sterilization treatment of edible fungi substrate. The ozone extraction and smoke detection system (103) is located in the shielding maze (1021) and connects the radiation safety protection and shielding system (102) to the outside world. It is used to extract ozone and nitrogen oxides generated by the electron beam ionizing the air. The edible fungus substrate preparation device (2) is used to prepare the required edible fungus substrate and send the edible fungus substrate to the feeding device (3); the feeding device (3) is embedded in the shielding labyrinth (1021) on one side of the entrance. The feeding device (3) enters from the entrance side of the shielding labyrinth (1021). The feeding device (3) is connected to the edible fungus substrate preparation device (2) and is used to transport the loose edible fungus substrate sent out by the edible fungus substrate preparation device (2) to the electron beam irradiation transmission and cleanliness control device (4) in a normal air cleanliness environment. The electron beam irradiation transmission and cleanliness control device (4) is installed after the feeding device (3) and extends from the outlet of the shielded labyrinth (1021) on the outlet side through the shielded irradiation hall (1022) to connect to the automatic inoculation and packaging integrated device (5); the electron beam irradiation transmission and cleanliness control device (4) is used to transfer the loose edible fungus substrate given by the feeding device (3) from the ordinary air cleanliness environment to the thousand-level air cleanliness environment, and continue to be transmitted in the thousand-level air cleanliness environment through the electron beam scanning area generated by the electron accelerator system (101) to complete the irradiation sterilization treatment until it reaches the automatic inoculation and packaging integrated device (5). The automatic inoculation and packaging integrated device (5) is installed in a Class 1000 cleanroom environment to inoculate and package the sterile edible fungus substrate obtained after electron beam irradiation sterilization. The electron beam irradiation transmission and cleanliness control device (4) includes an edible fungus substrate spreading mechanism (401), an edible fungus substrate irradiation transmission mechanism (402), an edible fungus substrate irradiation post-transmission mechanism (403), and a cleanliness control mechanism (404). The edible fungus substrate spreading mechanism (401) and the edible fungus substrate irradiation transmission mechanism (402) are embedded in the shielded irradiation hall (1022). The inlet of the edible fungus substrate spreading mechanism (401) is connected to the outlet of the feeding device (3). The inlet of the edible fungus substrate irradiation transmission mechanism (402) is connected to the outlet of the edible fungus substrate spreading mechanism (401). The edible fungus substrate irradiation transmission mechanism (403) is embedded in the shielded irradiation hall (1022) and the shielded labyrinth (1021) on the discharge side. The edible fungus substrate irradiation transmission mechanism (403) connects the outlet of the edible fungus substrate irradiation transmission mechanism (402) to the automatic inoculation and packaging integrated device (5), and connects the automatic inoculation and packaging integrated device (5) to the inlet of the edible fungus substrate spreading mechanism (401). The edible fungus substrate irradiation transmission mechanism (402) is provided with a cleanliness control mechanism (404) on the outside. The material conveying surface of the edible fungus substrate irradiation transmission mechanism (402) is a series of stainless steel trays (4022) of the same specification and a certain depth; the edible fungus substrate irradiation after transmission mechanism (403) is used to continue to transport the edible fungus substrate that has been sterilized by electron beam irradiation from the edible fungus substrate irradiation transmission mechanism (402) to the automatic inoculation and packaging integrated device (5). The edible fungus substrate irradiation after transmission mechanism (403) is reasonably arranged along the bending direction of the shielding labyrinth (1021) on the outlet side. The edible fungus substrate irradiation after transmission mechanism (403) adopts a suitable material conveying method and system such as pipe groove spiral conveying, pipe chain conveying, belt conveying, tray plate chain conveying or tray roller conveying. The irradiated substrate transmission mechanism (403) is matched with the material conveying method of the irradiated substrate transmission mechanism (402), and consists of two parts: a full tray transmission mechanism (4031) and an empty tray return mechanism (4032). The transmission speed of the full tray transmission mechanism (4031) is 1.5-3 times the transmission speed of the irradiated substrate transmission mechanism (402) for the stainless steel trays (4022). After the full tray transmission mechanism (4031) conveys each stainless steel tray (4022) to the automatic inoculation and packaging integrated device (5), it flips each stainless steel tray (4022) so that all the edible substrate in each stainless steel tray (4022) is poured into the storage unit of the automatic inoculation and packaging integrated device (5). Finally, the empty stainless steel trays (4022) are sequentially transferred back to the edible substrate spreading mechanism (401) by the empty tray return mechanism (4032).

2. The edible fungi substrate dispersed electron beam sterilization and inoculation packaging production system according to claim 1, characterized in that: The electron accelerator system (101) includes an electron beam scanning window (1011) and an electron beam scanning window cooling air knife (1012). The electron beam is ejected from the vacuum system into the air through the electron beam scanning window (1011) to form an electron beam scanning area. The electron beam scanning window cooling air knife (1012) blows air onto the electron beam scanning window (1011) to cool the electron beam scanning window (1011). The electron accelerator system (101) has the following performance parameters: electron beam energy 2-5MeV, beam current power not less than 100kW, electron beam scanning non-uniformity less than 5%, electron beam output power to electron accelerator system power consumption ratio not less than 40%, and stable and reliable full-power operation time not less than 7000 hours / year.

3. The edible fungi substrate dispersed electron beam sterilization and inoculation packaging production system according to claim 1, characterized in that: The shielding labyrinth (1021) and shielding irradiation hall (1022) of the radiation safety protection and shielding system (102) are ordinary clean environments; the ozone extraction and smoke detection system (103) includes an ozone extraction port (1031), which is located near the entrance of the shielding labyrinth (1021). An environmental isolation fire door is provided on the entrance side of the shielding labyrinth (1021) to prevent air from entering the shielding labyrinth (1021) from this side. A positive wind pressure and airflow direction are formed in the shielding labyrinth (1021) and shielding irradiation hall (1022) from the exit side of the shielding labyrinth (1021) to the ozone extraction port (1031), so that the air in the shielding labyrinth (1021) and shielding irradiation hall (1022) does not enter the electron beam irradiation transmission and cleanliness control device (4).

4. The edible fungi substrate dispersed electron beam sterilization and inoculation packaging production system according to claim 1, characterized in that: The feeding device (3) is selected from suitable material conveying methods and systems such as pipe groove spiral conveying, pipeline chain conveying, belt conveying, pallet chain conveying or pallet roller conveying.

5. The edible fungi substrate dispersed electron beam sterilization and inoculation packaging production system according to claim 1, characterized in that: The electron beam irradiation transmission and cleanliness control device (4) is made of stainless steel, which has high tolerance to ionizing radiation, ozone and humid environment. The edible fungus substrate spreading mechanism (401) is used to spread the edible fungus substrate delivered by the feeding device (3) evenly on the material carrying and conveying surface of the edible fungus substrate irradiation transmission mechanism (402) according to the required thickness. The edible fungus substrate irradiation transmission mechanism (402) is linked to the edible fungus substrate spreading mechanism (401). The edible fungus substrate irradiation transmission mechanism (402) starts 3-5 meters before the electron beam scanning area generated by the electron accelerator system (101). The width of the substrate-carrying stainless steel tray (4022) is smaller than the electron beam scanning width at that location. The edible fungus substrate spreading mechanism (401) spreads the edible fungus substrate evenly into the empty substrate-carrying stainless steel tray (4022) according to the required thickness. The edible fungus substrate irradiation transmission mechanism (402) sequentially and uniformly transports the substrate-carrying stainless steel trays (4022) through the electron beam generated by the electron accelerator system (101). The electron beam scanning area is used to complete the sterilization process with a certain electron beam irradiation dose; the edible fungus substrate irradiation transmission mechanism (402) adopts a suitable material conveying method and system such as belt conveyor, tray chain conveyor or tray roller conveyor; the edible fungus substrate irradiation transmission mechanism (402) uniformly transports each material-carrying stainless steel tray (4022) covered with edible fungus substrate through the electron beam scanning area generated by the electron accelerator system (101) in sequence, and the speed stability is controlled within 2%, and the gap between each material-carrying stainless steel tray (4022) is not greater than 2cm; the edible fungus substrate irradiation transmission mechanism (402) is equipped with an electron beam heat exchange target (4021) under the electron beam scanning area generated by the electron accelerator system (101).

6. The edible fungi substrate dispersed electron beam sterilization and inoculation packaging production system according to claim 5, characterized in that: The thickness of the edible mushroom substrate laid by the edible mushroom substrate spreading mechanism (401) on the material transport surface of the edible mushroom substrate irradiation transport mechanism (402), and the thickness of the edible mushroom substrate during the process of the edible mushroom substrate on the material transport surface being uniformly transported by the edible mushroom substrate irradiation transport mechanism (402) through the electron beam scanning area generated by the electron accelerator system (101), are determined based on the fact that the electron beam can penetrate the edible mushroom substrate to achieve effective sterilization of the edible mushroom substrate and the surface of the material transport surface. Therefore, a maximum limit H of the edible mushroom substrate spreading thickness is defined. opt : Based on the dose depth distribution pattern when an electron beam penetrates a homogeneous material, the maximum thickness H of the edible mushroom substrate layer is determined when the irradiation dose received at the bottom of the substrate is the same as the irradiation dose received at the surface. opt , H opt =(0.404E-0.161) / ρ In the formula, H opt The unit for electron beam energy E is cm, the unit for electron beam energy E is MeV, and the unit for edible fungus substrate density ρ is g / cm³. 3 ; The edible mushroom substrate spreading mechanism (401) spreads the edible mushroom substrate at a thickness not exceeding the maximum limit H of the edible mushroom substrate spreading thickness. opt The thickness is evenly spread into each material-carrying stainless steel pallet (4022). To ensure that the sterilization level of the edible mushroom substrate irradiated by electron beam meets the quality control requirements of the production process, it is necessary to determine the minimum effective sterilization dose D of the edible mushroom substrate by scattered electron beam irradiation through production validation. eff Unit: kGy; The process electron beam irradiation dose D received by the edible fungus substrate during production. pro Appropriately greater than the minimum effective sterilization dose D eff The width of the edible fungus substrate carrier transport surface is smaller than the electron beam scanning width. The electron beams extending beyond both ends of the width direction of the edible fungus substrate carrier transport surface directly hit the heat exchange target (4021) under the electron beam. The heat exchange target (4021) under the electron beam is a heat exchanger with internal circulating water cooling. The heat accumulated on the surface of the heat exchange target by the electron beam is promptly carried away by the circulating cooling water to prevent deformation of the heat exchange target structure. The circulating cooling water of the heat exchange target (4021) under the electron beam is tap water. After absorbing energy and heating up, the circulating cooling water is cooled down by a cooling tower installed outdoors.

7. The edible fungi substrate dispersed electron beam sterilization and inoculation packaging production system according to claim 6, characterized in that: The thickness of the edible mushroom substrate laid in the stainless steel tray (4022) shall not be less than the maximum thickness H of the edible mushroom substrate. opt 80%.

8. The edible fungi substrate dispersed electron beam sterilization and inoculation packaging production system according to claim 6, characterized in that: The process electron beam irradiation dose D received by the edible fungus substrate during production is guaranteed. pro Not greater than the minimum effective sterilization dose D eff 120%.

9. The edible fungi substrate dispersed electron beam sterilization and inoculation packaging production system according to claim 6, characterized in that: The cleanliness control mechanism (404) includes a main clean air duct (4041), a main clean air inlet (4042), a secondary clean air supply duct (4043), several booster fans (4044), a secondary clean air outlet (4045), a pre-irradiation transmission mechanism cleaning machine (4046), and several clean transmission mechanism sterilizers (4047); the main clean air duct (4041) is a pipe with a certain inner diameter, which carries the edible fungus substrate irradiation transmission mechanism (402), electron beam scanning window (1011), electron beam heat exchange target (4021), and edible fungus substrate post-irradiation transmission mechanism (403) in a full-disc transmission mechanism (4047); 031) Enclosed within it, the front part of the empty disk return mechanism (4032) is also enclosed within it. The clean air pressure in the main clean air duct (4041) is kept positive relative to the air pressure in the shielding labyrinth (1021) and the shielding irradiation hall (1022) to prevent unclean gas from entering the main clean air duct (4041) through any gaps and openings. The specific clean air pressure, air volume, humidity parameters in the main clean air duct (4041) and the settings of the main clean air inlet (4042), clean air make-up air duct (4043), booster fan (4044), and clean air outlet (4045) are set and adjusted according to actual production needs. The ventilation cross-section of the main clean air duct (4041) is circular or elliptical; a main clean air inlet (4042) is provided at the interface between the main clean air duct (4041) and the automatic inoculation and packaging integrated device (5); a clean air outlet (4045) is provided at the beginning of the edible fungus substrate irradiation transmission mechanism (402) and a clean air outlet (4045) is provided 3-5 meters away from the beginning of the empty tray return mechanism (4032); a certain flow rate of clean air is formed in the main clean air duct (4041) with a flow direction opposite to that of the full tray transmission mechanism (4031) and a certain flow rate of clean air with the same flow direction as that of the empty tray return mechanism (4032); the clean air makeup duct (4043) Clean air is supplied to the cooling air knife (1012) of the electron beam scanning window to meet the cooling requirements of the electron beam scanning window (1011). The blowing direction of the cooling air knife (1012) is opposite to the transmission direction of the edible fungus substrate irradiation transmission mechanism (402). A booster fan (4044) is installed 1-2 meters away from the clean air outlet (4045) at the beginning of the edible fungus substrate irradiation transmission mechanism (402) in the main clean air duct (4041) to increase the airflow power of the clean air exhaust in the main clean air duct (4041), straighten the airflow direction of the clean air, and form an air barrier to prevent the unclean air of the shielded irradiation hall (1022) from entering the main clean air duct (4041). The pre-irradiation transmission mechanism cleaning machine (4046) is installed between the clean air outlet (4045) and the booster fan (4044) at the beginning of the edible fungus substrate irradiation transmission mechanism (402). It cleans the metal surface by high-pressure water flushing, scraper cleaning or exhaust dust collection. The pre-irradiation transmission mechanism cleaning machine (4046) cleans the metal surface of the edible fungus substrate irradiation transmission mechanism (402) other than the material transport surface before entering the main clean air duct (4041) and reaching the electron beam scanning area generated by the electron accelerator system (101). A set of the clean transport mechanism sterilizers (4047) is installed between the booster fan (4044) and the electron beam scanning area generated by the electron accelerator system (101), and a set of the clean transport mechanism sterilizers (4047) is installed between the edible fungus substrate irradiation transport mechanism (402) and the edible fungus substrate irradiation transport mechanism (403). The clean transport mechanism sterilizers (4047) achieve their functions by means of electromagnetic heating sterilization, strong ultraviolet light sterilization, ozone sterilization or low-energy electron beam surface irradiation sterilization. The clean transport mechanism sterilizers (4047) are used to sterilize the metal surface parts other than the material transport surface of the edible fungus substrate irradiation transport mechanism (402), that is, the parts that cannot be irradiated by the electron beam generated by the electron accelerator system (101), the surface of the edible fungus substrate irradiation transport mechanism (403), and to limit the overall environment and the microbial load level of the object surface in the cleanliness control mechanism (404).

10. A method for operating the edible fungi substrate dispersed electron beam sterilization and inoculation packaging production system according to any one of claims 1-9, characterized in that: Includes the following steps: S1: Set the system operating parameters according to the production process requirements, start the production system, and make each piece of equipment in the production system operate stably. The environmental cleanliness level in the electron beam irradiation transmission and cleanliness control device (4) and the automatic inoculation and packaging integrated device (5) meets the requirements. S2: Add various cultivation substrate raw materials to the edible fungus substrate mixing device (2) and stir to form the required edible fungus substrate in a bulk state; S3: Edible fungus substrate batching device (2) delivers edible fungus substrate to feeding device (3); S4: The feeding device (3) transports the edible fungus substrate to the edible fungus substrate spreading mechanism (401); S5: The edible fungus substrate spreading mechanism (401) spreads the edible fungus substrate evenly on the material conveying surface of the edible fungus substrate irradiation transmission mechanism (402) according to the required thickness; S6: The edible fungus substrate irradiation transmission mechanism (402) transports the edible fungus substrate on the material transport surface at a certain thickness and at a uniform speed through the electron beam scanning area generated by the electron accelerator system (101), so that it is subjected to a certain electron beam irradiation dose for sterilization treatment and becomes a sterile edible fungus substrate. Then, in the clean environment provided by the cleanliness control mechanism (404), the sterile edible fungus substrate is transported to the edible fungus substrate irradiation transmission mechanism (403). S7: The irradiation-after-transfer mechanism (403) continues to transport the sterile edible fungus substrate to the automatic inoculation and packaging integrated device (5) in a clean environment provided by the cleanliness control mechanism (404); S8: Automatic inoculation and packaging integrated device (5) performs integrated inoculation and packaging of sterile edible fungi substrate and produces fungi bags, which are then output to the downstream edible fungi bag mycelium growth and cultivation production process. S2 to S8 are cyclical repeating steps.

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