Ring array test device based on miniaturized CMUT package unit and preparation method thereof

Abstract

The application is a kind of ring array testing device based on miniaturized CMUT packaging unit and its preparation method, belonging to the field of sensor technology. First, a set of packaging mold is included, and the perfect packaging of miniaturized CMUT is completed through the packaging mold; secondly, a kind of miniaturized CMUT packaging unit is obtained through the packaging mold, and the clamp in the packaging mold is directly packaged in the packaging unit and integrated with the packaging unit; finally, a kind of ring array testing device is obtained through the obtained miniaturized CMUT packaging unit. Through the packaging of the packaging mold, the shape and size are consistent, and the purpose of waterproof packaging is achieved, which can be applied to underwater testing. The testing device ensures the alignment position accuracy of the device, avoids the influence of position error on the transmission and reception signal. Since the shape and size of the device are consistent, the testing device can be reused after disassembly, reducing the installation and alignment time and greatly improving the testing efficiency.

Description

Technical Field

[0001] This invention belongs to the field of sensor technology, and particularly relates to the field of miniaturized sensor packaging and testing technology. Specifically, it is a ring array testing device based on a miniaturized CMUT packaging unit and its preparation method. Background Technology

[0002] With the continuous development of ultrasound medical testing technology, the problems of traditional piezoelectric micromechanical ultrasonic transducers (PMUTs) in testing have gradually become prominent. Due to the impedance mismatch between the piezoelectric transducer and the dielectric, the transducer's transmission and reception performance and sensitivity are seriously affected. In addition, traditional PMUTs have a narrow bandwidth and low lateral resolution, resulting in unclear three-dimensional imaging. They are also affected by many factors such as difficulty in integration and limitations in the manufacturing process, making it difficult to achieve greater breakthroughs.

[0003] Piezoelectric micromechanical ultrasonic transducers (CMUTs) fabricated using MEMS technology have advantages that traditional PMUTs do not possess, such as: (1) lower acoustic impedance, eliminating the need for complex impedance matching layers and facilitating impedance matching with media such as air, water, and human tissue; (2) ease of high-density array element integration, reducing volume and achieving miniaturization; (3) higher sensitivity, better consistency, and higher repeatability and precision; (4) wider bandwidth, higher lateral resolution, and clearer imaging; and (5) simple structure and fabrication process, facilitating transducer array fabrication and mass production, thus reducing costs. Based on these numerous advantages, CMUTs will play a more important role in the field of ultrasonic testing and will gradually replace traditional piezoelectric transducers.

[0004] Capacitive micromechanical ultrasonic transducers (CMUTs) convert ultrasonic energy by generating or receiving it through thin-film vibration. In transmit mode, a DC bias voltage and an AC voltage are applied across the CMUT terminals. The DC bias voltage causes the thin film to bend under electrostatic forces, while the AC voltage creates a changing electrostatic attraction between the upper and lower plates, causing the thin film to vibrate and emit ultrasound. In receive mode, the DC bias voltage causes the thin film to bend, and the incident ultrasonic waves cause it to vibrate, resulting in a change in capacitance, thus detecting the incident ultrasonic waves. These steps enable the CMUT to transmit and receive ultrasonic waves. Since CMUT testing is currently performed underwater, the CMUT and its PCB board must be encapsulated to prevent leakage damage during voltage application. For the relatively small CMUT structure, ensuring the integrity of the overall encapsulation and the stability of the encapsulated CMUT device is a primary challenge that needs to be addressed.

[0005] Furthermore, due to the current limitations of CUMTs in terms of directivity and relatively low transmitted sound pressure levels, the alignment accuracy of the CMUT is crucial during signal testing and final product screening. This is especially true for small, numerous circular arrays, where even slight alignment errors will negatively impact the assessment of CMUT performance. Currently, there are few devices suitable for testing CMUT circular array signals; most rely on manual patching, which makes it difficult to guarantee precise alignment. These errors affect the magnitude of the transmitted and received signals. Moreover, manual patching is time-consuming, labor-intensive, and inefficient. Summary of the Invention

[0006] The purpose of this invention is to solve the problems existing in the prior art and to provide a packaging mold based on a miniaturized CMUT, a miniaturized CMUT packaging unit obtained by the packaging mold, and a ring array testing device based on the miniaturized CMUT packaging unit. These are used together to ensure the integrity of the packaging and to accurately position and align multiple sensors, making the test results more realistic and accurate.

[0007] The first objective of this invention is to provide a packaging mold based on a miniaturized CMUT, which is achieved through the following technical solution:

[0008] A packaging mold based on a miniaturized CMUT includes a fixture and a slot. The fixture includes a U-shaped frame with a cuboid support platform at the middle of the base plate. First wire holes are respectively formed on the two side plates of the U-shaped frame. The slot includes a cuboid base block with several packaging slots on its top surface. The packaging slots are formed by opening downwards from the top surface of the cuboid base block, and are evenly arranged in rows along the length of the cuboid base block. First wire slots communicating with the packaging slots are respectively formed on the front and rear sides of the cuboid base block at the position corresponding to each packaging slot. The top opening of the first wire slot extends to the top surface of the cuboid base block. The size of the packaging slot matches the size of the U-shaped frame, and the width of the first wire slot matches the diameter of the wire.

[0009] Preferably, the encapsulation slots on the mold are provided with 10 slots.

[0010] The second objective of this invention is to provide a miniaturized CMUT packaging unit obtained by the above-described packaging mold, which is achieved through the following technical solution:

[0011] A miniaturized CMUT packaging unit includes a miniaturized CMUT unit mounted on a U-shaped frame of a fixture in a packaging mold. The PCB board of the miniaturized CMUT unit is supported on a cuboid support platform. The upper and lower polarity wires of the miniaturized CMUT unit extend to the outside of the U-shaped frame after passing through first wire holes on two side plates. The U-shaped frame mounting the miniaturized CMUT unit is then installed as a whole in a packaging slot of a groove in the packaging mold. The upper and lower polarity wires of the miniaturized CMUT unit extend to the outside of a cuboid base after passing through first wire slots on both sides. A packaging adhesive is injected into the packaging slot, and after static heating, the packaging adhesive solidifies, encapsulating the miniaturized CMUT unit and the fixture into a whole. The whole is then removed from the groove to obtain the miniaturized CMUT packaging unit.

[0012] Preferably, the miniaturized CMUT unit includes a CMUT chip, a PCB board, an upper electrode wire, and a lower electrode wire; a square chip area is provided at the center of the front side of the PCB board, and upper electrode pads and lower electrode pads are provided at both ends of the PCB board respectively; the CMUT chip is fixed to the square chip area on the PCB board by conductive silver paste, the upper electrode wire is soldered to the upper electrode pad on the PCB board, and the lower electrode wire is soldered to the lower electrode pad on the PCB board.

[0013] Preferably, the encapsulating colloid is PDMS adhesive.

[0014] The third objective of this invention is to provide a ring array testing device based on the aforementioned miniaturized CMUT packaging unit, which is achieved through the following technical solution:

[0015] A ring array testing device based on a miniaturized CMUT package unit includes a circular annular cylinder. The inner surface of the annular cylinder has several mounting slots, which are formed by opening outwards from the inner surface. These mounting slots are evenly distributed in a row along the inner surface of the annular cylinder. A second wire slot communicating with each mounting slot is provided on the inner surface of the annular cylinder at the top and bottom positions corresponding to the mounting slots. A second wire hole communicating with each second wire slot is provided on the outer surface of the annular cylinder at the position corresponding to the second wire slot. The miniaturized CMUT package unit is installed in each mounting slot on the inner surface of the annular cylinder, and the upper and lower wires of the miniaturized CMUT package unit pass through the corresponding second wire holes on the outer surface of the annular cylinder, thus obtaining the ring array testing device based on the miniaturized CMUT package unit.

[0016] Preferably, the annular cylinder has 128 mounting slots.

[0017] The fourth objective of this invention is to provide a method for fabricating the above-mentioned ring array test device based on a miniaturized CMUT packaging unit, which is achieved through the following technical solution:

[0018] A method for fabricating a ring array test device based on a miniaturized CMUT packaging unit includes the following steps:

[0019] 1) Fabrication of packaging molds

[0020] The packaging mold includes a fixture and a slot; the fixture includes a U-shaped frame, with a cuboid support platform located in the middle of the base plate of the U-shaped frame, and first wire holes respectively opened on the two side plates of the U-shaped frame; the slot includes a cuboid base block, with several packaging slots opened on the top surface of the cuboid base block, the packaging slots being formed by opening downwards from the top surface of the cuboid base block, and the several packaging slots being evenly distributed in rows along the length direction of the cuboid base block; on the front and rear sides of the cuboid base block, corresponding to the position of each packaging slot, a first wire slot communicating with the packaging slot is opened, and the top opening of the first wire slot extends to the top surface of the cuboid base block; the size of the packaging slot matches the size of the U-shaped frame, and the width of the first wire slot matches the diameter of the wire.

[0021] 2) Fabrication of miniaturized CMUT units

[0022] The miniaturized CMUT unit includes a CMUT chip, a PCB board, an upper electrode wire, and a lower electrode wire. The CMUT chip is fixed on the surface of the PCB board, and the upper electrode wire and the lower electrode wire are respectively connected to the two ends of the PCB board.

[0023] 3) Fabrication of miniaturized CMUT packaging units

[0024] A miniaturized CMUT unit is mounted on a U-shaped frame of a fixture in a packaging mold. The PCB board is supported on a cuboid support platform, with the CMUT chip facing upwards. The upper and lower conductors pass through the first conductor holes on the two side plates and extend to the outside of the U-shaped frame. The entire U-shaped frame housing the miniaturized CMUT unit is then mounted in a packaging slot within a groove in the packaging mold. The upper and lower conductors pass through the first conductor slots on both sides and extend to the outside of the cuboid base. Encapsulating adhesive is injected into the packaging slot. After static heating, the encapsulating adhesive solidifies, encapsulating the miniaturized CMUT unit and the fixture into a single unit. This unit is then removed from the groove, yielding the miniaturized CMUT packaging unit.

[0025] 4) Fabrication of a ring array test device based on miniaturized CMUT packaging unit

[0026] The ring array testing device includes a circular annular cylinder. The inner surface of the annular cylinder has several mounting slots, which are formed by opening outwards from the inner surface. These mounting slots are evenly distributed in a row along the inner surface of the annular cylinder. A second wire slot communicating with each mounting slot is provided on the inner surface of the annular cylinder at the top and bottom positions corresponding to the mounting slots. A second wire hole communicating with each second wire slot is provided on the outer surface of the annular cylinder at the position corresponding to the second wire slot. The miniaturized CMUT packaging unit obtained in claim 2 is installed in each mounting slot on the inner surface of the annular cylinder. The upper and lower electrode wires of the miniaturized CMUT packaging unit pass through the corresponding second wire holes on the outer surface of the annular cylinder, thus obtaining the ring array testing device based on the miniaturized CMUT packaging unit.

[0027] Preferably, in step 1), the encapsulation slots on the fixture are provided with 10 slots; in step 2), the miniaturized CMUT unit includes a CMUT chip, a PCB board, an upper electrode wire, and a lower electrode wire. A square chip area is provided at the center of the front side of the PCB board, and upper electrode pad points and lower electrode pad points are provided at both ends of the PCB board, respectively. The CMUT chip is fixed to the square chip area on the PCB board by conductive silver paste. The upper electrode wire is soldered to the upper electrode pad point on the PCB board, and the lower electrode wire is soldered to the lower electrode pad point on the PCB board; in step 3), the encapsulation adhesive is PDMS adhesive; in step 4), the mounting slots on the annular cylinder are provided with 128 slots.

[0028] First, this invention designs a specially structured packaging mold, which perfectly encapsulates a miniaturized CMUT, offering advantages such as simple operation, high packaging efficiency, and strong sealing. Second, this invention also yields a newly designed miniaturized CMUT packaging unit through the packaging mold. The clamp in the packaging mold is directly encapsulated within this packaging unit, becoming an integral part of it. Therefore, the clamp serves as both a packaging tool and a component of the packaging unit, demonstrating ingenious design. Furthermore, the resulting packaging unit exhibits strong sealing, completely eliminating the possibility of device damage due to leakage when voltage is applied underwater. The presence of the clamp within the packaging unit ensures stable chip support and fixation, resulting in stable and reliable operation. Finally, the miniaturized CMUT packaging unit also yields a newly designed ring array testing device. This device improves the accuracy of the CMUT ring array position, ensuring both the CMUT transmit / receive distance (preferably 20mm) and the CMUT alignment accuracy, thus avoiding signal inaccuracies caused by positional errors. Simultaneously, installation is simple and convenient, saving manual alignment time and significantly improving testing efficiency. In addition, the ring array test device of the present invention also realizes functions such as one-to-one transmission and one-to-reception and one-to-many transmission and reception among several CMUTs.

[0029] In this invention, the packaging mold and the testing device are used together. The packaging mold ensures both consistent shape and size and waterproofing, making it suitable for underwater testing. The testing device guarantees the alignment accuracy of the devices, avoiding the impact of positional errors on the transmitted and received signals. Because the devices have consistent shape and size, this testing device can be disassembled and reused, reducing installation and alignment time and significantly improving testing efficiency. Furthermore, this invention is also applicable to testing ring arrays of different sizes, transmission and reception distances, and numbers of array elements. Attached Figure Description

[0030] The accompanying drawings, which are provided to further illustrate the invention and form part of this application, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention.

[0031] Figure 1 This is a schematic diagram of the miniaturized CMUT unit in this invention.

[0032] Figure 2 This is a schematic diagram of the structure of the clamping fixture for the packaging mold in this invention.

[0033] Figure 3 This is a schematic diagram of the structure of the encapsulation mold groove in this invention.

[0034] Figure 4 This is a schematic diagram of the annular cylinder structure of the ring array testing device in this invention.

[0035] In the diagram: 1-U-shaped frame, 2-Cuboid support platform, 3-First wire hole, 4-Cuboid base block, 5-Encapsulation slot, 6-First wire slot, 7-CMUT chip, 8-PCB board, 9-Upper wire, 10-Lower wire, 11-Annular cylinder, 12-Mounting slot, 13-Second wire slot, 14-Second wire hole. Detailed Implementation

[0036] To enable those skilled in the art to better understand the present invention, the present invention will be further described clearly and completely below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0037] In the description of this embodiment, it should be understood that the terms "front", "rear", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the corresponding drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0038] In the description of this embodiment, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," etc., should be interpreted broadly. For example, they can refer to fixed installation or connection, detachable installation or connection, or integral installation or connection; they can refer to mechanical connection or electrical connection; they can refer to direct installation or connection, or indirect installation or connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. Example 1

[0039] This embodiment provides a packaging mold based on a miniaturized CMUT, including a fixture and a slot.

[0040] like Figure 2 As shown, the fixture includes a U-shaped frame 1, which consists of a base plate and two vertically arranged side plates on both sides. The overall dimensions of the U-shaped frame 1 are: length 15mm, width 2.2mm, height 5.8mm, and wall thickness 1mm. A cuboid support platform 2 is provided in the middle of the base plate of the U-shaped frame 1. The overall dimensions of the cuboid support platform 2 are: length 3mm, width 2.2mm, and height 2mm. First wire holes 3 are respectively opened on the two side plates of the U-shaped frame 1. The diameter of the first wire hole 3 is 1mm and its height is 2mm.

[0041] like Figure 3 As shown, the slot includes a cuboid base block 4, with overall dimensions of 44mm in length, 20mm in width, and 10mm in height. Ten encapsulation slots 5 are formed on the top surface of the cuboid base block 4, extending downwards from the top surface. These slots are evenly distributed in rows along the length of the cuboid base block 4. The dimensions of a single encapsulation slot 5 are 15.2mm in length, 2.3mm in width, and 6mm in depth. A first wire slot 6, communicating with each encapsulation slot 5, is formed on the front and rear sides of the cuboid base block 4 at the position corresponding to each encapsulation slot 5. The top opening of the first wire slot 6 extends to the top surface of the cuboid base block 4, and the width of the first wire slot 6 is 1mm.

[0042] The fixture can be locked into the encapsulation slot 5 of the mold. The size of the gap between the encapsulation slot 5 and the fixture directly affects the quality of the encapsulation. Therefore, it is necessary to ensure the precision of the fit between the encapsulation slot 5 and the fixture so that the encapsulation glue does not leak out during encapsulation and achieves the purpose of solidification and molding. Example 2

[0043] This embodiment provides a miniaturized CMUT packaging unit, including a miniaturized CMUT unit, such as... Figure 1As shown, the miniaturized CMUT unit includes a CMUT chip 7, a PCB board 8, an upper electrode wire 9, and a lower electrode wire 10. The overall dimensions of the PCB board 8 are: length 10.6mm, width 2mm, and height 1.5mm. A square chip area is provided at the center of the front side of the PCB board 8, with dimensions of: length 3.8mm and width 1.3mm. Upper electrode pads and lower electrode pads are respectively provided at both ends of the PCB board 8. The CMUT chip 7 is fixed to the square chip area on the PCB board 8 by conductive silver paste. The upper electrode wire 9 is soldered to the upper electrode pad on the PCB board 8, and the lower electrode wire 10 is soldered to the lower electrode pad on the PCB board 8. The miniaturized CMUT unit is installed on the U-shaped frame 1 of the fixture in the packaging mold of Embodiment 1. The back of the PCB board 8 is supported on the cuboid support platform 2 to prevent the PCB board 8 from flipping over, ensuring that the CMUT chip 7 faces upward. The upper and lower electrode wires 9 and 10 extend to the outside of the U-shaped frame 1 after passing through the first wire holes 3 on the two side plates, respectively, to achieve the purpose of fixation. The U-shaped frame 1, which houses the miniaturized CMUT unit, is installed entirely within the encapsulation slot 5 of the encapsulation mold in Example 1. The upper and lower conductors 9 and 10 of the miniaturized CMUT unit extend through the first conductor slots 6 on both sides to the outside of the cuboid base block 4. Since PDMS adhesive has a similar acoustic velocity to water and a relatively low acoustic impedance, PDMS adhesive is chosen as the encapsulating material. PDMS adhesive is injected into the encapsulation slot 5, and after static heating, it solidifies, encapsulating the miniaturized CMUT unit and the fixture into a single unit. This unit is then removed from the mold, yielding the miniaturized CMUT encapsulation unit. It can be observed that the PDMS adhesive completely encapsulates the entire miniaturized CMUT unit within the fixture. The miniaturized CMUT unit, fixture, and PDMS adhesive form a complete unit, achieving complete encapsulation of the miniaturized CMUT unit and providing excellent waterproofing. Furthermore, its uniform shape and size facilitate subsequent underwater ring array signal testing. Example 3

[0044] This embodiment provides a ring array test device based on a miniaturized CMUT package unit, including a circular annular cylinder 11, such as... Figure 4As shown, the overall dimensions of the annular cylinder 11 are: inner diameter 200mm, outer diameter 220mm, height 30mm, and ring thickness 10mm. The inner diameter of the annular cylinder 11 is set to 200mm to achieve signal transmission and reception at a distance of 20cm. The inner ring surface of the annular cylinder 11 has 128 mounting slots 12 for inserting miniaturized CMUT packaging units during testing. The mounting slots 12 are formed by opening outwards from the inner ring surface of the annular cylinder 11, and the 128 mounting slots 12 are evenly distributed in a row along the inner ring surface of the annular cylinder 11. The dimensions of the mounting slots 12 are: length 15.2mm, width 2.4mm, and depth 6mm. Corresponding to the top and bottom of each mounting slot 12, the inner ring surface of the annular cylinder 11 also has... A second wire slot 13 communicating with the mounting slot 12 is provided. The second wire slot 13 is 1.2mm wide and 6mm deep. A second wire hole 14 communicating with the second wire slot 13 is provided on the outer ring surface of the annular cylinder 11 at the position corresponding to each second wire slot 13. The diameter of the second wire hole 14 is 1.2mm to facilitate the wire to pass through and to connect to the power supply. The miniaturized CMUT packaging unit of Embodiment 2 is installed in each mounting slot 12 on the inner ring surface of the annular cylinder 11. The upper and lower electrode wires 9 and 10 of the miniaturized CMUT packaging unit pass through the corresponding second wire holes 14 on the outer ring surface of the annular cylinder 11, thus obtaining the ring array test device based on the miniaturized CMUT packaging unit. Example 4

[0045] This embodiment provides a method for fabricating the ring array test device based on the miniaturized CMUT packaging unit described in Embodiment 3, including the following steps:

[0046] 1) Fabrication of packaging molds

[0047] The packaging mold described in Example 1 includes the fabrication of a U-shaped frame 1, a cuboid support platform 2, a first wire hole 3, a cuboid base block 4, a packaging slot 5, and a first wire slot 6.

[0048] 2) Fabrication of miniaturized CMUT units

[0049] The fabrication of the miniaturized CMUT unit described in Example 2 includes the fabrication of a PCB board 8, a square chip area, upper and lower electrode pads, the fixing of the CMUT chip 7 to the PCB board 8, and the connection of the upper and lower electrode wires to the PCB board 8.

[0050] 3) Fabrication of miniaturized CMUT packaging units

[0051] The fabrication of the miniaturized CMUT packaging unit described in Example 2 includes mounting the miniaturized CMUT unit on the U-shaped frame 1, mounting the miniaturized CMUT unit and the U-shaped frame 1 together in the packaging slot 5 of the mold, and injecting and molding the packaging adhesive.

[0052] 4) Fabrication of a ring array test device based on miniaturized CMUT packaging unit

[0053] The ring array test device described in Example 3 is fabricated by fabricating a circular annular cylinder 11, a mounting slot 12, a second wire slot 13, a second wire hole 14, and mounting a miniaturized CMUT packaging unit in the mounting slot 12 on the circular annular cylinder 11, etc., and finally the ring array test device based on the miniaturized CMUT packaging unit is obtained.

[0054] The ring array testing method of the above-mentioned ring array testing device based on miniaturized CMUT packaging unit is as follows:

[0055] 128 pre-packaged miniaturized CMUT units are inserted into 128 mounting slots 12 on the annular cylinder 11, ensuring that the 128 mounting slots 12 and the miniaturized CMUT units are evenly distributed in a circle and at the same horizontal position to guarantee accurate positioning during testing. The ring array transmit / receive distance is 20 cm. The upper and lower electrode wires 9 and 10 of the miniaturized CMUT units are passed through the second wire hole 14 on the annular cylinder 11 and connected to the 128-channel circuit board. AC and DC voltages are applied to drive the CMUT, enabling tests such as single-transmit and single-receive, single-transmit and multiple-receive, and multiple-transmit and multiple-receive. Because this ring array test device is detachable, it can be reused, greatly reducing installation and alignment time, improving testing efficiency, while ensuring CMUT positioning accuracy and improving the amplitude of transmitted and received signals. In addition, this ring array test device can also be applied to three-dimensional imaging of ring array transmissive films at a distance of 20 cm.

[0056] The above provides a clear and complete description of the technical solutions in the embodiments of the present invention. The described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

Claims

1. A ring array testing device based on a miniaturized CMUT packaging unit, characterized in that: The device includes a circular annular cylinder. The inner surface of the annular cylinder has several mounting slots, which are formed by opening outwards from the inner surface. These mounting slots are evenly distributed in a row along the inner surface of the annular cylinder. A second wire slot, communicating with each mounting slot, is located at the top and bottom of the inner surface of the annular cylinder. A second wire hole, communicating with each second wire slot, is located at the corresponding position on the outer surface of the annular cylinder. A miniaturized CMUT packaging unit is installed in each mounting slot on the inner surface of the annular cylinder. The upper and lower wires of the miniaturized CMUT packaging unit pass through the corresponding second wire holes on the outer surface of the annular cylinder, thus obtaining the ring array test device based on the miniaturized CMUT packaging unit. The miniaturized CMUT packaging unit includes a packaging mold and a miniaturized CMUT unit; The packaging mold includes a fixture and a slot; the fixture includes a U-shaped frame, with a cuboid support platform located in the middle of the base plate of the U-shaped frame, and first wire holes respectively opened on the two side plates of the U-shaped frame; the slot includes a cuboid base block, with several packaging slots opened on the top surface of the cuboid base block, the packaging slots being formed by opening downwards from the top surface of the cuboid base block, and the several packaging slots being evenly distributed in rows along the length direction of the cuboid base block; on the front and rear sides of the cuboid base block, corresponding to the position of each packaging slot, a first wire slot communicating with the packaging slot is opened, and the top opening of the first wire slot extends to the top surface of the cuboid base block; the size of the packaging slot matches the size of the U-shaped frame, and the width of the first wire slot matches the diameter of the wire; The miniaturized CMUT unit includes a CMUT chip, a PCB board, an upper electrode wire, and a lower electrode wire; a square chip area is set in the center of the front side of the PCB board, and upper electrode pad points and lower electrode pad points are set at both ends of the PCB board respectively; the CMUT chip is fixed to the square chip area on the PCB board by conductive silver paste, the upper electrode wire is soldered to the upper electrode pad point on the PCB board, and the lower electrode wire is soldered to the lower electrode pad point on the PCB board. A miniaturized CMUT unit is mounted on a U-shaped frame of a fixture. The PCB board of the miniaturized CMUT unit is supported on a cuboid support platform. The upper and lower conductors of the miniaturized CMUT unit pass through the first conductor holes on the two side plates and extend to the outside of the U-shaped frame. The U-shaped frame with the miniaturized CMUT unit is then installed in the encapsulation slot of the fixture. The upper and lower conductors of the miniaturized CMUT unit pass through the first conductor slots on both sides and extend to the outside of the cuboid base. Encapsulating adhesive is injected into the encapsulation slot. After static heating, the encapsulating adhesive solidifies, encapsulating the miniaturized CMUT unit and the fixture into a whole. This whole is then removed from the fixture to obtain the miniaturized CMUT encapsulation unit.

2. The ring array testing device based on a miniaturized CMUT packaging unit according to claim 1, characterized in that: There are 128 mounting slots on the annular cylinder.

3. The ring array testing device based on a miniaturized CMUT packaging unit according to claim 1, characterized in that: The device has 10 card slots.

4. The ring array testing device based on a miniaturized CMUT packaging unit according to claim 1, characterized in that: The encapsulating colloid is PDMS adhesive.

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