Heat sink and electronic equipment

Abstract

This application discloses a heat spreader and electronic device, belonging to the field of heat dissipation technology. It includes: a first cover plate, a second cover plate, a capillary structure, a heat dissipation medium, and a functional film; the first and second cover plates are connected to form a cavity, and the capillary structure, heat dissipation medium, and functional film are disposed within the cavity; the cavity includes a first chamber and a second chamber, and the functional film is disposed between the first and second chambers to separate them; when the functional film is in a first state, it blocks the flow of liquid heat dissipation medium between the first and second chambers.

Description

Technical Field

[0001] This application belongs to the field of heat dissipation technology, specifically relating to a heat spreader and electronic equipment. Background Technology

[0002] With the development of technology, electronic devices are becoming increasingly widely used. Electronic devices can be used for video recording and communication. During use, electronic devices generate heat, causing their temperature to rise. Typically, heat dissipation devices are installed in electronic devices, placing them in contact with the heat-generating components. However, in related technologies, after applying heat dissipation devices to electronic devices, the heat dissipated by the heat-generating components can easily be transferred through the heat spreader to heat-sensitive structures within the electronic device, affecting these structures. Summary of the Invention

[0003] The purpose of this application is to provide a heat spreader and an electronic device that can solve the problem that heat from easily heated components of an electronic device can be easily transferred to heat-sensitive structures within the electronic device via the heat spreader, thus affecting the heat-sensitive structures.

[0004] In a first aspect, embodiments of this application provide a heat spreader, the heat spreader comprising: a first cover plate, a second cover plate, a capillary structure, a heat dissipation medium, and a functional film; The first cover plate and the second cover plate are connected to form a cavity, and the capillary structure, heat dissipation medium and functional membrane are disposed in the cavity; The cavity includes a first chamber and a second chamber, and the functional membrane is disposed between the first chamber and the second chamber to separate the first chamber and the second chamber; When the functional membrane is in the first state, the functional membrane blocks the flow of the liquid heat dissipation medium between the first chamber and the second chamber.

[0005] Secondly, embodiments of this application provide an electronic device, which includes the heat spreader described in the first aspect above.

[0006] In this embodiment, since the first cover plate and the second cover plate are connected to form a cavity, the capillary structure, the heat dissipation medium, and the functional membrane are disposed within the cavity. The cavity includes a first chamber and a second chamber, and the functional membrane is disposed between the first chamber and the second chamber to separate them. Therefore, the functional membrane can block the heat dissipation medium, that is, it blocks the flow of liquid heat dissipation medium between the first chamber and the second chamber. If the liquid heat dissipation medium is only in the first chamber, the second chamber can become a cooling area, and the first chamber becomes a heat dissipation area. If the liquid heat dissipation medium is present in both the first chamber and the second chamber, then once the first chamber corresponds to a heat source in the electronic device, the first chamber becomes a heat dissipation area, and the second chamber becomes a cooling area. That is, in this embodiment, a heat dissipation area and a cooling area can be formed on the heat spreader to ensure effective heat dissipation from the heat source while reducing the impact on other heat-sensitive structures. That is, in the embodiments of this application, a heat dissipation area and a cooling area can be formed in the heat spreader. So that after the heat spreader is applied to the electronic device, the heat dissipation area corresponds to the heat source and the cooling area corresponds to the heat-sensitive structure. So that while ensuring effective heat dissipation of the heat source, the heat of the heat source is isolated by the cooling area, avoiding the problem of heat being transferred to the heat-sensitive structure and thus affecting the heat-sensitive structure. Attached Figure Description

[0007] Figure 1 This is an exploded view of a heat spreader provided in an embodiment of this application; Figure 2 This is a partial schematic diagram of a heat spreader provided in an embodiment of this application; Figure 3 This is a schematic diagram illustrating one embodiment of a functional membrane provided in this application; Figure 4 This is a schematic diagram illustrating a second cover plate with a capillary structure provided in an embodiment of this application; Figure 5 This is a schematic diagram showing a support column on a first cover plate provided in an embodiment of this application; Figure 6 This diagram illustrates a heat spreader installed on an electronic device according to an embodiment of this application. Figure 7 This diagram illustrates a first cover plate provided in an embodiment of this application. Figure 8 This diagram illustrates a second cover plate provided in an embodiment of this application. Figure 9 This is a second schematic diagram illustrating a functional membrane provided in an embodiment of this application; Figure 10 This is a partially enlarged view of a functional membrane provided in an embodiment of this application.

[0008] Figure label: 10: First cover plate; 20: Second cover plate; 30: Capillary structure; 40: Functional membrane; 41: First vent hole; 50: Support structure; 60: Support column; 51: First partition section; 511: First through hole; 52: Second partition section; 101: First chamber; 102: Second chamber; 1011: First side; 1012: Second side; 1013: Third side; 1021: First sub-chamber; 1022: Second sub-chamber; 10101: Evaporation zone; 10102: Condensation zone; 100: Frame. Detailed Implementation

[0009] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0010] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0011] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0012] like Figures 1 to 10 As shown, the heat spreader includes: a first cover plate 10, a second cover plate 20, a capillary structure 30, a heat dissipation medium, and a functional film 40.

[0013] A first cover plate 10 and a second cover plate 20 are connected to form a cavity. A capillary structure 30, a heat dissipation medium, and a functional membrane 40 are disposed within the cavity. The cavity includes a first chamber 101 and a second chamber 102. The functional membrane 40 is disposed between the first chamber 101 and the second chamber 102 to separate them. When the functional membrane 40 is in a first state, it blocks the flow of liquid heat dissipation medium between the first chamber 101 and the second chamber 102.

[0014] In this embodiment, since the first cover plate 10 and the second cover plate 20 are connected to form a cavity, the capillary structure 30, the heat dissipation medium, and the functional membrane 40 are disposed in the cavity. The cavity includes a first chamber 101 and a second chamber 102. The functional membrane 40 is disposed between the first chamber 101 and the second chamber 102 to separate the first chamber 101 and the second chamber 102. Therefore, the functional membrane 40 can block the heat dissipation medium, that is, the functional membrane 40 blocks the liquid heat dissipation medium from flowing between the first chamber 101 and the second chamber 102. If the liquid heat dissipation medium is only in the first chamber 101, the second chamber 102 can become a cooling area, and the first chamber 101 becomes a heat dissipation area. If the liquid heat dissipation medium is present in both the first chamber 101 and the second chamber 102, then once the first chamber 101 corresponds to the heat source in the electronic device, the first chamber 101 becomes a heat dissipation area, and the second chamber 102 becomes a cooling area. In this embodiment of the application, a heat dissipation area and a cooling area can be formed on the heat spreader to ensure effective heat dissipation from the heat source while reducing the impact on other heat-sensitive structures.

[0015] Specifically, such as Figure 1As shown, the cavity includes a first chamber 101 and a second chamber 102. A functional membrane 40 is disposed between the first chamber 101 and the second chamber 102 to separate the first chamber 101 and the second chamber 102. At this time, the liquid heat dissipation medium can be located in the first chamber 101. Thus, when the heat exchange plate is applied to the electronic device, the first chamber 101 can be positioned opposite the heat source in the electronic device. Once the heat from the heat source is transferred to the first chamber 101, the liquid heat dissipation medium will be heated to form heat dissipation medium molecules, thereby absorbing the heat from the heat source. When the heat dissipation medium molecules move in the first chamber 101, they will also drive the non-condensable gas in the first chamber 101 to move. When the heat dissipation medium molecules are transferred to the functional membrane 40, the heat dissipation medium molecules cannot pass through the functional membrane 40, but the non-condensable gas can pass through the functional membrane 40, thereby the non-condensable gas enters the second chamber 102. Because the non-condensable gas has a lower temperature, the temperature in the second chamber 102 is also lower, resulting in a lower temperature at the functional membrane 40. This causes the heat dissipation medium molecules to condense and reform into a liquid heat dissipation medium, which then returns to the first chamber 101 via the capillary structure 30. Furthermore, since the liquid heat dissipation medium is located in the first chamber 101, and there is no liquid heat dissipation medium in the second chamber 102, the first chamber 101 functions as the heat dissipation area, and the second chamber 102 functions as the cooling area.

[0016] And such Figure 7As shown, the first chamber 101 and the second chamber 102 are respectively enclosed by a functional membrane 40. That is, the functional membrane 40 encloses the first chamber 101 and also encloses the second chamber 102. Both the first chamber 101 and the second chamber 102 contain liquid heat dissipation medium. Thus, when the heat spreader is applied to an electronic device, the first chamber 101 can be positioned opposite the heat source in the electronic device. Once the heat from the heat source is transferred to the first chamber 101, the liquid heat dissipation medium will be heated to form heat dissipation medium molecules. However, the functional membrane 40 that encloses the first chamber 101 will also be heated, and thus the functional membrane 40 will expand due to the heat. The heat dissipation medium molecules can then pass through the functional membrane 40 that encloses the first chamber 101, allowing the heat dissipation medium molecules to flow in the cavity of the first chamber 101, thereby achieving heat homogenization in a larger area of ​​the heat spreader. The second chamber 102 is not opposite the heat source, thus maintaining its previous state. This ensures the liquid heat dissipation medium within the second chamber remains liquid, and the functional membrane 40 surrounding the second chamber 102 experiences less heat and expansion, preventing heat dissipation medium molecules from passing through it. In other words, the temperature of the second chamber 102 is lower, and the functional membrane 40 prevents liquid medium molecules from passing through, causing heat dissipation medium molecules escaping from the first chamber 101 to flow only in other areas of the chamber. As these molecules flow, they condense and reform into liquid heat dissipation medium, returning to the first chamber 101 via the capillary structure 30. Conversely, the first chamber 101, being opposite the heat source, absorbs heat and acts as a heat dissipation area, while the second chamber 102, with its lower temperature, acts as a cooling area.

[0017] As can be seen from the above embodiments, in the embodiments of this application, a heat dissipation area and a cooling area can be formed in the heat spreader. Thus, after the heat spreader is applied to an electronic device, the heat dissipation area corresponds to the heat source and the cooling area corresponds to the heat-sensitive structure. In this way, while ensuring effective heat dissipation from the heat source, the heat from the heat source is isolated by the cooling area, preventing the heat from being transferred to the heat-sensitive structure and thus avoiding the problem of affecting the heat-sensitive structure.

[0018] It should be noted that, in this embodiment, the first cover plate 10 has a first surface, on which a first groove may be formed; the second cover plate 20 has a second surface, and the portion of the first surface without the first groove is fitted to the second surface, thereby forming a cavity between the first groove on the first surface and the second surface. Alternatively, a second groove may be formed on the second surface, and the portion of the second surface without the second groove is fitted to the first surface, thereby forming a cavity between the second groove on the second surface and the first surface. In this embodiment, a first groove may be formed on the first surface, and a groove may be formed on the second surface. The portion of the first surface without the first groove is fitted to the portion of the second surface without the second groove, and the opening of the first groove is opposite to the opening of the second groove, thereby forming a cavity between the first groove and the second groove. The first surface is the surface of the first cover plate 10 facing the second cover plate 20, and the second surface is the surface of the second cover plate 20 facing the first cover plate 10. The first cover plate 10 and the second cover plate 20 are stacked.

[0019] In addition, in this embodiment, the capillary structure 30 can be a capillary mesh. The capillary mesh can be disposed in the first chamber 101, and also in the second chamber 102, or simultaneously in both chambers 101 and 102.

[0020] In some embodiments, the heat spreader may also include a support structure 50 disposed around the first chamber 101, the support structure 50 and the functional membrane 40 being disposed between the first chamber 101 and the second chamber 102 so that the first chamber 101 and the second chamber 102 are independent of each other; the liquid heat dissipation medium is disposed in the first chamber 101, and when the functional membrane 40 is in the first state, the functional membrane 40 prevents the liquid heat dissipation medium from flowing from the first chamber 101 into the second chamber 102.

[0021] When a heat spreader dissipates heat from a heat source in an electronic device, a vacuum may occur inside the heat spreader, causing the first cover plate 10 and the second cover plate 20 to approach each other, affecting the volume of the cavity. Specifically, the first cover plate 10 and the second cover plate 20 may compress the cavity, reducing its volume. By providing a support structure 50, which supports the first cover plate 10 and the second cover plate 20, the volume of the cavity can be kept relatively fixed, facilitating the flow of the heat dissipation medium within the cavity. Additionally, as... Figure 1 As shown, the support structure 50 and the functional membrane 40 are disposed between the first chamber 101 and the second chamber 102, making the first chamber 101 and the second chamber 102 independent of each other. This means that the support structure 50 can effectively separate the first chamber 101 and the second chamber 102, providing support for the portion between them. Furthermore, in... Figure 1In the structure shown, the liquid heat dissipation medium is disposed in the first chamber 101. When the functional membrane 40 is in the first state, once the first chamber 101 is aligned with the heat source in the electronic device, the liquid heat dissipation medium in the first chamber 101 will be heated to form heat dissipation medium molecules. The heat dissipation medium molecules move to the functional membrane 40, which can block the heat dissipation medium molecules, preventing them from passing through the functional membrane 40 into the second chamber. That is, the functional membrane 40 blocks the liquid heat dissipation medium from flowing from the first chamber 101 into the second chamber 102, thereby ensuring that the liquid heat dissipation medium only flows in the first chamber 101. This facilitates heat dissipation when the first chamber 101 is aligned with the heat source in the electronic device.

[0022] It should be noted that, in the embodiments of this application, the support structure 50 has a first end and a second end opposite to each other along the direction from the first cover plate 10 to the second cover plate 20. The first end of the support structure 50 is in contact with the first cover plate 10, and the second end of the support structure 50 is in contact with the second cover plate 20, so that the support structure 50 supports the first cover plate 10 and the second cover plate 20.

[0023] Furthermore, in the embodiments of this application, in such Figure 7 In the structure shown, the first chamber 101 can be formed by the functional membrane 40 enclosing a cavity within the cavity, that is, the functional membrane 40 encloses a receiving space within the cavity, which serves as the first chamber 101. The second chamber 102 can also be formed by the functional membrane 40 enclosing a cavity within the cavity, that is, the functional membrane 40 encloses another receiving space within the cavity, which serves as the second chamber 102. The support structure 50 is located between the first chamber 101 and the second chamber 102, and the first chamber 101 and the second chamber 102 are independent. Alternatively, the support structure 50 can be provided within the cavity, dividing the cavity into the first chamber 101 and the second chamber 102, which are independent, and the functional membrane 40 can contact the support structure 50. Furthermore, in... Figure 7In the structure shown, both the first chamber 101 and the second chamber 102 can contain liquid heat dissipation media. When the heat spreader is applied to an electronic device, the first chamber 101 is positioned opposite the heat source. Once heat is transferred to the first chamber 101, the liquid heat dissipation media is heated and forms heat dissipation media molecules. The functional membrane 40 surrounding the first chamber 101 is also heated, causing it to expand. The heat dissipation media molecules can then pass through the functional membrane 40 surrounding the first chamber 101, flowing within the chamber and resulting in more even heating of the heat spreader's areas. The second chamber 102, however, is not positioned opposite the heat source, maintaining its previous state. The liquid heat dissipation media in the second chamber 102 remains liquid, and the functional membrane 40 surrounding it experiences less heating and expansion, preventing heat dissipation media molecules from passing through it. That is, the temperature of the second chamber 102 is lower, and the functional membrane 40 surrounding the second chamber 102 blocks the liquid medium molecules from passing through the functional membrane 40, so that the heat dissipation medium molecules escaping from the first chamber 101 only flow in other areas of the cavity. When the heat dissipation medium molecules flow in the cavity, they will also condense and reform into liquid heat dissipation medium, which will return to the first chamber 101 through the action of the capillary structure 30.

[0024] In addition, in this embodiment of the application, the support structure 50 can be a plate structure, that is, the support structure 50 can be a support plate.

[0025] Additionally, in some embodiments, such as Figure 5 As shown, the capillary structure 30 is stacked between the first cover plate 10 and the second cover plate 20. The first side of the support structure 50 is connected to the first cover plate 10, and the second side of the support structure 50 is sealed and abutted against the second cover plate 20 or the second side of the support structure 50 abuts against the capillary structure 30. The first side and the second side of the support structure 50 are opposite sides of the support structure 50. The support structure 50 has a first through hole 511, and the functional membrane 40 covers the first through hole 511 to separate the first chamber 101 and the second chamber 102.

[0026] The first side of the support structure 50 is connected to the first cover plate 10, and the second side of the support structure 50 is in sealing contact with the second cover plate 20 or abuts against the capillary structure 30. This arrangement allows the support structure 50 to support the first cover plate 10 and the second cover plate 20, preventing a vacuum from forming in the cavity and causing the first cover plate 10 and the second cover plate 20 to approach each other and compress the cavity, thus reducing its volume. Furthermore, the capillary structure 30 is stacked between the first cover plate 10 and the second cover plate 20, in a manner that... Figure 1In the structure shown, the first chamber 101 and the second chamber 102 are separated by a support structure 50 and a functional membrane 40. The first chamber 101 contains a liquid heat dissipation medium. Once the first chamber 101 receives heat, the liquid heat dissipation medium in the first chamber 101 will evaporate to form heat dissipation medium molecules. The heat dissipation medium molecules will condense at the functional membrane 40 and reform into a liquid heat dissipation medium. Through the action of the capillary structure 30, the liquid heat dissipation medium will flow back to the position in the first chamber 101 opposite to the heat source. That is, the presence of the capillary structure 30 makes the heat dissipation medium circulate in the first chamber 101, which facilitates the first chamber 101 to continuously dissipate heat from the heat source in the electronic device. In addition, the support structure 50 has a first through hole 511, and the functional membrane 40 covers the first through hole 511 to separate the first chamber 101 and the second chamber 102. So when the liquid heat dissipation medium is heated to form heat dissipation medium molecules, the heat dissipation medium molecules can pass through the first through hole 511 and then contact the functional membrane 40, thereby avoiding the functional membrane 40 from being subjected to large pressure, which would cause the functional membrane 40 to be prone to rupture.

[0027] In such Figure 7 In the structure shown, the first chamber 101 is formed by a functional membrane 40, and the second chamber 102 is also formed by a functional membrane 40. Once the first chamber 101 receives heat, the liquid heat dissipation medium in the first chamber 101 will be heated and form heat dissipation medium molecules. However, the functional membrane 40 that forms the first chamber 101 will also be heated, causing it to expand. The heat dissipation medium molecules can then pass through the functional membrane 40 surrounding the first chamber 101, allowing them to flow within the chamber and ensuring even heating in areas with a large number of heat spreaders. The second chamber 102, however, is not opposite the heat source, so it remains in its previous state. The liquid heat dissipation medium in the second chamber 102 remains liquid, and the functional membrane 40 surrounding the second chamber 102 is heated less and expands less, preventing the heat dissipation medium molecules from passing through it. That is, the temperature of the second chamber 102 is lower, and the functional membrane 40 surrounding the second chamber 102 prevents liquid medium molecules from passing through the functional membrane 40. This causes the heat dissipation medium molecules escaping from the first chamber 101 to flow only in other areas of the cavity. When the heat dissipation medium molecules flow in the cavity, they will also condense and reform into liquid heat dissipation medium, which will then return to the first chamber 101 through the capillary structure 30. In other words, the presence of the capillary structure 30 allows the heat dissipation medium to circulate in the cavity, facilitating the continuous heat dissipation of the heat source in the electronic device by the first chamber 101.

[0028] It should be noted that, as Figure 7As shown, when both the first chamber 101 and the second chamber 102 are enclosed by functional membranes 40, the functional membrane 40 enclosing the first chamber 101 can contact a portion of the support structure 50 and cover the first through hole 511 on that portion of the support structure 50. Similarly, the functional membrane 40 enclosing the second chamber 102 can contact the remaining portion of the support structure 50 and cover the first through hole 511 on that portion of the support structure 50. When the first chamber 101 and the second chamber 102 are separated by the support structure 50, the functional membrane 40 can contact the support structure 50 and cover the first through hole 511 on the support structure 50.

[0029] Additionally, in the embodiments of this application, such as Figure 7 As shown, when both the first chamber 101 and the second chamber 102 are enclosed by the functional membrane 40, if both the first chamber 101 and the second chamber 102 contain liquid heat dissipation medium, and the first chamber 101 corresponds to the heat source while the second chamber 102 does not, the liquid heat dissipation medium in the first chamber 101 will be heated to form heat dissipation medium molecules. These molecules can pass through the functional membrane 40 and reside outside the first chamber 101. When the heat dissipation medium molecules encounter cooling outside the first chamber 101, they will liquefy. The heat dissipation medium, in its liquid state, returns to the first chamber 101 through the capillary structure 30. When the liquid heat dissipation medium in the first chamber 101 is heated and forms heat dissipation medium molecules that pass through the functional membrane 40 and are located outside the first chamber 101, these molecules can contact the functional membrane 40 of the second chamber 102. Since the second chamber 102 is not heated, its temperature is lower, causing the heat dissipation medium molecules to cool and form a liquid heat dissipation medium. The second chamber 102 corresponds to the heat source position, while the first chamber 101 is not heated. When the location corresponds to the heat source, the liquid heat dissipation medium in the second chamber 102 will be heated to form heat dissipation medium molecules. These molecules can pass through the functional membrane 40 and reside outside the second chamber 102. Upon encountering cooling outside the second chamber 102, the heat dissipation medium molecules will revert to a liquid state, allowing the liquid heat dissipation medium to return to the second chamber 102 via the capillary structure 30. Specifically, after the heat dissipation medium molecules formed by the heated liquid heat dissipation medium in the second chamber 102 pass through the functional membrane 40 and reside outside the second chamber 102... The heat dissipation medium molecules can contact the functional membrane 40 of the first chamber 101. Since the first chamber 101 is not heated, its temperature is low, causing the heat dissipation medium molecules to cool and form a liquid heat dissipation medium. When both the second chamber 102 and the first chamber 101 correspond to the heat source, the liquid heat dissipation medium in the first chamber 101 and the second chamber 102 will be heated to form heat dissipation medium molecules. These molecules can pass through the functional membrane 40 and reside outside the first chamber 101 and the second chamber 102, thus achieving uniform heating across the entire uniform plate. In this case, as... Figure 3As shown, a first vent hole 41 can be formed on the functional membrane 40. The diameter of the first vent hole 41 can be the diameter of the heat dissipation medium molecules, so that the heat dissipation medium molecules can pass through the first vent hole 41 and flow out of the first chamber 101 and / or the second chamber 102, but block the liquid heat dissipation medium, so that the liquid heat dissipation medium cannot flow out of the first chamber 101 and / or the second chamber 102.

[0030] Additionally, in the embodiments of this application, such as Figure 1 As shown, when both the first chamber 101 and the second chamber 102 are formed by the support structure 50 separating the cavities, the functional membrane 40 is in contact with the support structure 50. If the first chamber 101 contains a liquid heat dissipation medium, when a portion of the first chamber 101 corresponds to the heat source position, the liquid heat dissipation medium will be heated to form heat dissipation medium molecules, and these molecules will diffuse within the first chamber 101. Furthermore, any non-condensable gases present in the first chamber 101 will move along with the heat dissipation medium molecules. When the heat dissipation medium molecules and non-condensable gases reach the support structure 50, the molecular functional membrane 40 can be installed, preventing the heat dissipation medium molecules from passing through it, while the non-condensable gases pass through and enter the second chamber 102. However, after moving away from the heat source, the heat dissipation medium molecules will condense to form a liquid heat dissipation medium. This liquid heat dissipation medium, through the capillary structure 30, will return to the position in the first chamber 101 corresponding to the heat source. In this case, a second vent hole can be formed on the functional membrane 40. The diameter of the second vent hole is less than 0.4 nanometers, so that the heat dissipation medium molecules cannot pass through the second vent hole, while the non-condensable gas can pass through the second vent hole and enter the second chamber 102.

[0031] In addition, in this embodiment of the application, the number of first through holes 511 can be multiple.

[0032] Additionally, in some embodiments, such as Figure 1 As shown, the support structure 50 extends from the first side 1011 of the first chamber 101 to the second side 1012 of the first chamber 101. The first side 1011 and the second side 1012 of the first chamber 101 are adjacent sides of the first chamber 101. The support structure 50 includes a first partition section 51 and a second partition section 52 connected to each other. The first partition section 51 is located on the first side 1011 of the first chamber 101 and has a plurality of spaced first through holes 511. The functional membrane 40 covers the plurality of first through holes 511 to separate the first chamber 101 and the second chamber 102. The second partition section 52 is located on the second side 1012 of the first chamber 101 and is continuously arranged to separate the first chamber 101 and the second chamber 102.

[0033] With such settings, such as Figure 1 As shown, the cavity is divided into a first chamber 101 and a second chamber 102 by the support structure 50, and the functional membrane 40 covers multiple first through holes 511 on the first dividing section 51 of the support structure 50, thereby separating the first chamber 101 and the second chamber 102. At this time, a liquid heat dissipation medium can be provided in the first chamber 101. The first chamber 101 usually also contains non-condensable gas. A second vent hole can be provided on the functional membrane 40. The diameter of the second vent hole is smaller than the diameter of the heat dissipation medium molecules and larger than the diameter of the non-condensable gas molecules. So once the first chamber 101 corresponds to the heat source position of the electronic device, the liquid heat dissipation medium in the first chamber 101 will be heated to form heat dissipation medium molecules. The heat dissipation medium molecules will flow to the functional membrane 40, and the heat dissipation medium molecules carry the non-condensable gas. The non-condensable gas molecules will pass through the functional membrane 40 and enter the second chamber 102, so that less or no non-condensable gas remains in the first chamber 101. During the process of the liquid heat dissipation medium being heated to form heat dissipation medium molecules, it absorbs heat, causing the temperature of the heat source to decrease. Once the heat dissipation medium molecules flow to the functional membrane 40, which is equivalent to moving away from the heat source, the heat dissipation medium molecules will condense to form a liquid heat dissipation medium. At this time, under the action of the capillary structure 30, the liquid heat dissipation medium will return to the position in the first chamber 101 corresponding to the heat source.

[0034] It should be noted that the first chamber 101 may have an evaporation zone 10101. When the heat spreader is applied to an electronic device, the evaporation zone 10101 corresponds to the heat source location of the electronic device. The liquid heat dissipation medium in the evaporation zone 10101 is heated to form heat dissipation medium molecules. These molecules carry non-condensable gas to the functional membrane 40. The non-condensable gas molecules pass through the functional membrane 40, which blocks the heat dissipation medium molecules. The heat dissipation medium molecules condense at the functional membrane 40 to form a liquid heat dissipation medium. The liquid heat dissipation medium returns to the evaporation zone 10101 under the action of the capillary structure 30. The evaporation zone 10101 can be located far from the functional membrane 40, meaning the functional membrane 40 is relatively far from the evaporation zone 10101, resulting in a lower temperature at the functional membrane 40.

[0035] Additionally, in some embodiments, such as Figure 1 As shown, the second chamber 102 includes a first sub-chamber 1021 and a second sub-chamber 1022 that are interconnected. The first sub-chamber 1021 is located on the first side 1011 of the first chamber 101, and the second sub-chamber 1022 is located on the second side 1012 of the first chamber 101. The angle between the first dividing segment 51 and the second dividing segment 52 is greater than 90°, such that the cross-sectional area of ​​the first sub-chamber 1021 gradually decreases in the direction away from the second sub-chamber 1022.

[0036] With this configuration, once the non-condensable gas in the first chamber 101 passes through the functional membrane 40 and enters the second chamber 102, it then enters the first sub-chamber 1021. The cross-sectional area of ​​the first sub-chamber 1021 gradually decreases in the direction away from the second sub-chamber 1022. This allows the non-condensable gas to flow into the larger second sub-chamber 1022 after entering the first sub-chamber 1021, thus enabling better storage of the non-condensable gas. In other words, this configuration facilitates the flow of non-condensable gas from the first sub-chamber 1021 into the second sub-chamber 1022, resulting in better storage and the formation of a lower-temperature region, i.e., a cold zone.

[0037] Additionally, in some embodiments, such as Figure 1 As shown, the capillary structure 30 is disposed in the first chamber 101 to allow the liquid heat dissipation medium to flow between the first side 1011 and the third side 1013 of the first chamber 101 under the guidance of the capillary structure 30. The third side 1013 and the first side 1011 of the first chamber 101 are opposite sides of the first chamber 101. The second side 1012 of the first chamber 101 is located between the third side 1013 and the first side 1011 of the first chamber 101. When the functional membrane 40 is in the first state, the gas in the first chamber 101 passes through the functional membrane 40 and enters the second chamber 102. The heat spreader contains the gas escaping from the first chamber 101 through the second chamber 102.

[0038] With this configuration, a liquid heat dissipation medium can be placed in the first chamber 101. When the heat spreader is applied to an electronic device, the first chamber 101 corresponds to the heat source location within the device. Heat emitted from the heat source can be transferred to the first chamber 101, causing the liquid heat dissipation medium in the first chamber 101 to heat up and form heat dissipation medium molecules. During this process, the heat spreader absorbs heat, cooling the heat source. The heat dissipation medium molecules then move. Once these molecules move away from the portion of the first chamber 101 corresponding to the heat source (where the temperature is lower), they condense and form a liquid heat dissipation medium. The capillary structure 30 is located within the first chamber 101, allowing the liquid heat dissipation medium to return to the portion of the first chamber 101 corresponding to the heat source under the guidance of the capillary structure 30. The liquid heat dissipation medium then reabsorbs heat, effectively creating a circulation system that continuously dissipates heat to the heat source. In addition, the first chamber 101 usually contains non-condensable gas. When the heat dissipation medium molecules move to the functional membrane 40, the functional membrane 40 can be provided with a second vent hole, and the non-condensable gas will enter the second chamber 102, so that the second chamber 102 contains the gas that escapes from the first chamber 101, while the functional membrane 40 blocks the heat dissipation medium molecules, so that the heat dissipation medium molecules remain in the first chamber 101.

[0039] It should be noted that, in the embodiments of this application, the first state of the function can be the state in which the functional membrane 40 is not heated. In addition, the functional membrane 40 is usually provided with vent holes. When the functional membrane 40 is not heated, the diameter of the vent holes on the functional membrane 40 remains unchanged. When the functional membrane 40 is heated, due to the effect of thermal expansion and contraction, the diameter of the vent holes on the functional membrane 40 increases.

[0040] Additionally, in some embodiments, such as Figure 1 and Figure 6 As shown, the first chamber 101 includes an evaporation zone 10101 for connecting a heat source and a condensation zone 10102 for condensing a heat dissipation medium. The evaporation zone 10101 is disposed near the third side 1013 of the first chamber 101, and the condensation zone 10102 is disposed near the first side 1011 of the first chamber 101.

[0041] With this configuration, when the heat spreader is applied to electronic devices, the heat source of the electronic device can be positioned corresponding to the evaporation zone 10101. The heat from the heat source is then transferred to the evaporation zone 10101, causing the liquid heat dissipation medium in the evaporation zone 10101 to form heat dissipation medium molecules, which absorb the heat from the heat source. After the heat dissipation medium molecules are transferred to the condensation zone 10102, they condense and reform into a liquid heat dissipation medium. Furthermore, the evaporation zone 10101 is positioned near the third side 1013 of the first chamber 101, and the condensation zone 10102 is positioned near the first side 1011 of the first chamber 101. This arrangement results in a greater distance between the evaporation zone 10101 and the condensation zone 10102, leading to a lower temperature in the condensation zone 10102, which facilitates the condensation of the heat dissipation medium molecules into a liquid heat dissipation medium.

[0042] Additionally, in some embodiments, such as Figure 1 and Figure 7 As shown, the heat spreader may also include a plurality of support columns 60 spaced apart, the capillary structure 30 is stacked between the first cover plate 10 and the second cover plate 20, and the support columns 60 are connected to the first cover plate 10; a plurality of support columns 60 are provided in both the first chamber 101 and the second chamber 102.

[0043] With this configuration, the support column 60 can support the first cover plate 10 and the second cover plate 20, thereby preventing the first cover plate 10 and the second cover plate 20 from getting close to each other, which would cause the first cover plate 10 and the second cover plate 20 to compress the first chamber 101 and the second chamber 102.

[0044] It should be noted that the multiple support columns 60 in the first chamber 101 can be evenly distributed, that is, the multiple support columns 60 in the first chamber 101 are distributed at equal intervals, and the multiple support columns 60 in the second chamber 102 can be evenly distributed, that is, the multiple support columns 60 in the second chamber 102 are distributed at equal intervals, so that the support columns 60 provide better support for the first cover plate 10 and the second cover plate 20.

[0045] In addition, in this embodiment of the application, the heat spreader may include a plurality of second chambers 102, which are arranged at intervals around the first chamber 101.

[0046] In addition, in some embodiments, the heat spreader may also include a third chamber (not shown in the figure), which is connected to the second chamber 102 via a pipe; the third chamber may be disposed inside or outside the chamber.

[0047] This arrangement allows the third chamber to contain molecules escaping from the first chamber 101. In other words, the third chamber is specifically designed to contain molecules escaping from the first chamber 101. This allows molecules escaping from the first chamber 101 to directly enter the third chamber after entering the second chamber 102, thus enabling the third chamber to contain these molecules. In short, by providing a third chamber, it is easier to contain molecules escaping from the first chamber 101.

[0048] It should be noted that, in this embodiment, a receiving member can be provided, in which a third chamber is provided. The third chamber is located outside the cavity and is connected to the second chamber 102 via a pipe. Alternatively, a third chamber can be separately provided within the cavity. The third chamber and the second chamber 102 can be separated by a portion of the first cover plate 10 and a portion of the second cover plate 20, and the third chamber and the second chamber 102 are connected by a pipe. The first cover plate 10 has a first groove and a second groove, which are spaced apart. The portion of the first cover plate 10 without the first and second grooves fits against the second cover plate 20, thereby allowing the first groove, the second groove, and the second cover plate 20 to enclose and form a cavity. The first groove includes a first chamber 101 and a second chamber 102, and the second groove is the third chamber. The third chamber and the second chamber 102 are connected by a pipe. Specifically, a through hole can be provided between the first groove and the second groove, and a pipe can be installed in this through hole.

[0049] In addition, in some embodiments, the functional membrane 40 also has a second state in which the liquid heat dissipation medium flows through the functional membrane 40 between the first chamber 101 and the second chamber 102.

[0050] With such settings, such as Figure 7As shown, once both the first chamber 101 and the second chamber 102 are enclosed by molecular functional membranes 40—that is, the first chamber 101 is enclosed by one molecular functional membrane 40 and the second chamber 102 is enclosed by another molecular functional membrane 40—when the heat spreader is applied to an electronic device, the heat source of the electronic device can be positioned corresponding to the first chamber 101. The liquid heat dissipation medium in the first chamber 101 is heated, forming heat dissipation medium molecules. These molecules then pass through the functional membranes 40 enclosing the first chamber 101 and escape from it. The second chamber 102, being unheated and at a lower temperature, will condense and form heat dissipation medium molecules once they reach it. The liquid heat dissipation medium flows from the second chamber 102 to the first chamber 101 through the capillary structure 30. If the heat source of the electronic device is positioned in relation to the second chamber 102, the liquid heat dissipation medium in the second chamber 102 will be heated to form heat dissipation medium molecules. These molecules will then pass through the functional membrane 40 surrounding the second chamber 102 and escape from the second chamber 102. Meanwhile, the first chamber 101 is not heated and has a lower temperature. Once the heat dissipation medium molecules move to the first chamber 101, they will condense to form a liquid heat dissipation medium, which will then flow from the first chamber 101 to the second chamber 102 through the capillary structure 30.

[0051] It should be noted that, in this embodiment, the second state of the functional membrane 40 can be a state in which the functional membrane 40 is heated. Specifically, when the first chamber 101 corresponds to the position of the heat source, the heat from the heat source is transferred to the functional membrane 40 that surrounds the first chamber 101, causing the functional membrane 40 to be heated; when the second chamber 102 corresponds to the position of the heat source, the heat from the heat source is transferred to the functional membrane 40 that surrounds the second chamber 102, causing the functional membrane 40 to be heated.

[0052] Additionally, in some embodiments, such as Figure 7 As shown, the cavity may further include a transition region (not shown in the figure) disposed between the first chamber 101 and the second chamber 102. The first chamber 101 and the second chamber 102 are separated by the transition region. The functional membrane 40 includes a first functional membrane 401 and a second functional membrane 402. The first functional membrane 401 is used to enclose and form the first chamber 101, and the second functional membrane 402 is used to enclose and form the second chamber 102.

[0053] The first chamber 101 can be formed by enclosing the first chamber 101 solely with the first functional membrane 401, and the second chamber 102 can be formed by enclosing the second chamber 102 solely with the second functional membrane 402. However, in this embodiment, when the first chamber 101 is formed by enclosing the first functional membrane 401, it can be formed by the first functional membrane 401 and the supporting structure 50 together, and the second chamber 102 can be formed by the second functional membrane 402 and the supporting structure 50 together. This embodiment does not limit the specific method used in this application.

[0054] In addition, in this embodiment of the application, by setting a transition zone, it is easy to separate the first chamber 101 and the second chamber 102.

[0055] Additionally, in some embodiments, such as Figure 7 As shown, the functional membrane 40 can also have a second state. When the functional membrane 40 is in the second state, the liquid heat dissipation medium flows through the functional membrane 40 between the first chamber 101 and the second chamber 102. When the first chamber 101 is connected to a heat source and the second chamber 102 is not connected to a heat source, the first functional membrane 401 is in the second state, and the transition zone causes the second functional membrane 402 to be in the first state. The liquid heat dissipation medium in the first chamber 101 flows through the first functional membrane 401 to the transition zone for heat dissipation. The liquid heat dissipation medium in the transition zone is blocked by the second functional membrane 402. Outside the two chambers 102; when the first chamber 101 and the second chamber 102 are respectively connected to heat sources, the first functional membrane 401 is in a second state, the second functional membrane 402 is in a second state, the liquid heat dissipation medium in the first chamber 101 passes through the first functional membrane 401 and flows to the transition zone to dissipate heat, the liquid heat dissipation medium in the second chamber 102 passes through the second functional membrane 402 and passes through the first functional membrane 401 and flows to the transition zone to dissipate heat; the liquid heat dissipation medium in the chamber can flow between the first chamber 101, the transition zone and the second chamber 102 to achieve uniform heat distribution.

[0056] like Figure 7As shown, when the first functional membrane 401 encloses to form the first chamber 101, or the first functional membrane 401 and the support structure 50 jointly enclose to form the first chamber 101, and the second functional membrane 402 encloses to form the second chamber 102, or the second functional membrane 402 and the support structure 50 jointly enclose to form the second chamber 102, when the heat spreader is applied to an electronic device, the first chamber 101 and / or the second chamber 102 can be connected to the heat source of the electronic device, thus the flow pattern of the liquid heat dissipation medium will be different. Specifically, when the first chamber 101 is connected to a heat source and the second chamber 102 is not connected to a heat source, the first functional membrane 401 is in the second state. At this time, due to the effect of the transition zone between the second chamber 102 and the first chamber 101, the second chamber 102 receives less or no heat, and the second functional membrane 402 is in the first state. The liquid heat dissipation medium in the first chamber 101 will be heated to form heat dissipation medium molecules, which will flow through the first functional membrane 401 to the transition zone to dissipate heat. After the heat dissipation medium molecules come into contact with the second functional membrane 402, they will condense to form liquid heat dissipation medium molecules, which will then re-enter the transition zone. The transition zone extends into the first chamber 101. When the first chamber 101 and the second chamber 102 are respectively connected to heat sources, the first functional membrane 401 is in a second state, and the second functional membrane 402 is in a second state. The liquid heat dissipation medium in the first chamber 101 forms heat dissipation medium molecules that flow through the first functional membrane 401 to the transition zone to dissipate heat. The liquid heat dissipation medium in the second chamber 102 forms heat dissipation medium molecules that flow through the second functional membrane 402 to the transition zone to dissipate heat. The liquid heat dissipation medium in the chamber can flow between the first chamber 101, the transition zone, and the second chamber 102 to achieve uniform heat dissipation.

[0057] Additionally, in the embodiments of this application, such as Figure 7 As shown, a first functional membrane 401 encloses and forms a first chamber 101, and a second functional membrane 402 encloses and forms a second chamber 102. That is, the first chamber 101 is formed solely by the first functional membrane, and the second chamber 102 is formed solely by the second functional membrane 402. This allows the heat dissipation medium molecules formed after heating in the first chamber 101 to have sufficient escape sites, and similarly, it allows the heat dissipation medium molecules formed after heating in the second chamber 102 to have sufficient escape sites, allowing them to escape from either the first chamber 101 or the second chamber 102. In other words, the first functional membrane 401 encloses and forms the first chamber 101, and the second functional membrane 402 encloses and forms the second chamber 102, facilitating the escape of heat dissipation medium molecules from either chamber 101 or the second chamber 102.

[0058] Additionally, in some embodiments, such as Figure 7As shown, the heat spreader may also include a plurality of support columns 60 spaced apart, the capillary structure 30 is stacked between the first cover plate 10 and the second cover plate 20, and the support columns 60 are connected to the first cover plate 10; a plurality of support columns 60 are provided in the first chamber 101, the second chamber 102 and the transition zone.

[0059] With this arrangement, the first chamber 101, the second chamber 102, and the transition area are all supported by the support columns 60, thereby preventing the first cover plate 10 and the second cover plate 20 from getting close to each other, which could lead to the first cover plate 10 and / or the second cover plate 20 compressing the first chamber 101, the transition area, and the second chamber 102.

[0060] It should be noted that, in this embodiment, the multiple support columns 60 within the first chamber 101 can be evenly distributed, meaning they can be equally spaced; the multiple support columns 60 within the transition zone can be evenly distributed, meaning they can be equally spaced; and the multiple support columns 60 within the second chamber 102 can be evenly distributed, meaning they can be equally spaced. Of course, the multiple support columns 60 within the first chamber 101, the transition zone, and the second chamber 102 may not be evenly distributed. This embodiment does not limit the distribution of these columns.

[0061] It should also be noted that, in the embodiments of this application, the liquid heat dissipation medium can be water, but it can also be other media; this application does not limit the specific media used. Furthermore, in the embodiments of this application, non-condensable gases include, but are not limited to, hydrogen, oxygen, and nitrogen.

[0062] In this embodiment, since the first cover plate 10 and the second cover plate 20 are connected to form a cavity, the capillary structure 30, the heat dissipation medium, and the functional membrane 40 are disposed in the cavity. The cavity includes a first chamber 101 and a second chamber 102. The functional membrane 40 is disposed between the first chamber 101 and the second chamber 102 to separate the first chamber 101 and the second chamber 102. Therefore, the functional membrane 40 can block the heat dissipation medium, that is, the functional membrane 40 blocks the liquid heat dissipation medium from flowing between the first chamber 101 and the second chamber 102. If the liquid heat dissipation medium is only in the first chamber 101, the second chamber 102 can become a cooling area, and the first chamber 101 becomes a heat dissipation area. If the liquid heat dissipation medium is present in both the first chamber 101 and the second chamber 102, then once the first chamber 101 corresponds to the heat source in the electronic device, the first chamber 101 becomes a heat dissipation area, and the second chamber 102 becomes a cooling area. In this embodiment, a heat dissipation area and a cooling area can be formed on the heat spreader to ensure effective heat dissipation from the heat source while minimizing the impact on other heat-sensitive structures. Specifically, in this embodiment, a heat dissipation area and a cooling area can be formed in the heat spreader. Therefore, after the heat spreader is applied to an electronic device, the heat dissipation area corresponds to the heat source, and the cooling area corresponds to the heat-sensitive structure. This ensures effective heat dissipation from the heat source while isolating the heat from the heat source by the cooling area, preventing heat transfer to the heat-sensitive structure and thus avoiding any impact on it.

[0063] This application provides an electronic device, including a heat spreader as described in any of the above embodiments.

[0064] It should be noted that, in the embodiments of this application, electronic devices include, but are not limited to, controllers, smart devices, terminal products, etc., wherein smart devices include, for example, smartphones, smart TVs, smart speakers, smart robots, VR devices, AR devices, XR devices, etc., and terminal products include, for example, personal computers, tablet computers, etc.

[0065] Additionally, in some embodiments, the electronic device may include a first heating element connected to the first chamber 101; when the functional membrane 40 is in the first state, the functional membrane 40 prevents the liquid heat dissipation medium from flowing from the first chamber 101 into the second chamber 102.

[0066] When the first heating device is connected to the first chamber 101, the heat from the first heating device is transferred to the first chamber 101. As a result, the liquid heat dissipation medium in the first chamber 101 forms heat dissipation medium molecules, which absorb the heat from the first heating device and dissipate heat from the first heating device.

[0067] It should be noted that the cavity can be divided into a first chamber 101 and a second chamber 102 by the support structure 50, thereby connecting the first heating device to the first chamber 101. That is, the first chamber 101 is not formed by the molecular functional membrane 40. Therefore, after the first chamber 101 is connected to the first heating device, the functional membrane 40 can be in the first state.

[0068] It should also be noted that the first heat-generating device includes, but is not limited to, control circuit boards, camera modules, etc.

[0069] Additionally, in some embodiments, such as Figure 1 As shown, when the functional membrane 40 is in the first state, the gas in the first chamber 101 passes through the functional membrane 40 and enters the second chamber 102, and the heat spreader contains the gas escaping from the first chamber 101 through the second chamber 102.

[0070] When the functional membrane 40 is in the first state, the non-condensable gas in the first chamber 101 can move to the functional membrane 40 under the influence of the heat dissipation medium molecules, and pass through the functional membrane 40 into the second chamber 102. Thus, the second chamber 102 can contain the non-condensable gas, so that the first chamber 101 has less non-condensable gas, which is conducive to the flow of heat dissipation medium molecules in the first chamber 101, thereby facilitating the heat dissipation of the first heat-generating device by the first chamber 101.

[0071] Additionally, in some embodiments, such as Figure 7 As shown, the cavity may further include a transition region disposed between the first chamber 101 and the second chamber 102. The first chamber 101 and the second chamber 102 are separated by the transition region. The functional membrane 40 includes a first functional membrane 401 and a second functional membrane 402. The first functional membrane 401 is used to enclose and form the first chamber 101, and the second functional membrane 402 is used to enclose and form the second chamber 102. The electronic device includes a first heating device and a second heating device. The first heating device is connected to the first chamber 101, and the second heating device is connected to the second chamber 102.

[0072] Among them, such as Figure 7As shown, the first chamber 101 can be formed solely by the first functional membrane 401, or it can be formed by the first functional membrane 401 and the supporting structure 50 together. Similarly, the second chamber 102 can be formed solely by the second functional membrane 402, or it can be formed by the second functional membrane 402 and the supporting structure 50 together. Therefore, after connecting the first heating device to the first chamber 101 and the second heating device to the second chamber 102, once the first heating device heats up but the second heating device does not, the liquid heat dissipation medium in the first chamber 101, after being heated, forms heat dissipation medium molecules. These molecules then pass through the functional membrane 40 surrounding the first chamber 101, escaping from the first chamber 101. Meanwhile, the second chamber 102, being unheated and at a lower temperature, will have its heat dissipation medium molecules condense and form a liquid heat dissipation medium once they reach it. This liquid heat dissipation medium then flows out of the second chamber 102. The capillary structure 30 acts to flow into the first chamber 101. If the second heating device heats up but the first heating device does not, the liquid heat dissipation medium in the second chamber 102 is heated and forms heat dissipation medium molecules. These molecules then pass through the functional membrane 40 surrounding the second chamber 102, allowing them to escape from the second chamber 102. Meanwhile, the first chamber 101 is not heated and has a lower temperature. Once the heat dissipation medium molecules move to the first chamber 101, they condense and form a liquid heat dissipation medium. This liquid heat dissipation medium then flows from the first chamber 101 into the second chamber 102 through the capillary structure 30.

[0073] In addition, in this embodiment, the functional membrane 40 also has a second state. When the functional membrane 40 is in the second state, the liquid heat dissipation medium flows through the functional membrane 40 between the first chamber 101 and the second chamber 102. When the first heating element heats up and the second heating element does not heat up, the first functional membrane 401 is in a second state, and the transition zone causes the second functional membrane 402 to be in a first state. The liquid heat dissipation medium in the first chamber 101 flows through the first functional membrane 401 to the transition zone for heat dissipation, and the liquid heat dissipation medium in the transition zone is blocked outside the second chamber 102 by the second functional membrane 402. When both the first heating element and the second heating element heat up, the first functional membrane 401 is in a second state, the second functional membrane 402 is in a second state, the liquid heat dissipation medium in the first chamber 101 flows through the first functional membrane 401 to the transition zone for heat dissipation, and the liquid heat dissipation medium in the second chamber 102 flows through the second functional membrane 402 to the first functional membrane 401 to the transition zone for heat dissipation. The liquid heat dissipation medium in the chamber can flow between the first chamber 101, the transition zone, and the second chamber 102 for heat dissipation.

[0074] In addition, in some embodiments, the electronic device may also include a frame 100, which is disposed opposite to the second chamber 102, or the second chamber 102 is disposed between the frame 100 and the first chamber 101.

[0075] With this design, once the heat source in the electronic device is dissipated by the first chamber 101, the heat in the first chamber 101 will also be transferred within the first chamber 101, preventing the heat from being rapidly transferred to the frame 100, which could cause the frame 100 to heat up quickly and affect the user experience. In other words, this design effectively uses the second chamber 102 to provide insulation, preventing the rapid transfer of heat from the heat source in the electronic device to the frame 100.

[0076] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0077] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat spreader, characterized in that, include: First cover plate, second cover plate, capillary structure, heat dissipation medium, and functional membrane; The first cover plate and the second cover plate are connected to form a cavity, and the capillary structure, heat dissipation medium and functional membrane are disposed in the cavity; The cavity includes a first chamber and a second chamber, and the functional membrane is disposed between the first chamber and the second chamber to separate the first chamber and the second chamber; When the functional membrane is in the first state, the functional membrane blocks the flow of the liquid heat dissipation medium between the first chamber and the second chamber; The cavity further includes a transition region disposed between the first chamber and the second chamber, the first chamber and the second chamber being spaced apart by the transition region, and the functional membrane including a first functional membrane and a second functional membrane, the first functional membrane being used to enclose and form the first chamber, and the second functional membrane being used to enclose and form the second chamber; The functional membrane also has a second state. When the functional membrane is in the second state, the liquid heat dissipation medium flows through the functional membrane between the first chamber and the second chamber. When the first chamber is connected to a heat source and the second chamber is not connected to a heat source, the first functional membrane is in the second state. The transition zone causes the second functional membrane to be in the first state. The liquid heat dissipation medium in the first chamber flows through the first functional membrane to the transition zone to dissipate heat. The liquid heat dissipation medium in the transition zone is blocked by the second functional membrane outside the second chamber.

2. The heat spreader according to claim 1, characterized in that, It also includes a support structure arranged around the first chamber, the support structure and the functional membrane being disposed between the first chamber and the second chamber to make the first chamber and the second chamber independent of each other; the liquid heat dissipation medium is disposed in the first chamber, and when the functional membrane is in the first state, the functional membrane prevents the liquid heat dissipation medium from flowing from the first chamber into the second chamber.

3. The heat spreader according to claim 2, characterized in that, The capillary structure is stacked between the first cover plate and the second cover plate. The first side of the support structure is connected to the first cover plate, and the second side of the support structure is sealed and abutted against the second cover plate or abutted against the capillary structure. The first side and the second side of the support structure are opposite sides of the support structure. The support structure has a first through hole, and the functional membrane covers the first through hole to separate the first chamber and the second chamber.

4. The heat spreader according to claim 3, characterized in that, The support structure extends from the first side of the first chamber to the second side of the first chamber, and the first side and the second side of the first chamber are adjacent sides of the first chamber; The support structure includes a first partition segment and a second partition segment connected to each other. The first partition segment is located on the first side of the first chamber and has a plurality of spaced first through holes. The functional membrane covers the plurality of first through holes to separate the first chamber and the second chamber. The second partition segment is located on the second side of the first chamber and is continuously arranged to separate the first chamber and the second chamber.

5. The heat spreader according to claim 4, characterized in that, The second chamber includes a first sub-chamber and a second sub-chamber that are interconnected. The first sub-chamber is located on a first side of the first chamber, and the second sub-chamber is located on a second side of the first chamber. The angle between the first partition segment and the second partition segment is greater than 90°, such that the cross-sectional area of ​​the first sub-chamber gradually decreases in the direction away from the second sub-chamber.

6. The heat spreader according to any one of claims 1 to 5, characterized in that, The capillary structure is disposed in the first chamber and is used to allow the liquid heat dissipation medium to flow between the first side and the third side of the first chamber under the guidance of the capillary structure. The third side of the first chamber and the first side of the first chamber are opposite sides of the first chamber, and the second side of the first chamber is located between the third side of the first chamber and the first side of the first chamber. When the functional membrane is in the first state, the gas in the first chamber passes through the functional membrane into the second chamber, and the heat spreader contains the gas escaping from the first chamber through the second chamber.

7. The heat spreader according to claim 6, characterized in that, The first chamber includes an evaporation zone for connecting a heat source and a condensation zone for condensing the heat dissipation medium. The evaporation zone is disposed on a third side near the first chamber, and the condensation zone is disposed on a first side near the first chamber.

8. The heat spreader according to claim 1, characterized in that, It also includes a third chamber, which is connected to the second chamber via a pipe; the third chamber is disposed inside the cavity or outside the cavity.

9. The heat spreader according to claim 1, characterized in that, With heat sources connected to the first chamber and the second chamber respectively, the first functional membrane is in the second state, the second functional membrane is in the second state, the liquid heat dissipation medium in the first chamber flows through the first functional membrane to the transition zone to dissipate heat, and the liquid heat dissipation medium in the second chamber flows through the second functional membrane to the transition zone to dissipate heat; the liquid heat dissipation medium in the cavity can flow between the first chamber, the transition zone and the second chamber to achieve heat equalization.

10. The heat spreader according to claim 1, characterized in that, It also includes a plurality of support columns spaced apart, the capillary structure being stacked between the first cover plate and the second cover plate, and the support columns being connected to the first cover plate; a plurality of the support columns are provided in the first chamber, the second chamber and the transition zone.

11. An electronic device, characterized in that, Includes a heat spreader as described in any one of claims 1 to 10.

12. The electronic device according to claim 11, characterized in that, The electronic device includes a first heating element connected to the first chamber; when the functional membrane is in the first state, the functional membrane prevents the liquid heat dissipation medium from flowing from the first chamber into the second chamber.

13. The electronic device according to claim 12, characterized in that, When the functional membrane is in the first state, the gas in the first chamber passes through the functional membrane into the second chamber, and the heat spreader contains the gas escaping from the first chamber through the second chamber.

14. The electronic device according to claim 11, characterized in that, The electronic device includes a first heating element and a second heating element, wherein the first heating element is connected to the first chamber and the second heating element is connected to the second chamber.

15. The electronic device according to claim 14, characterized in that, When both the first heating device and the second heating device are heating up, the first functional membrane is in the second state, the second functional membrane is in the second state, the liquid heat dissipation medium in the first chamber flows through the first functional membrane to the transition zone to dissipate heat, and the liquid heat dissipation medium in the second chamber flows through the second functional membrane to the first functional membrane to the transition zone to dissipate heat; the liquid heat dissipation medium in the cavity can flow between the first chamber, the transition zone and the second chamber to achieve uniform heat distribution.

16. The electronic device according to claim 12, characterized in that, It also includes a frame, which is disposed opposite to the second chamber, or the second chamber is disposed between the frame and the first chamber.

Images