A temperature control system for a print head

Abstract

The utility model relates to a temperature control system for printing nozzle, including semiconductor refrigeration piece, with the semiconductor refrigeration piece one end of the heat dissipation spare, with the semiconductor refrigeration piece other end of the printing head temperature control block, with the semiconductor refrigeration piece electricity connection's temperature control unit and the cooling liquid circulating assembly of external and with the heat dissipation spare connection, the cooling liquid circulating assembly includes the cooling liquid tank, pump body and radiator that connect gradually, and the cooling liquid in the cooling liquid tank is transported to the radiator heat dissipation after the pump body and supplies to the cooling liquid flow channel, then again backflow to the cooling liquid tank. The utility model discloses a cooling liquid circulation system is formed through the heat dissipation spare and external cooling liquid circulating assembly, and the cooling effect of semiconductor refrigeration piece is improved to the heat dissipation spare cooling, reaches the purpose of faster cooling and lower temperature, makes printing nozzle can fast switching temperature and temperature control range is wider, to satisfy the demand of complex biological material printing and organ chip manufacturing, simple structure.

Description

Technical Field

[0001] This utility model relates to the field of 3D printing technology for biomaterials, and more specifically, to a temperature control system for a printing nozzle. Background Technology

[0002] Bioprinting technology, as a key means to achieve high-precision, high-throughput biomaterial manufacturing, is receiving widespread attention. However, existing bioprinting technologies still have shortcomings in material deposition and performance control under complex environments. In particular, during the manufacturing of organ-on-a-chip, it is necessary to precisely control the printing performance of bio-inks (such as cell suspensions, hydrogels, etc.) under various temperature conditions to ensure the integrity of the printed structure and cell viability.

[0003] Currently, there are some patented technologies for high and low temperature printing nozzles on the market, but these technologies still have the following shortcomings: First, existing high and low temperature printing nozzles have limitations in temperature adjustment range and response speed. Many nozzles can only achieve unidirectional temperature adjustment (such as heating or cooling) and cannot achieve rapid switching between high and low temperatures in a short time. This is particularly inadequate when dealing with complex biological materials in organ-on-a-chip manufacturing. Second, although some nozzles have bidirectional temperature control functions, their complex structure and large size also lead to higher cleaning and maintenance costs. Third, existing patented high and low temperature printing nozzles also have shortcomings in temperature uniformity. During the printing process, uneven temperature distribution inside the nozzle may lead to inconsistent properties of biological materials, thereby affecting the stability of the printed structure.

[0004] For example, CN104985814A discloses a bioprinting nozzle for high and low temperature combinations. The nozzle includes an outer shell, a heat-conducting block, a heating rod, a cooling plate, a heat sink, a fan, a syringe, an upper baffle of the heat-conducting block, a lower baffle of the heat-conducting block, a cap, and a needle. The heating and cooling devices are integrated into the nozzle. This integrated design leads to a more complex nozzle structure and a larger volume, which increases the energy consumption of the nozzle during long-term operation. Furthermore, when multiple temperature control components are integrated into the nozzle, the layout of the heating and cooling elements is often not optimized due to space constraints. This may result in uneven temperature distribution inside the nozzle, especially when switching between high and low temperatures, where the temperature gradient is large, which will affect the performance stability of the biomaterial and the uniformity of the printed structure. Utility Model Content

[0005] To overcome the problems in the prior art, this utility model provides a temperature control system for a printhead, which enables bidirectional temperature control of the printhead, allowing the printhead to switch temperatures quickly and with a wider temperature control range. It has a simple structure and good application prospects.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a temperature control system for a printhead, including a thermoelectric cooler, a heat sink attached to one end of the thermoelectric cooler, a printhead temperature control block attached to the other end of the thermoelectric cooler, a temperature control unit electrically connected to the thermoelectric cooler, and an external coolant circulation assembly connected to the heat sink; the printhead temperature control block is used to mount the printhead; a coolant flow channel is provided inside the heat sink; the coolant circulation assembly includes a coolant tank, a pump body, and a radiator connected in sequence, the pump body delivers the coolant in the coolant tank to the radiator for heat dissipation and then supplies it to the coolant flow channel, and then returns it to the coolant tank.

[0007] The printhead is installed inside the printhead temperature control block, and the two are detachably connected. When printhead temperature control is required, the temperature control unit controls the thermoelectric cooler (TEU) to cool or heat by supplying a positive or reverse voltage, achieving bidirectional temperature control of the printhead. Specifically, supplying a positive voltage cools one end of the TEU, causing its temperature to drop (the cold end), while the other end heats up (the hot end). The heat from the hot end is transferred to the heat sink and carried away by the coolant flowing through its channels, thus cooling the hot end. Once the TEU is powered and stable, the temperature difference between the cold and hot ends remains constant. The cooling capacity depends on the temperature of the hot end; therefore, the better the heat sink's heat dissipation, the better the TEU's cooling capacity. This invention utilizes a coolant circulation system comprising a coolant tank, a pump, a radiator, and heat sink components to form a coolant circulation system. The pump delivers coolant from the tank to the radiator for cooling, then supplies it to the coolant flow channels before returning to the tank. This circulating coolant cools the heat sink components, accelerating heat dissipation and allowing the cold end of the thermoelectric cooler to reach a lower cooling temperature more quickly, enabling the printhead to rapidly transition from high to low temperature. When heating is required, the coolant circulation system is stopped. A reverse voltage is input to the thermoelectric cooler via the temperature control unit, swapping the hot and cold ends. Without coolant circulating for cooling, the printhead temperature rises, achieving the desired heating effect. Furthermore, in the coolant circulation system of this invention, only the heat dissipation component is located on the print head. By placing the coolant circulation component externally and not integrating it into the print head, a larger capacity coolant tank and a larger radiator can be provided, thereby accelerating the heat dissipation of the heat dissipation component. At the same time, it avoids the problems of complex print head structure, excessive size, and uneven temperature distribution inside the print head caused by integrating the temperature control system into the print head.

[0008] Furthermore, the outlet of the coolant tank is connected to the pump body, the pump body is connected to the inlet of the radiator, the outlet of the radiator is connected to the inlet of the coolant flow channel, and the inlet of the coolant tank is connected to the outlet of the coolant flow channel. After flowing out of the coolant flow channel, the coolant returns to the coolant tank. The pump body pressurizes the coolant in the coolant tank and outputs it to the radiator, which then enters the coolant flow channel to dissipate heat from the heat sink components, thus achieving coolant circulation and cooling.

[0009] Furthermore, the radiator includes a housing, heat dissipation fins installed within the housing, heat dissipation channels penetrating the heat dissipation fins, and a fan installed on the outside of the housing; the air outlet or air inlet of the fan faces the gap between the heat dissipation fins; the pump body is connected to the liquid inlet of the heat dissipation channel, and the liquid outlet of the heat dissipation channel is connected to the liquid inlet of the coolant channel. Under the action of the pump body, the coolant enters the heat dissipation channel of the radiator, exchanging heat with the heat dissipation fins during its flow. Simultaneously, the airflow from the fan also carries away the heat from the heat dissipation fins, thereby achieving rapid heat dissipation of the coolant.

[0010] Furthermore, the coolant tank is equipped with a level gauge. The level gauge monitors the coolant level in the tank, allowing for timely replenishment when coolant is insufficient.

[0011] Furthermore, the top of the coolant tank is provided with a mounting hole that connects to the interior of the tank. The level gauge is installed in the mounting hole and inserted into the tank. The outer casing of the level gauge can be fixed at the mounting hole, which facilitates maintenance of the level gauge and also allows for easy disassembly of the level gauge to add coolant to the coolant tank through the mounting hole.

[0012] Furthermore, the inlet of the coolant tank and the outlet of the coolant flow channel are connected by a return pipe. The return pipe has at least one straight section, on which heat dissipation sections are arranged circumferentially along the return pipe. These heat dissipation sections are partially located inside and partially outside the return pipe. The heat dissipation sections divide the coolant, allowing it to exchange heat with the outside environment over a large area. This results in coolant returning to the coolant tank at a lower temperature, which is more conducive to subsequent cooling and improves the heat dissipation effect on the heat sink components.

[0013] Furthermore, it also includes a heat exchanger mounted on the heat sink. The printhead operates within the forming chamber. When the printhead is at a low temperature, the forming chamber is also at a low temperature. Similarly, when the printhead heats up, the forming chamber also heats up. Therefore, the heat exchanger can exchange heat with the air inside the forming chamber, further accelerating the heat dissipation efficiency of the heat sink, thereby improving the cooling efficiency of the semiconductor refrigeration chip.

[0014] Furthermore, the heat exchanger is installed on the side of the heat sink away from the semiconductor cooling chip.

[0015] Furthermore, the heat exchanger is provided with multiple heat dissipation fins. The heat dissipation fins increase the contact area between the heat exchanger and the air, thereby improving the heat exchange efficiency.

[0016] Furthermore, the printhead temperature control block is provided with a receiving cavity for accommodating the printhead, and the side wall of the printhead temperature control block is provided with a connecting plane for contacting the other end of the thermoelectric cooler. The receiving cavity of the printhead temperature control block can enclose the printhead, thereby cooling or heating the enclosed part of the printhead, making the internal temperature of the printhead more uniform; the setting of the connecting plane can increase the contact area between the printhead temperature control block and the thermoelectric cooler, improving heat transfer efficiency.

[0017] Compared with existing technologies, the beneficial effects are:

[0018] 1. The coolant tank, pump body, radiator and heat sink form a coolant circulation system. The circulating coolant cools the heat sink, allowing the cold end of the semiconductor cooling chip to reach a lower temperature more quickly. This enables the print head to switch from high temperature to low temperature rapidly, and the print head has a wider temperature control range and a wider range of applications to meet the needs of printing complex biomaterials and manufacturing organ-on-a-chip.

[0019] 2. The coolant circulation assembly, through the combination of a radiator, coolant tank, and pump, can effectively cool the coolant with a simple structure. Placing the coolant circulation assembly externally, such as outside the printing chamber, instead of integrating it into the print head, allows for a larger coolant tank and a larger radiator, thereby accelerating heat dissipation from the heat sink. It also avoids the problems of complex print head structure, excessive size, and uneven temperature distribution within the print head caused by integrating the temperature control system into the print head.

[0020] 3. By setting heat exchange components on the heat sink, the heat dissipation efficiency of the heat sink can be further accelerated, thereby improving the cooling efficiency of the semiconductor refrigeration chip.

[0021] 4. By fixing the printhead with a printhead temperature control block, the printhead and temperature control system become independent, keeping the printhead structure simple. At the same time, the printhead temperature control block can enclose the printhead, making the internal temperature of the printhead more uniform and reducing temperature gradient differences during high and low temperature transitions. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of a temperature control system for a printhead.

[0023] Figure 2This is an exploded view of a semiconductor cooling chip, a printhead temperature control block, a heat sink, and a heat exchanger.

[0024] Figure 3 This is an exploded view of a coolant tank and a level gauge;

[0025] Figure 4 This is a schematic diagram of the reflux pipe structure;

[0026] Figure 5 yes Figure 4 A cross-sectional view along the AA direction.

[0027] Among them, 100-semiconductor cooling chip; 200-heat sink; 210-heat exchanger; 300-printhead temperature control block; 310-receiving cavity; 400-temperature control unit; 500-coolant flow channel; 600-radiator; 610-housing; 620-fan; 700-coolant tank; 710-level gauge; 720-mounting hole; 800-pump body; 900-return pipe; 910-heat dissipation unit. Detailed Implementation

[0028] The accompanying drawings are for illustrative purposes only and should not be construed as limiting this patent. To better illustrate this embodiment, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings. The positional relationships described in the drawings are for illustrative purposes only and should not be construed as limiting this patent.

[0029] In the accompanying drawings of this utility model, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," "right," "long," and "short" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0031] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] The technical solution of this utility model will be further described in detail below through specific embodiments and with reference to the accompanying drawings:

[0033] Example 1

[0034] like Figure 1 The illustration shows an embodiment of a temperature control system for a printhead, including a thermoelectric cooler 100, a heat sink 200 attached to one end of the thermoelectric cooler 100, a printhead temperature control block 300 attached to the other end of the thermoelectric cooler 100, a temperature control unit 400 electrically connected to the thermoelectric cooler 100, and an external coolant circulation assembly connected to the heat sink 200; the printhead temperature control block 300 is used to mount the printhead; the heat sink 200 has a coolant flow channel 500, and the coolant circulation assembly is used to supply coolant to the coolant flow channel 500.

[0035] Specifically, the coolant circulation assembly includes a coolant tank 700, a pump body 800, and a radiator 600 connected in sequence. The outlet of the coolant tank 700 is connected to the pump body 800, the pump body 800 is connected to the inlet of the radiator 600, the outlet of the radiator 600 is connected to the inlet of the coolant flow channel 500, and the inlet of the coolant tank 700 is connected to the outlet of the coolant flow channel 500. The pump body 800 pressurizes the coolant in the coolant tank 700 and outputs it to the radiator 600 for heat dissipation, then supplies it to the coolant flow channel 500 to dissipate heat from the heat sink 200, and then returns it to the coolant tank 700, thus realizing the circulation and cooling of the coolant.

[0036] In this embodiment, the printhead temperature control block 300 is provided with a receiving cavity 310 for accommodating the printhead, and a connecting plane is provided on the side wall of the printhead temperature control block 300 for attaching to the other end of the semiconductor cooling chip 100. The receiving cavity 310 of the printhead temperature control block 300 can enclose the printhead, thereby cooling or heating the enclosed part of the printhead, making the internal temperature of the printhead more uniform; the setting of the connecting plane can increase the contact area between the printhead temperature control block 300 and the semiconductor cooling chip 100, improving the heat transfer efficiency.

[0037] The working principle or workflow of this embodiment is as follows: The printhead is installed inside the printhead temperature control block 300, and the two are detachably connected. When it is necessary to control the temperature of the printhead, the temperature control unit 400 controls the semiconductor cooling chip 100 to cool or heat by supplying a positive or reverse voltage, thereby achieving bidirectional temperature control of the printhead. Specifically, by supplying a positive voltage, one end of the semiconductor cooling chip 100 cools down, and the temperature of this end decreases, while the temperature of the other end rises, and this end becomes the hot end. The heat from the hot end is transferred to the heat sink 200 and carried away by the coolant flowing in the coolant channel of the heat sink 200, thereby cooling the hot end. After carrying away the heat from the heat sink 200, the coolant flows back to the coolant tank 700. The pump 800 pressurizes the coolant in the coolant tank 700 and delivers it to the radiator 600. After the radiator 600 cools the coolant, the coolant enters the coolant channel 500 to cool the heat sink 200.

[0038] After the thermoelectric cooler 100 is powered on and stabilized, the temperature difference between its cold and hot ends remains constant. Its cooling capacity depends on the temperature of its hot end; therefore, the better the heat dissipation effect of the heat sink 200, the better the cooling capacity of the thermoelectric cooler 100. Furthermore, by circulating coolant to dissipate heat from the heat sink 200, its heat dissipation speed is accelerated, allowing the cold end of the thermoelectric cooler 100 to reach a lower temperature more quickly, enabling the printhead to rapidly transition from high to low temperature.

[0039] When heating is required, the coolant circulation component is stopped. The temperature control unit 400 inputs a reverse voltage to the thermoelectric cooler 100, causing the hot and cold ends of the thermoelectric cooler 100 to interchange. Since no coolant participates in the circulation and heat dissipation, the temperature of the print head will rise to achieve the purpose of heating.

[0040] The beneficial effects of this embodiment:

[0041] When the printhead is cooled, the coolant tank 700, pump body 800, radiator 600, and heat sink 200 form a coolant circulation system. The circulating coolant cools the heat sink 200, accelerating heat dissipation from the hot end of the thermoelectric cooler 100, thereby improving the cooling effect of the cold end and achieving faster cooling and lower temperatures. When the printhead is heated, the coolant circulation system is stopped simply by inputting a reverse voltage. In this embodiment, a temperature control system is used to control the printhead temperature, which can be reduced to a minimum of -25°C and increased to a maximum of 180°C, meeting the needs of printing complex biomaterials and manufacturing organ-on-a-chip devices.

[0042] The coolant circulation assembly, through the combination of a radiator, coolant tank, and pump, can effectively cool the coolant with a simple structure. Placing the coolant circulation assembly externally, such as outside the printing chamber, instead of integrating it into the print head, allows for a larger coolant tank and a larger radiator, thereby accelerating heat dissipation from the heat sink. This also avoids the problems of complex print head structure, excessive size, and uneven temperature distribution within the print head caused by integrating the temperature control system into the print head.

[0043] The printhead is fixed by the printhead temperature control block 300, allowing the printhead and temperature control system to operate independently, thus simplifying the printhead's structure. Simultaneously, the printhead temperature control block 300 can enclose the printhead, resulting in more uniform internal temperature and reducing temperature gradient differences during high and low temperature transitions.

[0044] In this embodiment, the heat sink 200 is a copper metal block. The heat exchanger 600 is an air-cooled heat exchanger. The printhead temperature control block 300 is made of metal, but can also be copper.

[0045] Example 2

[0046] Embodiment 2 of a temperature control system for a printhead further defines the coolant circulation component based on Embodiment 1.

[0047] Specifically, such as Figure 1 As shown, the radiator 600 includes a housing 610, heat dissipation fins installed inside the housing 610, heat dissipation channels penetrating the heat dissipation fins, and a fan 620 installed outside the housing 610; the air outlet or air inlet of the fan 620 faces the gap between the heat dissipation fins; the pump body 800 is connected to the liquid inlet of the heat dissipation channel, and the liquid outlet of the heat dissipation channel is connected to the liquid inlet of the coolant channel 500. The coolant enters the heat dissipation channel under the action of the pump body 800, and exchanges heat with the heat dissipation fins during its flow. Simultaneously, the airflow blown out by the fan 620 also carries away the heat from the heat dissipation fins, thereby achieving rapid heat dissipation of the coolant.

[0048] Specifically, such as Figure 3 As shown, the coolant tank 700 is equipped with a level gauge 710. The top of the coolant tank 700 has a mounting hole 720 that connects to the interior of the tank. The level gauge is installed in the mounting hole 720 and inserted into the coolant tank 700. The outer casing of the level gauge 710 can be fixed at the mounting hole 720 for easy maintenance. When the level gauge 710 detects insufficient coolant level, coolant can be added to the coolant tank 700 through the mounting hole 720 by removing the level gauge 710. Alternatively, a separate filling port can be provided.

[0049] In this embodiment, as Figure 4 and Figure 5As shown, the inlet of the coolant tank 700 and the outlet of the coolant flow channel 500 are connected by a return pipe 900. The return pipe 900 has at least one straight section, on which heat dissipation sections 910 are provided, distributed circumferentially along the return pipe 900. Part of the heat dissipation sections 910 are located inside the return pipe 900, and part is located outside the return pipe 900. The heat dissipation sections 910 divide the coolant, allowing it to exchange heat with the outside environment through them, and have a large heat exchange area. This results in a lower temperature of the coolant returning to the coolant tank 700, which is more conducive to subsequent cooling and improves the heat dissipation effect on the heat sink 200.

[0050] The working principle and effect of the temperature control system in this embodiment are the same as those in Embodiment 1.

[0051] Example 3

[0052] Embodiment 3 of a temperature control system for a printhead, based on Embodiment 1, such as... Figure 2 As shown, it also includes a heat exchanger 210 mounted on the heat sink 200. The heat exchanger 210 is mounted on the side of the heat sink 200 away from the thermoelectric cooler 100 and is provided with multiple heat exchange fins.

[0053] The print head operates within the forming chamber. When the print head is at a low temperature, the forming chamber is also at a low temperature. When the print head heats up, the forming chamber also heats up. Therefore, the heat exchanger 210 increases its contact with the air in the forming chamber through heat exchange fins, which can accelerate the heat exchange between the heat exchanger 210 and the air in the forming chamber. During cooling, this further accelerates the heat dissipation efficiency of the heat sink 200, thereby improving the cooling efficiency of the semiconductor cooling chip 100.

[0054] In this embodiment, the heat sink 200 is provided with a cavity for accommodating the thermoelectric cooler 100. The thermoelectric cooler 100 is installed in the cavity, resulting in a larger contact area with the heat sink 200 and better heat dissipation.

[0055] The working principle and effect of the temperature control system in this embodiment are the same as those in Embodiment 1.

[0056] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A temperature control system for a printhead, characterized in that, The device includes a thermoelectric cooler (100), a heat sink (200) attached to one end of the thermoelectric cooler (100), a printhead temperature control block (300) attached to the other end of the thermoelectric cooler (100), a temperature control unit (400) electrically connected to the thermoelectric cooler (100), and an external coolant circulation assembly connected to the heat sink (200); the printhead temperature control block (300) is used to mount the printhead; and the heat sink (200) has a coolant flow channel (500). The coolant circulation assembly includes a coolant tank (700), a pump body (800), and a radiator (600) connected in sequence. The pump body (800) delivers the coolant in the coolant tank (700) to the radiator (600) for heat dissipation and then supplies it to the coolant flow channel (500), and then it flows back to the coolant tank (700).

2. The temperature control system for a printhead according to claim 1, characterized in that, The outlet of the coolant tank (700) is connected to the pump body (800), the pump body (800) is connected to the inlet of the radiator (600), the outlet of the radiator (600) is connected to the inlet of the coolant channel (500), and the inlet of the coolant tank (700) is connected to the outlet of the coolant channel (500).

3. A temperature control system for a printhead according to claim 1, characterized in that, The radiator (600) includes a housing (610), heat dissipation fins installed inside the housing (610) and heat dissipation channels penetrating the heat dissipation fins, and a fan (620) installed on the outside of the housing (610); the air outlet or air inlet of the fan (620) faces the gap between the heat dissipation fins; the pump body (800) is connected to the liquid inlet of the heat dissipation channel, and the liquid outlet of the heat dissipation channel is connected to the liquid inlet of the coolant channel (500).

4. A temperature control system for a printhead according to claim 1, characterized in that, The coolant tank (700) is equipped with a level gauge (710).

5. A temperature control system for a printhead according to claim 4, characterized in that, The top of the coolant tank (700) is provided with a mounting hole (720) that communicates with the interior of the tank. The level gauge (710) is installed in the mounting hole (720) and inserted into the interior of the tank.

6. A temperature control system for a printhead according to claim 1, characterized in that, The inlet of the coolant tank (700) is connected to the outlet of the coolant flow channel (500) via a return pipe (900). The return pipe (900) has at least one straight section, on which a heat dissipation part (910) is provided, which is distributed circumferentially along the return pipe (900). The heat dissipation part (910) is partially located inside the return pipe (900) and partially located outside the return pipe (900).

7. A temperature control system for a printhead according to any one of claims 1-6, characterized in that, It also includes a heat exchanger (210) installed on the heat sink (200).

8. A temperature control system for a printhead according to claim 7, characterized in that, The heat exchanger (210) is installed on the side of the heat sink (200) away from the semiconductor cooling chip (100).

9. A temperature control system for a printhead according to claim 7, characterized in that, The heat exchanger (210) is provided with multiple heat dissipation fins.

10. A temperature control system for a printhead according to any one of claims 1-6, characterized in that, The printhead temperature control block (300) is provided with a receiving cavity (310) for accommodating the printhead, and the side wall of the printhead temperature control block (300) is provided with a connecting plane for attaching to the other end of the semiconductor cooling chip (100).

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