Display device

Abstract

The present disclosure relates to the technical field of display, and discloses a display device; the display device comprises a display panel, a circuit board assembly, a first heat insulation structure and a second heat insulation structure; the display panel has a display surface and a non-display surface arranged oppositely; the circuit board assembly is arranged on the side of the non-display surface away from the display panel, and the circuit board assembly has a first region and a second region, and the heat generation of the second region is greater than that of the first region; the first heat insulation structure is arranged between the circuit board assembly and the display panel and located in the first region; the second heat insulation structure is arranged between the circuit board assembly and the display panel and located in the second region; and the heat insulation performance of the second heat insulation structure is stronger than that of the first heat insulation structure. The second region with greater heat generation of the display device can well block the heat transfer path through the second heat insulation structure, reduce or even avoid the appearance of local hot spots on the front surface of the display panel, avoid affecting the service life uniformity of the display panel, and has low cost.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more specifically, to a display device. Background Technology

[0002] Currently, OLED (Organic Light Emitting Display) panels are widely used as display components in various electronic products. The flexibility and finer display performance of OLED panels, coupled with the technological advancements and intelligence of future aircraft, make OLED panels highly favored in aviation entertainment screens.

[0003] However, due to the stringent reliability standards of aviation products, as well as the requirements for ultra-narrow bezels, ultra-thin designs, and comfortable user experience, higher demands are placed on aviation OLED display devices. To maintain an ultra-thin body and ultra-narrow bezels, circuit board assemblies need to be attached to the back of the display panel. However, due to the high integration of the circuit board assemblies and the large number of heat-generating components, coupled with the high heat generation of the display panel itself, the heat from these components accumulates after the circuit board assemblies are folded back, causing localized hot spots on the front of the display panel. This affects the uniformity of the display panel's lifespan and results in a high temperature rise, leading to a poor user experience.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a display device.

[0006] According to one aspect of this disclosure, a display device is provided, comprising:

[0007] The display panel has a display surface and a non-display surface that are set relative to each other.

[0008] A circuit board assembly is disposed on the side of the non-display surface opposite to the display panel. The circuit board assembly has a first region and a second region, wherein the heat generation of the second region is greater than that of the first region.

[0009] A first heat insulation structure is disposed between the circuit board assembly and the display panel, and is located in the first region;

[0010] A second heat insulation structure is disposed between the circuit board assembly and the display panel, and is located in the second region; the heat insulation performance of the second heat insulation structure is stronger than that of the first heat insulation structure.

[0011] In one exemplary embodiment of this disclosure, the circuit board assembly includes a printed circuit board and a heat-generating component, the heat-generating component being disposed on the side of the printed circuit board opposite to the display panel.

[0012] In one exemplary embodiment of this disclosure, the second thermal insulation structure includes:

[0013] A heat dissipation layer is disposed on the side of the non-display surface opposite to the display panel, and the heat dissipation layer is used to evenly distribute the heat transferred to the heat dissipation layer;

[0014] A heat insulation plate is disposed on the side of the heat dissipation layer away from the display panel. An air gap is provided between the heat insulation plate and the printed circuit board. The air gap is disposed opposite to the heat-generating components.

[0015] In one exemplary embodiment of this disclosure, the orthographic projection of the heat-spreading layer on the display panel is located within the orthographic projection of the heat insulation plate on the display panel.

[0016] In one exemplary embodiment of this disclosure, the second thermal insulation structure further includes:

[0017] A reflective layer is disposed on the side of the heat insulation plate near the air gap, and the reflective layer is used to reflect the heat radiated by the circuit board assembly.

[0018] In one exemplary embodiment of this disclosure, the reflective layer is a metal layer or a metal plating layer.

[0019] In one exemplary embodiment of this disclosure, the second thermal insulation structure further includes:

[0020] A low-emissivity layer is disposed on the side of the printed circuit board near the air gap, and the emissivity of the low-emissivity layer is less than 0.1.

[0021] In one exemplary embodiment of this disclosure, the low-emissivity layer is exposed copper on the printed circuit board, or the low-emissivity layer is a metal layer or metal plating disposed on the side of the printed circuit board near the display panel.

[0022] In one exemplary embodiment of this disclosure, the display device further includes:

[0023] The second adhesive portion is bonded between the non-display surface and the side of the circuit board assembly near the display panel, and is used to fix the second heat insulation structure.

[0024] In one exemplary embodiment of this disclosure, the second adhesive portion is configured as an annular shape and is adhered to the outer periphery of the second thermal insulation structure so that the air gap forms a sealed structure.

[0025] In one exemplary embodiment of this disclosure, the circuit board assembly has an electrical connection portion on the side near the display panel, and the first heat insulation structure includes:

[0026] A shielding layer is disposed between the electrical connection portion and the display panel;

[0027] The first adhesive portion is bonded between the non-display surface and the side of the circuit board assembly near the display panel, and is used to fix the shielding layer.

[0028] In one exemplary embodiment of this disclosure, the first adhesive portion is configured as annular and is adhered to the outer periphery of the shielding layer.

[0029] The display device disclosed herein, on the one hand, has a first heat insulation structure located in a first region, disposed between the circuit board assembly and the display panel. This first heat insulation structure isolates the circuit board assembly from the display panel, reducing or even preventing the transfer of heat generated by the circuit board assembly to the display panel. On the other hand, a second heat insulation structure is located in a second region, disposed between the circuit board assembly and the display panel. This second heat insulation structure isolates the circuit board assembly from the display panel, reducing or even preventing the transfer of heat generated by the circuit board assembly to the display panel. Furthermore, the heat generation in the second region is greater than that in the first region. The heat insulation performance of the second heat insulation structure is stronger than that of the first heat insulation structure, allowing the second heat insulation structure to effectively block the heat transfer path in the heat-generating second region, reducing or even preventing the transfer of heat generated by the circuit board assembly to the display panel, reducing or even preventing the appearance of localized hot spots on the front of the display panel, and avoiding affecting the lifespan uniformity of the display panel. Additionally, although the heat insulation performance of the first heat insulation structure is weaker, its cost is lower, thereby reducing the cost of the display device.

[0030] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0032] Figure 1 This is a schematic diagram of an example embodiment of the display device disclosed herein.

[0033] Figure 2 This is a schematic diagram of another example embodiment of the display device disclosed herein.

[0034] Figure 3 for Figure 2 A schematic diagram of the structure in which the second thermal insulation structure and the second adhesive part are fitted together.

[0035] Figure 4 for Figure 2 A top view of the second heat insulation structure, the second adhesive part, and the heating element in combination.

[0036] Figure 5 for Figure 2 A schematic diagram of the structure in which the first thermal insulation structure and the electrical connection part are combined.

[0037] Figure 6 for Figure 2 A top view of the first thermal insulation structure.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1. Display panel;

[0040] 2. Circuit board assembly; 21. First area; 22. Second area; 23. Printed circuit board; 231. Electrical connection part; 24. Heating component;

[0041] 3. First thermal insulation structure; 31. Shielding layer; 32. First adhesive part;

[0042] 4. Second thermal insulation structure; 41. Heat dissipation layer; 42. Thermal insulation board; 43. Air gap; 44. Reflective layer; 45. Low-emissivity layer;

[0043] 5. Second adhesive part. Detailed Implementation

[0044] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0045] Although relative terms such as "up" and "down" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples shown in the accompanying drawings. It is understood that if the device of the icon is flipped upside down, the component described as "up" will become the component described as "down." When a structure is "up" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0046] The terms “a,” “one,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” and “third,” etc., are used only as markers and are not a limitation on the number of objects.

[0047] In this application, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. "And / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Furthermore, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0048] This disclosure provides an exemplary embodiment of a display device, with reference to... Figures 1-6 As shown, the display device may include a display panel 1, a circuit board assembly 2, a first heat insulation structure 3, and a second heat insulation structure 4; the display panel 1 has a display surface and a non-display surface disposed opposite to each other; the circuit board assembly 2 is disposed on the side of the non-display surface away from the display panel 1, and the circuit board assembly 2 has a first region 21 and a second region 22, the heat generation of the second region 22 is greater than the heat generation of the first region 21; the first heat insulation structure 3 is disposed between the circuit board assembly 2 and the display panel 1, and is located in the first region 21; the second heat insulation structure 4 is disposed between the circuit board assembly 2 and the display panel 1, and is located in the second region 22; the heat insulation performance of the second heat insulation structure 4 is stronger than that of the first heat insulation structure 3.

[0049] The display device disclosed herein includes, on the one hand, a first heat insulation structure 3 located in a first region 21, which is disposed between the circuit board assembly 2 and the display panel 1. The first heat insulation structure 3 can isolate the circuit board assembly 2 from the display panel 1, reducing or even preventing the heat generated by the circuit board assembly 2 from being transferred to the display panel 1. On the other hand, a second heat insulation structure 4 located in a second region 22, which is disposed between the circuit board assembly 2 and the display panel 1. The second heat insulation structure 4 can isolate the circuit board assembly 2 from the display panel 1, reducing or even preventing the heat generated by the circuit board assembly 2 from being transferred to the display panel 1. On the other hand, the heat generated in the second region 22 is greater than that in the first region 21. The heat insulation performance of the second heat insulation structure 4 is stronger than that of the first heat insulation structure 3. This allows the second region 22, which generates more heat, to effectively block the heat transfer path through the second heat insulation structure 4, reducing or even preventing the heat generated by the circuit board assembly 2 from being transferred to the display panel 1. This reduces or even prevents the appearance of local hot spots on the front of the display panel 1, thus avoiding affecting the lifespan uniformity of the display panel 1. In addition, although the heat insulation performance of the first heat insulation structure 3 is weaker, the cost of the first heat insulation structure 3 is lower, thereby reducing the cost of the display device.

[0050] The display panel 1 can be an OLED (Organic Electroluminescence Display) display panel 1, a QLED (Quantum Dot Light Emitting Diodes) display panel 1, a Micro-LED (Micro-light emitting diode) display panel 1, etc.; the display panel 1 has a light-emitting side and a non-light-emitting side, which are arranged opposite to each other. The light-emitting side can display the image, and the side displaying the image is called the display surface. The non-light-emitting side, which is arranged opposite to the display surface, is called the non-display surface.

[0051] In this example embodiment, taking OLED display panel 1 as an example, display panel 1 may include display back panel, touch layer group, color filter layer and cover plate.

[0052] The display backplane may include a substrate, a driving layer assembly, and light-emitting devices. The driving layer assembly can drive the light-emitting devices to emit light. The driving layer assembly is disposed on one side of the substrate, and the light-emitting devices are disposed on the side of the driving layer assembly opposite to the substrate.

[0053] The driving layer group may include multiple switching units, which may include multiple thin film transistors and capacitors, and the multiple switching units are arranged in an array; a first planarization layer is provided on the side of the multiple switching units away from the substrate, and the first planarization layer provides a relatively flat base surface for the film layer to be formed subsequently.

[0054] A light-emitting device is disposed on the side of the first planarization layer away from the substrate. The light-emitting device may include a first electrode, a pixel definition layer, a light-emitting layer group, and a second electrode.

[0055] Specifically, a first electrode is disposed on the side of the first planarization layer away from the substrate, and the first electrode is connected to the source electrode of the driving backplate. The first electrode can be an anode.

[0056] A pixel definition layer is disposed on the side of the first electrode facing away from the substrate. A via is disposed on the pixel definition layer, and a light-emitting layer group is disposed within the via. A second electrode is disposed on the side of the light-emitting layer group facing away from the substrate. The second electrode can be a cathode, and the second electrode is connected to the ground line VSS.

[0057] The display backplane may also include an encapsulation layer group. An encapsulation layer group is provided on the side of the second electrode away from the substrate. The encapsulation layer group is used to encapsulate the light-emitting device to prevent external moisture, impurities, etc. from entering the interior of the light-emitting device and affecting the display effect of the light-emitting device.

[0058] In this example embodiment, a touch layer group is provided on the side of the encapsulation layer group facing away from the substrate, so that the touch layer group is located on the display side of the display back panel, and touch functionality can be realized through the touch layer group. Of course, if touch functionality is not required, the touch layer group may not be provided.

[0059] A color filter layer is disposed on the side of the touch layer group facing away from the substrate. The color filter layer may include a red filter, a blue filter, a green filter, and a black matrix disposed between adjacent filters. Color display can be achieved through the color filter layer. Of course, in some other exemplary embodiments of this disclosure, a color filter layer may not be provided, and color display may be achieved through each sub-pixel itself.

[0060] A cover plate can be provided on the side of the color filter layer that faces away from the display back panel to protect the display surface of the entire display panel 1.

[0061] A heat dissipation film is provided on the non-display surface of the display back panel, which is opposite to the display surface. The heat dissipation film can dissipate the heat emitted by the display panel 1 to the outside.

[0062] The display panel 1 has a display surface and a non-display surface, which are arranged opposite to each other. The side that displays the image is the display surface. Specifically, the side of the cover plate that faces away from the heat dissipation film is the display surface, and the side of the heat dissipation film that faces away from the cover plate is the non-display surface.

[0063] The circuit board assembly 2 is electrically connected to the display panel 1. Specifically, the display panel 1 is provided with a plurality of first bonding pins, and the printed circuit board 23 of the circuit board assembly 2 is provided with a plurality of second bonding pins. The plurality of second bonding pins are bonded to the plurality of first bonding pins, thereby making the circuit board assembly 2 electrically connected to the display panel 1.

[0064] Furthermore, the circuit board assembly 2 is located on the side of the non-display surface away from the display panel 1, that is, the circuit board assembly 2 is bent to the side of the non-display surface of the display panel 1, so that the circuit board assembly 2 does not occupy the bezel of the display device, thereby achieving a narrow bezel.

[0065] Reference Figure 1 and Figure 2 As shown, the circuit board assembly 2 may include a printed circuit board 23 and a heat-generating component 24. The printed circuit board 23 may be a flexible circuit board, allowing the circuit board assembly 2 to be bent to the non-display surface of the display panel 1. The heat-generating component 24 may include a display driver chip, a touch driver chip, a power integrated circuit, etc. Of course, in some other exemplary embodiments of this disclosure, the printed circuit board 23 may also be a rigid circuit board, and the printed circuit board 23 and the display panel 1 may be connected by a flexible circuit board, which may be bent so that the circuit board assembly 2 is located on the non-display surface facing away from the display panel 1.

[0066] The heat-generating component 24 can be disposed on the side of the printed circuit board 23 away from the display panel 1, so that the heat-generating component 24 is far away from the display panel 1, thereby minimizing the heat generated by the heat-generating component 24 from being transferred to the display panel 1 and reducing the impact on the display panel 1. Of course, in some other exemplary embodiments of this disclosure, the heat-generating component 24 can also be disposed on the side of the printed circuit board 23 closer to the display panel 1 to reduce the area of ​​the circuit board assembly 2.

[0067] The circuit board assembly 2 has a first region 21 and a second region 22. The number of first regions 21 and the number of second regions 22 can be set as needed, and can be one, two, three or more; moreover, the number of first regions 21 and the number of second regions 22 can be the same or different.

[0068] The heat generation of the second region 22 is greater than that of the first region 21. For example, a heating element 24 can be provided in the second region 22, while no heating element 24 is provided in the first region 21, thus making the heat generation of the second region 22 greater than that of the first region 21. Alternatively, heating elements 24 can be provided in both the first and second regions 21, but the heat generation of the heating elements 24 in the first region 21 is less than that in the second region 22. Another possibility is that heating elements 24 can be provided in both the first and second regions 21, but the number of heating elements 24 in the first region 21 is less than the number of heating elements 24 in the second region 22, meaning the density of heating elements 24 in the first region 21 is lower and easier to dissipate heat, while the density of heating elements 24 in the second region 22 is higher and harder to dissipate heat. Furthermore, the second and third scenarios described above can coexist.

[0069] A first heat insulation structure 3 is provided in the first region 21, that is, the first heat insulation structure 3 is located in the first region 21. The first heat insulation structure 3 is located between the circuit board assembly 2 and the display panel 1. The first heat insulation structure 3 can isolate the circuit board assembly 2 and the display panel 1, reduce or even avoid the heat generated by the circuit board assembly 2 from being transferred to the display panel 1, reduce or even avoid the occurrence of local hot spots on the front of the display panel 1, and avoid affecting the lifespan uniformity of the display panel 1.

[0070] A second heat insulation structure 4 is provided in the second region 22, that is, the second heat insulation structure 4 is located in the second region 22; the second heat insulation structure 4 is located between the circuit board assembly 2 and the display panel 1. The second heat insulation structure 4 can isolate the circuit board assembly 2 and the display panel 1, reduce or even avoid the heat generated by the circuit board assembly 2 from being transferred to the display panel 1, reduce or even avoid the occurrence of local hot spots on the front of the display panel 1, and avoid affecting the lifespan uniformity of the display panel 1.

[0071] Furthermore, the heat insulation performance of the second heat insulation structure 4 is stronger than that of the first heat insulation structure 3. Since the heat generation of the second region 22 is greater than that of the first region 21, setting the heat insulation performance of the second heat insulation structure 4 to be stronger than that of the first heat insulation structure 3 allows the second heat insulation structure 4 to effectively block the heat transfer path of the heat-generating second region 22, reducing or even preventing the heat generated by the circuit board assembly 2 from being transferred to the display panel 1. This reduces or even prevents the appearance of localized hot spots on the front of the display panel 1, avoiding any impact on the lifespan uniformity of the display panel 1. Additionally, although the heat insulation performance of the first heat insulation structure 3 is weaker, its cost is lower, thereby reducing the cost of the display device.

[0072] Specifically, refer to Figure 1As shown, the second heat insulation structure 4 may include a heat dissipation layer 41, a heat insulation plate 42, and an air gap 43. The heat dissipation layer 41 is disposed on the side of the non-display surface away from the display panel 1. For example, the heat dissipation layer 41 may be attached to the non-display surface of the display panel 1. The material of the heat dissipation layer 41 may be a material with high thermal conductivity, such as graphite or copper foil. That is, the heat dissipation layer 41 may be a film layer with high thermal conductivity, such as a graphite layer or copper foil, so that the heat transferred to the heat dissipation layer 41 can be quickly transferred to all parts of the heat dissipation layer 41. In other words, the heat dissipation layer 41 is used to evenly distribute the heat transferred to the heat dissipation layer 41, so that the heat transferred to the heat dissipation layer 41 can be evenly distributed in all parts of the heat dissipation layer 41, avoiding the phenomenon of local hot spots on the front of the display panel 1 caused by heat concentration in a certain part, thereby improving the display uniformity and lifespan of the display device. Of course, in some other example embodiments of this disclosure, the heat dissipation layer 41 may not be attached to the non-display surface of the display panel 1, that is, a gap may also be provided between the heat dissipation layer 41 and the non-display surface of the display panel 1. The thickness of the heat spreader 41 is approximately 0.1 mm.

[0073] The second heat insulation structure 4 is set only in the second region 22, which makes the area of ​​the heat dissipation layer 41 smaller and the area of ​​the graphite layer of the heat dissipation layer 41 smaller, thus reducing costs; moreover, the smaller area of ​​the graphite layer makes it less prone to delamination, peeling, and flaking, thereby improving the robustness of the second heat insulation structure.

[0074] A heat insulation plate 42 is disposed on the side of the heat dissipation layer 41 facing away from the display panel 1. For example, the heat insulation plate 42 can be attached to the side of the heat dissipation layer 41 facing away from the display panel 1. The heat insulation plate 42 can be made of materials with good heat insulation properties, such as foam, polystyrene foam, or fiberboard. The heat insulation plate 42 can minimize the heat transfer generated by the circuit board assembly 2 to the display panel 1, reduce or even avoid the occurrence of local hot spots on the front of the display panel 1, and avoid affecting the lifespan uniformity of the display panel 1. The thickness of the heat insulation plate 42 is approximately 0.2 mm.

[0075] An air gap 43 is provided between the heat insulation plate 42 and the printed circuit board 23, and the air gap 43 is positioned opposite to the heat-generating component 24. The thermal conductivity of gas is much lower than that of solid, so the air gap 43 is a good heat insulation structure. Through the air gap 43, the heat generated by the circuit board assembly 2 can be further reduced to be transferred to the display panel 1, reducing or even avoiding the occurrence of local hot spots on the front of the display panel 1, and avoiding affecting the lifespan uniformity of the display panel 1.

[0076] Furthermore, the orthographic projection of the heat dissipation layer 41 on the display panel 1 is located within the orthographic projection of the heat insulation plate 42 on the display panel 1. For example, the orthographic projection of the heat dissipation layer 41 on the display panel 1 may coincide with the orthographic projection of the heat insulation plate 42 on the display panel 1, or the orthographic projection of the heat insulation plate 42 on the display panel 1 may cover and be larger than the orthographic projection of the heat dissipation layer 41 on the display panel 1. This allows the heat insulation plate 42 to completely cover the heat dissipation layer 41, preventing the heat dissipation layer 41 from connecting with the air gap 43 and preventing heat from being transferred to the heat dissipation layer 41 through the air gap 43.

[0077] Furthermore, experiments showed that without the air gap 43, most of the heat generated by the circuit board assembly 2 was transferred to the display panel 1 via thermal transfer, resulting in a higher temperature for the display panel 1. With the air gap 43 in place, only a small portion of the heat generated by the circuit board assembly 2 was transferred to the display panel 1, preventing the display panel 1 from becoming too hot.

[0078] Optional, refer to Figures 2-4 As shown, the second heat insulation structure 4 may further include a reflective layer 44, which is disposed on the side of the heat insulation plate 42 near the air gap 43, such that the reflective layer 44 is disposed between the heat insulation plate 42 and the air gap 43. Specifically, the reflective layer 44 is disposed on the side of the heat insulation plate 42 away from the display panel 1. For example, the reflective layer 44 may be attached to the side of the heat insulation plate 42 away from the display panel 1.

[0079] The reflective layer 44 is used to reflect the heat radiated by the circuit board assembly 2. There are three main ways of heat transfer between objects: conduction, convection and radiation. The heat transfer of the air gap 43 is mainly through convection and radiation. The reflective layer 44 can reflect the heat radiated by the circuit board assembly 2, thereby reducing or even avoiding the heat conduction method, further reducing the heat generated by the circuit board assembly 2 from being transferred to the display panel 1, reducing or even avoiding the appearance of local hot spots on the front of the display panel 1, and avoiding affecting the lifespan uniformity of the display panel 1.

[0080] The reflective layer 44 has a high reflectivity, which is the ratio of the radiant energy reflected from the surface of an object to the radiant energy received. The high reflectivity of the reflective layer 44 allows it to reflect most or even all of the received radiant energy.

[0081] The reflective layer 44 can be a metal layer or a metal plating layer. That is, the reflective layer 44 can be a single metal layer structure or a double-layer structure with a metal plating layer electroplated on other non-metallic layers. Of course, the reflective layer 44 can also be other structures, which will not be described in detail here.

[0082] Moreover, experiments have shown that when the reflective layer 44 is provided, it has the characteristics of low surface emissivity and high reflectivity, which reflects heat back to the circuit board assembly 2, so that the temperature of the display panel 1 is less affected by the circuit board assembly 2, and the temperature of the display panel 1 is significantly lower than that of the structure without the reflective layer 44.

[0083] Optional, refer to Figures 2-4 As shown, the second heat insulation structure 4 may further include a low-emissivity layer 45. The low-emissivity layer 45 is disposed on the side of the printed circuit board 23 near the air gap 43, such that the low-emissivity layer 45 is disposed between the air gap 43 and the printed circuit board 23. Specifically, the low-emissivity layer 45 is disposed on the side of the printed circuit board 23 near the display panel 1. For example, the low-emissivity layer 45 may be attached to the side of the printed circuit board 23 near the display panel 1. The emissivity of the low-emissivity layer 45 is less than 0.1. For example, the emissivity of the low-emissivity layer 45 may be 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, etc.

[0084] Emissivity is a measure of the relative strength of an object's surface in the form of radiation. The lower the emissivity, the weaker the object's surface is in the form of radiation. Therefore, the low emissivity of the low emissivity layer 45 is relatively small. After the heat from the heat-generating component 24 is transferred to the back of the printed circuit board 23, the low emissivity layer 45 can effectively reduce the heat radiation to the back of the display panel 1, thereby further reducing the heat transferred to the display panel 1.

[0085] Specifically, the low-emissivity layer 45 can be exposed copper on the printed circuit board 23, that is, the copper conductor layer of the printed circuit board 23 on the side close to the display panel 1 and located in the second region 22 is exposed and not covered by the insulating layer, forming exposed copper. The surface emissivity of the exposed copper is about 0.03, which is very small.

[0086] Of course, in some other exemplary embodiments of this disclosure, the low-emissivity layer 45 can be a metal layer or a metal plating layer disposed on the printed circuit board 23 near the display panel 1. That is, the low-emissivity layer 45 can be a single-layer metal layer structure, or a double-layer structure in which a metal plating layer is electroplated on other non-metallic layers. Of course, the low-emissivity layer 45 can also be other structures, which will not be described one by one here. For example, the low-emissivity layer 45 can be copper foil, the surface emissivity of which is about 0.03, which is very small; the low-emissivity layer 45 can also be aluminum foil, the surface emissivity of which is about 0.03, which is also very small.

[0087] The side of the printed circuit board 23 closest to the display panel 1 is made of FR-4 epoxy glass cloth laminate. The FR-4 epoxy glass cloth laminate will radiate the heat generated by the circuit board assembly 2 to the display panel 1. The low-emissivity layer 45 can prevent the FR-4 epoxy glass cloth laminate from radiating the heat generated by the circuit board assembly 2 to the display panel 1 through the air gap 43, thereby further reducing the heat transferred to the display panel 1.

[0088] In this example embodiment, the display device further includes a second adhesive portion 5, which is bonded between the non-display surface and the side of the circuit board assembly 2 near the display panel 1, and is used to fix the second heat insulation structure 4. The second adhesive portion 5 ensures the strong adhesion between the display panel 1 and the circuit board assembly 2.

[0089] The material of the second adhesive part 5 can be pressure-sensitive adhesive (PSA).

[0090] The second adhesive portion 5 has a first end face and a second end face disposed opposite to each other. The first end face is bonded to the non-display surface, and the second end face is bonded to the side of the circuit board assembly 2 near the display panel 1. The second adhesive portion 5 can be configured as a ring shape, and the second adhesive portion 5 also has an inner ring surface, which is bonded to the outer periphery of the second heat insulation structure 4 to fix the second heat insulation structure 4.

[0091] Furthermore, the second adhesive portion 5 enables the air gap 43 to form a sealed structure, for example, referring to Figure 1 As shown, a portion of the second adhesive portion 5 may be located between the circuit board assembly 2 and the heat insulation plate 42, and surrounds the air gap 43. The thickness of the second adhesive portion 5 located between the circuit board assembly 2 and the heat insulation plate 42 is approximately 0.3 mm, and the thickness of the remaining portion is approximately 0.7 mm. (Refer to...) Figure 2 As shown, a portion of the second adhesive part 5 may be located between the reflective layer 44 and the low-emissivity layer 45, and surround the air gap 43. The thickness of the second adhesive part 5 located between the reflective layer 44 and the low-emissivity layer 45 is approximately 0.3 mm, and the thickness of the remaining portion is approximately 0.7 mm. This meets the requirement of a relatively thin overall thickness.

[0092] The heat transfer mode of the air gap 43 is mainly convection and radiation. Setting the air gap 43 as a sealed structure can reduce the heat transfer by convection, thereby further reducing the heat transferred from the circuit board assembly 2 to the display panel 1 and improving the heat insulation effect of the second heat insulation structure 4.

[0093] In this example implementation, refer to Figure 1 , Figure 2 , Figure 5 and Figure 6As shown, an electrical connection portion 231 is provided on the side of the printed circuit board 23 near the display panel 1. The electrical connection portion 231 can be exposed copper on the printed circuit board 23, that is, the copper conductor layer of the part of the printed circuit board 23 near the display panel 1 and located in the first region 21 is exposed and not covered by the insulating layer to form the electrical connection portion 231.

[0094] The first heat insulation structure 3 may include a shielding layer 31 and a first adhesive portion 32. The shielding layer 31 is disposed between the electrical connection portion 231 and the display panel 1. The shielding layer 31 may be conductive cloth, copper foil, aluminum foil, etc. The printed circuit board 23 can be grounded through the shielding layer 31.

[0095] The first adhesive part 32 is bonded between the non-display surface and the side of the circuit board assembly 2 near the display panel 1, and is used to fix the shielding layer 31.

[0096] Specifically, the first adhesive portion 32 can be configured as a ring. One side of the first adhesive portion 32 is bonded to the non-display surface, and the other side is bonded to the side of the circuit board assembly 2 closest to the display panel 1. The first adhesive portion 32 can achieve the bonding and fixation between the circuit board assembly 2 and the display panel 1. Moreover, the inner ring surface of the first adhesive portion 32 is bonded to the outer peripheral surface of the shielding layer, that is, the first adhesive portion 32 is bonded to the outer periphery of the shielding layer, thereby fixing the shielding layer 31. The first adhesive portion 32 can ensure the firmness of the bonding between the display panel 1 and the circuit board assembly 2, preventing defects such as detachment and warping.

[0097] The material of the first adhesive portion 32 can be pressure-sensitive adhesive (PSA). The thickness of the first adhesive portion 32 is approximately 1 mm, and the thickness of the shielding layer 31 is also approximately 1 mm.

[0098] This display device is suitable for aircraft and meets the stringent reliability standards for aviation products, such as ultra-narrow bezels, ultra-thin design, and comfortable user experience.

[0099] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A display device, characterized by comprising: The display device comprises: a display panel having a display surface and a non-display surface arranged oppositely; a circuit board assembly arranged on a side of the non-display surface away from the display panel, the circuit board assembly having a first area and a second area, the second area having a greater heat generation than the first area; a first heat insulation structure arranged between the circuit board assembly and the display panel and located in the first area; a second heat insulation structure arranged between the circuit board assembly and the display panel and located in the second area, the second heat insulation structure having a stronger heat insulation performance than the first heat insulation structure; the circuit board assembly comprising a printed circuit board and a heat-generating component, the heat-generating component arranged on a side of the printed circuit board away from the display panel; the second heat insulation structure comprising: a uniform heating layer arranged on a side of the non-display surface away from the display panel, the uniform heating layer configured to uniformly distribute heat transferred to the uniform heating layer; a heat insulation plate arranged on a side of the uniform heating layer away from the display panel, an air gap being arranged between the heat insulation plate and the printed circuit board, the air gap being arranged opposite to the heat-generating component.

2. The display device according to claim 1, wherein A normal projection of the uniform heating layer on the display panel is located within a normal projection of the heat insulation plate on the display panel.

3. The display device according to claim 1, wherein The second heat insulation structure further comprises: a reflective layer arranged on a side of the heat insulation plate close to the air gap, the reflective layer configured to reflect heat radiated by the circuit board assembly.

4. The display device according to claim 3, wherein The reflective layer is a metal layer or a metal plating layer.

5. A display device according to claim 3 or 4, characterised in that, The second heat insulation structure further comprises: a low-emissivity layer arranged on a side of the printed circuit board close to the air gap, the low-emissivity layer having an emissivity less than 0.

1.

6. The display device according to claim 5, wherein The low-emissivity layer is a copper leakage on the printed circuit board, or the low-emissivity layer is a metal layer or a metal plating layer arranged on a side of the printed circuit board close to the display panel.

7. The display device according to any one of claims 1 to 4, wherein The display device further comprises: a second adhesive portion adhered between the non-display surface and a side of the circuit board assembly close to the display panel, and configured to fix the second heat insulation structure.

8. The display device according to claim 7, wherein The second adhesive portion is arranged in a ring shape and adhered to an outer periphery of the second heat insulation structure, so that the air gap forms a sealed structure.

9. The display device according to any one of claims 1 to 4, wherein A side of the circuit board assembly close to the display panel is provided with an electrical connection portion, and the first heat insulation structure comprises: a shielding layer arranged between the electrical connection portion and the display panel; a first adhesive portion adhered between the non-display surface and the side of the circuit board assembly close to the display panel, and configured to fix the shielding layer.

10. The display device according to claim 9, wherein The first adhesive portion is arranged in a ring shape and adhered to an outer periphery of the shielding layer.

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