A fixture for reflow soldering of chips

Abstract

The present application relates to chip packaging technical field, specifically relates to a kind of for chip reflow soldering fixture. Specifically include: carrier, for carrying the substrate to be welded;Carrier is provided with a plurality of for accommodating substrate placement slot;Cover plate, for accommodating the chip package unit to be welded;Cover plate is provided with a plurality of through cover plate containing slot, containing slot and placement slot one-to-one corresponding arrangement;Carrier and cover plate buckling, containing slot is correspondingly located above placement slot;Pressing platform, pair and opposite setting in the inner wall of containing slot of cover plate opposite two sides, and extend into containing slot with the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides, and the inner wall of containing slot opposite two sides,

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and more specifically to a fixture for chip reflow soldering. Background Technology

[0002] Flip-chip technology refers to depositing solder balls on the I / O pins of a chip package, then flipping the chip over and heating it to bond the molten solder balls to the substrate. Typically, pads and solder bumps are created on the active area side of the silicon chip package unit, and then the chip package unit is interconnected with solder and circuit board materials with the chip face down, forming a stable and reliable mechanical and electrical connection. Reflow soldering is a conventional heating technique, characterized by its simplicity and efficiency.

[0003] During flip-chip bonding, both the chip package unit and the substrate will undergo some degree of warpage after being heated to high temperatures. Because the CTE (coefficient of thermal expansion) of the chip package unit and the substrate are different, their warpage deformations will also differ, easily causing misalignment between the corresponding positions of the chip package unit pins and the pads on the substrate. This can lead to variations in the metallurgical bonding morphology between the chip bumps and the substrate pads, resulting in defective products.

[0004] Therefore, a solution is needed to address the issue of inconsistent warping deformation between the chip packaging unit and the substrate during reflow soldering, which causes the corresponding positions of the chip packaging unit pins and the pads on the substrate to shift, easily leading to variations in the metallurgical bonding morphology between the chip bumps and the substrate pads, resulting in risky products. Summary of the Invention

[0005] To address the aforementioned problems, the present invention provides a fixture for chip reflow soldering, comprising: a carrier for supporting a substrate to be soldered; the carrier having a plurality of placement slots for accommodating the substrate; a cover plate for accommodating a chip packaging unit to be soldered; the cover plate having a plurality of receiving slots penetrating the cover plate, the receiving slots corresponding one-to-one with the placement slots; when the carrier and the cover plate are engaged, the receiving slots are positioned above the placement slots; and a pressure table, arranged in pairs and opposite to each other on opposite sides of the inner wall of the receiving slot of the cover plate, extending into the receiving slot away from the inner wall of the receiving slot; the pressure table includes a connecting portion connected to the inner wall of the receiving slot, the lower surface of the connecting portion being flush with the lower surface of the cover plate, and a pressure-applying portion protruding downward from the lower surface of the connecting portion.

[0006] Optionally, the pressure table is located at least in the middle of the inner wall of the receiving groove along its length.

[0007] Optionally, a deformation groove is recessed at the bottom center of the placement groove; the width of the deformation groove is the same as that of the placement groove and the length of the deformation groove is less than that of the placement groove.

[0008] Optionally, a plurality of first slots are provided around the placement slot, and a first magnet is fixedly disposed in the first slot; the first slot is located at the bottom of the carrier; a plurality of second slots are provided around the receiving slot, and a second magnet is fixedly disposed in the second slot; the second slot is located at the bottom of the cover plate and is corresponding to the first slot.

[0009] Optionally, the bottom of the vehicle is provided with a plurality of through holes; some of the through holes are located at the bottom of the deformation groove, connecting the deformation groove with the ambient air at the bottom of the vehicle; some of the through holes are located at the bottom of the placement grooves on both sides of the deformation groove, connecting the placement grooves with the ambient air at the bottom of the vehicle.

[0010] Optionally, the opening of the through hole in the deformation groove and the opening in the placement groove are configured as flared openings that gradually expand toward the deformation groove or the placement groove.

[0011] Optionally, the placement slot is provided with force application slots at the four corners, and the force application slots expand outward in a circular shape from the four corners of the placement slot.

[0012] Optionally, the carrier has an annular groove extending circumferentially around its periphery, and the bottom of the annular groove is engraved with product information markings; when the cover plate is fastened to the carrier, the cover plate exposes the annular groove.

[0013] Optionally, the annular groove is provided with a plurality of grooves at intervals along the circumference of the vehicle. The grooves communicate with the ambient air on the side of the vehicle, and the grooves form an opening on the side wall of the annular groove that communicates with the top surface of the side wall.

[0014] Optionally, the carrier is provided with a positioning post, and the cover plate has a positioning groove at a corresponding position. When the carrier and the cover plate are fastened together, the positioning post is located in the positioning groove.

[0015] The beneficial effects of this invention are as follows:

[0016] 1. The jig for chip reflow soldering provided by this invention utilizes a pressure platform disposed on the inner wall of a receiving groove on a cover plate. During reflow soldering, the cover plate and the carrier are engaged, with the receiving groove positioned above the placement groove and the pressure platform positioned above the side of the placement groove. The pressure platform applies a downward force to the substrate in the placement groove, making the warpage of the substrate more closely approximate the warpage of the chip packaging unit. This reduces the offset between the corresponding positions of the chip packaging unit pins and the pads on the substrate. This prevents variations in the metallurgical bonding morphology between the chip bumps and the substrate pads, thus avoiding the production of risky products.

[0017] 2. Furthermore, the jig for chip reflow soldering provided by the present invention has a deformation groove set in the middle of the bottom of the placement tank. During the operation, the two sides of the substrate in the placement tank are supported by the bottom of the placement tank, while the middle part located in the deformation groove is suspended and not supported. At the same time, with the downward pressure applied by the pressure table, a certain degree of downward slight deformation will be generated at this point during the processing, so that the warpage of the substrate is closer to the warpage of the chip packaging unit. This reduces the offset between the corresponding positions of the chip packaging unit pins and the pads on the substrate, and reduces the risk of changes in the metallurgical bonding morphology between the chip bumps and the substrate pads.

[0018] 3. Furthermore, the jig for chip reflow soldering provided by the present invention, through the corresponding arrangement of a first magnet located at the bottom of the carrier and a second magnet located at the bottom of the cover plate, on the one hand, makes the engagement between the cover plate and the carrier more stable and prevents relative displacement, thus avoiding defective parts caused by accidental horizontal displacement of the chip packaging unit and the substrate during processing; on the other hand, since the first magnet and the second magnet are arranged around the placement groove and the receiving groove, there is a uniform magnetic force on the substrate placed on the carrier and the chip packaging unit placed on the cover plate. Under the action of magnetic force, the substrate located at the deformation groove, lacking supporting force, while the substrates on both sides of the deformation groove have supporting force provided by the placement groove, will further deform downward, thereby making the warpage of the substrate closer to the warpage of the chip packaging unit.

[0019] 4. Furthermore, the jig for chip reflow soldering provided by the present invention, through through holes partially disposed at the bottom of the deformation groove and partially disposed at the bottom of the placement grooves on both sides of the deformation groove, allows an external vacuum suction cup system to apply force to the substrate through the through holes during processing, making the substrate in the placement grooves on both sides of the deformation groove more stably fixed in the placement grooves. At the same time, the substrate at the deformation groove is subjected to a downward force to produce greater deformation, making the warpage of the substrate closer to the warpage of the chip packaging unit. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1a This is a schematic diagram showing the warping of the chip packaging unit and the substrate at room temperature during the reflow soldering process.

[0022] Figure 1bThis is a schematic diagram illustrating the warping of the chip packaging unit and the substrate under high temperature conditions during reflow soldering.

[0023] Figure 2 This is a schematic diagram of the structure of a fixture that houses a substrate according to an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of the fixture and the cover plate when the substrate is not placed in the fixture according to an embodiment of the present invention.

[0025] Figure 4 This is a cross-sectional view of the fixture and cover plate when the substrate is not placed in the fixture according to an embodiment of the present invention.

[0026] Figure 5 This is a top view of a vehicle according to an embodiment of the present invention;

[0027] Figure 6 This is a bottom view of a vehicle according to an embodiment of the present invention;

[0028] Figure 7 This is a top view of a cover plate according to an embodiment of the present invention;

[0029] Figure 8 This is a bottom view of a cover plate according to an embodiment of the present invention;

[0030] Figure 9 This is a partial enlarged view of the pressure application part of the fixture according to an embodiment of the present invention.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1. Chip packaging unit; 2. Substrate; 3. Carrier; 31. Placement slot; 311. Force application slot; 32. Through hole; 321. Flange; 33. Deformation slot; 34. Ring groove; 35. Groove; 4. Cover plate; 41. Receiving slot; 42. Positioning slot; 5. Pressing platform; 51. Connecting part; 52. Pressing part; 6. First magnet; 7. Second magnet; 8. Positioning post. Detailed Implementation

[0033] As mentioned earlier, during flip-chip bonding, both the chip package unit and the substrate will undergo some degree of warpage after being heated to high temperatures. Because the CTE (coefficient of thermal expansion) of the chip package unit and the substrate are different, their warpage deformations also differ, which can easily cause misalignment between the corresponding positions of the chip package unit's pins and the pads on the substrate. For details, refer to... Figure 1a and Figure 1bAt room temperature, substrate 2 exhibits a smiling face warp (i.e., warping with the sides upwards and the middle downwards), while chip packaging unit 1 exhibits a crying face warp (i.e., warping with the sides downwards and the middle upwards). However, at high temperatures, both substrate 2 and chip packaging unit 1 exhibit smiling face warps. It can be seen that during reflow soldering, the warp shape of chip packaging unit 1 changes significantly, while the shape of substrate 2 changes very little. The maximum warp distance between the two changes considerably, causing the corresponding positions of the chip packaging unit's pins and the pads on the substrate to shift. This can easily lead to variations in the metallurgical bonding between the pins of chip packaging unit 1 and the pads of substrate 2, resulting in potentially defective products.

[0034] To address the aforementioned problems, the present invention provides a fixture for chip reflow soldering, comprising: a carrier for supporting a substrate to be soldered; the carrier having a plurality of placement slots for accommodating the substrate; a cover plate for accommodating a chip packaging unit to be soldered; the cover plate having a plurality of receiving slots penetrating the cover plate, the receiving slots corresponding one-to-one with the placement slots; when the carrier and the cover plate are engaged, the receiving slots are positioned above the placement slots; and a pressure table, arranged in pairs and opposite to each other on opposite sides of the inner wall of the receiving slot of the cover plate, extending into the receiving slot away from the inner wall of the receiving slot; the pressure table includes a connecting portion connected to the inner wall of the receiving slot, the lower surface of the connecting portion being flush with the lower surface of the cover plate, and a pressure-applying portion protruding downward from the lower surface of the connecting portion.

[0035] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0037] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0038] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0039] Example 1

[0040] refer to Figures 2-9 The present invention provides a fixture for chip reflow soldering, comprising:

[0041] The carrier 3 is used to support the substrate 2 to be soldered; the carrier 3 is provided with a plurality of placement slots 31 for accommodating the substrate 2; in some embodiments, the carrier 3 has a plurality of placement areas arranged in an array, and each placement area is provided with a placement slot 31.

[0042] The cover plate 4 is used to accommodate the chip packaging unit 1 to be soldered; the cover plate 4 is provided with a plurality of receiving grooves 41 that pass through the cover plate, and the receiving grooves 41 are arranged one-to-one with the placement grooves 31; when the carrier 3 is fastened to the cover plate 4, the receiving grooves 41 are located above the placement grooves 31. In some embodiments, the receiving grooves 41 are arranged in an array in the cover plate 4 and correspond one-to-one with the arrayed placement grooves 31.

[0043] The pressure table 5 is arranged in pairs and opposite to each other on the inner wall of the receiving groove 41 of the cover plate 4, and extends into the receiving groove 41 away from the inner wall of the receiving groove 41; the pressure table 5 includes a connecting part 51 connected to the inner wall of the receiving groove 41, the lower surface of the connecting part 51 is flush with the lower surface of the cover plate 4, and a pressure application part 52 is provided on the lower surface of the connecting part 51 protruding downward.

[0044] The reflow soldering fixture for chips provided in this embodiment utilizes a pressure table 5 located on the inner wall of the receiving groove 41 on the cover plate 4. During reflow soldering, the cover plate 4 and the carrier 3 are engaged, with the receiving groove 41 positioned above the placement groove 31 and the pressure table 5 positioned above the side of the placement groove 31. The pressure table 5 applies a downward force to the substrate 2 in the placement groove 31, making the warpage of the substrate 2 more similar to that of the chip packaging unit 1. This reduces the offset between the pins of the chip packaging unit 1 and the corresponding pads on the substrate 2, preventing variations in the metallurgical bonding morphology between the chip bumps and the substrate pads, thus avoiding the production of risky products.

[0045] Specifically, in this embodiment, the pressure platform 5 is located at least in the middle of the inner wall of the receiving groove 41 along its length. Since the chip packaging unit 1 has the greatest warping deformation in the middle, placing the pressure platform 5 at least in the middle of the inner wall of the receiving groove 41 along its length ensures that pressure is applied to the middle of the substrate 2, resulting in the greatest deformation at least in the middle of the substrate 2.

[0046] Further reference Figures 3-5 In this embodiment, a deformation groove 33 is recessed in the middle of the bottom of the placement groove 31; the width of the deformation groove 33 is the same as that of the placement groove 31 and the length of the deformation groove 33 is less than that of the placement groove 31.

[0047] The fixture for chip reflow soldering provided in this embodiment has a deformation groove 33 set in the middle of the bottom of the placement groove 31. During the operation, the substrate 2 in the placement groove 31 is supported on both sides by the bottom of the placement groove 31, while the middle part located in the deformation groove 33 is suspended and not supported. At the same time, with the downward pressure applied by the pressure table 5 in the middle, a certain degree of downward slight deformation will be generated at this point during the processing, so that the warping degree of the substrate 2 is closer to the warping degree of the chip packaging unit 1, thereby reducing the offset between the corresponding position of the pins of the chip packaging unit 1 and the pads on the substrate 2, and reducing the risk of changes in the metallurgical bonding morphology between the chip bumps and the substrate pads.

[0048] Further reference Figure 6 , Figure 8 as well as Figure 9 In this embodiment,

[0049] Several first slots are provided around the placement slot 31, and a first magnet 6 is fixedly installed in the first slot; the first slot is located at the bottom of the carrier 3.

[0050] Several second slots are provided around the receiving slot 41, and a second magnet 7 is fixedly installed in the second slot; the second slots are located at the bottom of the cover plate 4 and are provided corresponding to the first slot.

[0051] The reflow soldering fixture for chips provided in this embodiment, through the corresponding placement of a first magnet 6 at the bottom of the carrier 3 and a second magnet 7 at the bottom of the cover plate 4, ensures a more secure fit between the cover plate 4 and the carrier 3, preventing relative misalignment and avoiding defective parts caused by accidental horizontal displacement of the chip packaging unit 1 and the substrate 2 during processing. Furthermore, since the first magnet 6 and the second magnet 7 are positioned around the placement groove 31 and the receiving groove 41, they exert a uniform magnetic force on the substrate 2 on the carrier 3 and the chip packaging unit 1 on the cover plate 4. Under the influence of this magnetic force, the substrate 2 located at the deformation groove 33, lacking supporting force, while the substrates 2 on both sides of the deformation groove 33 receive support from the placement groove 31, will further deform downwards, making the warpage of the substrate 2 more closely resemble that of the chip packaging unit 1.

[0052] Further reference Figures 3-6 In this embodiment, the bottom of the carrier 3 is provided with a plurality of through holes 32; some of the through holes 32 are located at the bottom of the deformation groove 33, connecting the deformation groove 33 with the ambient air at the bottom of the carrier 3; some of the through holes 32 are located at the bottom of the placement grooves 31 on both sides of the deformation groove 33, connecting the placement grooves 31 with the ambient air at the bottom of the carrier 3.

[0053] The fixture for chip reflow soldering provided in this embodiment, through the through holes 32 partially located at the bottom of the deformation groove 33 and partially located at the bottom of the placement grooves 31 on both sides of the deformation groove 33, allows the substrate 2 to be applied force to the substrate 2 through the through holes 32 by means of an external vacuum suction cup system during processing. This makes the substrate 2 in the placement grooves 31 on both sides of the deformation groove 33 more stably fixed in the placement grooves 31. At the same time, the substrate 2 at the deformation groove 33 is subjected to a downward force, resulting in greater deformation, making the warpage of the substrate 2 closer to the warpage of the chip packaging unit 1.

[0054] Furthermore, refer to Figure 4 In this embodiment, the openings of the through-hole 32 in the deformation groove 33 and the placement groove 31 are configured as flared openings 321 that gradually widen toward the deformation groove 33 or the placement groove 31. This allows the negative pressure air formed by the external vacuum suction system to have a larger contact area with the substrate 2, making the substrate 2 more stably positioned on the carrier 3.

[0055] Further reference Figure 5 In this embodiment, the placement groove 31 has force-applying grooves 311 at its four corners, and the force-applying grooves 311 expand outward in a circular shape from the four corners of the placement groove 31. The force-applying grooves 311 facilitate the removal of the processed substrate 2 from the placement groove 31.

[0056] Further reference Figure 2 and Figure 5 In this embodiment, the carrier 3 has an annular groove 34 extending circumferentially around its periphery, and the bottom of the annular groove 34 is engraved with product information markings; when the cover plate 4 is fastened to the carrier 3, the annular groove 34 is exposed.

[0057] Furthermore, refer to Figure 2 and Figure 5 In this embodiment, the annular groove 34 is provided with a plurality of grooves 35 at intervals along the circumference of the carrier 3. The grooves 35 connect the annular groove 34 and the ambient air on the side of the carrier 3, and the grooves 35 form openings on the sidewall of the annular groove 34 that connect to the top surface of the sidewall. The grooves 35 make it convenient to manually apply force to the cover plate 4 when not on the machine, so that the cover plate 4 and the carrier 3 can be separated.

[0058] Further reference Figure 2 , Figure 5 , Figure 7 and Figure 8 In this embodiment, the carrier 3 is equipped with a positioning post 8, and the cover plate 4 has a positioning groove 42 at the corresponding position. When the carrier 3 and the cover plate 4 are fastened together, the positioning post 8 is located in the positioning groove 42. During the processing, the cover plate 4 moves towards the carrier 3 under the action of the driving component and gradually completes the fastening. Through the above arrangement, as the cover plate 4 moves towards the carrier 3, the positioning post 8 gradually inserts into the positioning groove 42 to ensure that the closing position of the cover plate 4 relative to the carrier 3 is accurate. This ensures that the force applied by the pressure table 5 to the substrate 2 is the same as the preset value.

[0059] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A fixture for chip reflow soldering, characterized in that, include: The carrier (3) is used to support the substrate (2) to be welded; the carrier (3) is provided with a plurality of placement slots (31) for accommodating the substrate (2); Cover plate (4) is used to accommodate the chip packaging unit (1) to be soldered; the cover plate (4) is provided with a plurality of receiving grooves (41) that pass through the cover plate (4), and the receiving grooves (41) are provided one-to-one with the placement grooves (31); when the carrier (3) is fastened to the cover plate (4), the receiving grooves (41) are located above the placement grooves (31); A pressure table (5) is arranged in pairs and opposite to each other on the inner wall of the receiving groove (41) of the cover plate (4), and extends into the receiving groove (41) away from the inner wall of the receiving groove (41); the pressure table (5) includes a connecting part (51) connected to the inner wall of the receiving groove (41), the lower surface of the connecting part (51) is flush with the lower surface of the cover plate (4), and a pressure application part (52) is provided on the lower surface of the connecting part (51) protruding downward. A deformation groove (33) is recessed in the middle of the bottom of the placement groove (31); the width of the deformation groove (33) is the same as that of the placement groove (31) and the length of the deformation groove (33) is less than that of the placement groove (31). The pressure plate (5) is located at least in the middle of the inner wall of the receiving groove (41) along its length.

2. The fixture for chip reflow soldering according to claim 1, characterized in that, A plurality of first slots are provided around the placement slot (31), and a first magnet (6) is fixedly disposed in the first slot; the first slot is located at the bottom of the carrier (3); A plurality of second slots are provided around the receiving groove (41), and a second magnet (7) is fixedly provided in the second slot; the second slot is located at the bottom of the cover plate (4) and is provided corresponding to the first slot.

3. The fixture for chip reflow soldering according to claim 1, characterized in that, The bottom of the carrier (3) is provided with a plurality of through holes (32); some of the through holes (32) are located at the bottom of the deformation groove (33) and connect the deformation groove (33) with the ambient air at the bottom of the carrier (3); some of the through holes (32) are located at the bottom of the placement grooves (31) on both sides of the deformation groove (33) and connect the placement grooves (31) with the ambient air at the bottom of the carrier (3).

4. The fixture for chip reflow soldering according to claim 3, characterized in that, The opening of the through hole (32) in the deformation groove (33) and the opening in the placement groove (31) are configured as an flared opening (321) that gradually expands toward the deformation groove (33) or the placement groove (31).

5. The fixture for chip reflow soldering according to claim 1, characterized in that, The placement groove (31) has force-applying grooves (311) at its four corners, and the force-applying grooves (311) expand outward in a circular shape from the four corners of the placement groove (31).

6. The fixture for chip reflow soldering according to claim 1, characterized in that, The carrier (3) has an annular groove (34) extending circumferentially around it, and the bottom of the annular groove (34) is engraved with product information markings; when the cover plate (4) is fastened to the carrier (3), the cover plate (4) exposes the annular groove (34).

7. The fixture for chip reflow soldering according to claim 6, characterized in that, The annular groove (34) is provided with a plurality of grooves (35) spaced apart along the circumference of the carrier (3). The grooves (35) connect the annular groove (34) and the ambient air on the side of the carrier (3), and the grooves (35) form an opening on the side wall of the annular groove (34) that connects to the top surface of the side wall.

8. The fixture for chip reflow soldering according to claim 1, characterized in that, The carrier (3) is provided with a positioning post (8), and the cover plate (4) is provided with a positioning groove (42) at the corresponding position. When the carrier (3) and the cover plate (4) are fastened together, the positioning post (8) is located in the positioning groove (42).

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