Electroplated gemstone cutting saw blade and process for manufacturing same

Abstract

The present application relates to a kind of electroplated gem cutting saw blade and its manufacturing process, belong to diamond cutting abrasive tool technical field.It includes: the sawtooth-shaped periphery of base body and diamond layer, the sawtooth-shaped periphery of the base body is inclined plane, the diamond layer is plated on the inclined plane, the diamond layer is single layer in the radial direction of the inclined plane, in the inclined plane of the single sawtooth of the base body, the area of diamond particles to be plated is electroplated layer, diamond particles in the diamond layer are wrapped and plated in the electroplated layer, in the radial direction of the inclined plane, the thickness of the electroplated layer is greater than the particle size of the diamond particles.The saw blade in the present application is light, efficiency and life are greatly improved, is suitable for thinning, meets strong or high linear speed cutting, also suitable for multi-piece scale manufacturing, and manufacturing cost is low.

Description

Technical Field

[0001] This invention relates to the field of diamond cutting abrasive technology, and in particular to an electroplated gemstone cutting saw blade and its manufacturing process. Background Technology

[0002] In existing technologies, diamond roller saw blades are commonly used for cutting and processing gemstone materials. These blades use a low-carbon steel base with radial (or angled) slots penetrating the base near its outer diameter. The base is deformed by rolling and pressing, mechanically securing the diamonds placed within the slots. Roller saw blades are characterized by their high sharpness, primarily because they have a weak grip on the diamonds. During operation, the diamonds are prone to falling off under stress, resulting in them working when the cutting edge is sharp and under low stress, and falling off when the cutting edge is dull and under high stress. Therefore, while these blades are sharp, they have a short lifespan and are unsuitable for heavy-duty or high-speed cutting. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an electroplated gemstone cutting saw blade and its manufacturing process, which addresses the shortcomings of the prior art.

[0004] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: An electroplated gemstone cutting saw blade includes: a substrate with a serrated peripheral surface and a diamond layer. The serrated peripheral surface of the substrate is an inclined surface. The diamond layer is plated on the inclined surface. The diamond layer is a single layer in the radial direction of the inclined surface. On the inclined surface of the single serration of the substrate, the area to be plated with the diamond particles is an electroplating layer. The diamond particles in the diamond layer are encapsulated and plated in the electroplating layer. In the radial direction of the inclined surface, the thickness of the electroplating layer is greater than the particle size of the diamond particles.

[0005] The beneficial effects of this invention are as follows: the serrated substrate facilitates intermittent cutting; the diamond layer coated on the beveled surface helps control the total thickness of the saw blade, enabling thinner blades; the single-layer diamond layer improves its self-sharpening properties; the diamond particles are encapsulated within the electroplated layer, and the thickness of the radial electroplated layer on the beveled surface of the saw teeth is greater than the particle size of the diamond particles, ensuring the holding force of the electroplated layer on the diamond particles. Simultaneously, the saw blade of this invention has a lighter load, significantly improved efficiency and lifespan, is suitable for thinner blades, meets the requirements for high-power or high-speed cutting, and is also suitable for large-scale multi-blade manufacturing, reducing manufacturing costs.

[0006] Based on the above technical solution, the present invention can be further improved as follows.

[0007] Furthermore, on the inclined surface of the single serration of the matrix, the difference in radius between two points circumferentially spaced by one particle diameter is greater than or equal to one-quarter of the particle diameter of the diamond particle, and less than or equal to one-half of the particle diameter of the diamond particle.

[0008] The beneficial effect of adopting the above-mentioned further solutions is that it helps to adjust the processing load and lifespan of the saw blade.

[0009] Furthermore, the diamond particles are arranged in a single row, double row, multiple rows, or a combination of single and double rows along the axial direction of the inclined surface.

[0010] The beneficial effects of adopting the above-mentioned further solutions are: it is conducive to adapting to different processing conditions according to various embodiments and reducing unnecessary wear of diamond particles.

[0011] Furthermore, along the axial direction of the inclined plane, the axial width of each row of diamond particles is greater than twice the diameter of the diamond particles and less than twice the diameter of the diamond particles.

[0012] The beneficial effect of adopting the above-mentioned further scheme is that it helps to improve the consolidation strength of diamond particles.

[0013] Furthermore, in a row of diamond particles on the inclined surface near the end face of the matrix, some diamond particles protrude from the end face of the matrix to form side edges.

[0014] The beneficial effect of adopting the above-mentioned further solution is that it helps to alternately set the side edges formed by the protruding end face of the diamond particles on the electroplating layer on the circumference of the saw blade, so that the saw blade substrate is less likely to rub against the workpiece and can work smoothly.

[0015] Furthermore, when the diamond particles are arranged in double rows, multiple rows, or multiple rows intersecting in the axial direction of the inclined surface, in the circumferential direction of the inclined surface of the single serration of the substrate, the area between two adjacent rows of diamond particles that is not coated with diamond particles is a blank coating. The width of the blank coating is greater than zero and less than twice the particle size of the diamond particles.

[0016] The beneficial effects of adopting the above-mentioned further solutions are: it helps the saw blade to form grooves to play a centering role, reduces the risk of edge breakage, and at the same time helps to enhance mechanical crushing and reduce the processing load of the saw blade.

[0017] Another technical solution of the present invention to solve the above-mentioned technical problems is as follows: a manufacturing process for an electroplated gemstone cutting saw blade, comprising the following steps:

[0018] S1: The base material is processed into a base body in one step by stamping according to the design shape of the outer peripheral sawtooth and the mounting hole;

[0019] S2: Insulate the non-electroplated areas on the slope;

[0020] S3: Assemble multiple substrates in parallel on the electrode shaft;

[0021] S4: Separate two adjacent substrates with a non-conductive partition, such that the non-conductive partition is at each point on the outer periphery of the substrate that is greater than or equal to one time the diameter of the diamond particle.

[0022] S5: Diamond particles are deposited onto the electroplating layer through an electroplating process, and the thickness of the inclined radial electroplating layer is greater than the particle size of the diamond particles to form a diamond layer.

[0023] S6: Shaping and sharpening the coated saw blade.

[0024] The beneficial effects of this invention are: stamping the substrate simplifies the process and reduces costs; insulating the non-electroplated areas helps prevent diamond particles from being plated on non-working surfaces, facilitating the orderly formation of the diamond layer; assembling multiple substrates side-by-side facilitates the simultaneous manufacturing of multiple saw blades, improving production efficiency, enabling large-scale production, and reducing manufacturing costs; the size limitation of the non-conductive separator helps restrict the thickness of the plating layer in the axial direction to meet design requirements; the electroplating process helps to solidify the diamond particles on the inclined surface of each saw tooth on the outer periphery of the substrate, and the radial electroplating layer thickness on the inclined surface of the saw teeth is greater than the particle size of the diamond particles, which helps to ensure the holding force of the diamond, so that the diamond particles are not easily detached when the saw blade is cutting at high force or high linear speed, thus achieving a long service life; shaping and sharpening help to ensure the accuracy of the saw blade and allow for break-in-free use. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure provided for an embodiment of the present invention;

[0026] Figure 2 This is an overall structural cross-sectional view provided for an embodiment of the present invention;

[0027] Figure 3 for Figure 2 A magnified structural diagram of region P in the middle;

[0028] Figure 4 This is a side view of Embodiment 1 of the present invention;

[0029] Figure 5 for Figure 4 A magnified structural diagram of region I in the middle;

[0030] Figure 6 This is a front view of the overall structure provided in an embodiment of the present invention;

[0031] Figure 7 for Figure 6A magnified structural diagram of region H in the middle;

[0032] Figure 8 for Figure 6 A magnified structural diagram of region M in the middle;

[0033] Figure 9 This is a side view of Embodiment 2 of the present invention;

[0034] Figure 10 for Figure 9 A magnified structural diagram of the N region;

[0035] Figure 11 This is a side view of Embodiment 3 of the present invention;

[0036] Figure 12 for Figure 11 A magnified structural diagram of the K region;

[0037] Figure 13 This is a side view of Embodiment 4 of the present invention;

[0038] Figure 14 for Figure 13 A magnified structural diagram of the O region in the middle;

[0039] Figure 15 This is a flowchart of the manufacturing process of the present invention.

[0040] The attached diagram lists the components represented by each number as follows:

[0041] 1. Substrate; 2. Bevel; 3. Diamond layer; 21. Electroplated layer; 22. Blank plating layer.

[0042] in, Figure 5 and Figure 10 In this context, B represents the axial width of a single row of diamond particles. Figure 10 B1 in the figure represents the width of the blank coating area; Figure 5 and Figure 7 In this context, 'b' represents the particle size of the diamond. Figure 12 b2 represents the thickness of the saw blade substrate; Figure 8 R and R1 in the matrix represent the radii of two points arbitrarily spaced one particle size apart along the circumference on a single serrated inclined surface of the matrix. Figure 3 and Figure 8 In this context, b1 represents the thickness of the electroplated layer in the radial direction of the sawtooth bevel. Detailed Implementation

[0043] The principles and features of the present invention are described below. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0044] like Figures 1 to 14As shown, an electroplated gemstone cutting saw blade includes: a substrate 1 with a serrated circumferential surface and a diamond layer 3. The serrated circumferential surface of the substrate 1 is a bevel 2. The diamond layer 3 is plated on the bevel 2. The diamond layer 3 is a single layer in the radial direction of the bevel 2. On the bevel 2 with a single serration of the substrate 1, the area to be plated with diamond particles is an electroplating layer 21. The diamond particles in the diamond layer 3 are encapsulated and plated in the electroplating layer 21. In the radial direction of the bevel 2, the thickness b1 of the electroplating layer 21 is greater than the particle size b of the diamond particles.

[0045] It should be noted that: the electroplated layer 21 is the area to be plated with diamond particles. However, when the diamond particles are actually plated onto the electroplated layer 21, because the diamond particles are randomly plated, some diamond particles will extend beyond the electroplated layer 21, causing the diamond particles to protrude from the end face of the substrate 1, such as... Figure 5 As shown.

[0046] The beneficial effects of this invention are as follows: the serrated substrate facilitates intermittent cutting; the diamond layer coated on the beveled surface helps control the total thickness of the saw blade, enabling thinner blades; the single-layer diamond layer improves its self-sharpening properties; the diamond particles are encapsulated within the electroplated layer, and the thickness of the radial electroplated layer on the beveled serration is greater than the particle size of the diamond particles, ensuring the electroplated layer's holding force on the diamond particles. Simultaneously, the substrate of this invention has a light load, significantly improved efficiency and lifespan, is suitable for thinner blades, meets the requirements for high-power or high-speed cutting, and is also suitable for large-scale multi-blade manufacturing, reducing manufacturing costs.

[0047] Preferred, such as Figure 6 and Figure 8 As shown, on the inclined surface 2 of a single serration of the matrix 1, the difference in radius R-R1 between two points circumferentially spaced by one time the particle size is greater than or equal to one-quarter the particle size b of the diamond particle, and less than or equal to one-half the particle size b of the diamond particle.

[0048] The advantages of adopting the above preferred scheme are: it helps to adjust the processing load and life of the saw blade.

[0049] Preferred, such as Figures 4 to 14 As shown, the diamond particles are arranged in a single row, double row, multiple rows, or a single row intersecting, double row intersecting, or multiple row intersecting arrangement along the axial direction of the inclined plane 2.

[0050] The advantages of adopting the above preferred solution are: it helps to adapt to different processing conditions according to various embodiments and reduces unnecessary wear of diamond particles.

[0051] Preferred, such as Figure 5 and Figure 10As shown, along the axial direction of the inclined plane 2, the axial arrangement width B of each row of diamond particles is greater than one times the particle diameter b of the diamond particles and less than twice the particle diameter b of the diamond particles.

[0052] It should be noted that, since some diamond particles extend beyond the electroplating layer 21 when they are deposited onto it, the axial width B of a single row of diamond particles refers to the distance between the top of the uppermost diamond particle and the bottom of the lowermost diamond particle within a row of diamond particles deposited by the electroplating layer 21. Figure 5 and Figure 10 As shown.

[0053] The beneficial effect of adopting the above-mentioned preferred scheme is that it helps to improve the consolidation strength of diamond particles.

[0054] Preferred, such as Figure 5 and Figure 12 As shown, in the axial direction of the inclined plane 2 near the end face of the substrate 1, some diamond particles protrude from the end face of the substrate 1 to form side edges.

[0055] It should be noted that: the side edge refers to the diamond particle that protrudes above the end face of the substrate 1, such as... Figure 5 and Figure 12 As shown.

[0056] The advantages of adopting the above-mentioned preferred solution are: it helps to alternately arrange the side edges formed by the protruding end face of the diamond particles on the electroplating layer on the circumference of the saw blade, so that the saw blade substrate is less likely to rub against the workpiece and can work smoothly.

[0057] Preferred, such as Figure 10 As shown, when the diamond particles are arranged in double rows, multiple rows, or multiple rows intersecting in the axial direction of the inclined surface 2, in the circumferential direction of the inclined surface 2 with a single serration on the substrate 1, the area between two adjacent rows of diamond particles that is not coated with diamond particles is a blank coating 22. The width B1 of the blank coating 22 is greater than zero and less than twice the particle size b of the diamond particles.

[0058] It should be noted that the width B1 of the blank coating 22 refers to the distance between the bottom of the lowest diamond particle in the upper column and the top of the highest diamond particle in the lower column, with respect to two adjacent columns of diamond particles.

[0059] The advantages of adopting the above-mentioned preferred scheme are: it helps the saw blade to form grooves to play a centering role, reduces the risk of edge breakage, and at the same time helps to enhance mechanical crushing and reduce the processing load of the saw blade.

[0060] like Figure 15 As shown, another technical solution of the present invention to solve the above-mentioned technical problem is as follows: a manufacturing process for an electroplated gemstone cutting saw blade includes the following steps:

[0061] S1: The base material is processed into base 1 in one step by stamping according to the design shape of the outer peripheral sawtooth and the mounting hole;

[0062] S2: Insulate the area of ​​the non-electroplated layer 21 on the inclined plane 2;

[0063] S3: Assemble multiple substrates 1 in parallel on the electrode shaft;

[0064] S4: Separate two adjacent substrates 1 with a non-conductive partition, such that the non-conductive partition is at each point on the outer periphery of the substrate 1 that is greater than or equal to one time the diameter of the diamond particle.

[0065] S5: Diamond particles are plated onto the electroplating layer 21 by electroplating process, and the thickness of the radial electroplating layer 21 on the inclined surface 2 is greater than the particle size of the diamond particles to form a diamond layer 3.

[0066] S6: Shaping and sharpening the coated saw blade.

[0067] It should be noted that in step S1, the selected matrix material must have high rigidity, which helps to ensure strength, meet the rigidity requirements of thin sheeting, and adapt to strong or high linear speed cutting.

[0068] The beneficial effects of this invention are: stamping the substrate simplifies the process and reduces costs; insulating the non-electroplated areas helps prevent diamond particles from being plated on non-working surfaces, facilitating the orderly formation of the diamond layer; assembling multiple substrates side-by-side facilitates the simultaneous manufacturing of multiple saw blades, improving production efficiency, enabling large-scale production, and reducing manufacturing costs; the size limitation of the non-conductive separator helps restrict the thickness of the plating layer in the axial direction to meet design requirements; the electroplating process helps to solidify the diamond particles on the inclined surface of each saw tooth on the outer periphery of the substrate, and the radial electroplating layer thickness on the inclined surface of the saw teeth is greater than the particle size of the diamond particles, which helps to ensure the holding force of the diamond, so that the diamond particles are not easily detached when the saw blade is cutting at high force or high linear speed, thus achieving a long service life; shaping and sharpening help to ensure the accuracy of the saw blade and allow for break-in-free use.

[0069] The present invention will be illustrated below through several embodiments:

[0070] Example 1.

[0071] like Figure 4 and Figure 5 As shown, the diamond particles are arranged in a single row along the axial direction of the inclined plane 2, and there is no blank coating 22.

[0072] Example 2.

[0073] like Figure 9 and Figure 10 As shown, the diamond particles are arranged in two rows along the axial direction of the inclined surface 2, that is, along the axial direction of the substrate 1, two electroplated layers 21 are arranged one-to-one at the upper and lower ends of the inclined surface 2 of the single serration of the substrate 1, and there is a non-electroplated insulating area between the two electroplated layers 21, with a blank plating layer 22 present.

[0074] Example 3.

[0075] like Figure 11 and Figure 12 As shown, the diamond particles are arranged in a double-row, intersecting pattern along the axial direction of the inclined surface 2. That is, along the axial direction of the substrate 1, on the inclined surface 2 of one tooth of the substrate 1, the upper half is an electroplated layer 21, and the lower half is an unplated insulating area. On the inclined surface 2 of adjacent teeth, the lower half is an electroplated layer 21, and the upper half is an unplated insulating area. There is no blank plating layer 22. In this embodiment, since the electroplated layers 21 are alternately arranged on the inclined surface 2 of the teeth, when diamond particles are plated on the electroplated layers 21, the parts of the diamond particles protruding from the electroplated layers 21 are alternately arranged on the circumference of the saw blade, which improves the stability of the saw blade during operation.

[0076] Example 4.

[0077] like Figure 13 and Figure 14 As shown, the diamond particles are arranged in multiple rows in a crisscross pattern along the axial direction of the inclined surface 2. That is, along the axial direction of the substrate 1, the structure shown in Embodiment 2 is arranged on the inclined surface 2 of one tooth of the substrate 1. On the inclined surface 2 of adjacent teeth, the electroplated layer 21 is disposed in the middle of the inclined surface 2, and two non-electroplated insulating areas are disposed one-to-one at the upper and lower ends of the electroplated layer 21, with blank plating layers 22 present. In this embodiment, since the electroplated layer 21 is alternately arranged on the inclined surface 2 of the teeth, when the diamond particles are plated on the electroplated layer 21, the parts of the diamond particles protruding from the electroplated layer 21 are alternately arranged on the circumference of the saw blade, which improves the stability of the saw blade during operation.

[0078] The present invention has the following main effects:

[0079] 1. By using a multi-tooth structure on the outer periphery of the saw blade, the concentration of conventional electroplated diamond abrasive is appropriately reduced, and the pressure of the working diamond is increased, thereby improving the sharpness of the saw blade and its service life under light-load processing conditions.

[0080] 2. By using a multi-tooth and beveled single-layer diamond plating method, the conventional single-layer electroplating method is changed, giving the saw blade a certain impregnation method. This avoids the characteristic of single-layer diamond electroplated saw blades on the outer circumference whose sharpness decreases exponentially with diamond passivation, making them unusable. This results in a higher average performance and longer effective life.

[0081] 3. By setting a blank coating, the workpiece material between adjacent diamond rows is mechanically crushed, which reduces the total amount of grinding by the saw blade and thus reduces the grinding load. This helps to eliminate workpiece chipping or breakage and achieve a higher yield.

[0082] 4. Since the saw blade end face does not need to be plated with diamond, it is conducive to thinning; the electroplating process of multi-blade saw blades is easy to scale up, the process is relatively simple, the efficiency is high, and the production cost is low.

[0083] 5. By stacking and fixing multiple saw blades of the same diameter together, a saw blade or parallel grinding wheel with a certain thickness can be formed for grooving or rough grinding. By stacking and fixing multiple saw blades of different diameters together, a circumferentially shaped grinding wheel with a certain thickness can be formed for rough grinding and shaping.

[0084] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0085] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0086] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0087] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0088] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0089] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A gem-plated cutting saw blade, characterized in that, include: A serrated substrate (1) and a diamond layer (3) are arranged on a serrated circumference. The serrated circumference of the substrate (1) is a slope (2). The diamond layer (3) is plated on the slope (2). The diamond layer (3) is a single layer in the radial direction of the slope (2). On the slope (2) with a single serration of the substrate (1), the area to be plated with diamond particles is an electroplating layer (21). The diamond particles in the diamond layer (3) are encapsulated and plated in the electroplating layer (21). In the radial direction of the slope (2), the thickness of the electroplating layer (21) is greater than the particle size of the diamond particles. On the inclined surface (2) of a single serration of the matrix (1), the difference in radius between two points circumferentially spaced by one time the particle size is greater than or equal to one-quarter the particle size of the diamond particle, and less than or equal to one-half the particle size of the diamond particle. On the axial direction of the inclined plane (2), the axial arrangement width of each column of diamond particles is greater than one times the particle size of the diamond particles and less than two times the particle size of the diamond particles. A row of diamond particles on the inclined surface (2) near the end face of the matrix (1) has some diamond particles protruding from the end face of the matrix (1) to form side edges.

2. The electroplated gemstone cutting saw blade according to claim 1, characterized in that, The diamond particles are arranged in a single row, double row, multiple rows, or a single row cross, double row cross, or multiple row cross in the axial direction of the inclined plane (2).

3. The electroplated gemstone cutting saw blade according to claim 2, characterized in that, When the diamond particles are arranged in double rows or multiple rows or multiple rows intersecting in the axial direction of the inclined surface (2), in the circumferential direction of the inclined surface (2) of the single serration of the substrate (1), the area between two adjacent rows of diamond particles that is not coated with diamond particles is a blank coating (22). The width of the blank coating (22) is greater than zero and less than twice the particle size of the diamond particles.

4. A manufacturing process for an electroplated gemstone cutting saw blade, characterized in that, The method for manufacturing an electroplated gemstone cutting saw blade according to any one of claims 1-3 comprises the following steps: S1: The base material is processed into a base body in one step by stamping according to the design shape of the outer peripheral saw teeth and the mounting hole (1). S2: Insulate the area of ​​the non-electroplated layer (21) on the inclined plane (2); S3: Assemble multiple substrates (1) side by side on the electrode shaft; S4: Separate two adjacent substrates (1) with a non-conductive partition, such that the non-conductive partition is greater than or equal to the diamond particle diameter at each point on the outer periphery of the substrate (1); S5: Diamond particles are plated onto the electroplating layer (21) by electroplating process, and the thickness of the radial electroplating layer (21) on the inclined surface (2) is greater than the particle size of the diamond particles to form a diamond layer (3). S6: Shaping and sharpening the coated saw blade.

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