Magnetron sputtering apparatus

By designing a dual-axis drive device, the problem of planar driving of magnetrons in vacuum equipment is solved, and stable driving of magnetron elements in vacuum chamber is achieved, which improves the utilization rate of target material and solves the heat dissipation problem.

CN117107201BActive Publication Date: 2026-02-10SHENZHEN ARRAYED MATERIALS TECH CO LTD
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Patent Information

Application Number
CN202310980213.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-08-04
Publication Date
2026-02-10
Estimated Expiration
2043-08-04

AI Technical Summary

Technical Problem

In existing vacuum equipment, it is difficult to drive magnetrons along a planar direction, especially due to the limitations of heat dissipation, making it difficult to achieve multi-directional component driving.

Method used

A dual-axis drive device is adopted, including first and second drive units, which are connected to the adjustment unit through a connecting part to realize the driving of the magnetic control element in the plane direction within the vacuum chamber. The motor and lead screw assembly are located outside the vacuum chamber and are connected by a vacuum connector to independently drive the magnetic control element.

Benefits of technology

It enables planar drive of the magnetron in the vacuum chamber, improves the utilization rate of the target material, avoids the problem of motor heat dissipation, and can stably control the position of the magnetron in a vacuum state.

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Abstract

The application discloses a magnetron sputtering device, a double-shaft driving device and a vacuum device. The magnetron sputtering device comprises a coating cavity, a target material is arranged at the upper part of the inside of the coating cavity; the double-shaft driving device is arranged above the coating cavity and is separated from the coating cavity, and the double-shaft driving device comprises a first driving part, a second driving part, and a connecting part; the first driving part drives in a first direction, the second driving part drives in a second direction which is orthogonal to the first direction, and the connecting part is connected with the first driving part and the second driving part respectively; the connecting part comprises a first adjusting unit and a second adjusting unit; the first adjusting unit is connected with the first driving part and can be freely adjusted in the second direction; and the second adjusting unit is connected with the second driving part and can be freely adjusted in the first direction; and a magnetron element is arranged above the target material and is separated from the coating cavity, and the magnetron element is installed on the first adjusting unit or the second adjusting unit. The magnetron sputtering device can drive the magnetron element in a planar direction in the vacuum cavity.
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Description

Technical Field

[0001] This invention relates to, but is not limited to, the field of vacuum equipment technology, and particularly to magnetron sputtering equipment, dual-axis drive devices, and vacuum equipment. Background Technology

[0002] Motor-driven single-axis or multi-axis robotic arms (drive units) are widely used in automated equipment. When used as multi-axis robotic arms, the drive directions of the single-axis robotic arms are usually superimposed in an orthogonal manner to form, for example, a two-axis or three-axis robotic arm.

[0003] Furthermore, in vacuum equipment, it is sometimes necessary to drive components within the vacuum chamber. Motor-driven devices used in vacuum chambers are typically rotating mechanisms. For example, the motor is fixed outside the vacuum chamber and connected to the components inside via magnetohydrodynamics, thereby driving the components to operate. For instance, this method can drive a substrate stage or a rotating target within the vacuum chamber to rotate.

[0004] However, sometimes it is necessary to move components within a vacuum chamber in a planar manner. For example, in magnetron sputtering equipment using planar targets, it is sometimes necessary to house the magnetron within the vacuum chamber and drive it along planar directions (e.g., the X and Y axes). However, existing structures for multi-directional actuation of components typically utilize multi-axis robotic arms formed by stacking single-axis robotic arms. In vacuum equipment, due to heat dissipation and other issues, it is difficult to place motors within the vacuum chamber and stack robotic arms, making it challenging to drive the magnetron along a planar direction. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention proposes a magnetron sputtering apparatus capable of driving a magnetron-controlled element along a planar direction within a vacuum chamber. Furthermore, this invention also proposes a dual-axis drive device and a vacuum apparatus incorporating this dual-axis drive device.

[0006] According to the first embodiment of the magnetron sputtering apparatus, there are: a coating chamber, and a plate-shaped target material is disposed above the interior of the coating chamber; a dual-axis drive device, spaced apart from the coating chamber and disposed above the coating chamber, the dual-axis drive device having: a first drive unit that drives along a first direction, wherein the first direction is parallel to the target material; a second drive unit that drives along a second direction, wherein the second direction is parallel to the target material and orthogonal to the first direction; a connecting part that is connected to the first drive unit and the second drive unit respectively, the connecting part having a first adjustment unit and a second adjustment unit, the first adjustment unit being connected to the first drive unit and freely adjustable along the second direction, the second adjustment unit being connected to the second drive unit and freely adjustable along the first direction; and a magnetron sputtering element that is spaced apart from the coating chamber and located above the target material, the magnetron sputtering element being mounted to the first adjustment unit or the second adjustment unit.

[0007] According to the magnetron sputtering apparatus of this embodiment, it is possible to drive the magnetron element in a planar direction within a vacuum chamber.

[0008] In some embodiments, a control cavity that can be in a vacuum state is provided above the coating cavity, the control cavity being separated from the coating cavity; the magnetron is disposed within the control cavity.

[0009] In some embodiments, the first drive unit includes a first motor and a first lead screw assembly, the first motor being disposed outside the control cavity and the first lead screw assembly being disposed inside the control cavity, the first motor and the first lead screw assembly being connected via a first vacuum connector; the second drive unit includes a second motor and a second lead screw assembly, the second motor being disposed outside the control cavity and the second lead screw assembly being disposed inside the control cavity, the second motor and the second lead screw assembly being connected via a second vacuum connector.

[0010] In some embodiments, the first driving unit further includes: a first guiding unit and a first mounting unit, the first guiding unit and the first mounting unit being respectively disposed within the control cavity, the first guiding unit guiding along the first direction, and the first mounting unit mounted on the first guiding unit and connected to the first lead screw assembly; the second driving unit further includes: a second guiding unit and a second mounting unit, the second guiding unit and the second mounting unit being respectively disposed within the control cavity, the second guiding unit guiding along the second direction, and the second mounting unit mounted on the second guiding unit and connected to the second lead screw assembly; the first adjusting unit is mounted to the first mounting unit; the second adjusting unit is mounted to the second mounting unit; and the magnetic control element is mounted to the first adjusting unit and extends along the second direction.

[0011] In some embodiments, the coating cavity has a back plate above it for mounting a target material, the back plate separating the control cavity from the coating cavity.

[0012] In some embodiments, the pressure within the control chamber may be set to below 10 kPa.

[0013] According to the second embodiment of the dual-axis drive device, it includes: a first drive unit having: a first execution unit, a first guide unit, and a first mounting unit, wherein the first execution unit drives linearly along a first direction, the first guide unit guides along the first direction, and the first mounting unit is mounted on the first guide unit and driven by the first execution unit along the first direction; a second drive unit having: a second execution unit, a second guide unit, and a second mounting unit, wherein the second execution unit drives linearly along a second direction orthogonal to the first direction, the second guide unit guides along the second direction, and the second mounting unit is mounted on the second guide unit and driven by the second execution unit along the second direction; a connecting unit connected to the first drive unit and the second drive unit respectively, the connecting unit having a first adjustment unit and a second adjustment unit, wherein the first adjustment unit is mounted on the first mounting unit and is freely adjustable along the second direction, and the second adjustment unit is mounted on the second mounting unit and is freely adjustable along the first direction; a working unit can be mounted on the second adjustment unit.

[0014] According to the dual-axis drive device of this embodiment, the working unit can be driven along the planar direction.

[0015] In some embodiments, the first execution unit includes a motor or cylinder as an execution element; the second execution unit includes a motor or cylinder as an execution element.

[0016] According to the third embodiment of the vacuum device, a vacuum chamber is provided, including: a dual-axis drive device of any of the above, wherein the first execution unit and the second execution unit are respectively located outside the vacuum chamber; the first guide unit and the first mounting unit, the second guide unit and the second mounting unit, and the connecting portion are respectively located inside the vacuum chamber.

[0017] According to the vacuum device of this embodiment, the working unit can be driven in a planar direction within the vacuum chamber.

[0018] In some embodiments, the working unit includes a magnetron, a target, a substrate, or a tray. Attached Figure Description

[0019] Figure 1 This is a top-view perspective view of a magnetron sputtering apparatus according to one embodiment.

[0020] Figure 2 It is along Figure 1 The sectional view at point AA.

[0021] Figure 3 yes Figure 1 A three-dimensional view of the dual-axis drive device.

[0022] Figure 4 yes Figure 3 A schematic diagram of the first adjustment unit in the process.

[0023] Figure 5 This is a simplified schematic diagram of the magnetron sputtering apparatus of this embodiment.

[0024] Figure 6 This is a schematic diagram of one implementation of a magnetron sputtering device in the known technology. Detailed Implementation

[0025] The embodiments of this implementation are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this implementation, and should not be construed as limiting this implementation.

[0026] In the description of this embodiment, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this embodiment.

[0027] In the description of this embodiment, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0028] In the description of this embodiment, unless otherwise explicitly limited, terms such as setting, installing, and connecting should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this embodiment in conjunction with the specific content of the technical solution.

[0029] Reference Figures 1 to 6 and mainly refer to Figures 1 to 3 The magnetron sputtering apparatus 100 according to the first embodiment includes: a coating chamber 101, a dual-axis drive device 102, and a magnetron sputtering element 103. A plate-shaped target 104 is provided above the interior of the coating chamber 101. The dual-axis drive device 102 is spaced apart from the coating chamber 101 and disposed above it. The dual-axis drive device 102 includes: a first drive section 105, a second drive section 106, and a connecting section 107. The first drive section 105 drives along a first direction, wherein the first direction is parallel to the target 104. The second drive section 106 drives along a second direction, wherein the second direction is parallel to the target 104 and orthogonal to the first direction. The connecting section 107 is connected to both the first drive section 105 and the second drive section 106. The connecting section 107 has a first adjustment unit 108 and a second adjustment unit 109. The first adjustment unit 108 is connected to the first drive section 105 and is freely adjustable along the second direction. The second adjustment unit 109 is connected to the second drive unit 106 and can be freely adjusted along the first direction. The magnetron sputtering element 103 is separated from the coating cavity 101 and is located above the target material 104. The magnetron sputtering element 103 is mounted to either the first adjustment unit 108 or the second adjustment unit 109.

[0030] According to the magnetron sputtering apparatus 100 of this embodiment, the magnetron element 103 can be driven along a planar direction within a vacuum chamber (e.g., control chamber 111 described later). Specifically, as the basic structure of magnetron sputtering, the magnetron sputtering apparatus 100 includes a deposition chamber 101, in which a substrate 110 is deposited. A target 104 is disposed above the substrate 110, i.e., above the deposition chamber 101. A magnetron element 103 (magnetron tube) and a driving device for driving the magnetron element 103 are disposed above (on the back side) of the target 104. Driven by the driving device, the magnetron element 103 scans the surface of the target 104 to extend the electron trajectory using the magnetic field generated by the magnetron element 103, thereby increasing the ionization rate of the metal. Since the magnetic field strength of the magnetron element 103 may vary, this may result in different etching rates of the target 104, leading to different utilization rates of the target 104.

[0031] In this embodiment, by mounting the magnetron 103 on a dual-axis drive device 102 that drives along a plane formed by the first direction and the second direction, the position of the magnetron 103 scanning the surface of the target 104 can be changed, thereby changing the intensity of the magnetic field acting on the same position of the target 104, making the overall intensity of the magnetic field acting on the same position of the target 104 more uniform and improving the utilization rate of the target 104.

[0032] Furthermore, in this embodiment, since the dual-axis drive device 102 has a connecting portion 107, which connects to the first drive unit 105 via a first adjustment unit 108 and to the second drive unit 106 via a second adjustment unit 109, when the first drive unit 105 drives the magnetic control element 103 along the first direction, since the second adjustment unit 109 can be freely adjusted along the first direction, the operation of the first drive unit 105 is not affected by the installation state of the second drive unit 106, and can freely drive the magnetic control element 103. Similarly, when the second drive unit 106 drives the magnetic control element 103 along the second direction, since the first adjustment unit 108 can be freely adjusted along the second direction, the operation of the second drive unit 106 is not affected by the installation state of the first drive unit 105, and can freely drive the magnetic control element 103. Therefore, the actuators (e.g., motors) of the first drive unit 105 and the second drive unit 106 of the dual-axis drive device 102 can be configured according to the actual situation. For example, the motors of the first drive unit 105 and the second drive unit 106 can be independently installed outside the vacuum chamber without considering the problem of motor heat dissipation, etc., and the magnetic control element 103 can be driven in the vacuum chamber along the plane direction formed by the first direction and the second direction.

[0033] Continue to refer to Figure 5As described above, the magnetron sputtering element 103 of this embodiment is driven in a planar direction within a vacuum chamber. Specifically, a control chamber 111, which can be in a vacuum state, is provided above the coating chamber 101, and the control chamber 111 is separated from the coating chamber 101. The magnetron sputtering element 103 is disposed within the control chamber 111. In the planar magnetron sputtering apparatus 100, a back plate 112 is provided above the coating chamber 101, and the target material 104 is mounted on the back plate 112. The back plate 112 seals the coating chamber 101 from above so that the target material 104 and the coating chamber 101 are opposite each other. Furthermore, the back plate 112 separates the coating chamber 101 from the control chamber 111 disposed above the coating chamber 101.

[0034] Continue to refer to Figure 5 and supplementary reference Figure 6 When the equipment size is small, the overall strength of the backplate 112 is supported by the pressure difference between the external pressure and the pressure inside the coating chamber 101. However, when the equipment size increases, the pressure difference between the external pressure and the pressure inside the coating chamber 101 becomes larger, which may cause the backplate 112 to deform. When the backplate 112 deforms, the target material 104 mounted on the backplate 112 also deforms, which can lead to uneven consumption of the target material 104. In this embodiment, by providing a control chamber 111 that can be in a vacuum state above the coating chamber 101 and separating the control chamber 111 from the coating chamber 101, the deformation of the backplate 112 caused by the pressure difference on both sides of the backplate 112 can be suppressed. For example, by evacuating the control chamber 111, the pressure inside the control chamber 111 can be reduced to a level that will not affect the deformation of the backplate 112, thereby suppressing the deformation of the target material 104. The pressure in the control chamber 111 only needs to be reduced to a level that will not affect the deformation of the back plate 112, for example, it can be set to below 10 kPa.

[0035] Since the magnetic control element 103 can be driven in a planar direction in a vacuum chamber (e.g., control chamber 111) by the aforementioned dual-axis drive device 102, the dual-axis drive device 102 can control the magnetic control element 103 in the control chamber 111 even when the control chamber 111 is in a vacuum state.

[0036] Furthermore, although the example of using the dual-axis drive device 102 to drive the magnetic control element 103 within a vacuum chamber has been described above, it is not limited to this. The dual-axis drive device 102 can also drive the magnetic control element 103 in, for example, atmospheric environments without any obstacles.

[0037] Main reference Figure 3 and supplementary reference Figure 1 , Figure 2In some embodiments, the first drive unit 105 includes a first motor 113 and a first lead screw assembly 114. The first motor 113 is disposed outside the control cavity 111, and the first lead screw assembly 114 is disposed inside the control cavity 111. The first motor 113 and the first lead screw assembly 114 are connected via a first vacuum connector 115. The second drive unit 106 includes a second motor 116 and a second lead screw assembly 117. The second motor 116 is disposed outside the control cavity 111, and the second lead screw assembly 117 is disposed inside the control cavity 111. The second motor 116 and the second lead screw assembly 117 are connected via a second vacuum connector 118. By placing the first motor 113 and the second motor 116 outside the control cavity 111 via the first vacuum connector 115 and the second vacuum connector 118, respectively, the requirements for motor heat dissipation can be ignored, thereby facilitating the configuration of the first motor 113 and the second motor 116.

[0038] The control cavity 111 is defined in a rectangular shape, for example, by a rectangular annular circumferential wall 127. A base plate 129 is formed at the bottom of the circumferential wall 127, and the base plate 129 and the circumferential wall 127 are integrally formed. A rectangular groove 131 is formed in the middle of the base plate 129, and the length and width of the rectangular groove 131 are larger than the length and width of the target material 104, respectively.

[0039] As described above, the first motor 113 and the first lead screw assembly 114 are connected via a first vacuum coupling 115. The first vacuum coupling 115 is, for example, a known coupling for connecting components of a vacuum chamber to components outside the vacuum chamber, such as a magnetorheological fluid coupling. The first vacuum coupling 115 is mounted on one side of the circumferential wall 127 in a first direction. The first motor 113 is connected to the first vacuum coupling 115 on the outside of the circumferential wall 127, for example, via a speed reducer (not marked). The first lead screw assembly 114 can be directly mounted on the base plate 129, or it can be mounted on the base plate 129 via, for example, a transfer plate (not marked). The lead screw (not marked) of the first lead screw assembly 114 extends in the first direction and spans the length of the rectangular groove 131 in the first direction. Thus, it can be ensured that the stroke of the magnetron 103 (e.g., a magnetron tube) extending in the second direction, for example, can be driven in the first direction to completely cover the target 104.

[0040] In addition, the first drive unit 105 further includes a first guide unit 130 and a first mounting unit 132, which are respectively disposed within the control cavity 111. The first guide unit 130 guides along a first direction, and the first mounting unit 132 is mounted on the first guide unit 130 and connected to the first lead screw assembly 114. The first guide unit 130 may include, for example, a known linear guide rail or linear guide shaft. In some embodiments, the first guide unit 130 is selected as a linear slide rail (not marked in the figures). The first guide unit 130 may include two sets of parallel linear slide rails, and the first guide unit 130 is mounted within the control cavity 111 with the slider (not marked in the figures) of the linear slide rail facing downwards. The mounting position of the first guide unit 130 is not particularly limited; for example, it may be directly mounted on the base plate 129, or it may be mounted on the base plate 129 via, for example, a transfer plate. The first mounting unit 132 includes, for example, a first mounting plate 133 extending in a second direction and a first nut mounting seat 119 mounted on the first mounting plate 133. The two ends of the first mounting plate 133 in the second direction are respectively mounted to the sliders of the two sets of linear guide rails of the first guide unit 130, and the lead screw nut of the first lead screw assembly 114 is mounted on the first nut mounting seat 119. Thus, when the first motor 113 of the first drive unit 105 operates, the first mounting plate 133 of the first mounting unit 132 is driven in the first direction via the transmission of the first lead screw assembly 114.

[0041] As described above, the second motor 116 and the second lead screw assembly 117 are connected via a second vacuum connector 118. The second vacuum connector 118 is, for example, a known coupling for connecting components of a vacuum chamber to components outside the vacuum chamber, such as a magnetorheological fluid coupling. The second vacuum connector 118 is mounted on one side of the circumferential wall 127 in a second direction. The second motor 116 is connected to the second vacuum connector 118 on the outside of the circumferential wall 127, for example, via a speed reducer (not marked in the drawings). The second lead screw assembly 117 can be directly mounted on the base plate 129, or it can be mounted on the base plate 129 via, for example, a transfer plate. The lead screw of the second lead screw assembly 117 extends in the second direction, and the length of the lead screw (not marked in the drawings) extending in the second direction is not particularly limited, as long as it can be ensured that, for example, the magnetron 103 (e.g., a magnetron tube) extending in the second direction can completely cover the target 104 in the second direction.

[0042] In addition, the second drive unit 106 further includes a second guide unit 128 and a second mounting unit 120, which are respectively disposed within the control cavity 111. The second guide unit 128 guides along a second direction, and the second mounting unit 120 is mounted on the second guide unit 128 and connected to the second lead screw assembly 117. The second guide unit 128 may include, for example, a known linear guide rail or a linear guide shaft. In some embodiments, the second guide unit 128 is selected as a linear guide shaft (not marked with reference numerals), and the first guide unit 130 may include two sets of parallel linear guide shafts. The mounting position of the second guide unit 128 is not particularly limited; for example, it can be directly mounted on the base plate 129, or it can be mounted on the base plate 129 via, for example, a transfer plate (not marked with reference numerals). The second mounting unit 120 includes, for example, a second mounting plate 121 extending in a first direction and a second nut mounting seat 122 mounted on the second mounting plate 121. The two ends of the second mounting plate 121 in the first direction are respectively mounted to the sliding bearings (not marked) of the two sets of linear guide shafts of the second guide unit 128, and the lead screw nut (not marked) of the second lead screw assembly 117 is mounted on the second nut mounting seat 122. Thus, when the second motor 116 of the second drive unit 106 operates, the second mounting plate 121 of the second mounting unit 120 is driven in the second direction via the transmission of the second lead screw assembly 117.

[0043] Main reference Figure 3 , Figure 4 and supplementary reference Figure 2 , Figure 1As described above, the first adjustment unit 108 of the connecting part 107 is connected to the first drive part 105 and is freely adjustable along the second direction. The second adjustment unit 109 of the connecting part 107 is connected to the second drive part 106 and is freely adjustable along the first direction. Specifically, the first adjustment unit 108 of the connecting part 107 is mounted to the first mounting unit 132. The second adjustment unit 109 of the connecting part 107 is mounted to the second mounting unit 120. The magnetic control element 103 is mounted to the first adjustment unit 108 and extends along the second direction. The first adjustment unit 108 includes a first adjustment guide rail 123 that is freely adjustable along the second direction. The type of the first adjustment guide rail 123 is not particularly limited; for example, it can be a linear slide rail or a linear guide shaft. The first adjustment guide rail 123 is mounted to the first mounting plate 133 of the first mounting unit 132. The second adjustment unit 109 includes a second adjustment guide rail 124 that is freely adjustable along the first direction. The type of the second adjustment guide rail 124 is not particularly limited; for example, it can be a linear slide rail or a linear guide shaft. The second adjusting guide rail 124 is mounted to the second mounting plate 121 of the second mounting unit 120. Furthermore, the connecting portion 107 also includes a third mounting plate 125 and a connecting plate 126. The third mounting plate 125 extends along the second direction and is mounted to the first adjusting guide rail 123 of the first adjusting unit 108. The connecting plate 126 is L-shaped, with one end connected to the third mounting plate 125 and the other end connected to the slider of the second adjusting guide rail 124. The magnetic control element 103 can be, for example, a known magnetron, extending along the second direction and mounted to the third mounting plate 125.

[0044] Furthermore, although the above description illustrates an example of the magnetic control element 103 being installed in the first adjustment unit 108, it is not limited to this. The magnetic control element 103 can also be installed in the second adjustment unit 109 as needed.

[0045] When the first motor 113 of the first drive unit 105 operates, the first lead screw assembly 114 is driven by the first motor 113, and the first mounting unit 132 is linearly driven along the first direction via the first guide unit 130, which guides along the first direction. Since the second adjustment unit 109 of the connecting unit 107, which is mounted to the second mounting unit 120, includes a second adjustment guide rail 124 that is freely adjustable along the first direction, when the first mounting unit 132 is linearly driven along the first direction, the first adjustment unit 108 of the first mounting plate 133, which is connected to the second adjustment unit 109 via the connecting plate 126 and mounted to the first mounting unit 132, is also linearly driven along the first direction along with the first mounting unit 132. That is, the magnetic control element 103 mounted to the third mounting plate 125 is also linearly driven along the first direction. Furthermore, since the second adjustment guide rail 124 of the second adjustment unit 109 is freely adjustable along the first direction, the operation of the second drive unit 106 does not affect the linear driving of the magnetic control element 103 along the first direction.

[0046] When the second motor 116 of the second drive unit 106 operates, the second lead screw assembly 117 is driven by the second motor 116, and the second mounting unit 120 is linearly driven in the second direction via the second guide unit 128, which guides in the second direction. Since the first adjustment unit 108 of the connecting unit 107, which is mounted to the first mounting unit 132, includes a first adjustment guide rail 123 that is freely adjustable in the second direction, when the second mounting unit 120 is linearly driven in the second direction, the first adjustment unit 108, which is connected to the second adjustment unit 109 via the connecting plate 126 and mounted to the first mounting plate 133 of the first mounting unit 132, is also linearly driven in the second direction along with the second mounting unit 120. That is, the magnetic control element 103 mounted to the third mounting plate 125 is also linearly driven in the second direction. Furthermore, since the first adjustment guide rail 123 of the first adjustment unit 108 is freely adjustable in the second direction, the operation of the first drive unit 105 does not affect the linear driving of the magnetic control element 103 in the second direction.

[0047] Therefore, since the magnetic control element 103 is connected to the first drive unit 105 and the second drive unit 106 via the connecting part 107, and the connecting part 107 has a first adjustment unit 108 that can be freely adjusted along the second direction and a second adjustment unit 109 that can be freely adjusted along the first direction, it is possible for the first drive unit 105 and the second drive unit 106 to drive the magnetic control element 103 independently. That is, through the second adjustment unit 109, the first drive unit 105 can independently drive the magnetic control element 103 linearly along the first direction without being affected by the operation or installation state of the second drive unit 106; through the first adjustment unit 108, the second drive unit 106 can independently drive the magnetic control element 103 linearly along the second direction without being affected by the operation or installation state of the first drive unit 105. Furthermore, since the first adjustment unit 108 and the second adjustment unit 109 are connected by the connecting plate 126, when the first drive unit 105 and the second drive unit 106 operate simultaneously, the magnetic control element 103 can be driven independently along the first direction and the second direction, respectively. That is, the magnetic control element 103 can be driven along the planar direction in the control cavity 111, which is a vacuum cavity.

[0048] Furthermore, the above embodiment illustrates an example of using the dual-axis drive device 102 to drive the magnetic control element 103 along a planar direction within the control cavity 111, but it is not limited thereto. For example, the dual-axis drive device 102 can be used as a stand-alone robotic arm structure.

[0049] Continue to refer to Figure 3Specifically, the dual-axis drive device 102 according to the second embodiment includes: a first drive unit 105, a second drive unit 106, and the aforementioned connecting unit 107. The first drive unit 105 includes: a first execution unit (not marked), the aforementioned first guide unit 130, and the aforementioned first mounting unit 132. The first execution unit drives linearly along a first direction. The first guide unit 130 guides along the first direction. The first mounting unit 132 is mounted on the first guide unit 130 and driven along the first direction by the first execution unit. The second drive unit 106 includes: a second execution unit (not marked), the aforementioned second guide unit 128, and the aforementioned second mounting unit 120. The second execution unit drives linearly along a second direction orthogonal to the first direction. The second guide unit 128 guides along the second direction. The second mounting unit 120 is mounted on the second guide unit 128 and driven along the second direction by the second execution unit. The connecting unit 107 is connected to both the first drive unit 105 and the second drive unit 106. The connecting part 107 has the first adjustment unit 108 and the second adjustment unit 109 described above. The first adjustment unit 108 is mounted to the first mounting unit 132 and can be freely adjusted in the second direction. The second adjustment unit 109 is mounted to the second mounting unit 120 and can be freely adjusted in the first direction. In addition, a working unit can be mounted on the second adjustment unit 109.

[0050] According to the dual-axis drive device 102 of this embodiment, the working unit can be driven along a planar direction. Specifically, the dual-axis drive device 102 of this embodiment can achieve the planar driving function that can be achieved by existing dual-axis robotic arms formed by stacking robotic arms. The application scenarios of the dual-axis drive device 102 of this embodiment are not particularly limited. For example, it can be used in an atmospheric environment or a vacuum environment. When used in an atmospheric environment, it can be used, for example, in scenarios where equipment space is limited and only a small range of movement of the working unit is possible.

[0051] The term "work unit" is not particularly limited. In an atmospheric environment, examples of work units include, for instance, a clamp for holding a workpiece, a fixture for holding or positioning a workpiece, a sensor for detecting a parameter or characteristic of a workpiece, and a cylinder for transporting a workpiece. In a vacuum environment, examples of work units include, for instance, the aforementioned magnetron element 103, the target 104 used as a coating source in a magnetron sputtering device 100 or a laser pulse coating device, the substrate 110 used as the object to be coated, or a tray used to support or transport the object.

[0052] In some embodiments, the first execution unit includes a motor or cylinder as the execution element; the second execution unit also includes a motor or cylinder as the execution element. For example, in an atmospheric environment, the first execution unit may select the aforementioned first motor 113 as the execution element, and the second execution unit may select the aforementioned second motor 116 as the execution element. Furthermore, when a motor is selected as the execution element, the first motor 113 is connected to a first lead screw drive assembly via, for example, a known coupling, and the second motor 116 is similarly connected via a known coupling and a second lead screw drive assembly. Additionally, the first and second execution units may also be selected, for example, as cylinders as the execution element, as needed.

[0053] Furthermore, the aforementioned dual-axis drive device 102 can also be used in devices other than the magnetron sputtering apparatus 100. For example, the vacuum apparatus according to the third embodiment (not marked with reference numerals) has a vacuum chamber (not marked with reference numerals) and further includes: the dual-axis drive device 102 of any of the above, wherein the first execution unit and the second execution unit are respectively located outside the vacuum chamber. The first guide unit 130 and the first mounting unit 132, the second guide unit 128 and the second mounting unit 120, and the connecting portion 107 are respectively located inside the vacuum chamber.

[0054] According to the vacuum equipment of this embodiment, the working unit can be driven along a planar direction within the vacuum chamber. Besides vacuum coating equipment such as the magnetron sputtering equipment 100 described above, examples of vacuum lamination equipment can also be cited.

[0055] Although embodiments of this implementation have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this implementation, the scope of which is defined by the claims and their equivalents.

Claims

1. A magnetron sputtering apparatus, characterized in that, include: A coating cavity, wherein a plate-shaped target is located above the interior of the coating cavity; A dual-axis drive device, spaced apart from and disposed above the coating cavity, the dual-axis drive device having: A first driving unit drives the target material along a first direction, wherein the first direction is parallel to the target material. The second driving unit drives the target material along a second direction, wherein the second direction is parallel to the target material and orthogonal to the first direction. A connecting part is connected to the first driving part and the second driving part respectively. The connecting part has a first adjustment unit and a second adjustment unit. The first adjustment unit is connected to the first driving part and can be freely adjusted along the second direction. The second adjustment unit is connected to the second driving part and can be freely adjusted along the first direction. A magnetron is spaced apart from the coating cavity and located above the target material; the magnetron is mounted to the first adjustment unit or the second adjustment unit. Above the coating cavity is a control cavity that can be in a vacuum state. The control cavity is separated from the coating cavity, and the magnetron is disposed in the control cavity. The first drive unit includes a first motor and a first lead screw assembly. The first motor is disposed outside the control cavity, and the first lead screw assembly is disposed inside the control cavity. The first motor and the first lead screw assembly are connected via a first vacuum connector. The second drive unit includes a second motor and a second lead screw assembly. The second motor is disposed outside the control cavity, and the second lead screw assembly is disposed inside the control cavity. The second motor and the second lead screw assembly are connected via a second vacuum connector. The first drive unit further includes: a first guide unit and a first mounting unit. The first guide unit and the first mounting unit are respectively disposed in the control cavity. The first guide unit guides along the first direction. The first guide unit includes a linear slide rail or a linear guide shaft. The first mounting unit is mounted on the first guide unit and connected to the first lead screw assembly. The second drive unit further includes: a second guide unit and a second mounting unit, the second guide unit and the second mounting unit are respectively disposed in the control cavity, the second guide unit guides along the second direction, the second guide unit includes a linear slide rail or a linear guide shaft, and the second mounting unit is mounted on the second guide unit and connected to the second lead screw assembly; The first adjustment unit is installed onto the first mounting unit; The second adjustment unit is installed into the second mounting unit; The magnetic control element is mounted on the first adjustment unit and extends along the second direction.

2. The magnetron sputtering apparatus according to claim 1, characterized in that, The coating cavity has a back plate above it for mounting the target material, and the back plate separates the control cavity from the coating cavity.

3. The magnetron sputtering apparatus according to claim 1, characterized in that, The pressure inside the control chamber can be set to below 10 kPa.

Citation Information

Patent Citations

  • Magnetron sputtering equipment, double-shaft driving device and vacuum equipment

    CN220413508U