Hall effect test comprehensive experiment instrument and experiment method thereof
By designing displacement adjustment components and variable temperature positioning components, the problems of poor contact, magnetic field interference, and poor cooling effect in Hall effect testing instruments were solved, enabling stable positioning and efficient measurement of materials of different sizes, and improving experimental accuracy and efficiency.
Patent Information
- Application Number
- CN202311005082.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-10
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2043-08-10
AI Technical Summary
Existing Hall effect testing instruments suffer from problems such as poor contact, magnetic field interference, poor cooling effect, and insufficient size adaptability, and cannot meet the comprehensive experimental requirements.
The device employs displacement adjustment components and variable temperature positioning components, along with elastic contact components and heat-conducting block design, to ensure stable contact and efficient heating/cooling of the test material. It also utilizes an insulating shell to reduce the influence of external temperature and avoid magnetic field interference.
It achieves stable positioning and efficient measurement of materials of different sizes, improves experimental accuracy and efficiency, avoids poor contact and magnetic field interference, and enhances cooling and heating effects.
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Figure CN117116122B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of physical experiment instruments, in particular to a Hall effect test comprehensive experiment instrument and an experiment method thereof. BACKGROUND
[0002] The Hall effect experiment is an important experimental teaching project in the university physics experiment course, which can help students combine theoretical knowledge with practical operation and deepen the understanding and application of the Hall effect. The Hall effect feature is that when the current is perpendicular to the external magnetic field through the conductor, an additional electric field perpendicular to the current and the magnetic field will be generated, thereby generating a potential difference at both ends of the conductor. The Hall effect tester utilizes this principle to measure important parameters such as the carrier concentration, mobility, resistivity, and Hall coefficient of semiconductors. At present, the experimental instrument equipment used in teaching has a relatively old structure and single function, and can only be used for experiments on specific items, which cannot meet the needs of comprehensive experiments.
[0003] Patent No. CN202110652222.1 discloses a Hall effect experiment instrument convenient for replacing test materials, which comprises a coil, a first hinge, a mounting frame, a carrier box, a second hinge, and test materials. The coil is installed on its corresponding base. The mounting frame is rotatably connected to the base through the first hinge. The carrier box is rotatably connected to the end of the mounting frame through the second hinge. The tester is electrically connected to the coil and the carrier box through wires. The test materials are placed in the carrier box. The carrier box is rectangular and has a box cover on the upper part. Wire holes are formed in the middle of the four sides. Conductive contacts are fixed to the inner side of the carrier box corresponding to the wire holes. The wires connected to the tester are electrically connected to the conductive contacts through the wire holes. The conductive contacts are buckled on the four sides of the test materials to fix the test materials and form conductive contact.
[0004] When the carrier box is placed in the test materials, the test materials are placed between the conductive contacts by buckling to form conductive contact, and then the box cover is closed. Only buckling is used to connect, which can fix the test materials, but in actual use, there will be a gap between the conductive contacts and the test materials, which will cause poor electrical connection and affect the experimental measurement results. The buckling structure used in the application has strict requirements on the size of the test materials. If the size of the test materials is incorrect or worn, it may not be able to be inserted or loose, thereby failing to fix the test materials.
[0005] Patent No.: CN202022194119.0, discloses a kind of heating refrigeration device of adjustable temperature type Hall effect tester, temperature sensor, heat conduction block, heating module, refrigeration sheet, temperature sensor is arranged inside sample tank, the front surface of heat conduction block is equipped with heat conduction socket, the number of heat conduction socket is identical with the number of heat pipe, heat conduction socket is matched with heat pipe, heat pipe is inserted into heat conduction socket, heating module is fixedly connected in the lower surface of heat conduction block, heating module is electrically connected with controller, refrigeration sheet includes 4 blocks, and the refrigeration face of 4 blocks of refrigeration sheet is fixedly connected on the left side, right side, upper side and rear side of heat conduction block respectively, refrigeration sheet is electrically connected with controller, the application adopts left and right two groups of heat pipes and is distributed in the two sides of sample tank, and heat pipe is generally metal material, when carrying out Hall effect experiment, it can generate interference to magnetic field, so as to weaken or shield magnetic field;When refrigerating, sample tank is cooled by heat conduction through the refrigeration sheet around heat conduction block, and heat conduction block can only be attached to sample tank by one side surface, so that the refrigeration effect is general, and the structure size of heat conduction block is large, and the function is single, which affects experimental operation. SUMMARY
[0006] The present application is directed to the above problems, discloses a kind of Hall effect test comprehensive experiment instrument and experimental method thereof, can be replaced with the semiconductor test material of different material to carry out experiment, suitable for different size measurement material, ensure the positioning effect of measurement material, improve heating, refrigeration rate simultaneously.
[0007] The specific technical solutions are as follows:
[0008] The utility model provides a kind of Hall effect test comprehensive experiment instrument, including experiment instrument body, and the top of experiment instrument body is equipped with displacement adjusting component and direct current electromagnet respectively in left and right sides, the direct current electromagnet includes coil end and gap end, positioning rod is horizontally equipped on the displacement adjusting component, and one end of the positioning rod extends into the gap end of direct current electromagnet and is equipped with the measuring device for fixing semiconductor test material, heat insulation casing is arranged on the top of experiment instrument body and outside direct current electromagnet, heat insulation cover is hingedly arranged on one side of heat insulation casing, recess is opened on one side of the heat insulation cover, heat insulation pad is arranged in the recess, and recess is opened on heat insulation pad and is used to accommodate positioning rod;The displacement adjusting component includes slide rail seat, sliding seat, lifting seat, the sliding seat is horizontally slidably arranged on the slide rail seat, displacement screw is horizontally rotatably arranged in the slide rail seat, displacement knob is connected to one end of displacement screw, and displacement screw is slidably connected with sliding seat, longitudinal lifting groove is formed in one side of sliding seat and makes that the cross section of sliding seat is '' F '' shape structure, pivot is rotatably arranged in the middle of lifting groove, lifting knob is connected to one end of pivot, gear is arranged on pivot, and rack is slidably arranged in lifting groove, rack is meshingly connected with gear on one side, and lifting seat is arranged on the other side of rack, the end of lifting seat close to direct current electromagnet is equipped with the translation slot for accommodating positioning rod, two guide rods and a translation screw are horizontally arranged in the translation slot, the guide rod and translation screw are all horizontally through the positioning rod, and translation screw is threadedly connected with positioning rod, one end of translation screw is through translation slot and is connected with translation knob.
[0009] Further, the measuring device comprises a mounting shell, an elastic contact assembly and a variable temperature positioning assembly, one end of the mounting shell is connected with the positioning rod, the mounting shell is a rectangular shell structure, the top of the mounting shell is open, and a positioning cover is hingedly arranged at the top opening of the mounting shell, one end of the positioning cover is fixed to one side of the mounting shell through buckling, and the elastic contact assembly is arranged through the positioning cover and three surfaces of the side of the mounting shell, one end of the outer side of the four elastic contact assemblies is connected with the current output connector and the voltage output connector on the experimental instrument body through wires, and the inner side of the four elastic contact assemblies is closely arranged on the four sides of the semiconductor test material and forms a conductive contact; the variable temperature positioning assembly comprises two upper heat-conducting blocks and two lower heat-conducting blocks, the two upper heat-conducting blocks and the two lower heat-conducting blocks are located on the two sides of the upper end and the two sides of the lower end of the mounting shell, the sides away from each other of the two upper heat-conducting blocks and the two lower heat-conducting blocks are elastically movably connected with the inner wall of the mounting shell through elastic support assemblies, the top of the adjacent side of the two upper heat-conducting blocks is provided with a guide portion with an arc surface structure, one end surface of one of the two upper heat-conducting blocks is transversely provided with a pressing rod, and the other end surface of the other upper heat-conducting block is also transversely provided with a pressing rod, the two pressing rods extend to the two sides respectively and penetrate through the two sides of the mounting shell respectively; the end face of the upper heat-conducting block and the lower heat-conducting block close to the test material is provided with a positioning groove for accommodating one corner of the test material, and the side of the upper heat-conducting block and the lower heat-conducting block located in the positioning groove is provided with a mounting groove, and a refrigeration fin is arranged in the mounting groove of one of the upper heat-conducting block and the lower heat-conducting block, and a heating fin is arranged in the mounting groove of the other upper heat-conducting block and the other lower heat-conducting block.
[0010] Further, the elastic contact assembly comprises a guide column and a second spring, the guide column is provided with a limiting protrusion on the side wall of one end close to the test material, the second spring is sleeved on the guide column, one end of the second spring abuts against the mounting shell or the positioning cover, and the other end of the second spring abuts against the limiting protrusion, so that the guide column abuts against the test material under the support of the second spring.
[0011] Further, one end of the guide column located on the two sides of the mounting shell is provided with an arc surface structure at the top to avoid limiting the test material by the guide column.
[0012] Further, the center of the front and rear end faces of the mounting shell is recessed inwardly and forms an inner recess, the inner recess is in a rectangular structure, the middle part of the inner recess is provided with a plane, the periphery edge of the inner recess is provided with an inclination, the distance between the inner walls of the two inner recesses is matched with the thickness of the test material, and a rectangular opening is formed in the center of the inner recess of the front and rear ends of the mounting shell.
[0013] Further, the elastic support assembly is arranged on both sides of the upper end and the lower end of the mounting shell, and the elastic support assembly comprises a guide rod and a first spring, one end of the guide rod is connected to the inner wall of the mounting shell, the first spring is sleeved on the guide rod, and one side of the upper heat-conducting block and the lower heat-conducting block is provided with a containing groove for containing the spring, so that the two ends of the spring are pressed against the inner wall of the mounting shell and the containing groove respectively, and a movable slot for containing the guide rod is arranged in the center of the containing groove.
[0014] Further, one end of the positioning rod is provided with a clamping groove for mounting the mounting shell, and the lower end of the mounting shell is clamped and connected in the clamping groove.
[0015] Further, the front end of the experimental instrument body is provided with a display screen and a key, the key is electrically connected to the refrigeration sheet and the heating sheet through wires respectively, the experimental instrument body is further provided with a reversing switch, the reversing switch is electrically connected to the direct-current electromagnet, the current output connector and the voltage output connector respectively, the experimental instrument body is provided with a power supply and a control circuit board, and the control circuit board is electrically connected to the power supply, the display screen, the key and the reversing switch respectively.
[0016] Further, an insertion groove is arranged on the end face of the guide column close to the test material, an insulating sleeve is embedded in the insertion groove, a probe type temperature sensor is arranged in the insulating sleeve, the probe type temperature sensor is connected to the control circuit board in the experimental instrument body through wires, and the front end of the probe type temperature sensor is flush with the end face of the guide column and abuts against the side face of the test material.
[0017] An experimental method of a Hall effect test comprehensive experimental instrument, and the specific steps are as follows:
[0018] S1: embedding the test material into the mounting shell of the measuring device and closing the positioning cover, so that the guide columns in the four elastic contact assemblies are in contact with the side face of the test material, and the wires on the four guide columns are connected to the current output connector and the voltage output connector;
[0019] S2: adjusting the displacement adjustment assembly, so that the measuring device moves to the gap end of the direct-current electromagnet, and the translation knob is located at the center of the gap end by adjusting the translation knob;
[0020] S3: turning on the power supply of the comprehensive experimental instrument to electrify the direct-current electromagnet, the current output connector and the voltage output connector, and reading the Hall voltage displayed on the comprehensive experimental instrument;
[0021] S4: adjusting the translation knob to change the position of the test material and reading the changed Hall voltage displayed on the comprehensive experimental instrument;
[0022] S5: Close the heat insulation cover, and control the refrigeration piece or heating piece to work through the button, so that the temperature of the test material changes, the temperature of the test material is observed through the display screen, and when the temperature reaches the specified temperature value, the changed Hall voltage value displayed on the comprehensive tester is read out.
[0023] The beneficial effects of the present application are embodied in:
[0024] The measuring device in the present application positions the embedded test material through the inner recess, and the inner recess is provided with a through port, so that the magnetic field can directly pass through the test material, effectively avoiding the interference of the installation shell on the magnetic field, and the four corners of the test material are accurately sleeved and fixed by the variable temperature positioning assembly, and the elastic contact assembly in the measuring device stably contacts the four corners of the test material, which can effectively ensure the contact effect and avoid poor contact.
[0025] The present application sets heating pieces and refrigeration pieces in the four heat-conducting blocks respectively, so that the test material is heated or refrigerated by heat conduction through the heat-conducting blocks, and the heat-conducting blocks are sleeved with the test material, effectively increasing the contact area, thereby improving the heating and refrigeration efficiency and further improving the experimental efficiency.
[0026] The displacement adjusting assembly can quickly and accurately adjust the position of the measuring device in the magnetic field, meet the needs of the experiment, and effectively ensure the constant temperature inside the measuring device by setting the heat insulation shell and the heat insulation cover, thereby reducing the influence of the external temperature on the measuring device. BRIEF DESCRIPTION OF DRAWINGS
[0027] Figure 1 It is a structural schematic diagram of the present application.
[0028] Figure 2 It is a top view of the present application.
[0029] Figure 3 It is a front structure schematic diagram of the measuring device in the present application.
[0030] Figure 4 It is a front sectional view of the measuring device in the present application.
[0031] Figure 5 It is a side sectional view of the installation shell in the present application.
[0032] Figure 6 It is an installation structure schematic diagram of the probe type temperature sensor in the present application.
[0033] The experimental instrument body 1, the display screen 101, the button 102, the current output connector 103, the voltage output connector 104, the reversing switch 105, the direct current electromagnet 2, the coil end 21, the gap end 22.
[0034] Displacement adjusting assembly 3, slide rail seat 31, displacement screw rod 311, displacement knob 312, sliding seat 32, lifting groove 321, rotating shaft 322, lifting knob 323, gear wheel 324, rack 325, lifting seat 33, translation groove 331, guide rod 332, translation screw rod 333, translation knob 334, positioning rod 34, clamping groove 341;
[0035] Measuring device 4, mounting shell 41, inner recess 411, through hole 412, elastic contact assembly 42, guide column 421, limiting bump 4211, second spring 422, insertion slot 423, insulating sleeve 424, probe type temperature sensor 425, variable temperature positioning assembly 43, upper heat conduction block 431, mounting groove 4311, positioning groove 4312, accommodating groove 4313, movable groove 4314, pressing rod 4315, guide part 4316, lower heat conduction block 432, guide rod 433, first spring 434, positioning cover 44, test material 45, refrigeration sheet 46, heating sheet 47;
[0036] Thermal insulation shell 5, thermal insulation cover 51, notch 52, thermal insulation pad 53, groove 531. DETAILED DESCRIPTION
[0037] In order to make the technical scheme of the present application clearer and more explicit, the present application will be further described below in conjunction with the drawings. Any equivalent replacement and conventional inference of the technical features of the technical scheme of the present application all fall within the protection scope of the present application. The fixed connection and fixed arrangement mentioned in the present application are general connection modes in the mechanical field, and welding, positioning bolt and nut connection and screw connection are all possible.
[0038] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0039] As Figures 1-2As shown, a kind of Hall effect test comprehensive experiment instrument, including experimental instrument body 1, displacement adjusting assembly 3 and direct current electromagnet 2 are respectively equipped on the top left and right sides of experimental instrument body 1, direct current electromagnet 2 includes coil end 21 and gap end 22, displacement adjusting assembly 3 is horizontally equipped with positioning rod 34, one end of positioning rod 34 extends into the gap end 22 of direct current electromagnet 2 and is equipped with the measuring device 4 for fixing semiconductor test material 45, the measuring device 4 includes installation shell 41, elastic contact component 42 and variable temperature positioning assembly 43, one end of installation shell 41 is connected with positioning rod 34, installation shell 41 is the rectangular shell structure of longitudinal arrangement, the top of installation shell 41 is open, and positioning cover 44 is hingedly arranged at the top opening of installation shell 41, one end of positioning cover 44 is fixed with the side of installation shell 41 by buckle, elastic contact component 42 is all through the setting on positioning cover 44 and the other three sides of installation shell 41 except top, the outer side one end of four elastic contact components 42 is respectively connected with current output connector 103 and voltage output connector 104 on experimental instrument body 1 by wire, and the inner side one end of four elastic contact components 42 is respectively closely set with the four sides of semiconductor test material 45 and forms electrically conductive contact.
[0040] Displacement adjusting assembly 3 includes slide rail seat 31, sliding seat 32, lifting seat 33, sliding seat 32 is horizontally slidably arranged on slide rail seat 31, displacement screw rod 311 is horizontally rotatably arranged in slide rail seat 31, displacement screw rod 311 one end is connected with displacement knob 312, and displacement screw rod 311 is slidably connected with sliding seat 32, the side of sliding seat 32 is longitudinally provided with lifting groove 321 and makes the cross section of sliding seat 32 present " " shape structure, rotating shaft 322 is horizontally rotatably arranged in the middle part of lifting groove 321, and rotating shaft 322 one end is connected with lifting knob 323, gear 324 is arranged on rotating shaft 322, and rack 325 is slidably arranged in lifting groove 321, one side of rack 325 is meshingly connected with gear 324, and the other side of rack 325 is provided with lifting seat 33, the end of lifting seat 33 close to direct current electromagnet 2 is provided with translation slot 331 for accommodating positioning rod 34, two guide rods 332 and one translation screw rod 333 are horizontally arranged in translation slot 331, guide rod 332 and translation screw rod 333 all horizontally pass through positioning rod 34, and translation screw rod 333 is threadedly connected with positioning rod 34, one end of translation screw rod 333 passes through translation slot 331 and is connected with translation knob 334.
[0041] As Figures 3-5As shown, the temperature-variable positioning assembly 43 comprises two upper heat-conducting blocks 431 and two lower heat-conducting blocks 432, which are respectively located at the upper ends and the lower ends of the mounting shell 41. The upper heat-conducting blocks 431 and the lower heat-conducting blocks 432 are made of copper to improve the heat-conducting effect. The sides of the two upper heat-conducting blocks 431 and the two lower heat-conducting blocks 432 away from each other are elastically movably connected to the inner walls of the mounting shell 41 through elastic support assemblies. The top of the side of each of the two upper heat-conducting blocks 431 adjacent to each other is provided with a guide portion 4316 with an arc surface. The surface of one end of one of the two upper heat-conducting blocks 431 is transversely provided with a pressing rod 4315, and the surface of the other end of the other upper heat-conducting block 431 is also transversely provided with a pressing rod 4315. The two pressing rods 4315 respectively extend to the two sides and respectively penetrate through the two sides of the mounting shell 41. By pressing the two pressing rods 4315 on the two sides, the two upper heat-conducting blocks 431 are respectively driven to move to the two sides, so that the upper heat-conducting blocks 431 no longer limit the upper end of the test material 45, thereby facilitating the removal of the test material 45. The end faces of the upper heat-conducting blocks 431 and the lower heat-conducting blocks 432 near the end of the test material 45 are provided with positioning grooves 4312 for accommodating one corner of the test material 45. The side of each of the upper heat-conducting blocks 431 and the lower heat-conducting blocks 432 located at the positioning groove is provided with a mounting groove 4311. The mounting groove 4311 of one of the upper heat-conducting blocks 431 and one of the lower heat-conducting blocks 432 is mounted with a refrigeration fin 46, which is a semiconductor refrigeration fin 46. The mounting groove 4311 of the other upper heat-conducting block 431 and the other lower heat-conducting block 432 is mounted with a heating fin 47, which is a ceramic heating fin 47.
[0042] The elastic support assemblies are arranged at the upper ends and the lower ends of the mounting shell 41. Each elastic support assembly comprises a guide rod 433 and a first spring 434. One end of the guide rod 433 is connected to the inner wall of the mounting shell 41. The first spring 434 is sleeved on the guide rod 433. One side of each of the upper heat-conducting blocks 431 and the lower heat-conducting blocks 432 is provided with a containing groove 4313 for containing the spring, so that the two ends of the spring are respectively pressed against the inner wall of the mounting shell 41 and the containing groove 4313 and support the upper heat-conducting blocks 431 and the lower heat-conducting blocks 432. The center of the containing groove 4313 is provided with a moving groove 4314 for containing the guide rod 433. The guide rod 433 and the pressing rod 4315 are made of a material that is not easy to conduct heat, such as ceramic.
[0043] The elastic contact assembly 42 comprises a guide column 421 and a second spring 422, the guide column 421 is provided with a limiting protrusion 4211 on one end of the side wall close to the test material 45, the second spring 422 is sleeved on the guide column 421, one end of the second spring 422 is pressed on the mounting shell 41 or the positioning cover 44, the other end of the second spring 422 is pressed on the limiting protrusion 4211, so that the guide column 421 is pressed on the test material 45 under the support of the second spring 422. Wherein, the top of one end of the guide column 421 located on both sides of the mounting shell 41 is provided with an arc surface structure to avoid limiting the test material 45 by the guide column 421.
[0044] As shown in Figure 6 , the guide column 421 is provided with an insertion slot 423 on the end face close to the test material 45, the insertion slot 423 is embedded with an insulating sleeve 424, the insulating sleeve 424 is provided with a probe type temperature sensor 425, the front end of the probe type temperature sensor 425 is flush with the end face of the guide column 421 and abuts on the side of the test material 45, the probe type temperature sensor 425 is separated from the conductive contact by using the insulating sleeve 424 and the guide column 421, so as to avoid interference of the probe type temperature sensor 425 to the conductive contact.
[0045] The mounting shell 41 is recessed inwardly and forms an inner recess 411 at the center of the front and rear two end faces, the inner recess 411 is in a rectangular structure, the middle part of the inner recess 411 is provided with a plane, and the periphery edge is provided with an inclination, the spacing between the inner walls of the two inner recesses 411 is matched with the thickness dimension of the test material 45, so as to position the test material 45, and the inner recess 411 of the front and rear two ends of the mounting shell 41 is provided with a rectangular through port 412 at the center, the through port 412 can make the magnetic field directly pass through the test material 45, and reduce the interference of the mounting shell 41 to the magnetic field.
[0046] The experimental instrument body 1 is further provided with a heat insulation shell 5 of transparent material on the top, the direct current electromagnet 2 is arranged in the heat insulation shell 5, the heat insulation cover 51 of transparent material is hingedly arranged on one side of the heat insulation shell 5, the notch 52 is arranged on one side of the heat insulation cover 51, the heat insulation pad 53 is arranged in the notch 52, and the recess 531 for accommodating the positioning rod 34 is arranged on the heat insulation pad 53, so that when the heat insulation cover 51 is closed, the sealing property is improved, and the influence of the external temperature environment is reduced.
[0047] The experimental instrument body 1 is provided with a display screen 101 and a button 102 at the front end, the button 102 is respectively electrically connected with the refrigeration fin 46 and the heating fin 47 through wires, the experimental instrument body 1 is further provided with a reversing switch 105, the reversing switch 105 is respectively electrically connected with the direct current electromagnet 2, the current output connector 103 and the voltage output connector 104, the experimental instrument body 1 is provided with a power supply and a control circuit board, and the control circuit board is respectively electrically connected with the power supply, the display screen 101, the button 102, the probe type temperature sensor 425 and the reversing switch 105.
[0048] An experimental method of a Hall effect test comprehensive experiment instrument, the specific steps are as follows:
[0049] S1: embed the test material 45 into the installation shell 41 of the measuring device 4 and close the positioning cover 44, so that the guide posts 421 in the four elastic contact assemblies 42 are in contact with the four sides of the test material 45, and the wires on the four guide posts 421 are connected with the current output connector 103 and the voltage output connector 104.
[0050] S2: adjust the displacement adjustment assembly 3 to move the measuring device 4 into the gap end 22 of the direct current electromagnet 2, and adjust the translation knob 334 to be located at the center of the gap end 22.
[0051] S3: turn on the power supply of the comprehensive experiment instrument to energize the direct current electromagnet 2, the current output connector 103 and the voltage output connector 104, and read the displayed Hall voltage on the Hall effect test comprehensive experiment instrument; by adjusting the current and voltage, the influence on the Hall effect can be tested.
[0052] S4: when testing the influence of the change of the distance between the Hall semiconductor and the magnetic field position on the Hall effect, adjust the translation knob 334 to change the position of the test material 45 and read the displayed Hall voltage on the comprehensive experiment instrument.
[0053] S5: when testing the influence of the temperature change of the Hall semiconductor on the Hall effect, close the heat insulation cover 51, and control the operation of the refrigeration fin 46 or the heating fin 47 by the button 102, so that the temperature of the test material 45 changes, the temperature of the test material 45 is observed through the display screen 101, and when the temperature reaches the specified temperature value, the changed Hall voltage displayed on the comprehensive experiment instrument is read.
[0054] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A Hall effect testing comprehensive experimental instrument, comprising an instrument body (1), wherein a displacement adjustment component (3) and a DC electromagnet (2) are respectively provided on both sides of the top of the instrument body (1), the DC electromagnet (2) comprising a coil end (21) and a gap end (22), a positioning rod (34) is horizontally provided on the displacement adjustment component (3), one end of the positioning rod (34) extends into the gap end (22) of the DC electromagnet (2) and is provided with a measuring device (4) for fixing a semiconductor test material (45), characterized in that, The experimental instrument body (1) is provided with a heat insulation shell (5) on the top outside of the DC electromagnet (2). A heat insulation cover (51) is hinged to one side of the heat insulation shell (5). A notch (52) is opened on one side of the heat insulation cover (51). A heat insulation pad (53) is provided in the notch (52). A groove (531) for accommodating the positioning rod (34) is opened on the heat insulation pad (53). The displacement adjustment component (3) includes a slide rail seat (31), a sliding seat (32), and a lifting seat (33). The sliding seat (32) is horizontally slidably arranged on the slide rail seat (31). A displacement screw (311) is horizontally rotatably arranged in the slide rail seat (31). One end of the displacement screw (311) is connected to a displacement knob (312). The displacement screw (311) is slidably connected to the sliding seat (32). A lifting groove (321) is longitudinally opened on one side of the sliding seat (32). The middle of the lifting groove (321) is horizontally rotated. A rotating shaft (322) is provided, and a lifting knob (323) is connected to one end of the rotating shaft (322). A gear (324) is provided on the rotating shaft (322), and a rack (325) is longitudinally slidably arranged in the lifting groove (321). One side of the rack (325) is meshed with the gear (324), and the lifting seat (33) is provided on the other side of the rack (325). A translation groove (331) for accommodating the positioning rod (34) is opened at one end of the lifting seat (33) near the DC electromagnet (2). Two guide rods (332) and a translation screw (333) are horizontally arranged in the translation groove (331). The guide rods (332) and the translation screw (333) are both horizontally passing through the positioning rod (34), and the translation screw (333) is threadedly connected to the positioning rod (34). One end of the translation screw (333) passes through the translation groove (331) and is connected to the translation knob (334). The measuring device (4) includes a mounting housing (41), an elastic contact assembly (42), and a temperature-changing positioning assembly (43). One end of the mounting housing (41) is connected to the positioning rod (34). The mounting housing (41) has a rectangular housing structure and an opening at the top. A positioning cover (44) is hinged at the opening at the top of the mounting housing (41). One end of the positioning cover (44) is fixed to one side of the mounting housing (41) by a snap fastener. The elastic contact assembly (42) is disposed through the positioning cover (44) and three sides of the side of the mounting housing (41). The outer ends of the four elastic contact assemblies (42) are respectively connected to the current output connector (103) and voltage output connector (104) on the experimental instrument body (1) via wires. The inner ends of the four elastic contact assemblies (42) are respectively tightly fitted to the four sides of the semiconductor test material (45) to form conductive contact. The variable temperature positioning assembly (43) includes two upper heat-conducting blocks (431) and two lower heat-conducting blocks (432). The two upper heat-conducting blocks (431) and the two lower heat-conducting blocks (432) are respectively located on the upper and lower sides of the mounting housing (41). The opposite sides of the upper heat-conducting block (431) and the two lower heat-conducting blocks (432) are elastically and movably connected to the inner wall of the mounting housing (41) through an elastic support assembly. The top of the adjacent side of the two upper heat-conducting blocks (431) is provided with a guide part (4316) with an arc surface structure. One end surface of one upper heat-conducting block (431) is provided with a pressing rod (4315) laterally, and the other end surface of the other upper heat-conducting block (431) is also provided with a pressing rod (4315) laterally. The two pressing rods (4315) extend to both sides and penetrate both sides of the mounting housing (41); the upper heat-conducting blocks (431) and the lower heat-conducting blocks (432) are elastically and movably connected to the inner wall of the mounting housing (41) through an elastic support assembly. A positioning groove (4312) for accommodating one corner of the test material (45) is provided on the end face of the block (432) near the test material (45). An installation groove (4311) is provided on the upper heat-conducting block (431) and the lower heat-conducting block (432) on one side of the positioning groove (4312). A cooling chip (46) is installed in the installation groove (4311) of one upper heat-conducting block (431) and one lower heat-conducting block (432). A heating chip (47) is installed in the installation groove (4311) of another upper heat-conducting block (431) and another lower heat-conducting block (432).
2. The Hall effect testing comprehensive experimental instrument as described in claim 1, characterized in that, The elastic contact assembly (42) includes a guide post (421) and a second spring (422). A limiting protrusion (4211) is provided on the side wall of the guide post (421) near the test material (45). The second spring (422) is sleeved on the guide post (421). One end of the second spring (422) presses against the mounting housing (41) or the positioning cover (44), and the other end of the second spring (422) presses against the limiting protrusion (4211), so that the guide post (421) presses against the test material (45) under the support of the second spring (422).
3. The Hall effect testing comprehensive experimental instrument as described in claim 2, characterized in that, in, The top of one end of the guide post (421) located on both sides of the mounting housing (41) is set with an arc surface structure.
4. The Hall effect testing comprehensive experimental instrument as described in claim 3, characterized in that, The guide post (421) has an insertion groove (423) on one end face near the test material (45). An insulating sleeve (424) is embedded in the insertion groove (423). A probe-type temperature sensor (425) is installed inside the insulating sleeve (424). The front end of the probe-type temperature sensor (425) is flush with the end face of the guide post (421) and abuts against the side of the test material (45).
5. The Hall effect testing comprehensive experimental instrument as described in claim 1, characterized in that, The center of both the front and rear end faces of the mounting housing (41) is recessed inward to form an inner recess (411). The inner recess (411) has a rectangular structure. The middle part of the inner recess (411) is flat, and its four edges are inclined. The distance between the inner walls of the two inner recesses (411) is adapted to the thickness of the test material (45). A rectangular opening (412) is provided at the center of the inner recesses (411) at both the front and rear ends of the mounting housing (41).
6. The Hall effect testing comprehensive experimental instrument as described in claim 1, characterized in that, The elastic support components are distributed on both sides of the upper end and the lower end of the mounting housing (41). The elastic support components include a guide rod (433) and a first spring (434). One end of the guide rod (433) is connected to the inner wall of the mounting housing (41). The first spring (434) is sleeved on the guide rod (433). A receiving groove (4313) for accommodating the spring is opened on one side of the upper heat-conducting block (431) and the lower heat-conducting block (432), so that the two ends of the spring are pressed against the inner wall of the mounting housing (41) and the receiving groove (4313) respectively. A movable groove (4314) for accommodating the guide rod (433) is opened in the center of the receiving groove (4313).
7. The Hall effect testing comprehensive experimental instrument as described in claim 1, characterized in that, The positioning rod (34) has a slot (341) at one end for mounting the mounting housing (41), and the lower end of the mounting housing (41) is snapped into the slot (341).
8. The Hall effect testing comprehensive experimental instrument as described in claim 5, characterized in that, The experimental instrument body (1) has a display screen (101) and a button (102) at the front end. The button (102) is electrically connected to the cooling chip (46) and the heating chip (47) respectively through wires. The experimental instrument body (1) is also equipped with a reversing switch (105). The reversing switch (105) is electrically connected to the DC electromagnet (2), the current output connector (103) and the voltage output connector (104) respectively. The experimental instrument body (1) is equipped with a power supply and a control circuit board. The control circuit board is electrically connected to the power supply, the display screen (101), the button (102), the probe-type temperature sensor (425) and the reversing switch (105) respectively.
9. The experimental method of the Hall effect testing integrated experimental apparatus according to any one of claims 1-8, the specific steps of which are as follows: S1: Embed the test material (45) into the mounting housing (41) of the measuring device (4) and close the positioning cover (44) so that the guide post (421) in the four elastic contact assembly (42) contacts the sides of the test material (45) and connect the wires on the four guide posts (421) to the current output connector (103) and the voltage output connector (104); S2: Adjust the displacement adjustment component (3) to move the measuring device (4) to the gap end (22) of the DC electromagnet (2), and adjust the translation knob (334) to make it located at the center of the gap end (22); S3: Turn on the power of the integrated experimental instrument to power on the DC electromagnet (2), current output connector (103) and voltage output connector (104), and read the Hall voltage reading displayed on the Hall effect test integrated experimental instrument. S4: By adjusting the translation knob (334), the position of the test material (45) is changed and the reading of the changed Hall voltage displayed on the integrated experimental instrument is read; S5: Close the heat insulation cover (51) and control the cooling chip (46) or heating chip (47) to work by pressing the button (102) to change the temperature of the test material (45). Observe the temperature of the test material (45) through the display screen (101) and read the Hall voltage reading displayed on the integrated experimental instrument when the temperature reaches the specified temperature value.
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