Optoelectronic light emitting device and method

Abstract

The invention relates to an optoelectronic light emitting device comprising a transparent sheet, in particular a glass sheet, on which at least a partially transparent first intermediate layer is arranged, and at least one optoelectronic fiber arranged on the first intermediate layer, the at least one optoelectronic fiber having at least one electrical lead wire which extends in a longitudinal direction and which is connected to a plurality of optoelectronic semiconductor devices. The optoelectronic fiber further comprises a flexible carrier substrate on which the at least one electrical lead wire and the plurality of optoelectronic semiconductor devices are arranged. The optoelectronic light emitting device further comprises at least a partially transparent second intermediate layer, wherein the second intermediate layer is arranged on the first intermediate layer and covers the at least one optoelectronic fiber.

Description

[0001] This application claims priority to German patent application 10 2021 108 003.7, dated March 30, 2021, the disclosure of which is incorporated herein by reference.

[0002] This invention relates to a technique for displaying information in or on a transparent sheet or surface of a vehicle. In particular, this invention relates to a window, sunroof, canopy, or other surface of a vehicle, including optoelectronic semiconductor devices and their wiring and control mechanisms, for displaying information or symbols on the window, sunroof, canopy, or other surface of the vehicle.

[0003] Although the present invention relates primarily to window slats, windows, panoramic sunroofs, roofs, and exterior surfaces of automobiles, it is not limited to this particular type of vehicle, but can instead be implemented in other types of vehicles, such as trains, buses, trucks, airplanes, or ships.

[0004] Furthermore, the subject matter of this invention can also be used in the field of buildings and houses to display information in or on windows, special glass panes, or similar structures. Background Technology

[0005] Laminated glass is commonly used for windows in motor vehicles, especially automobiles. It is used not only for windshields but also, in some cases, for side windows, rear windows, sunroofs, and panoramic sunroofs. Laminated glass is manufactured by bonding two or more panes of glass together using a thermoplastic bonding layer. Sometimes, the thermoplastic layer is applied only to a single pane.

[0006] Directional orientation enables LEDs radiating towards the interior space of motor vehicles, particularly automobiles, to provide interior lighting or to provide information to the driver or other occupants of the vehicle. Directional orientation, on the other hand, enables outward-radiating light sources, such as headlights, taillights, high-mounted brake lights, and auxiliary brake lights or indicator lights, to provide external lighting for the vehicle.

[0007] In the past, attempts have been made to integrate LED lighting devices as integral components of vehicle parts, for example, to provide interior lighting for vehicles. One approach, for instance, involves integrating LEDs into the vitrified material of the vehicle, particularly into a thermoplastic bonding layer between two glass panes.

[0008] However, there is currently no known solution to distribute individual LEDs over a large area (>>1m). 2They are integrated into the windows of motor vehicles at relatively high spacing (e.g., >2 cm) in a particularly cost-effective manner and method. For example, if LEDs grown on a continuous monolithic substrate are integrated into the thermoplastic bonding layer of such a laminated glass sheet, the large area will result in a high area cost, and the large non-emitting dead zone will generate unnecessary costs.

[0009] A simple-to-manufacture optoelectronic fiber is known from WO 2020011857 ​​A1, particularly for integration into textile fabrics. Here, the optoelectronic fiber is configured and its dimensions are set such that it resembles a textile thread and can be integrated into textiles, particularly using conventional weaving and / or knitting and / or embroidery techniques. The fiber is very long, thus enabling it to be considered, to a certain extent, a continuous fiber.

[0010] The need is to solve the above problems and provide a window or window pane for vehicles that includes optoelectronic semiconductor devices and is simple and low-cost to manufacture. Summary of the Invention

[0011] This and other needs are met by a photoelectroluminescent device having the features of claim 1 and a method for manufacturing a photoelectroluminescent device having the features of claim 16. Embodiments and improvements of the invention are described in the dependent claims.

[0012] The optoelectronic light-emitting device according to the present invention includes a transparent sheet, particularly a glass sheet, on which a first intermediate layer, at least partially transparent, is disposed. Furthermore, the light-emitting device includes at least one optoelectronic fiber disposed on the first intermediate layer, the at least one optoelectronic fiber having at least one electrical wire extending in a longitudinal direction and connected to a plurality of optoelectronic semiconductor devices. The optoelectronic fiber includes a flexible carrier substrate on which the at least one electrical wire and the plurality of optoelectronic semiconductor devices are disposed. A second intermediate layer, at least partially transparent, is disposed on the first intermediate layer and covers the at least one optoelectronic fiber.

[0013] A key aspect of this invention is the integration of optoelectronic fibers, which can be manufactured independently of the laminated glass sheet, into a thermoplastic bonding layer between the two glass sheets of the laminated glass sheet. These optoelectronic fibers include multiple light sources or LEDs. To this end, the optoelectronic fibers can be produced cost-effectively in a separate manufacturing process, then arranged on a first intermediate layer according to a desired pattern and accordingly integrated into the laminated glass sheet. This allows for the integration of LEDs into the sheet in a very cost-effective manner, while simultaneously enabling a high degree of personalization in the arrangement of the optoelectronic fibers or LEDs.

[0014] In some embodiments, the transparent sheet is formed from a glass sheet, but it can also be formed from a transparent plastic such as plexiglass or a transparent film. In some embodiments, the transparent sheet is formed from a transparent, flexible film.

[0015] In some embodiments, the at least partially transparent first and / or second intermediate layers are formed from a molten material layer, an adhesive layer, a hot-melt adhesive layer, a resin (e.g., ethylene vinyl acetate (EVA), polyvinyl butyral (PVB)), or an ionomer-based system. In particular, the at least partially transparent first and / or second intermediate layers can comprise or be composed of at least partially transparent plastics, particularly at least partially transparent films, particularly flexible films. In some embodiments, the at least partially transparent first and / or second intermediate layers can be blackened.

[0016] In some embodiments, at least one optoelectronic fiber is embedded between a first intermediate layer and a second intermediate layer that are at least partially transparent. The first and second intermediate layers, for example, are capable of compensating for the height or profile of the at least one optoelectronic fiber.

[0017] In some embodiments, at least one electrical conductor is configured to supply electrical power and / or data signals to a plurality of optoelectronic semiconductor devices. The at least one electrical conductor can be made of a conductive material (e.g., copper). The at least one electrical conductor can be coated and / or blackened to reduce the reflectivity of the outer surface region of the at least one electrical conductor. The coating can be, for example, a palladium or molybdenum coating. In some embodiments, the at least one electrical conductor can have a width of 5 μm to 50 μm. In particular, the width or cross-section of the at least one electrical conductor can be related to the length of the optoelectronic fiber and the electrical power to be transmitted to power the optoelectronic semiconductor devices.

[0018] In some embodiments, at least one electrical conductor comprises a substantially transparent material, such as indium tin oxide (ITO). This material, for example, can increase the transparency of the optoelectronic fiber and thus the transparency of the optoelectronic light-emitting device.

[0019] In some embodiments, the optoelectronic fiber has a flexible capping layer. The flexible capping layer is disposed on a flexible carrier substrate and embeds at least one electrical conductor and multiple optoelectronic semiconductor devices. The flexible capping layer and the flexible carrier layer, for example, can surround the at least one electrical conductor and multiple optoelectronic semiconductor devices and provide mechanical stability to them. Furthermore, the flexible capping layer and the flexible carrier layer can protect the at least one electrical conductor and multiple optoelectronic semiconductor devices, for example, from damage that may occur during further processing of the optoelectronic fiber.

[0020] In some embodiments, the flexible carrier substrate and / or flexible capping layer comprises at least one material selected from PVB, EVA, silicone, acrylic resin, and epoxy resin. In particular, the flexible carrier substrate and / or flexible capping layer can comprise a substantially transparent material that also possesses flexible or elastic properties. In some embodiments, the flexible carrier substrate and flexible capping layer are made of the same material.

[0021] Here, the term "flexible" can be understood as: the flexible carrier substrate and / or flexible cover layer are bendable or elastic and can be non-destructively shaped into the desired form without the application of large forces.

[0022] In some embodiments, the materials of the flexible carrier substrate and / or the flexible capping layer have refractive indices substantially corresponding to those of the materials of the first and / or second intermediate layers. This reduces the refractive index jump between the materials of the flexible carrier substrate and / or the flexible capping layer and the materials of the first and / or second intermediate layers. This, in turn, results in little or no light being refracted or reflected at the interface between the flexible carrier substrate and / or the flexible capping layer and the first and / or second intermediate layers.

[0023] In some embodiments, when viewed transversely to the longitudinal direction, the optoelectronic fiber has one of the following cross-sectional shapes: rectangular; square; circular; elliptical; and trapezoidal. For example, here, a first portion of the cross-section can be formed by a flexible carrier substrate and a second portion can be formed by a flexible capping layer. At least one electrical conductor and multiple optoelectronic semiconductor devices can be arranged between the flexible carrier substrate and the flexible capping layer.

[0024] In some embodiments, the height and / or width, or the diameter or radius of the cross-section of the optoelectronic fiber, is less than or equal to 200 μm, and particularly less than or equal to 150 μm. With such a height, the optoelectronic fiber can be integrated into a bonding layer between two glass sheets, because the profile generated by at least one optoelectronic fiber can be compensated for by the bonding layer.

[0025] In some embodiments, at least two intersecting optoelectronic fibers have a height of less than or equal to 300 μm at their intersection. This height also allows for the integration of multiple intersecting optoelectronic fibers into a connecting layer between two glass plates, as the profile created by the multiple intersecting optoelectronic fibers can be compensated for by the connecting layer.

[0026] In some embodiments, the optoelectronic fiber has a length of at least 1 m, particularly at least 5 m. The optoelectronic fiber can be designed as a continuous fiber and has a particularly large length when viewed in the longitudinal direction. The optoelectronic fiber can be wound and processed, for example, in a manner similar to conventional textile fibers, thus making it particularly suitable for integration into the bonding layer of a laminated glass sheet.

[0027] In some embodiments, each of the plurality of optoelectronic semiconductor devices is formed by a light-emitting element or an LED. In some embodiments, each of the light-emitting elements forms a light-emitting point, wherein the light-emitting point as a whole is capable of forming a light-emitting symbol or light-emitting text during normal use of the optoelectronic light-emitting device. On the other hand, the light-emitting points can also be arbitrarily arranged relative to each other, and for example, form a dotted pattern. Here, the term "light-emitting point" should not be understood as a dotted element, but rather as an area of ​​light-emitting surface predetermined and defined by the dimensions of the semiconductor element.

[0028] In some embodiments, at least one of the plurality of optoelectronic semiconductor devices can be formed from a light-emitting element or LED comprising a conversion material. The conversion material can, for example, be disposed on the light-emitting region of the semiconductor device and configured to convert the light emitted by the semiconductor device into light of different wavelengths.

[0029] In some embodiments, each of the plurality of optoelectronic semiconductor devices is formed of an LED, particularly an LED chip. LEDs can be specifically referred to as mini-LEDs, which are small LEDs, for example, having an edge length of less than 200 μm, particularly up to less than 40 μm, particularly 200 μm to 10 μm. Another range is 150 μm to 40 μm. Within this spatial range, the optoelectronic semiconductor devices are virtually invisible to the human eye.

[0030] LEDs can also be referred to as micro LEDs, μLEDs, or μLED chips, especially those with an edge length of 100 μm to 10 μm. In some implementations, LEDs can have a spatial dimension of 90 × 150 μm or 75 × 125 μm.

[0031] In some implementations, mini-LED or μLED chips can be caseless semiconductor chips. Caseless means that the chip has no casing around its semiconductor layer, such as a "die". In some implementations, caseless can mean that the chip does not contain any organic materials. Therefore, caseless devices do not contain organic compounds containing covalently bonded carbon.

[0032] In some embodiments, each of the plurality of semiconductor optoelectronic devices can include a mini-LED or μLED chip configured to emit light of a selected color. In some embodiments, two or more of the plurality of optoelectronic semiconductor devices can form a pixel, such as an RGB pixel comprising three mini-LED or μLED chips. For example, an RGB pixel can emit red, green, and blue light, as well as any mixed color light. In some embodiments, three or more of the plurality of optoelectronic semiconductor devices can also form a pixel, such as an RGBW pixel comprising four mini-LED or μLED chips. For example, an RGBW pixel can emit red, green, blue, and white light, as well as any mixed color light. For example, white light, red light, green light, or blue light can be generated in a fully converted form by means of an RGBW pixel.

[0033] In some embodiments, each of the plurality of optoelectronic semiconductor devices is associated with an integrated circuit that controls it. In some embodiments, two or more of the plurality of optoelectronic semiconductor devices are each associated with an integrated circuit that controls them. For example, RGB pixels can be each associated with an integrated circuit (IC). For example, one or more integrated circuits can be formed from particularly small integrated circuits (e.g., micro-integrated circuits (μICs)).

[0034] In some embodiments, a layer with light-scattering particles can be disposed above each of multiple optoelectronic semiconductor devices or above each pixel. Using such a layer with light-scattering particles can particularly improve the uniform emission of light from optoelectronic semiconductor devices.

[0035] In some implementations, multiple optoelectronic semiconductor devices of an optoelectronic fiber are connected to each other in parallel circuits. Compared to series circuits, this offers the advantage that a single defective optoelectronic semiconductor device will not cause other optoelectronic semiconductor devices on the same optoelectronic fiber to malfunction.

[0036] In some implementations, multiple optoelectronic semiconductor devices of an optoelectronic fiber are interconnected in a daisy-chain manner. In this context, daisy-chain can mean controlling multiple optoelectronic semiconductor devices via a serial bus. For example, the individual controllability of an optoelectronic semiconductor device can be achieved by connecting multiple optoelectronic semiconductor devices in series, such as each having an integrated circuit (IC) assigned to it.

[0037] In some embodiments, each of the plurality of optoelectronic semiconductor devices is formed by a light-emitting element or LED. During normal use of the optoelectronic light-emitting device, the plurality of light-emitting elements form luminous symbols or luminous text. In the case of multiple optoelectronic fibers, the light-emitting elements of each optoelectronic fiber can collectively form symbols or luminous text during normal use of the optoelectronic light-emitting device, or the light-emitting elements of each optoelectronic fiber can form multiple symbols or luminous text during normal use of the optoelectronic light-emitting device.

[0038] In some embodiments, when viewed along the longitudinal direction of the optoelectronic fiber, the spacing between at least two adjacent optoelectronic semiconductor devices is greater than or equal to 1 mm, greater than or equal to 1 cm, or greater than or equal to 2 cm. Therefore, multiple optoelectronic semiconductor devices can be integrated into, for example, a window in a motor vehicle in a particularly cost-effective manner and with relatively large spacing between them, such as greater than or equal to 2 cm. The non-light-emitting surface created by the large spacing incurs no cost or only minimal cost because there are no semiconductor components or semiconductor substrates in this surface, only an intermediate layer.

[0039] In some embodiments, the optoelectronic light-emitting device includes additional transparent sheets, particularly glass sheets, wherein a first intermediate layer and a second intermediate layer are disposed between the two transparent sheets, particularly glass sheets. The first and second intermediate layers can, for example, be formed by a thermoplastic bonding layer laminated between the two glass sheets. Accordingly, the optoelectronic light-emitting device can form a laminated glass sheet in which multiple light-emitting elements are integrated.

[0040] The present invention also relates to a method for manufacturing a photoelectric light-emitting device, comprising the following steps:

[0041] -Provide transparent sheets, especially glass sheets;

[0042] - Apply a first intermediate layer that is at least partially transparent to the transparent sheet;

[0043] - Provide at least one optoelectronic fiber, wherein the at least one optoelectronic fiber includes at least one electrical wire and a flexible carrier substrate, the at least one electrical wire extending in a longitudinal direction and connected to a plurality of optoelectronic semiconductor devices;

[0044] -At least one optoelectronic fiber is arranged on the first intermediate layer; and

[0045] - Apply a second intermediate layer that is at least partially transparent to the first intermediate layer, such that the second intermediate layer covers the first intermediate layer and at least one optoelectronic fiber.

[0046] In some embodiments, a step of arranging at least one optoelectronic fiber on a first intermediate layer is performed such that the at least one optoelectronic fiber or multiple optoelectronic semiconductor devices form symbols or characters during operation of the optoelectronic semiconductor devices. For this purpose, at least one optoelectronic fiber can be pressed into or bonded to the first intermediate layer, for example, in a corresponding arrangement or shape, such that multiple optoelectronic semiconductor devices form symbols or characters during subsequent predetermined operation of the optoelectronic semiconductor devices.

[0047] In some implementations, the method includes additional steps:

[0048] - Arrange another transparent sheet, particularly a glass sheet, on the second intermediate layer, such that the first and second intermediate layers are arranged between the two transparent sheets, particularly the glass sheets.

[0049] In some embodiments, the transparent sheet, the first intermediate layer, the second intermediate layer, and optionally an additional transparent sheet are bonded together in a further lamination step, particularly under pressure and / or temperature.

[0050] In some embodiments, the step of providing at least one optoelectronic fiber includes providing a flexible carrier substrate, arranging at least one electrical wire in a longitudinal direction on the flexible carrier substrate, and electrically connecting a plurality of optoelectronic semiconductor devices to the at least one electrical wire. Similarly, the optoelectronic semiconductor devices can also be connected to the at least one electrical wire individually or in multiples arranged on an integrated circuit in the form of a component.

[0051] In some embodiments, the step of providing at least one optoelectronic fiber further includes the step of disposing of a flexible capping layer on a flexible carrier substrate. The flexible capping layer is disposed on the flexible carrier substrate such that at least one electrical wire and a plurality of optoelectronic semiconductor devices are at least partially embedded in the flexible capping layer. Attached Figure Description

[0052] Embodiments of the present invention will now be explained in more detail with reference to the accompanying drawings. The following are schematic illustrations:

[0053] Figure 1 The structure of the laminated glass sheet is shown;

[0054] Figure 2 The structure of a photoelectric light-emitting device based on some aspects of the proposed principles is shown;

[0055] Figure 3 The structure of an optoelectronic fiber based on some aspects of the proposed principles is shown;

[0056] Figure 4An integrated circuit is shown, which has one or three optoelectronic semiconductor devices disposed thereon; and

[0057] Figure 5 A top view of a photoelectric light-emitting device based on some aspects of the proposed principles is shown. Detailed Implementation

[0058] The following embodiments and examples illustrate various aspects and combinations thereof according to the proposed principles. The embodiments and examples are not always drawn to scale. Similarly, different elements can be shown enlarged or reduced to highlight aspects. It goes without saying that the aspects and features of the embodiments and examples shown in the figures can be readily combined with each other without affecting the principles of the invention. Some aspects have regular structures or shapes. It should be noted that slight deviations from the ideal shape may occur in practice, but this does not contradict the concept of the invention.

[0059] Furthermore, the various figures, features, and aspects are not necessarily shown at the correct dimensions, and the proportions between the elements are not necessarily substantially accurate. Some aspects and features are highlighted by showing them in magnified form. However, terms such as "above," "above," "below," "under," "larger," and "smaller" are correctly represented relative to the elements in the figures. Therefore, it is feasible to deduce these relationships between elements from the figures.

[0060] Figure 1 The structure of a conventional laminated glass sheet 1 is shown. The laminated glass sheet 1 includes a first glass sheet 2 and a second glass sheet 3, and a thermoplastic bonding layer 4 that mechanically connects the two glass sheets to each other. For example, the laminated glass sheet 1 can be produced by laminating the two glass sheets together using the thermoplastic bonding layer 4.

[0061] Figure 2 The structure of a photoelectric light-emitting device 5 based on some aspects of the proposed principles is shown. The light-emitting device 5 includes a transparent sheet 6, particularly a glass sheet, on which a first intermediate layer 7, at least partially transparent, is disposed. Furthermore, the light-emitting device 5 includes a network 8 composed of photoelectric fibers disposed on the first intermediate layer 7. A second intermediate layer 9, at least partially transparent, is disposed above and covers the photoelectric fibers 11, and another transparent sheet 10, particularly a glass sheet, is disposed above the second intermediate layer 9.

[0062] The composite consisting of the layers or sheets shown is mechanically connected to each other in such a way that the two transparent sheets 6, 10 can be laminated together, for example, through two intermediate layers 7, 9. Alternatively, the composite consisting of the layers or sheets shown can be bonded to each other.

[0063] The network 8, composed of optoelectronic fibers, can include one or more optoelectronic fibers 11 (e.g., Figure 3 (As shown). Figure 3 The optoelectronic fiber 11 shown has a first electrical conductor 12 and a second electrical conductor 13 extending along the longitudinal direction L of the optoelectronic fiber 11. In addition, the optoelectronic fiber 11 has a plurality of optoelectronic semiconductor devices 14, which are electrically connected to the two electrical conductors 12 and 13 and are distributed in the longitudinal direction of the optoelectronic fiber 11.

[0064] In addition, the optoelectronic fiber 11 also has: a flexible carrier substrate 15 on which two electrical wires 12 and 13 and a plurality of optoelectronic semiconductor devices 14 are disposed; and a flexible cover layer 16 disposed on the flexible carrier substrate 15, wherein the electrical wires 12 and 13 and the plurality of optoelectronic semiconductor devices 14 are embedded in the flexible cover layer.

[0065] The flexible carrier substrate 15 and the flexible capping layer 16 surround the electrical conductors 12, 13 and the plurality of optoelectronic semiconductor devices 14, and impart the required mechanical stability to the optoelectronic fiber 11. In addition, the flexible capping layer 16 and the flexible carrier layer 15 can protect the electrical conductors 12, 13 and the plurality of optoelectronic semiconductor devices 14 from damage that may occur during further processing of the optoelectronic fiber 11.

[0066] Therefore, the flexible carrier substrate 15 and the flexible capping layer 16 can comprise substantially transparent materials that also possess flexible or elastic properties. For example, the flexible carrier substrate 15 and the flexible capping layer 16 may be made of materials such as PVB, EVA, silicone, acrylic resin, or epoxy resin.

[0067] according to Figure 3 Three optoelectronic semiconductor devices 14 are respectively arranged on the integrated circuit 17 to form pixels. For example, the three optoelectronic semiconductor devices 14 can respectively form RGB pixels on the integrated circuit 17.

[0068] exist Figure 4 The figure illustrates two embodiments of a corresponding assembly 19 comprising an integrated circuit 17 and semiconductor devices 14 disposed thereon. On the left side of the figure, the integrated circuit 17 is shown with one optoelectronic semiconductor device 14 disposed on it, while on the right side, the integrated circuit 17 is shown with three optoelectronic semiconductor devices 14 disposed on it. The two lower portions of the figure illustrate the potting compound 18 of the assembly 19, which has cavities 20 on the optoelectronic semiconductor devices 14, allowing light from the optoelectronic semiconductor devices 14 to be emitted from the assembly 19.

[0069] Viewed transversely along the length direction L, the optoelectronic fiber 11 has a rectangular cross-section. Here, the first portion of the cross-section is formed by a flexible carrier substrate 15 and the second portion is formed by a flexible capping layer 16. Electrical wires 12 and 13, as well as a plurality of optoelectronic semiconductor devices 14 or integrated circuits 17, are arranged between the flexible carrier substrate 15 and the flexible capping layer 16.

[0070] The cross-section has a height H and a width B. Here, the height H is particularly less than or equal to 200 μm, or less than or equal to 150 μm, and the width B is particularly less than or equal to 300 μm, or less than or equal to 200 μm. This height allows the optoelectronic fiber 11 to be integrated between two intermediate layers 7 and 9 between the two transparent sheets 6 and 10, because the profile generated by the optoelectronic fiber 11 can be compensated for by the two intermediate layers 7 and 9.

[0071] Figure 5 A top view of a photoelectroluminescent device 5 based on some aspects of the proposed principles is shown. The photoelectroluminescent device 5 has a plurality of photoelectro-optical fibers 11 arranged between two intermediate layers 7, 9. Figure 5 The photoelectric fiber 11 is shown as an example.

[0072] The optoelectronic fiber 11 can be arranged between the two intermediate layers 7 and 9, such that at least a subset of the plurality of optoelectronic semiconductor devices 14 forms luminous symbols or luminous text during normal use of the optoelectronic light-emitting device 5. However, similarly, all of the plurality of optoelectronic semiconductor devices 14 can also collectively form symbols or luminous text during normal use of the optoelectronic light-emitting device 5. Alternatively or additionally, at least some of the optoelectronic semiconductor devices 14 can be arbitrarily arranged relative to each other and, for example, form dotted patterns during normal use of the optoelectronic light-emitting device 5.

[0073] List of reference numerals

[0074] 1. Laminated glass sheet

[0075] 2 First glass slide

[0076] 3 Second glass plate

[0077] 4. Thermoplastic bonding layer

[0078] 5. Optoelectronic light-emitting devices

[0079] 6. Transparent sheet

[0080] 7. At least partially transparent first intermediate layer

[0081] 8. A network composed of optoelectronic fibers 11

[0082] 9. At least partially transparent second intermediate layer

[0083] 10. Other transparent sheets

[0084] 11 Optoelectronic Fibers

[0085] 12 First conductor

[0086] 13 Second conductor

[0087] 14 Optoelectronic Semiconductor Devices

[0088] 15 Flexible carrier substrate

[0089] 16 Flexible Covering Layer

[0090] 17 Integrated Circuits

[0091] 18. Potting components

[0092] 19 components

[0093] 20 chambers

[0094] L (vertical direction)

[0095] H height

[0096] B width

Claims

1. A photoelectric light-emitting device (5), comprising: A transparent sheet (6), and a first intermediate layer (7) that is at least partially transparent, are disposed on the transparent sheet; At least one optoelectronic fiber (11) is disposed on the first intermediate layer (7), the at least one optoelectronic fiber having at least one electrical conductor (12, 13) extending in a longitudinal direction (L) and connected to a plurality of optoelectronic semiconductor devices (14), wherein the optoelectronic fiber (11) includes a flexible carrier substrate (15), the at least one electrical conductor (12, 13) and the plurality of optoelectronic semiconductor devices (14) are disposed on the flexible carrier substrate; as well as A second intermediate layer (9) that is at least partially transparent, wherein the second intermediate layer is disposed on the first intermediate layer (7) and covers the at least one optoelectronic fiber (11).

2. The photoelectric light-emitting device according to claim 1, in, The at least one electrical conductor (12, 13) is blackened or comprises a substantially transparent material.

3. The photoelectric light-emitting device according to claim 1 or 2, in, The optoelectronic fiber (11) has a flexible cover layer (16) disposed on the flexible carrier substrate (15), and the at least one electrical conductor (12, 13) and the plurality of optoelectronic semiconductor devices (14) are embedded in the flexible cover layer (16).

4. The photoelectric light-emitting device according to claim 3, in, The flexible carrier substrate (15) and / or the flexible cover layer (16) include at least one of PVB, EVA, silicone resin, acrylic resin and epoxy resin, and wherein the flexible carrier substrate (15) and the flexible cover layer (16) may optionally have the same material.

5. The photoelectric light-emitting device according to claim 3, in, The material of the flexible carrier substrate (15) and / or the material of the flexible cover layer (16) has a refractive index that substantially corresponds to the refractive index of the material of the first intermediate layer (7) and / or the second intermediate layer (9).

6. The photoelectric light-emitting device according to claim 1 or 2, in, The optoelectronic fiber (11) has one of the following cross-sectional shapes when viewed transversely to the longitudinal direction (L): rectangle; square; Circular; oval; and Trapezoid.

7. The photoelectric light-emitting device according to claim 1 or 2, in, The height (H) and / or width (B) or the diameter or radius of the cross section of the optoelectronic fiber (11) is less than or equal to 200 μm.

8. The photoelectric light-emitting device according to claim 1 or 2, in, The optoelectronic fiber (11) has a length of at least 1 m.

9. The photoelectric light-emitting device according to claim 1 or 2, in, Each of the plurality of optoelectronic semiconductor devices (14) is associated with an integrated circuit (17) that manipulates it, or, Two or more of the plurality of optoelectronic semiconductor devices (14) are associated with an integrated circuit (17) that manipulates them.

10. The photoelectric light-emitting device according to claim 1 or 2, in, The plurality of optoelectronic semiconductor devices (14) are connected to each other in the form of a parallel circuit.

11. The photoelectric light-emitting device according to claim 1 or 2, in, The plurality of optoelectronic semiconductor devices (14) are interconnected with each other in a daisy chain manner.

12. The photoelectric light-emitting device according to claim 1 or 2, in, The at least one optoelectronic fiber (11) or the plurality of optoelectronic semiconductor devices (14) form symbols or text during operation of the optoelectronic semiconductor device (14).

13. The photoelectric light-emitting device according to claim 1 or 2, It also includes an additional transparent sheet (10), wherein the first intermediate layer (7) and the second intermediate layer (9) are arranged between the two transparent sheets (6, 10).

14. The photoelectric light-emitting device according to claim 1 or 2, in, At least two intersecting optoelectronic fibers (11) have a height of less than or equal to 300 μm at their intersection.

15. The photoelectric light-emitting device according to claim 1 or 2, in, When viewed along the longitudinal direction (L), the spacing between at least two adjacent optoelectronic semiconductor devices (14) is greater than or equal to 1 mm.

16. The photoelectric light-emitting device according to claim 1, in, The transparent sheet (6) is a glass sheet.

17. The photoelectric light-emitting device according to claim 1 or 2, in, The height (H) and / or width (B) or the diameter or radius of the cross section of the optoelectronic fiber (11) is less than or equal to 150 μm.

18. The photoelectric light-emitting device according to claim 13, in, The transparent sheet (6) and the other transparent sheet (10) are glass sheets, and the first intermediate layer (7) and the second intermediate layer (9) are arranged between the two glass sheets.

19. A method for manufacturing an optoelectronic light-emitting device (5), comprising the following steps: Provide transparent sheet (6); A first intermediate layer (7) that is at least partially transparent is applied to the transparent sheet (6); At least one optoelectronic fiber (11) is provided, wherein the at least one optoelectronic fiber (11) has at least one electrical conductor (12, 13) and includes a flexible carrier substrate (15), the at least one electrical conductor extends in a longitudinal direction (L) and is connected to a plurality of optoelectronic semiconductor devices (14); The at least one optoelectronic fiber (11) is arranged on the first intermediate layer (7); and A second intermediate layer (9) that is at least partially transparent is applied to the first intermediate layer (7) such that the second intermediate layer (9) covers the first intermediate layer (7) and the at least one optoelectronic fiber (11).

20. The method according to claim 19, in, The step of arranging the at least one optoelectronic fiber (11) on the first intermediate layer (7) is performed such that the at least one optoelectronic fiber (11) or the plurality of optoelectronic semiconductor devices (14) form symbols or text during operation of the optoelectronic semiconductor devices (14).

21. The method according to claim 19 or 20, It also includes arranging another transparent sheet (10) on the second intermediate layer (9), such that the first intermediate layer (7) and the second intermediate layer (9) are arranged between the two transparent sheets (6, 10); and / or It also includes a lamination step, wherein the transparent sheet (6), the first intermediate layer (7), the second intermediate layer (9) and an optional additional transparent sheet (10) are connected to each other.

22. The method according to claim 19 or 20, in, The step of providing the at least one optoelectronic fiber (11) includes the step of providing the flexible carrier substrate (15), the step of arranging at least one electrical wire (12, 13) along the longitudinal direction (L) on the flexible carrier substrate (15), and the step of electrically connecting a plurality of optoelectronic semiconductor devices (14) to the at least one electrical wire (12, 13).

23. The method according to claim 22, in, The step of providing the at least one optoelectronic fiber (11) further includes the step of arranging a flexible cover layer (16) on the flexible carrier substrate (15) such that the at least one electrical conductor (12, 13) and the plurality of optoelectronic semiconductor devices (14) are at least partially embedded in the flexible cover layer (16).

24. The method according to claim 19, in, The transparent sheet (6) is a glass sheet.

25. The method according to claim 21, in, The transparent sheet (6) and the other transparent sheet (10) are glass sheets, and the first intermediate layer (7) and the second intermediate layer (9) are arranged between the two glass sheets.

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