A resistance evaporation coating device and an evaporation coating method

Abstract

The application belongs to the technical field of evaporation equipment, and particularly relates to a resistance evaporation mechanism, resistance evaporation equipment and a method, which comprises two support frames arranged symmetrically left and right, each of the support frames comprises a crossbeam located at the middle and electrode fixing plates located at both sides, the electrode fixing plates are perpendicular to the crossbeam, electrodes are fixed on the electrode fixing plates, an evaporation source bracket is arranged in the middle of the two support frames, a crucible is arranged on the bracket, the crucible is cylindrical, and evaporation materials are placed in the crucible. The application improves the evaporation process efficiency and prolongs the service life of the equipment.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of resistance evaporation equipment. Specifically, it relates to a resistance evaporation mechanism, a resistance coating equipment with the mechanism, and an evaporation coating method. BACKGROUND

[0002] The resistance evaporation vacuum coating technology is a method of using resistance heating in a vacuum chamber to evaporate a linear or sheet-shaped coating material into an appropriate shape of resistance wire evaporation source, and then placing the evaporation material on the resistance wire. The coating material is melted, evaporated, or sublimated by the Joule heat of the electric current, and the vaporized coating material molecules are deposited on the substrate to obtain a smooth and high-reflectivity film layer.

[0003] The resistance evaporation vacuum coating is currently the most common and simplest coating technology, which is generally suitable for coating materials with a melting point below 1500℃ and does not require high film layer. The equipment is cheap, has high production capacity, fast efficiency, and simple process, and thus is widely used and popular.

[0004] The resistance evaporation vacuum coating equipment is mainly composed of a vacuum chamber and a vacuum pumping system, and the vacuum chamber has an evaporation source (i.e., an evaporation heater), a substrate and a substrate holder, a substrate heater, an exhaust system, etc. The coating material is placed in the evaporation source in the vacuum chamber, and is evaporated by the evaporation source under high vacuum conditions. When the average free path of the vapor molecules is greater than the linear size of the vacuum chamber, the atoms and molecules of the film material vapor escape from the surface of the evaporation source and rarely collide with or are hindered by other molecules or atoms, and can directly reach the surface of the coated substrate. Since the substrate temperature is low, the film material vapor particles condense on the substrate to form a film. This method requires that the evaporation source material has a high melting point, a low saturated vapor pressure, stable chemical properties, does not react with the coating material at high temperatures, has good heat resistance, a small power density variation, etc. The shape of the evaporation source mainly includes multiple wire spiral, U-shaped, sinusoidal wave-shaped, thin plate-shaped, boat-shaped, and conical basket-shaped, etc. For example, Chinese invention patent 201820171682.6 discloses an evaporation assembly of a resistance evaporation vacuum coating machine, which includes a base, positive and negative electrode pins vertically and spaced apart on the base, first and second clamping blocks installed on the upper ends of the positive and negative electrode pins, respectively, a placement plate installed at the first and second clamping blocks at both ends, and an evaporation boat placed in the slot of the placement plate. The evaporation boat includes a slot body and wings horizontally extended from both ends of the slot body. The slot body is seated in the slot of the placement plate, and the wings are erected on the placement plate. It is suitable for large-scale coating operations and can be reused.

[0005] But at present, the film layer plated by the resistance evaporation vacuum coating equipment also has certain limitations, mainly reflected in that for refractory metals, it has low vapor pressure, it is difficult to make a thin film, and some elements are easy to react with the heating wire to form an alloy, causing damage to the equipment, and it is not easy to obtain an alloy film with uniform composition. SUMMARY

[0006] In view of the problems existing in the prior art, the present application provides a resistance evaporation mechanism, a resistance coating equipment with the above mechanism and an evaporation coating method.

[0007] The complete technical solution of the present application comprises:

[0008] A resistance evaporation mechanism comprises two support frames arranged symmetrically left and right, each support frame comprises a crossbeam at the middle and electrode fixing plates at both sides, the electrode fixing plates are perpendicular to the crossbeam, electrodes are fixed on the electrode fixing plates, an evaporation source bracket is arranged in the middle of the two support frames, a crucible is arranged on the bracket, the crucible is cylindrical, and evaporation materials are placed in the interior of the crucible.

[0009] Further, the length of the crossbeam is greater than that of the electrode fixing plate.

[0010] Further, the electrodes are fixed on the electrode fixing plates by fixing bolts.

[0011] Further, two electrodes are respectively arranged on each support frame, and the two support frames form two groups of electrodes, one group being positive electrodes and the other group being negative electrodes.

[0012] Further, the depth of the crucible is greater than the diameter of the cross section thereof.

[0013] Further, a resistance evaporation coating equipment with the resistance evaporation mechanism comprises an evaporation chamber with an inclined surface, a workpiece disc system is arranged at the upper middle part of the evaporation chamber, the workpiece disc system enables the workpiece disc to rotate uniformly according to the setting, the resistance evaporation mechanism is arranged below the workpiece disc system, an ion source system is embeddedly arranged on the wall of the evaporation chamber, the ion source system is a system for providing workpiece pre-cleaning and etching process, and a vacuum pumping system is arranged at the back side of the evaporation chamber.

[0014] Further, the evaporation chamber has a boat-shaped structure.

[0015] Further, a method for resistance evaporation coating by using the equipment comprises the following steps:

[0016] (1) After a 6-inch silicon wafer workpiece is installed on a workpiece disc, the workpiece disc carrying the workpiece is loaded on a workpiece table, evaporation materials are loaded into the crucible of the evaporation source, and the evaporation chamber is closed.

[0017] (2) The vacuum degree of the boat-shaped evaporation chamber is extracted to 8.0E-7 torr, and the ion source is started to pre-clean the surface of the workpiece for 10 minutes.

[0018] (3) After the ion source cleaning process is completed, the corresponding process parameters of the resistance evaporation source are selected, wherein the evaporation material is aluminum, and the process factor ratio is: aluminum 72.26, and the evaporation rate is:

[0019] (4) The workpiece disc is started to rotate at a speed of 7 revolutions per minute, the vacuum degree of the boat-shaped evaporation chamber is extracted to 8.0E-7 torr, and after the vacuum is stable for 3 minutes, the evaporation source power is started, and according to the process parameters in step (3), the material aluminum is pre-melted first, when the solid is completely melted into liquid, the evaporation source shutter is opened, and the film is plated according to the evaporation rate, and the process is monitored by the process control probe, when the film thickness reaches , the process is ended, the evaporation source shutter is closed, the workpiece disc rotation is closed, and the evaporation source power is closed.

[0020] The advantages of the present application relative to the prior art are:

[0021] 1. The evaporation mechanism is optimally designed, the crucible volume of the evaporation source is large, more evaporation materials can be contained, and the continuous resistance evaporation process is suitable. Meanwhile, the structure design of the double support frame improves the structural stability, and two electrodes are used in each support frame, so that a larger voltage and current can be used, the evaporation process efficiency is improved, and the optimization of the resistance evaporation mechanism is realized.

[0022] 2. The structure design of the crucible mode and the heating sheet avoids the problem that in the traditional heating wire heating mode, some elements are easy to react with the heating wire to form an alloy, causing damage to the equipment, prolonging the service life of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the resistance evaporation mechanism of the present application.

[0024] Figure 2 It is a general structural schematic diagram of the resistance evaporation film coating equipment of the present application.

[0025] Figure 3 It is a sectional view of the evaporation chamber.

[0026] In the figure: 1-evaporation chamber, 2-evaporation chamber door, 3-workpiece disc system, 4-resistance evaporation mechanism, 5-ion source system, 6-vacuum extraction system, 7-support frame, 8-fixing bolt, 9-electrode, 10-evaporation source, 11-inclined surface. DETAILED DESCRIPTION

[0027] The present application is described in detail below in conjunction with the embodiments and drawings, but it should be understood that the embodiments and drawings are only used to exemplarily describe the present application and cannot constitute any limitation to the protection scope of the present application. All reasonable variations and combinations within the scope of the inventive concept of the present application fall within the protection scope of the present application.

[0028] The present application first discloses a resistance evaporation mechanism, as shown in Figure 1 two support frames 7 are symmetrically arranged, each support frame includes a crossbeam in the middle and electrode fixing plates on both sides, the electrode fixing plates are perpendicular to the crossbeam, the length of the crossbeam is greater than that of the electrode fixing plates, and electrodes 9 are fixed on the electrode fixing plates through fixing bolts 8, wherein the electrodes carried by the two support frames are a positive electrode and a negative electrode, and an evaporation source bracket is arranged in the middle of the two support frames 7, the evaporation source bracket is made of sheet material with good heat conduction performance, and an evaporation source 10 is arranged on the bracket, the evaporation source includes a crucible, the crucible is cylindrical, evaporation material is placed in the crucible, and the depth of the crucible is greater than the diameter of the cross section. The crucible designed in the present application has a large volume and can hold more evaporation material, which can be suitable for continuous resistance evaporation process. At the same time, the reasonable structural design of the double support frames improves the system stability, and two electrodes are used in each support frame, which can use larger voltage and current, improves the evaporation process, and realizes the optimization of the resistance evaporation mechanism.

[0029] Secondly, the present application discloses a resistance evaporation coating equipment with the above-mentioned resistance evaporation mechanism, as shown in Figure 2 the evaporation chamber 1 is of a boat type structure. The evaporation chamber 1 is of a front opening door structure, the front is provided with an evaporation chamber door 2, the upper middle part of the evaporation chamber is provided with a workpiece disc system 3, the workpiece disc system enables the workpiece disc to rotate uniformly according to the setting, so that the ion source cleans the workpiece, the ion source etching process or the electron beam evaporation coating is good in uniformity. The resistance evaporation mechanism 4 is arranged below the workpiece disc system 3, and the resistance evaporation mechanism is a system for providing ion material in a vapor state of coating material. The ion source system 5 is embeddedly arranged on the wall of the evaporation chamber, and the ion source system is a system for providing a workpiece pre-cleaning and etching process. The vacuum pumping system 6 is arranged on the back side of the evaporation chamber.

[0030] In addition, the power supply system and the process gas system are further included, the power supply system provides power for the equipment, and the process gas system provides process gas for the equipment.

[0031] The evaporation chamber is designed as a boat type structure, as shown in Figure 3As shown, from its longitudinal section, it comprises a top surface, a bottom surface, a first side surface perpendicular to the top surface and the bottom surface, a second side surface perpendicular to the top surface, and an inclined surface 11 connecting the second side surface and the bottom surface, that is, a bevel will be made on the side surface of the rectangular evaporation chamber. The ion source is installed on the bevel. The principle of designing the bevel is that the ion source center emits a ray to the 2 / 3 of the radius of the center of the workpiece disc, and the manufacturing angle of the bevel and the installation position of the ion source are designed. The bevel is designed with an installation caliber for installing the ion source, and the ion source is installed in a semi-embedded form. The control line, power line, process gas pipe, and cooling water pipe of the ion source are exposed to the air and are not located in the evaporation chamber. Compared with the case where the ion source is arranged in the evaporation chamber, the above design reduces the air exhaust source of the evaporation chamber and can obtain a more pure film layer quality. The quality and stability of the film layer prepared by different devices are less different, that is, the consistency is good.

[0032] On the other hand, since the rectangular evaporation chamber is changed into a boat-shaped evaporation chamber with a bevel in the present application, the support stability of the evaporation chamber is different from that of the traditional evaporation chamber. Therefore, in the design of the size and angle of the bevel, the size and weight of the whole evaporation chamber and the ion source, the angle and distance between the ion source and the workpiece disc, and the weight of each component need to be comprehensively considered to ensure the support stability of the evaporation chamber during the film deposition process and prolong the service life of the equipment.

[0033] In the above parameters, since the center emits a ray to the 2 / 3 of the radius of the center of the workpiece disc 3, the angle between the bevel and the ground and the distance between the ion source and the workpiece disc are fixed values. Specifically, the included angle between the bevel and the bottom surface is 120°, the distance between the center point of the ion source surface and the 2 / 3 of the radius of the center of the workpiece disc is 225 mm, and the included angle between the straight line between the center point of the ion source surface and the 2 / 3 of the radius of the center of the workpiece disc and the horizontal direction of the workpiece disc is 30°. The installation position of the ion source on the bevel is that the distance from the starting point of the bottom bevel to the center of the bevel is 160 mm.

[0034] Under the above condition limitation, for different parameters of the evaporation chamber, the height ratio of the top surface, the bottom surface, and the side edge of the evaporation chamber, the weight of the ion source, and the overall weight of the evaporation chamber are designed, the support stability of the evaporation chamber during the respective film deposition process is recorded, and the recorded large data is analyzed to select reasonable process parameters. Through analysis, the following determination method is selected:

[0035]

[0036] In the formula, L1 is the length of the top surface of the evaporation chamber, L2 is the length of the bottom surface of the bottom surface of the evaporation chamber, H is the height of the evaporation chamber, W1 is the weight of the ion source, W2 is the weight of the evaporation chamber, k is a coefficient, and the value range is 9-11, preferably 9.72.

[0037] According to the above principle, combined with the actual space condition of the workshop, the upper edge L1 is selected as 690 mm, the lower edge L2 is selected as 535 mm, the evaporation chamber height H is selected as 450 mm, the ion source weight W1 is selected as 40 KG, and the evaporation chamber weight W2 is selected as 540 KG.

[0038] A method for resistance evaporation film coating by using the device of the application, comprising:

[0039] The ion source is semi-embeddedly installed on the slope of the boat-shaped evaporation chamber, the electron beam evaporation source is located at the bottom of the boat-shaped evaporation chamber, the workpiece disc is located at the top of the boat-shaped evaporation chamber, and the crystal oscillator probe is installed on the side wall of the evaporation chamber near the workpiece disc. Specifically, the following steps are included:

[0040] (1) After the 6-inch silicon wafer workpiece is installed on the workpiece disc, the workpiece disc carrying the workpiece is loaded on the workpiece table, the evaporation material is loaded into the crucible of the evaporation source, and the evaporation chamber is closed.

[0041] (2) The vacuum degree of the boat-shaped evaporation chamber is pumped to 8.0E-7 torr, and the ion source is started to pre-clean the surface of the workpiece for 10 minutes.

[0042] (3) After the ion source cleaning process is completed, the corresponding process parameters of the resistance evaporation source are selected, wherein the evaporation material is aluminum, the process factor ratio is: aluminum 72.26, and the evaporation rate is:

[0043] (4) The workpiece disc is started to rotate at a speed of 7 revolutions per minute, the vacuum degree of the boat-shaped evaporation chamber is pumped to 8.0E-7 torr, and after the vacuum is stable for 3 minutes, the evaporation source power is started, the process parameters in step (3) are followed, the material aluminum is pre-melted, when the solid is completely melted into liquid, the evaporation source shutter is opened, and the film coating is started according to the evaporation rate, and the process control probe monitors the process, when the film coating thickness reaches , the process is ended, the evaporation source shutter is closed, the workpiece disc rotation is stopped, and the evaporation source power is turned off.

[0044] The structure of the boat-shaped evaporation chamber designed in this way is used for the type of resistance evaporation device, including single-piece boat-shaped resistance evaporation mechanism, single / multi-piece boat-shaped resistance evaporation device with workpiece loading and unloading chamber, and multi-cavity boat-shaped resistance evaporation device.

[0045] Preferably, the resistance evaporation coating equipment of the present application can be a single-piece evaporation coating equipment, which comprises an evaporation chamber, a workpiece disc rotating system, a resistance evaporation mechanism, a vacuum pumping system, a power supply system, a semi-embedded ion source system, a process gas system, etc. It is a compact resistance evaporation system, with small floor space, simple operation and maintenance, and is suitable for trial production of small batches of workpieces.

[0046] Preferably, the resistance evaporation coating equipment of the present application can also be an evaporation coating equipment with a single-piece workpiece loading and unloading chamber, which comprises an evaporation chamber, a workpiece loading and unloading chamber conveying system, a workpiece disc rotating system, a resistance evaporation mechanism, a vacuum pumping system, a power supply system, a semi-embedded ion source system, a process gas system, etc.

[0047] The evaporation chamber is a resistance evaporation evaporation chamber. The workpiece loading and unloading chamber conveying system includes a conveying manipulator for loading workpieces (from the workpiece loading and unloading chamber to the evaporation chamber) and unloading workpieces (from the evaporation chamber to the workpiece loading and unloading chamber), and a high-vacuum isolation valve for isolating the workpiece loading and unloading chamber and the evaporation chamber. The workpiece disc rotating system allows the workpiece disc to rotate uniformly according to the settings, so that the workpiece is cleaned by the ion source or the uniformity of the resistance evaporation coating is good. The resistance evaporation mechanism provides ionized material in a vapor state. The vacuum pumping system is a system that independently pumps the workpiece loading and unloading chamber and the evaporation chamber, wherein the workpiece loading and unloading chamber is equipped with a low-vacuum pumping system, the evaporation chamber is equipped with a low-vacuum and high-vacuum pumping system, and the workpiece loading and unloading chamber and the evaporation chamber pumping systems are collectively referred to as the vacuum pumping system. The semi-embedded ion source system provides pre-cleaning of the workpiece. The process gas system provides process gas.

[0048] The use of a single-piece evaporation coating equipment designed with a workpiece loading and unloading chamber conveying system allows workpieces to be loaded and unloaded in the workpiece loading and unloading chamber, so that the evaporation chamber can be maintained at a relatively low vacuum, and the workpiece loading and unloading chamber can be pumped to a low vacuum in a relatively short time. Generally, the time required to pump from atmospheric pressure to a low vacuum and a process high vacuum is about 30 minutes. With this configuration, only one high vacuum needs to be pumped in the process, and the time required for the evaporation chamber to recover to the process high vacuum is 3-5 minutes or less. The overall design saves time and improves production efficiency. The film layers of different materials deposited by different equipment have good quality, purity, consistency, and less deviation.

[0049] Preferably, the resistance evaporation coating equipment of the present application can also be a multi-piece boat-type resistance evaporation equipment with a workpiece loading chamber, which comprises a workpiece loading and unloading chamber multi-piece system designed with a manipulator and a workpiece clamping device, and can load multiple workpieces at a time. It can complete batch coating under a relatively low vacuum, has high production efficiency, and has relatively good stability of coating quality.

[0050] When the film is plated by using the evaporation system of the evaporation chamber resistance, the ion source pre-cleaning process removes impurities and surface oxides on the workpiece surface, the workpiece surface is pure, and the resistance evaporation material is better combined with the surface, and compared with the ion source arranged in the evaporation chamber, the evaporation chamber gas source is reduced, a more pure compound film layer can be obtained, and the quality and stability of the workpiece film layer prepared by different equipment are less different, that is, the consistency is good.

[0051] Preferably, the resistance evaporation film plating equipment of the present application can also be a multi-cavity ship type resistance evaporation equipment, which comprises a multi-piece workpiece loading and unloading chamber system, a workpiece transfer chamber system, an evaporation chamber system, a workpiece loading and unloading chamber, and high vacuum isolation valves between each evaporation chamber and the workpiece transfer chamber to realize independent vacuum. The workpiece loading and unloading chamber system has a front opening door structure, is designed with a plurality of workpiece clamps, and is provided with a vacuum pumping system. The workpiece transfer chamber system is designed with an upper opening cover plate structure, is designed with a manipulator, and the manipulator is responsible for taking and delivering workpieces between the workpiece loading and unloading chamber and the evaporation chamber, and is provided with a vacuum pumping system. The evaporation chamber is provided with a resistance evaporation mechanism, a workpiece disc system, an ion source system, a vacuum pumping system, a process gas system, a power supply system, etc. Different resistance evaporation film plating processes can be simultaneously satisfied, the processes performed in different evaporation chambers do not interfere with each other, and the same process can also be combined for use.

[0052] In addition, since the present application has a plurality of evaporation chambers, a plurality of different film plating processes can be performed, and since the plurality of evaporation chambers share one workpiece loading and unloading chamber and workpiece transfer chamber, and the time required from low vacuum to high vacuum and the film plating process are different, in order to efficiently complete the multi-process vacuum film plating process and reduce the idle time and waiting time of each link, the film plating process of the multi-evaporation chamber needs to be controlled. Specifically, it includes:

[0053] First, the film plating time of different film plating processes is pre-calibrated. In the actual film plating process, the evaporation source can be an oxide evaporation source or a metal evaporation source, or a combination of the two. Since different types of evaporation sources have different evaporation and deposition rates, in order to obtain more uniform and accurate film plating time estimation, the present application calibrates different evaporation sources before reaction. The specific method is to select sample workpieces, record the evaporation source to workpiece distance, evaporation power, gas flow, workpiece quantity, workpiece disc rotation speed, etc. After film plating, the film thickness of the sample and the uniformity of the film on the surface of the sample are measured, and the workpieces with non-uniformity not meeting the requirements are removed. For the remaining workpieces, analyze whether there is a linear relationship between each parameter and the film thickness. For parameters with non-linear relationship, fixed parameter values are used during film plating. For parameters with linear relationship, record the linear relationship between the film thickness and the linear relationship, and store the relationship in the control system as a preset setting, which can be selected during actual film plating. After final determination, the corresponding linear relationship between the evaporation power, film plating time and film thickness is selected.

[0054] Subsequently, the workpiece loading / unloading and vacuuming time in the workpiece loading / unloading chamber is set as t1, the workpiece transfer and vacuuming time in the workpiece transfer chamber is set as t2, and the required film forming time is calculated according to the film forming thickness requirement of each evaporation chamber by the previous method. Meanwhile, the film forming time of each evaporation chamber is added with the corresponding sample feeding and vacuuming, sample feeding time (transferred from the workpiece loading / unloading chamber to the evaporation chamber), sample feeding time (transferred from the evaporation chamber to the workpiece loading / unloading chamber), sample feeding and vacuuming time, and the vacuuming time as a whole process cycle, and the process cycle time of each evaporation chamber is compared to select a reasonable process sequence.

[0055] The above application is only some embodiments of the application. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the application, which are all within the protection scope of the application.

Claims

1. A resistance evaporation coating apparatus with a resistance evaporation mechanism, characterized in that, The resistance evaporation mechanism comprises two support frames arranged symmetrically left and right, each support frame comprises a crossbeam at the middle and electrode fixing plates at both sides, the electrode fixing plates are perpendicular to the crossbeam, electrodes are fixed on the electrode fixing plates, two electrodes are used in each support frame, and the resistance evaporation mechanism has four electrodes in total; an evaporation source bracket is arranged in the middle of the two support frames, a crucible is arranged on the bracket, the crucible is cylindrical, and evaporation materials are arranged in the crucible; The resistance evaporation coating equipment comprises an evaporation chamber with an inclined surface, a workpiece disc system is arranged at the upper middle part of the evaporation chamber, the workpiece disc system enables the workpiece disc to rotate uniformly according to the setting, a resistance evaporation mechanism is arranged below the workpiece disc system, an ion source system is embedded on the wall of the evaporation chamber, the ion source system is a system for providing workpiece pre-cleaning and etching process, and a vacuum pumping system is arranged at the back side of the evaporation chamber; The evaporation chamber has a boat-shaped structure; from the longitudinal section, the evaporation chamber comprises a top surface, a bottom surface, a first side surface perpendicular to the top surface and the bottom surface, a second side surface perpendicular to the top surface, and an inclined surface connecting the second side surface and the bottom surface, that is, a slope is made on the side surface of the rectangular evaporation chamber; The control line, power line, process gas pipe and cooling water pipe of the ion source are not located in the evaporation chamber; The angle of the slope and the installation position of the ion source are designed according to the point that the radius of 2 / 3 of the ion source center is taken as the starting point of the radial line to the center of the workpiece disc; The angle between the slope and the bottom surface is 120°, the distance between the center point of the surface of the ion source and the point at the position of 2 / 3 of the radius of the workpiece disc taken as the starting point is 225 mm, the angle between the straight line between the two points at the position of 2 / 3 of the radius of the workpiece disc taken as the starting point and the horizontal direction of the workpiece disc is 30°, and the installation position of the ion source on the slope is 160 mm from the starting point of the bottom slope to the center of the slope.

2. The resistive evaporation coating apparatus according to claim 1, wherein The length of the crossbeam is greater than that of the electrode fixing plate.

3. The resistive evaporation coating apparatus according to claim 1, wherein The electrode is fixed on the electrode fixing plate by a fixing bolt.

4. The resistive evaporation coating apparatus according to claim 1, wherein Two electrodes are arranged on each support frame.

5. The resistive evaporation coating apparatus according to claim 1, wherein The depth of the crucible is greater than the diameter of the cross section of the crucible.

6. A method of resistive evaporation coating using the apparatus according to any one of claims 1 to 5, characterized in that, Specifically comprising the following steps: (1) after a 6-inch silicon wafer workpiece is installed on the workpiece disc, the workpiece disc carrying the workpiece is loaded on the workpiece table, evaporation materials are loaded into the crucible of the evaporation source, and the evaporation chamber is closed; (2) the vacuum degree of the boat-shaped process evaporation chamber is pumped to 8.0E-7 torr, and the ion source is started to pre-clean the surface of the workpiece for 10 minutes. (3) After the ion source cleaning process is completed, the corresponding process parameters of the resistance evaporation source are selected, wherein the evaporation material is aluminum, and the process factor ratio is: aluminum 72.26, evaporation rate: (4) Start the workpiece tray and rotate it at a speed of 7 rpm to evacuate the vacuum degree of the ship-shaped process vapor deposition chamber to 8.0E-7 torr. After the vacuum stabilizes for 3 minutes, start the evaporation source power supply. According to the process parameters in step (3), first pre-melt the aluminum material. When the solid has completely melted into liquid, open the evaporation source baffle and start according to the process parameters in step (3). The evaporation rate is used for coating, and the process is monitored by a crystal control probe. When the coating thickness reaches... When the process is complete, close the evaporator baffle, stop the workpiece disc rotation, and turn off the evaporator power supply.

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