Array substrate, display panel and display device

Abstract

This invention relates to the field of display technology and discloses an array substrate, a display panel, and a display device. The array substrate includes: a substrate, which includes at least one first sub-part and a second sub-part, the second sub-part at least partially surrounding the first sub-part; at least one driving chip, which is correspondingly disposed with respect to the first sub-part and bonded to one side of the corresponding first sub-part; the distance between the edge of the driving chip and the edge of the corresponding first sub-part is greater than 0; and the thickness of the first sub-part is less than the thickness of the second sub-part in a direction perpendicular to the plane of the substrate. This invention is beneficial in improving the phenomenon of color and brightness variations in the display panel caused by the driving chip being bonded to the substrate in the prior art.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more specifically, to an array substrate, a display panel, and a display device. Background Technology

[0002] In existing display panels, integrated circuit (IC) chips are generally packaged using COG (chip on glass) technology. Specifically, the IC chip is bonded to a glass substrate. However, after bonding the IC chip to the glass substrate using COG technology, the display panel is prone to COG mura, which is a phenomenon where the IC chip bonded to the glass substrate causes changes in the display panel's color and brightness, seriously affecting the uniformity of the black state of the display panel. Summary of the Invention

[0003] In view of this, the present invention provides an array substrate, a display panel, and a display device, which helps to improve the phenomenon of color and brightness changes in the display panel caused by the bonding of the driver chip to the substrate in the prior art.

[0004] The present invention provides an array substrate, comprising: a substrate, the substrate including at least one first sub-part and a second sub-part, the second sub-part at least partially surrounding the first sub-part; at least one driving chip, the driving chip being disposed corresponding to the first sub-part and bonded to one side of the first sub-part corresponding to it; the distance between the edge of the driving chip and the edge of the first sub-part corresponding to it being greater than 0; and the thickness of the first sub-part being less than the thickness of the second sub-part in a direction perpendicular to the plane of the substrate.

[0005] Based on the same idea, the present invention also provides a display panel, including the array substrate provided by the present invention.

[0006] Based on the same idea, the present invention also provides a display device, including the display panel provided by the present invention.

[0007] Compared with the prior art, the array substrate, display panel, and display device provided by the present invention achieve at least the following beneficial effects:

[0008] In the array substrate provided by this invention, the substrate includes a first sub-part and a second sub-part. The thickness of the first sub-part is less than the thickness of the second sub-part along a direction perpendicular to the plane of the substrate. That is, the thickness of the first sub-part is smaller along a direction perpendicular to the plane of the substrate. Since the driver chip is bonded to the region of the first sub-part in the substrate, the reduced thickness of the first sub-part along the direction perpendicular to the plane of the substrate effectively reduces the stress when the driver chip is bonded to the first sub-part at high temperature. This helps to reduce the deformation area of ​​the substrate, thereby improving the phenomenon of color and brightness variations in the display panel caused by the driver chip being bonded to the substrate, improving the dark-state uniformity of the display panel, and thus improving product yield.

[0009] Of course, any product implementing this invention need not necessarily achieve all of the technical effects described above at the same time.

[0010] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0011] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0012] Figure 1 This is a planar schematic diagram of an array substrate provided by the present invention;

[0013] Figure 2 yes Figure 1 A cross-sectional view of the array substrate along A-A';

[0014] Figure 3 yes Figure 1 A cross-sectional view of the array substrate along B-B';

[0015] Figure 4 This is a planar schematic diagram of another array substrate provided by the present invention;

[0016] Figure 5 yes Figure 4 A cross-sectional view of the array substrate along C-C';

[0017] Figure 6 This is a planar schematic diagram of another array substrate provided by the present invention;

[0018] Figure 7 This is a planar schematic diagram of another array substrate provided by the present invention;

[0019] Figure 8 yes Figure 1 Another cross-sectional view of the array substrate along B-B';

[0020] Figure 9 This is a planar schematic diagram of another array substrate provided by the present invention;

[0021] Figure 10 yes Figure 9 A cross-sectional view of the array substrate along D-D';

[0022] Figure 11 yes Figure 1 Another cross-sectional view of the array substrate along B-B';

[0023] Figure 12 This is a schematic diagram of the structure of a display panel provided by the present invention;

[0024] Figure 13 This is a schematic diagram of the planar structure of a display device provided by the present invention. Detailed Implementation

[0025] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0026] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0027] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0028] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0030] Figure 1 This is a planar schematic diagram of an array substrate provided by the present invention. Figure 2 yes Figure 1 A cross-sectional view of the array substrate along A-A', see reference. Figure 1 and Figure 2 This embodiment provides an array substrate, which includes:

[0031] The substrate 10 includes at least one first sub-part 11 and a second sub-part 12, wherein the second sub-part 12 at least partially surrounds the first sub-part 11.

[0032] At least one driver chip 20 is provided, which is correspondingly disposed to the first sub-part 11 and is bound to one side of the first sub-part 11 corresponding to it.

[0033] The distance between the edge of the driver chip 20 and the edge of its corresponding first sub-part 11 is greater than 0;

[0034] Along the direction perpendicular to the plane of the substrate 10, the thickness of the first sub-part 11 is less than the thickness of the second sub-part 12.

[0035] Specifically, the array substrate provided in this embodiment includes a substrate 10. Optionally, the substrate 10 is a glass substrate. The array substrate also includes a driver chip 20, which is bonded to the substrate 10.

[0036] In existing technologies, chip-on-glass (COG) technology is generally used to bond driver chips to a substrate. Specifically, anisotropic conductive film (ACF) is typically used to press-fit the driver chip's pins to the electrode terminals on the substrate face-to-face, thereby bonding the driver chip to the substrate. During the high-temperature face-to-face bonding of the driver chip to the substrate, the area on the substrate where the driver chip is bonded expands due to heat. Because the thermal expansion coefficients of the driver chip and the substrate are different, the stress deformation of the driver chip and the substrate differs during heating and cooling. This causes deformation of the area on the substrate where the driver chip is bonded under pressure, resulting in changes in the color and brightness of the display panel. This leads to poor uniformity in dark states and reduced contrast, severely impacting product yield.

[0037] In this embodiment, the substrate 10 includes a first sub-part 11 and a second sub-part 12. The second sub-part 12 at least partially surrounds the first sub-part 11. The driving chip 20 is disposed corresponding to the first sub-part 11 and is bound to one side of the first sub-part 11. The distance between the edge of the driving chip 20 and the edge of the first sub-part 11 is greater than 0, that is, the driving chip 20 is bound to the area where the first sub-part 11 is located in the substrate 10.

[0038] Along the direction perpendicular to the plane of the substrate 10, the thickness of the first sub-part 11 is less than the thickness of the second sub-part 12. That is, along the direction perpendicular to the plane of the substrate 10, the thickness of the first sub-part 11 is smaller. Since the driver chip 20 is bonded to the area where the first sub-part 11 is located in the substrate 10, the reduced thickness of the first sub-part 11 along the direction perpendicular to the plane of the substrate 10 effectively reduces the stress when the driver chip 20 is bonded to the first sub-part 11 at high temperature. This helps to reduce the deformation area of ​​the substrate 10, thereby improving the phenomenon of color and brightness variations in the display panel caused by the driver chip 20 being bonded to the substrate 10, improving the uniformity of the dark state of the display panel, and thus improving product yield.

[0039] It should be noted that, Figure 1 The example shows two driving chips 20 bonded on the substrate 10. In other embodiments of the present invention, other numbers of driving chips 20 may be bonded on the substrate 10, which will not be described in detail here.

[0040] Figure 3 yes Figure 1 A cross-sectional view of the array substrate along B-B', see reference. Figure 1 and Figure 3 Optionally, when multiple driving chips 20 are bonded to the substrate 10, each driving chip 20 is arranged in a one-to-one correspondence with a first sub-part 11, and the driving chip 20 is bonded to one side of its corresponding first sub-part 11. This effectively reduces the stress when the driving chip 20 is bonded to its corresponding first sub-part 11 at high temperature, thereby helping to reduce the deformation area of ​​the substrate 10. At the same time, the total area of ​​each first sub-part 11 in the substrate 10 is small, which helps to improve the overall strength of the substrate 10 and reduces the risk of damage to the substrate 10 from external forces.

[0041] Figure 4 This is a planar schematic diagram of another array substrate provided by the present invention. Figure 5 yes Figure 4 A cross-sectional view of the array substrate along C-C', see reference. Figure 4 and Figure 5Optionally, when multiple driver chips 20 are bonded to the substrate 10, the multiple driver chips 20 are correspondingly arranged with a first sub-part 11, and the driver chip 20 is bonded to one side of the corresponding first sub-part 11. This can effectively reduce the stress when the driver chip 20 is bonded to the corresponding first sub-part 11 at high temperature, thereby helping to reduce the deformation area of ​​the substrate 10. At the same time, along the direction perpendicular to the plane of the substrate 10, the thickness of the first sub-part 11 is less than the thickness of the second sub-part 12. That is, the first sub-part 11 in the substrate 10 needs to be thinned by etching and other processes. The multiple driver chips 20 corresponding to a first sub-part 11 help to simplify the thinning process and reduce production costs.

[0042] Optionally, the thickness of the first sub-part 11 is half the thickness of the second sub-part 12 along the direction perpendicular to the plane of the substrate 10. This effectively reduces the stress when the driver chip 20 is bonded to its corresponding first sub-part 11 at high temperature, thereby helping to reduce the deformation area of ​​the substrate 10. Simultaneously, it effectively avoids the overall strength of the substrate 10 being affected by an excessively small thickness of the first sub-part 11 along the direction perpendicular to the plane of the substrate 10. Furthermore, it effectively avoids the difficulty of the thinning process being increased by an excessively small thickness of the first sub-part 11 along the direction perpendicular to the plane of the substrate 10.

[0043] For example, in the direction perpendicular to the plane of the substrate 10, the thickness of the first sub-part 11 is 0.25 mm, and the thickness of the second sub-part 12 is 0.5 mm. Of course, it is understood that in other embodiments of the present invention, the thickness of the first sub-part 11 and the thickness of the second sub-part 12 in the direction perpendicular to the plane of the substrate 10 can be set to other values ​​according to actual production needs, which will not be elaborated here.

[0044] It should be noted that, Figure 1 The example shown depicts the first sub-part 11 as a rectangular region. In other embodiments of the invention, the first sub-part 11 may also have other shapes, as exemplarily seen in reference [reference needed]. Figure 6 , Figure 6 This is a planar schematic diagram of another array substrate provided by the present invention, wherein the edge 111 of the first sub-part 11 is curved. Of course, the position of the first sub-part 11 can be set on any side of the substrate 10. Those skilled in the art can set the shape and position of the first sub-part 11 according to actual needs. The embodiments of the present invention do not specifically limit this.

[0045] Continue to refer to Figure 1 and Figure 2 In some alternative embodiments, the distance between at least a portion of the edge 111 of the first sub-part 11 and the edge 21 of the corresponding driving chip 20 is greater than or equal to 2 cm.

[0046] In the prior art, when the driver chip is bonded to the substrate by high temperature, the deformation area of ​​the substrate is within 2 cm of the edge of the driver chip.

[0047] Specifically, in this embodiment, the distance between at least a portion of the edge 111 of the first sub-part 11 and the edge 21 of the corresponding driving chip 20 is greater than or equal to 2cm. That is, the range of the first sub-part 11 at least partially covers the range in the prior art where the driving chip is bonded to the substrate at high temperature, which is prone to deformation. This helps to reduce the deformation area of ​​the substrate 10 when the driving chip 20 is bonded to the substrate 10 at high temperature. This helps to improve the phenomenon of color and brightness changes in the display panel caused by the driving chip 20 being bonded to the substrate 10, improve the uniformity of the dark state of the display panel, and thus help to improve the product yield.

[0048] Continue to refer to Figure 1 and Figure 2 In some optional embodiments, the edge 111 of the first sub-part 11 includes a first edge portion 112 that intersects with the second sub-part 12, and the distance between the first edge portion 112 and the edge 21 of the corresponding driving chip 20 is greater than or equal to 2 cm.

[0049] Specifically, the edge 111 of the first sub-part 11 includes a first edge portion 112 that intersects with the second sub-part 12. The distance between the first edge portion 112 and the edge 21 of the corresponding driving chip 20 is greater than or equal to 2cm. That is, the range of the first sub-part 11 completely covers the range of the substrate that is prone to deformation when the driving chip is bonded to the substrate at high temperature in the prior art. This helps to reduce the deformation area of ​​the substrate 10 when the driving chip 20 is bonded to the substrate 10 at high temperature. This helps to improve the phenomenon of color and brightness changes in the display panel caused by the driving chip 20 being bonded to the substrate 10, improve the dark uniformity of the display panel, and thus help to improve the product yield.

[0050] Continue to refer to Figure 1 and Figure 2 Optionally, the driver chip 20 is bonded to one side of the substrate 10. Correspondingly, the first sub-part 11 is located on one side of the substrate 10. To achieve a narrow bezel, the distance between the driver chip 20 and the edges of the substrate 10 on the same side as the driver chip 20 is small, typically less than 2 cm. Thus, the second sub-part 12 in the substrate 10 is partially disposed around the first sub-part 11, and the first sub-part 11 extends to the edge of the substrate 10 on the same side as the driver chip 20. In this case, the distance between the portion of the edge 111 of the first sub-part 11 that does not intersect with the second sub-part 12 and the edge of the driver chip 20 is less than 2 cm.

[0051] Figure 7 This is a planar schematic diagram of another array substrate provided by the present invention, for reference. Figure 7 Optionally, when the second sub-part 12 in the substrate 10 is completely arranged around the first sub-part 11, the distance between the first edge 112 at the intersection of the first sub-part 11 and the second sub-part 12 and the edge 21 of the corresponding driving chip 20 is greater than or equal to 2cm. In this case, the driving chip 20 can be arranged at the center of the first sub-part 11, which facilitates the determination of the bonding position of the driving chip 20 in the first sub-part 11 and ensures that the setting range of the first sub-part 11 completely covers the range of the substrate that is prone to deformation when the driving chip is bonded to the substrate by high temperature in the prior art.

[0052] Continue to refer to Figures 1-3 In some alternative embodiments, the first sub-part 11 and the second sub-part 12 form a groove 13, which is located on the side of the first sub-part 11 away from the driver chip 20;

[0053] Furthermore, the surface of the substrate 10 near the driver chip 20 is planar.

[0054] Specifically, along a direction perpendicular to the plane of the substrate 10, the thickness of the first sub-part 11 is less than the thickness of the second sub-part 12, thereby forming a groove 13 between the first sub-part 11 and the second sub-part 12. The groove 13 is located on the side of the first sub-part 11 away from the driver chip 20, that is, the driver chip 20 is bonded to the side of the first sub-part 11 away from the groove 13, and the surface of the substrate 10 near the driver chip 20 is planar, thereby facilitating the bonding of the driver chip 20 to the substrate 10. At the same time, the planar structure of the surface of the substrate 10 on which the driver chip 20 is bonded facilitates the arrangement of signal lines (not shown in the figure) electrically connected to the driver chip 20.

[0055] Figure 8 yes Figure 1 Another cross-sectional view of the array substrate along B-B', see reference. Figure 1 and Figure 8 In some alternative embodiments, a heat-conducting structure 30 is provided in the groove 13, and the thermal conductivity of the heat-conducting structure 30 is greater than that of the substrate 10.

[0056] Specifically, the driver chip 20 generates a significant amount of heat during operation, and this heat buildup can affect its performance. The driver chip 20 is bonded to the side of the first sub-part 11 furthest from the groove 13. A heat-conducting structure 30 can be provided within the groove 13, and the thermal conductivity of the heat-conducting structure 30 is greater than that of the substrate 10. This structure enhances the heat dissipation of the array substrate, allowing the heat from the driver chip 20 to be dissipated promptly, ensuring stable operation of the driver chip 20 and guaranteeing the normal operation of the array substrate.

[0057] Meanwhile, along the direction perpendicular to the plane where the substrate 10 is located, the thickness of the first sub-part 11 is less than the thickness of the second sub-part 12. After the driver chip 20 is bound to the first sub-part 11, a heat-conducting structure 30 can be provided in the groove 13, so that the heat-conducting structure 30 has a supporting function, which helps to improve the overall strength of the substrate 10 and reduces the risk of damage to the substrate 10 by external forces.

[0058] refer to Figure 1 and Figure 8 In some alternative embodiments, the thickness of the thermally conductive structure 30 is equal to the thickness of the groove 13 in a direction perpendicular to the plane of the substrate 10.

[0059] Specifically, along the direction perpendicular to the plane of the substrate 10, the thickness of the first sub-part 11 is less than the thickness of the second sub-part 12. The first sub-part 11 and the second sub-part 12 form a groove 13. Along the direction perpendicular to the plane of the substrate 10, the thickness of the heat-conducting structure 30 is equal to the thickness of the groove 13. That is, the heat-conducting structure 30 completely fills the groove 13, thereby enhancing the heat dissipation effect of the array substrate and improving the overall strength of the substrate 10, while avoiding the heat-conducting structure 30 protruding from the groove 13, which would cause an increase in the thickness of the array substrate.

[0060] It should be noted that in other embodiments of the present invention, when satisfying the heat dissipation effect required by the array substrate and the overall strength required by the substrate 10, the thickness of the heat-conducting structure 30 in the direction perpendicular to the plane of the substrate 10 can also be less than the thickness of the groove 13. The specific thickness of the heat-conducting structure 30 in the direction perpendicular to the plane of the substrate 10 can be set according to actual production needs, and will not be described in detail here.

[0061] Figure 9 This is a planar schematic diagram of another array substrate provided by the present invention. Figure 10 yes Figure 9 A cross-sectional view of the array substrate along D-D', see reference. Figure 9 and Figure 10In some alternative embodiments, the array substrate 10 further includes a flexible circuit board 40, one end of which is bound to the side of the first sub-part 11 near the driving chip 20, the flexible circuit board 40 is bent toward the side away from the driving chip 20, and the other end of the flexible circuit board 40 is located in the groove 13.

[0062] Specifically, the array substrate 10 also includes a flexible circuit board 40, one end of which is bonded to the side of the first sub-part 11 near the driver chip 20. Since the thickness of the first sub-part 11 is less than the thickness of the second sub-part 12 along a direction perpendicular to the plane of the substrate 10, the first sub-part 11 and the second sub-part 12 form a groove 13. Thus, after the flexible circuit board 40 is bent towards the side facing away from the driver chip 20, the other end of the flexible circuit board 40 is located within the groove 13, and the portion of the flexible circuit board 40 placed on the side of the array substrate 10 facing away from the driver chip 20 after bending is located within the groove 13, which is beneficial for achieving a narrow bezel. Simultaneously, the space of the groove 13 can be reused to accommodate the flexible circuit board 40, which helps reduce the thickness of the array substrate.

[0063] Continue to refer to Figure 9 and Figure 10 In some alternative embodiments, the thickness of the flexible circuit board 40 is less than the thickness of the groove 13 in a direction perpendicular to the plane of the substrate 10.

[0064] Specifically, along the direction perpendicular to the plane of the substrate 10, the thickness of the first sub-part 11 is less than the thickness of the second sub-part 12. The first sub-part 11 and the second sub-part 12 form a groove 13, and the space of the groove 13 is reused to accommodate a portion of the flexible circuit board 40. Along the direction perpendicular to the plane of the substrate 10, the thickness of the flexible circuit board 40 is less than the thickness of the groove 13, thereby preventing the flexible circuit board 40 placed in the groove 13 from protruding out of the groove 13 and causing an increase in the thickness of the array substrate.

[0065] It should be noted that in other embodiments of the present invention, the thickness of the flexible circuit board 40 can also be equal to the thickness of the groove 13 along the direction perpendicular to the plane of the substrate 10. The specific thickness of the flexible circuit board 40 can be set according to actual production needs, and will not be described in detail here.

[0066] Figure 11 yes Figure 1 Another cross-sectional view of the array substrate along B-B', see reference. Figure 1 and Figure 11 In some alternative embodiments, an elastic structure 50 is provided in the groove 13, and the elastic modulus of the elastic structure 50 is greater than the elastic modulus of the substrate 10.

[0067] Specifically, along the direction perpendicular to the plane of the substrate 10, the thickness of the first sub-part 11 is less than the thickness of the second sub-part 12. Simultaneously, an elastic structure 50 is provided within the groove 13, and the elastic modulus of the elastic structure 50 is greater than that of the substrate 10. Therefore, when the driver chip 20 is bound to the first sub-part 11, it helps to further reduce the stress on the first sub-part 11, thereby reducing the deformation area of ​​the substrate 10. Furthermore, the elastic structure 50 within the groove 13 provides support, which helps to improve the overall strength of the substrate 10 and reduces the risk of damage to the substrate 10 from external forces.

[0068] refer to Figure 1 and Figure 11 In some alternative embodiments, the thickness of the elastic structure 50 is equal to the thickness of the groove 13 in a direction perpendicular to the plane of the substrate 10.

[0069] Specifically, along the direction perpendicular to the plane of the substrate 10, the thickness of the first sub-part 11 is less than the thickness of the second sub-part 12. The first sub-part 11 and the second sub-part 12 form a groove 13. Along the direction perpendicular to the plane of the substrate 10, the thickness of the elastic structure 50 is equal to the thickness of the groove 13. That is, the elastic structure 50 completely fills the groove 13. This reduces the stress on the first sub-part 11 and improves the overall strength of the substrate 10, while preventing the elastic structure 50 from protruding out of the groove 13, thus avoiding an increase in the thickness of the array substrate.

[0070] It should be noted that in other embodiments of the present invention, when satisfying the need to reduce the stress on the first sub-part 11 and the overall strength required for the substrate 10, the thickness of the elastic structure 50 in the direction perpendicular to the plane of the substrate 10 may also be less than the thickness of the groove 13. The specific thickness of the elastic structure 50 in the direction perpendicular to the plane of the substrate 10 can be set according to actual production needs, and will not be described in detail here.

[0071] Continue to refer to Figure 1 and Figure 2 In some alternative embodiments, the driving chip 20 is located on one side of the substrate 10 along the first direction X;

[0072] The width of the array substrate 10 along the first direction X is less than the length of the array substrate 10 along the second direction Y, wherein both the first direction X and the second direction Y are parallel to the direction of the plane on which the substrate 10 is located, and the first direction X and the second direction Y intersect. Optionally, the first direction X and the second direction Y are perpendicular.

[0073] Specifically, the width of the array substrate 10 along the first direction X is less than the length of the array substrate 10 along the second direction Y; that is, the length of the array substrate 10 along the second direction Y is longer, and the width of the array substrate 10 along the first direction X is shorter. Since the driving chip 20 is located on one side of the substrate 10 along the first direction X, and the width of the array substrate 10 along the first direction X is shorter, the deformation of the array substrate 10 caused by bonding the driving chip 20 to the first sub-part 11 at high temperature in the first direction X is significant. At this time, by setting the thickness of the first sub-part 11 to be less than the thickness of the second sub-part 12 along the direction perpendicular to the plane of the substrate 10, the stress when bonding the driving chip 20 to the first sub-part 11 at high temperature can be effectively reduced. This helps to reduce the deformation area of ​​the substrate 10, thereby improving the phenomenon of color and brightness variations in the display panel caused by the driving chip 20 bonding to the substrate 10 in the first direction X, improving the dark uniformity of the display panel, and thus improving product yield.

[0074] It should be noted that in other embodiments of the present invention, when the width of the array substrate 10 along the first direction X is greater than the length of the array substrate 10 along the second direction Y, the thickness of the first sub-part 11 along the direction perpendicular to the plane where the substrate 10 is located may be less than the thickness of the second sub-part 12. The present invention will not elaborate on these points here.

[0075] This embodiment provides a display panel, including the array substrate described above.

[0076] Figure 12 This is a schematic diagram of the structure of a display panel provided by the present invention, for reference. Figure 12 The display panel includes an array substrate 100 and a color filter substrate 200 disposed opposite to each other, and a liquid crystal layer 300 disposed between the array substrate 100 and the color filter substrate 200; wherein, the array substrate 100 is the array substrate provided in any of the above embodiments of the present invention.

[0077] It should be noted that, Figure 12 The display panel shown is illustrated using a liquid crystal display panel as an example only. Those skilled in the art should understand that in other implementations of this application, the display panel can also be an organic light-emitting display panel, a micro LED display panel, a quantum dot display panel (QLED), electronic paper, or other types of panels or display components. This application does not limit the specific implementation; the choice depends on the actual situation. It should be noted that those skilled in the art will understand that the display panel of this application, in addition to including an array substrate, can also include other known structures.

[0078] This embodiment provides a display device, including the display panel described above.

[0079] Please refer to Figure 13 , Figure 13 This is a schematic diagram of the planar structure of a display device provided by the present invention. Figure 13 The provided display device 1000 includes a display panel 400, wherein the display panel is the display panel 400 provided in any of the above embodiments of the present invention. Figure 13 This embodiment uses a mobile phone as an example to illustrate the display device 1000. It is understood that the display device provided in this embodiment can be any other display device with display function, such as a computer, television, or vehicle-mounted display device; this invention does not impose specific limitations on this. The display device provided in this embodiment has the beneficial effects of the display panel provided in this embodiment. For details, please refer to the specific descriptions of the display panel in the above embodiments; these will not be repeated here.

[0080] As can be seen from the above embodiments, the array substrate, display panel, and display device provided by the present invention achieve at least the following beneficial effects:

[0081] In the array substrate provided by this invention, the substrate includes a first sub-part and a second sub-part. The thickness of the first sub-part is less than the thickness of the second sub-part along a direction perpendicular to the plane of the substrate. That is, the thickness of the first sub-part is smaller along a direction perpendicular to the plane of the substrate. Since the driver chip is bonded to the region of the first sub-part in the substrate, the reduced thickness of the first sub-part along the direction perpendicular to the plane of the substrate effectively reduces the stress when the driver chip is bonded to the first sub-part at high temperature. This helps to reduce the deformation area of ​​the substrate, thereby improving the phenomenon of color and brightness variations in the display panel caused by the driver chip being bonded to the substrate, improving the dark-state uniformity of the display panel, and thus improving product yield.

[0082] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. An array substrate, characterized by, The array substrate comprises: a substrate, which comprises at least a first sub-portion and a second sub-portion, the second sub-portion at least partially surrounds the first sub-portion; at least one driving chip, which is arranged corresponding to the first sub-portion, and is bonded to one side of the first sub-portion corresponding to the driving chip; a distance between an edge of the driving chip and an edge of the first sub-portion corresponding to the driving chip is greater than 0; a thickness of the first sub-portion is less than a thickness of the second sub-portion along a direction perpendicular to a plane where the substrate is located; the first sub-portion and the second sub-portion form a groove, which is located on a side of the first sub-portion away from the driving chip; a heat-conducting structure is arranged in the groove, and a heat-conducting coefficient of the heat-conducting structure is greater than a heat-conducting coefficient of the substrate, or an elastic structure is arranged in the groove, and an elastic modulus of the elastic structure is greater than an elastic modulus of the substrate.

2. The array substrate according to claim 1, wherein a distance between at least a part of an edge of the first sub-portion and an edge of the driving chip corresponding to the edge of the first sub-portion is greater than or equal to 2 cm.

3. The array substrate according to claim 2, wherein the edge of the first sub-portion comprises a first edge portion which borders the second sub-portion, and a distance between the first edge portion and an edge of the driving chip corresponding to the first edge portion is greater than or equal to 2 cm.

4. The array substrate according to claim 1, wherein a surface of the substrate near a side of the driving chip is a planar structure.

5. The array substrate according to claim 1, wherein a thickness of the heat-conducting structure is less than or equal to a thickness of the groove along a direction perpendicular to a plane where the substrate is located.

6. The array substrate according to claim 1, wherein the array substrate further comprises a flexible circuit board, one end of the flexible circuit board is bonded to a side of the first sub-portion near the driving chip, the flexible circuit board is bent along a side away from the driving chip, and the other end of the flexible circuit board is located in the groove.

7. The array substrate according to claim 6, wherein a thickness of the flexible circuit board is less than or equal to a thickness of the groove along a direction perpendicular to a plane where the substrate is located.

8. The array substrate according to claim 1, wherein a thickness of the elastic structure is less than or equal to a thickness of the groove along a direction perpendicular to a plane where the substrate is located.

9. The array substrate according to claim 1, wherein the driving chip is located on one side of the substrate along a first direction; a width of the array substrate along the first direction is less than a length of the array substrate along a second direction, wherein the first direction and the second direction are both parallel to a direction of a plane where the substrate is located, and the first direction and the second direction intersect.

10. A display panel, characterized by, The array substrate according to any one of claims 1-9.

11. A display device, characterized by comprising: The display panel according to claim 10.

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