Driving circuit, display module and display device

Abstract

The application discloses a driving circuit, a display module and a display device. The driving circuit comprises a system integrated chip, a voltage comparison module and a power supply circuit module. The voltage comparison module is connected between the system integrated chip and the power supply circuit module. The voltage comparison module is used for receiving an input voltage output by the system integrated chip in a starting process, and outputting the input voltage to the power supply circuit module or stopping outputting the input voltage according to a relationship between the input voltage and a reference voltage. In the driving circuit, the display module and the display device, the voltage comparison module outputs the input voltage to the power supply circuit module or stops outputting the input voltage according to the relationship between the input voltage and the reference voltage in the starting process, so that a stable voltage domain of the input voltage can be established in the starting process, time sequence abnormalities and chip mis-triggering are avoided, and the starting failure phenomenon is avoided, and the design cost and the risk are reduced.

Description

Technical Field

[0001] This application relates to the field of circuit driving technology, and in particular to a driving circuit, a display module, and a display device. Background Technology

[0002] In related technologies, during the power-on process of an LCD panel, because the input voltage has not yet established a stable voltage domain, the timing control chip may start working at this time, leading to timing abnormalities and false triggering of the chip, resulting in various power-on defects such as screen flickering. If, during the design process, the circuit design is modified and the timing is adjusted to ensure the voltage domain stabilizes before the chip starts working, this avoids false triggering. However, this approach requires redesigning the circuit or timing for different chip manufacturers, significantly increasing design costs and risks. Summary of the Invention

[0003] This application provides a driving circuit, a display module, and a display device to solve at least one of the aforementioned technical problems.

[0004] The driving circuit of this application includes a system integrated chip, a voltage comparison module, and a power supply circuit module. The voltage comparison module is connected between the system integrated chip and the power supply circuit module. The voltage comparison module is used to receive the input voltage output by the system integrated chip during the power-on process, and output the input voltage to the power supply circuit module according to the relationship between the input voltage and the reference voltage, or stop outputting the input voltage.

[0005] In some embodiments, the voltage comparison module outputs the input voltage to the power supply circuit module when the input voltage is greater than the reference voltage, and stops outputting the input voltage when the input voltage is less than or equal to the reference voltage.

[0006] In some embodiments, the voltage comparison module includes a voltage comparator and a first transistor. The positive input terminal of the voltage comparator is connected to the reference voltage, the negative input terminal of the voltage comparator is connected to the system integrated circuit (SIC), the output terminal of the voltage comparator is connected to the gate of the first transistor, the source of the first transistor is connected to the SIC, and the drain of the first transistor is connected to the power supply circuit module.

[0007] In some embodiments, the driving circuit further includes a logic control module and a discharge module, the logic control module and the discharge module being sequentially connected between the system integrated chip and the power supply circuit module, and the discharge module being connected to the voltage comparison module.

[0008] The logic control module is used to receive the power-on / off signal sent by the system integrated chip, and control the working state of the discharge module according to the power-on / off signal, so that the voltage comparison module can output the input voltage to the power supply circuit module, or discharge the input voltage.

[0009] In some implementations, the logic control module is used to receive a power-on signal sent by the system integrated chip, and control the discharge module to be in a stopped working state according to the power-on signal, so that the voltage comparison module can output the input voltage to the power supply circuit module; the logic control module is also used to receive a power-off signal sent by the system integrated chip, and control the discharge module to be in a working state according to the power-off signal, so as to discharge the input voltage.

[0010] In some implementations, the logic control module includes a logic controller and a transistor. The input terminal of the logic controller is connected to the system integrated chip, the output terminal of the logic controller is connected to the base of the transistor, the collector of the transistor is connected to the discharge module, and the emitter of the transistor is grounded.

[0011] In some embodiments, the discharge module includes a second transistor, the gate of which is connected to the logic control module, the drain of which is connected to the voltage comparison module and the power supply circuit module, and the source of which is grounded.

[0012] In some embodiments, the driving circuit further includes a timing control chip and a driving chip. The timing control chip is connected to the system integration chip, the power supply circuit module, and the driving chip, respectively. The power supply circuit module is also connected to the driving chip, and the driving chip is used to connect to the display panel.

[0013] The display module of this application includes:

[0014] The driving circuit described in any of the above embodiments; and

[0015] The display panel is connected to the driving circuit.

[0016] The display device according to the embodiments of this application includes the display module of the above embodiments.

[0017] In the driving circuit, display module, and display device of this application, the voltage comparison module outputs the input voltage to the power supply circuit module according to the relationship between the input voltage and the reference voltage during the power-on process, or stops outputting the input voltage. This allows the input voltage to establish a stable voltage domain during the power-on process, avoiding timing abnormalities and chip mis-triggers that could lead to poor power-on, thus reducing design costs and risks.

[0018] Additional aspects and advantages of embodiments of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of this application. Attached Figure Description

[0019] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, wherein:

[0020] Figure 1 This is a schematic diagram of the screen flickering during power-on of a display panel in related technologies;

[0021] Figure 2 This is a schematic diagram of a display module according to certain embodiments of this application;

[0022] Figure 3 This is a circuit diagram of the driving circuit of some embodiments of this application;

[0023] Figure 4 This is a schematic diagram of horizontal lines caused by insufficient discharge of the display panel in related technologies;

[0024] Figure 5 This is a schematic diagram of a display device according to certain embodiments of this application.

[0025] Explanation of reference numerals in the attached figures:

[0026] Drive circuit 100, system integrated chip 10, voltage comparison module 20, voltage comparator 21, power supply circuit module 30, logic control module 40, logic controller 41, discharge module 50, timing control chip 60, drive chip 70, display panel 200, display module 300, display device 1000, first transistor M1, second transistor M2, transistor Q, first resistor R1, second resistor R2, third resistor R3, fourth resistor R4, and fifth resistor R5. Detailed Implementation

[0027] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0028] Please see Figure 1 In related technologies, during the power-on process of an LCD panel, because the input voltage has not yet established a stable voltage domain, the timing control chip may start working at this time, leading to timing abnormalities and chip mis-triggering, thus causing various power-on problems, such as screen flickering during power-on (e.g., ...). Figure 1 (As shown). If, during the design process, the circuit design is modified and the timing is adjusted so that the chip starts working only after the voltage domain has stabilized to avoid false triggering, this method requires redesigning the circuit or timing for different chip manufacturers, which greatly increases the design cost and risk.

[0029] Please see Figure 2 and Figure 3 To address the aforementioned technical problems, this application provides a driving circuit 100. The driving circuit 100 includes a system integrated chip 10, a voltage comparison module 20, and a power supply circuit module 30. The voltage comparison module 20 is connected between the system integrated chip 10 and the power supply circuit module 30. The voltage comparison module 20 is used to receive the input voltage VDD output by the system integrated chip 10 during power-on, and output the input voltage VDD to the power supply circuit module 30 according to the relationship between the input voltage VDD and the reference voltage Vref, or stop outputting the input voltage VDD.

[0030] In the driving circuit 100 of this embodiment, the voltage comparison module 20 outputs the input voltage VDD to the power supply circuit module 30 based on the relationship between the input voltage VDD and the reference voltage Vref during power-on, or stops outputting the input voltage VDD. This allows the input voltage VDD to establish a stable voltage domain during power-on, avoiding timing abnormalities and chip mis-triggers that could lead to poor power-on. Furthermore, since there is no need to change the circuit design or adjust the circuit timing during the design process, design costs and risks are reduced.

[0031] Specifically, during power-on, the system integrated chip 10 outputs an input voltage VDD to the voltage comparator module 20. The voltage comparator module 20 compares the input voltage VDD with the reference voltage Vref to control the output of the input voltage VDD to the power supply circuit module 30, or to stop outputting the input voltage VDD. In one embodiment, the voltage comparator module 20 may output the input voltage VDD to the power supply circuit module 30 when the input voltage VDD is greater than the reference voltage Vref, and may stop outputting the input voltage VDD when the input voltage VDD is less than or equal to the reference voltage Vref. Thus, when the input voltage VDD fluctuates within the range of less than or equal to the reference voltage Vref, the voltage comparator module 20 will not output the input voltage VDD; it will only output the input voltage VDD when the input voltage VDD is greater than the reference voltage Vref, thereby establishing a stable voltage domain.

[0032] Please see Figure 2 and Figure 3 In some embodiments, the voltage comparison module 20 includes a voltage comparator 21 and a first transistor M1. In this case, the system integrated chip 10 is connected to the voltage comparator 21, the voltage comparator 21 is connected to the first transistor M1, and the first transistor M1 is connected to the power supply circuit module 30.

[0033] Specifically, the positive input terminal of voltage comparator 21 is connected to the reference voltage Vref, the negative input terminal of voltage comparator 21 is connected to the system integrated circuit chip 10, and the output terminal of voltage comparator 21 is connected to the gate of the first transistor M1. The source of the first transistor M1 is connected to the system integrated circuit chip 10, and the drain of the first transistor M1 is connected to the power supply circuit module 30. The connection between the negative input terminal of voltage comparator 21 and the system integrated circuit chip 10 can be direct or indirect. When the negative input terminal of voltage comparator 21 is indirectly connected to the system integrated circuit chip 10, the voltage comparison module 20 may further include a first resistor R1, and the source of the first transistor M1 is connected to the system integrated circuit chip 10 through the first resistor R1.

[0034] In this embodiment, during power-on, the voltage comparator 21 compares the input voltage VDD with the reference voltage Vref. When VDD > Vref, the first transistor M1 is turned on, and the voltage comparator module 20 outputs the input voltage VDD to the power supply circuit module 30; when VDD ≤ Vref, the first transistor M1 is turned off, and the voltage comparator module 20 stops outputting the input voltage VDD. Figure 3 In the example shown, the first transistor M1 is a PMOS transistor. When VDD > Vref, the voltage comparator module 20 outputs a low level to turn on the first transistor M1; when VDD ≤ Vref, the voltage comparator module 20 outputs a high level to turn off the first transistor M1. Of course, in other examples, the first transistor M1 can also be an NMOS transistor. In this case, the connection between the positive and negative input terminals of the voltage comparator 21 and the reference voltage Vref and input voltage VDD can be interchanged. This way, when VDD > Vref, the voltage comparator module 20 outputs a high level, thus turning on the first transistor M1; and when VDD ≤ Vref, the voltage comparator module 20 outputs a low level, thus turning off the first transistor M1.

[0035] Please see Figure 4In related technologies, LCD panels pass through panel / module factories before being shipped as complete units. Due to differences in the lamp-lighting fixtures between different processes, voltage rebound and incomplete discharge may occur during the shutdown process of the LCD panel. Because Indium Gallium Zinc Oxide (IGZO) panels have low leakage current, incomplete shutdown discharge can leave charge residue in the MOSFET, causing voltage stress in the MOSFET. After a period of time, the MOSFET characteristics shift, and when the LCD panel is turned on again, horizontal lines (such as...) will appear. Figure 4 As shown in the image, this defect only appears after a period of time, making it difficult to detect at the factory level and causing adverse effects on the client or end-user market.

[0036] Please see Figure 2 To address the aforementioned technical problems, in some embodiments, the drive circuit 100 further includes a logic control module 40 and a discharge module 50. The logic control module 40 and the discharge module 50 are sequentially connected between the system integrated chip 10 and the power supply circuit module 30. The discharge module 50 is also connected to the voltage comparison module 20. The logic control module 40 receives power-on / off signals sent by the system integrated chip 10 and controls the operating state of the discharge module 50 according to the power-on / off signals, so that the voltage comparison module 20 can output the input voltage VDD to the power supply circuit module 30, or discharge the input voltage VDD.

[0037] In the driving circuit 100 of this application embodiment, the logic control module 40 controls the working state of the discharge module 50 according to the power-on / off signal, so that the voltage comparison module 20 can output the input voltage VDD to the power circuit module 30, or discharge the input voltage VDD. This can both establish a stable voltage domain for the input voltage VDD during the power-on process and enable the discharge module 50 to fully discharge the input voltage VDD during the power-off process under different lighting fixtures, thereby improving the risk of charge residue, avoiding poor discharge caused by differences in lighting fixtures between different processes, and also avoiding horizontal lines generated during restart.

[0038] The power-on and power-off signals may include power-on and power-off signals. In one embodiment, the logic control module 40 receives the power-on signal sent by the system integrated chip 10 and controls the discharge module 50 to be in a stopped state according to the power-on signal, so that the voltage comparison module 20 can output the input voltage VDD to the power circuit module 30. The logic control module 40 is also used to receive the power-off signal sent by the system integrated chip 10 and controls the discharge module 50 to be in an operating state according to the power-off signal to discharge the input voltage VDD. By rapidly discharging the input voltage VDD through the operation of the discharge module 50, the rebound of the input voltage VDD during power-off or power-down can be reduced, avoiding impact on the downstream circuitry.

[0039] Please see Figure 2 and Figure 3 In some embodiments, the logic control module 40 includes a logic controller 41 and a transistor Q. In this case, the system integrated chip 10 is connected to the logic controller 41, the logic controller 41 is connected to the transistor Q, and the transistor Q is connected to the discharge module 50.

[0040] Specifically, the input terminal of the logic controller 41 is connected to the system integrated chip 10, and the output terminal of the logic controller 41 is connected to the base of the transistor Q. The collector of the transistor Q is connected to the discharge module 50, and the emitter of the transistor Q is grounded. The connection between the output terminal of the logic controller 41 and the base of the transistor Q can be direct or indirect. When the output terminal of the logic controller 41 is indirectly connected to the base of the transistor Q, the logic control module 40 may further include a second resistor R2, through which the output terminal of the logic controller 41 is connected to the base of the transistor Q. Furthermore, the logic control module 40 may also include a third resistor R3, through which the base of the transistor Q is grounded. This prevents the base of the transistor Q from being left floating, optimizing the circuit.

[0041] In this embodiment, during the power-on process, the logic controller 41 receives a power-on signal and outputs a high-level signal to turn on the transistor Q, thereby controlling the discharge module 50 to be in a stopped state, and the voltage comparator module 20 outputs the input voltage VDD to the power supply circuit module 30. During the power-off process, the logic controller 41 receives a power-off signal and outputs a low-level signal to turn off the transistor Q, thereby controlling the discharge module 50 to be in a working state to discharge the input voltage VDD.

[0042] Please see Figure 2 and Figure 3 In some embodiments, the discharge module 50 includes a second transistor M2. In this case, the second transistor M2 is connected to the logic control module 40, the voltage comparison module 20, and the power supply circuit module 30, respectively.

[0043] Specifically, the gate of the second transistor M2 is connected to the logic control module 40 (specifically, the collector of transistor Q), the drain of the second transistor M2 is connected to the voltage comparison module 20 (specifically, the drain of the first transistor M1) and the power supply circuit module 30, and the source of the second transistor M2 is grounded. The discharge module 50 may further include a fourth resistor R4, through which the gate of the second transistor M2 is connected to a preset voltage. In one example, the preset voltage is 5V. The discharge module 50 may also include a fifth resistor R5, through which the source of the second transistor M2 is grounded.

[0044] In this embodiment, during power-on, the logic control module 40 controls the second transistor M2 to turn off according to the power-on signal, so as to allow the voltage comparison module 20 to output the input voltage VDD to the power supply circuit module 30; during power-off, the logic control module 40 controls the second transistor M2 to turn on according to the power-off signal, so as to discharge the input voltage VDD. Figure 3 In the example shown, the second transistor M2 is an NMOS transistor. When transistor Q is on, its collector is low, and the second transistor M2 is off; when transistor Q is off, its collector is high, and the second transistor M2 is on. Of course, in other examples, the second transistor M2 can also be a PMOS transistor, as long as the logic controller 41, transistor Q, and the second transistor M2 satisfy the condition that the logic control module 40 controls the second transistor M2 to turn off according to the power-on signal and controls it to turn on according to the power-off signal.

[0045] Please see Figure 3 The following is combined with Figure 3 The operation of the driving circuit 100 according to the embodiments of this application is described in detail. During the power-on process, the logic controller 41 receives a power-on signal and outputs a high level, causing transistor Q to conduct, the second transistor M2 to turn off, and the voltage comparator module 20 to normally output the input voltage VDD. Simultaneously, the voltage comparator 21 compares the input voltage VDD with the reference voltage Vref. When VDD > Vref, the first transistor M1 conducts, and the voltage comparator module 20 outputs the input voltage VDD to the power supply circuit module 30; when VDD ≤ Vref, the first transistor M1 turns off, and the voltage comparator module 20 stops outputting the input voltage VDD. This allows the input voltage VDD to establish a stable voltage domain during the power-on process. During the power-off process, the logic controller 41 receives a power-off signal and outputs a low level, causing transistor Q to turn off, the second transistor M2 to conduct, and the discharge module 50 to discharge the input voltage VDD. Thus, by rapidly discharging the input voltage VDD through the operation of the discharge module 50, the rebound of the input voltage VDD during power-off or power-down can be reduced, avoiding any impact on the downstream circuitry.

[0046] Please see Figure 2 In some embodiments, the driving circuit 100 further includes a timing control chip 60 and a driving chip 70. The timing control chip 60 is connected to the system integrated circuit chip 10, the power supply circuit module 30, and the driving chip 70, respectively. The power supply circuit module 30 is also connected to the driving chip 70. The driving chip 70 is used to connect to the display panel 200.

[0047] Thus, the driving circuit 100 can perform timing control on the display panel 200 through the timing control chip 60 and the driving chip 70, the driving circuit 100 can provide power to the timing control chip 60 through the power circuit module 30, and the driving circuit 100 can provide power to the display panel 200 through the power circuit module 30 and the driving chip 70.

[0048] Please see Figure 2 This application also provides a display module 300. The display module 300 includes a driving circuit 100 and a display panel 200 as described in any of the above embodiments. The driving circuit 100 is connected to the display panel 200. The display panel 200 may be a liquid crystal panel (TFT-LCD panel).

[0049] Please see Figure 5 This application also provides a display device 1000. The display device 1000 includes a display module 300.

[0050] Specifically, the display device 1000 includes, but is not limited to, devices with display functions such as displays, mobile phones, laptops, tablets, wearable display devices 1000 (such as smartwatches, smart glasses, etc.), televisions, and digital cameras.

[0051] In summary, the driving circuit 100, display module 300, and display device 1000 of this application embodiment have at least the following beneficial effects: On the one hand, the voltage comparison module 20 outputs the input voltage VDD to the power supply circuit module 30 according to the relationship between the input voltage VDD and the reference voltage Vref during the power-on process, or stops outputting the input voltage VDD, which enables the input voltage VDD to establish a stable voltage domain during the power-on process, avoiding timing abnormalities and chip mis-triggers that lead to poor power-on. At the same time, since there is no need to change the circuit design or adjust the circuit timing during the design process, design costs and risks are reduced. On the other hand, the logic control module 40 controls the working state of the discharge module 50 according to the power-on / off signal, so that the voltage comparison module 20 can output the input voltage VDD to the power circuit module 30, or discharge the input voltage VDD. This can not only establish a stable voltage domain for the input voltage VDD during the power-on process, but also enable the discharge module 50 to fully discharge the input voltage VDD during the power-off process under different lighting fixtures, improve the risk of charge residue, avoid poor discharge caused by differences in lighting fixtures between different processes, and also avoid horizontal lines generated during restart.

[0052] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0053] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0054] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0055] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0056] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," and "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with an embodiment or example that are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0057] Although embodiments of this application have been shown and described above, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A drive circuit characterized by comprising: The driving circuit comprises a system integrated chip, a voltage comparison module and a power supply circuit module, the voltage comparison module is connected between the system integrated chip and the power supply circuit module, and the voltage comparison module is configured to receive an input voltage output by the system integrated chip during a booting process and output the input voltage to the power supply circuit module or stop outputting the input voltage according to a relationship between the input voltage and a reference voltage. The driving circuit further comprises a logic control module and a discharging module, the logic control module and the discharging module are sequentially connected between the system integrated chip and the power supply circuit module, and the discharging module is further connected with the voltage comparison module. The logic control module comprises a logic controller and a transistor, an input end of the logic controller is connected with the system integrated chip, an output end of the logic controller is connected with a base of the transistor, a collector of the transistor is connected with the discharging module, and an emitter of the transistor is grounded. The logic controller is configured to receive a switching signal sent by the system integrated chip and control the transistor to be turned on or turned off according to the switching signal, so as to control a working state of the discharging module, so that the voltage comparison module can output the input voltage to the power supply circuit module or discharge the input voltage.

2. The drive circuit according to claim 1, characterized by The voltage comparison module outputs the input voltage to the power supply circuit module when the input voltage is greater than the reference voltage, and stops outputting the input voltage when the input voltage is less than or equal to the reference voltage.

3. The drive circuit according to claim 2, characterized in that, The voltage comparison module comprises a voltage comparator and a first transistor, a positive input end of the voltage comparator is connected with the reference voltage, a negative input end of the voltage comparator is connected with the system integrated chip, an output end of the voltage comparator is connected with a gate of the first transistor, a source of the first transistor is connected with the system integrated chip, and a drain of the first transistor is connected with the power supply circuit module.

4. The drive circuit according to claim 1, characterized by The logic control module is configured to receive a booting signal sent by the system integrated chip and control the discharging module to be in a stop working state according to the booting signal, so that the voltage comparison module can output the input voltage to the power supply circuit module, and the logic control module is further configured to receive a shutting down signal sent by the system integrated chip and control the discharging module to be in a working state according to the shutting down signal, so as to discharge the input voltage.

5. The drive circuit according to claim 4, characterized in that, The discharging module comprises a second transistor, a gate of the second transistor is connected with the logic control module, a drain of the second transistor is connected with the voltage comparison module and the power supply circuit module, and a source of the second transistor is grounded.

6. The drive circuit of claim 1, wherein The driving circuit further comprises a timing control chip and a driving chip, the timing control chip is connected with the system integrated chip, the power supply circuit module and the driving chip respectively, the power supply circuit module is further connected with the driving chip, and the driving chip is configured to be connected with a display panel.

7. A display module, characterized by The driving circuit comprises: The driving circuit according to any one of claims 1-6; and The driving circuit comprises: A display panel, the driving circuit being connected with the display panel.

8. A display device, characterized by comprising: The display module comprises the display module of claim 7.

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