An electronic device protection structure, a circuit board, a display module and a manufacturing method

Abstract

The application discloses an electronic device protection structure, a circuit board, a display module and a manufacturing method, to improve the problem of poor electromagnetic and static protection effect caused by the wrinkles and virtual attachment of the attached adhesive tape when the prior art attaches the protective adhesive tape to the electronic device. The circuit board comprises a substrate, a component group on one side of the substrate, a first protective adhesive tape on the side of the component group away from the substrate, and a second protective adhesive tape on the side of the first protective adhesive tape away from the component group; the first protective adhesive tape comprises a covering part covering the component group and a lap joint part extending from at least one side of the covering part to the substrate; and the second protective adhesive tape is attached to the periphery of the component group and electrically connected to the lap joint part.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, and in particular to an electronic device protection structure, a circuit board, a display module and a manufacturing method. BACKGROUND

[0002] Due to the folding characteristic, there is a gap between the screen and the middle frame of the folding mobile phone, which cannot be waterproofed by the shell, so the waterproof performance of the folding product is poor. In the prior art, the point coating waterproof glue method usually causes the problem of poor electrostatic shielding effect of the protective tape. SUMMARY

[0003] The present application provides an electronic device protection structure, a circuit board, a display module and a manufacturing method to improve the problem of poor electromagnetic and electrostatic protection effect caused by the wrinkles and virtual attachment of the attached tape when the protective tape is attached to the electronic device in the prior art.

[0004] The electronic device protection structure provided by the present application comprises a substrate, a component group on one side of the substrate, a first protective tape on the side of the component group away from the substrate, and a second protective tape on the side of the first protective tape away from the component group.

[0005] The first protective tape comprises a covering part covering the component group and a lap joint part extending from at least one side of the covering part to contact the substrate.

[0006] The second protective tape is attached to the periphery of the component group and is electrically connected to the lap joint part.

[0007] In a possible implementation, there is a gap between the second protective tape and the component group.

[0008] In a possible implementation, the lap joint part comprises a first lap joint part and a second lap joint part connecting the first lap joint part and the covering part.

[0009] The first lap joint part contacts the substrate, and the lap joint part is electrically connected to the second protective tape at the first lap joint part.

[0010] In a possible implementation, the first protective tape comprises a first insulating layer, a first conductive layer and a second insulating layer stacked away from the substrate in sequence, and the second protective tape comprises a third insulating layer, a second conductive layer and a fourth insulating layer stacked away from the substrate in sequence.

[0011] The first protective tape exposes the first conductive layer on a side of the first protective tape facing the second protective tape and in a region corresponding to the first lap joint, and the second protective tape exposes the second conductive layer on a side of the second protective tape facing the first protective tape and in a region corresponding to the first lap joint, so that the first conductive layer of the first protective tape and the second conductive layer of the second protective tape are electrically connected.

[0012] In a possible implementation, the substrate includes a third conductive layer, and the third conductive layer includes a wire, and the wire is grounded.

[0013] The second protective tape also electrically connects with part of the wire.

[0014] In a possible implementation, a side of the second protective tape facing the substrate has an opening in a region corresponding to the wire at the lap joint, and the second conductive layer is exposed, so that the second conductive layer of the second protective tape and the wire are electrically connected.

[0015] In a possible implementation, the first insulating layer includes a first sub-insulating layer and a first insulating adhesive layer located on a side of the first sub-insulating layer away from the first conductive layer.

[0016] The first conductive layer includes a first sub-conductive layer and a first conductive adhesive layer located on a side of the first sub-conductive layer facing the first insulating layer.

[0017] The second insulating layer includes a second sub-insulating layer and a second insulating adhesive layer located on a side of the second sub-insulating layer facing the first conductive layer.

[0018] In a possible implementation, the third insulating layer includes a third sub-insulating layer and a third insulating adhesive layer located on a side of the third sub-insulating layer away from the second conductive layer.

[0019] The second conductive layer includes a second sub-conductive layer and a second conductive adhesive layer located on a side of the second sub-conductive layer facing the third insulating layer.

[0020] The fourth insulating layer includes a fourth sub-insulating layer and a fourth insulating adhesive layer located on a side of the fourth sub-insulating layer facing the second conductive layer.

[0021] In a possible implementation, the first sub-insulating layer and the third sub-insulating layer are made of the same material, and the first insulating adhesive layer and the third insulating adhesive layer are made of the same material.

[0022] The first sub-conductive layer and the second sub-conductive layer are made of the same material, and the first conductive adhesive layer and the second conductive adhesive layer are made of the same material.

[0023] The material of the second sub-insulating layer is the same as that of the fourth sub-insulating layer, and the material of the second insulating adhesive layer is the same as that of the fourth insulating adhesive layer.

[0024] In a possible implementation, the projection of the first lap joint part on the substrate has a width greater than that of the projection of the covering part on the substrate.

[0025] The projection of the covering part on the substrate has a width greater than that of the projection of the second lap joint part on the substrate.

[0026] In a possible implementation, the projection length of the first lap joint part on the substrate is less than that of the projection of the covering part on the substrate.

[0027] The projection length of the first lap joint part on the substrate is the same as that of the second lap joint part on the substrate.

[0028] In a possible implementation, the projection of the component group on the substrate falls within the projection of the covering part on the substrate.

[0029] The embodiment of the present application further provides a circuit board comprising the first protective adhesive tape, the substrate, and the component group.

[0030] The embodiment of the present application further provides a display module comprising a display panel, the circuit board, and the second protective adhesive tape.

[0031] The embodiment of the present application further provides a manufacturing method of the display module, and the manufacturing method comprises the following steps.

[0032] Providing a substrate, wherein one side of the substrate is provided with a component group;

[0033] Attaching a first protective adhesive tape to the side of the component group away from the substrate, wherein the first protective adhesive tape comprises a covering part covering the component group and a lap joint part extending from at least one side of the covering part and in contact with the substrate.

[0034] Attaching a second protective adhesive tape to the side of the first protective adhesive tape away from the component group, wherein the second protective adhesive tape is attached to the periphery of the component group and electrically connected to the lap joint part.

[0035] In a possible implementation, the step of attaching the first protective adhesive tape to one side of the substrate comprises the following steps.

[0036] A circuit board is provided, wherein one side of the circuit board is provided with a component group;

[0037] The first protective tape is attached to one side of the circuit board;

[0038] The circuit board with the first protective tape attached is bound with a display panel.

[0039] The electronic device protection structure has the following beneficial effects: in the electronic device protection structure, the first protective tape and the second protective tape located on the side of the first protective tape away from the component group are provided; the first protective tape comprises a covering portion covering the component group and a lap portion extending from at least one side of the covering portion to contact the substrate; and the second protective tape is attached to the periphery of the component group and electrically connected to the lap portion. In the electronic device protection structure, the first protective tape on the surface of the component group and the second protective tape on the periphery of the component group are designed separately, and then the two protective tapes are connected in a “stacking” manner. In this way, the first protective tape on the surface of the component group can be grounded through the second protective tape on the periphery of the component group. Since the covering portion on the surface of the component group and the lap portion extending therefrom are integrated and designed separately from the second protective tape on the periphery of the component group, there is no wrinkle or loose attachment when the protective tape is attached, thereby improving the problem that the protective tape attached to the circuit board in the prior art has wrinkles and is loosely attached, resulting in poor electromagnetic and electrostatic protection effect. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1A A top view of the prior art with the protective tape attached;

[0041] Figure 1B A top view of the prior art with the protective tape attached; Figure 1A A cross-sectional view along the dashed line A1B1 in FIG. 1;

[0042] Figure 1C A top view of the prior art with the protective tape attached; Figure 1A A cross-sectional view along the dashed line C1D1 in FIG. 3;

[0043] Figure 2A A top view of the prior art with the protective tape attached;

[0044] Figure 2B A top view of the prior art with the protective tape attached; Figure 2A A cross-sectional view along the dashed line A1B1 in FIG. 1;

[0045] Figure 3A A top view of the prior art with the protective tape attached;

[0046] Figure 3B A top view of the prior art with the protective tape attached; Figure 3AA cross-sectional view along the dotted line A1B1;

[0047] Figure 3C A cross-sectional view along the dotted line A1B1; Figure 3A A cross-sectional view along the dotted line A2B2 when the transfer film is attached;

[0048] Figure 3C A cross-sectional view along the dotted line A2B2 when the first protective tape is attached; Figure 3A A cross-sectional view along the dotted line A2B2 when the first protective tape is attached;

[0049] Figure 4A A top view of the transfer film corresponding to the second protective tape;

[0050] Figure 4B A top view of the second protective tape;

[0051] Figure 4C A top view when the second protective tape is attached;

[0052] Figure 5A A top view of the circuit board after the first protective tape and the second protective tape are attached;

[0053] Figure 5B A cross-sectional view along the dotted line A1B1; Figure 5A A cross-sectional view along the dotted line A1B1;

[0054] Figure 6 A manufacturing flowchart of the display device provided by the embodiment. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without any creative effort fall within the protection scope of the present disclosure.

[0056] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the meanings as understood by a person of ordinary skill in the art to which the present disclosure pertains. The terms "first", "second", and similar terms are used herein to distinguish one element from another, and are not necessarily used in a sequence or to denote importance or quantity. The terms "comprise", "comprising", "include", "including" and the like are used herein to mean including but not limited to. The terms "connected", "coupled", and the like are used herein to indicate either a direct connection, an indirect connection or an electrical connection between two or more elements, and can encompass the presence of wired or wireless electrical connections between two or more elements. The terms "upper", "lower", "left", "right" and the like are used herein for ease of description to describe the orientations of an element under discussion and do not connote specific orientations of the element under discussion, which can be determined in accordance with the absolute positions of the element under discussion.

[0057] As used herein, "about" or "approximately" means within a range that is acceptable to a person of ordinary skill in the art considering the measurement and error (i.e., limitations of the measurement system) associated with the measurement of the particular quantity. For example, "about" can mean within one or more standard deviations, or within ±30%, 20%, 10%, 5% of the stated value.

[0058] In the drawings, the thicknesses of layers, films, panels, regions, etc., are exaggerated for clarity. Exemplary embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, embodiments described herein are not to be construed as being limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an area illustrated or described as flat can typically have rough and / or nonlinear features. Moreover, sharp angles that are illustrated can be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the present claims.

[0059] In order to keep the following description of the embodiments of the present disclosure clear and concise, the detailed description of known functions and known components will be omitted.

[0060] To improve the overall waterproof performance of foldable products, a waterproof structure must be designed from the inside out. Generally, waterproof adhesive is applied around component assemblies during display assembly. This necessitates that during display production, when applying the EMI tape (for electrostatic and electromagnetic protection), the area around component assembly 02 should not be covered. The area around component assembly 02 is reserved for adhesive application, but the EMI tape 03 on the component and circuit board surfaces is isolated, and the EMI tape 03 on the surface of component assembly 02 cannot be grounded. To achieve grounding, conventional designs... Figures 1A-1C As shown, where, Figure 1B for Figure 1A A schematic diagram of the cross-section at point A1B1 along the dashed line. Figure 1C for Figure 1A The cross-sectional diagram at point C1D1 along the dotted line shows that the protective tape 03 is applied using an integrated design, meaning the surface of component group 02 and the circuit board surface are a single sheet of tape. After the circuit board is bonded, a single-sided transfer film 05 is applied. The protective tape 03 on the surface of component group 02 and the protective tape 03 on the surface of the circuit board are connected into a single unit through a small area on the side, which can achieve grounding. However, the integrated design has problems such as... Figure 1C As shown, where, Figure 1C The diagram on the right shows the attachment process using transfer film 05. Figure 1C The left figure shows the final attachment diagram of the protective tape 03 after removing the transfer film 05. Since the protective tape 03 on the surface of component group 02 is broken on three sides and the protective tape 03 on the surface of the circuit board, and the side of component group 02 is sloping during attachment, and the protective tape 03 in the sloping area is relatively narrow and long (for example, 2-3 mm wide and about 20 mm long), wrinkles and incomplete attachment are inevitable during attachment, resulting in poor electromagnetic and electrostatic protection effects.

[0061] In view of this, see Figures 2A-5B As shown, where, Figure 2A This is a top view of the circuit board without the first and second protective tapes applied. Figure 2B for Figure 2A A schematic diagram of the cross-section at point A1B1 along the dashed line. Figure 3A This is a top view of the circuit board after the first protective tape has been applied. Figure 3B for Figure 3A A schematic diagram of the cross-section at point A1B1 along the dashed line. Figure 3C The image on the right is Figure 3A A cross-sectional diagram of the transfer film being attached at point A2B2 along the dashed line. Figure 3C The left image is Figure 3A A cross-sectional diagram showing the first protective tape applied at point A2B2 along the dotted line in the center. Figure 4A A top view of the transfer film corresponding to the second protective tape. Figure 4BA top view of the second protective tape, Figure 4C A top view of the second protective tape, Figure 5A A top view of the circuit board after the first protective tape and the second protective tape are attached, Figure 5B A top view of the circuit board after the first protective tape and the second protective tape are attached, Figure 5A A cross-sectional view along the dashed line A1B1, the electronic device protection structure provided by the embodiment of the present application comprises: a substrate 1, a component group 2 located on one side of the substrate 1, a first protective tape 3 located on a side of the component group 2 away from the substrate 1, and a second protective tape 4 located on a side of the first protective tape 3 away from the component group 2. Specifically, the component group 2 can include one or more components, and the components can include, for example, a control chip IC, a capacitor C, and / or a resistor R, etc.

[0062] The first protective tape 3 comprises: a covering portion 31 covering the component group 2, and a lap portion 32 extending from at least one side of the covering portion 31 to contact the substrate 1.

[0063] The second protective tape 4 is attached to the periphery of the component group 2 and electrically connected to the lap portion 32. Specifically, the periphery of the component group 2 can be understood as a part or all of the region outside the component group 2.

[0064] In the embodiment of the present application, the electronic device protection structure comprises the first protective tape 3 and the second protective tape 4 located on a side of the first protective tape 3 away from the component group 2. The first protective tape 3 comprises: a covering portion 31 covering the component group 2, and a lap portion 32 extending from at least one side of the covering portion 31 to contact the substrate 1. The second protective tape 4 is attached to the periphery of the component group 2 and electrically connected to the lap portion 32. In the embodiment of the present application, the first protective tape 3 on the surface of the component group 2 is designed separately from the second protective tape 4 on the periphery of the component group 2 through the "stacking" type protective tape structure design, and then the two areas of protective tape are connected in a "stacking" manner. In this way, the first protective tape 3 on the surface of the component group 2 can be grounded through the second protective tape 4 on the periphery of the component group 2. Since the covering portion 31 on the surface of the component group 2 and the lap portion 32 extending therefrom are integrated and designed separately from the second protective tape 4 on the periphery of the component group 2, there is no wrinkle or virtual attachment when attaching, which can improve the problem that the attached protective tape has wrinkles and virtual attachment, resulting in poor electromagnetic and electrostatic protection effect in the prior art.

[0065] In a possible implementation, the electronic device protection structure is combined with Figure 5AAs shown, the second protective tape 4 has a gap P with the component group 2. Specifically, the gap P can be used to set a waterproof adhesive for waterproofing the component group 2, that is, by dispensing glue on the component group 2 and the peripheral gap P to strengthen the waterproofing of the component group 2, and improve the waterproofing performance when the circuit board is applied to a foldable display device (such as a foldable mobile phone), which has a gap between the screen and the middle frame due to its folding characteristics, and cannot be waterproofed by the casing.

[0066] In a possible implementation, in combination with Figure 3A , Figure 3B and Figure 5B As shown, the lap joint portion 32 includes a first lap joint portion 321 and a second lap joint portion 322 connecting the first lap joint portion 321 and the cover portion 31; the first lap joint portion 321 is in contact with the substrate 1, and the lap joint portion 32 is electrically connected to the second protective tape 4 at the first lap joint portion 321. Specifically, the second lap joint portion 322 is used to connect the cover portion 31 and the first lap joint portion 321, and can be partially in contact with the substrate 1 or be partially arranged at an angle with the substrate 1.

[0067] In a possible implementation, in combination with Figure 3B and Figure 5B As shown, the lower part of Figure 3B is an enlarged view of the dashed box in the upper part of Figure 3B , Figure 5B As shown, the lower part of Figure 5B is an enlarged view of the dashed box in the upper part of , the first protective tape 3 includes a first insulating layer 33, a first conductive layer 35, and a second insulating layer 34 stacked away from the substrate 1 in sequence; the second protective tape 4 includes a third insulating layer 41, a second conductive layer 43, and a fourth insulating layer 42 stacked away from one side of the substrate 1 in sequence; the first protective tape 3 exposes the first conductive layer 35 in a region corresponding to the first lap joint portion 321 on a side facing the second protective tape 4, and the second protective tape 4 exposes the second conductive layer 43 in a region corresponding to the first lap joint portion 321 on a side facing the first protective tape 3, so that the first conductive layer 35 of the first protective tape 3 and the second conductive layer 43 of the second protective tape 4 are electrically connected.

[0068] Figure 5B In a possible implementation, in combination with As shown, the substrate 1 includes a third conductive layer including the wire 5, and the second protective tape 4 is also electrically connected to part of the wire 5. In this way, the circuit board can be used to guide out interference signals such as static electricity or electromagnetic signals from the outside. Specifically, the material of the wire 5 can be copper.

[0069] Figure 5BAs shown, the overlap portion 32 can extend to the side of the circuit board where the wire 5 is provided.

[0070] Specifically, in combination with Figure 5B As shown, the side of the second protective tape 4 facing the substrate 1 has an opening 40 in the region corresponding to the wire at the overlap, exposing the second conductive layer 43, so that the second conductive layer 43 of the second protective tape 4 is electrically connected to the wire 5.

[0071] In a possible implementation, in combination with Figure 5B As shown, the first insulating layer 33 includes a first sub-insulating layer 331 and a first insulating adhesive layer 332 located on the side of the first sub-insulating layer 331 away from the first conductive layer 35; the first conductive layer 35 includes a first sub-conductive layer 351 and a first conductive adhesive layer 352 located on the side of the first sub-conductive layer 351 facing the first insulating layer 33; and the second insulating layer 34 includes a second sub-insulating layer 341 and a second insulating adhesive layer 342 located on the side of the second sub-insulating layer 341 facing the first conductive layer 35.

[0072] In a possible implementation, in combination with Figure 5B As shown, the third insulating layer 41 includes a third sub-insulating layer 411 and a third insulating adhesive layer 412 located on the side of the third sub-insulating layer 411 away from the second conductive layer 43; the second conductive layer 43 includes a second sub-conductive layer 431 and a second conductive adhesive layer 432 located on the side of the second sub-conductive layer 431 facing the third insulating layer 41; and the fourth insulating layer 42 includes a fourth sub-insulating layer 421 and a fourth insulating adhesive layer 422 located on the side of the fourth sub-insulating layer 421 facing the second conductive layer 43.

[0073] In a possible implementation, in combination with Figure 5B As shown, the material of the first sub-insulating layer 331 is the same as that of the third sub-insulating layer 411, and the material of the first insulating adhesive layer 332 is the same as that of the third insulating adhesive layer 412; specifically, the material of the first sub-insulating layer 331 and that of the third sub-insulating layer 411, for example, can both be polyethylene terephthalate (PET), and specifically, for example, the material of the first insulating adhesive layer 332 and that of the third insulating adhesive layer 412 can both be pressure sensitive adhesive (PSA).

[0074] The material of the first sub-conductive layer 351 is the same as the material of the second sub-conductive layer 431, and the material of the first conductive adhesive layer 352 is the same as the material of the second conductive adhesive layer 432. Specifically, the material of the first conductive adhesive layer 352 and the material of the second conductive adhesive layer 432 may, for example, both be conductive cloth, may, for example, both be a copper layer, or may, for example, be electrospun fibers. Specifically, the material of the first conductive adhesive layer 352 and the material of the second conductive adhesive layer 432 may, for example, both be pressure sensitive adhesive (PSA).

[0075] The material of the second sub-insulating layer 341 is the same as the material of the fourth sub-insulating layer 421, and the material of the second insulating adhesive layer 342 is the same as the material of the fourth insulating adhesive layer 422. Specifically, the material of the second sub-insulating layer 341 and the material of the fourth sub-insulating layer 421 may, for example, both be a Mylar adhesive layer. The material of the second insulating adhesive layer 342 and the material of the fourth insulating adhesive layer 422 may, for example, both be pressure sensitive adhesive (PSA).

[0076] In a possible implementation, in combination with Figure 3A As shown in the figure, in the direction perpendicular to the direction in which the covering portion 31 points to the lapping portion 32, the projection width d1 of the first lapping portion 321 on the substrate 1 is greater than the projection width d2 of the covering portion 31 on the substrate 1. In the direction perpendicular to the direction in which the covering portion 31 points to the lapping portion 32, the projection width d2 of the covering portion 31 on the substrate 1 is greater than the projection width d3 of the second lapping portion 322 on the substrate 1.

[0077] In a possible implementation, in combination with Figure 3A As shown in the figure, in the direction in which the covering portion 31 points to the lapping portion 32, the projection length a1 of the first lapping portion 321 on the substrate 1 is less than the projection length a2 of the covering portion 31 on the substrate 1. In the direction in which the covering portion 31 points to the lapping portion 32, the projection length a1 of the first lapping portion 321 on the substrate 1 is the same as the projection length a3 of the second lapping portion 322 on the substrate 1.

[0078] In a possible implementation, in combination with Figure 2A and Figure 3A As shown in the figure, the orthographic projection of the component group 2 on the substrate 1 falls within the orthographic projection of the covering portion 31 on the substrate 1. Specifically, the orthographic projection of the covering portion 31 on the substrate 1 and the orthographic projection of the component group 2 on the substrate 1 may, for example, coincide with each other.

[0079] Based on the same inventive concept, the present application also provides a circuit board, which comprises the first protective adhesive tape provided by the embodiment of the present application, a substrate, and a component group.

[0080] In a possible implementation, the circuit board is a flexible circuit board (FPC).

[0081] Based on the same inventive concept, the present application also provides a display module, comprising a display panel and a circuit board and a second protective tape as provided by the present application. Specifically, the display module of the present application can be a folding display device, for example, a folding mobile phone, a folding tablet computer, a folding television, a folding display, a folding notebook computer, a folding digital photo frame, a folding navigator, or any product or component with display function. Other essential components of the display device are understood by those skilled in the art and are not described here, nor should they be considered as a limitation on the present disclosure.

[0082] Based on the same inventive concept, the present application also provides a manufacturing method for manufacturing a display module as provided by the present application, as shown in Figure 6 The manufacturing method comprises:

[0083] Step S100, providing a substrate, wherein one side of the substrate is provided with a component group;

[0084] Step S200, attaching a first protective tape to the side of the component group away from the substrate, wherein the first protective tape comprises a covering portion covering the component group, and a lap portion extending from at least one side of the covering portion and contacting the substrate;

[0085] Step S300, attaching a second protective tape to the side of the first protective tape away from the component group, wherein the second protective tape is attached to the periphery of the component group and electrically lapped with the lap portion.

[0086] In a possible implementation, regarding step S200, attaching a first protective tape to the side of the component group away from the substrate, comprises:

[0087] Step S201, providing a circuit board, wherein one side of the circuit board is provided with a component group;

[0088] Step S202, attaching a first protective tape to one side of the circuit board;

[0089] Step S203, binding the circuit board with the first protective tape attached to the display panel.

[0090] In the present application, the first protective tape can be attached after the circuit board is manufactured by the circuit board supplier, which can play a protective role against static electricity when the circuit board is single, and will not increase the process steps of the module factory.

[0091] The beneficial effects of the embodiments of the present application are as follows: in the embodiments of the present application, the electronic device protection structure comprises a first protective tape 3 and a second protective tape 4 located on the side of the first protective tape 3 away from the component group 2; the first protective tape 3 comprises a covering portion 31 covering the component group 2 and a lap portion 32 extending from at least one side of the covering portion 31 to contact the substrate 1; and the second protective tape 4 is attached to the periphery of the component group 2 and electrically connected to the lap portion 32. In the embodiments of the present application, the first protective tape 3 on the surface of the component group 2 is designed separately from the second protective tape 4 on the periphery of the component group 2 through the design of the protective tape structure in the form of “stacking and splicing”, and then the two areas of protective tape are connected in the form of “stacking and splicing”. In this way, the first protective tape 3 on the surface of the component group 2 can be grounded through the second protective tape 4 on the periphery of the component group 2. Since the covering portion 31 on the surface of the component group 2 and the lap portion 32 extending therefrom are integrated and designed separately from the second protective tape 4 on the periphery of the component group 2, there will be no wrinkles and virtual attachment when the protective tape is attached, and thus the problem that the protective tape attached to the circuit board in the prior art has wrinkles and virtual attachment, resulting in poor electromagnetic and electrostatic protection effect, can be improved.

[0092] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application belong to the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these modifications and variations.

Claims

1. An electronic device protection structure, characterized by, The application relates to a substrate, a component group on one side of the substrate, a first protective tape on the side of the component group away from the substrate, and a second protective tape on the side of the first protective tape away from the component group; the component group comprises one or more components, and the components comprise control chips, capacitors and / or resistors. The first protective tape comprises a covering part covering the component group and a lap part extending from at least one side of the covering part to contact the substrate. The second protective tape is attached to the periphery of the component group and is electrically connected to the lap part. The second protective tape has a gap with the component group.

2. The electronic device protection structure of claim 1, wherein, The lap part comprises a first lap part and a second lap part connecting the first lap part and the covering part.

3. An electronic device protection structure as claimed in claim 1 or 2, characterized in that The first lap part contacts the substrate, and the lap part is electrically connected to the second protective tape at the first lap part. The first protective tape comprises a first insulating layer, a first conductive layer and a second insulating layer stacked away from the substrate in sequence; the second protective tape comprises a third insulating layer, a second conductive layer and a fourth insulating layer stacked away from the substrate in sequence.

4. The electronic device protection structure of claim 3, wherein, One side of the first protective tape facing the second protective tape and the corresponding area of the first lap part expose the first conductive layer, and one side of the second protective tape facing the first protective tape and the corresponding area of the first lap part expose the second conductive layer, so that the first conductive layer of the first protective tape is electrically connected to the second conductive layer of the second protective tape. The substrate comprises a third conductive layer, and the third conductive layer comprises a wire, and the wire is grounded.

5. The electronic device protection structure of claim 4, wherein, The second protective tape is also electrically connected to part of the wire. One side of the second protective tape facing the substrate has an opening in the area corresponding to the wire at the lap part, and the second conductive layer is exposed, so that the second conductive layer of the second protective tape is electrically connected to the wire.

6. The electronic device protection structure of claim 5, wherein, The first insulating layer comprises a first sub-insulating layer and a first insulating adhesive layer on the side of the first sub-insulating layer away from the first conductive layer.

7. An electronic device protection structure as claimed in any one of claims 4-6, characterized in that The first conductive layer comprises a first sub-conductive layer and a first conductive adhesive layer on the side of the first sub-conductive layer facing the first insulating layer. The second insulating layer comprises a second sub-insulating layer and a second insulating adhesive layer on the side of the second sub-insulating layer facing the first conductive layer. The third insulating layer comprises a third sub-insulating layer and a third insulating adhesive layer on the side of the third sub-insulating layer away from the second conductive layer.

8. The electronic device protection structure of claim 7, wherein the adhesive is a pressure sensitive adhesive. The second conductive layer comprises a second sub-conductive layer and a second conductive adhesive layer on the side of the second sub-conductive layer facing the third insulating layer. The fourth insulating layer comprises a fourth sub-insulating layer and a fourth insulating adhesive layer on the side of the fourth sub-insulating layer facing the second conductive layer. The material of the first sub-insulating layer is the same as that of the third sub-insulating layer, and the material of the first insulating adhesive layer is the same as that of the third insulating adhesive layer.

9. The electronic device protection structure of claim 8, wherein, ​ The material of the first sub-conductive layer is the same as the material of the second sub-conductive layer, and the material of the first conductive adhesive layer is the same as the material of the second conductive adhesive layer; The material of the second sub-insulating layer is the same as the material of the fourth sub-insulating layer, and the material of the second insulating adhesive layer is the same as the material of the fourth insulating adhesive layer.

10. The electronic device protection structure of claim 3, wherein, The width of the projection of the first lap portion on the substrate is greater than the width of the projection of the cover portion on the substrate. The width of the projection of the cover portion on the substrate is greater than the width of the projection of the second lap portion on the substrate.

11. The electronic device protection structure of claim 3, wherein, The projection length of the first lap portion on the substrate is less than the projection length of the cover portion on the substrate. The projection length of the first lap portion on the substrate is the same as the projection length of the second lap portion on the substrate.

12. The electronic device protection structure of claim 3, wherein, The projection of the component group on the substrate falls within the projection of the cover portion on the substrate.

13. A circuit board, characterized by The electronic device protection structure comprises the first protective tape, the second protective tape, the substrate, and the component group.

14. A display module, characterized by The circuit board comprises a display panel.

15. A method of manufacturing the display module of claim 14, wherein, The manufacturing method comprises: Providing a substrate, wherein one side of the substrate is provided with a component group; Attaching a first protective tape to the side of the component group away from the substrate, wherein the first protective tape comprises a cover portion covering the component group, and a lap portion extending from at least one side of the cover portion and in contact with the substrate; Attaching a second protective tape to the side of the first protective tape away from the component group, wherein the second protective tape is attached to the periphery of the component group and electrically connected to the lap portion.

16. The manufacturing method as described in claim 15, characterized in that, The method of attaching the first protective tape to the side of the component group away from the substrate comprises: Attaching the first protective tape to the side of the component group away from the substrate to form the circuit board; Binding the circuit board with the first protective tape to a display panel.

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