A method and apparatus for brushing a substrate

Abstract

This invention discloses a method and apparatus for brushing and polishing a substrate. The method includes the following steps: plugging the through holes in a copper-clad laminate to obtain a plugged copper-clad laminate and plugging resin; performing a first rough polishing treatment on the surface resin and the bottom resin respectively by flipping a plate to obtain a copper-clad laminate after the first rough polishing treatment; performing a second rough polishing treatment on the surface resin and the bottom resin of the copper-clad laminate after the first rough polishing treatment by flipping a plate to obtain a copper-clad laminate after the second rough polishing treatment; and polishing the upper and lower surfaces of the copper-clad laminate after the second rough polishing treatment by flipping a plate to obtain a copper-clad laminate with a smooth surface. The polishing treatment is completed by applying a third pressure to the copper-clad laminate with a second ceramic brush, and the third pressure is greater than the first pressure, thereby improving the brushing and polishing efficiency of the substrate, reducing the scrap rate of substrate production, and effectively controlling the production cost of the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of substrate production, and in particular to a substrate brushing method and device. BACKGROUND

[0002] In the processing of copper clad laminated board, in order to connect the circuits on each layer of board, a through hole is needed to be set through the copper clad laminated board, and a copper foil is plated on the hole wall of the through hole, and the circuits between each layer of board are connected through the copper foil on the hole wall of the through hole to form a whole. Among them, the hole filling is an important process in the production of substrate, and the specified material is filled into the through hole of the substrate by a certain method according to the requirements. For example, before etching, in order to avoid the etching solution flowing into the through hole and corroding the copper foil on the hole wall of the through hole, the resin or ink needs to be filled into the through hole to cover or plug the through hole. After the hole filling, the resin or ink is caused to overflow out of the through hole of the substrate due to gravity, resulting in uneven upper and lower surfaces of the substrate, which affects the normal progress of the subsequent process. Therefore, after the hole filling is completed, the surface of the substrate needs to be brushed to keep the upper and lower surfaces of the substrate flat.

[0003] With the rapid development of electronic products towards light, thin, short, small, high density, multi-function, microelectronic integration technology, the circuit of the copper clad laminated board also has higher requirements. The existing substrate brushing process cannot guarantee the flatness of the substrate, and has poor grinding ability for the substrate with thin thickness, high rejection rate, and is prone to the phenomenon of missing substrate on the surface of the substrate or unclean grinding plate, which affects the yield of the substrate production. SUMMARY

[0004] To solve the above problems, the purpose of the present application is to provide a substrate brushing method and device, improve the brushing efficiency of the substrate, reduce the rejection rate of the substrate production, and effectively control the production cost of the substrate.

[0005] The technical scheme adopted by the present application to solve the problems is:

[0006] In a first aspect, the present application provides a substrate brushing method, which comprises the following steps:

[0007] Filling the through hole on the copper clad laminated board to obtain a copper clad laminated board after hole filling and hole filling resin, wherein the hole filling resin after hole filling includes surface resin protruding from the surface of the copper clad laminated board and bottom surface resin protruding from the bottom surface of the copper clad laminated board;

[0008] Conveying the copper clad laminated board to a first station, and the first station is provided with a first ceramic brush;

[0009] The surface resin and the bottom resin on the copper-clad plate are respectively subjected to a first rough polishing treatment by means of a plate turning manner, wherein the first rough polishing treatment is completed by applying a first pressure to the copper-clad plate by the first ceramic brush;

[0010] The copper-clad plate after the first rough polishing treatment is transported to a second station, and the second station is provided with a non-woven fabric brush;

[0011] The surface resin and the bottom resin on the copper-clad plate after the first rough polishing treatment are respectively subjected to a second rough polishing treatment by means of a plate turning manner, wherein the second rough polishing treatment is completed by applying a second pressure to the copper-clad plate by the non-woven fabric brush;

[0012] The copper-clad plate is transported to a third station, and the third station is provided with a second ceramic brush, and the granularity of the second ceramic brush is greater than that of the first ceramic brush;

[0013] The upper and lower surfaces of the copper-clad plate after the second rough polishing treatment are respectively subjected to a polishing treatment by means of a plate turning manner, so as to obtain the copper-clad plate with smooth surfaces, wherein the polishing treatment is completed by applying a third pressure to the copper-clad plate by the second ceramic brush, and the third pressure is greater than the first pressure.

[0014] In some embodiments, the method for plugging a through hole on a copper-clad plate to obtain a copper-clad plate after plugging comprises:

[0015] Fixing the copper-clad plate on a workbench;

[0016] Pressing resin into the through hole by means of a scraper to obtain the copper-clad plate after plugging.

[0017] In some embodiments, the method for pressing resin into the through hole by means of a scraper comprises:

[0018] Performing vacuumizing treatment on the workbench, wherein the vacuumizing pressure of the workbench is 37 Pa;

[0019] The scraper applies pressure to the resin in a first direction, wherein the pressure of the scraper is 7 kg / cm 2 , the speed of the scraper in the first direction is 45 mm / s, and the angle formed by the scraper and the copper-clad plate is 15°;

[0020] The scraper applies pressure to the resin in a second direction, wherein the speed of the scraper in the second direction is 200 mm / s, and the second direction is opposite to the first direction.

[0021] In some embodiments, the surface resin and the bottom surface resin are respectively subjected to a first rough polishing treatment by means of turning over the copper-clad plate to obtain a first rough polishing treated copper-clad plate, comprising:

[0022] pressing the first ceramic brush onto the copper-clad plate until the pressure applied by the first ceramic brush onto the copper-clad plate reaches the first pressure, wherein the first pressure is 1.4 kg / cm 2 ;

[0023] polishing the surface resin by means of the first ceramic brush, wherein the working current of the first ceramic brush is 0.6 A, the moving speed of the first ceramic brush is 3 m / min, and the granularity of the first ceramic brush is 800 mesh;

[0024] lifting the first ceramic brush, and turning over the copper-clad plate so that the bottom surface resin faces the first ceramic brush;

[0025] pressing the first ceramic brush onto the copper-clad plate until the pressure applied by the first ceramic brush onto the copper-clad plate reaches the first pressure, wherein the first pressure is 1.4 kg / cm 2 ;

[0026] polishing the surface resin by means of the first ceramic brush to obtain a first rough polishing treated copper-clad plate, wherein the working current of the first ceramic brush is 0.6 A, the moving speed of the first ceramic brush is 3 m / min, and the granularity of the first ceramic brush is 800 mesh.

[0027] In some embodiments, the first ceramic brush is pressed onto the copper-clad plate until the pressure applied by the first ceramic brush onto the copper-clad plate reaches the first pressure, comprising:

[0028] the first ceramic brush is pressed onto the first station and the pressure received by the first station is obtained;

[0029] when the pressure received by the first station is equal to the first pressure, the first ceramic brush stops pressing.

[0030] In some embodiments, the surface resin and the bottom surface resin on the first rough polishing treated copper-clad plate are respectively subjected to a second rough polishing treatment by means of turning over the copper-clad plate to obtain a second rough polishing treated copper-clad plate, comprising:

[0031] pressing the non-woven fabric brush onto the first rough polishing treated copper-clad plate until the pressure applied by the non-woven fabric brush onto the copper-clad plate reaches the second pressure;

[0032] polishing the surface resin by the non-woven fabric brush, wherein the working current of the non-woven fabric brush is 0.6A, the moving speed of the non-woven fabric brush is 3m / min, and the granularity of the non-woven fabric brush is 800 mesh, to obtain the copper-clad plate after surface polishing by the non-woven fabric brush;

[0033] lifting the non-woven fabric brush, and turning over the copper-clad plate after surface polishing by the non-woven fabric brush so that the bottom surface resin faces the non-woven fabric brush;

[0034] pressing the non-woven fabric brush onto the copper-clad plate after surface polishing by the non-woven fabric brush until the pressure applied by the non-woven fabric brush to the copper-clad plate after surface polishing by the non-woven fabric brush reaches the second pressure;

[0035] polishing the bottom surface resin by the non-woven fabric brush to obtain the copper-clad plate after the second rough polishing, wherein the working current of the non-woven fabric brush is 0.6A, the moving speed of the non-woven fabric brush is 3m / min, and the granularity of the non-woven fabric brush is 800 mesh.

[0036] In some embodiments, the upper and lower surfaces of the copper-clad plate after the second rough polishing are polished by turning over the copper-clad plate to obtain the copper-clad plate with smooth surfaces, comprising:

[0037] pressing the second ceramic brush onto the copper-clad plate after the second rough polishing until the pressure applied by the second ceramic brush to the copper-clad plate after the second rough polishing reaches the third pressure, wherein the third pressure is 1.6kg / cm 2 ;

[0038] polishing the surface resin by the second ceramic brush to obtain the copper-clad plate after surface treatment by the second ceramic brush, wherein the working current of the second ceramic brush is 0.6A, the moving speed of the first ceramic brush is 3m / min, and the granularity of the second ceramic brush is 2000 mesh;

[0039] lifting the second ceramic brush, and turning over the copper-clad plate after surface treatment by the second ceramic brush so that the bottom surface resin faces the second ceramic brush;

[0040] pressing the second ceramic brush onto the copper-clad plate after surface treatment by the second ceramic brush until the pressure applied by the second ceramic brush to the copper-clad plate after surface treatment by the second ceramic brush reaches the third pressure, wherein the third pressure is 1.6kg / cm 2 ;

[0041] The surface resin is polished by the second ceramic brush to obtain a smooth copper-clad laminate. The operating current of the second ceramic brush is 0.6A, the moving speed of the first ceramic brush is 3m / min, and the particle size of the second ceramic brush is 2000 mesh.

[0042] Secondly, embodiments of this application provide a substrate brushing apparatus, comprising:

[0043] A via-plugging module is used to plug through holes on a copper-clad laminate to obtain the copper-clad laminate after plugging and via-plugging resin, wherein the via-plugging resin includes a surface resin and a bottom resin protruding from the surface of the copper-clad laminate.

[0044] The first brushing module is used to perform a first rough grinding process on the surface resin and the bottom resin respectively by flipping the plate to obtain the copper-clad board after the first rough grinding process. The first rough grinding is completed by applying a first pressure to the copper-clad board by the first ceramic brush.

[0045] The second brushing module is used to perform a second rough polishing process on the surface resin and the bottom resin of the copper-clad laminate after the first rough polishing process by flipping a plate, so as to obtain the copper-clad laminate after the second rough polishing process. The second rough polishing is completed by applying the second pressure to the copper-clad laminate by the non-woven brush.

[0046] The polishing module is used to polish the upper and lower surfaces of the copper-clad laminate after the second rough grinding process by flipping the plate to obtain a smooth copper-clad laminate. The polishing process is completed by applying a third pressure to the copper-clad laminate by the second ceramic brush, and the third pressure is greater than the first pressure.

[0047] The conveying module is used to convey the copper-clad laminate to a first station equipped with the first ceramic brush; it is also used to convey the copper-clad laminate after the first rough polishing treatment to a second station, the second station being equipped with a non-woven fabric brush; and it is also used to convey the copper-clad laminate to a third station, the third station being equipped with a second ceramic brush, the second ceramic brush having a larger particle size than the first ceramic brush.

[0048] Thirdly, embodiments of this application provide an electronic device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, it implements the substrate brushing method described above.

[0049] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the substrate brushing method described above.

[0050] In this embodiment, the through holes on the copper-clad laminate are plugged to form a plugging resin higher than the copper-clad laminate; the plugging resin is first coarsely polished with a first ceramic brush under a first pressure; the plugging resin is second coarsely polished with a non-woven brush under a first pressure; and the plugging resin is polished with a second ceramic brush under a second pressure to obtain a copper-clad laminate with a smooth surface. The second pressure is greater than the first pressure. By performing two coarse polishing and polishing processes on the copper-clad laminate with different pressures using a ceramic brush and a non-woven brush, the brushing efficiency of the substrate is improved, the scrap rate of substrate production is reduced, and the production cost of the substrate is effectively controlled.

[0051] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0052] Figure 1 This is a flowchart of a substrate brushing method according to an embodiment of the present invention;

[0053] Figure 2 for Figure 1 Flowchart of step S1000;

[0054] Figure 3 for Figure 2 Flowchart of step S1200;

[0055] Figure 4 for Figure 1 Flowchart of step S3000;

[0056] Figure 5 for Figure 4 Flowchart of step S3100;

[0057] Figure 6 for Figure 1 Flowchart of step S5000;

[0058] Figure 7 for Figure 1 Flowchart of step S7000;

[0059] Figure 8 This is a structural diagram of a substrate brushing device according to an embodiment of the present invention;

[0060] Figure 9 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0061] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0062] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0063] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0064] In the description of this invention, unless otherwise explicitly defined, terms such as "setting," "installing," and "connecting" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0065] The substrate brushing method and apparatus involved in this invention are based on a multilayer substrate processing method. The fabrication process of a multilayer substrate includes multiple steps such as single-layer fabrication, lamination, drilling, copper plating, solder resist printing, and soldering. To protect the copper foil on the walls of vias and maintain the connectivity of circuits between layers, predetermined materials need to be filled into the vias in a predetermined process. For example, before etching, to prevent copper etching solution from flowing into the vias and corroding the copper foil on the via walls, predetermined resin or ink needs to be inserted into the vias to cover or plug them; before soldering the printed circuit, to prevent soldering from damaging the copper foil on the via walls, solder resist needs to be inserted into the vias while printing the solder resist. The method of inserting and filling the vias with predetermined materials is called the via-plugging method. After via plugging, due to gravity, manufacturing processes, and other factors, resin or ink may overflow from the vias of the substrate, causing unevenness on the upper and lower surfaces of the substrate, affecting the normal operation of subsequent processes. Therefore, after the vias are plugged, the surface of the substrate needs to be brushed to keep the upper and lower surfaces of the substrate flat.

[0066] With the advancement and development of electronic technology, multilayer boards are increasingly widely used in various electrical devices. When processing multilayer boards, through-holes are needed to connect the circuits on each layer. Copper foil is plated onto the walls of these through-holes, connecting the circuits between layers and integrating the printed circuits on the multilayer board into a unified whole. Boards have evolved from single-layer to double-sided, multilayer, and flexible, each maintaining its own development trend. Due to the continuous pursuit of higher precision, higher density, and higher reliability, along with efforts to reduce size, lower cost, and improve performance, existing board polishing processes cannot guarantee board flatness. They also have poor polishing capabilities for thinner boards, resulting in a high scrap rate and failing to meet the production requirements of high-precision boards.

[0067] Based on the above, embodiments of the present invention provide a method and apparatus for brushing and polishing a substrate. The method involves plugging the through-holes on a copper-clad laminate to form a plugging resin higher than the copper-clad laminate; performing a first coarse polishing of the plugging resin using a first ceramic brush; performing a second coarse polishing of the plugging resin using a non-woven fabric brush; and polishing the plugging resin using a second ceramic brush to obtain a copper-clad laminate with a smooth surface. By performing two coarse polishing and polishing processes on the copper-clad laminate, the brushing and polishing efficiency of the substrate is improved, the scrap rate of substrate production is reduced, and the production cost of the substrate is effectively controlled.

[0068] Please see Figure 1 , Figure 1 The flowchart illustrates a substrate brushing method provided by an embodiment of the present invention. For example... Figure 1 As shown, the substrate brushing method of this embodiment includes the following steps:

[0069] Step S1000: Plug the through holes on the copper clad laminate to obtain a plugged copper clad laminate and plugging resin, wherein the plugging resin includes a surface resin protruding from the surface of the copper clad laminate and a bottom surface resin protruding from the bottom surface of the copper clad laminate.

[0070] Understandably, via plugging is a crucial step in substrate manufacturing. In practical applications, the via plugging process prevents solder from penetrating through vias and causing short circuits during wave soldering, and also prevents solder balls from popping out and causing short circuits in the copper-clad laminate. When there are vias on the pads of Ball Grid Array (BGA) packaging technology, via plugging must be performed first, followed by gold plating, to facilitate BGA soldering. Via plugging can also prevent flux residue from remaining in the vias, maintaining the flatness of the copper-clad laminate surface, and preventing surface solder paste from flowing into the vias and causing cold solder joints, thus affecting the mounting of the copper-clad laminate.

[0071] Understandably, via plugging can be performed in different ways depending on the specific situation, and its process flow is particularly long and difficult to control. Currently, common via plugging processes include resin plugging and electroplating. Resin plugging involves plating copper onto the via walls, filling them with epoxy resin, and finally plating copper again on the resin surface. The effect is that the via remains conductive, and the surface is free of dents, not affecting soldering. Electroplating directly fills the vias with electroplating, eliminating gaps and providing excellent soldering convenience, but it requires high process skill. This application's embodiments mainly focus on the brushing operation of the substrate after resin plugging. Since resin plugging forms a higher resin level than the copper-clad laminate at both the top and bottom of the via (i.e., surface resin and bottom resin), it is necessary to brush the top and bottom surfaces of the copper-clad laminate to ensure its surface flatness.

[0072] Please see Figure 2 , Figure 2 A schematic diagram illustrating the specific implementation process of another embodiment of step S1000 described above is shown. For example... Figure 2 As shown, step S1000 includes at least the following steps:

[0073] Step S1100: Fix the copper-clad laminate on the worktable.

[0074] Understandably, to ensure the resin can stably and quickly fill the vias on the copper-clad laminate, it is necessary to fix the copper-clad laminate to prevent displacement during the filling process, which would affect the stability of the pressure applied by the scraper. In practical applications, the worktable can fix the copper-clad laminate through positioning holes, which is existing technology and will not be elaborated here.

[0075] Step S1200: Press the resin into the through hole using a scraper to obtain the copper-clad laminate after plugging the hole.

[0076] Understandably, the most difficult aspect of traditional solder mask plugging methods is achieving a high degree of fill, typically requiring 70-100%, meaning the via needs to be 70-100% filled with resin. Incomplete plugging can lead to resin buildup within the via attacking the copper layer and resin in subsequent processing steps, resulting in poor conductivity or poor foaming of the solder mask ink after thermal stress, leading to insufficient product reliability. Currently, to improve plugging fullness, a double-printing method is generally used. However, double printing can easily cause ink buildup, affecting product appearance. Therefore, strict control of the plugging environment and squeegee parameters is necessary.

[0077] Please see Figure 3 , Figure 3 A schematic diagram illustrating the specific implementation process of another embodiment of step S1200 described above is shown. For example... Figure 3 As shown, step S1200 includes at least the following steps:

[0078] Step S1210: Vacuum the worktable, wherein the vacuum pressure of the worktable is 37 Pa.

[0079] Understandably, by vacuuming the worktable and controlling the vacuum pressure at 37 Pa, it is possible to ensure that the resin can stably enter the through-holes. Thus, performing through-hole plugging on the copper-clad laminate in a vacuum environment ensures that the circuit board surface is smooth, not only because the through-holes are filled with plugging resin, but also because of the smooth surface finish. This effectively avoids problems such as incomplete plugging and voids in the plugging process. Controlling the vacuum pressure of the worktable using a vacuum device is existing technology and will not be elaborated upon here.

[0080] Step S1220: The doctor blade applies pressure to the resin along the first direction, wherein the pressure of the doctor blade is 7 kg / cm. 2 The speed of the scraper along the first direction is 45 mm / s, and the angle between the scraper and the copper-clad laminate is 15°.

[0081] Understandably, the pressure applied to the resin by the scraper is 7 kg / cm². 2 The speed of the scraper along the first direction is 45 mm / s, the angle between the scraper and the copper-clad laminate is 15°, and the scraper applies pressure to the resin along the first direction, so that the resin is pressed into the through hole, ensuring that the appearance of the plug is uniform and flat, and improving the saturation of the resin on the scraper entering the hole.

[0082] Step S1230: The scraper applies pressure to the resin in the second direction, wherein the speed of the scraper in the second direction is 200 mm / s, and the second direction is opposite to the first direction.

[0083] Understandably, to improve the via filling effect and avoid resin buildup caused by secondary printing, this embodiment employs a scraping-back method. That is, the scraper maintains constant pressure on the resin during the scraping back motion, while the scraper's speed in the second direction is 200 mm / s. The second direction is opposite to the first direction; the scraper performs one round trip to fill the copper-clad laminate, ensuring a full via filling effect.

[0084] Understandably, in order to allow the resin to harden after plugging, the copper-clad laminate needs to be placed at 130-145℃ for 30-60 minutes to ensure that the resin reaches a certain hardness and to avoid the subsequent polishing operation affecting the saturation of the plugging.

[0085] Step S2000: Convey the copper-clad laminate to the first station, where a first ceramic brush is installed.

[0086] Understandably, copper-clad laminates undergo different brushing and polishing steps at different workstations. To improve the operating efficiency of the copper-clad laminates, they need to be transported to the first workstation via a conveyor module 850. In practical applications, the conveyor module 850 can be a conveyor belt, robotic arm, or other transport device used to quickly transport the copper-clad laminates to the first workstation.

[0087] Step S3000: The surface resin and the bottom resin are subjected to a first rough polishing process by flipping the plate to obtain the copper-clad board after the first rough polishing process. The first rough polishing is completed by applying a first pressure to the copper-clad board with a first ceramic brush.

[0088] It is understood that the copper-clad laminate obtained by step S1000 above has via-filling resin on its upper and lower surfaces. Therefore, both sides of the copper-clad laminate need to be polished. In this embodiment, a flipping method is used to polish both sides of the copper-clad laminate separately. That is, the surface resin of the copper-clad laminate is first polished at the first station, and then the copper-clad laminate is flipped so that the bottom resin faces the first ceramic brush, and then the bottom resin of the copper-clad laminate is polished.

[0089] Understandably, using a ceramic brush to grind the surface of the copper-clad laminate is effective because of its good abrasiveness. The ceramic brush has an elastic porous layer on its surface, which makes it tough and prevents it from scratching the surface of the copper-clad laminate. At the same time, the porous structure of the ceramic brush improves chip removal and prevents chip clogging of the holes. It can also effectively extend the life of the ceramic brush and improve its toughness, ensuring the efficiency of the first ceramic brush in coarsely grinding the resin that is blocking the holes.

[0090] Please see Figure 4 , Figure 4 A schematic diagram illustrating the specific implementation process of another embodiment of step S3000 described above is shown. For example... Figure 4 As shown, step S3000 includes at least the following steps:

[0091] Step S3100: Press the first ceramic brush onto the copper-clad laminate until the pressure applied by the first ceramic brush to the copper-clad laminate reaches the first pressure, wherein the first pressure is 1.4 kg / cm². 2 .

[0092] Understandably, to ensure the polishing effect of the first ceramic brush on the copper-clad laminate, it is necessary to press the first ceramic brush onto the copper-clad laminate and maintain appropriate pressure. Therefore, a pressure sensor needs to be installed at the first station to accurately obtain the pressure applied by the first ceramic brush to the copper-clad laminate, thereby precisely controlling the distance between the first ceramic brush and the copper-clad laminate to avoid over-polishing or under-polishing of the copper-clad laminate, which would affect the production yield of the substrate.

[0093] Please see Figure 5 , Figure 5A schematic diagram illustrating the specific implementation process of another embodiment of step S3100 described above is shown. For example... Figure 5 As shown, step S3100 includes at least the following steps:

[0094] Step S3110: The first ceramic brush presses down and presses the copper-clad laminate onto the first station, and obtains the pressure on the first station.

[0095] Understandably, to ensure the polishing effect of the first ceramic brush on the copper-clad laminate, it is necessary to press the first ceramic brush onto the copper-clad laminate and maintain appropriate pressure. The pressure at the first station is acquired in real time using a pressure sensor. It is understood that acquiring the pressure at the first station using a pressure sensor is existing technology and will not be elaborated upon here.

[0096] Step S3120: When the pressure at the first station is equal to the first pressure, the first ceramic brush stops pressing down.

[0097] Understandably, the first ceramic brush continuously presses down, gradually increasing the pressure on the copper-clad laminate until the pressure at the first station equals the initial pressure, i.e., the pressure at the first station is 1.4 kg / cm². 2 Then, the first ceramic brush stops pressing down and continues to apply the first pressure to the copper-clad board.

[0098] Step S3200: Polish the surface resin with a first ceramic brush, wherein the working current of the first ceramic brush is 0.6A, the moving speed of the first ceramic brush is 3m / min, and the particle size of the first ceramic brush is 800 mesh.

[0099] It is understandable that setting the operating current of the first ceramic brush to 0.6A and its moving speed to 3m / min at the first station can effectively control the polishing depth of the first ceramic brush, ensuring that the polishing depth of each polishing of the copper-clad laminate is less than 2.5μm, thus avoiding damage to the copper-clad laminate. The operating parameters of the first ceramic brush at the first station are existing technology and will not be elaborated upon here.

[0100] It is understandable that the higher the grit size of the ceramic brush, the finer the polishing effect and the smoother the polished surface; the higher the grit size, the finer the particles on the surface of the ceramic brush, and vice versa. In this embodiment, in order to achieve the effect of the first coarse polishing, the grit size of the first ceramic brush is selected as 800 mesh, that is, 800 ceramic brush particles are arranged in each square centimeter area to quickly achieve the effect of the first coarse polishing.

[0101] Step S3300: Raise the first ceramic brush and flip the copper-clad laminate so that the bottom resin faces the first ceramic brush.

[0102] Understandably, after the first ceramic brush completes its initial rough polishing of the surface resin, it rises to release the pressure applied to the copper-clad laminate. The first station then uses a flipping device to flip the laminate, so that the resin-covered bottom faces the first ceramic brush, facilitating the polishing of the bottom surface. In practical applications, the flipping device can move and flip the copper-clad laminate using a suction cup or robotic arm structure; this is existing technology and will not be elaborated upon here.

[0103] Step S3400: Press the first ceramic brush onto the copper-clad laminate until the pressure applied by the first ceramic brush to the copper-clad laminate reaches the first pressure, wherein the first pressure is 1.4 kg / cm². 2 .

[0104] It is understandable that the process of applying the first pressure to the copper-clad laminate by the first ceramic brush before polishing the bottom resin is the same as step S3100 above, and will not be repeated here.

[0105] Step S3500: Polish the surface resin with the first ceramic brush to obtain the copper-clad board after the first rough polishing treatment. The working current of the first ceramic brush is 0.6A, the moving speed of the first ceramic brush is 3m / min, and the particle size of the first ceramic brush is 800 mesh.

[0106] It is understandable that the process of the first ceramic brush polishing the bottom resin is the same as the above step S3200. The first ceramic brush polishes the bottom resin with the same working current and moving speed, which will not be described again here.

[0107] Understandably, in order to improve the uniformity of the first ceramic brush's rough polishing of the copper-clad laminate, the above step S3000 is repeated during the production process to perform a second polishing on both sides of the copper-clad laminate. For details, please refer to step S3000, which will not be repeated here.

[0108] Step S4000: Convey the copper-clad board after the first rough polishing process to the second station, which is equipped with a non-woven fabric brush.

[0109] Understandably, copper-clad laminates undergo different brushing and polishing steps at different workstations. To improve the efficiency of copper-clad laminate operation, after the first rough polishing, the copper-clad laminate needs to be transported to the second workstation via conveyor module 850. In practical applications, conveyor module 850 can be a conveyor belt, robotic arm, or other transport device used to quickly transport the copper-clad laminate to the second workstation.

[0110] Step S5000: The surface resin and bottom resin of the copper-clad laminate after the first rough polishing are subjected to a second rough polishing process by flipping the plate to obtain the copper-clad laminate after the second rough polishing process. The second rough polishing is completed by applying a second pressure to the copper-clad laminate with a non-woven brush.

[0111] Understandably, after the first rough polishing of the copper clad laminate, the surface resin and bottom resin still exceed the surface of the copper clad laminate, requiring a second rough polishing of the top and bottom surfaces to improve the flatness of the copper clad laminate surface.

[0112] Understandably, non-woven fabric brushes are soft brushes, which can prevent surface concavity when polishing thin copper-clad laminates, effectively preventing via deformation. This avoids problems such as excessive polishing of raised areas leading to exposed substrate or incomplete polishing of concave areas. Because non-woven fabric brushes can polish concave areas that ceramic brushes cannot reach, they can effectively remove via-filling resin, ensuring the smoothness of the copper-clad laminate surface.

[0113] Please see Figure 6 , Figure 6 A schematic diagram illustrating the specific implementation process of another embodiment of step S5000 described above is shown. For example... Figure 6 As shown, step S5000 includes at least the following steps:

[0114] Step S5100: Press the non-woven brush onto the copper-clad laminate after the first rough polishing treatment until the pressure applied by the non-woven brush to the copper-clad laminate reaches the second pressure.

[0115] Understandably, to ensure the effective polishing of the copper-clad laminate by the non-woven brush, it is necessary to press the non-woven brush onto the copper-clad laminate and maintain appropriate pressure. Therefore, a pressure sensor needs to be installed at the second station to accurately obtain the pressure applied by the non-woven brush to the copper-clad laminate, thereby precisely controlling the distance between the non-woven brush and the copper-clad laminate to avoid over-polishing or under-polishing of the copper-clad laminate, which would affect the production yield of the substrate.

[0116] It is understandable that, consistent with step S3100 above, the pressure at the second workstation is acquired in real time via a pressure sensor until the pressure at the second workstation equals the second pressure, i.e., the pressure at the second workstation is 1.4 kg / cm². 2 Then, the nonwoven brush stops pressing down and continues to apply a second pressure to the copper-clad board.

[0117] Step S5200: Polish the surface resin with a non-woven brush, wherein the working current of the non-woven brush is 0.6A, the moving speed of the non-woven brush is 3m / min, and the particle size of the non-woven brush is 800 mesh, to obtain the copper-clad laminate after surface polishing with a non-woven brush.

[0118] Understandably, the second pressure of the non-woven brush is set to 1.4 kg / cm through the abrasion device. 2 The working current of the non-woven brush is set to 0.6A, and the moving speed of the non-woven brush is set to 3m / min. This can effectively control the polishing depth of the non-woven brush and ensure that the polishing depth of each polishing of the copper-clad board is less than 0.5μm, thus avoiding damage to the copper-clad board.

[0119] Understandably, in order to ensure the efficiency and precision of the second rough polishing, the non-woven brush also uses a particle size of 800 mesh to improve the working efficiency of the non-woven brush and effectively ensure that the copper-clad laminate can quickly achieve the effect of the second rough polishing, thereby improving the production yield of the substrate.

[0120] Step S5300: Raise the non-woven brush and flip the copper-clad board after surface polishing with the non-woven brush so that the bottom resin faces the non-woven brush.

[0121] Understandably, after the non-woven brush completes the second rough polishing of the surface resin, and then rises to release the pressure applied to the copper-clad laminate, the second station uses a flipping device to flip the copper-clad laminate so that the resin on the bottom surface faces the non-woven brush, facilitating the brush's polishing of the bottom surface. In practical applications, the flipping device can move and flip the copper-clad laminate using a suction cup or robotic arm structure; this is existing technology and will not be elaborated upon here.

[0122] Step S5400: Press the non-woven fabric brush onto the copper-clad laminate after surface polishing with the non-woven fabric brush until the pressure applied by the non-woven fabric brush to the copper-clad laminate after surface polishing with the non-woven fabric brush reaches the second pressure.

[0123] It is understandable that the process of applying the first pressure to the copper-clad laminate with the non-woven brush before polishing the bottom resin is the same as step S5100 above, and will not be repeated here.

[0124] Step S5500: Polish the bottom resin with a non-woven brush to obtain the copper-clad board after the second rough polishing treatment. The working current of the non-woven brush is 0.6A, the moving speed of the non-woven brush is 3m / min, and the particle size of the non-woven brush is 800 mesh.

[0125] It is understandable that the process of the non-woven brush polishing the bottom resin is the same as step S5200 above. The non-woven brush polishes the bottom resin with the same working current and moving speed, which will not be described again here.

[0126] It is understandable that, consistent with step S3000 above, in order to improve the uniformity of the coarse polishing of the copper clad laminate by the non-woven fabric brush, step S5000 above is repeated during the production process to perform secondary polishing on both sides of the copper clad laminate to ensure the uniformity of the polishing.

[0127] Step S6000: Convey the copper-clad laminate to the third station. The third station is equipped with a second ceramic brush, and the particle size of the second ceramic brush is larger than that of the first ceramic brush.

[0128] Understandably, copper-clad laminates undergo different brushing and polishing steps at different workstations. To improve the operating efficiency of the copper-clad laminates, after the second rough polishing, they need to be transported to the third workstation via conveyor module 850. In practical applications, conveyor module 850 can be a conveyor belt, robotic arm, or other transport device used to quickly transport the copper-clad laminates to the third workstation.

[0129] Step S7000: Polish the upper and lower surfaces of the copper-clad laminate after the second rough grinding process by flipping the plate to obtain a copper-clad laminate with a smooth surface. The polishing process is completed by applying a third pressure to the copper-clad laminate with a second ceramic brush, and the third pressure is greater than the first pressure.

[0130] It is understandable that polishing refers to the finishing process performed on the surface of copper-clad laminate using flexible polishing tools and abrasive particles or other polishing media to remove paint contamination, oxide layers, and shallow scratches, thereby improving the surface finish and quality of the circuit board.

[0131] Understandably, since the particle size of the second ceramic brush is larger than that of the first ceramic brush and the non-woven fabric brush, by setting the third pressure to be greater than the first pressure, the polishing efficiency of the second ceramic brush on the through-hole filling resin can be effectively improved, ensuring the surface flatness of the copper clad laminate and improving the yield of the substrate.

[0132] It is understandable that using a ceramic brush with a larger particle size to grind the surface of the copper-clad laminate can effectively protect the surface of the copper-clad laminate. At the same time, the second ceramic brush polishes the copper-clad laminate, reduces the surface tension of the copper-clad laminate, and thus effectively improves the quality of the subsequent plating of the copper-clad laminate.

[0133] Please see Figure 7 , Figure 7 A schematic diagram illustrating the specific implementation process of another embodiment of step S7000 described above is shown. For example... Figure 6 As shown, step S7000 includes at least the following steps:

[0134] Step S7100: Press the second ceramic brush onto the copper-clad laminate after the second rough polishing treatment until the pressure applied by the second ceramic brush to the copper-clad laminate after the second rough polishing treatment reaches the third pressure, wherein the third pressure is 1.6 kg / cm². 2 .

[0135] Understandably, to ensure the polishing effect of the second ceramic brush on the copper-clad laminate, it is necessary to press the second ceramic brush onto the copper-clad laminate and maintain appropriate pressure. Therefore, a pressure sensor needs to be installed at the third station to accurately obtain the pressure applied by the second ceramic brush to the copper-clad laminate, thereby precisely controlling the distance between the second ceramic brush and the copper-clad laminate to avoid over-polishing or under-polishing of the copper-clad laminate, which would affect the production yield of the substrate.

[0136] It is understandable that, consistent with step S5100 above, the pressure at the third station is acquired in real time via a pressure sensor until the pressure at the third station equals the third pressure, i.e., the pressure at the third station is 1.6 kg / cm². 2 Then, the second ceramic brush stops pressing down and continues to apply a third pressure to the copper-clad board.

[0137] Step S7200: Polish the surface resin with a second ceramic brush to obtain a copper-clad laminate after surface treatment with a second ceramic brush. The working current of the second ceramic brush is 0.6A, the moving speed of the first ceramic brush is 3m / min, and the particle size of the second ceramic brush is 2000 mesh.

[0138] Understandably, setting the operating current of the second ceramic brush to 0.6A and its moving speed to 3m / min effectively controls the second ceramic brush to perform stable polishing operations on the copper-clad laminate, avoiding damage to the laminate. Similarly, in practical applications, after the second ceramic brush completes the polishing of the upper surface of the copper-clad laminate, the laminate is flipped over, and the second ceramic brush continues to polish the lower surface of the laminate.

[0139] Understandably, in order to achieve the polishing effect, the second ceramic brush is made of 2000 mesh, which means that 2000 ceramic brush particles are arranged in each square centimeter area. Finer ceramic brush particles can effectively polish the copper-clad laminate.

[0140] Step S7300: Raise the second ceramic brush and flip the copper-clad laminate after surface treatment using the second ceramic brush so that the bottom resin faces the second ceramic brush.

[0141] Understandably, after the second ceramic brush completes the polishing process on the surface resin, and then rises to release the pressure applied to the copper-clad laminate, the third station uses a flipping device to flip the copper-clad laminate so that the resin on the bottom surface faces the second ceramic brush, facilitating the second ceramic brush to polish the bottom surface of the copper-clad laminate. In practical applications, the flipping device can move and flip the copper-clad laminate using a suction cup or robotic arm structure, which is existing technology and will not be elaborated upon here.

[0142] Step S7400: Press the second ceramic brush onto the copper-clad laminate after surface treatment with the second ceramic brush until the pressure applied by the second ceramic brush to the copper-clad laminate after surface treatment reaches the third pressure, wherein the third pressure is 1.6 kg / cm². 2 .

[0143] It is understandable that the process of applying a third pressure to the copper-clad laminate by the second ceramic brush before polishing the bottom resin is the same as step S7100 above, and will not be repeated here.

[0144] Step S7500: Polish the surface resin with a second ceramic brush to obtain a smooth copper-clad laminate. The working current of the second ceramic brush is 0.6A, the moving speed of the first ceramic brush is 3m / min, and the particle size of the second ceramic brush is 2000 mesh.

[0145] It is understandable that the process of the second ceramic brush polishing the bottom resin is the same as the above step S7200. The second ceramic brush polishes the bottom resin with the same working current and moving speed, which will not be described in detail here.

[0146] Understandably, after polishing the copper-clad laminate (CCL), cleaning is necessary due to the presence of debris and impurities on its surface. Specifically, the CCL is cleaned using a water washing machine to remove debris and impurities remaining from the polishing process; then, it is dried using a drying device to quickly remove moisture. It is understood that cleaning the CCL using water washing and drying equipment is existing technology and will not be elaborated upon here.

[0147] See Figure 8 , Figure 8 This is a schematic diagram of the structure of the substrate brushing and polishing device 800 provided in the embodiments of this application. The entire process of the substrate brushing and polishing method provided in the embodiments of this application involves the following modules in the substrate brushing and polishing device: hole plugging module 810, first polishing module 820, second polishing module 830, polishing module 840 and conveying module 850.

[0148] Among them, the via plugging module 810 is used to plug the through holes on the copper clad laminate to obtain the copper clad laminate after plugging and the via plugging resin. The via plugging resin includes surface resin and bottom resin protruding from the copper clad laminate.

[0149] The first brushing module 820 is used to perform a first rough grinding process on the surface resin and the bottom resin by flipping the plate to obtain the copper-clad board after the first rough grinding process. The first rough grinding is completed by applying a first pressure to the copper-clad board by the first ceramic brush.

[0150] The second brushing module 830 is used to perform a second rough grinding process on the surface resin and bottom resin of the copper-clad laminate after the first rough grinding process by flipping the plate, so as to obtain the copper-clad laminate after the second rough grinding process. The second rough grinding is completed by applying a second pressure to the copper-clad laminate by a non-woven brush.

[0151] The polishing module 840 is used to polish the upper and lower surfaces of the copper-clad laminate after the second rough grinding process by flipping the plate to obtain a copper-clad laminate with a smooth surface. The polishing process is completed by applying a third pressure to the copper-clad laminate with a second ceramic brush, and the third pressure is greater than the first pressure.

[0152] The conveying module 850 is used to convey the copper-clad laminate after hole plugging to the first station; it is also used to convey the copper-clad laminate after the first rough polishing to the second station, which is equipped with a non-woven brush; and it is also used to convey the copper-clad laminate to the third station, which is equipped with a second ceramic brush, the particle size of which is larger than that of the first ceramic brush.

[0153] It should be noted that the information interaction and execution process between the modules of the above-mentioned device are based on the same concept as the method embodiment of this application. For details on their specific functions and technical effects, please refer to the method embodiment section, and they will not be repeated here.

[0154] Figure 9 An electronic device 900 provided in an embodiment of this application is shown. The electronic device 900 includes, but is not limited to:

[0155] Memory 901 is used to store programs;

[0156] The processor 902 is used to execute the program stored in the memory 901. When the processor 902 executes the program stored in the memory 901, the processor 902 is used to perform the above-mentioned substrate brushing method.

[0157] The processor 902 and the memory 901 can be connected via a bus or other means.

[0158] The memory 901, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs, such as the substrate brushing method described in any embodiment of this application. The processor 902 implements the aforementioned substrate brushing method by running the non-transitory software program and instructions stored in the memory 901.

[0159] The memory 901 may include a program storage area and a data storage area. The program storage area may store the operating system and application programs required for at least one function; the data storage area may store the brushing method for executing the aforementioned substrate. Furthermore, the memory 901 may include high-speed random access memory and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, the memory 901 may optionally include memory remotely located relative to the processor 902, and these remote memories can be connected to the processor 902 via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0160] The non-transient software program and instructions required to implement the above-described substrate brushing method are stored in memory 901. When executed by one or more processors 902, the substrate brushing method provided in any embodiment of this application is executed.

[0161] This application embodiment also provides a storage medium storing computer-executable instructions for performing the above-described substrate brushing method.

[0162] In one embodiment, the storage medium stores computer-executable instructions that are executed by one or more control processors 902, such as one processor 902 in the aforementioned electronic device 900, which can cause the one or more processors 902 to perform the substrate brushing method provided in any embodiment of this application.

[0163] The embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0164] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically include computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

Claims

1. A method of brush polishing a substrate, characterized by, The method comprises the following steps: The method comprises the following steps: The method comprises the following steps: The method comprises the following steps: The method comprises the following steps: The method comprises the following steps: The method comprises the following steps: The upper and lower surfaces of the copper-clad plate after the second rough polishing treatment are polished by means of a turning plate, to obtain the copper-clad plate with smooth surfaces, wherein the polishing treatment is completed by the second ceramic brush applying a third pressure to the copper-clad plate, and the third pressure is greater than the first pressure; the through-hole resin is polished by the second ceramic brush, to obtain the copper-clad plate with smooth surfaces; specifically, the second ceramic brush is pressed onto the copper-clad plate after the second rough polishing treatment, until the pressure applied by the second ceramic brush to the copper-clad plate after the second rough polishing treatment reaches the third pressure, wherein the third pressure is 1.6 kg / cm 2 ; the surface resin is polished by the second ceramic brush, to obtain the copper-clad plate after the surface treatment by the second ceramic brush, wherein the working current of the second ceramic brush is 0.6 A, the moving speed of the first ceramic brush is 3 m / min, and the granularity of the second ceramic brush is 2000 meshes; the second ceramic brush is lifted, the copper-clad plate after the surface treatment by the second ceramic brush is turned, so that the bottom resin faces the second ceramic brush; the second ceramic brush is pressed onto the copper-clad plate after the surface treatment by the second ceramic brush, until the pressure applied by the second ceramic brush to the copper-clad plate after the surface treatment by the second ceramic brush reaches the third pressure, wherein the third pressure is 1.6 kg / cm 2 ; the surface resin is polished by the second ceramic brush, to obtain the copper-clad plate with smooth surfaces, wherein the working current of the second ceramic brush is 0.6 A, the moving speed of the first ceramic brush is 3 m / min, and the granularity of the second ceramic brush is 2000 meshes.

2. The method of claim 1, wherein the brush scrubbing is performed by a brush having a plurality of bristles. The method comprises the following steps: The method comprises the following steps: The method comprises the following steps:

3. The method of claim 2, wherein the brush is a brush having a plurality of bristles. The method comprises the following steps: The method comprises the following steps: The doctor applies pressure to the resin in a first direction, wherein the pressure of the doctor is 7 kg / cm 2 The speed of the doctor in the first direction is 45 mm / s, and the angle formed by the doctor and the copper clad board is 15°. The method comprises the following steps:

4. The method of claim 1, wherein the substrate is a glass substrate. The method comprises the following steps: pressing the first ceramic brush onto the copper clad board until a pressure applied by the first ceramic brush onto the copper clad board reaches the first pressure, wherein the first pressure is 1.4 kg / cm 2 ; The method comprises the following steps: The method comprises the following steps: pressing the first ceramic brush onto the copper clad board until a pressure applied by the first ceramic brush onto the copper clad board reaches the first pressure, wherein the first pressure is 1.4 kg / cm 2 ; The method comprises the following steps:

5. The method of claim 4, wherein the brush is a brush having a plurality of bristles. 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The method of claim 4, wherein the brush is a brush having a plurality of bristles. The second rough polishing treatment is performed on the surface resin and the bottom surface resin on the copper-clad plate after the first rough polishing treatment by turning the plate, to obtain a copper-clad plate after the second rough polishing treatment, comprising: The non-woven fabric brush is pressed onto the copper-clad plate after the first rough polishing treatment until the pressure applied by the non-woven fabric brush reaches the second pressure; The non-woven fabric brush is used to polish the surface resin, wherein the working current of the non-woven fabric brush is 0.6 A, the moving speed of the non-woven fabric brush is 3 m / min, and the granularity of the non-woven fabric brush is 800 meshes, to obtain a copper-clad plate after surface polishing by the non-woven fabric brush; The non-woven fabric brush is lifted, and the copper-clad plate after surface polishing by the non-woven fabric brush is turned to make the bottom surface resin face the non-woven fabric brush; The non-woven fabric brush is pressed onto the copper-clad plate after surface polishing by the non-woven fabric brush until the pressure applied by the non-woven fabric brush reaches the second pressure; The non-woven fabric brush is used to polish the bottom surface resin, to obtain a copper-clad plate after the second rough polishing treatment, wherein the working current of the non-woven fabric brush is 0.6 A, the moving speed of the non-woven fabric brush is 3 m / min, and the granularity of the non-woven fabric brush is 800 meshes.

7. A substrate brushing apparatus for implementing the substrate brushing method according to any one of claims 1 to 6, characterized by, Comprising: A hole plugging module is used to plug a through hole on a copper-clad plate, to obtain a plugged copper-clad plate and a plugged resin, wherein the plugged resin includes a surface resin and a bottom surface resin protruding from the surface of the copper-clad plate; A first brush polishing module is used to perform a first rough polishing treatment on the surface resin and the bottom surface resin by turning the plate, to obtain a copper-clad plate after the first rough polishing treatment, wherein the first rough polishing is completed by a first ceramic brush applying a first pressure to the copper-clad plate; A second brush polishing module is used to perform a second rough polishing treatment on the surface resin and the bottom surface resin on the copper-clad plate after the first rough polishing treatment by turning the plate, to obtain a copper-clad plate after the second rough polishing treatment, wherein the second rough polishing is completed by a non-woven fabric brush applying a second pressure to the copper-clad plate; A polishing module is used to polish the upper and lower surfaces of the copper-clad plate after the second rough polishing treatment by turning the plate, to obtain a copper-clad plate with smooth surfaces, wherein the polishing is completed by a second ceramic brush applying a third pressure to the copper-clad plate, and the third pressure is greater than the first pressure; A conveying module is used to convey the plugged copper-clad plate to a first station, to convey the copper-clad plate after the first rough polishing treatment to a second station provided with the non-woven fabric brush, and to convey the copper-clad plate to a third station provided with the second ceramic brush, wherein the granularity of the second ceramic brush is greater than that of the first ceramic brush.

8. An electronic device, comprising: Comprising: The memory, the processor and the computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the method for brushing a substrate according to any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that, The computer program is stored in the memory, and the processor executes the computer program to implement the method for brushing a substrate according to any one of claims 1 to 6.

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