Translation system

Abstract

A translation system is provided, including a scanning translation device and an information presentation device configured to receive data from the scanning translation device in a wireless transmission. The information presentation device includes a display panel. The display panel includes a substrate, a first electrode and a second electrode disposed on the substrate and spaced apart by a bump, a carrier injection layer continuously disposed on the first electrode, the second electrode, and the bump, a carrier transport layer continuously lined on the carrier injection layer and disposed on the carrier injection layer, and a first organic emission layer and a second organic emission layer disposed on the carrier transport layer. On the bump, a thickness of the first organic emission layer gradually decreases along a first direction, and a thickness of the second organic emission layer gradually decreases along a second direction opposite to the first direction. Near a top of the bump, the second organic emission layer covers a portion of the first organic emission layer.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a translation system, in particular, a translation system comprising a scanning translation device and an information presentation device which are separable from each other. BACKGROUND

[0002] Conventional handheld translation devices (e.g., translation pens) adopt a one-piece design, and the translated results are presented by a screen integrated on the translation device. The size of the screen affects the user experience. When the screen size on the translation device is large, although the displayed results are clearer, it increases the difficulty of holding the translation device. On the contrary, when the screen size on the translation device is small, although the holding is better, the small screen causes many limitations on information display. The present disclosure provides a device that can solve the above dilemma. SUMMARY

[0003] A translation system comprises a scanning translation device and an information presentation device configured to receive data from the scanning translation device in a wireless transmission manner. The information presentation device comprises a display panel. The display panel comprises a substrate, a first electrode and a second electrode disposed on the substrate and spaced apart via a bump, a carrier injection layer disposed on and continuously on the first electrode, the second electrode, and the bump, a carrier transport layer disposed on and continuously lining the carrier injection layer, and a first organic emission layer and a second organic emission layer disposed on the carrier transport layer. On the bump, the thickness of the first organic emission layer gradually decreases along a first direction, and the thickness of the second organic emission layer gradually decreases along a second direction opposite to the first direction. Near the top of the bump, the second organic emission layer covers a portion of the first organic emission layer.

[0004] In some embodiments, the scanning translation device further comprises a collection device configured to sense two-dimensional features or three-dimensional features within a target area.

[0005] In some embodiments, the scanning translation device further comprises a processing device configured to translate the two-dimensional features or the three-dimensional features sensed by the collection device; and a communication interface configured to send the translation results generated by the processing device to the information presentation device.

[0006] In some embodiments, the display panel further comprises a first organic carrier transport layer disposed on the first organic emission layer; and a second organic carrier transport layer disposed on the second organic emission layer. Wherein on the bump, the thickness of the first organic carrier transport layer gradually decreases along the first direction, and the thickness of the second organic carrier transport layer gradually decreases along the second direction.

[0007] In some implementations, near the top of the bump, the first organic carrier transport layer extends under the second organic carrier transport layer.

[0008] In some implementations, the first organic emissive layer and the second organic emissive layer are configured to emit different colors of light.

[0009] In some implementations, the information presenting device further comprises a lens module configured to project information displayed on the display panel onto a display area located outside the information presenting device.

[0010] In some implementations, the information presenting device further comprises a lens module configured to project information displayed on the display panel onto a display area located inside the information presenting device.

[0011] In some implementations, the scanning translating device comprises a first coupling component and the information presenting device comprises a second coupling component, wherein the scanning translating device and the information presenting device are detachably coupled via the first coupling component and the second coupling component.

[0012] In some implementations, wherein the processing device is configured to translate the sensed two-dimensional feature or the three-dimensional feature from a first language to a second different language.

[0013] A translating system comprises an information presenting device and a scanning translating device configured to wirelessly transmit data to the information presenting device. The information presenting device comprises a display panel and a lens module configured to project information displayed on the display panel onto a display area. The display panel comprises a substrate, a bump disposed on the substrate between a first electrode and a second electrode, and a first organic emissive layer and a second organic emissive layer disposed over the bump. The first organic emissive layer and the second organic emissive layer are configured to emit different colors of light. On the bump, a thickness of the first organic emissive layer gradually decreases along a first direction, and a thickness of the second organic emissive layer gradually decreases along a second direction opposite to the first direction.

[0014] In some implementations, near the top of the bump, the second organic emissive layer covers a portion of the first organic emissive layer.

[0015] In some embodiments, the display panel further comprises: a first organic carrier transport layer disposed on the first organic emissive layer; and a second organic carrier transport layer disposed on the second organic emissive layer. Wherein near the top of the bump, the first organic carrier transport layer extends underneath the second organic carrier transport layer.

[0016] In some embodiments, on the bump, the thickness of the first organic carrier transport layer gradually decreases along the first direction, and the thickness of the second organic carrier transport layer gradually decreases along the second direction.

[0017] In some embodiments, wherein the scanning and translating device comprises a first coupling component and the information presenting device comprises a second coupling component, and wherein the scanning and translating device and the information presenting device are detachably coupled via the first coupling component and the second coupling component.

[0018] In some embodiments, the scanning and translating device further comprises: a collecting device configured to sense two-dimensional features or three-dimensional features within a target area; a processing device configured to translate the two-dimensional features or the three-dimensional features sensed by the collecting device; and a communication interface configured to send the translation results generated by the processing device to the information presenting device.

[0019] In some embodiments, wherein the display area is located outside the information presenting device.

[0020] In some embodiments, wherein the display area is located inside the information presenting device. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1A A schematic diagram of a scanning and translating device according to some embodiments.

[0022] Figure 1B A schematic diagram of an information presenting device according to some embodiments.

[0023] Figure 1C A schematic diagram of a translating system according to some embodiments.

[0024] Figure 2 A schematic diagram of a use of a translating system according to some embodiments.

[0025] Figure 3 A schematic diagram of a use of a translating system according to some embodiments.

[0026] Figure 4 A schematic diagram of a lens module and a display panel according to some embodiments.

[0027] Figure 5 FIG. 1 is a schematic view of a lens module and a display panel according to some embodiments.

[0028] Figure 6A FIG. 2 is a schematic view of a cross-section of a portion of a display panel according to some embodiments.

[0029] Figure 6B FIG. 3 is a schematic view of an enlarged cross-section of a portion of a display panel according to some embodiments.

[0030] Figures 7A to 7L FIG. 4 is a schematic view of a display panel at different manufacturing stages according to some embodiments of the present disclosure.

[0031] BRIEF DESCRIPTION OF DRAWINGS

[0032] 10 scanning translation device

[0033] 20 information presentation device

[0034] 30 target area

[0035] 40 display area

[0036] 102 acquisition device

[0037] 202 lens module

[0038] 302 feature

[0039] 402 translation result DETAILED DESCRIPTION

[0040] The following disclosure provides many different embodiments, or examples, for implementing different features of the application. Specific examples of components and configurations are described below to provide a thorough description of embodiments of the application. Of course, it is contemplated that the application can be practiced without such specific details. In other instances, well-known structures and functions have not been described in detail so as not to obscure the application. This application can be implemented by utilizing various computer hardware and software. It should be noted that the application can be implemented on a variety of different platforms and devices. For example, the application can be implemented on a personal computer, a laptop computer, a handheld computer, a personal digital assistant, a cellular telephone, a smart phone, a smart watch, a tablet computer, a server, a computer system, or any other device. In addition, the application can be implemented on a variety of different operating systems. For example, the application can be implemented on a Windows operating system, a Macintosh operating system, a UNIX operating system, a LINUX operating system, a UNIX-like operating system, or another operating system. In addition, the application can be implemented on a variety of different computer languages. For example, the application can be implemented on a C computer language, a C++ computer language, a Java computer language, a Visual Basic computer language, a Python computer language, a Ruby computer language, a Perl computer language, or another computer language. In addition, the application can be implemented on a variety of different computer architectures. For example, the application can be implemented on a single computer, a distributed computer, a client-server computer, a peer-to-peer computer, or another computer architecture. In addition, the application can be implemented on a variety of different computer networks. For example, the application can be implemented on a local computer network, a wide-area computer network, a global computer network (e.g., the Internet), or another computer network. In addition, the application can be implemented on a variety of different computer systems. For example, the application can be implemented on a mainframe computer system, a minicomputer system, a server computer system, a client computer system, a personal computer system, a workstation, a laptop computer system, a handheld computer system, a personal digital assistant, a cellular telephone, a smart phone, a smart watch, a tablet computer, or another computer system. In addition, the application can be implemented on a variety of different computer environments. For example, the application can be implemented on a single-processor computer environment, a multi-processor computer environment, a multiprocessor computer system, a computer system including virtual

[0041] Moreover, the use of spatially relative terms, such as "beneath", "below", "lower", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0042] Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Moreover, as used herein, "about" is intended to encompass a value ±10%, ±5%, ±1%, or ±0.5% of a given value or range. Alternatively, the phrase "about" is intended to encompass within the acceptable standard error of the mean in the art. Unless otherwise indicated, all numbers expressing quantities of materials, time periods, temperatures, and so forth as used in the specification and claims are to be understood as being modified in all instances by the term "about". Accordingly, unless otherwise indicated, the numerical parameters are approximations. At the very least, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges can be expressed as from one endpoint to another, or between two endpoints. Unless otherwise indicated, all ranges disclosed herein are inclusive of the endpoints.

[0043] Figure 1A FIG. 1 is a schematic diagram of a scanning translation device 10 according to some embodiments.

[0044] The scanning translation device 10 includes an acquisition device 102, a power device 106, a memory 107, a processing device 108, and a communication interface 110. The scanning translation device 10 also includes a combination assembly 112. The acquisition device 102 can include a sensor 102a, a light source 102b, and a light source control assembly 102c.

[0045] Although Figure 1AThe collection device 102, the power supply device 106, the memory 107, the processing device 108, and the communication interface 110 can be electrically connected to each other. Data, signals, instructions, voltages, currents, and the like can be transmitted between the collection device 102, the power supply device 106, the memory 107, the processing device 108, and the communication interface 110. In some embodiments, the processing device 108 can control the sensor 102a, the light source 102b, and the light source control component 102c. In some embodiments, the processing device 108 can control the communication interface 110. The power supply device 106 can provide power required for the operation of the collection device 102, the memory 107, the processing device 108, and the communication interface 110.

[0046] In some embodiments, the sensor 102a can be an image sensor configured to sense two-dimensional features such as images, characters, patterns, and the like. In some embodiments, the sensor 102a can be an acoustic sensor configured to sense three-dimensional features. For example, Braille, which is designed for the blind, is a three-dimensional feature. In some embodiments, the sensor 102a can include at least one image sensor and at least one acoustic sensor to sense both two-dimensional features and three-dimensional features.

[0047] The light source 102b can be used to illuminate the two-dimensional features or the three-dimensional features to be collected. In some embodiments, the light source 102b can include, but is not limited to, a light-emitting diode (LED), a tungsten filament bulb, and an ultraviolet bulb. The light source control component 102c can adjust the illumination range of the light source 102b. In some embodiments, the light source control component 102c can adjust the illumination intensity of the light source 102b. With the combination of the light source 102b and the light source control component 102c, the sensor 102a can better sense or collect the two-dimensional features or the three-dimensional features of the target area. The two-dimensional features or the three-dimensional features sensed or collected by the sensor 102a can be stored in the memory 107.

[0048] The two-dimensional features or the three-dimensional features collected by the collection device 102 can be translated by the processing device 108. In some embodiments, the processing device 108 can translate the collected two-dimensional features or the three-dimensional features from a first language to a second different language. For example, the processing device 108 can translate the collected English words into Chinese. In other embodiments, the processing device 108 can translate the collected two-dimensional features or the three-dimensional features from geometric figures or geometric structures into a specific language. For example, the processing device 108 can translate the collected three-dimensional features from (e.g., Braille) into Chinese.

[0049] In other embodiments, the processing device 108 can convert the acquired two-dimensional or three-dimensional features into specific text or speech output based on the mapping table stored in the memory 107. In other embodiments, the processing device 108 can convert the acquired two-dimensional or three-dimensional features into specific text or speech output based on the database stored in the memory 107. For example, the mapping table or database in the memory 107 may contain dozens of nursery rhymes or teaching content. When the acquisition device 102 acquires specific two-dimensional or three-dimensional features, the processing device 108 can select the corresponding nursery rhyme or teaching content from the memory 107 and output it.

[0050] In some embodiments, the processing device 108 can send the translated result to another device via the communication interface 110 (e.g., Figure 1B The information presentation device 20). In some embodiments, the communication interface 110 may be a wireless communication interface, including but not limited to Bluetooth, Wi-Fi, ZigBee, UWB, NFC, WiMAX, RFID, GPRS, Huawei Hilink protocol, Mesh, Thread, Z-Wave, LiFi, etc. In some embodiments, the communication interface 110 may include a wired communication interface, including but not limited to RS-232, RS-485, Universal Interface Bus (GPIB), High Definition Multimedia Interface (HDMI), Universal Serial Bus (USB), optical fiber, etc. In some embodiments, the scanning and translation device 10 may receive update data via the communication interface 110 to update the database in the memory 107.

[0051] Figure 1B This is a schematic diagram of an information presentation device according to certain embodiments. The information presentation device 20 includes a lens module 202, a display panel 204, a speaker 205, a power supply 206, a processing device 208, and a communication interface 210. The information presentation device 20 further includes a bonding component 212.

[0052] Although Figure 1BThe lens module 202, the display panel 204, the speaker 205, the power supply device 206, the processing device 208, and the communication interface 210 can have electrical connections to each other. Data, signals, instructions, voltages, currents, and the like can be transmitted between the lens module 202, the display panel 204, the speaker 205, the power supply device 206, the processing device 208, and the communication interface 210. In some embodiments, the processing device 208 can control the lens module 202, the display panel 204, the speaker 205, and the communication interface 210. The power supply device 206 can provide power required for the lens module 202, the display panel 204, the speaker 205, the processing device 208, and the communication interface 210 to operate.

[0053] The display panel 204 can have a plurality of pixel units. In some embodiments, the display panel 204 can have a plurality of self-emitting pixel units. A display panel 204 with high pixel density is provided in the present disclosure, and the manufacturing method thereof will be described in subsequent paragraphs. Information displayed on the display panel 204 can be projected via the lens module 202. Figures 7A to 7L

[0054] The speaker 205 can play audio signals or voice signals.

[0055] The information presentation device 20 can receive data or instructions from the scanning and translating device 10. The information presentation device 20 can be configured to receive data or instructions from the scanning and translating device 10 in a wireless transmission manner. The information presentation device 20 can receive data or instructions from the communication interface 110 of the scanning and translating device 10 via the communication interface 210. In some embodiments, the information presentation device 20 can receive the translated results from the communication interface 110 of the scanning and translating device 10 via the communication interface 210. The processing device 208 can control the communication interface 210 to receive the translated results, and control the display panel 204 and the lens module 202 to project the translated results. In some embodiments, the processing device 208 can control the communication interface 210 to receive the translated results, and control the speaker 205 to play the translated results in audio signals or voice signals.

[0056] ​In some embodiments, the communication interface 210 may be a wireless communication interface, including but not limited to Bluetooth, Wi-Fi, ZigBee, UWB, NFC, WiMAX, RFID, GPRS, Huawei Hilink protocol, Mesh, Thread, Z-Wave, LiFi, etc. In some embodiments, the communication interface 210 may include a wired communication interface, including but not limited to RS-232, RS-485, Universal Interface Bus (GPIB), High Definition Multimedia Interface (HDMI), Universal Serial Bus (USB), fiber optic, etc.

[0057] The information presentation device 20 can be combined with the scanning and translation device 10. The information presentation device 20 can also be separated from the scanning and translation device 10. In this disclosure, the information presentation device 20 can also be referred to as a detachable information presentation device or a remote information presentation device.

[0058] The information presentation device 20 can be coupled to the scanning translation device 10 via coupling components 112 and 212. The information presentation device 20 can be detached from the scanning translation device 10. The information presentation device 20 and the scanning translation device 10 can be detachably coupled via coupling components 112 and 212. In some embodiments, coupling components 112 and 212 can have mutually matching physical structures. For example, coupling components 112 and 212 can have snap-fit ​​or latch structures. In other embodiments, coupling components 112 and 212 can be magnets that attract each other. In other embodiments, coupling component 112 can be a housing structure to partially house and hold the information presentation device 20. In other embodiments, coupling component 212 can be a housing structure to partially house and hold the scanning translation device 10.

[0059] Figure 1C This is a schematic diagram of a translation system according to certain implementations. Figure 1C The displayed translation system includes a scanning translation device and an information presentation device. For example... Figure 1C As shown, the information presentation device 20 can be integrated with the scanning and translation device 10 to form a single unit. The scanning and translation device 10 and the information presentation device 20 can be collectively referred to as a translation system. The integration of the information presentation device 20 and the scanning and translation device 10 facilitates storage and portability. Although Figure 1C The scanning translation device 10 and the information presentation device 20 are combined with each other in a vertical manner. In other embodiments, the scanning translation device 10 and the information presentation device 20 can be combined with each other in a horizontal manner. That is, the combination component 112 and the combination component 212 can be disposed on the side of the scanning translation device 10 and the information presentation device 20.

[0060] Figure 2 A schematic diagram of a usage of a translation system according to some embodiments. Figure 2 A schematic diagram of a usage of a scanning translation device and an information presentation device is shown.

[0061] The scanning translation device 10 can acquire features 302 on the target area 30 via the acquisition device 102. The features 302 can be two-dimensional features or three-dimensional features. In some embodiments, the features 302 can be text, images, geometric shapes, Braille, code words, or any other forms of features to be recognized. The scanning translation device 10 can send the results of the translation of the features 302 to the information presentation device 20. In some embodiments, the scanning translation device 10 can send the results of the translation to the information presentation device 20 via wireless means. In other embodiments, the scanning translation device 10 can send the results of the translation to the information presentation device 20 via wired means. The information presentation device 20 can present the results of the translation 402 on the display area 40. In this embodiment, the information presentation device 20 can project the results of the translation 402 onto the display area 40 via projection. In this embodiment, the display area 40 is an area external to the scanning translation device 10 and the information presentation device 20. In this embodiment, the information presentation device 20 can be a pico projector.

[0062] Figure 3 A schematic diagram of a usage of a translation system according to some embodiments. Figure 3 A schematic diagram of a usage of a scanning translation device and an information presentation device is shown. The scanning translation device 10 and the information presentation device 20 can be collectively referred to as a translation system.

[0063] The scanning translation device 10 can acquire features 302 on the target area 30 via the acquisition device 102. The features 302 can be two-dimensional features or three-dimensional features. In some embodiments, the features 302 can be text, images, geometric shapes, Braille, code words, or any other forms of features to be recognized. The scanning translation device 10 can send the results of the translation of the features 302 to the information presentation device 20. In some embodiments, the scanning translation device 10 can send the results of the translation to the information presentation device 20 via wireless means. In other embodiments, the scanning translation device 10 can send the results of the translation to the information presentation device 20 via wired means.

[0064] The information presentation device 20 can display the translation results on the display area 40. In this embodiment, the display area 40 is located inside the lens module 202, or the display area 40 is part of the lens module 202. In this embodiment, the display area 40 is an area located inside the information presentation device 20. In this embodiment, the information presentation device 20 can be a virtual reality (VR) headset.

[0065] Figure 4 This is a schematic diagram of a lens module and a display panel according to certain embodiments. The lens module 202 may include lenses 202a and 202b. Although Figure 4 Two lenses are shown, but according to practical design, the lens module 202 can contain any number of lenses greater than one. The display panel 204 can contain a plurality of pixels 204p. These pixels 204p can be self-emissive pixels. These pixels 204p can emit light in the visible light range, including red (e.g., wavelengths between 620nm and 780nm), green (e.g., wavelengths between 500nm and 580nm), and blue (e.g., wavelengths between 400nm and 500nm). The information presented by the display panel 204 can be projected onto the display area 40 via the lens module 202. In this embodiment, the display area 40 is an area located outside the scanning translation device 10 and the information display device 20.

[0066] Figure 5 This is a schematic diagram of a lens module and a display panel according to certain embodiments. The lens module 202 may include lenses 202a and 202b. Although Figure 4 Two lenses are shown, but according to practical design, the lens module 202 can include any number of lenses greater than one. The display panel 204 can include a plurality of pixels 204p. These pixels 204p can be self-emissive pixels. These pixels 204p can emit light in the red, green, and blue visible light range. The information presented on the display panel 204 can be projected onto the display area 40 via the lens module 202. In this embodiment, the display area 40 is located on a component inside the information presentation device 20. In some embodiments, the display area 40 can be located on a waveguide. In some embodiments, the display area 40 can be on a waveguide. The user 50 can observe the information presented on the display area 40 at close range.

[0067] Figure 6A This is a schematic cross-sectional view of a portion of a display panel according to certain embodiments.

[0068] The display panel 204 can include a substrate 204a and a plurality of first electrodes 204b disposed on the substrate 204a. The plurality of first electrodes 204b are disposed with a plurality of bumps 204c therebetween. A carrier injection layer 204L1 is continuously disposed on the first electrodes 204b and the bumps 204c. The carrier injection layer 204L1 covers the first electrodes 204b and the bumps 204c.

[0069] A carrier transport layer 204L2 (or first type carrier transport layer) is disposed on the bumps 204c and the first electrodes 204b. The carrier transport layer 204L2 is disposed on the carrier injection layer 204L1. The carrier transport layer 204L2 is continuously lined along the carrier injection layer 204L1.

[0070] An organic emissive (EM) layer 204L3 is disposed above the first electrodes 204b, extending and partially covering the carrier transport layer 204L2. In the top view, the organic emissive layer 204L3 completely covers the first electrodes 204b and partially covers the bumps 204c. An organic carrier transport layer 204L4 (or second type carrier transport layer) is disposed on the organic emissive layer 204L3. In the top view, the organic carrier transport layer 204L4 completely covers the first electrodes 204b and partially covers the bumps 204c. A second electrode 204d is disposed on the organic carrier transport layer 204L4. In the top view, the second electrode 204d completely covers the first electrodes 204b and partially covers the bumps 204c.

[0071] The bumps 204c are also referred to as pixel defined layer (PDL). Two adjacent bumps 204c define a pixel. For example, a pixel 204pl is defined between the dashed line A-A' and the dashed line B-B'. Another pixel 204p2 is defined between the dashed line B-B' and the dashed line C-C'.

[0072] Two adjacent pixels, due to the process employed by the present disclosure, will see partial overlap of the organic emissive layer 204L3, the organic carrier transport layer 204L4, and the second electrode 204d at the top of the bumps 204c (e.g., where the dashed line B-B' intersects the bumps 204c). The details of the top of the bumps 204c (i.e., the dashed box D) will be discussed in subsequent paragraphs.

[0073] Figure 6B A cross-sectional view of a portion of a display panel is shown in accordance with some embodiments. Figure 6B A cross-sectional view of a portion of a display panel is shown in accordance with some embodiments. Figure 6AThe structure within the middle dotted box D. The bump 204c has an uneven surface s1. The carrier injection layer 204L1 is disposed conformally along the uneven surface s1 and has an uneven surface s2. The carrier transport layer 204L2 is disposed conformally along the uneven surface s2 and has an uneven surface s3. In the present disclosure, the uneven surface can include a non-horizontal surface or a non-smooth surface.

[0074] In Figure 6B , the organic emission layer 204L3, the organic carrier transport layer 204L4, and the second electrode 204d on the left correspond to the pixel 204p1 in Figure 6A ; while the organic emission layer 204L3', the organic carrier transport layer 204L4', and the second electrode 204d' on the right correspond to the pixel 204p2 in Figure 6A .

[0075] The thickness W1 of the organic emission layer 204L3 changes in a gradient along the positive direction of the X-axis (the first direction). The thickness W2 of the organic carrier transport layer 204L4 changes in a gradient along the positive direction of the X-axis (the first direction). The thickness W3 of the second electrode 204d changes in a gradient along the positive direction of the X-axis (the first direction). The thickness W1 of the organic emission layer 204L3 gradually decreases along the positive direction of the X-axis (the first direction). The thickness W2 of the organic carrier transport layer 204L4 gradually decreases along the positive direction of the X-axis (the first direction). The thickness W3 of the second electrode 204d gradually decreases along the positive direction of the X-axis (the first direction).

[0076] The thickness W4 of the organic emission layer 204L3' changes in a gradient along the negative direction of the X-axis (the second direction). The thickness W5 of the organic carrier transport layer 204L4' changes in a gradient along the negative direction of the X-axis (the second direction). The thickness W6 of the second electrode 204d' changes in a gradient along the negative direction of the X-axis (the second direction). The thickness W4 of the organic emission layer 204L3' gradually decreases along the negative direction of the X-axis (the second direction). The thickness W5 of the organic carrier transport layer 204L4' gradually decreases along the negative direction of the X-axis (the second direction). The thickness W6 of the second electrode 204d' gradually decreases along the negative direction of the X-axis (the second direction).

[0077] The gradient change direction of the thickness W1 of the organic emission layer 204L3 is opposite to that of the thickness W4 of the organic emission layer 204L3'. The gradient change direction of the thickness W2 of the organic carrier transport layer 204L4 is opposite to that of the thickness W5 of the organic carrier transport layer 204L4'. The gradient change direction of the thickness W3 of the second electrode 204d is opposite to that of the thickness W6 of the second electrode 204d'.

[0078] Referring to Figure 6B Near the highest point (top) of the bump 204c, the organic emissive layer 204L3, the organic carrier transport layer 204L4, and the second electrode 204d each has a portion covered by the organic emissive layer 204L3'. The organic emissive layer 204L3, the organic carrier transport layer 204L4, and the second electrode 204d each has a portion extending under the organic emissive layer 204L3'. The organic emissive layer 204L3, the organic carrier transport layer 204L4, and the second electrode 204d each has a portion extending under the organic carrier transport layer 204L4' and the second electrode 204d'.

[0079] It is noted that the second electrode 204d and the second electrode 204d' do not contact each other. The second electrode 204d and the second electrode 204d' are separated from each other by the organic emissive layer 204L3' and the organic carrier transport layer 204L4'.

[0080] Figures 7A to 7L A schematic diagram of a display panel at different manufacturing stages of a method according to some embodiments of the present disclosure.

[0081] In Figure 7A In some embodiments, the substrate 204a includes a base material (not shown), a dielectric layer (not shown), and one or more circuits (not shown) disposed on or in the base material. In some embodiments, the base material is a transparent base material, or at least a portion thereof is transparent. In some embodiments, the base material is a non-flexible base material, and the material of the base material can include glass, quartz, low temperature poly-silicon (LTPS), or other suitable materials. In some embodiments, the base material is a flexible base material, and the material of the base material can include transparent epoxy, polyimide, polyvinyl chloride, polymethyl methacrylate, or other suitable materials. The dielectric layer can be disposed on the base material as needed. In some embodiments, the dielectric layer can include silicon oxide, silicon nitride, silicon oxynitride, or other suitable materials.

[0082] In some embodiments, the circuit may include a complementary metal-oxide-semiconductor (CMOS) circuit, or a plurality of transistors and capacitors adjacent to the transistors, wherein the transistors and capacitors are formed on a dielectric layer. In some embodiments, the transistors are thin-film transistors (TFTs). Each transistor includes a source / drain region (including at least one source region and one drain region), a channel region between the source / drain regions, a gate electrode disposed above the channel region, and a gate insulator between the channel region and the gate electrode. The channel region of the transistor may be made of a semiconductor material, such as silicon or other elements selected from Group IV, Group III, and Group V.

[0083] A plurality of first electrodes 204b are disposed on a substrate 204a. Each first electrode 204b is configured such that one side is connected to a circuit (not shown) embedded in the substrate 204a, and the other side is in contact with a light-emitting material. The array pattern of the first electrodes 204b is designed with regard to the arrangement of pixels. A photosensitive layer 204c' is disposed on the first electrodes 204b and the substrate 204a. In some embodiments, the photosensitive layer 204c' is coated on the first electrodes 204b and the substrate 204a.

[0084] A photosensitive layer 204c' is filled into the gap between adjacent first electrodes 204b. The photosensitive layer 204c' is heated to a predetermined temperature and then exposed to a specified wavelength. The photosensitive layer 204c' absorbs more than 90% of visible light and is also referred to as a blackbody material in this disclosure. After exposure, the photosensitive layer 204c' is wetted in a solution for development.

[0085] like Figure 7B As shown, a portion of the photosensitive layer 204c' is removed, leaving a portion that substantially covers the gap between adjacent first electrodes 204b. In this cross-sectional view, the remaining photosensitive layer 204c' forms a plurality of bumps 204c, each bump 204c filling the gap between adjacent first electrodes 204b. The bumps 204c partially cover each first electrode 204b. The patterned bumps 204c are also called a pixel defined layer (PDL).

[0086] The bump 204c can be formed into different shapes. Figure 7BIn this embodiment, bump 204c has a curved surface. In some embodiments, bump 204c is trapezoidal in shape. After bump 204c is formed, a cleaning operation is performed to clean the exposed surfaces of bump 204c and the first electrode 204b. In one embodiment, during the cleaning operation, deionized water is heated to a temperature between 30°C and 80°C. After the temperature of the deionized water rises to a predetermined temperature, the deionized water is directed to the exposed surfaces of bump 204c and the first electrode 204b.

[0087] In some embodiments, ultrasonic waves are used during the cleaning operation. The ultrasonic waves are introduced into a cleaning agent (e.g., water or isopropyl alcohol (IPA)). In some embodiments, carbon dioxide is introduced into the cleaning agent. After the cleaning operation, the cleaning agent is removed from the exposed surfaces via a heating operation. During the heating operation, the substrate 204a and bump 204c can be heated to a temperature between 80°C and 110°C. In some examples, compressed air is directed to the exposed surfaces to help remove cleaning agent residues while heating is being performed.

[0088] Following the heating process, the exposed surface can be treated with O2, N2, or Ar plasma. The plasma is used to roughen the exposed surface. In some embodiments, ozone is used to condition the surface of the exposed surface.

[0089] like Figure 7C As shown, a carrier injection layer 204L1 is disposed on the exposed surfaces of the bumps 204c and the first electrode 204b. The carrier injection layer 204L1 is continuously lining along the exposed surfaces. More specifically, the exposed surfaces of each first electrode 204b are configured as the effective light-emitting area of ​​a light-emitting unit (i.e., a pixel). In this embodiment, all light-emitting units use a common carrier injection layer 204L1. In some embodiments, the carrier injection layer 204L1 is used for hole injection. In some embodiments, the carrier injection layer 204L1 is used for electron injection. The carrier injection layer 204L1 continuously covers the plurality of PDL bumps 204c and the first electrode 204b. Optionally, the carrier injection layer 204L1 is in contact with the PDL bumps 204c. In one embodiment, the carrier injection layer 204L1 is in contact with the first electrode 204b. In some embodiments, the carrier injection layer 204L1 is organic.

[0090] like Figure 7DAs shown, a carrier transport layer 204L2 (or a first-type carrier transport layer) is disposed on the exposed surfaces of the bumps 204c and the first electrode 204b. A carrier injection layer 204L1 is disposed beneath the carrier transport layer 204L2. The carrier transport layer 204L2 is continuously lined along the carrier injection layer 204L1. In this embodiment, all light-emitting units use a common carrier transport layer 204L2. In some embodiments, the carrier transport layer 204L2 is used for hole injection. In some embodiments, the carrier transport layer 204L2 is used for electron injection. The carrier transport layer 204L2 continuously covers the plurality of PDL bumps 204c and the first electrode 204b. Optionally, the carrier transport layer 204L2 is in contact with the carrier injection layer 204L1. In some embodiments, the carrier transport layer 204L2 is organic.

[0091] like Figure 7E As shown, a buffer layer 204t is disposed on the PDL bump 204c and also covers the carrier injection layer 204L1 and the carrier transport layer 204L2. The buffer layer 204t serves to prevent moisture from penetrating into the PDL bump 204c, the carrier injection layer 204L1, and the carrier transport layer 204L2. In one embodiment, the buffer layer 204t is applied via spin coating. The buffer layer 204t may be further heated to a temperature T1. In some embodiments, T1 is approximately 5°C to 10°C, below the glass transition temperature of the carrier injection layer 204L1 and the carrier transport layer 204L2. This heating operation lasts approximately 1 to 10 minutes. In some embodiments, the buffer layer 204t comprises fluorine.

[0092] exist Figure 7F In the process, after the heating operation, a photosensitive layer 204s is formed on the buffer layer 204t. The photosensitive layer 204s can be further patterned using a photolithography process so that a portion of the buffer layer 204t is exposed through the groove 214. Figure 7G In this process, a portion of the buffer layer 204t is removed to create a groove 215, thereby exposing the carrier transport layer 204L2. In some embodiments, this is performed via wet etching. Figure 7G The removal operation.

[0093] In some embodiments, the removal operation includes at least two steps. The first step is vertical removal, generally according to groove 214 (see...). Figure 7F The size of the opening width is used to cut off the buffer layer by 204t, such as Figure 7G As shown. After forming groove 215, a second step is performed to execute lateral removal, as... Figure 7H As shown. A groove 216 is formed, allowing the groove 215 to extend further into the buffer layer 204t, exposing more surface towards the highest point of the PDL bump 204c.

[0094] An organic emissive (EM) layer 204L3 is disposed in the recess 215 and covers the carrier transport layer 204L2 and the photosensitive layer 204s. In some embodiments, the organic emissive layer 204L3 is disposed on the carrier transport layer 204L2. In some embodiments, the organic emissive layer 204L3 is disposed on the photosensitive layer 204s. Figure 7I In some embodiments, the organic emissive layer 204L3 completely covers the exposed carrier transport layer 204L2. The organic emissive layer 204L3 is configured to emit a first color.

[0095] As shown in FIG. 2B, an organic carrier transport layer 204L4 (or second type carrier transport layer) is disposed on the organic emissive layer 204L3. The organic carrier transport layer 204L4 can be a hole or electron transport layer 204L4. In some embodiments, the organic carrier transport layer 204L4 and the carrier transport layer 204L2 are each configured to be of opposite valence states. Figure 7J In some embodiments, a second electrode 204d is disposed on the organic carrier transport layer 204L4. The top surface of the photosensitive layer 204s is also covered by the second electrode 204d. After the second electrode 204d is formed, the photosensitive layer 204s can be removed. The organic emissive layer 204L3, the organic carrier transport layer 204L4, and the second electrode 204d on the photosensitive layer 204s are also removed. The second electrode 204d can be a metallic material, such as Ag, Mg, etc. In some embodiments, the second electrode 204d includes ITO (indium tin oxide) or IZO (indium zinc oxide). In some embodiments, each light emitting unit (i.e., pixel) has an independent second electrode 204d, and multiple light emitting units share a common organic carrier transport layer 204L4, as viewed from a cross-sectional view.

[0096] Figure 7K The operations shown in FIG. 2B can be repeated to form light emitting units of different colors.

[0097] The operations shown in FIG. 2B can be repeated to form light emitting units of different colors. Figures 7A-7K

[0098] FIG. 2C shows a schematic diagram of further fabricating an adjacent pixel 204p2 after the pixel 204pl is fabricated. In some embodiments, the organic emissive layer 204L3' is configured to emit a different color of light than the organic emissive layer 204L3. In some embodiments, the organic emissive layer 204L3' has a different material than the organic emissive layer 204L3. Figure 7L It is noted that the recess 215' is formed by patterning the photosensitive layer 204s through a lithography process in the present disclosure. As semiconductor fabrication technology continues to evolve, such as extreme ultraviolet lithography (EUV) technology, the minimum width of the patterned recess that can be formed by the lithography process has already been below 6 nanometers. Therefore, using the lithography process to fabricate the display panel 204 can have the advantage of high resolution. The display panel 204 produced by the fabrication process of the present disclosure can achieve a pixel density of 800 ppi or higher.

[0099] It is noted that the recess 215' is formed by patterning the photosensitive layer 204s through a lithography process in the present disclosure. As semiconductor fabrication technology continues to evolve, such as extreme ultraviolet lithography (EUV) technology, the minimum width of the patterned recess that can be formed by the lithography process has already been below 6 nanometers. Therefore, using the lithography process to fabricate the display panel 204 can have the advantage of high resolution. The display panel 204 produced by the fabrication process of the present disclosure can achieve a pixel density of 800 ppi or higher. It is noted that the recess 215' is formed by patterning the photosensitive layer 204s through a lithography process in the present disclosure. As semiconductor fabrication technology continues to evolve, such as extreme ultraviolet lithography (EUV) technology, the minimum width of the patterned recess that can be formed by the lithography process has already been below 6 nanometers. Therefore, using the lithography process to fabricate the display panel 204 can have the advantage of high resolution. The display panel 204 produced by the fabrication process of the present disclosure can achieve a pixel density of 800 ppi or higher. It is noted that the recess 215' is formed by patterning the photosensitive layer 204s through a lithography process in the present disclosure. As semiconductor fabrication technology continues to evolve, such as extreme ultraviolet lithography (EUV) technology, the minimum width of the patterned recess that can be formed by the lithography process has already been below 6 nanometers. Therefore, using the lithography process to fabricate the display panel 204 can have the advantage of high resolution. The display panel 204 produced by the fabrication process of the present disclosure can achieve a pixel density of 800 ppi or higher. It is noted that the recess 215' is formed by patterning the photosensitive layer 204s through a lithography process in the present disclosure. As semiconductor fabrication technology continues to evolve, such as extreme ultraviolet lithography (EUV) technology, the minimum width of the patterned recess that can be formed by the lithography process has already been below 6 nanometers. Therefore, using the lithography process to fabricate the display panel 204 can have the advantage of high resolution. The display panel 204 produced by the fabrication process of the present disclosure can achieve a pixel density of 800 ppi or higher. It is noted that the recess 215' is formed by patterning the photosensitive layer 204s through a lithography process in the present disclosure. As semiconductor fabrication technology continues to evolve, such as extreme ultraviolet lithography (EUV) technology, the minimum width of the patterned recess that can be formed by the lithography process has already been below 6 nanometers. Therefore, using the lithography process to fabricate the display panel 204 can have the advantage of high resolution. The display panel 204 produced by the fabrication process of the present disclosure can achieve a pixel density of 800 ppi or higher. It is noted that the recess 215' is formed by patterning the photosensitive layer 204s through a lithography process in the present disclosure. As semiconductor fabrication technology continues to evolve, such as extreme ultraviolet lithography (EUV) technology, the minimum width of the patterned recess that can be formed by the lithography process has already been below 6 nanometers. Therefore, using the lithography process to fabricate the display panel 204 can have the advantage of high resolution. The display panel 204 produced by the fabrication process of the present disclosure can achieve a pixel density of 800 ppi or higher. It is noted that the recess 215' is formed by patterning the photosensitive layer 204s through a lithography process in the present disclosure. As semiconductor fabrication technology continues to evolve, such as extreme ultraviolet lithography (EUV) technology, the minimum width of the patterned recess that can be formed by the lithography process has already been below 6 nanometers. Therefore, using the lithography process to fabricate the display panel 204 can have the advantage of high resolution. The display panel 204 produced by the fabrication process of the present disclosure can achieve a pixel density of 800 ppi or higher. It is noted that the recess 215' is formed by patterning the photosensitive layer 204s through a lithography process in the present disclosure. As semiconductor fabrication technology continues to evolve, such as extreme ultraviolet lithography (EUV) technology, the minimum width of the patterned recess that can be formed by the lithography process has already been below 6 nanometers. Therefore, using the lithography process to fabricate the display panel 204 can have the advantage of high resolution. The display panel 204 produced by the fabrication process of the present disclosure can achieve a pixel density of 800 ppi or higher. It is noted that the recess 215' is formed by patterning the photosensitive layer 204s through a lithography process in the present disclosure. As semiconductor fabrication technology continues to evolve, such as extreme ultraviolet lithography (EUV) technology, the minimum width of the patterned recess that can be formed by the lithography process has already been below 6 nanometers. Therefore, using the lithography process to fabricate the display panel 204 can have the advantage of high resolution. The display panel 204 produced by the fabrication process of the present disclosure can achieve a pixel density of 800 ppi or higher. It is noted that the recess 215' is formed by patterning the photosensitive layer 204s through a lithography process in the present disclosure. As semiconductor fabrication technology continues to evolve, such as extreme ultraviolet lithography (EUV) technology, the minimum width of the patterned recess that can be formed by the lithography process has already been below 6 nanometers. Therefore, using the lithography process

[0100] In addition, due to the horizontal misalignment in the photolithography process, the recess 215' formed in the process of forming the pixel 204p2 can overlap with the boundary portion of the recess 215 formed in the process of forming the pixel 204pl. Thus, the features of the partial overlap between the organic emission layer, the organic carrier transport layer, and the second electrode of the adjacent pixels around the highest point of the bump 204c can be generated as shown in FIG. 6B. The features do not affect the normal operation of the display panel 204, and can be used as an identification feature for a display panel manufactured using the process of the present disclosure. Figure 6B In addition, due to the horizontal misalignment in the photolithography process, the recess 215' formed in the process of forming the pixel 204p2 can overlap with the boundary portion of the recess 215 formed in the process of forming the pixel 204pl. Thus, the features of the partial overlap between the organic emission layer, the organic carrier transport layer, and the second electrode of the adjacent pixels around the highest point of the bump 204c can be generated as shown in FIG. 6B. The features do not affect the normal operation of the display panel 204, and can be used as an identification feature for a display panel manufactured using the process of the present disclosure.

[0101] The foregoing outlines features of some embodiments so that a person having ordinary skill in the art can more fully understand the aspects of the present disclosure. Those skilled in the art should appreciate that they can readily use the conception and the specific embodiments disclosed herein as a basis for designing or modifying other processes and structures for carrying out the same purposes and / or achieving the same advantages of the present embodiments. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.

[0102] Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. Accordingly, the disclosure of the present application is intended to be illustrative, but not limiting, of the scope of the application, which is set forth in the following claims.

Claims

1. A translation system, comprising: a scanning translation device, wherein the scanning translation device includes a collection device including a sensor, a light source, and a light source regulation component, wherein the light source and the light source regulation component are configured to cause the sensor to sense two-dimensional features or three-dimensional features within a target area; and an information presentation device configured to receive data from the scanning translation device in a wireless transmission, wherein the information presentation device includes: a display panel including: a substrate; a first electrode and a second electrode disposed on the substrate, separated by a bump; a carrier injection layer continuously disposed on the first electrode, the second electrode, and the bump; a carrier transport layer disposed on and continuously lined along the carrier injection layer; a first organic emissive layer and a second organic emissive layer disposed on the carrier transport layer, wherein on the bump, a thickness of the first organic emissive layer gradually decreases along a first direction, and a thickness of the second organic emissive layer gradually decreases along a second direction opposite to the first direction; and near a top of the bump, the second organic emissive layer covers a portion of the first organic emissive layer.

2. The translation system of claim 1, wherein the scanning translation device further comprises: a processing device configured to translate the two-dimensional features or the three-dimensional features sensed by the collection device; and a communication interface configured to send a translation result generated by the processing device to the information presentation device.

3. The translation system of claim 1, wherein the display panel further includes: a first organic carrier transport layer disposed on the first organic emissive layer; and a second organic carrier transport layer disposed on the second organic emissive layer, wherein on the bump, a thickness of the first organic carrier transport layer gradually decreases along the first direction, and a thickness of the second organic carrier transport layer gradually decreases along the second direction.

4. The translation system of claim 3, wherein near the top of the bump, the first organic carrier transport layer extends under the second organic carrier transport layer.

5. The translation system of claim 1, wherein the first organic emissive layer and the second organic emissive layer are configured to emit different colors of light.

6. The translation system of claim 1, wherein the information presentation device further includes a lens module configured to project information displayed on the display panel onto a display area located outside the information presentation device.

7. The translation system of claim 1, wherein the information presentation device further includes a lens module configured to project information displayed on the display panel onto a display area located inside the information presentation device. ​ 8. The translation system of claim 1, wherein the scanning translation device comprises a first coupling component and the information presentation device comprises a second coupling component, and wherein the scanning translation device and the information presentation device are detachably coupled via the first coupling component and the second coupling component.

9. The translation system of claim 2, wherein the processing device is configured to translate the sensed two-dimensional features or three-dimensional features from a first language to a second different language.

10. A translation system, comprising: an information presentation device; and a scanning translation device, wherein the scanning translation device includes a collection device, the collection device including a sensor, a light source, and a light source control component, wherein the light source and light source control component are configured to cause the sensor to sense two-dimensional features or three-dimensional features within a target area; the scanning translation device is configured to wirelessly transmit data to the information presentation device, wherein the information presentation device includes: a display panel and a lens module configured to project information displayed on the display panel onto a display area, wherein the display panel includes: a substrate; a bump disposed on the substrate between a first electrode and a second electrode; a first organic emissive layer and a second organic emissive layer disposed above the bump, wherein the first organic emissive layer and the second organic emissive layer are configured to emit different colors of light; a thickness of the first organic emissive layer gradually decreases along a first direction and a thickness of the second organic emissive layer gradually decreases along a second direction opposite the first direction on the bump.

11. The translation system of claim 10, wherein near a top of the bump, the second organic emissive layer covers a portion of the first organic emissive layer.

12. The translation system of claim 10, wherein the display panel further includes: a first organic carrier transport layer disposed on the first organic emissive layer; and a second organic carrier transport layer disposed on the second organic emissive layer, wherein the first organic carrier transport layer extends under the second organic carrier transport layer near a top of the bump.

13. The translation system of claim 12, wherein a thickness of the first organic carrier transport layer gradually decreases along the first direction and a thickness of the second organic carrier transport layer gradually decreases along the second direction on the bump.

14. The translation system of claim 10, wherein the scanning translation device comprises a first coupling component and the information presentation device comprises a second coupling component, and wherein the scanning translation device and the information presentation device are detachably coupled via the first coupling component and the second coupling component.

15. The translation system of claim 11, wherein: the scanning translation device further includes: a processing device configured to translate the sensed two-dimensional features or three-dimensional features; and a communication interface configured to transmit translation results generated by the processing device to the information presentation device. ​ ​ 16. The translation system of claim 10, wherein the display area is located external to the information presentation device.

17. The translation system of claim 10, wherein the display area is located internal to the information presentation device.

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