Display panel and display device
By setting a stepped structure in the transition area and display area of the OLED display panel to impede the flow of organic material liquid, the problem of wide bezels in the prior art is solved, and a display panel design with narrow bezels and high reliability is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2023-09-13
- Publication Date
- 2026-05-29
AI Technical Summary
Existing OLED display panels have relatively wide bezels due to the need to reserve sufficient space for the fluidity of the organic encapsulation layer, making it difficult to achieve narrow bezel designs.
At least two stepped structures are set in the transition area and part of the display area of the display panel to form a film thickness difference, which hinders the flow of organic liquid material. An organic encapsulation layer is prepared by IJP process to reduce the bezel width.
While ensuring the uniformity of the film layer within the display area, the transition space at the edge of the organic encapsulation layer is reduced to achieve a narrow bezel setting, thereby improving encapsulation reliability and display uniformity.
Smart Images
Figure CN117177609B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, and more particularly to a display panel and display device. Background Technology
[0002] Currently, in optoelectronic display technology, OLED (Organic Light Emitting Diode) possesses numerous advantages such as active light emission, high brightness, high contrast, ultra-thinness, low power consumption, flexibility, and a wide operating temperature range, making it an advanced and mainstream new flat panel display technology. OLED display panels typically require an encapsulation layer, which protects the organic light-emitting layer in the OLED from external environmental corrosion. The organic material of the encapsulation layer is usually applied using IJP (inkjet printing) technology. Due to the fluidity of the liquid, sufficient space needs to be reserved in the non-bezel area of the display panel, resulting in relatively wide bezels in existing display panels and making it difficult to achieve narrow bezel designs. Summary of the Invention
[0003] This application provides a display panel and display device that can reduce the width of the border of the non-display area of the display panel, thereby enabling a narrow border setting for the display panel.
[0004] A first aspect of this application provides a display panel, including:
[0005] The substrate layer includes a first encapsulation region and a second encapsulation region. The first encapsulation region includes a display region and a transition region, and the transition region is located between the display region and the second encapsulation region.
[0006] An organic encapsulation layer is disposed in the first encapsulation region, and the boundary of the organic encapsulation layer is located in the transition region, or the boundary of the organic encapsulation layer is located at the boundary between the transition region and the second encapsulation region;
[0007] A first inorganic encapsulation layer is disposed between the substrate layer and the organic encapsulation layer, and the first inorganic encapsulation layer is disposed in the first encapsulation region and at least a portion of the second encapsulation region;
[0008] At least two stepped structures are disposed between the substrate layer and the first inorganic encapsulation layer, and the stepped structures are disposed in the transition region and / or part of the display region;
[0009] In the thickness direction of the display panel, two adjacent stepped structures are used to form a film thickness difference, and the film thickness difference formed by two adjacent stepped structures is greater than 1 micrometer.
[0010] In some embodiments, in the second encapsulation region, the thickness fluctuation of the film layer between the first inorganic encapsulation layer and the substrate layer is less than 1 micrometer.
[0011] In some embodiments, the thickness of the stepped structure decreases progressively in the direction from the display area to the transition area.
[0012] In some embodiments, the display panel includes:
[0013] The stepped structure has at least three levels, which are used to form at least three film thickness steps.
[0014] In some embodiments, when the stepped structure is disposed in the transition region, the orthographic projection of the stepped structure closest to the display region onto the substrate layer at least partially overlaps with the boundary of the display region.
[0015] In some embodiments, among the film thickness steps formed by at least two levels of the stepped structure, there exists a film thickness jump position of one of the film thickness steps whose orthogonal projection on the substrate coincides with the boundary of the display area.
[0016] In some embodiments, the orthographic projection of the thickness jump position of the first thickness step closest to the second packaging region onto the substrate is the first boundary, the boundary between the second packaging region and the transition region is the second boundary, and the first boundary coincides with the second boundary.
[0017] In some embodiments, the orthographic projection of the thickness jump position of the first thickness step closest to the second encapsulation region onto the substrate is a first boundary, and the boundary of the orthographic projection of the organic encapsulation layer onto the substrate is a third boundary, wherein the first boundary and the third boundary at least partially coincide.
[0018] In some embodiments, the display panel further includes:
[0019] An organic insulating layer is disposed between the first inorganic encapsulation layer and the substrate layer;
[0020] A passivation layer is disposed between the organic insulating layer and the first inorganic encapsulation layer;
[0021] A driving electrode layer is disposed between the substrate layer and the organic insulating layer;
[0022] At least one of the stepped structures is disposed in the organic insulating layer and / or the passivation layer; and / or,
[0023] At least one of the stepped structures is formed based on the edge of the driving electrode layer.
[0024] In some embodiments, the organic insulating layer includes a pixel defining layer and an organic planarization layer. The organic planarization layer is disposed between the substrate layer and the passivation layer, and the passivation layer is disposed between the organic planarization layer and the pixel defining layer. The pixel defining layer includes a plurality of pixel openings, and a light-emitting layer is disposed within each pixel opening.
[0025] At least one level of the stepped structure is disposed in the pixel defining layer; and / or,
[0026] At least one level of the stepped structure is disposed on the organic planar layer; and / or,
[0027] At least one of the stepped structures is formed based on the boundary of the organic flat layer.
[0028] In some embodiments, the width of each step structure is greater than or equal to 30 micrometers in the direction from the display area to the transition area.
[0029] In some embodiments, in the direction from the display area to the transition area, the width of each step structure is greater than or equal to 45 micrometers; and / or,
[0030] The thickness difference between two adjacent stepped structures is greater than 1.3 micrometers.
[0031] A second aspect of this application provides a display device, comprising:
[0032] The display panel as described in the first aspect.
[0033] The display panel provided in this application embodiment features at least two stepped structures in the transition region and / or part of the display region. Adjacent stepped structures form a film thickness difference. In the direction from the first encapsulation region to the second encapsulation region, the last stepped structure can also form a film thickness difference. In the organic encapsulation layer fabrication process, the at least two film thickness differences formed by the at least two stepped structures can impede the flow of organic liquid. The film thickness difference is greater than 1 micrometer, meaning that due to the viscosity and surface tension of the organic liquid, it cannot overcome the film thickness difference encountered in the stepped structure, effectively intercepting the liquid flow in the inkjet printing process. By reducing the transition space at the edge of the organic encapsulation layer while ensuring the uniformity of the film layer within the display region, the width of the second encapsulation region does not need to be too wide, thus reducing the bezel of the non-display region and achieving a display panel with a narrow bezel. Attached Figure Description
[0034] Figure 1 A schematic structural diagram of a display panel provided in an embodiment of this application;
[0035] Figure 2 A schematic cross-sectional view of a display panel along A1-A2 is provided as an embodiment of this application.
[0036] Figure 3 A schematic diagram of another cross-sectional structure of a display panel along A1-A2 provided in an embodiment of this application;
[0037] Figure 4 A schematic diagram of another cross-sectional structure of a display panel along A1-A2, provided for an embodiment of this application;
[0038] Figure 5 A schematic diagram of another cross-sectional structure of a display panel along A1-A2, provided for an embodiment of this application;
[0039] Figure 6 A schematic diagram of another cross-sectional structure of a display panel along A1-A2, provided for an embodiment of this application;
[0040] Figure 7 This is a schematic structural diagram of a display device provided in an embodiment of this application. Detailed Implementation
[0041] To better understand the technical solutions provided in the embodiments of this specification, the technical solutions of the embodiments of this specification will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments of this specification and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification, rather than limitations on the technical solutions of this specification. In the absence of conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.
[0042] In this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, without necessarily requiring or implying any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The term "two or more" includes two or more cases.
[0043] Currently, in optoelectronic display technology, OLED boasts numerous advantages such as active light emission, high brightness, high contrast, ultra-thinness, low power consumption, flexibility, and a wide operating temperature range, making it an advanced and mainstream new flat panel display technology. OLED display panels typically require an encapsulation layer, which protects the organic light-emitting layer of the organic light-emitting diode from external environmental corrosion. The organic material of the encapsulation layer is usually applied using IJP (inkjet printing) technology. Due to the fluidity of the liquid, sufficient space needs to be reserved in the non-bezel area of the display panel, resulting in relatively wide bezels in existing display panels and making it difficult to achieve narrow bezel designs.
[0044] In view of this, embodiments of this application provide a display panel and a display device that can reduce the width of the border of the non-display area of the display panel, thereby enabling a narrow border setting for the display panel.
[0045] A first aspect of this application provides a display panel. Figure 1 A schematic structural diagram of a display panel provided in an embodiment of this application; Figure 2 This is a schematic cross-sectional view of a display panel along A1-A2, provided as an embodiment of this application. (In conjunction with...) Figure 1 and Figure 2 It includes: a substrate layer 100, an organic encapsulation layer 200, a first inorganic encapsulation layer 300, and a stepped structure 400. The substrate layer 100 may include a flexible substrate and a rigid substrate. The flexible substrate may be made of polyimide material, and the rigid substrate may be made of glass substrate. This application does not specifically limit the embodiments. Figure 1 As shown, the substrate layer 100 may include a first encapsulation region 110 and a second encapsulation region 120. The first encapsulation region 110 includes a display region 111 and a transition region 112. The transition region 112 is located between the display region 111 and the second encapsulation region 120. The second encapsulation region 12 may be a non-display region. Figure 1 The second encapsulation region 120 surrounding the first encapsulation region 110 shown is merely illustrative and not intended to limit the specific implementation of this application. For example, a light-emitting device may be disposed within the display region 111, serving as a display pixel, and the light emitted by the light-emitting device may be used to display an image. The organic encapsulation layer 200 and the first inorganic encapsulation layer 300 can be used to encapsulate the light-emitting device. To ensure the reliability of the encapsulation of the light-emitting device, the organic encapsulation layer 200 and the first inorganic encapsulation layer 300 may cover the transition region 112 outside the display region 111, and the first inorganic encapsulation layer 300 may also cover a portion of the second encapsulation region 120. The second encapsulation region 120 can serve as a border for the non-display area.
[0046] For example, such as Figure 2As shown, the boundary of the organic encapsulation layer 200 may also be located at the boundary between the transition region 112 and the second encapsulation region 120. In some embodiments, the organic encapsulation layer 200 is disposed in the first encapsulation region 110, and the boundary of the organic encapsulation layer 200 is located in the transition region 112. The organic encapsulation layer 200 may be fabricated using IJP processes.
[0047] refer to Figure 2 A first inorganic encapsulation layer 300 is disposed between the substrate layer 100 and the organic encapsulation layer 200, and is disposed in the first encapsulation region 110 and at least a portion of the second encapsulation region 120. At least two-stage stepped structures 400 are disposed between the substrate layer 100 and the first inorganic encapsulation layer 300, and the stepped structures 400 are disposed in the transition region 112. In some embodiments, the stepped structures 400 may be disposed in a portion of the display region 111. Figure 2 As shown, the stepped structure 400 includes a first-level stepped structure 410 and a second-level stepped structure 420. In the thickness direction H of the display panel, adjacent stepped structures 400 form a film thickness step h. The last stepped structure 400 in the direction from the first encapsulation region 110 to the second encapsulation region 120 can independently form a film thickness step h. The film thickness step h formed by adjacent stepped structures 400 is greater than 1 micrometer, and the film thickness step h of the last stepped structure 400 is also greater than 1 micrometer. A film thickness step h greater than 1 micrometer can impede the flow of liquid in the IJP process; the larger the film thickness step h, the better the impediment effect. Figure 2 As shown, the last step structure in the direction from the first encapsulation region 110 to the second encapsulation region 120 is the second step structure 420. The number of steps in the step structure 400 is the same as the number of film thickness steps h, that is, the number of film thickness steps h can be formed by the number of step structures. In the fabrication process of the organic encapsulation layer 200, the film thickness steps h formed by the step structure 400 can play a role in hindering the flow of organic liquid. That is, due to the viscosity and surface tension of the organic liquid, when it encounters the film thickness steps h of the step structure 400, it will be unable to cross the step, which can effectively intercept the liquid flow in the IJP process. While ensuring the uniformity of the film layer in the display region 111, the transition space at the edge of the organic encapsulation layer 200 can be reduced, so the width of the second encapsulation region 120 does not need to be too wide, which can play a role in reducing the bezel of the non-display area and realizing a display panel with a narrow bezel setting. The width of the second encapsulation region 120 can be the size of the second encapsulation region 120 in the direction from the first encapsulation region 110 to the second encapsulation region 120.
[0048] It should be noted that the organic encapsulation layer 200 can encapsulate particles, relieve stress, and planarize the film layer. In other words, the IJP process achieves film planarization by filling the step differences in the contact film layer through liquid flow. Due to the fluidity of the organic material liquid, the non-display area of the display panel needs sufficient space to uniformly distribute the thickness of the organic encapsulation layer 200 at the edges of the display area. This ensures a normal display effect at the edges of the display area and prevents uneven thickness of the organic encapsulation layer 200 from causing poor edge display uniformity. Uneven thickness of the organic encapsulation layer 200 would result in a wider non-display bezel, limiting the possibility of setting a narrow bezel for the display panel.
[0049] The display panel provided in this application embodiment has at least two stepped structures 400 in the transition region 112 and / or part of the display region 111. Adjacent stepped structures 400 form a film thickness difference h. In the direction from the first encapsulation region 110 to the second encapsulation region 120, the last stepped structure 400 can also form a film thickness difference h. In the fabrication process of the organic encapsulation layer 200, the at least two film thickness differences h formed by the at least two stepped structures 400 can impede the flow of organic liquid. The film thickness difference is greater than 1 micrometer, meaning that due to the viscosity and surface tension of the organic liquid, it cannot overcome the film thickness difference h when encountering the stepped structure 400, effectively intercepting the liquid flow in the IJP process. By reducing the transition space at the edge of the organic encapsulation layer 200 while ensuring the uniformity of the film layer within the display region 111, the width of the second encapsulation region 120 does not need to be too wide, which can reduce the bezel of the non-display region, achieving a display panel with a narrow bezel.
[0050] For example, Figure 3 This is a schematic diagram of another display panel's cross-sectional structure along A1-A2, provided as an embodiment of this application. Figure 3 As shown, to ensure the reliable performance of the display panel's packaging, two isolation pillars 101 can be designed to prevent liquid overflow during the IJP process, thereby achieving the reliability requirements. However, the placement of the isolation pillars 101 widens the space of the second packaging region 120. That is, in the direction from the transition region 112 to the second packaging region 120, the size of the second packaging region 120 increases with the placement of the isolation pillars 101, thus creating a bezel for the display panel. The isolation pillars 101 limit the narrow bezel design. For example, the height of the isolation pillars 101 in the thickness direction H of the display panel can be between 3 micrometers and 6 micrometers.
[0051] For example, Figure 4 This is a schematic diagram of another cross-sectional structure of a display panel along A1-A2, provided as an embodiment of this application. Figure 4As shown, the isolation pillars 101 within the second encapsulation area 120 can be removed. By adjusting the shrinkage parameter of the IJP process, the distance between the inkless dots can be adjusted. The appearance of the film layer in the IJP process at the inkless dots relies on the flow of liquid. By adjusting the shrinkage value, the organic encapsulation layer 200 set in the IJP process can be controlled within the first encapsulation area 110. Therefore, the isolation pillars 101 do not need to be set in the second encapsulation area 120, which can reduce the space of the second encapsulation area 120 and achieve a narrow bezel for the display panel.
[0052] It should be noted that the thickness of the organic encapsulation layer 200 prepared by the IJP process decreases continuously from the target thickness from 2000 micrometers inside the first encapsulation region to the edge of the organic encapsulation layer. Since the edge liquid is flow-filled, its viscosity and surface tension cause it to be unable to overcome step differences or other uneven film structures at the edges of other film layers. Therefore, the stepped structure 400 can effectively intercept the liquid flow in the IJP process.
[0053] The display panel provided in this application embodiment, by removing the isolation pillar 101 within the second encapsulation region 120, reduces the thickness fluctuation of the film layer between the first inorganic encapsulation layer 300 and the substrate layer 100 within the second encapsulation region 120 to less than 1 micrometer, thereby narrowing the width of the second encapsulation region 120 and making it possible to achieve an ultra-narrow bezel. Furthermore, removing the isolation pillar 101 within the second encapsulation region 120 avoids the risk of touch metal traces breaking or leaving metal residue at the isolation pillar 101 location due to step differences, thus improving the reliability of the touch metal traces.
[0054] In some embodiments, the thickness of the stepped structure 400 decreases progressively in the direction from the display area 111 to the transition area 112. The progressively thinned stepped structure 400 can form a stepped structure with uniform film thickness differences, which is more effective in preventing liquid overflow in the IJP process.
[0055] In some embodiments, the display panel may include at least three stepped structures 400 for forming at least three film thickness steps h. A greater number of stepped structures 400 results in a higher resistance effect on liquid flow. However, the number of stepped structures 400 should not be too many, as too many steps will increase the width of the transition region 112, still affecting the improvement of the narrow bezel.
[0056] For example, refer to Figure 4The stepped structure 400 includes a first-level stepped structure 410, a second-level stepped structure 420, and a third-level stepped structure 430. The thickness of the first-level stepped structure 410 corresponds to a first thickness h01, the thickness of the second-level stepped structure 420 corresponds to a second thickness h02, and the thickness of the third-level stepped structure 430 corresponds to a third thickness h03. The first-level stepped structure 410 corresponds to a first film thickness step h1, the second-level stepped structure 420 corresponds to a second film thickness step h2, and the third-level stepped structure 430 corresponds to a third film thickness step h3. It should be noted that the thickness of the stepped structure 400 refers to the distance from the surface of the stepped structure away from the substrate layer 100 to the substrate layer 100. Additionally, if other film layers are disposed on the substrate layer 100, such as a continuous, stepless buffer layer or other insulating or electrode layer, the thickness of the stepped structure 400 can be the distance between the surface of the stepped structure 400 away from the substrate layer 100 and the uppermost continuous, stepless insulating or electrode layer after the buffer layer. In the direction from the display area 111 to the transition area 112, the width of each stepped structure is greater than or equal to 30 micrometers. The width L of the second-level stepped structure 420 is greater than or equal to 30 micrometers; a width that is too small is not conducive to impeding liquid overflow. It should also be noted that the width of the third-level stepped structure 430 needs to be greater than or equal to 30 micrometers.
[0057] For example, in the direction from the display area 111 to the transition area 112, the width of each step structure 400 can be greater than or equal to 45 micrometers; the larger the width, the better the liquid-blocking effect, but it cannot be widened too much, as this could easily result in an excessively wide transition area 112. The film thickness difference between two adjacent step structures 400 is greater than 1.3 micrometers. For example, the first film thickness difference h1, the second film thickness difference h2, and the third film thickness difference h3 can all be greater than 1 micrometer, and specifically, the film thickness difference can be 1.5 micrometers.
[0058] In some embodiments, the display panel may include an organic insulating layer, a passivation layer, and a driving electrode layer. The organic insulating layer is disposed between the first inorganic encapsulation layer 300 and the substrate layer 100. The organic insulating layer may include a pixel defining layer and an organic planarization layer. The pixel defining layer can be used to define the regions of adjacent sub-pixels, and the organic planarization layer can be used to plan the film layer steps formed by the driving circuit. The driving electrode layer is part of the driving circuit, and typically the source and drain of the driving transistor are disposed in the driving electrode layer. The passivation layer is disposed between the organic insulating layer and the first inorganic encapsulation layer; the driving electrode layer is disposed between the substrate layer and the organic insulating layer. At least one step structure 400 may be disposed in the organic insulating layer; in some examples, at least one step structure 400 is disposed in the passivation layer; in some examples, at least one step structure 400 is formed based on the edge of the driving electrode layer, that is, the film layer steps formed at the edge of the driving electrode can form a film thickness step on the film layer covering the driving electrode, thereby forming a step structure.
[0059] For example, Figure 5 This is a schematic diagram of another cross-sectional structure of a display panel along A1-A2, provided as an embodiment of this application. Figure 5 As shown, the organic insulating layer may include an organic planarization layer 700 and a pixel defining layer 600. A first inorganic encapsulation layer 300 and a second inorganic encapsulation layer 500 are respectively disposed on both sides of the organic encapsulation layer 200. The thickness of the organic encapsulation layer 200 is greater than the thickness of the inorganic encapsulation layer. The organic encapsulation layer 200 can retain stress and buffer stress, while the inorganic encapsulation layer can block water and oxygen. A driving electrode layer 800, an organic planarization layer 700, and a pixel defining layer 600 are sequentially stacked between the substrate layer 100 and the first inorganic encapsulation layer 300. The edges of the driving electrode layer 800, the organic planarization layer 700, and the pixel defining layer 600 do not extend beyond the edge of the stepped structure 400. The first film thickness difference h1 formed by the first-level stepped structure 410 and the second-level stepped structure 420 is based on the edge film thickness difference of the driving electrode layer 800. The second film thickness difference h2 formed by the second-level stepped structure 420 and the third-level stepped structure 430 is based on the edge film thickness difference of the organic planarization layer 700. The third film thickness difference h3 formed by the third-level stepped structure 430 is based on the edge film thickness difference of the pixel defining layer 600. Figure 5 The stepped structure 400 shown is disposed on the pixel defining layer 600, but the shape of the stepped structure 400 is formed based on the edges of the driving electrode layer 800, the organic planarization layer 700 and the pixel defining layer 600, respectively.
[0060] For example, refer to Figure 5 An organic planarization layer 700 is disposed between a substrate layer 100 and a passivation layer. The passivation layer is disposed between the organic planarization layer 700 and a pixel defining layer 600. The pixel defining layer 600 includes a plurality of pixel openings, and a light-emitting layer is disposed within each pixel opening.
[0061] In some implementations, at least one step structure is disposed on the pixel boundary layer; at least one step structure is disposed on the organic planarization layer; at least one step structure is formed based on the boundary of the organic planarization layer.
[0062] For example, Figure 6 This is a schematic diagram of another cross-sectional structure of a display panel along A1-A2, provided as an embodiment of this application. Figure 6As shown, the display area includes a driving transistor TFT and a light-emitting device. The light-emitting device includes a cathode 910, a light-emitting layer 920, and an anode 930. An organic planarization layer 700 and a passivation layer PV are disposed between the anode 930 and the driving transistor TFT. An inter-insulating layer ILD is disposed between the active layer of the driving transistor TFT and the source / drain electrodes. The source / drain electrodes are disposed in the driving electrode layer 800. The light-emitting layer 920 is disposed within a cutout formed by the pixel defining layer 600. The cathode 910 is disposed between the first inorganic encapsulation layer 300 and the light-emitting layer 920.
[0063] In some embodiments, when the stepped structure 400 is disposed in the transition region, the orthographic projection of the stepped structure 400 closest to the display region 111 onto the substrate layer 100 at least partially overlaps with the boundary of the display region 111. It should be noted that, referring to... Figure 5 and Figure 6 The first-level stepped structure 410 is closest to the display area 111, and its orthographic projection boundary on the substrate layer 100 coincides with the boundary of the display area 111. This reduces the space occupied by the stepped structure 400 in the transition area 112, limits the width of the transition area 112, and prevents it from occupying too much space, thus affecting the bezel width of the display panel. It should be noted that the width of each stepped structure 400 in the multi-level stepped structure 400 is similar. The width of the first-level stepped structure closest to the display area 111 (i.e., the first-level stepped structure pointing from the display area 111 to the transition area 112) is similar to the widths of the other stepped structures. Since there are differences in the film layers between the display area 111 and the transition area 112, the width of the first-level stepped structure 410 may have no obvious boundary or may have a boundary based on the film layer step difference; this embodiment does not specifically limit this.
[0064] In some embodiments, in the film thickness steps formed by at least two levels of stepped structures, the orthographic projection of the film thickness jump position of one film thickness step on the substrate layer 100 coincides with the boundary of the display area 111. For example, refer to... Figure 5 The thickness step h1 of the first-level stepped structure 410 coincides with the boundary of the display area 111.
[0065] In some embodiments, the orthographic projection of the thickness jump position of the first-level thickness step closest to the second packaging region 120 onto the substrate layer 100 is the first boundary, and the boundary between the second packaging region 120 and the transition region 112 is the second boundary, with the first boundary coinciding with the second boundary. For example, refer to... Figure 5The third-level stepped structure 430 is closest to the second encapsulation region 120. The boundary of the third film thickness step h3 of the third-level stepped structure 430 projected onto the substrate layer 100 is the first boundary, and the boundary between the second encapsulation region 120 and the transition region 112 is the second boundary. The first boundary and the second boundary coincide. The film thickness step position of the last-level stepped structure 400 in the direction from the display region 111 to the transition region 112 coincides with the boundary of the second encapsulation region 120 near the transition region 112. This can further reduce the width of the transition region 112 and further reduce the width of the non-display bezel of the display panel, achieving an ultra-narrow bezel setting for the display panel.
[0066] In some embodiments, the orthographic projection of the thickness jump position of the first-level thickness step closest to the second encapsulation region 120 onto the substrate layer 100 is the first boundary, and the boundary of the orthographic projection of the organic encapsulation layer 200 onto the substrate layer 100 is the third boundary, with the first boundary and the third boundary at least partially overlapping. For example, refer to... Figure 6 The third-level stepped structure 430 is the closest stepped structure to the second encapsulation region 120. The third film thickness step h3 of the third-level stepped structure 430 is located at the first boundary, and the boundary of the organic encapsulation layer 200 is the third boundary. Due to the film-forming characteristics of the liquid in the IJP process, the third boundary may be an irregular boundary. Therefore, the first boundary and the third boundary may partially overlap or completely overlap. This application embodiment does not make specific limitations. The boundary of the organic encapsulation layer 200 can be restricted within the boundary of the transition region 112 under the action of the stepped structure 400, so there is no need to set the isolation pillar 101. By setting the stepped structure and eliminating the isolation pillar 101, the width of the second encapsulation region 120 can be reduced. The transition region 112 where the stepped structure 400 is located is the original edge area of the organic encapsulation layer 200. With the adjustment of the inward shrinkage parameter of the IJP process, the edge of the organic encapsulation layer 200 can be restricted within the first encapsulation region 110, minimizing the width of the non-display border.
[0067] For example, the film thickness difference of the stepped structure 400 can be formed by film etching or by film layer difference below the film layer. This application embodiment does not make specific limitations.
[0068] A second aspect of this application provides a display device. Figure 7 This is a schematic structural diagram of a display device provided in an embodiment of this application. Figure 7 As shown, the display device includes a display panel 1000 as described in the first aspect.
[0069] It should be noted that the display device may also include a control motherboard, which is electrically connected to the display panel 1000. The display panel 1000 displays an image under the drive of the control motherboard. The display device may also include a housing and a battery, and the battery, control motherboard, and display panel 1000 may be disposed within the housing. The display panel 1000 may also include a light filter layer, a touch layer, and a cover plate, etc., which are not specifically limited in the embodiments of this application.
[0070] The display device provided in this application embodiment has at least two stepped structures 400 in the transition region 112 and / or part of the display region 111 through the display panel. Adjacent stepped structures 400 form a film thickness difference h. In the direction from the first encapsulation region 110 to the second encapsulation region 120, the last stepped structure 400 can also form a film thickness difference h. In the preparation process of the organic encapsulation layer 200, the at least two film thickness differences h formed by the at least two stepped structures 400 can play a role in blocking the flow of organic liquid. The film thickness difference is greater than 1 micrometer, that is, due to the viscosity and surface tension of the organic liquid, it will be unable to cross the film thickness difference h of the stepped structure 400, which can effectively intercept the liquid flow in the IJP process. While ensuring the uniformity of the inner film layer in the display area 111, the transition space at the edge of the organic encapsulation layer 200 can be reduced. In this way, the width of the second encapsulation area 120 does not need to be too wide, which can reduce the border of the non-display area and realize a display panel with a narrow border, thereby obtaining a display device with a narrow border.
[0071] It should be noted that the display device provided in this application embodiment can be applied to smartphones, laptops, tablets, televisions, smart wearable devices, etc. For example, smart wearable devices may include smartwatches, VR (virtual reality) devices, and AR (augmented reality) devices, etc. This application embodiment does not make specific limitations.
[0072] It should be noted that the descriptions of each embodiment in the above embodiments have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.
[0073] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.
[0074] Although preferred embodiments have been described in this specification, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this specification.
[0075] Obviously, those skilled in the art can make various modifications and variations to this specification without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims and their equivalents, this specification is also intended to include such modifications and variations.
Claims
1. A display panel, characterized in that, include: The substrate layer includes a first encapsulation region and a second encapsulation region. The first encapsulation region includes a display region and a transition region, and the transition region is located between the display region and the second encapsulation region. An organic encapsulation layer is disposed in the first encapsulation region, and the boundary of the organic encapsulation layer is located in the transition region, or the boundary of the organic encapsulation layer is located at the boundary between the transition region and the second encapsulation region; A first inorganic encapsulation layer is disposed between the substrate layer and the organic encapsulation layer, and the first inorganic encapsulation layer is disposed in the first encapsulation region and at least a portion of the second encapsulation region; At least two stepped structures are disposed between the substrate layer and the first inorganic encapsulation layer, and the stepped structures are disposed in the transition region and / or part of the display region; In the thickness direction of the display panel, two adjacent stepped structures are used to form a film thickness difference, and the film thickness difference formed by two adjacent stepped structures is greater than 1 micrometer. A driving electrode layer, an organic planarization layer, a passivation layer, and a pixel delimitation layer are stacked sequentially between the substrate layer and the first inorganic encapsulation layer. The stepped structure is disposed on the pixel defining layer. The stepped structure includes a first-level stepped structure, a second-level stepped structure, and a third-level stepped structure. The first-level stepped structure is close to the display area, the third-level stepped structure is close to the second encapsulation area, and the second-level stepped structure is located between the first-level stepped structure and the third-level stepped structure. The first film thickness difference formed by the first-level stepped structure and the second-level stepped structure is based on the edge film thickness difference of the driving electrode layer. The second film thickness difference formed by the second-level stepped structure and the third-level stepped structure is based on the edge film thickness difference of the organic planarization layer. The third film thickness difference formed by the third-level stepped structure is based on the edge film thickness difference of the pixel defining layer. No isolation pillars for blocking the organic encapsulation layer are provided in the second encapsulation area.
2. The display panel according to claim 1, characterized in that, In the second encapsulation region, the thickness fluctuation between the first inorganic encapsulation layer and the substrate layer is less than 1 micrometer.
3. The display panel according to claim 1, characterized in that, The thickness of the stepped structure decreases progressively in the direction from the display area to the transition area.
4. The display panel according to claim 3, characterized in that, include: The stepped structure has at least three levels, which are used to form at least three film thickness steps.
5. The display panel according to claim 1, characterized in that, When the stepped structure is disposed in the transition region, the orthographic projection of the stepped structure closest to the display area onto the substrate layer at least partially overlaps with the boundary of the display area.
6. The display panel according to claim 1, characterized in that, In the film thickness steps formed by at least two levels of the stepped structure, there exists a film thickness jump position where the orthogonal projection on the substrate layer coincides with the boundary of the display area.
7. The display panel according to claim 1, characterized in that, The orthographic projection of the thickness jump position of the first-level thickness step closest to the second packaging region onto the substrate is the first boundary, the boundary between the second packaging region and the transition region is the second boundary, and the first boundary coincides with the second boundary.
8. The display panel according to claim 1, characterized in that, The orthographic projection of the thickness jump position of the first-level thickness step closest to the second encapsulation region onto the substrate is the first boundary, and the boundary of the orthographic projection of the organic encapsulation layer onto the substrate is the third boundary, with the first boundary and the third boundary at least partially overlapping.
9. The display panel according to claim 1, characterized in that, Also includes: At least one of the stepped structures is disposed in the passivation layer; and / or, At least one of the stepped structures is formed based on the edge of the driving electrode layer.
10. The display panel according to claim 9, characterized in that, The pixel defining layer includes multiple pixel openings, and a light-emitting layer is disposed within each pixel opening; At least one level of the stepped structure is disposed in the pixel defining layer; and / or, At least one of the stepped structures is disposed on the organic planar layer; And / or, At least one of the stepped structures is formed based on the boundary of the organic flat layer.
11. The display panel according to claim 1, characterized in that, In the direction from the display area to the transition area, the width of each step structure is greater than or equal to 30 micrometers.
12. The display panel according to claim 11, characterized in that, In the direction from the display area to the transition area, the width of each step structure is greater than or equal to 45 micrometers; and / or, The thickness difference between two adjacent stepped structures is greater than 1.3 micrometers.
13. A display device, characterized in that, include: The display panel as described in any one of claims 1 to 12.