A surface treatment apparatus and method for improving the performance of electrolytic copper

Abstract

The embodiment of the specification provides a surface treatment device for improving the performance of electrolytic copper, which comprises a plurality of transmission rollers, a treatment tank, a winding box and a processor; the plurality of transmission rollers are linked through a transmission device and are configured to wind or unwind the copper foil; the treatment tank is configured to treat the surface of the copper foil; the winding box is configured to place the wound copper foil; the processor is configured to: obtain copper foil treatment information; control the plurality of transmission rollers to convey the copper foil to the treatment tank; control the first cleaning component to clean the copper foil based on the first cleaning parameter; control the plurality of transmission rollers to convey the copper foil to the winding box; control the purging component and / or the drying component to perform surface treatment on the copper foil based on the surface treatment parameter.

Description

TECHNICAL FIELD

[0001] The present specification relates to the technical field of electrolytic copper, in particular to a surface treatment device and method for improving the performance of electrolytic copper. BACKGROUND

[0002] In the production process of copper foil, the green foil (copper foil just processed without surface treatment) needs to be pickled and passivated to remove impurities on the surface of the copper foil and avoid oxidation of the surface of the copper foil affecting its quality.

[0003] The patent with publication number CN110756508B discloses a surface treatment device for electrolytic copper foil before winding, which can adjust the corresponding cleaning time according to the amount of surface treatment solution on the outer side of the electrolytic copper foil without changing the winding speed of the electrolytic copper foil, so that the electrolytic copper foil can be in the appropriate cleaning time, increase the cleaning effect of the electrolytic copper foil, and also can wipe the electrolytic copper foil after cleaning to wipe the moisture on the surface of the electrolytic copper foil clean, increase the subsequent drying effect. However, the amount of surface treatment solution in the patent is based on manual monitoring and judgment, and the cleaning time is adjusted by adjusting the adjusting plate on the device, which is time-consuming and laborious; in addition, the wool roller used for wiping the copper foil is easy to accumulate more ion impurities in the surface treatment solution with the extension of the use time, which leads to the copper foil being easily contaminated in the later stage.

[0004] Therefore, it is desirable to propose a surface treatment device and method for improving the performance of electrolytic copper to solve the above problems of the copper foil made of electrolytic copper in the later surface treatment process. SUMMARY

[0005] One or more embodiments of the present specification provide a surface treatment device for improving the performance of electrolytic copper, comprising a processor configured to execute a surface treatment method for improving the performance of electrolytic copper. The surface treatment device comprises a plurality of sets of transmission rollers, a treatment tank, a winding box and a processor; the plurality of sets of transmission rollers comprise winding rollers and unwinding rollers, and are linked by a transmission device and configured to wind or unwind the copper foil; the treatment tank is configured to treat the surface of the copper foil, and a first cleaning component is arranged at the treatment tank, wherein the first cleaning component comprises a first distributed water gun and a water suction component; the winding box is configured to place the wound copper foil, and a blowing component and a drying component are arranged at the winding box; the processor is configured to: obtain copper foil treatment information, wherein the copper foil treatment information at least comprises copper foil production process flow information; control the plurality of sets of transmission rollers to convey the copper foil to the treatment tank; control the first cleaning component to clean the copper foil based on first cleaning parameters; control the plurality of sets of transmission rollers to convey the copper foil to the winding box; and control the blowing component and / or the drying component to perform surface treatment on the copper foil based on surface treatment parameters, wherein the surface treatment parameters comprise blowing parameters and / or drying parameters.

[0006] One or more embodiments of the present specification provide a surface treatment method for improving the performance of electrolytic copper, which is executed by a processor and comprises: obtaining copper foil treatment information, wherein the copper foil treatment information comprises process flow information; controlling a plurality of sets of transmission rollers to convey the copper foil to a treatment tank; controlling a first cleaning component to clean the copper foil based on first cleaning parameters; controlling the plurality of sets of transmission rollers to convey the copper foil to a winding box; and controlling a blowing component and / or a drying component to perform surface treatment on the copper foil based on surface treatment parameters, wherein the surface treatment parameters comprise blowing parameters and / or drying parameters. BRIEF DESCRIPTION OF DRAWINGS

[0007] The present specification will be further described in the manner of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, the same reference numbers represent the same structures, wherein:

[0008] Figure 1 FIG. 1 is a structural schematic diagram of a surface treatment device for improving the performance of electrolytic copper according to some embodiments of the present specification;

[0009] Figure 2 FIG. 2 is an exemplary flowchart of a surface treatment method for improving the performance of electrolytic copper according to some embodiments of the present specification;

[0010] Figure 3 FIG. 3 is a schematic diagram of cleaning a water suction component according to some embodiments of the present specification;

[0011] Figure 4 is a schematic diagram of determining a target parameter according to some embodiments of the present specification;

[0012] Figure 5 is a schematic diagram of determining a surface treatment parameter according to some embodiments of the present specification. DETAILED DESCRIPTION

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present specification, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some examples or embodiments of the present specification, and for those skilled in the art, the present specification can also be applied to other similar scenarios without creative labor on the basis of these drawings. Unless it is clear from the language context or otherwise indicated, the same reference numbers in the drawings represent the same structure or operation.

[0014] It should be understood that the "system", "device", "unit" and / or "module" used herein is a method for distinguishing different components, elements, parts, sections or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0015] As shown in the specification and claims, unless the context clearly indicates otherwise, the words "one", "a", "an", and / or "the" do not refer to the singular, but can also include the plural. Generally speaking, the terms "comprise" and "include" only indicate the inclusion of the steps and elements explicitly identified, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements.

[0016] Flowcharts are used in the present specification to illustrate the operations performed by the system according to the embodiments of the present specification. It should be understood that the preceding or subsequent operations are not necessarily performed in sequence. On the contrary, each step can be processed in reverse order or simultaneously. At the same time, other operations can also be added to these processes, or one or more steps of the operation can be removed from these processes.

[0017] Figure 1 is a structural schematic diagram of a surface treatment device for improving the performance of electrolytic copper according to some embodiments of the present specification. As shown in Figure 1 the surface treatment device 100 can at least include the following components.

[0018] In some embodiments, the surface treatment device 100 for improving the performance of electrolytic copper can include a transmission roller 110, a treatment tank 120, a winding box 130 and a processor (not shown in the figure).

[0019] The transmission roller 110 refers to a device for transmitting power. In some embodiments, the surface treatment device 100 has multiple sets of transmission rollers configured to wind or unwind the copper foil. For example, the transmission roller can unwind a roll of copper foil for surface treatment; or wind the treated copper foil into a roll.

[0020] In some embodiments, the transmission roller 110 can be composed of a winding roller 111 and an unwinding roller 112. In some embodiments, multiple sets of transmission rollers 110 can be linked by a transmission device 113. When the transmission device is activated, it can drive the winding roller 111 or the unwinding roller 112 to complete the winding or unwinding operation of the copper foil.

[0021] The winding roller 111 refers to the part of the transmission roller 110 used for winding operation of the copper foil.

[0022] The unwinding roller 112 refers to the part of the transmission roller 110 used for unwinding operation of the copper foil.

[0023] The transmission device 113 refers to a mechanical device that mechanically links multiple sets of transmission rollers 110 through various components such as gears, chains, and belts.

[0024] The treatment tank 120 refers to a structure for treating the surface of the copper foil. The treatment means for the surface of the copper foil can include pickling, passivation, and water washing. In some embodiments, the treatment tank can be used to clean the surface of the copper foil, for example, the treatment tank can clean the residual electroplating solution on the surface of the copper foil from the previous process such as electroplating process.

[0025] In some embodiments, the treatment tank is in the form of a groove with a first cleaning component 121 inside.

[0026] The first cleaning component 121 refers to a component for cleaning the transmission roller 110. In some embodiments, the first cleaning component includes a first distributed water gun 1211 and a water absorbing component 1212.

[0027] The first distributed water gun 1211 refers to a device for washing the copper foil with water. In some embodiments, the first cleaning component 121 can include multiple first distributed water guns, which can be determined according to actual needs.

[0028] The water absorbing component 1212 is configured to wipe the washed copper foil. In some embodiments, the water absorbing component can include at least one material for drying, for example, the water absorbing component can include a sponge, a solid desiccant, etc. In some embodiments, the first cleaning component 121 can include multiple water absorbing components, which can be determined according to actual needs.

[0029] In some embodiments, the first cleaning component 121 is also provided with a distributed pressure unit and a humidity sensor. More relevant descriptions can be found in Figure 3 .

[0030] The winding box 130 is a box-shaped device for storage. In some embodiments, the winding box is configured to place the wound copper foil.

[0031] In some embodiments, the winding box is provided with a blowing component 131 and a drying component 132.

[0032] The blowing component 131 is a component for blowing the surface of the copper foil in the winding box 130. In some embodiments, the blowing component can be a small fan or the like, which is used to blow away the residual solid particles or other impurities on the surface of the wound copper foil, so as to achieve the smoothness of the copper foil surface.

[0033] The drying component 132 is a component for drying the copper foil in the winding box 130. In some embodiments, the drying component can be a small dryer or the like, which is used to further evaporate the small amount of moisture or other liquids (such as electroplating liquid) remaining on the surface of the copper foil, so as to achieve the dryness of the copper foil surface.

[0034] The processor refers to a device for controlling the normal and orderly operation of each component of the surface device. In some embodiments, the processor can be configured to: obtain copper foil processing information, the copper foil processing information at least including copper foil production process information; control a plurality of transmission rollers to convey the copper foil to the processing tank; control the first cleaning component to clean the copper foil based on the first cleaning parameter; control the plurality of transmission rollers to convey the copper foil to the winding box; control the blowing component and / or the drying component to perform surface treatment on the copper foil based on the surface treatment parameter, the surface treatment parameter including the blowing parameter and / or the drying parameter. More relevant descriptions of the processor can be found in Figures 2-4 .

[0035] It should be understood that Figure 1 the devices shown and their component parts can be implemented in various ways.

[0036] It should be noted that the above description of the surface treatment device 100 for improving the performance of electrolytic copper and its component parts is for the convenience of description, and cannot limit the scope of the embodiments. It can be understood that, for those skilled in the art, after understanding the principle of the device, any combination of the components can be made without departing from the principle. In some embodiments, Figure 1 the transmission rollers 110, the processing tank 120, the winding box 130 and the processor disclosed in may be different components in one device, or one component can realize the functions of two or more components described above.

[0037] Figure 2 is an exemplary flowchart of a surface treatment method for improving the performance of electrolytic copper according to some embodiments of the present specification. As shown in Figure 2 , the flow 200 includes the following steps. In some embodiments, the flow 200 can be executed by the processor of the surface treatment device 100 for improving the performance of electrolytic copper. As shown in Figure 2 , the method can include:

[0038] Step 210, obtaining copper foil treatment information.

[0039] The copper foil treatment information refers to information related to the surface treatment of the copper foil. In some embodiments, the copper foil treatment information at least includes process flow information, etc. The process flow information refers to the process information of producing the copper foil, for example, the treatment steps of producing the copper foil, the materials used in each treatment step, the treatment time, etc. Based on the process flow information, the steps or substances that can affect the quality of the copper foil during the treatment process of the copper foil can be determined, so as to target the surface of the copper foil for treatment and ensure the quality of the copper foil.

[0040] The copper foil treatment information can be determined based on a variety of feasible ways.

[0041] In some embodiments, the processor can determine the copper foil treatment information based on a manually preset manner, for example, the processor can determine the copper foil treatment information based on obtaining manual input. In some embodiments, the copper foil treatment information can also be obtained by accessing a professional database containing the copper foil treatment process flow through the network.

[0042] Step 220, controlling a plurality of transmission rollers to convey the copper foil to a treatment tank.

[0043] In some embodiments, the processor can complete the operation of winding and feeding the copper foil into the treatment tank by controlling the cooperative operation of the plurality of transmission rollers and the transmission device. The processor can execute corresponding operations in different working stages of the surface treatment device based on the preset unwinding and winding modes. For example, the processor can control the plurality of transmission rollers to perform unwinding operation on the copper foil which needs to be surface treated, after the unwinding is completed, the surface treatment device starts to clean and dry the surface of the copper foil; for another example, after the surface treatment operation of the surface treatment device on the surface of the copper foil is completed, the winding mode is entered, the processor controls the transmission device and the winding roller system to operate, and the copper foil which has completed the surface treatment is wound and stored in the winding box.

[0044] Step 230, based on a first cleaning parameter, controlling a first cleaning component to clean the copper foil.

[0045] The first cleaning parameter refers to the working parameter of the first cleaning component for cleaning the copper foil.

[0046] In some embodiments, the first cleaning parameter can include a first cleaning intensity and a first cleaning period, etc.

[0047] The first cleaning intensity indicates the intensity of the first cleaning component in cleaning the copper foil. For example, the first cleaning intensity can be represented by a numerical value of 1-10, and the larger the numerical value, the higher the cleaning intensity, which is more suitable for the case where the copper foil surface is more contaminated.

[0048] The first cleaning period refers to the time interval of multiple cleaning operations on the copper foil.

[0049] In some embodiments, the processor can determine the first cleaning parameter of the first cleaning component based on prior experience. For example, at least one set of historical first cleaning parameters with the highest usage frequency is determined based on historical data, and the first cleaning parameter is determined based on the average value of the at least one set of historical first cleaning parameters.

[0050] During the process of treating the copper foil by the surface treatment device, it is necessary to clean the water absorption component of the first cleaning component every certain period of time to ensure the cleaning effect of the first cleaning component on the copper foil. During the cleaning period, the treatment of the copper foil by the surface treatment device will be paused.

[0051] If the first cleaning component works for a long time, too many impurities from the copper foil may be attached to the water absorption component, which reduces the cleaning effect. Frequent pauses in the copper foil treatment process for cleaning the water absorption component may affect the production efficiency of the copper foil, and long-term exposure of the copper foil to the air may increase the risk of oxidation. Therefore, it is necessary to set a reasonable first cleaning period to make the time configuration of the copper foil cleaning and the water absorption component cleaning more reasonable, so as to ensure the production quality without affecting the production efficiency.

[0052] In some embodiments, the processor can also determine a plurality of sets of candidate parameters based on historical production data, each set of candidate parameters including the first cleaning parameter of the first cleaning component and the second cleaning parameter of the second cleaning component, and select a target parameter from the plurality of sets of candidate parameters as the working parameter of the surface treatment device.

[0053] By considering the combined cleaning effect of the first cleaning parameter and the second cleaning parameter on the production of the copper foil, it is beneficial to balance the cleaning demand of the copper foil and the cleaning demand of the water absorption component, and improve the quality of the copper foil production. For more details, please refer to Figure 4 and related descriptions.

[0054] In some embodiments, the processor can control the first distributed water gun of the first cleaning component to flush and clean the surface of the copper foil based on the first cleaning parameter, and control the water absorption component to absorb the residual water or other liquid (such as electroplating liquid) on the surface of the copper foil after the flushing is completed.

[0055] Step 240, control the multiple sets of transmission rollers to convey the copper foil to the winding box.

[0056] In some embodiments, the processor can control the transmission rollers to run, so that the winding rollers convey the treated copper foil in the treatment tank to the winding box.

[0057] Step 250, based on the surface treatment parameters, control the blowing component and / or the drying component to perform surface treatment on the copper foil.

[0058] The surface treatment parameters refer to parameters related to the surface treatment of the copper foil. In some embodiments, the surface treatment parameters can include the wind speed of the blowing component, the temperature of the drying component, etc.

[0059] The surface treatment refers to a treatment process for further processing the surface of the copper foil. In some embodiments, the surface treatment can include steps of impurity cleaning, drying residual moisture on the surface of the copper foil, etc.

[0060] In some embodiments, the processor can determine the surface treatment parameters in various ways. For example, the processor can determine the surface treatment parameters by obtaining the parameter values input by the user; for another example, the processor can determine the surface treatment parameters based on historical production data.

[0061] In some embodiments, the processor can also determine the treatment parameter threshold based on the copper foil treatment information, and determine the surface treatment parameters based on the treatment parameter threshold. More relevant descriptions can be found in the Figure 5 and related descriptions thereof.

[0062] In some embodiments, the processor can perform drying and blowing operations on the surface of the copper foil that has entered the winding box through the drying component and the blowing component. Specifically, the drying component can raise the temperature of the surface of the copper foil through heating to facilitate evaporation of moisture; the blowing component can blow hot air on the surface of the copper foil through the air blower to accelerate the removal of contaminants on the surface of the copper foil.

[0063] In some embodiments of the present specification, the processor controls the orderly cooperation and operation of the components of the surface treatment device, and finally realizes the surface treatment of the electrolytic copper, which improves the automation degree of the device and significantly improves the efficiency and accuracy of the later surface treatment of the copper foil.

[0064] It should be noted that the above description of the process 200 is only for example and illustration, and does not limit the scope of the present specification. Those skilled in the art can make various modifications and changes to the process 200 under the guidance of the present specification. However, these modifications and changes are still within the scope of the present specification.

[0065] Figure 3is an exemplary schematic diagram of cleaning the water absorption component according to some embodiments of the present specification. As shown in Figure 3 The process 300 of cleaning the water absorption component can include the following, as shown.

[0066] In some embodiments, the surface treatment device further comprises a second cleaning component 310, the second cleaning component comprising a second distributed water gun 311; the processor is further configured to control the second cleaning component 310 to clean the water absorption component 212 based on a second cleaning parameter 320.

[0067] The second cleaning component 310 is a component for cleaning the water absorption component 212. In some embodiments, the second cleaning component 310 comprises a second distributed water gun 311.

[0068] In some embodiments, the second cleaning component 310 can be configured in the treatment tank.

[0069] The second distributed water gun 311 is configured to clean the water absorption component 212. In some embodiments, the second distributed water gun 311 can be configured around the water absorption component 212 to clean the water absorption component 212.

[0070] In some embodiments, the processor can control the second distributed water gun of the second cleaning component to flush the water absorption component based on the second cleaning parameter, to remove the pollutants adsorbed by the water absorption component when wiping the copper foil surface residues.

[0071] The second cleaning parameter 320 refers to a parameter related to the cleaning operation of the second cleaning component.

[0072] In some embodiments, the second cleaning parameter 320 can include a second cleaning period, a second cleaning intensity level, etc. The second cleaning period refers to the time interval of the second cleaning component cleaning the water absorption component. The second cleaning intensity refers to data representing the intensity of the second cleaning component cleaning the water absorption component, which can be represented by a preset gear position. The higher the gear position, the greater the cleaning intensity. More details about the distributed pressure unit 312 can be found in the relevant description below.

[0073] In some embodiments, the processor can determine the second cleaning parameter of the second cleaning component based on prior experience. For example, based on historical data, at least one set of historical second cleaning parameters with the highest usage frequency is determined, and the second cleaning parameter is determined based on the average value of the at least one set of historical second cleaning parameters.

[0074] In some embodiments, the second cleaning parameter 320 can be related to the pollution residue feature, the first cleaning feature, and the second component feature.

[0075] The first component feature refers to data representing information related to the first cleaning component. For example, the position, water pressure, water flow rate, and water absorption capacity of the first distributed water gun.

[0076] The second component feature refers to data representing information related to the second cleaning component. For example, the position, water pressure, water flow rate, and water absorption capacity of the second distributed water gun 311, the frequency of extrusion, the applied pressure, and the water discharge rate of the distributed pressure unit. More information about the distributed pressure unit can be found in the relevant description below.

[0077] As described in the relevant description in step 230, the first cleaning component and the second cleaning component work alternately, and therefore, the second cleaning parameter corresponding to the second cleaning component is affected by both the first component feature and the second component feature, and the second cleaning parameter needs to be determined by taking into consideration both types of component features.

[0078] The contamination residue feature refers to data representing the situation of the residual contamination on the copper foil after the previous process. In some embodiments, the contamination residue feature can include the type of contamination and the amount of residual contamination.

[0079] The more types of contamination and the greater the amount of residual contamination on the copper foil, the more likely the contamination will accumulate on the water absorption component. Therefore, when the second cleaning component cleans the water absorption component, the intensity needs to be greater, i.e., the second cleaning cycle needs to be shorter, and the second cleaning intensity needs to be greater.

[0080] In some embodiments, the contamination residue feature can be related to the copper foil processing information.

[0081] In some embodiments, the processor can determine the copper foil contamination residue feature based on the copper foil processing information 410 by vector matching.

[0082] In some embodiments, the processor can perform cluster analysis on the copper foil processing information based on the contamination residue feature in the historical data, group the copper foil processing information corresponding to similar contamination residue features into a category, and determine a standard vector based on the cluster center. The cluster center can represent the type of copper foil processing information, and the corresponding standard vector includes at least one element representing the copper foil processing information, such as the processing steps of the copper foil, the materials used in each processing step, and the processing time.

[0083] Each cluster center has its corresponding standard contamination residue feature, which can be represented by a feature vector. The elements in the feature vector can include at least the type of contamination and the amount of residual contamination.

[0084] The clustering algorithm can include but is not limited to K-Means (K-means) clustering and / or density-based clustering method (DBSCAN), etc. More information about the copper foil processing information can be found in the relevant description below.Figure 2 and related descriptions thereof.

[0085] In some embodiments, the processor can match the to-be-matched vector with the standard vectors, determine the copper foil contaminant residue feature, wherein the to-be-matched vector is constructed based on the current copper foil processing information, and the to-be-matched vector includes at least one element representing the current copper foil processing information. For example, the processor can construct the to-be-matched vector based on the current copper foil processing information, match the to-be-matched vector with the standard vectors, select a standard vector similar to the to-be-matched vector as a target standard vector, and determine the contaminant residue feature corresponding to the to-be-matched vector based on the standard contaminant residue feature corresponding to the target standard vector. The preset condition can be that the similarity is the largest, or the similarity exceeds a preset threshold.

[0086] In some embodiments of the present specification, the copper foil contaminant residue feature is determined based on the copper foil processing information by vector matching, which can refer to historical data when determining the copper foil contaminant residue feature, and more accurately and quickly determine the copper foil contaminant residue feature.

[0087] In some embodiments, the processor can determine the second cleaning parameter 320 based on the copper foil contaminant residue feature, the second cleaning component feature, and the plurality of candidate parameters.

[0088] For more related content, please refer to Figure 4 and related descriptions thereof.

[0089] In some embodiments, the second cleaning component 310 further includes a distributed pressure unit 312 and a humidity sensor 313, and the processor is further configured to control the distributed pressure unit 312 to extrude the water absorption component 212 based on the extrusion parameter in response to the humidity data satisfying a preset humidity condition.

[0090] The distributed pressure unit 312 is configured to extrude the water absorption component 212. In some embodiments, the distributed pressure unit 312 can be configured around the water absorption component 212 to extrude the water absorption component 212.

[0091] In some embodiments, the second cleaning parameter can further include an extrusion parameter of the distributed pressure unit 312.

[0092] The extrusion parameter refers to data related to the extrusion operation of the distributed pressure unit 312. For example, extrusion strength, extrusion frequency, etc.

[0093] In some embodiments, the extrusion parameter can be pre-set by a technician based on prior knowledge or historical experience.

[0094] The humidity sensor 313 is configured to obtain humidity data of the water absorption component 212. In some embodiments, there can be multiple humidity sensors, which can be configured at the first preset positions. The first preset positions refer to positions at different orientations for collecting humidity data of the water absorption component.

[0095] The humidity data refer to data characterizing the water content of the water absorption component 212. The higher the water content of the water absorption component 212, the greater the value of the humidity data.

[0096] In some embodiments, the processor can obtain the humidity data from the temperature sensor 313.

[0097] In some embodiments, in response to the humidity data satisfying a preset humidity condition, the processor can control the distributed pressure unit 312 to press the water absorption component 212 based on the pressing parameter.

[0098] The preset humidity condition refers to the maximum value of the humidity of the water absorption component. In some embodiments, the humidity data satisfying the preset humidity condition can be that the value of the humidity data is greater than the preset humidity condition, which can be preset by the technician based on prior knowledge or historical experience.

[0099] In some embodiments of the present specification, in response to the humidity data satisfying the preset humidity condition, the processor controls the distributed pressure unit to press the water absorption component based on the pressing parameter, which can keep the humidity of the water absorption component within a reasonable range and will not affect the wiping effect of the copper foil.

[0100] In some embodiments of the present specification, the surface treatment device further comprises a second cleaning component, and the processor controls the second cleaning component to clean the water absorption component based on the second cleaning parameter, which can ensure that the cleaning degree of the water absorption component is within a reasonable range and avoid secondary pollution of the water absorption component to the copper foil.

[0101] Figure 4 is a schematic diagram of determining the target parameter according to some embodiments of the present specification. As shown in Figure 4 , the process 400 of determining the target parameter can include the following.

[0102] In some embodiments, the processor can determine the target parameter based on the pollutant residue feature, the first component feature, the second component feature, and the plurality of groups of candidate parameters, the target parameter including the first cleaning parameter and the second cleaning parameter.

[0103] In some embodiments, the candidate parameter includes a first candidate cleaning parameter and a second candidate cleaning parameter. The first candidate cleaning parameter refers to an alternative first cleaning parameter. The second candidate cleaning parameter refers to an alternative second cleaning parameter. For more information about the second cleaning parameter, please refer to the related description in the present specification Figure 3 .

[0104] In some embodiments, the candidate parameters can be pre-set based on prior experience. For example, a plurality of groups of first candidate cleaning parameters and a plurality of groups of second candidate cleaning parameters with the highest usage frequency are determined based on historical production data, and the plurality of groups of first candidate cleaning parameters and the plurality of groups of second candidate cleaning parameters are randomly combined to obtain a plurality of groups of candidate parameters.

[0105] The contaminant residue feature refers to data about the situation of the residual contaminants on the copper foil. For example, the contaminant residue feature can include the type of the contaminants, the amount of the residual contaminants, etc.

[0106] In some embodiments, the contaminant residue feature can be obtained based on the copper foil processing information through vector matching. More details can be found in the related description in Figure 3 .

[0107] The first component feature refers to a feature related to the first cleaning component 121. In some embodiments, the first component feature can include the position of the distributed water gun, the water pressure, the water output, and the water suction capacity of the water suction component, etc.

[0108] In some embodiments, the first component feature 420 can be determined by obtaining manual input. The content of the manual input can include relevant information of each component of the first cleaning component, such as the position of the distributed water gun, the water pressure, the water output, and the water suction capacity of the water suction component, etc.

[0109] In some embodiments, the processor can determine the target parameter from the candidate parameters based on a preset rule. For example, the preset rule can be to prioritize the working time length of the first cleaning component, and then the candidate parameter with the shortest first cleaning period can be determined as the target parameter. For another example, the preset rule can be to prioritize the working time length of the second cleaning component, and then the candidate parameter with the shortest second cleaning period can be determined as the target parameter.

[0110] In some embodiments, the processor can determine the estimated cleaning effect 450-1 and the estimated cleaning time 450-2 of the candidate parameter based on the contaminant residue feature 410, the first component feature 420, the second component feature 430, and the candidate parameter 440, and determine the candidate parameter that meets the selection condition in terms of the estimated cleaning effect and the estimated cleaning time as the target parameter 460.

[0111] The estimated cleaning effect refers to the degree of the cleaning result on the surface of the copper foil. In some embodiments, the cleaning effect can be determined based on whether there is residual moisture, contaminants, etc. after cleaning, and the amount of the residual moisture and / or contaminants, for example, the more the amount of the residual moisture and / or contaminants, the worse the cleaning effect.

[0112] The estimated cleaning time can represent a time required to clean the copper foil to meet a requirement.

[0113] In some embodiments, the estimated cleaning time 450-1 and the cleaning effect 450-2 can be determined based on a first prediction model.

[0114] In some embodiments, the first prediction model can be a machine learning model. For example, the first prediction model can be any one or a combination of a Deep Neural Networks (DNN), a Convolutional Neural Network (CNN), or other custom model structures, etc.

[0115] In some embodiments, the input of the first prediction model includes the copper foil contaminant residue feature, the first component feature, the second component feature, and the candidate cleaning parameter. In some embodiments, the output of the first prediction model includes the estimated cleaning effect and the estimated cleaning time. The descriptions of the copper foil contaminant residue feature, the second component feature, the second cleaning parameter, etc. can be referred to the related descriptions in the present specification. Figure 3

[0116] In some embodiments, the first prediction model can be trained based on a large number of first training samples with first labels. A loss function is constructed based on the first labels and the prediction results of an initial first prediction model, and the initial first prediction model is iteratively updated based on the loss function. The training is completed when the loss function of the initial first prediction model meets a preset condition, which can be that the loss function converges, the number of iterations reaches a threshold, etc.

[0117] In some embodiments, the first training sample can include a sample copper foil contaminant residue feature, a sample first component feature, a sample second component feature, and a sample cleaning parameter. The first training sample can be obtained based on historical operation data of a plurality of cleaning operations. The first label can be an actual cleaning effect and an actual cleaning time spent during a cleaning operation based on the sample cleaning parameter.

[0118] In some embodiments of the present specification, the cleaning effect and the estimated cleaning time are determined by the first prediction model, so that the prediction results are closer to the actual situation, and the reliability of the cleaning effect and the estimated cleaning time is improved. At the same time, the first prediction model can significantly improve the data processing efficiency.

[0119] In some embodiments, based on the cleaning effect and the estimated cleaning time, a weighted score method can be used to obtain an evaluation value of the candidate parameter. According to the size of the evaluation value, the target parameter can be determined.

[0120] ​For example, the evaluation value = k1*cleaning effect + k2 / estimated cleaning time, and the candidate parameter group corresponding to the highest evaluation value is taken as the target parameter. Wherein, k1 and k2 are evaluation coefficients, which can be determined according to actual needs. For example, if the service life of the copper foil is required to be as long as possible, k1 is appropriately increased; if the copper foil is required to be put into use as soon as possible, k2 is appropriately increased.

[0121] Figure 5 is an exemplary schematic diagram of determining surface treatment parameters according to some embodiments of the present specification. As shown in Figure 5 The process 500 of determining surface treatment parameters can include the following.

[0122] In some embodiments, the processor can also determine a treatment parameter threshold 510 based on the copper foil treatment information 510, and determine the surface treatment parameters 550 based on the treatment parameter threshold 510.

[0123] The treatment parameter threshold 510 refers to a threshold of the surface treatment parameters. The threshold of the surface treatment parameters can include a maximum value and / or a minimum value of the surface treatment parameters. In some embodiments, the treatment parameter threshold can include a blowing intensity threshold and / or a drying intensity threshold.

[0124] The blowing intensity threshold refers to a threshold of the blowing intensity when the blowing component blows the copper foil. The threshold of the blowing intensity can include a maximum value and / or a minimum value of the blowing intensity. The blowing intensity can include blowing force, blowing temperature, etc. When blowing the copper foil, the blowing intensity cannot be greater than the maximum value of the blowing intensity threshold, so as to avoid copper foil deformation due to excessive blowing force, or copper foil oxidation, denaturation, etc. due to excessive blowing temperature; the blowing intensity cannot be less than the minimum value of the blowing intensity threshold, so as to avoid affecting the blowing effect due to insufficient blowing force.

[0125] The blowing force refers to data representing the blowing force of the blowing component, which can be represented by a preset gear. The higher the gear, the greater the blowing force.

[0126] The blowing temperature refers to the temperature used by the blowing component when blowing.

[0127] The drying intensity threshold refers to a maximum value of the drying intensity when the drying component dries the copper foil. When drying the copper foil, the drying intensity cannot be greater than the drying intensity threshold, so as to avoid copper foil oxidation, denaturation, etc. due to excessive drying temperature. The drying intensity can include drying temperature, etc.

[0128] The drying temperature refers to the temperature used by the drying component when drying.

[0129] In some embodiments, the treatment parameter threshold can be determined based on prior knowledge or historical experience.

[0130] In some embodiments, the surface treatment parameter can be determined in various ways. For example, the processor can determine the surface treatment parameter based on historical production data. For example, the processor can determine at least one historical surface treatment parameter with a frequency of use exceeding a preset number of times from the historical production data, and determine an average parameter value of the at least one historical surface treatment parameter, and determine the surface treatment parameter based on the average parameter value.

[0131] In some embodiments, the surface treatment parameter 550 is also related to the estimated cleaning effect 530, and the processor can determine the surface treatment parameter 550 based on the treatment parameter threshold 520 and the cleaning effect 530.

[0132] The estimated cleaning effect 530 is estimated data representing the effect of cleaning the copper foil. In some embodiments, the cleaning effect can be determined by a first prediction model, and the relevant description can be found in the section Figure 4 and the related description therein.

[0133] In some embodiments, the blowing intensity threshold is related to the estimated cleaning effect 530. If the estimated cleaning effect is poor, it means that there is more residual moisture on the copper foil after cleaning, and stronger blowing intensity is needed to evaporate or separate the residual moisture from the copper foil, so a larger blowing intensity threshold needs to be set. Similarly, if the cleaning effect is poor, there is more residual moisture, so a larger drying intensity is needed, so a larger drying intensity threshold needs to be set.

[0134] In some embodiments of the present specification, since the cleaning effect of the copper foil will affect the effect of surface treatment, for example, if there is more residual moisture on the surface of the copper foil and the blowing intensity is not enough, the surface of the copper foil will still have residual moisture, so determining the surface treatment parameter based on the treatment parameter threshold and the cleaning effect can obtain a more reasonable surface treatment parameter, and thus obtain a better surface treatment effect.

[0135] In some embodiments, the processor can determine the surface treatment parameter 550 based on the treatment parameter threshold 520 and the cleaning effect 530 through a preset algorithm 540.

[0136] The preset algorithm 540 refers to an algorithm for determining the surface treatment parameter. In some embodiments, the preset algorithm 540 can include the following steps:

[0137] S1: Encode based on the treatment parameter 520.

[0138] In some embodiments, the processor can encode the blowing intensity and the baking intensity. For example, the processor can encode the blowing intensity in the surface treatment parameter as A, and if the blowing temperature included in the blowing intensity is numbered as e, the encoding of the blowing temperature can be Ae, indicating the blowing temperature in the blowing intensity A. For another example, the processor can encode the baking intensity in the surface treatment parameter as B, and if the baking temperature included in the baking intensity is numbered as c, the encoding of the baking temperature can be Bc, indicating the baking temperature in the baking intensity B.

[0139] S2: Randomly generate a plurality of initial production schemes based on the foregoing encoding.

[0140] The initial production scheme can refer to a scheme preliminarily determined to contain surface treatment parameters. The initial production scheme can contain a plurality of initial parameters.

[0141] In some embodiments, the initial production scheme can be represented by a vector. The elements in the vector represent the respective parameters in the surface treatment parameters, and the values of the elements represent the numerical values of the respective parameters in the surface treatment parameters. Among them, the elements in the vector at least include the blowing intensity and the baking intensity. The numerical value of the blowing intensity can be determined based on the blowing intensity threshold, and the numerical value of the baking intensity can be determined based on the baking intensity threshold.

[0142] For example, a certain initial production scheme can be (Ae, Bc), and the initial parameters in the initial production scheme can be Ae and Bc respectively, Ae indicating the blowing temperature e in the blowing intensity A, and Bc indicating the baking temperature c in the baking intensity B. Among them, the blowing temperature e can be any numerical value within the blowing intensity threshold range, and the baking temperature c can be any numerical value within the baking intensity threshold range.

[0143] S3: Determine the fitness value.

[0144] The fitness value refers to a parameter for evaluating the rationality of the initial scheme, and the fitness value is positively correlated with the rationality of the production scheme. The more reasonable the production scheme is, the more likely the surface treatment parameters contained in the production scheme are to be used as the final parameters for production.

[0145] In some embodiments, the processor can predict the surface treatment effect corresponding to each production scheme based on the blowing intensity value and the baking intensity value in the production scheme, and take the corresponding surface treatment effect as the fitness value of each production scheme. For example, the processor can predict the surface treatment effect based on the parameter value in the initial scheme, and determine the corresponding fitness value. For example, the numerical value of the surface treatment effect can be taken as the fitness, and the larger the numerical value is, the stronger the fitness is.

[0146] The surface treatment effect can be determined based on the cleaning effect of the first cleaning component and the surface treatment parameters in the initial production plan by a second prediction model. More details about the second prediction model will be described later.

[0147] S4: screening the initial production plans to determine at least one first candidate production plan.

[0148] In some embodiments, for each of the plurality of initial production plans, the processor can determine a selection parameter of the initial production plan based on the fitness value corresponding to the initial production plan, the selection parameter being used to represent the initial probability of the initial production plan being determined as the first candidate production plan, and the selection parameter of the initial production plan being positively correlated with the fitness value corresponding thereto. For example, the processor can determine the selection parameter of the initial production plan based on the ratio of the fitness value corresponding to the initial production plan to the sum of the fitness values of all the initial production plans.

[0149] In some embodiments, the processor can determine a plurality of first candidate production plans from the plurality of initial production plans based on the selection parameter corresponding to each of the plurality of initial production plans. For example, the initial production plan with the selection parameter greater than a preset selection parameter threshold can be determined as the first candidate production plan.

[0150] S5: processing the plurality of first candidate production plans based on a preset rule to obtain a second candidate production plan and a third candidate production plan.

[0151] In some embodiments, the preset rule can include a first transformation and a second transformation, the first transformation being to exchange the parameters corresponding to the same element in the plurality of different first candidate production plans, and the second transformation being to adjust the numerical value corresponding to an element in the first candidate production plan.

[0152] In some embodiments, the processor can perform a first exchange on the plurality of first candidate production plans to generate a plurality of second candidate production plans. For example, the first candidate production plan 1 is (Ae1, Bc1) and the first candidate production plan 2 is (Ae2, Bc2), the parameters corresponding to the first element in the first candidate production plan 1 and the parameters corresponding to the second element in the first candidate production plan 2 can be exchanged respectively to generate the second candidate production plan (Ae1, Bc2) and / or (Ae2, Bc1).

[0153] In some embodiments, the processor can perform a second transformation on the plurality of second candidate production schemes to generate a plurality of third candidate production schemes. For example, the first candidate production scheme 1 is (Ae1, Bc1), and the second candidate production scheme is generated by adjusting the second element pair in the first candidate production scheme 1, i.e., modifying Bc1 to Bc3, and the new second candidate production scheme generated after modification is (Ae1, Bc3).

[0154] In some embodiments, the processor can perform a transformation on a part of the plurality of second candidate production schemes to generate a plurality of third candidate production schemes. For example, 5% of the total number of second candidate production schemes are randomly selected for transformation.

[0155] S6: Eliminate the initial production scheme that is not ideal.

[0156] In some embodiments, the processor can sort the initial production schemes in descending order of fitness, eliminate the initial production schemes with a fitness ranking lower than a preset ranking, and replace the eliminated initial production schemes with the second candidate production schemes and the third candidate production schemes to form a new production scheme set, and perform the next round of transformation according to the new production scheme set.

[0157] S7: Repeat S3-S6 to continue the iterative transformation until the end condition is met, and determine the production scheme with the largest fitness value as the target production scheme.

[0158] In some embodiments, the end condition can include at least one of the number of iterative updates reaching a preset number threshold, the fitness value reaching a fitness threshold, and the difference between the fitness values before and after two consecutive iterations being less than a preset difference threshold. The preset condition can be preset by the user.

[0159] In some embodiments of the present specification, the initial production scheme is processed through multiple iterative updates to determine a plurality of surface treatment parameters, and the best surface treatment parameter is selected, which is beneficial to obtain a better surface treatment effect of the copper foil.

[0160] In some embodiments, the processor can predict the processing effect corresponding to the surface treatment parameter through a second prediction model.

[0161] The processing effect refers to data representing the effect of surface treatment of the copper foil, and the effect of surface treatment can include whether the copper foil surface still has residual moisture and / or contaminants.

[0162] In some embodiments, the second prediction model can be a machine learning model. For example, the prediction model can include any one or combination of a Convolutional Neural Networks (CNN) model, a Neural Networks (NN) model, or other custom model structure.

[0163] In some embodiments, the input of the second prediction model can include the surface treatment parameter and the cleaning effect corresponding to the surface treatment parameter, and the output can include the surface treatment effect. The cleaning effect refers to the residual moisture content and the residual amount of pollutants on the surface of the copper foil after the copper foil is cleaned by the second cleaning component, and the surface treatment effect refers to whether there is residual moisture and / or pollutants on the surface of the copper foil after the copper foil is blown and dried. More description about the cleaning effect can be found in Figure 2 and the related description.

[0164] In some embodiments, the prediction model can be trained based on a large number of first training samples with first labels. The first training sample can be a sample surface treatment parameter and a sample cleaning effect corresponding to the sample surface treatment parameter, and the first label of the first training sample can be the surface treatment effect. In some embodiments, the first training sample can be obtained based on historical data, and the first label can be the actual surface treatment effect of the copper foil after the copper foil is surface treated based on the historical surface treatment parameter and the historical cleaning effect.

[0165] In some embodiments, the prediction model can be trained by: inputting a plurality of first training samples with first labels into an initial second prediction model, constructing a loss function based on the first labels and the prediction results of the initial second prediction model, updating the initial second prediction model based on the iteration of the loss function, and completing the training when the loss function of the initial second prediction model meets a preset condition. The preset condition can be that the loss function converges, the number of iterations reaches a set value, etc.

[0166] In some embodiments, by predicting the treatment effect corresponding to the surface treatment parameter through the second prediction model, the treatment effect corresponding to the surface treatment parameter can be more accurately predicted, which is conducive to improving the accuracy of determining the surface treatment parameter through the preset algorithm.

[0167] In some embodiments of the present specification, the processing parameter threshold is determined based on the copper foil processing information, and the surface treatment parameter is determined based on the processing parameter threshold. Based on the actual processing condition of the copper foil, a more reasonable surface treatment parameter can be determined, and thus the surface treatment effect of the copper foil is better.

[0168] Having now described the basic concept, it will be apparent to those skilled in the art that many modifications, adaptations, and variations of the specific embodiments described can be used, and that equivalents can be substituted, without departing from the true spirit and scope of the disclosure. Accordingly, the disclosure is intended to embrace all such alternatives, modifications, and variations as fall within the scope of the disclosure, including the scope of the appended claims, presented in part by the following claims.

[0169] Also, the use of "a" or "an" to describe elements of the disclosure is intended to be broad and include one or more elements unless otherwise indicated. Similarly, the use of "adapted to" or "configured to" herein is intended to convey that the element is capable of being so adapted or configured unless otherwise indicated. Also, the use of "based on" is intended to convey that the element is based on at least one of the values or conditions indicated unless otherwise indicated.

[0170] In addition, the order of presentation of the processing elements and sequences described in this specification is intended to be an example only and is not intended to be a limitation of the scope of the processes and methods described in this specification. Although the above disclosure discusses some presently preferred embodiments of the application, it is to be understood that the details disclosed herein are merely examples of embodiments of the application and that the claims are intended to cover all modifications and equivalents that fall within the spirit and scope of the application. For example, although the system components described above can be implemented by hardware devices, they can also be implemented by software solutions only, such as installing the described system on an existing server or mobile device.

[0171] Similarly, it is to be noticed that the term "comprising" or "comprises", when used in this specification, is taken to specify the presence of stated features, integers, steps, or components, but does not preclude the presence or addition of one or more other features, integers, steps, components, or groups thereof. It is also to be understood that the word "a" or "an" when used in the context of this specification

[0172] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of range in some embodiments of this specification are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0173] For each patent, patent application, patent application publication, and other material, such as articles, books, specifications, publications, and documents, referenced in this specification, the entire contents of which are incorporated herein by reference. This excludes historical application documents that are inconsistent with or conflict with the content of this specification, as well as documents that limit the broadest scope of the claims in this specification (currently or subsequently appended to this specification). It should be noted that in the event of any inconsistency or conflict between the descriptions, definitions, and / or terminology used in the supplementary materials to this specification and the content of this specification, the descriptions, definitions, and / or terminology used in this specification shall prevail.

[0174] Finally, it should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments described herein. Other variations may also fall within the scope of this specification. Therefore, alternative configurations of the embodiments described herein are intended to be illustrative rather than limiting, and should be considered consistent with the teachings of this specification. Accordingly, the embodiments described herein are not limited to those explicitly introduced and described herein.

Claims

1. A surface treatment device for improving the performance of electrolytic copper, characterized by, The surface treatment device comprises a plurality of sets of transmission rollers, a treatment tank, a winding box and a processor; The plurality of sets of transmission rollers comprise winding rollers and unwinding rollers, and are connected through a transmission device and configured to wind or unwind the copper foil; The treatment tank is configured to treat the surface of the copper foil, and is provided with a first cleaning component and a second cleaning component, the first cleaning component comprises a first distributed water gun and a water absorption component, the first distributed water gun is configured to wash the copper foil, and the water absorption component is configured to wipe the washed copper foil, the second cleaning component comprises a second distributed water gun, and the second distributed water gun is configured to clean the water absorption component; The winding box is configured to place the wound copper foil, and is provided with a blowing component and a drying component; The processor is configured to: obtain copper foil treatment information, the copper foil treatment information comprising process flow information; control the plurality of sets of transmission rollers to convey the copper foil to the treatment tank; based on the first cleaning parameters, control the first cleaning component to clean the copper foil, the first cleaning parameters comprising first cleaning intensity and first cleaning period, the first cleaning period referring to the time interval of multiple cleaning operations on the copper foil; control the plurality of sets of transmission rollers to convey the copper foil to the winding box; based on the surface treatment parameters, control the blowing component and / or the drying component to perform surface treatment on the copper foil, the surface treatment parameters comprising blowing parameters and / or drying parameters; and, based on the second cleaning parameters, control the second cleaning component to clean the water absorption component, the second cleaning parameters comprising second cleaning period and second cleaning intensity, the second cleaning period referring to the time interval of the second cleaning component cleaning the water absorption component, the first cleaning component and the second cleaning component working alternately, the second cleaning parameters related to the pollution residue characteristics of the copper foil, the first component characteristics of the first cleaning component and the second component characteristics of the second cleaning component, the pollution residue characteristics determined by vector matching based on the copper foil treatment information.

2. The surface treatment apparatus for improving the performance of electrolytic copper according to claim 1, wherein The second cleaning component further comprises a distributed pressure unit and a humidity sensor, and the humidity sensor is configured to obtain humidity data of the water absorption component; The second cleaning parameters further comprise extrusion parameters of the distributed pressure unit; The processor is further configured to: in response to the humidity data satisfying a preset humidity condition, control the distributed pressure unit to extrude the water absorption component based on the extrusion parameters.

3. The surface treatment apparatus for improving the performance of electrolytic copper according to claim 1, wherein The processor is further configured to: based on the pollution residue characteristics, the first component characteristics, the second component characteristics and a plurality of candidate parameters, determine the estimated cleaning effect and the estimated cleaning time of each candidate parameter through a first prediction model; and, based on the estimated cleaning effect and the estimated cleaning time of each candidate parameter, determine the evaluation value of each candidate parameter through weighted scoring; based on the evaluation value, determine the target parameters; wherein, The candidate parameters include a first candidate cleaning parameter and a second candidate cleaning parameter; and the target parameters include the first cleaning parameter and the second cleaning parameter.

4. The surface treatment apparatus for improving the performance of electrolytic copper according to claim 1, wherein The processor is further configured to: determine a processing parameter threshold based on the copper foil processing information, the processing parameter threshold including a blowing intensity threshold and / or a drying intensity threshold; determine the surface processing parameter based on the processing parameter threshold.

5. A surface treatment method for improving the properties of electrolytic copper, characterized by, The method is performed by a processor and includes: obtaining copper foil processing information, the copper foil processing information including process flow information; controlling a plurality of transmission rollers to convey the copper foil to a processing tank; controlling a first cleaning component to clean the copper foil based on a first cleaning parameter, the first cleaning component being disposed at the processing tank, the first cleaning component including a first distributed water gun and a water absorption component, the first distributed water gun being configured to wash the copper foil, the water absorption component being configured to wipe the copper foil after washing, the first cleaning parameter including a first cleaning intensity and a first cleaning period, the first cleaning period indicating a time interval for multiple cleaning operations on the copper foil; controlling the plurality of transmission rollers to convey the copper foil to a winding box; controlling a blowing component and / or a drying component to perform surface processing on the copper foil based on a surface processing parameter, the surface processing parameter including a blowing parameter and / or a drying parameter; and controlling a second cleaning component to clean the water absorption component based on a second cleaning parameter, the second cleaning component being disposed at the processing tank, the second cleaning component including a second distributed water gun, the second distributed water gun being configured to wash the water absorption component, the second cleaning parameter including a second cleaning period and a second cleaning intensity, the second cleaning period indicating a time interval for the second cleaning component to wash the water absorption component, the first cleaning component and the second cleaning component working alternately, the second cleaning parameter being related to a pollution residue feature of the copper foil, a first component feature of the first cleaning component, and a second component feature of the second cleaning component, the pollution residue feature being determined based on the copper foil processing information through vector matching.

6. The surface treatment method for improving the performance of electrolytic copper according to claim 5, characterized by, The second cleaning component further includes a distributed pressure unit and a humidity sensor, and the second cleaning parameter further includes a pressing parameter of the distributed pressure unit; the method further includes: obtaining humidity data of the water absorption component from the humidity sensor; in response to the humidity data satisfying a preset humidity condition, controlling the distributed pressure unit to press the water absorption component based on the pressing parameter.

7. The surface treatment method for improving the performance of electrolytic copper according to claim 5, wherein The method further includes: determining, based on the pollution residue feature, the first component feature, the second component feature, and a plurality of candidate parameters, an estimated cleaning effect and an estimated cleaning time of each candidate parameter through a first prediction model; and determining, based on the estimated cleaning effect and the estimated cleaning time of each candidate parameter, an evaluation value of each candidate parameter through weighted scoring; determining a target parameter based on the evaluation value; and The each set of candidate parameters includes a first candidate cleaning parameter and a second candidate cleaning parameter; and the target parameter includes the first cleaning parameter and the second cleaning parameter.

8. The surface treatment method for improving the performance of electrolytic copper according to claim 5, wherein The method further includes: determining a processing parameter threshold value based on the copper foil processing information, the processing parameter threshold value including a blowing intensity threshold value and / or a drying intensity threshold value; determining the surface processing parameter based on the processing parameter threshold value.

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