Hot press forming die and amorphous alloy micro-fluidic core hot press forming device

Abstract

The application belongs to the technical equipment field of amorphous alloys, and particularly relates to a hot-pressing forming die and an amorphous alloy micro-fluidic mold core hot-pressing forming device. The hot-pressing forming die comprises a heating structure and a mold pressing structure. The heating structure comprises a fixed heat insulation support and a heating block arranged on the heat insulation support. The mold pressing structure comprises an upper pressing head, a lower pressing head below the upper pressing head, a flow limiting mold base connected with the lower pressing head, and a mold plate in the flow limiting mold base. The heating block is between the upper pressing head and the lower pressing head, and the upper pressing head and the lower pressing head are both slidingly arranged relative to the heating block. A target object is stacked on the mold plate. The upper pressing head moves downward and presses the heating block, and the lower pressing head moves upward and makes the target object abut against the heating block, so that the heat of the heating block is conducted to the target object, and the target object replicates the micro-nano structure of the mold plate under the action of the lower pressing head. The micro-nano structure on the mold plate can be integrally and one-time replicated on the amorphous alloy, and the hot-pressing efficiency of the amorphous alloy is improved.

Description

Technical Field

[0001] This invention belongs to the field of amorphous alloy technology and equipment, and particularly relates to hot pressing molds and amorphous alloy microfluidic mold core hot pressing device. Background Technology

[0002] A microfluidic chip is a miniaturized experimental platform used to control, manipulate, and analyze liquid or gas samples at the microscale. Due to its numerous advantages, including miniaturization, automation, high throughput, rapid analysis, and low cost, microfluidic chips are widely used in biomedical research, drug screening, gene analysis, environmental monitoring, single-cell analysis, protein detection, DNA sequencing, cell culture, and drug delivery, providing a powerful tool and technological platform for scientific research and clinical diagnosis.

[0003] Currently, microfluidic chips are made of materials including glass, polymers, and silicon. The appropriate material is selected based on the application scenario and requirements. Among the microfluidic chips currently on the market, polymer microfluidic chips have the widest range of applications and the lowest cost. Therefore, high-quality, high-precision polymer microfluidic chips with high processing limits are of great significance for in vitro real-time detection, scientific research, and rapid detection.

[0004] However, the main production methods for polymer microfluidic chips today are injection molding, die-cutting, and roll printing. Regardless of the method, a key component—the mold core—is required. The main idea behind these production methods is to replicate the micro-nano structures on the mold core onto the polymer material. Therefore, the quality of the mold core determines the performance, quality, and application range of the microfluidic chip. Currently, the microstructure scale of microfluidic chip mold cores is mainly concentrated above 50 micrometers. Furthermore, as the microstructure scale continues to decrease, the processing difficulty increases, and the precision and surface quality continuously deteriorate. Traditional microfluidic chip mold core processing methods include mechanical milling, electrical discharge machining (EDM), and laser processing. These traditional methods are completed step-by-step from point to line to surface, resulting in low processing efficiency and reliance on high-precision machining centers. Summary of the Invention

[0005] The purpose of this application is to provide a hot-press molding die, which aims to solve the problem of how to improve the preparation efficiency of the mold core.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0007] In a first aspect, a hot pressing mold is provided, comprising:

[0008] The heating structure includes a fixedly mounted heat-insulating bracket and a heating block mounted on the heat-insulating bracket; and

[0009] A molding structure includes an upper pressure head, a lower pressure head located below the upper pressure head, a flow-limiting mold base connected to the lower pressure head, and a template located within the flow-limiting mold base. The heating block is located between the upper pressure head and the lower pressure head, and both the upper pressure head and the lower pressure head are slidably disposed relative to the heating block. The target object is stacked on the template.

[0010] The upper pressure head moves downward and presses against the heating block, while the lower pressure head moves upward and brings the target object against the heating block, so that the heat from the heating block is conducted to the target object. Under the action of the lower pressure head, the target object replicates the micro-nano structure of the template.

[0011] In some embodiments, the flow-limiting mold base has a molding cavity with an opening, the template is placed in the molding cavity, and the target object is at least partially located in the molding cavity.

[0012] In some embodiments, the heating structure further includes a first reinforcing plate located within the molding cavity and a second reinforcing plate disposed opposite to the first reinforcing plate, wherein the template and the amorphous alloy are located between the first reinforcing plate and the second reinforcing plate, and the amorphous alloy is completely located within the molding cavity.

[0013] In some embodiments, the heating structure further includes a heat insulation block located above the heating block and for the upper pressure head to abut against.

[0014] In some embodiments, the heat insulation block has a heat insulation cavity, the area defined by the heat insulation cavity completely covers the heating block in the vertical direction, and the upper pressure head abuts against the center of the heat insulation cavity.

[0015] In some embodiments, the heat insulation bracket includes two elastic members with elastic restoring force and two fixed side plates arranged opposite each other. The two elastic members are respectively located on the two fixed side plates, and the two ends of the heating block are respectively connected to the two fixed side plates. The elastic members are located between the fixed side plates and the heating block, and the heating block compresses the elastic members downward.

[0016] In some embodiments, the hot pressing mold further includes a self-balancing structure disposed on the lower pressure head, the flow-limiting mold base being connected to the self-balancing structure, and the self-balancing structure being used to make the force of the lower pressure head perpendicular to the surface of the mold plate.

[0017] In some embodiments, the self-balancing structure includes a balancing seat and a balancing ball head. The balancing seat has a positioning cavity with a spherical wall. One end of the balancing ball head is located inside the positioning cavity, and the shape of the balancing ball head is adapted to the shape of the positioning cavity. The flow-limiting mold base is connected to the balancing ball head.

[0018] In some embodiments, the hot pressing mold further includes a heat insulation plate disposed on the balance ball head, and the flow limiting mold base is connected to the heat insulation plate.

[0019] In a second aspect, an amorphous alloy microfluidic mold core hot pressing forming apparatus is provided, which includes the hot pressing forming mold.

[0020] The beneficial effects of this application are as follows: the hot pressing mold includes a heating structure and a pressing structure. The upper and lower pressure heads move towards the heating block at the same time, so that the heat of the heating block is transferred to the amorphous alloy. At the same time, the upper and lower pressure heads press against each other, so that the micro-nano structure on the template is copied onto the amorphous alloy in one go, which improves the hot pressing efficiency of the amorphous alloy and ultimately improves the processing efficiency of the mold core. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or exemplary technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a three-dimensional structural schematic diagram of the hot pressing molding die provided in the embodiments of this application;

[0023] Figure 2 yes Figure 1 An exploded view of a hot press molding die;

[0024] Figure 3 yes Figure 1 A cross-sectional schematic diagram of a hot pressing mold;

[0025] Figure 4 yes Figure 3 A magnified view of a portion at point A.

[0026] The following are the labeling elements in the figure:

[0027] 100. Hot pressing mold; 110. Molding structure; 101. Upper pressure head; 102. Lower pressure head; 104. Flow limiting mold base; 300. Heating structure; 301. Heating block; 302. Heat insulation bracket; 200. Self-balancing structure; 303. First reinforcing plate; 304. Second reinforcing plate; 3021. Fixed side plate; 3022. Fixed base plate; 3023. Clearance hole; 203. Heat insulation plate; 307. Thermocouple; 1041. Molding cavity; 500. Amorphous alloy; 305. Template; 201. Balance base; 202. Balance ball head; 204. Positioning cavity; 306. Heat insulation block; Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the scope of this application.

[0029] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly or indirectly attached to that other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," etc., indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, and are for ease of description only, not to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0030] Please see Figures 1 to 3This application provides a hot-pressing mold 100 capable of hot-pressing amorphous alloy 500 to replicate micro / nano structures on the amorphous alloy 500. The micro / nano structures refer to microstructures with micrometer-level and / or nanometer-level dimensions. Amorphous alloy 500, also known as metallic glass, is a novel metallic material in which atoms lose long-range order in three-dimensional space while maintaining short-range order. Due to its unique physical, chemical, and mechanical properties, it has attracted widespread attention in science and industry. Below the glass transition temperature (generally 400-500 degrees Celsius), amorphous alloy 500 exhibits excellent mechanical, physical, and chemical properties, fully meeting the requirements for use as a material for microfluidic chip mold cores. Simultaneously, it possesses unique thermoplasticity; after reaching the glass transition temperature, the hardness of amorphous alloy 500 decreases, resulting in superior molding capabilities. In this embodiment, the amorphous alloy 500 is plate-shaped. By processing micro-nano structures on the amorphous alloy 500, the amorphous alloy 500 is processed into a mold core.

[0031] Please see Figures 2 to 4 The hot pressing mold 100 includes a heating structure 300 and a molding structure 110. The heating structure 300 includes a fixedly mounted heat-insulating bracket 302 and a heating block 301 mounted on the heat-insulating bracket 302. The heating block 301, in a conductive state, generates heat, thereby softening the amorphous alloy 500 and bringing its temperature to its glass softening temperature. The heat-insulating bracket 302 has a hollow structure and is used to support and position the heating block 301.

[0032] Please see Figures 2 to 4 The molding structure 110 includes an upper pressure head 101, a lower pressure head 102 located below the upper pressure head 101, a flow-limiting mold base 104 connected to the lower pressure head 102, and a template 305 located within the flow-limiting mold base 104. A heating block 301 is located between the upper pressure head 101 and the lower pressure head 102, and the flow-limiting mold base 104 is located below the heating block 301. Both the upper pressure head 101 and the lower pressure head 102 are slidably disposed relative to the heating block 301, meaning that both the upper pressure head 101 and the lower pressure head 102 can reciprocate vertically under the drive of an external force. The target object is stacked on top of the template 305.

[0033] In this embodiment, the target object is amorphous alloy 500. The upper pressure head 101 moves downward and presses against the heating block 301, while the lower pressure head 102 moves upward and brings the target object against the heating block 301, so that the heat from the heating block 301 is conducted to the target object. Under the action of the lower pressure head 102, the target object replicates the micro / nano structure of the template 305. It can be understood that the upper pressure head 101 moves towards and against the heating block 301 to restrict the movement of the heating block 301 in a vertically upward direction, and the lower pressure head 102 moves towards the heating block 301 to move the flow-limiting mold base 104 to the heating block 301, bringing the amorphous alloy 500 against the heating block 301.

[0034] Please see Figures 2 to 4 The hot pressing mold 100 provided in this application includes a heating structure 300 and a molding structure 110. The upper pressure head 101 and the lower pressure head 102 move toward the heating block 301 at the same time, so that the heat of the heating block 301 is transferred to the amorphous alloy 500. At the same time, the upper pressure head 101 and the lower pressure head 102 press against each other, so that the micro-nano structure on the template 305 is copied onto the amorphous alloy 500 in one go, thereby improving the hot pressing efficiency of the amorphous alloy 500.

[0035] Please see Figures 2 to 4 It is understandable that the separation of the amorphous alloy 500 and the heating block 301 ensures that the amorphous alloy 500 is only heated when in contact with the heating block 301. After the amorphous alloy 500 detaches from the heating block 301, it is not heated, thus controlling the amount of heat applied to the amorphous alloy 500 and preventing overheating and crystallization oxidation, thereby improving the hot pressing accuracy. Furthermore, after hot pressing, the amorphous alloy 500 detaches from the heating block 301, preventing crystallization oxidation of the micro / nano structures processed on it, improving the hot pressing quality. This allows for the processing of microfluidic chip molds at the sub-twenty-micrometer level, and even the sub-hundred-nanometer level, while also avoiding defects such as tool marks and melting, resulting in high surface quality and high dimensional accuracy.

[0036] Optionally, the flow-limiting mold base 104 is made of mold steel. Mold steel is a type of steel used to manufacture molds (or models). It has specific mechanical properties and chemical composition to meet the requirements of mold manufacturing. Mold steel typically needs to possess properties such as high strength, hardness, wear resistance, corrosion resistance, and fatigue resistance.

[0037] Please see Figures 2 to 4 In some embodiments, the flow-limiting mold base 104 has an open molding cavity 1041, the template 305 is placed in the molding cavity 1041, and the amorphous alloy 500 is at least partially located in the molding cavity 1041.

[0038] Optionally, the template 305, made of silicon, can be positioned via the molding cavity 1041. The amorphous alloy 500 is located within the molding cavity 1041, thereby allowing for its positioning.

[0039] In some embodiments, the heating structure 300 further includes a first reinforcing plate 303 located within the molding cavity 1041 and a second reinforcing plate 304 disposed opposite to the first reinforcing plate 303. The template 305 and the amorphous alloy 500 are located between the first reinforcing plate 303 and the second reinforcing plate 304, and the amorphous alloy 500 is completely located within the molding cavity 1041. When the amorphous alloy 500 is subjected to pressure, the first reinforcing plate 303 is partially located within the molding cavity 1041, which can limit the lateral overflow of the amorphous alloy 500. At this time, the first reinforcing plate 303 is just slightly higher than the upper surface of the flow-limiting mold.

[0040] Optionally, a template 305 is placed on the second reinforcing plate 304, which provides a flat and smooth surface for the template 305 to prevent it from breaking due to uneven stress. The upper surface of the template 305 with micro-nano structures is in direct contact with the lower surface of the amorphous alloy 500. After the amorphous alloy 500 reaches the softening temperature, the microstructure on the template 305 will be replicated onto the amorphous alloy 500 under pressure. The first reinforcing plate 303 comes into direct contact with the heating block 301 after the pressure head 102 rises a certain distance, which plays a role in conducting heat and pressure.

[0041] Please see Figures 2 to 4 Optionally, both the first reinforcing plate 303 and the second reinforcing plate 304 are made of tungsten steel. Tungsten steel is a special alloy steel whose main component is tungsten (usually accounting for a very high proportion, typically exceeding 80%), along with other alloying elements such as nickel, iron, copper, and cobalt. Tungsten steel is known for its excellent hardness, high-temperature stability, and corrosion resistance. This allows it to remain stable in the high-temperature environment of the heating block 301 and withstand the clamping forces of the lower and upper pressure heads 102 and 101.

[0042] Optionally, the second reinforcing plate 304 provides the template 305 with a contact plane that has high surface hardness and a smooth surface, which can avoid stress concentration and prevent the template 305 from breaking. The surface of the template 305 in direct contact with the amorphous alloy 500 has micro-nano structures on a microfluidic chip fabricated using semiconductor processing technology. After the amorphous alloy 500 softens when heated to the glass transition temperature, the micro-nano structures on the template 305 are copied onto the amorphous alloy 500 under the pressure of the upper pressure head 101 and the lower pressure head 102.

[0043] Optionally, the first reinforcing plate 303 also provides a surface with high hardness and a high surface roughness level. Utilizing the non-adhesive properties of tungsten steel, it prevents the amorphous alloy 500 from softening and sticking to it, improving the ease of demolding. Furthermore, the first reinforcing plate 303 is in direct contact with the heating block 301, acting as a heat transfer medium. The pressure from the upper pressure head 101 is transferred to the amorphous alloy 500 and the template 305 through the first reinforcing plate 303.

[0044] Optionally, the amorphous alloy 500 is completely located within the molding cavity 1041, so that the amorphous alloy 500 will not overflow from the molding cavity 1041 during the hot pressing process.

[0045] Please see Figures 2 to 4 In some embodiments, the heating structure 300 further includes a heat insulation block 306 located above the heating block 301 and for the upper pressure head 101 to abut against.

[0046] Optionally, the heat insulation block 306 can prevent heat from being transferred upwards to the pressure head 101, while allowing heat to be conducted to the amorphous alloy 500 as much as possible. The heat insulation block 306 is made of heat insulation material, which can be alumina ceramic, polymer foam, or silicate insulation material.

[0047] Please see Figures 2 to 4 In some embodiments, the heat insulation block 306 has a heat insulation cavity, the area defined by the heat insulation cavity completely covers the heating block 301 in the vertical direction, and the upper pressure head 101 abuts against the center of the heat insulation cavity.

[0048] Optionally, by providing a heat insulation cavity inside the heat insulation block 306, not only can the heat insulation cavity block heat conduction to the upper pressure head 101, but the heat insulation block 306 can also be made hollow and have good elasticity. When the upper pressure head 101 presses down on the heat insulation block 306, it causes the heat insulation block 306 to undergo a slight elastic deformation, thereby driving the heating block 301 to fully and tightly adhere to the amorphous alloy 500 surface to surface, improving the efficiency of heat conduction. It can also enable the amorphous alloy 500 to fully adhere to the template 305 surface to surface, thereby making the micro-nano structure replicated on the amorphous alloy 500 uniformly distributed.

[0049] Please see Figures 2 to 4 In some embodiments, the heat insulation bracket 302 includes two elastic members with elastic restoring force and two oppositely arranged fixed side plates 3021. The two elastic members are respectively located on the two fixed side plates 3021, and the two ends of the heating block 301 are respectively connected to the two fixed side plates 3021. The elastic members are located between the fixed side plates 3021 and the heating block 301, and the heating block 301 compresses the elastic members downward.

[0050] Optionally, the elastic element can be a tube spring. By compressing the tube spring through the heating block 301, the horizontal angle between the heating block 301 and the amorphous alloy 500 can be finely adjusted, so that the heating block 301 is tightly attached to the heated surface of the amorphous alloy 500. Even after the amorphous alloy 500 softens due to heat, the heating block 301 can still maintain a tight fit with the amorphous alloy 500, avoiding gaps between the amorphous alloy 500 and the heating block 301 due to the fluidity of the amorphous alloy 500 after softening. It can also maintain sufficient surface-to-surface contact between the amorphous alloy 500 and the template 305.

[0051] Please see Figure 2 Optionally, a limiting groove 3024 is provided at the upper end of the fixed side plate 3021, and at least one tube spring is provided in each limiting groove 3024. The heating block 301 then abuts against each tube spring downwards, so that the heating block 301 can finely adjust its angle with the horizontal plane.

[0052] Please see Figures 2 to 4 In some embodiments, the hot pressing mold 100 further includes a self-balancing structure 200 disposed on the lower pressure head 102, the flow limiting mold base 104 is connected to the self-balancing structure 200, and the self-balancing structure 200 is used to make the force of the lower pressure head 102 perpendicular to the plate surface of the template 305.

[0053] Please see Figures 2 to 4 It is understandable that the self-balancing structure 200 can improve the accuracy of the force on the amorphous alloy 500, so that the force of the upper pressure head 101 is perpendicular to the template 305, thereby ensuring that the template 305 and the amorphous alloy 500 maintain sufficient surface contact and the pressure distribution at the contact position is highly uniform.

[0054] In some embodiments, the self-balancing structure 200 includes a balancing seat and a balancing ball head 202. The balancing seat has a positioning cavity 204, the cavity wall of which is spherically shaped. One end of the balancing ball head 202 is located within the positioning cavity 204, and the shape of the balancing ball head 202 is adapted to the shape of the positioning cavity 204 for spherical movable connection. The flow-limiting mold base 104 is connected to the balancing ball head 202.

[0055] Please see Figures 2 to 4It is understandable that both the balance seat and the balance ball head 202 are made of graphite. The good lubrication properties of graphite allow the balance seat and balance ball head 202 to rotate freely, and the high-temperature resistance of graphite also avoids the influence of heat from the heating block 301. The cooperation between the balance seat and the balance ball head 202, under the force of the upper pressure head 101 and the lower pressure head 102, results in pressure perpendicular to the surface of the amorphous alloy 500 to be processed, and the pressure distribution is uniform. This allows the micro-nano structures on the template 305 to be accurately replicated onto the amorphous alloy 500. Due to the uniform pressure distribution, the consistency of the micro-nano structures at various locations on the amorphous alloy 500 is high, improving the hot pressing quality.

[0056] Please see Figures 2 to 4 Optionally, the lower surface of the balance seat is provided with a first positioning groove for connecting the lower pressure head 102, and the upper surface of the balance ball head 202 is provided with a second positioning groove for connecting the flow limiting mold base 104. The shapes of the first positioning groove and the second positioning groove can both be rectangular.

[0057] In some embodiments, the hot pressing mold 100 further includes a heat insulation plate 203 disposed on the balance ball head 202, and the flow limiting mold base 104 is connected to the heat insulation plate 203. The heat insulation plate 203 can block heat conduction to the balance ball head 202, avoid excessive thermal expansion of the balance ball head 202, thereby improving the accuracy of the balance structure.

[0058] Please see Figures 2 to 4 It is understandable that the heat insulation plate 203 is also made of heat insulation material, and the heat insulation plate 203 can also be processed into a hollow structure, so that the heat insulation plate 203 has a certain elasticity. Under the drive of the pressure head 102, the heat insulation plate 203 undergoes elastic deformation, and finally the amorphous alloy 500 and the heating block 301 are in full surface-to-surface contact.

[0059] The present invention also proposes an amorphous alloy microfluidic mold core hot pressing molding device, which includes a hot pressing molding die 100. The specific structure of the hot pressing molding die 100 is as described in the above embodiments. Since the present invention adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0060] Please see Figures 2 to 4In some embodiments, the amorphous alloy microfluidic mold core hot pressing forming apparatus further includes a pneumatic transmission system, which enables the upper pressure head 101 and the lower pressure head 102 to feed in the Z-axis direction (vertical direction). The upper pressure head 101 and the lower pressure head 102 are respectively threadedly connected to the piston rods of the upper cylinder and the lower cylinder, thereby completing linear motion in the Z-axis direction. After the hot pressing is completed, the upper cylinder and the lower cylinder are reset, and the processed amorphous alloy 500 is removed.

[0061] Optionally, the side wall of the flow-limiting mold has a temperature measuring hole, into which the thermocouple 307 can be inserted to measure the temperature of the heated amorphous alloy 500 in real time, thereby obtaining accurate measurement results and facilitating the control of the heating temperature of the heating block 301.

[0062] Please see Figures 2 to 4 Optionally, the heating block 301 is a cast copper heating block 301, whose heating temperature is precisely controlled by a PID temperature control heating system, and the temperature of the heating block 301 can be displayed in real time.

[0063] Optionally, the heat insulation bracket 302 also includes a fixed base plate 3022 laid flat, with the two fixed side plates 3021 respectively connected to the two ends of the fixed base plate 3022, and the fixed base plate 3022 is provided with a clearance hole 3023 for the downward pressure head 102 to pass through.

[0064] The amorphous alloy 500 microfluidic mold core hot pressing equipment provided in this embodiment is used to process the surface of amorphous alloy 500 material, and to connect with semiconductor processing technology. The micro-nano structures on the microfluidic chip are processed onto the silicon wafer by photolithography. Then, the structure on the mold is copied onto the surface of the amorphous alloy 500 material by this equipment. It can also be applied to the forming and processing of other metal micro-nano structures, such as micro gears and micro pins, and has a wide range of applications and excellent applicability.

[0065] The amorphous alloy 500 microfluidic mold core hot pressing equipment provided in this embodiment exhibits stable temperature control, excellent molding effect, and high product yield during actual production. By combining the unique thermoplastic molding properties of amorphous alloy 500 with existing high-precision semiconductor processing technology, it overcomes the difficulties in processing traditional materials, as well as the challenge of photolithography on metal surfaces.

[0066] The above are merely optional embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A hot pressing molding die, characterized in that, include: The heating structure includes a fixedly installed heat insulation bracket and a heating block installed on the heat insulation bracket; as well as A molding structure includes an upper pressure head, a lower pressure head located below the upper pressure head, a flow-limiting mold base connected to the lower pressure head, and a template located within the flow-limiting mold base. The heating block is located between the upper pressure head and the lower pressure head, and both the upper pressure head and the lower pressure head are slidably disposed relative to the heating block. The target object is stacked on the template. In this process, the upper pressure head moves downward and presses against the heating block, while the lower pressure head moves upward and brings the target object against the heating block, so that the heat from the heating block is conducted to the target object. Under the action of the lower pressure head, the target object replicates the micro-nano structure of the template. The target object and the heating block are separated, and the target object detaches from the heating block after the hot pressing is completed. The heating structure also includes a heat insulation block located above the heating block and used for the upper pressure head to abut against; The heat insulation block has a heat insulation cavity, and the area defined by the heat insulation cavity completely covers the heating block in the vertical direction. The upper pressure head abuts against the center of the heat insulation cavity. The heat insulation block is hollow and elastic. When the upper pressure head presses down on the heat insulation block, it causes a slight elastic deformation of the heat insulation block to drive the heating block and the amorphous alloy to fully and tightly adhere to each other surface to surface.

2. The hot pressing mold as described in claim 1, characterized in that: The flow-limiting mold base has an open molding cavity, the template is placed in the molding cavity, and the target object is at least partially located in the molding cavity.

3. The hot pressing mold as described in claim 2, characterized in that: The heating structure further includes a first reinforcing plate located within the molding cavity and a second reinforcing plate disposed opposite to the first reinforcing plate. The template and the target object are located between the first reinforcing plate and the second reinforcing plate, and the target object is completely located within the molding cavity.

4. The hot pressing mold as described in any one of claims 1-3, characterized in that: The heat insulation bracket includes two elastic elements with elastic restoring force and two fixed side plates arranged opposite each other. The two elastic elements are respectively located on the two fixed side plates, and the two ends of the heating block are respectively connected to the two fixed side plates. The elastic elements are located between the fixed side plates and the heating block, and the heating block compresses the elastic elements downward.

5. The hot pressing mold as described in any one of claims 1-3, characterized in that: The hot pressing mold also includes a self-balancing structure disposed on the lower pressure head, and the flow-limiting mold base is connected to the self-balancing structure. The self-balancing structure is used to make the force of the lower pressure head perpendicular to the surface of the mold plate.

6. The hot pressing mold as described in claim 5, characterized in that: The self-balancing structure includes a balancing seat and a balancing ball head. The balancing seat has a positioning cavity with a spherical wall. One end of the balancing ball head is located inside the positioning cavity, and the shape of the balancing ball head is adapted to the shape of the positioning cavity. The flow-limiting mold base is connected to the balancing ball head.

7. The hot pressing mold as described in claim 6, characterized in that: The hot pressing mold also includes a heat insulation plate disposed on the balance ball head, and the flow limiting mold base is connected to the heat insulation plate.

8. A hot pressing device for amorphous alloy microfluidic mold cores, characterized in that, Including the hot pressing mold as described in any one of claims 1-7.

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