A glue coating and developing machine

Abstract

The application discloses a glue coating and developing machine, which comprises a machine body, a process unit and a chemical room arranged in the machine body, wherein the process unit comprises glue coating units; the glue coating units are symmetrically arranged on both sides of the chemical room; the chemical room is connected with the glue coating units through pipelines and shunt pipes; the shunt pipes on both sides of the chemical room are symmetrically arranged; and the connection positions of the pipelines and the shunt pipes are arranged on the symmetric axes of the shunt pipes on both sides. The glue coating and developing machine has novel design, the glue coating units are arranged on both sides of the chemical room, the supply pipeline of the photoresist is effectively shortened, the condensation of the photoresist in the pipeline is avoided, the stable supply of the photoresist is ensured, the design of the photoresist supply system is greatly simplified, and the stable use of the glue coating and developing machine is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of glue coating and developing machine, and particularly relates to a glue coating and developing machine. BACKGROUND

[0002] In the process of photoetching of a wafer, chemical solution in a chemical room needs to be coated on the wafer, wherein the glue coating process coats photoresist, and the developing process coats developing solution.

[0003] In the existing glue coating and developing machine, the chemical room is mostly arranged below or at one side of the process unit, such as the front side or the rear side. This arrangement mode makes the distances between the chemical room and the multiple process units different, and different lengths of pipelines and corresponding control systems are needed, the control system is relatively cumbersome, and the longer pipeline also causes the condensation of the photoresist, so that the photoresist cannot be stably supplied, and the stable operation of the glue coating and developing machine is affected. SUMMARY

[0004] The present application aims at solving the problem in the prior art that different lengths of pipelines and corresponding control systems are needed, the control system is relatively cumbersome, and the longer pipeline also causes the condensation of the photoresist, so that the photoresist cannot be stably supplied, and the stable operation of the glue coating and developing machine is affected, and provides a glue coating and developing machine.

[0005] In order to achieve the above-mentioned purpose, the present application adopts the following technical scheme:

[0006] A glue coating and developing machine comprises a machine body, a process unit and a chemical room arranged in the machine body, the process unit comprises a glue coating unit;

[0007] The glue coating unit is arranged symmetrically on both sides of the chemical room, and the chemical room is connected with the glue coating unit through pipelines and shunt pipes.

[0008] The shunt pipes arranged on both sides of the chemical room are symmetrically arranged.

[0009] The connection between the pipeline and the shunt pipe is arranged on the symmetric axis of the shunt pipes on both sides.

[0010] Preferably, the diameters, lengths and height differences of the shunt pipes are completely same.

[0011] Preferably, the connection between the pipeline and the shunt pipe is further provided with a shunt valve.

[0012] Preferably, the chemical room is provided with multiple photoresist storage areas and multiple pump installation layers for installing photoresist pumps, multiple storage tanks are arranged in the photoresist storage areas, photoresist pumps are arranged in the pump installation layers, and the feeding end of the photoresist pump is connected with the storage tank.

[0013] More preferably, the chemical room is further provided with a photoresist temporary storage pipe on one side, the photoresist temporary storage pipe is connected with the photoresist pump on the feeding end, and the photoresist temporary storage pipe is connected with the pipeline on the discharging end.

[0014] More preferably, the chemical room is further provided with a plurality of slide rails on the upper and lower sides, and slide seats are fixedly installed in the machine body and correspond to the slide rails.

[0015] Preferably, the process unit further comprises a cold plate unit, which is arranged at the opposite position of the other end of the chemical room.

[0016] More preferably, the cold plate unit is provided with a plurality of hot plate units on both sides.

[0017] Preferably, the machine body is provided with a functional module on one side of the process unit, the functional module is provided with a transfer unit, and a wafer box station is arranged on the other side of the functional module.

[0018] A glue coating and developing machine comprises a machine body, a process unit and a chemical room arranged in the machine body, wherein the process unit comprises a glue coating unit and a developing unit.

[0019] The glue coating unit is provided with a plurality of units and is symmetrically arranged on both sides of the chemical room, and the chemical room is connected with the glue coating unit through a first pipeline and a first shunt pipe.

[0020] The developing unit is provided with a plurality of units and is symmetrically arranged on both sides of the chemical room, and a liquid supply device is arranged outside the machine body and corresponds to the position of the chemical room, and the liquid supply device is connected with the developing unit through a second pipeline and a second shunt pipe.

[0021] The plurality of first shunt pipes arranged on both sides of the chemical room are symmetrically arranged, and the connection between the first pipeline and the first shunt pipe is arranged on the symmetric axis of the first shunt pipes on both sides.

[0022] The plurality of second shunt pipes arranged on both sides of the liquid supply device are symmetrically arranged, and the connection between the second pipeline and the second shunt pipe is arranged on the symmetric axis of the second shunt pipes on both sides.

[0023] Compared with the prior art, the present application has the following advantages:

[0024] 1. In the present application, the glue coating unit is symmetrically arranged on both sides of the chemical room, which greatly shortens the length of the photoresist pipeline, shortens the conveying distance of the photoresist, effectively avoids the condensation of the photoresist in the pipeline, and ensures the stable supply of the photoresist.

[0025] 2. In the present application, the shunt pipes are symmetrically arranged on both sides, and the photoresist is uniformly distributed by the shunt valve, so that the photoresist in the plurality of shunt pipes can be uniformly fed, the synchronous feeding of the photoresist can be uniformly controlled, and the supply effect of the photoresist is ensured.

[0026] 3、The present application, by the complete symmetrical shunt pipe, effectively facilitates the control of photoresist supply, greatly simplifies the supply system, facilitates the maintenance of the equipment, simplifies the structural design of the coating and developing machine, and reduces the design and manufacturing cost of the coating and developing machine.

[0027] The present application is novel in design, by arranging the coating unit on both sides of the chemical room, effectively shortens the photoresist supply pipeline, avoids the condensation of photoresist in the pipeline, ensures the stable supply of photoresist, and greatly simplifies the design of the photoresist supply system, ensuring the stable use of the coating and developing machine. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 The schematic diagram of the pipeline system of the present application.

[0029] Figure 2 The schematic diagram of the pipeline system of the fifth embodiment of the present application.

[0030] Figure 3 The schematic diagram of the position relationship between the chemical room and the process unit of the present application.

[0031] Figure 4 The schematic diagram of the position relationship between the chemical room and the process unit of the present application.

[0032] Figure 5 The schematic diagram of the chemical room structure of the present application.

[0033] Figure 6 The schematic diagram of the side structure of the chemical room of the present application.

[0034] In the figure: process unit 1, coating unit 11, developing unit 12, liquid supply device 121, hot plate unit 13, cold plate unit 14, chemical room 2, slide rail 21, photoresist storage area 22, storage tank 221, pump installation layer 23, photoresist temporary storage pipe 24, pipeline 3, first pipeline 301, first shunt pipe 3011, second pipeline 302, second shunt pipe 3021, shunt pipe 31, shunt valve 311, slide 4, wafer box station 5, functional module 6, transfer unit 61. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all.

[0036] Embodiment one

[0037] Reference Figures 1-6The application relates to a glue coating and developing machine, which comprises a machine body, a process unit 1 and a chemical room 2 arranged in the machine body, wherein the process unit 1 comprises a glue coating unit 11 and a developing unit 12.

[0038] The glue coating unit 11 is arranged on both sides of the chemical room 2 in a plurality of and symmetrical modes, and the chemical room 2 is connected with the glue coating unit 11 through a pipeline 3 and a shunt pipe 31.

[0039] The shunt pipes 31 arranged on both sides of the chemical room 2 are arranged in a symmetrical mode.

[0040] The connection between the pipeline 3 and the shunt pipe 31 is arranged on the symmetrical axis of the shunt pipes 31 arranged on both sides. When the photoresist in the chemical room 2 is sent to the glue coating unit 11 through the shunt pipe 31, the flow distance and flow pressure of the photoresist on both sides are the same through the shunt pipe 31 arranged in the same mode, the supply of the photoresist is controlled conveniently, the design of the photoresist supply control system is greatly reduced, and compared with the design that the chemical room 2 is arranged outside the machine body, the length of the photoresist supply route from the chemical room 2 to the glue coating unit 11 is effectively shortened, the time of the photoresist in the pipeline is shortened, the viscous photoresist can be sent into the glue coating unit 11 smoothly, and the operation of the glue coating and developing machine is not affected by the condensation of the photoresist in the pipeline.

[0041] In the embodiment, when the photoresist is coated on the wafer, the photoresist in the chemical room 2 is sent into the pipeline 3 and is shunted through the shunt pipes 31 arranged in a symmetrical mode, and then the photoresist is synchronously and uniformly sent into the plurality of glue coating units 11 to coat the wafer, and then the wafer is heated and cooled and is sent into a photoetching machine to perform photoetching, and then the wafer is sent into the developing unit 12 to develop, so that the wafer processing is completed.

[0042] The glue coating and developing machine synchronously supplies the photoresist through the shunt pipes 31 arranged in a symmetrical mode, the accurate delivery of the photoresist is guaranteed, the management and control of the pipeline are facilitated, the control system is not bulky, the manufacturing and maintenance of the glue coating and developing machine are facilitated, the use of the glue coating and developing machine is facilitated, the length of the shunt pipe 31 is greatly shortened through the design that the glue coating unit 11 is arranged on both sides of the chemical room 2, the condensation of the photoresist in the pipeline is effectively avoided, and the stable supply of the photoresist is guaranteed.

[0043] Embodiment two

[0044] Reference Figure 1The embodiment is basically same as the first embodiment, and is more optimized in that the pipe diameter, length and height difference of the plurality of shunt pipes 31 are completely same, the parameters of the plurality of shunt pipes 31 are ensured to be same, the photoresist conveying pressure in each shunt pipe 31 is ensured to be consistent, the synchronous feeding of the photoresist in each shunt pipe 31 is ensured, the supply control of the photoresist is facilitated, and the accurate control of the photoresist during the photoresist coating is ensured.

[0045] In the embodiment, as shown in Figure 1 , the connection between the pipeline 3 and the shunt pipe 31 is further provided with a shunt valve 311, the supply of the photoresist is controlled through the shunt valve 311, and the photoresist in the pipeline 3 is uniformly fed into the shunt pipe 31, so that the centralized control of the photoresist supply is facilitated.

[0046] Embodiment three

[0047] Referring to Figure 5 and 6 , the embodiment is basically same as the first embodiment, and is more optimized in that the chemical room 2 is provided with a plurality of photoresist storage areas 22 and a pump mounting layer 23 for mounting a photoresist pump, the photoresist storage area 22 is provided with a plurality of storage tanks 221, the pump mounting layer 23 is provided with a photoresist pump, and the feeding end of the photoresist pump is connected with the storage tank 221 in penetration, the storage tank 221 is stored through the photoresist storage area 22, the replenishment of the photoresist is facilitated, and the photoresist in the storage tank 221 is fed out in cooperation with the photoresist pump, so that the supply effect of the photoresist is ensured.

[0048] In the embodiment, as shown in Figure 5 and 6 , the chemical room 2 is further provided with a photoresist temporary storage pipe 24 on one side, the feeding end of the photoresist temporary storage pipe 24 is connected with the discharging end of the photoresist pump, and the discharging end of the photoresist temporary storage pipe 24 is connected with the pipeline 3 in penetration, the photoresist is transported from the storage tank 221 to the photoresist temporary storage pipe 24 by the photoresist pump, the photoresist is fed into the pipeline 3 by the photoresist pump to complete the supply of the photoresist when the photoresist needs to be supplied to the photoresist coating unit 11.

[0049] In the embodiment, as shown in Figure 5 and 6 , the embodiment is basically same as the first embodiment, and is more optimized in that the chemical room 2 is provided with a plurality of slide rails 21 on the upper and lower sides, and the slide rails 21 are fixedly installed with slide seats 4 in the machine body, the chemical room 2 is facilitated to be removed from the photoresist coating and developing machine for maintenance and repair, the storage tank 221 is facilitated to be replaced, and the use of the photoresist coating and developing machine is facilitated.

[0050] Embodiment four

[0051] Referring to Figures 1-4In the embodiment, the process unit 1 further comprises a cold plate unit 14 arranged at the opposite position of the chemical room 2.

[0052] The cold plate unit 14 is arranged at the middle position of the chemical room 2.

[0053] The cold plate unit 14 is arranged at the middle position of the chemical room 2.

[0054] In the embodiment, as shown in Figures 1-4 The machine body is provided with a function module 6 corresponding to one side of the process unit 1, the function module 6 is provided with a transfer unit 61, and the other side of the function module 6 is provided with a wafer box station 5. The wafer is transferred between the wafer box station 5 and the process unit through the transfer unit 61, so as to ensure the wafer transfer effect.

[0055] Embodiment five

[0056] Referring to Figure 2 A glue coating and developing machine, characterized in that it comprises a machine body, a process unit 1 and a chemical room 2 arranged in the machine body, the process unit 1 comprises a glue coating unit 11 and a developing unit 12.

[0057] The glue coating unit 11 is arranged at the two sides of the chemical room 2, and the chemical room 2 and the glue coating unit 11 are connected through a first pipeline 301 and a first shunt pipe 3011.

[0058] The developing unit 12 is arranged at the two sides of the chemical room 2, and a liquid supply device 121 is arranged outside the machine body corresponding to the position of the chemical room 2, and the liquid supply device 121 and the developing unit 12 are connected through a second pipeline 302 and a second shunt pipe 3021.

[0059] The first shunt pipes 3011 arranged at the two sides of the chemical room 2 are symmetrically arranged, and the connection between the first pipeline 301 and the first shunt pipe 3011 is arranged on the symmetric axis of the two first shunt pipes 3011.

[0060] The second shunt pipes 3021 arranged at the two sides of the liquid supply device 121 are symmetrically arranged, and the connection between the second pipeline 302 and the second shunt pipe 3021 is arranged on the symmetric axis of the two second shunt pipes 3021.

[0061] In the embodiment, the photoresist is stored in the chemical room 2, the developer is stored in the developer supply device 121, and the photoresist and the developer are synchronously fed into the corresponding photoresist coating unit 11 and the developing unit 12 through the first and second completely symmetrical shunt pipes 3011 and 3021. The precise synchronous control of the photoresist and the developer can be achieved by only simple pipeline design and simple supply control, and the control system of the photoresist coating and developing machine is further simplified.

[0062] The above merely describes the preferred embodiments of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can make equivalent replacements or changes according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered by the protection scope of the present application.

Claims

1. A gumming and developing machine characterized by comprising: The machine body and the process unit (1) and the chemical room (2) arranged in the machine body, the process unit (1) comprising a glue applying unit (11) and a developing unit (12); The glue applying unit (11) is provided with a plurality of and symmetrically arranged on both sides of the chemical room (2), and the chemical room (2) is connected with the glue applying unit (11) through a pipeline (3) and a shunt pipe (31); The plurality of shunt pipes (31) on both sides of the chemical room (2) are symmetrically arranged; The connection between the pipeline (3) and the shunt pipe (31) is arranged on the symmetric axis of the two shunt pipes (31).

2. The glue applicator and developer according to claim 1, wherein The pipe diameter, length and height difference of the plurality of shunt pipes (31) are completely the same.

3. The glue applicator and developer according to claim 1, wherein The connection between the pipeline (3) and the shunt pipe (31) is further provided with a shunt valve (311).

4. The glue applicator and developer according to claim 1, wherein The chemical room (2) is provided with a plurality of photoresist storage areas (22) and a pump mounting layer (23) for mounting a photoresist pump, the photoresist storage area (22) is provided with a plurality of storage tanks (221), the pump mounting layer (23) is provided with a photoresist pump, and the photoresist pump feeding end is connected with the storage tank (221) in penetration.

5. The glue applicator and developer according to claim 4, wherein The chemical room (2) is further provided with a photoresist temporary storage pipe (24), the feeding end of the photoresist temporary storage pipe (24) is connected with the discharge end of the photoresist pump, and the discharge end of the photoresist temporary storage pipe (24) is connected with the pipeline (3) in penetration.

6. The glue applicator and developer according to claim 4, wherein The chemical room (2) is provided with a plurality of slide rails (21) on both upper and lower sides, and the machine body is fixedly provided with a sliding seat (4) corresponding to the slide rail (21).

7. The glue applicator and developer according to claim 1, wherein The process unit (1) further comprises a cold plate unit (14), and the cold plate unit (14) is arranged at the opposite position of the other end of the chemical room (2).

8. The glue applicator and developer according to claim 7, wherein The cold plate unit (14) is provided with a plurality of hot plate units (13) on both sides.

9. The glue applicator and developer machine of claim 1, wherein, The machine body is provided with a functional module (6) on one side corresponding to the process unit (1), the functional module (6) is provided with a transfer unit (61), and the other side of the functional module (6) is provided with a wafer box station (5).

10. A gumming and developing machine characterized by comprising: The machine body and the process unit (1) and the chemical room (2) arranged in the machine body, the process unit (1) comprising a glue applying unit (11) and a developing unit (12); The glue applying unit (11) is provided with a plurality of and symmetrically arranged on both sides of the chemical room (2), and the chemical room (2) is connected with the glue applying unit (11) through a first pipeline (301) and a first shunt pipe (3011); The developing unit (12) is provided with a plurality of and symmetrically arranged on both sides of the chemical room (2), and a liquid supply device (121) is arranged outside the machine body corresponding to the position of the chemical room (2), and the liquid supply device (121) is connected with the developing unit (12) through a second pipeline (302) and a second shunt pipe (3021); The plurality of first shunt pipes (3011) on both sides of the chemical room (2) are symmetrically arranged; and the connection between the first pipeline (301) and the first shunt pipe (3011) is arranged on the symmetric axis of the two first shunt pipes (3011). The second shunt pipes (3021) on both sides of the liquid supply device (121) are symmetrically arranged, and the connection between the second pipe (302) and the second shunt pipe (3021) is arranged on the symmetric axis of the second shunt pipes (3021) on both sides.

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