A method for batch production of high-reliability multi-core group molded capacitors

Abstract

A method for batch producing high-reliability multi-core group molded capacitors, comprising the following steps: step one, forming a capacitor frame, the capacitor frame comprising a plurality of frame units arranged at intervals, each frame unit comprising a frame unit body, a first pin and a second pin respectively arranged at both ends of the frame unit body, and a series welding rib connected to the frame unit body, the first pin being provided with a first welding rib, and the second pin being provided with a second welding rib; step two, mounting a plurality of ceramic capacitor chips between the first welding rib and the series welding rib or between the second welding rib and the series welding rib, respectively; step three, placing the capacitor frame with the ceramic capacitor chips mounted therein in a corresponding mold for molding, and removing the excess frame waste after demolding; to obtain a multi-core group molded capacitor; the withstand voltage of the molded capacitor produced by the application is increased to 2 times of the original, thereby improving the reliability index of the molded capacitor.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of molded capacitor preparation, and particularly relates to a method for batch preparation of high-reliability multi-core group molded capacitor. BACKGROUND

[0002] Capacitors are developing towards miniaturization, micro-miniaturization and large capacity under the impetus of science and technology. A single molded capacitor is difficult to make great progress in large capacity, high voltage resistance and low equivalent series resistance by changing production process and product material only. If multiple molded capacitors are directly used in series or parallel in the circuit, the complexity of circuit design will be increased, and the space occupied by the molded capacitors on the circuit board will also be increased, which needs to be further improved. SUMMARY

[0003] The present application aims to overcome the shortcomings of the prior art and provide a method for batch preparation of high-reliability multi-core group molded capacitor.

[0004] The present application adopts the following technical solutions:

[0005] A method for batch preparation of high-reliability multi-core group molded capacitor comprises the following steps:

[0006] Step one, forming a capacitor frame, the capacitor frame comprises a plurality of frame units arranged at intervals, the frame unit comprises a frame unit body, a first pin and a second pin respectively arranged at both ends of the frame unit body, and a series welding rib connected with the frame unit body, the first pin is provided with a first welding rib, the second pin is provided with a second welding rib opposite to the first welding rib up and down, and the series welding rib is arranged at the side of the first welding rib and the second welding rib;

[0007] Step two, mounting a plurality of ceramic capacitor chips between the first welding rib and the series welding rib or the second welding rib and the series welding rib, respectively;

[0008] Step three, placing the capacitor frame with the ceramic capacitor chips mounted therein in a corresponding mold for molding, removing the excess frame waste after demolding; to obtain a high-reliability multi-core group molded capacitor with multiple ceramic capacitor chips inside forming series-parallel connection.

[0009] Further, the first pin further comprises a first pin end and a connecting rib provided on the first pin end and extending towards the second pin; the first welding rib is provided on the first pin end and parallel to the connecting rib; in step one, after the capacitor frame is formed, the first welding rib, the second welding rib and the connecting rib are concave downwards to form a concave area; in step two, the plurality of ceramic capacitor chips are mounted in the concave area and single-sidedly mounted between the first welding rib and the connecting rib or the second welding rib and the connecting rib.

[0010] Further, the connecting rib comprises a positioning section connected with the first pin end and a connecting section provided on the top surface of the positioning section and connected with the connecting rib; the diameter of the connecting section is smaller than that of the positioning section; in step two, the plurality of ceramic capacitor chips are respectively mounted between the first welding rib and the connecting rib or the second welding rib and the connecting rib, and the connecting section is broken.

[0011] Further, the frame unit body further comprises a space frame provided around the first welding rib, the second welding rib and the connecting rib; the first pin further comprises a notch groove provided on the first pin end and extending towards the end of the frame unit body.

[0012] Further, the frame unit body further comprises two first extension space frames provided on both sides of the first pin end; the lowest part of the first extension space frame is higher than the highest part of the notch groove; the highest part of the space frame is lower than the highest part of the notch groove.

[0013] Further, the second pin further comprises a second pin end and a breakable hole provided on the second pin end; the second welding rib is provided on the second pin end; the breakable hole is located behind the second welding rib.

[0014] Further, the frame unit body further comprises two second extension space frames provided on both sides of the second pin end; the upper end of the second extension space frame is lower than the lowest part of the breakable hole; the lowest part of the space frame is higher than the lowest part of the breakable hole.

[0015] Further, the frame unit body is provided with a positioning rib connected with the side of the connecting rib; in step two, the plurality of ceramic capacitor chips are respectively double-sidedly mounted between the first welding rib and the connecting rib or the second welding rib and the connecting rib.

[0016] From the above description of the present application, compared with the prior art, the beneficial effects of the present application are: the present application limits the preparation method by limiting the structure of the capacitor frame, to obtain a multi-core group molded capacitor with multiple ceramic chips inside forming series and parallel connection. In the case of ensuring the capacity of the molded capacitor unchanged, the withstand voltage value of the molded capacitor is increased to 2 times of the original, thereby improving the reliability index of the molded capacitor. At the same time, by limiting the setting position and connection mode of the first pin, the second pin and the series welding rib, the integration of the molded capacitor can be improved, the board layout can be synchronized, and compared with the chip capacitor, the mechanical capabilities such as pressure resistance and impact resistance are significantly improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 Schematic diagram of the capacitor frame of the first embodiment Figure 1 ;

[0018] Figure 2 Schematic diagram of the capacitor frame of the first embodiment Figure 2 ;

[0019] Figure 3 Assembled schematic diagram of the capacitor frame and the ceramic constant-volume chip of the first embodiment

[0020] Figure 4 Equivalent circuit diagram of Figure 3 ;

[0021] Figure 5 Schematic diagram of the capacitor frame of the second embodiment Figure 1 ;

[0022] Figure 6 Front view of the assembled capacitor frame and ceramic constant-volume chip of the second embodiment

[0023] Figure 7 Back view of the assembled capacitor frame and ceramic constant-volume chip of the second embodiment

[0024] Figure 8 Assembled schematic diagram of the capacitor frame and the ceramic constant-volume chip of the second embodiment

[0025] In the figure, 1-frame unit, 2-strip hole, 3-frame unit body, 4-first pin, 5-second pin, 6-series welding rib, 7-give way empty frame, 8-ceramic capacitor chip, 9-recessed area, 31-first extension empty frame, 32-second extension empty frame, 33-division, 34-positioning rib, 41-first pin end, 42-first welding rib, 43-notch groove, 44-connection rib, 45-positioning section, 46-connection section, 51-second pin end, 52-second welding rib, 53-easy-to-break hole. DETAILED DESCRIPTION

[0026] The application is further described in the following specific embodiments.

[0027] A method for batch producing high-reliability multi-core group molded capacitors, a plurality of ceramic capacitor chips 8 are fixedly adhered on a capacitor frame, after being molded and packaged, the excess frame waste is removed to form.

[0028] The capacitor frame comprises a plurality of frame units 1 arranged at intervals, and the capacitor frame of the application has two embodiments; specifically, in the first embodiment, the capacitor frame further comprises a plurality of strip-shaped holes 2 arranged between adjacent two frame units 1; by arranging the strip-shaped holes 2 between the adjacent two frame units 1, the strength between the adjacent two frame units 1 is reduced, so that it is more labor-saving when the frame unit 1 waste is removed, and the possible scratches on the surface of the product during the process of removing the frame unit waste are reduced, ensuring the stable quality of the final product.

[0029] The frame unit 1 comprises a frame unit body 3, a first pin 4, a second pin 5, a series welding rib 6 and a give-way empty frame 7.

[0030] The first pin 4 is arranged at the two ends of the frame unit body 3 opposite to the second pin 5; specifically, in the first embodiment and the second embodiment, the first pin 4 comprises a first pin end 41, a first welding rib 42 arranged on the first pin end 41 and extending towards the second pin 5, and a notch groove 43 arranged on the first pin end 41 and extending towards the end of the frame unit body 3; by arranging the notch groove 43, the rigidity of the first pin 4 is reduced, which is convenient for subsequent packaging and forming.

[0031] The second pin 5 comprises a second pin end 51 and a second welding rib 52 arranged on the second pin end 51 and extending towards the first pin 4; specifically, in the first embodiment, the first pin further comprises a breakable hole 53 arranged on the second pin end 51, the first welding rib 42 and the second welding rib 52 are arranged opposite to each other, and by arranging the breakable hole 53, the rigidity of the second pin 4 is reduced, which is convenient for subsequent packaging and forming; in the second embodiment, the second pin 5 is not provided with the breakable hole 53, but is provided with the same notch groove 43 as the first pin 4.

[0032] The series welding rib 6 is arranged at the side of the first welding rib 42 and the second welding rib 52, and is connected with the frame unit body 3.

[0033] In the first embodiment, the series welding rib 6 is connected with the frame unit body 3 through the first pin end 41. Specifically, the first pin 4 further comprises a connecting rib 44 arranged on the first pin end 41 and extending towards the second pin 5 to connect with the series welding rib 6. The connecting rib 44 is arranged in parallel with the first welding rib 42. Specifically, the connecting rib 44 comprises a positioning segment 45 connected with the first pin end 41 and a connecting segment 46 arranged on the top surface of the positioning segment 45 and connected with the series welding rib 6. The diameter of the connecting segment 46 is smaller than that of the positioning segment 45. After the capacitor frame and the ceramic capacitor chip 8 are molded and packaged, the connection between the series welding rib 6 and the first pin end 41 is disconnected by breaking the connecting segment 46, so as to obtain a high-reliability multi-core group molded capacitor with multiple ceramic capacitor chips 8 connected in series and parallel.

[0034] In the second embodiment, the side edge of the series welding rib 6 is directly connected with the frame unit body 3. Specifically, the frame unit body 3 is provided with a positioning rib 34 connected with the side edge of the series welding rib 6. After the capacitor frame and the ceramic capacitor chip 8 are molded and packaged, the connection between the series welding rib 6 and the frame unit body 3 is disconnected by breaking the positioning rib 34, so as to obtain a high-reliability multi-core group molded capacitor with multiple ceramic capacitor chips 8 connected in series and parallel. By limiting the connection mode of the series welding rib 6 and the frame unit body 3, the series welding rib 6, the first welding rib 42 and the second welding rib 52 are integrated on the capacitor frame, so that the multiple ceramic capacitor chips 8 connected in series and parallel can improve the withstand voltage value and also realize batch production of the molded capacitor, effectively improving the production efficiency of the molded capacitor. Without manually placing the series welding rib 6 at the relative position of the first welding rib 42 and the second welding rib 52, the operation is facilitated and the labor cost is reduced.

[0035] The empty frame 7 is arranged around the first welding rib 42, the second welding rib 43 and the series welding rib 6. Specifically, in the first embodiment, the frame unit body 3 further comprises two first extended empty frames 31 arranged on both sides of the first pin end 41 and two second extended empty frames 32 arranged on both sides of the second pin end 51. Further, the lowest part of the first extended empty frame 31 is higher than the highest part of the notch groove 43, and the highest part of the empty frame 7 is lower than the highest part of the notch groove 43. The upper end of the second extended empty frame 32 is lower than the lowest part of the easy-to-fold hole 53, and the lowest part of the empty frame 7 is higher than the lowest part of the easy-to-fold hole 53. Therefore, a partition 33 is formed between the highest part of the empty frame 7 and the lowest part of the first extended empty frame 31, and a partition 33 is formed between the lowest part of the empty frame 7 and the highest part of the second extended empty frame 32, so as to prevent the material liquid from overflowing along the empty frame 7 to the empty frame on both sides of the first pin end 41 or the second pin end 51 and connecting with the first pin end 41 or the second pin end 51 during the molding and packaging of the capacitor. The subsequent product forming may introduce impurities, affecting the product pin forming effect, and increasing the overflow cleaning time and labor cost. Further, in the second embodiment, the positioning rib 34 extends from the outside of the empty frame 7 to the inside and is connected with the side of the series welding rib 6.

[0036] In the first embodiment, the preparation method of the multi-core group molded capacitor specifically includes the following steps:

[0037] Step one, forming a capacitor frame, and then making the first welding rib 42, the second welding rib 52 and the series-parallel welding rib 6 recess downward to form a recessed area 9 through corresponding equipment;

[0038] Step two, installing a plurality of ceramic capacitor chips 8 in the recessed area 9, and installing them on one side between the first welding rib 42 and the series welding rib 6 or the second welding rib 52 or the series welding rib 6, and then breaking the connection section 46;

[0039] Step three, placing the capacitor frame with the plurality of ceramic capacitor chips 8 installed therein in a mold for molding and packaging, and after demolding, removing the excess frame waste, so as to obtain a high-reliability multi-core group molded capacitor with a plurality of ceramic capacitor chips 8 inside forming series-parallel connection.

[0040] In the second embodiment, the preparation method of the multi-core group molded capacitor specifically includes the following steps:

[0041] Step one, forming a capacitor frame;

[0042] Step two, installing a plurality of ceramic capacitor chips 8 on both sides between the first welding rib 42 and the series welding rib 6 or the second welding rib 52 and the series welding rib 6, respectively;

[0043] Step three, the capacitor frame installed with multiple ceramic capacitor chips 8 is placed in a mold for die bonding, after demolding, the positioning rib 34 is broken and the excess frame waste is removed, and a high-reliability multi-core group die-bonded capacitor with multiple ceramic capacitor chips 8 forming series-parallel connection is obtained.

[0044] In the case of installing the same number of ceramic capacitor chips 8, the length of the multi-core group die-bonded capacitor prepared in example one is longer than that of the multi-core group die-bonded capacitor prepared in example two, but the thickness is smaller than that of the multi-core group die-bonded capacitor prepared in example two; so as to select the appropriate multi-core group die-bonded capacitor according to different use environment.

[0045] The application limits the preparation method by limiting the structure of the capacitor frame, so as to obtain a multi-core group die-bonded capacitor with multiple ceramic capacitor chips 8 forming series-parallel connection, and the withstand voltage value of the die-bonded capacitor is doubled under the condition of ensuring the capacity of the die-bonded capacitor, thereby improving the reliability index of the die-bonded capacitor; at the same time, the setting position and connection mode of the first pin 4, the second pin 5 and the series welding rib 6 are limited, which can improve the integration of the die-bonded capacitor, facilitate the synchronous layout, and the mechanical ability such as pressure resistance and impact resistance of the die-bonded capacitor is significantly improved compared with the chip capacitor.

[0046] The above is only a preferred embodiment of the application, and therefore cannot limit the scope of the application, that is, equivalent changes and modifications made according to the patent range and content of the application should still be within the scope of the application.

Claims

1. A method of batch manufacturing high reliable multi-core group molded capacitors, characterized by: The method comprises the following steps: Step 1: forming a capacitor frame, wherein the capacitor frame comprises a plurality of frame units arranged at intervals, each frame unit comprises a frame unit body, a first pin and a second pin arranged at two ends of the frame unit body respectively, and a series welding rib connected with the frame unit body, the first pin is provided with a first welding rib, the second pin is provided with a second welding rib opposite to the first welding rib, and the series welding rib is arranged at the side of the first welding rib and the second welding rib; Step 2: mounting a plurality of ceramic capacitor chips between the first welding rib and the series welding rib or between the second welding rib and the series welding rib respectively; Step 3: placing the capacitor frame with the ceramic capacitor chips mounted thereon in a corresponding mold for die pressing, and removing the excess frame waste after demolding to obtain a high-reliability multi-core group die-pressed capacitor with a plurality of ceramic capacitor chips inside forming a series-parallel connection. The first pin further comprises a first pin end and a connecting rib arranged on the first pin end and extending towards the second pin to connect with the series welding rib, and the first welding rib is arranged on the first pin end and parallel to the connecting rib; in step 1, after the capacitor frame is formed, the first welding rib, the second welding rib and the series welding rib are recessed downward to form a recessed area by a corresponding device; in step 2, the plurality of ceramic capacitor chips are mounted in the recessed area and single-sidedly mounted between the first welding rib and the series welding rib or between the second welding rib and the series welding rib. The connecting rib comprises a positioning section connected with the first pin end and a connecting section arranged on the top surface of the positioning section and connected with the series welding rib, and the diameter of the connecting section is smaller than that of the positioning section; in step 2, the plurality of ceramic capacitor chips are mounted between the first welding rib and the series welding rib or between the second welding rib and the series welding rib respectively, and the connecting section is broken.

2. The method of claim 1, wherein the method is a batch method. The frame unit body further comprises a space frame arranged around the first welding rib, the second welding rib and the series welding rib; and the first pin further comprises a notch groove arranged on the first pin end and extending towards the end of the frame unit body.

3. The method of claim 2, wherein the method is a batch method. The frame unit body further comprises two first extension space frames arranged on both sides of the first pin end, and the lowest part of the first extension space frame is higher than the highest part of the notch groove, and the highest part of the space frame is lower than the highest part of the notch groove.

4. The method of claim 2, wherein the method is a batch process. The second pin further comprises a second pin end and a breakable hole arranged on the second pin end, the second welding rib is arranged on the second pin end, and the breakable hole is located behind the second welding rib.

5. The method of claim 4, wherein: the plurality of high-reliability multi-core group molded capacitors are prepared in a batch. The frame unit body further comprises two second extension space frames arranged on both sides of the second pin end, and the upper end of the second extension space frame is lower than the lowest part of the breakable hole, and the lowest part of the space frame is higher than the lowest part of the breakable hole.

6. The method of claim 1, wherein: the plurality of high-reliability multi-core group molded capacitors are prepared in a batch. The frame unit body is provided with a positioning rib connected with the side of the series welding rib; in step 2, the plurality of ceramic capacitor chips are double-sidedly mounted between the first welding rib and the series welding rib or between the second welding rib and the series welding rib respectively.

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