Substrate mounting apparatus and substrate mounting method

Abstract

The application relates to the technical field of display panel production equipment, and discloses a substrate bonding device and method. The substrate bonding device is used for bonding a flexible substrate and a rigid substrate which are respectively provided with a first bonding area and a second bonding area, and comprises a table assembly and an image acquisition assembly. The table assembly comprises a first light-transmitting part and a second light-transmitting part, the first bonding area is attached to the first light-transmitting part, the second bonding area can be arranged opposite to the second light-transmitting part, the image acquisition assembly is arranged below the table assembly, and images of the first bonding area and the second bonding area are respectively acquired through the first light-transmitting part and the second light-transmitting part. The thickness of the second light-transmitting part is greater than that of the first light-transmitting part, so that the focal point of the image acquisition assembly for acquiring the image through the second light-transmitting part is higher than the upper surface of the first bonding area. The substrate bonding device can simultaneously focus on the first bonding area and the second bonding area and acquire clear images, the steps are few, and the bonding efficiency and precision are high.

Description

Technical Field

[0001] This invention relates to the field of display panel manufacturing equipment technology, and in particular to a substrate bonding apparatus and a substrate bonding method. Background Technology

[0002] In the display panel manufacturing process, it is often necessary to bond flexible substrates (such as flexible screens, flexible circuit boards, etc.) to rigid substrates (such as integrated circuit boards, chips, etc.). During the bonding process, CCD cameras are used to capture images and position the bonding areas of the flexible substrate and the rigid substrate separately. However, since the flexible substrate will warp to a certain extent, it cannot be suspended. Therefore, during image capture and inspection, a light-transmitting stage is used to support the flexible substrate.

[0003] like Figure 1 As shown, existing substrate bonding devices include a stage assembly 1', a CCD camera 3', and a pressure head 2'. The stage assembly 1' includes a first stage 11' and a second stage 12' connected together, with the second stage 12' being light-transmitting. The pressure head 2' and the CCD camera 3' are respectively disposed on the upper and lower sides of the second stage 12'. A flexible substrate 4' is supported on the first stage 11', and the bonding area of ​​the flexible substrate 4' is attached to the upper surface of the second stage 12'. To clearly detect the image of the bonding area of ​​the flexible substrate 4', the CCD camera 3' needs to be focused on the upper surface of the second stage 12'. To clearly detect the image of the rigid substrate 5', the rigid substrate 5' also needs to be attached to the upper surface of the second stage 12'. However, the surfaces of rigid substrates 5', such as integrated circuit boards and chips, are very fragile, so they cannot be directly attached to the upper surface of the second stage 12'. The common practice in the prior art is as follows: Figure 1 and Figure 2As shown, (1) the rigid substrate 5′ and the flexible substrate 4′ are fixed on the pressure head 2′ and the stage assembly 1′ respectively, and the bonding area of ​​the flexible substrate 4′ is attached to the second stage 12′; (2) the stage assembly 1′ moves horizontally between the pressure head 2′ and the CCD camera 3′, so that the CCD camera 3′ can acquire images of the flexible substrate 4′; (3) the stage assembly 1′ moves the flexible substrate 4′ horizontally to the avoidance position; (4) the pressure head 2′ moves downward in the vertical direction, and moves the rigid substrate 5′ to a position flush with the upper surface of the second stage 12′, and the CCD camera 3′ focuses on the rigid substrate 5′ and acquires images of the rigid substrate 5′; (5) the pressure head 2′ moves upward in the vertical direction to avoid; (6) the stage assembly 1′ moves the flexible substrate 4′ back to the position between the pressure head 2′ and the CCD camera 3′; (7) the pressure head 2′ moves downward in the vertical direction, so as to bond the bonding area on the rigid substrate 5′ with the bonding area of ​​the flexible substrate 4′. It is evident that existing substrate bonding devices are cumbersome and inefficient in terms of bonding process; moreover, the numerous driving actions of each component lead to a decrease in bonding accuracy.

[0004] Therefore, there is an urgent need for a substrate bonding device and a substrate bonding method to solve the above-mentioned technical problems. Summary of the Invention

[0005] One objective of this invention is to provide a substrate bonding device that, when bonding rigid and flexible substrates, can simultaneously focus on and acquire clear images of a first bonding area and a second bonding area, with fewer steps, high bonding efficiency, and high precision.

[0006] Another objective of this invention is to provide a substrate bonding method that, by employing the aforementioned substrate bonding apparatus, has fewer steps, higher bonding efficiency, and higher bonding accuracy.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] A substrate bonding device for bonding a flexible substrate and a rigid substrate, wherein a first bonding region and a second bonding region are respectively provided on the flexible substrate and the rigid substrate, characterized in that the substrate bonding device comprises:

[0009] A stage assembly, the stage assembly including a first light-transmitting portion and a second light-transmitting portion, the flexible substrate being supported on the stage assembly, and the first bonding area being attached to the upper surface of the first light-transmitting portion, the second bonding area being located on the upper side of the stage assembly and being disposed opposite to the second light-transmitting portion;

[0010] An image acquisition component is disposed below the stage assembly, and the image acquisition component acquires images of the first bonding area and the second bonding area through the first light-transmitting part and the second light-transmitting part, respectively.

[0011] The thickness of the second light-transmitting part is greater than the thickness of the first light-transmitting part, so that the focal point of the image acquisition component acquiring the image through the second light-transmitting part is higher than the upper surface of the first bonding area.

[0012] As an optional solution, the thickness of the first light-transmitting part is T1, the thickness of the second light-transmitting part is T2, and 3mm≤T2-T1≤7mm.

[0013] As an optional solution, the image acquisition component acquires an image at a focal height of H1 through the first light-transmitting part and at a focal height of H2 through the second light-transmitting part, where 1mm ≤ H2 - H1 ≤ 2mm.

[0014] As an alternative, the first light-transmitting part is made of one of the following materials: quartz, plexiglass; and / or

[0015] The second light-transmitting part is made of one of the following materials: quartz or plexiglass.

[0016] As an alternative, the upper surface of the first light-transmitting part and the upper surface of the second light-transmitting part are flush.

[0017] As an optional solution, the substrate bonding device further includes a pressure head assembly, which is disposed on the upper side of the stage assembly. The pressure head assembly can fix and drive the rigid substrate to move up and down. The pressure head assembly and / or the stage assembly can move in the horizontal plane so that the second bonding area and the second light-transmitting portion are (opposite to each other or the second bonding area and the first bonding area are opposite to each other).

[0018] As an optional solution, the stage assembly includes a first stage and a second stage, with the second stage mounted on the first stage, and both the first light-transmitting portion and the second light-transmitting portion constructed on the second stage.

[0019] As an alternative, the first platform includes a support plate, a clamping plate, and fasteners, and the second platform is disposed between the support plate and the clamping plate, with the fasteners locking the support plate and the clamping plate to lock the second platform.

[0020] As an optional solution, the carrier plate includes:

[0021] The lower plate, the clamping plate and the lower plate clamp the second platform;

[0022] An upper plate is disposed on the lower plate. The vertical projection of one end of the upper plate near the second platform falls into the range of the lower plate, so that a stepped surface is formed on the lower plate. The second platform also includes an overlapping part that overlaps the stepped surface.

[0023] As an alternative, the second platform and the upper plate abut against each other at their respective end faces.

[0024] As an optional solution, the upper plate is provided with an airflow channel, one end of which is connected to the upper surface of the upper plate and the other end is connected to the vacuum generating component. The airflow channel is used to adsorb the flexible substrate.

[0025] A substrate bonding method, which uses the aforementioned substrate bonding device to bond the substrate, includes the following steps:

[0026] The flexible substrate is supported on the stage assembly, and the first bonding area is attached to the upper surface of the first light-transmitting portion; the rigid substrate is fixed to the pressure head assembly.

[0027] The pressure head assembly and / or the stage assembly move in the horizontal plane so that the second bonding area is positioned opposite to the second light-transmitting part, and the image acquisition assembly acquires images of the first bonding area and the second bonding area through the first light-transmitting part and the second light-transmitting part, respectively.

[0028] The pressure head assembly and / or the stage assembly move in the horizontal plane to make the second bonding area opposite to the first bonding area. The pressure head assembly drives the rigid substrate to descend so as to bond the second bonding area of ​​the rigid substrate to the first bonding area.

[0029] The beneficial effects of this invention are:

[0030] The substrate bonding apparatus of the present invention, by providing a first light-transmitting portion and a second light-transmitting portion with different thicknesses, changes the focusing position of the image acquisition component in acquiring images of the first bonding area and the second bonding area, respectively. Therefore, without the rigid substrate contacting the stage assembly, the image acquisition component can simultaneously and clearly acquire images of both the rigid and flexible substrates. Thus, during the bonding process, the stage assembly does not need to perform the action of moving the flexible substrate to avoid obstacles in the horizontal plane, and the pressure head assembly does not need to perform the actions of moving the rigid substrate downwards to align with the upper surface of the first light-transmitting portion and moving upwards to avoid obstacles from the stage assembly. This significantly reduces the steps in the bonding process between the flexible and rigid substrates, improving bonding efficiency. Furthermore, by reducing the number of steps in each component's operation, the total motion error can also be reduced, thereby improving bonding accuracy.

[0031] The substrate bonding method of the present invention, by employing the above-described substrate bonding apparatus, has fewer steps, higher bonding efficiency, and higher bonding accuracy. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of a substrate bonding device in the prior art during the bonding process. Figure 1 ;

[0033] Figure 2 This is a schematic diagram of a substrate bonding device in the prior art during the bonding process. Figure 2 ;

[0034] Figure 3 This is a longitudinal cross-sectional structural diagram of the substrate bonding device provided in a specific embodiment of the present invention;

[0035] Figure 4 This is a schematic diagram of the longitudinal section of the second platform provided in a specific embodiment of the present invention;

[0036] Figure 5 This is a top view of the platform assembly provided in a specific embodiment of the present invention;

[0037] Figure 6 This is a schematic diagram of the structure of the second platform provided in a specific embodiment of the present invention.

[0038] In the picture:

[0039] 1′, Stage assembly; 11′, First stage; 12′, Second stage; 2′, Indenter; 3′, CCD camera; 4′, Flexible substrate; 5′, Rigid substrate;

[0040] 10. Platform assembly; 11. First platform; 111. Support plate; 1111. Lower plate; 1112. Upper plate; 1113. Step surface; 112. Clamping plate; 1121. Clearance notch; 113. Fastener; 12. Second platform; 121. First light-transmitting part; 122. Second light-transmitting part; 123. Overlapping part;

[0041] 20. Pressure head assembly;

[0042] 30. Image acquisition component;

[0043] 40. Flexible substrate; 41. First bonding area;

[0044] 50. Rigid substrate. Detailed Implementation

[0045] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention and not the entire structure.

[0046] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0047] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0048] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0049] This embodiment provides a substrate bonding device, which can be used for thermo-press bonding between two substrates, particularly suitable for bonding between a flexible substrate 40 and a rigid substrate 50. Optionally, the flexible substrate 40 can be a flexible screen, a flexible circuit board, etc., and the rigid substrate 50 can be an integrated circuit board, a chip, etc. In this embodiment, the example of a flexible screen as the flexible substrate 40 and an integrated circuit board as the rigid substrate 50 is used for illustration. Figure 3As shown, the flexible substrate 40 has a first bonding region 41, and the rigid substrate 50 has a second bonding region (not shown in the figure). Anisotropic conductive adhesive is disposed on the first bonding region 41 and / or the second bonding region. The substrate bonding device can accurately align the first bonding region 41 and the second bonding region and then heat and pressurize them to achieve bonding between the flexible substrate 40 and the rigid substrate 50.

[0050] like Figure 3 As shown, the substrate bonding device includes a stage assembly 10, a pressure head assembly 20, a pressure head drive assembly (not shown), an image acquisition assembly 30, and a control assembly (not shown). The stage assembly 10 supports the flexible substrate 40. In this embodiment, the stage assembly 10 is horizontally positioned, and the flexible substrate 40 can be fixed to the upper surface of the stage assembly 10. The pressure head assembly 20 is positioned above the stage assembly 10, and can fix the rigid substrate 50 and heat the rigid substrate 50. The pressure head drive assembly can drive the pressure head assembly 20 to move vertically up and down, thereby pressing the rigid substrate 50 onto the flexible substrate 40. The pressure head drive assembly can also drive the pressure head assembly 20 to move horizontally, thereby adjusting the position and orientation of the second bonding area relative to the first bonding area 41 in the horizontal plane. The image acquisition assembly 30 is positioned below the stage assembly 10, and is used to acquire images of the first bonding area 41 and the second bonding area. Optionally, the image acquisition assembly 30 can be a CCD camera, a CMOS camera, etc. Optionally, the stage assembly 10 and the pressure head assembly 20 can fix the flexible substrate 40 and the rigid substrate 50 respectively by vacuum adsorption. Of course, in other embodiments, they can also be clamped by grippers, which is not specifically limited here.

[0051] In some embodiments, the image acquisition component 30 and the pressure head driving component are electrically connected to the control component. After acquiring images of the first bonding area 41 and the second bonding area, the image acquisition component 30 sends them to the control component. The control component processes and calculates the images to determine the positional deviation of the first bonding area 41 and the second bonding area in the horizontal plane, and sends a corresponding command to the pressure head driving component. After receiving the corresponding command, the pressure head driving component adjusts the position of the second bonding area in the horizontal plane to ensure that the second bonding area is vertically aligned with the first bonding area 41. Then, the pressure head driving component drives the pressure head component 20 and the rigid substrate 50 to move downward together, so that the second bonding area and the first bonding area 41 are pressed together. Optionally, the movement of the rigid substrate 50 driven by the pressure head driving component in the horizontal plane includes translation and rotation, thereby flexibly adjusting the position and orientation of the rigid substrate 50. It is understood that any structure in the prior art that can drive the pressure head component 20 to move in the horizontal plane and vertical direction can be used in this application.

[0052] In some embodiments, the substrate bonding device further includes a stage driving assembly capable of driving the stage assembly 10 and the flexible substrate 40 to move in a horizontal plane. The image acquisition assembly 30, the stage driving assembly, and the pressure head driving assembly are electrically connected to the control assembly. In this embodiment, the image acquisition assembly 30 acquires images of the first bonding area 41 and the second bonding area and sends them to the control assembly. The control assembly processes and calculates the images to determine the positional deviation of the first bonding area 41 and the second bonding area in the horizontal plane, and sends corresponding commands to the stage driving assembly and the pressure head driving assembly. After receiving the commands, the stage driving assembly and the pressure head driving assembly drive the stage assembly 10 and the pressure head assembly 20 to move simultaneously in the horizontal plane, thereby aligning the positions of the first bonding area 41 and the second bonding area vertically. Then, the pressure head driving assembly drives the pressure head assembly 20 and the rigid substrate 50 to move downward, causing the second bonding area and the first bonding area 41 to be pressed together. It is understandable that the stage driving assembly drives the flexible substrate 40 to move in the horizontal plane in the manner of translation and rotation, thereby flexibly adjusting the position and orientation of the flexible substrate 40.

[0053] In some embodiments, the substrate bonding device further includes a stage driving assembly, which can drive the stage assembly 10 and the flexible substrate 40 thereon to move in a horizontal plane. The image acquisition assembly 30, the stage driving assembly, and the pressure head driving assembly are electrically connected to the control assembly. In this embodiment, the pressure head driving assembly can only drive the pressure head assembly 20 and the rigid substrate 50 to move up and down. Specifically, after the image acquisition assembly 30 acquires images of the first bonding area 41 and the second bonding area respectively and sends them to the control assembly, the control assembly processes and calculates the images to determine the positional deviation of the first bonding area 41 and the second bonding area in the horizontal plane, and sends corresponding instructions to the stage driving assembly and the pressure head driving assembly respectively. After receiving the instructions, the stage driving assembly drives the stage assembly 10 and the flexible substrate 40 to move in the horizontal plane, thereby aligning the positions of the first bonding area 41 and the second bonding area vertically. Then, the pressure head driving assembly drives the pressure head assembly 20 and the rigid substrate 50 to move downward together, so that the second bonding area and the first bonding area 41 are pressed together.

[0054] like Figure 3As shown, the stage assembly 10 includes a first light-transmitting portion 121 and a second light-transmitting portion 122. When the flexible circuit board is supported on the stage assembly 10, the first bonding area 41 is attached to the upper surface of the first light-transmitting portion 121. The pressure head assembly 20 and / or the stage assembly 10 can move in the horizontal plane, enabling the pressure head assembly 20 and the rigid substrate 50 to be positioned above the second light-transmitting portion 122, with the second bonding area and the second light-transmitting portion 122 arranged vertically opposite each other. The image acquisition assembly 30 can acquire images of the first bonding area 41 through the first light-transmitting portion 121 and can acquire images of the second bonding area through the second light-transmitting portion 122. Since the material of the light-transmitting area is different from that of air, the light-transmitting area will change the propagation path of light. Because the thickness of the first light-transmitting portion 121 and the second light-transmitting portion 122 are different, the focal point (i.e., the focal position) of the image acquisition assembly 30 after passing through the first light-transmitting portion 121 is different from the focal position after passing through the second light-transmitting portion 122.

[0055] Preferably, the thickness of the second light-transmitting portion 122 is greater than the thickness of the first light-transmitting portion 121. Therefore, when the focal point of the image acquisition component 30 after passing through the first light-transmitting portion 121 falls on the upper surface of the first light-transmitting portion 121, the focal point of the image acquisition component 30 after passing through the second light-transmitting portion 122 will be higher than the upper surface of the first bonding area 41. In other words, under the premise that the lower surface of the rigid substrate 50 is higher than the upper surface of the first bonding area 41 (i.e., not in contact with the upper surface of the stage assembly 10), the image acquisition component 30 can focus on the rigid substrate 50 and the flexible substrate 40 respectively, that is, the image acquisition component 30 can simultaneously and clearly acquire the images of the first bonding area 41 and the second bonding area.

[0056] This embodiment also provides a substrate bonding method, which uses the aforementioned substrate bonding device to bond a flexible substrate 40 and a rigid substrate 50. The substrate bonding method includes the following steps: (1) fixing the rigid substrate 50 on the pressure head assembly 20, placing the flexible substrate 40 on the stage assembly 10, so that the first bonding area 41 is attached to the upper surface of the first light-transmitting portion 121; (2) moving the pressure head assembly 20 and / or the stage assembly 10 in a horizontal plane so that the second bonding area is located directly above the second light-transmitting portion 122 and higher than the upper surface of the flexible substrate 40; the image acquisition assembly 30 focuses on the first bonding area through the first light-transmitting portion 121 and the second light-transmitting portion 122 respectively. (3) The stage drive assembly drives the stage assembly 10 and / or the pressure head drive assembly drives the pressure head assembly 20 to move in the horizontal plane, so that the first bonding area 41 is located directly below the second bonding area; (4) The pressure head drive assembly drives the pressure head assembly 20 and the rigid substrate 50 to move downward, so that the first bonding area 41 and the second bonding area are pressed together, and the pressure head assembly 20 is heated at the same time to achieve bonding of the rigid substrate 50 and the flexible substrate 40.

[0057] Therefore, the substrate bonding device of this embodiment, by setting a first light-transmitting part 121 and a second light-transmitting part 122 with different thicknesses, changes the focusing position of the image acquisition component 30 in acquiring images of the first bonding area 41 and the second bonding area, respectively. Thus, without the rigid substrate 50 contacting the stage assembly 10, the image acquisition component 30 can simultaneously and clearly acquire images of the rigid substrate 50 and the flexible substrate 40. Therefore, during the bonding process, the stage assembly 10 does not need to perform the action of moving the flexible substrate 40 to avoid obstacles in the horizontal plane, and the pressure head assembly 20 does not need to perform the actions of moving the rigid substrate 50 downward to be flush with the upper surface of the first light-transmitting part 121 and moving upward to avoid obstacles from the stage assembly 10. This significantly reduces the steps in the bonding process of the flexible substrate 40 and the rigid substrate 50, and improves the bonding efficiency. On the basis of reducing the number of steps in each component's operation, the total motion error can also be reduced, thereby improving the bonding accuracy.

[0058] Preferably, both the first light-transmitting portion 121 and the second light-transmitting portion 122 are made of quartz material. On one hand, quartz material has good light transmittance, thus making the images acquired by the image acquisition component 30 clearer. On the other hand, quartz material has high hardness, so during the use of the substrate bonding device, the first light-transmitting portion 121 and the second light-transmitting portion 122 are less prone to scratches and wear, further ensuring that the image acquisition component 30 can acquire clear images. In other embodiments, the first light-transmitting portion 121 and the second light-transmitting portion 122 may also be made of light-transmitting materials such as plexiglass; no specific limitation is made here.

[0059] Optionally, such as Figure 3 and Figure 4 As shown, the thickness of the first light-transmitting part 121 is T1, and the thickness of the second light-transmitting part 122 is T2, where 3mm ≤ T2 - T1 ≤ 7mm. By setting the thickness difference between the second light-transmitting part 122 and the first light-transmitting part 121 within the above range, the height H1 of the focal point of the image acquired by the image acquisition component 30 through the first light-transmitting part 121 and the height H2 of the focal point of the image acquired through the second light-transmitting part 122 satisfy the following condition: 1mm ≤ H2 - H1 ≤ 2mm. Since the thickness of the flexible substrate 40 is generally less than 300 micrometers, this thickness can be ignored. That is, when the focal point of the image acquisition component 30 after passing through the first light-transmitting part 121 is located on the upper surface of the first light-transmitting part 121, and the focal point of the image acquisition component 30 after passing through the second light-transmitting part 122 is located at 1mm to 2mm above the upper surface of the flexible substrate 40, the lower surface of the rigid substrate 50 will be located at a position approximately 1mm to 2mm higher than the upper surface of the flexible substrate 40. Therefore, when adjusting the position of the flexible substrate 40 and / or the rigid substrate 50 in the horizontal plane, the flexible substrate 40 and the rigid substrate 50 will not interfere or rub against each other.

[0060] Preferably, such as Figure 3 As shown, the upper surface of the first light-transmitting portion 121 and the upper surface of the second light-transmitting portion 122 are flush. On one hand, this provides a unified reference point for processing the first and second light-transmitting portions 121 and 122, facilitating more precise control over their thicknesses. On the other hand, when adjusting the position of the flexible substrate 40 and / or the rigid substrate 50 in the horizontal plane, it prevents the rigid substrate 50 from colliding with the upper surface of the second light-transmitting portion 122.

[0061] Preferably, such as Figure 3 As shown, the stage assembly 10 includes a first stage 11 and a second stage 12. The second stage 12 is mounted on the first stage 11. The portion of the flexible substrate 40 other than the first bonding area 41 (hereinafter referred to as the main body) is supported on the first stage 11. The first light-transmitting portion 121 and the second light-transmitting portion 122 are both constructed on the second stage 12. That is, the first light-transmitting portion 121 and the second light-transmitting portion 122 are integrally formed, reducing the connection structure between the first light-transmitting portion 121 and the second light-transmitting portion 122. This avoids the connection structure affecting the propagation of light within the first light-transmitting portion 121 and the second light-transmitting portion 122, ensuring the image accuracy acquired by the image acquisition assembly 30. Furthermore, since the first bonding area 41 of the flexible substrate 40 does not need to be light-transmitting, a lower-cost metal material or other material can be used when manufacturing the first stage 11, thereby reducing the cost of the substrate bonding device.

[0062] like Figure 3 , Figure 5 and Figure 6 As shown, the first stage 11 includes a support plate 111, a clamping plate 112, and a fastener 113. The second stage 12 is disposed between the support plate 111 and the clamping plate 112. The fastener 113 locks the support plate 111 and the clamping plate 112 to lock the second stage 12. The clamping of the clamping plate 112 and the support plate 111 achieves the fixation of the second stage 12, eliminating the need for drilling holes or other machining on the second stage 12, thus ensuring the accuracy of light propagation within the second stage 12. Optionally, the fastener 113 can be a bolt. The clamping plate 112 has a through hole, and the support plate 111 has a threaded hole. The position of the threaded hole corresponds to the position of the through hole. The fastener 113 passes through the through hole and is threaded into the threaded hole, thereby connecting the support plate 111 and the clamping plate 112. Optionally, two fasteners 113 are provided to ensure the reliability of the connection between the carrier plate 111 and the clamping plate 112. In other embodiments, the number of fasteners 113 may be three or more, which will not be specified here. It is understood that in other embodiments, the carrier plate 111 and the clamping plate 112 may also be connected by pins or other fasteners 113, which will not be specifically limited here.

[0063] like Figure 5 As shown in the figure, the X and Y directions represent two perpendicular directions in the horizontal plane. In this embodiment, the clamping plate 112 is provided with a clearance notch 1121, and the second platform 12 is at least partially accommodated within the clearance notch 1121. On the one hand, when installing the platform assembly 10, the clearance notch 1121 allows the end face of the clamping plate 112 perpendicular to the X direction to abut against the end face of the bearing plate 111 perpendicular to the X direction, thereby facilitating the operator to confirm the relative positions of the clamping plate 112, the bearing plate 111, and the second platform 12, and improving the installation accuracy of the platform assembly 10. On the other hand, the side wall of the clearance notch 1121 perpendicular to the Y direction can position the second platform 12 in the Y direction, thereby improving the positional accuracy of the second platform 12 during installation.

[0064] Preferably, such as Figure 3 , Figure 5 and Figure 6 As shown, the support plate 111 includes a lower plate 1111 and an upper plate 1112. The clamping plate 112 and the lower plate 1111 together clamp the second stage 12. The upper plate 1112 is disposed on the lower plate 1111. The vertical projection of the end of the upper plate 1112 near the second stage 12 falls within the range of the lower plate 111, so that the edge of the lower plate 1111 forms a stepped surface 1113. The second stage 12 also includes an overlapping portion 123, which overlaps on the stepped surface 1113. Through the contact between the overlapping portion 123 and the stepped surface 1113, the second stage 12 and the first stage 11 can be positioned in the height direction, thereby ensuring the installation accuracy of the second stage 12 in the height direction, and thus more accurately controlling the focal position of the image acquisition component 30 after passing through the first light-transmitting portion 121 and the second light-transmitting portion 122 respectively. Optionally, the upper plate 1112 and the lower plate 1111 can be connected by any method such as adhesive bonding, fastener connection, or snap-fit, without any specific limitation.

[0065] When the flexible substrate 40 is placed on the stage assembly 10, the main body of the flexible substrate 40 is supported on the upper plate 1112, and the first bonding area 41 is supported on the first light-transmitting portion 121. Preferably, the upper surface of the upper plate 1112 is flush with the upper surface of the first light-transmitting portion 121, thereby preventing the flexible substrate 40 from bending. Optionally, in this embodiment, there may be one overlapping portion 123; in other embodiments, there may be two or more overlapping portions 123 spaced apart along the Y direction, which is not specifically limited here.

[0066] Preferably, such as Figure 5As shown, the end faces of the second platform 12 and the upper plate 1112 abut against each other. That is, the end face of the second platform 12 perpendicular to the X direction and the end face of the upper plate 1112 perpendicular to the X direction abut against each other. The abutment of these two end faces can position the second platform 12 in the X direction, thereby further improving the positional accuracy of the second platform 12 during installation.

[0067] Optionally, an airflow channel is provided within the upper plate 1112. One end of the airflow channel is connected to the upper surface of the upper plate 1112, and the other end is connected to the vacuum generating component. The airflow channel is used to adsorb the flexible substrate 40, thereby ensuring the stability of the flexible substrate 40 fixed on the stage assembly 10 and preventing damage to the flexible substrate 40. Optionally, the vacuum generating component can be a vacuum pump.

[0068] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. For those skilled in the art, based on the concept of the present invention, there will be changes in specific implementation methods and application scope. The content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the claims of the present invention.

Claims

1. A substrate bonding apparatus for bonding a flexible substrate (40) and a rigid substrate (50), wherein a first bonding region (41) and a second bonding region are respectively provided on the flexible substrate (40) and the rigid substrate (50), characterized in that, The substrate bonding device includes: A stage assembly (10) includes a first light-transmitting portion (121) and a second light-transmitting portion (122). A flexible substrate (40) is supported on the stage assembly (10), and the first bonding area (41) is attached to the upper surface of the first light-transmitting portion (121). The second bonding area is located on the upper side of the stage assembly (10) and can be disposed opposite to the second light-transmitting portion (122). An image acquisition component (30) is disposed below the stage component (10). The image acquisition component (30) acquires images of the first bonding area (41) and the second bonding area through the first light-transmitting part (121) and the second light-transmitting part (122), respectively. The thickness of the second light-transmitting part (122) is greater than the thickness of the first light-transmitting part (121) so that the focal point of the image acquisition component (30) acquiring the image through the second light-transmitting part (122) is higher than the upper surface of the first bonding area (41).

2. The substrate bonding apparatus as claimed in claim 1, characterized in that, The thickness of the first light-transmitting portion (121) is T1, the thickness of the second light-transmitting portion (122) is T2, and 3mm ≤ T2 - T1 ≤ 7mm; and / or The image acquisition component (30) acquires an image through the first light-transmitting part (121) at a focal height of H1, and acquires an image through the second light-transmitting part (122) at a focal height of H2, where 1mm ≤ H2 - H1 ≤ 2mm.

3. The substrate bonding apparatus as claimed in claim 1, characterized in that, The first light-transmitting part (121) is made of one of the following materials: quartz, plexiglass; and / or The second light-transmitting part (122) is made of one of the following materials: quartz or plexiglass.

4. The substrate bonding apparatus as claimed in claim 1, characterized in that, The upper surface of the first light-transmitting part (121) is flush with the upper surface of the second light-transmitting part (122).

5. The substrate bonding apparatus as claimed in claim 1, characterized in that, The substrate bonding device further includes a pressure head assembly (20), which is disposed on the upper side of the stage assembly (10). The pressure head assembly (20) can fix and drive the rigid substrate (50) to move up and down. The pressure head assembly (20) and / or the stage assembly (10) can move in the horizontal plane so that the second bonding area is opposite to the second light-transmitting part (122) or the second bonding area is opposite to the first bonding area (41).

6. The substrate bonding apparatus according to any one of claims 1-5, characterized in that, The stage assembly (10) includes a first stage (11) and a second stage (12), the second stage (12) being mounted on the first stage (11), and the first light-transmitting part (121) and the second light-transmitting part (122) being constructed on the second stage (12).

7. The substrate bonding apparatus as claimed in claim 6, characterized in that, The first platform (11) includes a support plate (111), a clamping plate (112) and a fastener (113). The second platform (12) is disposed between the support plate (111) and the clamping plate (112). The fastener (113) locks the support plate (111) and the clamping plate (112) to lock the second platform (12).

8. The substrate bonding apparatus as claimed in claim 7, characterized in that, The support plate (111) includes: The lower plate (1111) and the clamping plate (112) clamp the second platform (12); An upper plate (1112) is disposed on the lower plate (1111). The vertical projection of one end of the upper plate (1112) near the second platform (12) falls into the range of the lower plate (1111), so that a stepped surface (1113) is formed on the lower plate (1111). The second platform (12) also includes an overlapping part (123), which overlaps on the stepped surface (1113).

9. The substrate bonding apparatus as claimed in claim 8, characterized in that, The second platform (12) and the upper plate (1112) abut against each other at their respective end faces.

10. A method for bonding a substrate, characterized in that, Bonding a substrate using the substrate bonding apparatus according to any one of claims 1-9 includes the following steps: The flexible substrate (40) is supported on the stage assembly (10), and the first bonding area (41) is attached to the upper surface of the first light-transmitting portion (121); the rigid substrate (50) is fixed to the pressure head assembly (20) located above the stage assembly (10); The pressure head assembly (20) and / or the stage assembly (10) move in the horizontal plane so that the second bonding area is positioned opposite to the second light-transmitting part (122), and the image acquisition assembly (30) acquires images of the first bonding area (41) and the second bonding area through the first light-transmitting part (121) and the second light-transmitting part (122) respectively. The pressure head assembly (20) and / or the stage assembly (10) move in the horizontal plane so that the second bonding area is positioned opposite to the first bonding area (41), and the pressure head assembly (20) drives the rigid substrate (50) to descend so as to bond the second bonding area of ​​the rigid substrate (50) to the first bonding area (41).

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