Natural cooling electronic equipment and manufacturing method, cabinet and data center using the same

Abstract

A naturally cooling electronic device and a manufacturing method, a cabinet and a data center using the same. The naturally cooling electronic device comprises: a closed housing for sealing at least part of the electronic components of the naturally cooling electronic device, and mainly conducting heat generated inside the naturally cooling electronic device to the closed housing by heat conduction; wherein the naturally cooling electronic device is cooled by natural cooling. The present invention can achieve efficient cooling without the aid of any external energy source, has low energy consumption, reduces cooling and heat dissipation costs, and reduces the PUE value of the data center; the manufacturing method of the naturally cooling electronic device, cabinet and data center of the present invention is simple, has low construction cost, and is suitable for mass construction.

Description

Technical Field

[0001] The present invention relates to the field of electronic information technology and heat dissipation technology, and in particular to a natural cooling electronic device and a manufacturing method thereof, and a cabinet and a data center using the same. Background Art

[0002] With the rise of e-commerce, enterprise users will process more and more business through the Internet or Intranet, and various business models are beginning to move to the "cloud", which allows enterprises to better save costs and improve efficiency. As an important hardware support for the "network cloud", the number and scale of data centers (Internet Data Center, IDC) are also increasing year by year. Data centers are used to transmit, accelerate, display, calculate, and store various data information on the Internet, and have gradually become "power tigers" everywhere, mainly because the operation of IT equipment and refrigeration systems requires a lot of electricity, especially traditional air conditioning cooling systems.

[0003] For cooling of data centers, the mainstream methods are still air cooling and liquid cooling. In order to save energy, solutions have been proposed to directly use outdoor cold sources, such as fresh air, or indirectly use outdoor cold sources, such as rotary heat recovery, cold water systems, etc. to cool the computer room. When outdoor fresh air is used as a cold source, the cleanliness of the fresh air must be guaranteed. It needs to be filtered and introduced into the computer room through fans and other equipment. When using traditional cold water systems for cooling, the pipelines are large and complex, and the later operation and maintenance are difficult. In addition, pipeline leakage will seriously affect the normal operation of the data center.

[0004] Therefore, as my country vigorously develops and builds various data centers, how to provide data center solutions that can reduce energy consumption and reduce maintenance complexity is an urgent problem that R&D personnel need to solve. Summary of the invention

[0005] In view of this, the main purpose of the present invention is to provide a natural cooling electronic device, a manufacturing method thereof, a cabinet and a data center using the same, in order to at least partially solve the above technical problems.

[0006] In order to achieve the above object, as a first aspect of the present invention, a natural cooling electronic device is provided, comprising:

[0007] A closed housing, used to seal at least part of the electronic components of the naturally cooled electronic device, and to conduct heat generated inside the naturally cooled electronic device to the closed housing mainly by heat conduction;

[0008] Wherein, the naturally cooling electronic device is cooled by a natural cooling method.

[0009] As a second aspect of the present invention, a method for manufacturing a natural cooling electronic device is also provided, comprising the following steps:

[0010] Manufacturing of closed enclosures;

[0011] The heat generating components of the naturally cooled electronic device are attached to the housing, or heat pipes, temperature averaging plates, metal or non-metallic heat conducting structures with high thermal conductivity are used to connect the heat generating components of the naturally cooled electronic device and the inner wall of the closed housing;

[0012] The closed shell is sealed.

[0013] As a third aspect of the present invention, a cluster of the above-mentioned naturally cooling electronic devices is also proposed, comprising at least two of the above-mentioned naturally cooling electronic devices working in collaboration, the cluster of the naturally cooling electronic devices.

[0014] As a fourth aspect of the present invention, a cabinet is further provided, wherein the cabinet adopts an open structure.

[0015] As a fifth aspect of the present invention, a data center is also proposed, wherein the data center adopts at least one natural cooling electronic device as described above.

[0016] Based on the above technical solutions, it can be seen that the naturally cooling electronic equipment, the manufacturing method thereof, the cabinet and the data center using the naturally cooling electronic equipment of the present invention have at least one of the following beneficial effects compared with the prior art:

[0017] (1) The naturally cooled electronic equipment, cabinets and data centers of the present invention do not rely on any external input energy, but only rely on their own endogenous power, or only require a small amount of energy to assist in driving, to drive the heat energy to diffuse out of the equipment and exchange it with the natural environment. The energy consumption is extremely low, meeting the requirements of a data center with general power, and can greatly reduce the heat dissipation cost;

[0018] (2) The manufacturing method of the naturally cooling electronic equipment, cabinet and data center of the present invention is simple, the raw materials are easily available, the cost is low, and no additional water source and wind source are required, which is suitable for the batch construction of naturally cooling data centers in the vast northeast and northwest regions of China;

[0019] (3) The naturally cooled electronic equipment, cabinets and data centers of the present invention are easy to repair and maintain, with low subsequent maintenance costs, lower system PUE values, reduced construction costs and maintenance costs, and achieved energy conservation and emission reduction effects;

[0020] (4) The data center of the present invention is transparent on all sides, so that the main structure can be connected to the outside world in the horizontal direction. The natural wind from the surrounding environment can be largely introduced into the main structure for heat dissipation, so that the interior of the main structure can perform efficient heat dissipation by natural convection. At the same time, the hot air inside the main structure can also quickly float up to the rooftop natural ventilator through the chimney effect and be discharged into the atmosphere. The steel frame structure does not require an additional cooling system and can achieve zero-cost efficient heat dissipation with the help of natural wind, thereby reducing the power consumption of the data center, reducing the PUE value, reducing the construction cost and maintenance cost, and achieving the effect of energy saving and emission reduction.

[0021] (5) The data center of the present invention adopts a metal frame, which has high structural strength and good energy absorption and deformation. It can withstand high-level typhoons and high-intensity earthquakes, can withstand strong winds, rainstorms and extremely cold weather, and is adaptable to a wide range of regions. The data center of the present invention can be flexibly set up and expanded as needed, and is easy to disassemble and maintain. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The method and device of the present invention are further described below in conjunction with the accompanying drawings and embodiments:

[0023] Figure 1 is a schematic structural diagram of a first embodiment of a natural cooling electronic device of the present invention;

[0024] Figure 2 is a structural schematic diagram of a second embodiment of a natural cooling electronic device of the present invention;

[0025] Figure 3 is a schematic structural diagram of a third embodiment of the natural cooling electronic device of the present invention;

[0026] Figure 4A , 4B They are respectively a structural schematic diagram of a fourth embodiment of a naturally cooling electronic device of the present invention and an exploded diagram of a quick-install structure;

[0027] Figure 5 Schematic diagrams of the installation positions of the naturally cooling electronic equipment and the facade of the present invention, wherein (A)-(C) are schematic diagrams of the contact between one face, two faces, and three faces, respectively;

[0028] Figure 6 It is a structural schematic diagram of an embodiment of the present invention in which a naturally cooled electronic device is suspended on a square frame cabinet;

[0029] Figure 7 It is a structural schematic diagram of another embodiment of the present invention in which a naturally cooled electronic device is suspended on a square frame cabinet;

[0030] Figure 8is a three-dimensional view of a chimney effect type cabinet in which the naturally cooled electronic equipment of the present invention is suspended;

[0031] Fig. 9 It is a schematic diagram of the structure of the edge data center of the present invention;

[0032] Fig. 10A , 10B They are respectively a front view and a side view of a data center on one floor using the natural cooling of electronic equipment of the present invention;

[0033] Fig.11A , 11B They are respectively a front view and a side view of a four-story data center using the natural cooling of electronic equipment of the present invention;

[0034] Figures 12A-12C They are respectively a top view of the base of the chimney effect type cabinet of the present invention, a bottom view of the base of the chimney effect type cabinet on which the natural cooling electronic equipment of the present invention is suspended, and a top view of the metal floor;

[0035] Fig.13A , 13B They are the front view and the perspective view of the data center with solar panels installed;

[0036] Fig.14 It is a structural schematic diagram of a data center having a rainwater collection pool on a roof and a cooling water storage pool underground according to the present invention;

[0037] In the above drawings, the meanings of the reference numerals are as follows:

[0038] 1 Natural cooling of electronic equipment 2 Electronic components

[0039] 3 Enclosed housing 4 Equipment cooling unit

[0040] 5 Contact heat transfer surface 6 Equipment external cooling unit

[0041] 7 Frame cabinet 8 Chimney effect cabinet

[0042] 9 All-steel building 10 Natural ventilator

[0043] 11 Contact fixed surface

[0044] 13 Facade 14 Floor

[0045] 31 housing 32 cover

[0046] 35 Spring pin

[0047] 71 Heat conduction frame 72 Cabinet cooling unit

[0048] 82 air flow channel 84 base

[0049] 91 Solar panels 92 Rainwater collection tanks

[0050] 93 Cooling water storage tank DETAILED DESCRIPTION

[0051] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0052] The meanings of some terms in this invention are as follows:

[0053] Electronic equipment refers to equipment that is composed of electronic components such as transistors, electron tubes, integrated circuits, etc., and uses electronic technology (including software) to function. Electronic equipment includes various devices that use analog or digital circuits for detection, control, calculation, communication and other functions.

[0054] IT (Information Technology) refers to information technology.

[0055] IT equipment refers to equipment that performs information technology processing. It is also limited to any equipment mounted on a rack (called rack-mounted equipment). Such equipment typically includes servers, dedicated storage arrays, network switches and routers, power supply and distribution, and remote management equipment.

[0056] Data center refers to "an entity consisting of computer sites (computer rooms), other infrastructure, information system hardware and software, information resources (data) and personnel, as well as corresponding rules and regulations". In the present invention, data centers include highly centralized Internet data centers (IDCs), national data centers (NDCs) and enterprise data centers (EDCs), as well as edge data centers located close to the user end.

[0057] The closed housing includes a fully closed housing and a semi-closed housing. The fully closed housing can completely seal at least some electronic components, and the semi-closed housing has certain openings or holes on the basis of the fully closed housing.

[0058] A cabinet is a device used to fix electronic devices and / or equipment and provide a housing environment and protection for them. Since the cabinet in the present invention is an open structure, "cabinet" and "rack" can be used interchangeably.

[0059] Natural cooling, also known as "natural heat dissipation", refers to a cooling / heat dissipation method that allows electronic equipment to work normally without the help of any external power source, and does not rely on forced cooling and forced convection. In the present invention, the natural cooling is achieved by relying solely on the natural wind of the natural environment or the flow of fluid driven by the endogenous driving force of the device. The endogenous driving force described in the present invention includes evaporation and condensation of the evaporation chamber, siphon effect, spontaneous rise of hot air after heating the air, and spontaneous rise of liquid due to heating.

[0060] PUE (Power Usage Effectiveness) is an indicator for evaluating the energy efficiency of a data center, which refers to the ratio of all energy consumed by a data center to the energy consumed by IT loads. PUE = total energy consumption of a data center / energy consumption of IT equipment, where total energy consumption of a data center includes energy consumption of IT equipment and energy consumption of systems such as cooling and power distribution. Its value is greater than 1. The closer it is to 1, the less energy non-IT equipment consumes, i.e., the better the energy efficiency level.

[0061] With the continuous formulation and improvement of standards, the construction and development of data centers have gradually developed into certain fixed modes. For example, it is usually necessary to ensure the temperature and humidity of the internal space of the data center and the cleanliness of the air. The cooling methods of data centers are mainly forced air cooling and liquid cooling. The more mature cooling methods currently include air conditioning refrigeration, indirect liquid cooling with cooling towers, immersion liquid cooling with complex heat exchange equipment, etc. These cooling methods have the disadvantages of high energy consumption and high cost. Many improvements have been proposed in the existing technology to address these disadvantages, such as introducing fresh air or using natural water bodies. However, due to the constraints of the above standards, the space of the data center is closed, and the introduction of external cold sources still requires the use of fans, water pumps and other power-consuming driving devices. With the construction boom of data centers, data centers are getting bigger and bigger, and the proportion of electricity consumption in total operating costs has remained high (according to reports, it will reach about 50% in 2025). How to reduce the daily energy consumption of data centers and operate them at low cost and high quality is a technical problem that technical personnel in the R&D and manufacturing industries of data centers urgently need to solve.

[0062] In this regard, after in-depth research, the inventors have proposed an idea that is completely different from the existing centralized forced cooling of data centers. This idea breaks the mindset that data centers have always adopted centralized forced cooling, overcomes the prejudice of technical personnel in this field, can save the high energy consumption and high cost of forced cooling, and greatly reduce the operation and maintenance costs of the entire data center. In addition, the above idea is not a simple retro idea. Although the heat dissipation field did propose a solution to achieve natural cooling by increasing the volume of the radiator in the early days, when modern, highly integrated, and high-heating power data centers need to be cooled, technical personnel in this field will no longer go back to this bulky and inefficient heat dissipation method. The large size of the heat sink will cause great trouble to the installation and maintenance of the system. The layout of the heat sink, the disassembly and assembly of electronic equipment, and the heavy weight of the equipment that requires additional support all require a lot of research and development energy from technical personnel. Therefore, technical personnel in this field have a strong technical prejudice against the idea of ​​using external bulky heat sinks for natural cooling. The present invention adopts various advanced natural cooling technologies, considers natural cooling comprehensively within the scope of the entire data center, assists in designing various transverse wind / longitudinal wind cooling channels, and specially designed cabinets and racks, and proposes a new natural cooling idea. This solution reduces the heat flux density per unit area of ​​electronic equipment to below a set threshold by natural cooling at the equipment level, diffuses the heat of each electronic equipment to its main cooling unit and external cooling unit as much as possible for natural cooling, opens the entire data center on all sides to allow natural wind to help cool the equipment, and turns the entire data center building and components into a large radiator to reduce the energy consumption of refrigeration equipment.

[0063] Specifically, Figure 1-14 As shown, the present invention provides a natural cooling electronic device 1, comprising:

[0064] A closed housing 3, used to seal at least part of the electronic components 2 of the naturally cooled electronic device, and to conduct heat generated inside the naturally cooled electronic device to the closed housing 3 by heat conduction;

[0065] The naturally cooled electronic device may be cooled only by natural cooling, or by adding auxiliary cooling means appropriately on the basis of natural cooling. However, it should be emphasized that the present invention does not adopt a forced cooling method.

[0066] The closed shell 3 is made of a material with a high thermal conductivity (e.g., greater than or equal to 10 W / m·K, preferably greater than or equal to 30 W / m·K), and the material with a high thermal conductivity may include metal and / or non-metal, preferably at least one of stainless steel, carbon steel, aluminum alloy, magnesium alloy, magnesium-lithium alloy, copper alloy, silver, high thermal conductivity ceramics (High Thermal Conductivity Ceramic Materials), aluminum-based silicon carbide, graphite composite materials, diamond composite materials, and graphene composite materials. The high thermal conductivity ceramics may be, for example, beryllium oxide, aluminum nitride, silicon carbide, silicon nitride, aluminum oxide, and polycrystalline diamond (PCD) ceramics.

[0067] The sealing process includes full sealing and semi-sealing, and the semi-sealing process includes the step of forming air holes on the closed shell 3. Preferably, the air holes formed by the semi-sealing process are splashproof to prevent water from directly flowing into the closed shell.

[0068] Among them, the closed shell 3 preferably includes a plurality of shells 31 and an optional, matching and closed cover 32; the heat-generating components 2 of the naturally cooled electronic device are attached to the shells 31, or the heat-generating electronic components 2 of the naturally cooled electronic device 1 transfer heat to the closed shell 3 through heat pipes, temperature averaging plates, high thermal conductivity metal or non-metallic thermal conductive structures.

[0069] Preferably, the shell 31 can be one, and at least one cover 32 is matched with it to form a complete closed space. The shell 31 can also be two, that is, two halves, which are combined together to form a complete closed space, and there can be no cover 32. The shell 31 and the cover 32 can also be other numbers, as long as they can be combined together to form a complete closed space.

[0070] Preferably, the housing 31 may be an integrally formed aluminum alloy housing 31, for example, an aluminum alloy housing 31 integrally formed by an aluminum extrusion process, with one end sealed by welding, and in the shape of a straight quadrangular prism. The cover 32 matched therewith may be similar to the end cover sealed by welding, and may be connected and fixed to the housing 31 by a quick release device or detachable bolts.

[0071] Preferably, the closed housing 3 further provides airtight treatment for at least part of the electronic components 2 of the naturally cooling electronic device 1 , thereby strictly isolating water vapor and air from entering the closed housing 3 .

[0072] Preferably, the closed housing 3 can provide ordinary waterproof protection for at least part of the electronic components 2 of the naturally cooled electronic device 1, such as strong splash protection with IEC IP above 6; further preferably, the closed housing 3 can provide waterproof and dustproof protection for part of the electronic components 2 of the naturally cooled electronic device 1, such as IP56; even further preferably, the closed housing 3 provides "three-proof" protection for part of the electronic components 2 of the naturally cooled electronic device 1, namely, waterproof, dustproof, mildew-proof and salt spray-proof; most preferably, for example, an air-sealing treatment is performed.

[0073] Preferably, heat transfer is achieved between the heat pipe, the temperature equalizing plate, the metal or non-metal thermal conductive structure with high thermal conductivity and the heat-generating electronic component 2 of the naturally cooled electronic device 1, or between the closed housing 3 and the heat-generating electronic component 2 of the naturally cooled electronic device 1, or between the closed housing 3 and the heat pipe, the temperature equalizing plate, the metal or non-metal thermal conductive structure with high thermal conductivity, through a low thermal resistance thermal interface material, and the low thermal resistance thermal interface material is, for example, selected from liquid metal, phase change material, thermal grease, thermal adhesive, thermal pad and / or indium foil.

[0074] Preferably, the heat can be evenly distributed on the surface of the closed shell 3 through a heat pipe, a temperature equalizing plate, a metal or non-metallic heat-conducting structure with high thermal conductivity, so that the entire surface of the closed shell 3 can play a role in heat dissipation.

[0075] Through the above design, for some occasions with relatively low heat and power consumption, such as data storage centers, natural wind can be fully utilized to cool the equipment simply through the design of the above closed shell, greatly reducing the equipment cost and operating expenses invested in the cooling equipment.

[0076] The naturally cooling electronic device 1 may further include a device body cooling unit 4, which is located on the outer surface of the closed housing 3 and is used to transfer at least part of the heat of the closed housing 3 to the natural environment.

[0077] Preferably, the equipment body cooling unit 4 can be integrally formed with the closed housing 3, thereby simplifying the processing technology. Of course, a split equipment body cooling unit 4 can also be used, so that it can be added later based on specific needs, and the setting is more flexible and efficient.

[0078] Preferably, the equipment body cooling unit 4 is a finned heat sink or an evaporative condenser driven by no external energy source.

[0079] Preferably, the surface of the equipment body cooling unit 4 is provided with a thermal control coating with an emissivity greater than or equal to 0.8, which not only facilitates surface radiation heat dissipation, but also reduces dust adhesion and facilitates dust collection by a vacuum cleaner.

[0080] Preferably, the equipment body cooling unit 4 includes a plurality of heat dissipation fins, the spacing between any two heat dissipation fins is between 5 and 20 mm, more preferably 10 mm; the thickness of the heat dissipation fins is between 0.5 and 5 mm, preferably 2 mm; the height of the heat dissipation fins is between 10 and 200 mm. More preferably, the heat dissipation fins are arranged vertically, in line with the direction of rising hot air.

[0081] Preferably, the heat can be evenly distributed on the surface of the equipment body cooling unit 4, for example, by means of a heat pipe, a temperature equalizing plate, a metal or non-metallic heat-conducting structure with high thermal conductivity.

[0082] The addition of the equipment body cooling unit 4 can make the data center cooling more efficient and suitable for more heat dissipation scenarios, such as low-power data computing centers and other scenarios.

[0083] The naturally cooling electronic device 1 may further include a contact heat-conducting surface 5, which is disposed on the outer surface of the closed shell 3 and is used to transfer part of the heat on the closed shell 3 to the device external cooling unit 6 in contact with the contact heat-conducting surface 5; the device external cooling unit 6 is located outside the naturally cooling electronic device 1 and does not belong to the naturally cooling electronic device 1, and is used to transfer part of the heat on the closed shell 3 of the naturally cooling electronic device 1 to the natural environment in a natural cooling manner. There are many options for the device external cooling unit 6. In the present invention, for example, it may be a frame cabinet, a chimney effect cabinet, a full steel frame building, etc., which are described below, or a natural flowing water body heat exchange device, a natural evaporative cooling device (without forced cooling and heat exchange), etc. The present invention is not limited thereto, and any device that can achieve natural cooling may be included.

[0084] Preferably, heat is transferred from the heat-generating electronic components 2 of the naturally cooled electronic device 1 to the contact thermal conductive surface 5 through a heat pipe, a temperature homogenizing plate, a metal or non-metal thermal conductive structure with high thermal conductivity, and is evenly distributed on the entire surface of the contact thermal conductive surface 5.

[0085] Preferably, the area of ​​the contact heat-conducting surface 5 is between 1% and 90% of the total outer surface of the closed shell 3, preferably between 16.7% and 50%;

[0086] Preferably, the roughness Ra of the contact heat-conducting surface 5 is better than 3.2 μm, preferably less than 0.4 μm;

[0087] Preferably, the flatness of the contact heat-conducting surface 5 is better than 0.3 mm / (100 mm*100 mm), preferably 0.1 mm / (100 mm*100 mm).

[0088] Preferably, the shape of the contact heat-conducting surface 5 is a plane, or a shape that matches the contour of the contact heat-conducting part of the equipment's external cooling unit 6; the interior of the contact heat-conducting surface 5 and the interior of the contact heat-conducting part that matches it are buried with, for example, heat pipes, temperature averaging plates, and metal or non-metal heat-conducting structures with high thermal conductivity that are in contact with or adjacent to each other, thereby increasing the heat transfer efficiency between each other.

[0089] Preferably, heat transfer is achieved between the contact heat-conducting surface 5 and the external cooling unit 6 of the device through a low thermal resistance thermal interface material, and the low thermal resistance thermal interface material is preferably selected from liquid metal, phase change material, thermal grease, thermal adhesive, thermal pad and / or indium foil.

[0090] Preferably, the heat dissipated by the contact heat-conducting surface 5 can account for more than one-tenth of the total heat generated inside the naturally cooled electronic device, preferably more than one-third, and more preferably at least more than half. The more heat dissipated by the contact heat-conducting surface 5, the higher the heat transfer efficiency required from the heat-generating electronic component 2 to the contact heat-conducting surface 5, and the higher the thermal conductivity required for the heat pipe, the temperature spreader, and the metal or non-metal heat-conducting structure with high thermal conductivity.

[0091] Preferably, when the naturally cooled electronic device is running at maximum power, the present invention can control the heat flux density per unit area of ​​the closed housing 3 to be below a first threshold value; the first threshold value is set to, for example, 0.1 W / m 2 , preferably set to 0.04W / m 2 .

[0092] In addition, the naturally cooled electronic device of the present invention can be cooled and dissipated by completely natural cooling, and some other auxiliary heat dissipation means can be appropriately added to improve the cooling and heat dissipation efficiency. For example, the naturally cooled electronic device can also include a fan arranged near or close to the device body cooling unit 4, which is used to assist in heat dissipation by directly blowing or guiding airflow through the device body cooling unit 4. However, it should be noted that this setting of the present invention is different from the forced cooling method of completely dissipating heat by direct blowing. It is more important to guide the airflow and introduce outdoor cold air into the room. It only serves as an auxiliary heat dissipation for the natural cooling method of the present invention.

[0093] In addition, the naturally cooled electronic device in the present invention may also include a liquid cooling plate arranged close to the contact heat conductive surface or a liquid cooling channel arranged inside the contact heat conductive surface, which is used to assist heat dissipation by cooling liquid flowing through the liquid cooling plate or the liquid cooling channel. Similarly, these liquid cooling methods are also different from conventional forced liquid cooling, and do not require high-power cooling towers and air conditioning heat exchange devices. They mainly assist heat dissipation by liquid flow and heat exchange with natural cold sources, which is only a supplement to the natural cooling method of the present invention.

[0094] The naturally cooling electronic equipment includes, for example, IT equipment and other functional equipment; the IT equipment may include at least one of computing equipment, storage equipment and network equipment; the other functional equipment may include at least one of power supply and distribution equipment, interface equipment and safety protection equipment. For computing equipment, for example, it includes CPU, GPU and other computing components; for storage equipment, for example, it includes magnetic storage, optical disk storage, magneto-optical storage, etc., wherein magnetic storage further includes hard disk (HD), solid state drive (SDD), EPPRAM, etc.

[0095] In a preferred embodiment, the IT equipment is, for example, a computing device, which includes, for example, 1, 2, 3, 4, 5, 6, 7, 8, 16, 32, 64, 128, ... CPUs and / or GPUs, which may be located on 1, 2, 3, 4, 5, 6, 7, 8, ... circuit boards, and the backs of the CPU and / or GPU heating elements are in close contact with low thermal resistance thermal interface materials and heat pipes, temperature spreaders, and high thermal conductivity metal or non-metallic thermal conductive structures to achieve heat transfer, so as to efficiently transport the heat generated by them to the equipment body cooling unit 4 and / or the contact thermal conductive surface 5.

[0096] In another preferred embodiment, the IT device is, for example, a storage device, which includes, for example, 1, 2, 3, 4, 5, 6, 7, 8, 16, 32, 64, 128, ... mechanical hard disks (HDs), solid state disks (SDDs) and / or single or multiple optical disk drive devices (CD, DVD, SVCD, Blu-ray), etc. A heat pipe, a temperature plate, a metal or non-metal heat-conducting structure with high thermal conductivity, etc. are also arranged near the heat-generating position of the storage device, so as to efficiently transfer the heat generated by it to the device body cooling unit 4 and / or the contact heat-conducting surface 5.

[0097] In a preferred embodiment, the IT equipment is, for example, power supply and distribution equipment, which includes several high-power transformers and / or large capacitors. The heat-generating position of the power supply and distribution equipment (such as the silicon steel sheet of the transformer) is also close to the heat pipe, the temperature equalizing plate, the metal or non-metallic heat-conducting structure with high thermal conductivity, etc., so as to efficiently transfer the heat generated by it to the equipment body cooling unit 4 and / or the contact heat-conducting surface 5.

[0098] In a preferred embodiment, the IT equipment is encapsulated in a closed housing 3, for example, by a buffering and shockproof structure, so that the internal electronic components 2 will not be damaged if the equipment is accidentally dropped during installation.

[0099] The naturally cooled electronic device may be provided with a heating unit inside, for example, to enable the naturally cooled electronic device to start and stop normally even at low temperatures; preferably, the heating unit is, for example, a heating film, a PTC heating sheet, a TEC semiconductor cooler, etc. When the indoor temperature is below 0°C, the heating unit is started to make the temperature inside the naturally cooled electronic device higher than 0°C, thereby ensuring that the naturally cooled electronic device can start normally. After normal startup, the heat generated by the heating electronic components of the device can keep the device working in an appropriate temperature zone, at which time the working state of the heating unit can be terminated.

[0100] Therefore, since the present invention is different from the traditional data center, the IT equipment is first encapsulated in a closed shell 3, and the core components are tightly protected by the closed shell 3, so it is not necessary to avoid moisture and dust, so that the data center is in an open space, allowing the outdoor wind to blow freely to the equipment cabinet without hindrance; and the body heat dissipation element 4 and the contact heat conduction surface 5 of the equipment itself greatly expand the volume of the heat dissipation unit, which can reduce the energy consumption of forced cooling, and is suitable for the establishment of large IDCs in places such as the northwest and northeast where the outdoor temperature is low, the space is relatively open, and the rent is cheap. Furthermore, since the configured heat dissipation structures are carefully calculated and designed to meet specific threshold requirements, it can be ensured that when many IT equipment are used, they can meet the design requirements, and will not interfere with each other or increase costs due to excessive design.

[0101] The present invention also discloses a method for manufacturing a natural cooling electronic device, comprising the following steps:

[0102] Manufacturing a closed housing 3; the closed housing 3 preferably includes a plurality of housings and an optional cover body that is matched and closed therewith;

[0103] The heat generating components 2 of the naturally cooled electronic device 1 are attached to the housing, or heat pipes, temperature averaging plates, metal or non-metallic heat conducting structures with high thermal conductivity are used to connect the heat generating components of the naturally cooled electronic device and the inner wall of the closed housing;

[0104] The closed housing 3 is sealed.

[0105] Preferably, in the sealing treatment step, the closed shell and the equipment body cooling unit are formed integrally.

[0106] Preferably, the manufacturing method further comprises, after the sealing step, fixing a device body cooling unit 4 on the closed shell 3 by welding or screwing, so as to transfer at least part of the heat of the closed shell 3 to the natural environment through the device body cooling unit 4.

[0107] Preferably, the manufacturing method further comprises a step of forming a contact thermal conductive surface 5 on the closed shell 3 after the sealing treatment step, wherein the contact thermal conductive surface 5 is a part of the outer surface of the closed shell 3, and is used to conduct part of the heat on the closed shell 3 to an equipment external cooling unit 6 in contact with the contact thermal conductive surface 5; the equipment external cooling unit 6 is located outside the naturally cooled electronic device 1, and is used to transfer part of the heat on the closed shell 3 of the naturally cooled electronic device 1 to the natural environment in a natural cooling manner.

[0108] When the naturally cooled electronic device 1 is running at maximum power, the heat flux density per unit area of ​​the closed housing 3 can be controlled below a first threshold, so that the naturally cooled electronic device can achieve natural cooling without any external input energy. The first threshold is 0.1 W / m 2 , preferably 0.04W / m 2 .

[0109] In a preferred embodiment, as shown in the figure, in the sealing step of the above-mentioned closed shell 3, a full metal shell 31 with one or both ends open can be used, and the electronic components 2 can be encapsulated inside through a cover 32. The closed shell 3 is through heat pipes, temperature averaging plates, metal or non-metallic heat-conducting structures with high thermal conductivity, etc., on the one hand, heat is conducted to the equipment body cooling unit 4, and on the other hand, heat is conducted to the contact heat-conducting surface 5. The closed shell 3 can be fixed by an integrally formed heat dissipation frame structure that is sleeved on the closed shell 3, and a retractable spring pin 35 is provided to fix and position it. When quick disassembly is required, the spring pin 35 is pressed to retract it into the closed shell 3, so that the closed shell 3 can be quickly disassembled.

[0110] The present invention also discloses a cluster of naturally cooling electronic devices 1 as described above, comprising at least two or more of the above-mentioned naturally cooling electronic devices 1 working in collaboration, and the cluster of naturally cooling electronic devices 1 can also reduce the heat flux density per unit area inside the naturally cooling electronic devices 1 to below a first threshold, so that the cluster of naturally cooling electronic devices 1 can achieve natural cooling without the aid of any external input energy.

[0111] Preferably, the number of the collaborative natural cooling electronic devices is, for example, 3, 4, 5, 6, 7, 8, 9, 10, 12, 16, 24, 32, ... The collaborative natural cooling electronic devices 1 are connected through power and signals and can collaboratively complete the specified task under the control of the service scheduler.

[0112] The present invention also discloses a server, comprising at least two of the above-mentioned natural cooling electronic devices, and the server is not equipped with high-power consumption cooling equipment, such as air conditioning, water-cooled forced heat exchange, coolant forced heat exchange and other equipment, but natural evaporation and immersion reflux cooling equipment that is spontaneously driven by no energy source can be provided.

[0113] The present invention also discloses a cabinet, which adopts an open structure, preferably a four-sided open structure, and further preferably a six-sided fully open structure without panels. The cabinet, for example, includes a heat-conducting frame 71 or a heat-conducting plate, and a contact fixing surface 11 for fixing the naturally cooled electronic device 1; the contact fixing surface 11 has an outer contour that matches the contact heat-conducting surface 5 of the naturally cooled electronic device 1, through which the heat transferred by the contact heat-conducting surface 5 is transferred to the heat-conducting frame 71 or the heat-conducting plate for natural cooling; wherein the naturally cooled electronic device 1 includes a closed shell 3 for sealing the electronic components 2 of the naturally cooled electronic device 1, the contact heat-conducting surface 5 is arranged on the outer surface of the closed shell 3, and the heat generated by the naturally cooled electronic device 1 is transferred to the contact heat-conducting surface 5 on the closed shell 3 by heat conduction.

[0114] Preferably, the cabinet may further include a cabinet cooling unit 72 , and the heat diffused onto the heat-conducting frame 71 or the heat-conducting plate is further conducted to the cabinet cooling unit 72 for natural cooling.

[0115] Preferably, heat can be evenly distributed on the surface of the heat-conducting frame 71, heat-conducting plate and / or cabinet cooling unit 72, for example, by means of a heat pipe, a temperature-averaging plate, a metal or non-metal heat-conducting structure with high thermal conductivity.

[0116] Preferably, a contact fixing device 12 is further provided between the contact fixing surface 11 and the contact heat conducting surface 5 , and the contact fixing device 12 adopts a quick-install structure to facilitate quick installation and disassembly.

[0117] Preferably, the cabinet is a square-frame cabinet 7 having a frame structure, preferably a rectangular frame structure.

[0118] Preferably, the cabinet is a chimney effect type cabinet 8 having a chimney effect type structure, and the chimney effect type structure is an air flow channel inside the chimney, or is located on the surface of the cabinet.

[0119] The heat-conducting frame 71 of the cabinet can be deformed in various ways, such as into a flat plate, column, spiral, double spiral, spherical, etc., as long as the heat dissipation area can be expanded and the cooling of the equipment by natural wind is not hindered. More preferably, the deformation of the heat-conducting frame 71 of the cabinet can also form a spontaneous airflow channel to accelerate the flow of gas and improve the cooling efficiency. For example, a continuous airflow channel that is connected to the roof chimney is formed inside or on the surface of the heat-conducting frame 71 of the cabinet, or different temperature zones are formed indoors to drive the surrounding airflow to flow to the middle, etc.

[0120] The present invention also discloses a data center using at least one naturally cooling electronic device as described above. Preferably, the data center includes, for example, at least one accommodation space for accommodating the naturally cooling electronic device. There may also be multiple accommodation spaces, such as a row of single-story houses, a plurality of multi-story buildings, etc.

[0121] The data center may adopt an open structure, i.e., a structure with a non-zero permeability. Preferably, the permeability of the natural cooling data center is greater than or equal to 5%, more preferably greater than or equal to 33%, and further preferably greater than or equal to 60%. As a preferred embodiment, the natural cooling data center has no external walls on all four sides, allowing natural wind to pass through; or has thermal insulation external walls on all four sides, but has windows on the walls that can control the size of the air inlet, and the windows ensure that natural wind can freely enter and exit during operation.

[0122] Preferably, a specific flow channel for lateral wind is formed inside the data center through the layout of cabinets and auxiliary means such as wind guide plates, so that the natural wind passing through the hall can be purposefully guided to blow through the equipment to be cooled, thereby enhancing the efficiency of natural cooling.

[0123] The main building structure of the data center can be made of steel frame, aluminum alloy frame, wood structure, concrete structure, polymer film, polymer fiber, etc. The main building structure of the data center is preferably made of high thermal conductivity material, so that part of the heat generated by the naturally cooled electronic equipment contained therein can be transferred to the main building structure and transferred to the natural environment in a natural cooling manner, without the need for forced cooling by external input energy, thereby achieving the purpose of energy saving and environmental protection. Further preferably, the main building structure of the data center is made of steel or aluminum.

[0124] Preferably, the data center adopts a modular structure to achieve rapid construction through assembly. The modular structure includes, for example, standardized, factory-prefabricated building components, such as load-bearing columns, frame beams, wall panels, floor mounting frames (I-beams), floors, roofs with natural ventilators, exterior wall panels, exterior wall shutters, standard cabinets, fan walls, etc.

[0125] Among them, at least one horizontal direction of the data center is provided with a shielding structure, and the shielding structure can be, for example, any one of a rolling door structure, a rolling film structure, a window structure, a folding barrier, and a push-pull barrier. The shielding structure can be closed or opened to form an open structure; preferably, louver-shaped baffles can also be installed in the four directions of the data center, and the rotating axis of the louver-shaped baffle is a horizontal axis, and the angle of rotation of the baffle can be adjusted to adjust the amount of air entering the room. In winter or extremely cold areas, such as the North and South Poles, the intake of cold air can be reduced to ensure that the equipment in the data center operates in a suitable temperature range. In addition, screens or filters can also be set in the gaps of the louver-shaped baffles to appropriately reduce dust, etc.

[0126] It is preferred that each floor of the data center adopts a floor with a through structure, so that the airflow under the floor can move upward through the through structure. The through structure can be, for example, a through hole with a small aperture arranged in a specific manner, or a large hollow area.

[0127] Preferably, the floor of the data center is made of a material with high thermal conductivity, and the material with high thermal conductivity includes metal and / or non-metal, preferably at least one of aluminum alloy, copper alloy, magnesium alloy, magnesium-lithium alloy, silver, carbon steel, stainless steel, high thermal conductivity ceramics (High Thermal Conductivity Ceramic Materials), silicon carbide, aluminum-based silicon carbide, graphite composites, diamond composites, graphene composites, etc.

[0128] Preferably, the data center forms a longitudinal wind flow path through the natural ventilator on the floor and roof that penetrates from top to bottom, and utilizes the chimney effect to enhance the efficiency of natural cooling. It should be noted that when the chimney effect cabinet 8 is used, the air flow channel 82 inside the cabinet directly passes through the roof, and there is a strong "chimney effect". Due to the floor that penetrates from top to bottom, the rising hot air flow on the outer surface of the cabinet can also form a "chimney effect" and also form a longitudinal wind flow path. When the frame cabinet 7 is used, since there is no internal air flow channel, there is only the "chimney effect" formed by the rising hot air flow on the outer surface of the cabinet to form a longitudinal wind flow path.

[0129] When the chimney effect cabinet 8 is used, the data center preferably sets a mezzanine (bottom floor) under the first floor as an air intake layer, and the top of the air intake layer is provided with a plurality of air intakes penetrating the layer board and connected with the bottom of the chimney effect cabinet 8 of the upper floor, and openings can be set on the walls of the surrounding sides of the air intake layer to inlet air, and fans can also be set in the openings to assist in strengthening the air flow. Alternatively, the first floor can be directly set on the ground (bottom floor), and in this case, air intakes are set at the bottom of the chimney effect cabinet 8 facing the surroundings.

[0130] Preferably, the air inlet openings are arranged in a spiral shape, for example, so that the incoming air forms a spiral enhanced airflow in the chimney effect cabinet 8 to avoid mutual interference and weakening of the airflow.

[0131] The airflow channel of the chimney effect cabinet 8 may also include, for example, a valve or baffle that can adjust the airflow size. The valve or baffle may be a rotating type, a flip type, or an open-close type; it may be set at any position in the airflow channel as long as it is convenient for operation, but at least one set should be set at the bottom air inlet, because it is more conducive to control from the source to avoid adverse effects.

[0132] The data center may also include an exhaust structure located on the roof, which is used to exhaust the hot air flow that passes through the top and bottom from the roof; the exhaust structure is preferably a natural ventilator or an unpowered wind hood. When the floor is relatively high and there are many chimney effect type cabinets 8, it is preferred to use a natural ventilator, which is located in the middle of the roof to converge the rising airflow of all chimney effect type cabinets 8. When there are relatively few chimney effect type cabinets 8, for example, an unpowered wind hood may also be used. Each chimney effect type cabinet 8 corresponds to a chimney, and an unpowered wind hood is set on the top of the chimney. Through natural ventilators and unpowered wind hoods, the chimney effect can be enhanced, the cooling efficiency of the chimney effect type cabinets can be improved, and at the same time, rainwater can be isolated from entering the air flow channel.

[0133] The data center may also be provided with a plurality of fans, which are used to directly blow the naturally cooled electronic equipment and / or cabinets for cooling, or, instead of blowing directly, assist in exhausting the hot air inside the data center. The fans may form a fan wall or may be arranged separately. Preferably, the fans may be located, for example, under the floor or on the air inlet side of the vertical wall to blow air to form an airflow, and / or, the fans may also be located on the roof or on the air outlet side of the vertical wall to suck air to form an airflow.

[0134] The data center may also be provided with a plurality of detachable air guide plates for guiding cold air to flow through the naturally cooled electronic equipment when the fan is working. The air guide plates may be independently provided, independently supported, and fixed on the floor or wall; or they may be part of the cabinet, for example, provided in a gradually shrinking shape, and aligned with the equipment body cooling unit 4 on the naturally cooled electronic equipment 1 and / or the equipment external cooling unit 6 on the cabinet.

[0135] The data center may also appropriately arrange solar panels to provide part of the energy, and the arrangement of the solar panels cannot block the passage of natural wind. Therefore, when setting up the solar panels, it is necessary to consider both the angle of sunlight, that is, the projection area of ​​sunlight on the solar panels, and the direction of natural wind all year round. When setting up, try to use the roof, the eaves space below the windows, and the ground. The first floor of the data center can be left empty for office, parking and other purposes. By arranging the main heating equipment on high floors, it is more susceptible to natural wind and speeds up the heat dissipation efficiency. It can also increase the height of the floors and enhance the chimney effect.

[0136] The data center may also utilize the electric energy generated by solar panels to drive fans, guide or assist in controlling the airflow that moves spontaneously due to heat in the data center, so as to form a stable and continuous airflow to accelerate cooling.

[0137] Among them, the data center can also appropriately increase liquid cooling, and the liquid cooling equipment belongs to self-driven or micro-driven natural cooling liquid cooling equipment, for example, by setting up a rainwater collection pool under the roof eaves, or setting up a cooling water storage pool at a certain depth underground, and then using gravity or a micro water pump to give a relatively small driving force to circulate and take away the heat of the entire cabinet or even the entire steel frame building, and the heat is dissipated through the unpowered water cooling tower on the roof, or by heat exchange with the low-temperature soil layer underground. The high-power consumption and forced cooling solution is not within the scope of consideration of the present invention.

[0138] In the data center, the naturally cooling electronic device 1 can be located on a floor, a cabinet (rack), a shelf, a column and / or a facade (including a wall). Preferably, the naturally cooling electronic device conducts heat to a corresponding structure by contacting a heat conducting surface 5 to enhance heat dissipation.

[0139] The present invention will be further described below through specific examples. It should be noted that the following examples are only for illustration and are not intended to limit the present invention.

[0140] Example 1

[0141] like Figure 1 As shown, Embodiment 1 of the present invention discloses a naturally cooled electronic device 1 in which a heat generating electronic component 2 is a storage device. The storage device is a hard disk group, and the heat generating part of the storage device (the heat generating electronic component 2) is tightly attached to a heat conductive metal strip (not shown in the figure) with a high thermal conductivity, and then tightly attached to a shell 31 of a closed shell 3. The heat generated by the heat generating electronic component 2 is conducted to the closed shell 3 of the naturally cooled electronic device 1, and is naturally cooled by natural wind and heat radiation.

[0142] like Figure 5As shown in (A)-5(C), the naturally cooling electronic device 1 of Embodiment 1 of the present invention can be arranged on the floor, cabinet / rack, shelf, column and / or facade (including wall) in different ways. The figure shows the contact with the metal facade 13 and the floor 14. Figure 5 As shown in (A), one surface of the naturally cooled electronic device 1 contacts the metal facade 13 (or the outer surface of the chimney effect cabinet 8), and the area of ​​the contact heat conductive surface 5 is about 10% of the total outer surface area of ​​the closed housing 3; Figure 5 As shown in (B), two surfaces of the naturally cooled electronic device 1 are in contact with the metal facade 13 (or the outer surface of the chimney effect cabinet 8), and the area of ​​the contact heat conductive surface 5 is about 20% of the total outer surface area of ​​the closed housing 3; Figure 5 As shown in (C), two surfaces of the naturally cooled electronic device 1 contact the metal facade 13 (or the outer surface of the chimney effect cabinet 8), and one surface contacts the floor 14. The area of ​​the contact heat conductive surface 5 is about 50% of the total outer surface area of ​​the closed shell 3.

[0143] Example 2

[0144] like Figure 2 As shown, Embodiment 2 of the present invention discloses a naturally cooled electronic device 1 in which a heat generating electronic component 2 is a computing device. The computing device is a motherboard including a CPU and a GPU. The backs of the CPU and GPU are tightly attached to a temperature averaging plate through thermal grease. The temperature averaging plate (not shown in the figure) conducts the high heat generated by the CPU and GPU to the closed housing 3 and the device body cooling unit 4 of the naturally cooled electronic device 1. The closed housing 3 and the device body cooling unit 4 are integrally formed, and are naturally cooled by natural wind and heat radiation.

[0145] Example 3

[0146] like Figure 3 As shown, Embodiment 3 of the present invention discloses a naturally cooled electronic device 1 in which the heat-generating electronic component 2 is a computing device. The computing device is a motherboard including a CPU and a GPU. The CPU and GPU sides are tightly fitted with non-metal with high thermal conductivity, such as aluminum-based silicon carbide material, through thermal pads. The aluminum-based silicon carbide material (the left oblique line portion in the figure) conducts the high heat generated by the CPU and GPU to the contact thermal conductive surface 5 (the left black portion) of the naturally cooled electronic device 1. The contact thermal conductive surface 5 is fitted with the contact fixing surface 11 (the right black portion) of the device external cooling unit 6, and the high heat generated by the CPU and GPU is efficiently conducted to the device external cooling unit 6 through a heat pipe (the right oblique line portion in the figure), and then further naturally cooled by natural wind and heat radiation.

[0147] Example 4

[0148] like Figure 4A As shown, Embodiment 4 of the present invention discloses a naturally cooled electronic device 1 in which the heat-generating electronic component 2 is a computing device. The computing device is a motherboard including multiple CPUs and GPUs. The CPU and GPU sides are tightly fitted with non-metals with high thermal conductivity, such as graphene materials, through thermal pads. The aluminum-based silicon carbide material (the left oblique line portion in the figure) conducts the high heat generated by the CPU and GPU to the closed housing 3, the device body cooling unit 4 and the contact heat-conducting surface 5 (the left black portion) of the naturally cooled electronic device 1. The closed housing 3 and the device body cooling unit 4 are designed separately. The contact heat-conducting surface 5 is fitted with the contact fixing surface 11 (the right black portion) of the device external cooling unit 6. Part of the high heat generated by the CPU and GPU is efficiently conducted to the device external cooling unit 6 through a heat pipe (the right oblique line portion in the figure), and then further naturally cooled through natural wind and heat radiation.

[0149] like Figure 4B As shown, the naturally cooling electronic device 1 of embodiment 4 of the present invention can be quickly assembled and disassembled. The electronic components 2 are enclosed in a closed shell 3 including a shell body 31 and a cover body 32. The closed shell 3 is provided with a retractable spring pin 35 to fix the position. When quickly assembled, the device body cooling unit 4 is mounted on the closed shell 3 so that the spring pin 35 is supported in position to fix the closed shell 3; when quickly disassembled, the spring pin 35 is pressed to retract it into the closed shell 3, and then the device body cooling unit 4 is slid to open the closed shell 3 to take out the heat-generating electronic components 2 encapsulated therein.

[0150] Example 5

[0151] like Figure 6 As shown, embodiment 5 of the present invention discloses a structure in which the naturally cooling electronic device 1 of the present invention is carried on a square frame cabinet 7, and the square frame cabinet 7 includes a heat-conducting frame 71, and a contact fixing area (not shown in the figure) matching the outer contour of the contact heat-conducting surface 5 of the naturally cooling electronic device is provided on the heat-conducting frame 71, and the contact fixing area diffuses part of the heat conducted from the naturally cooling electronic device 1 to the heat-conducting frame 71 through a heat pipe for natural cooling.

[0152] Example 6

[0153] like Figure 7As shown, embodiment 6 of the present invention discloses a structure in which the naturally cooling electronic device 1 of the present invention is carried on a square frame cabinet 7, wherein the square frame cabinet 7 includes a heat conductive frame 71 and a cabinet cooling unit 72, and the heat conductive frame 71 is provided with a contact fixing area (not shown in the figure) matching the outer contour of the contact heat conductive surface 5 of the naturally cooling electronic device, and the contact fixing area diffuses part of the heat conducted from the naturally cooling electronic device 1 to the heat conductive frame 71 and the cabinet cooling unit 72 through a heat pipe for natural cooling.

[0154] Example 7

[0155] like Figure 8 As shown, Example 7 of the present invention discloses a structure for suspending a naturally cooling electronic device 1 on a chimney effect type cabinet 8; the chimney effect type cabinet 8 is a deformation of the cabinet frame structure, which is changed from a square frame to an internal hollow columnar structure, and its main structure is made of aluminum alloy material with high thermal conductivity, and the outer surface is provided with a plurality of equipment fixing installation areas (not shown in the figure) for contacting and fixing with the contact heat conduction area 5 of the naturally cooling electronic device 1, which are used to diffuse part of the heat conducted from the naturally cooling electronic device 1 to the entire chimney effect type cabinet 8, heat the air in the internal air flow channel 82 to form a "chimney effect" to naturally cool the entire equipment.

[0156] Among them, a base 84 fixedly connected to the I-beam frame of the floor (not shown in the figure) is welded at the bottom of the chimney effect type cabinet 8, so that the chimney effect type cabinet 8 is fixed in the room. At the same time, the metal floor and the base are designed to be through-connected from top to bottom. The airflow inside the chimney effect type cabinet 8 can penetrate the metal floor and the base, and form an internal airflow channel that is through-connected from top to bottom with the airflow channels inside the chimney effect type cabinets 8 on different floors, all the way to the natural ventilator on the roof (not shown in the figure).

[0157] Figures 12A-12C They are respectively a top view of the base 84, a bottom view of the base 84 welded with the chimney effect cabinet 8 (looking up from the bottom), and a top view of the metal floor 14. As can be seen from the figure, there are a large number of hollow parts on the base 84, which allow airflow to pass through unimpeded; the metal floor 14 has a metal mesh structure in the middle, and the mesh allows airflow to pass through unimpeded, which can also be a porous structure.

[0158] Example 8

[0159] like Fig. 9 As shown, Embodiment 8 of the present invention discloses an edge data center (Edge Data Center) using the naturally cooled electronic device 1 of the present invention. The edge data center includes an equipment chassis placed under a simple rainproof canopy, and the chassis carries a plurality of naturally cooled electronic devices 1 of the present invention.

[0160] Example 9

[0161] like Fig. 10A , 10B As shown, Example 9 of the present invention discloses a data center that adopts the natural cooling electronic equipment 1 of the present invention. The data center is an equipment layer structure, and the equipment layer is supported by pillars, and an air intake space is formed below (bottom floor), which is convenient for setting various air inlets and auxiliary fans. The data center is implemented by an all-steel building 9, and its pillars and metal floor 14 are made of steel with high thermal conductivity. The chimney effect cabinets 8 of Example 7 are arranged in a room according to a specific layout. The room is ventilated on all four sides, and natural wind can pass through the room as lateral wind, and the metal floor 14 adopts Fig. 12C The mesh panels shown above are permeable, so that the air entering from the bottom floor passes through the internal airflow channel 82 of the chimney effect cabinet 8 and directly reaches the natural ventilator 10 on the roof. As a result, the heat generated by the heat-generating electronic components 2 in the data center is diffused to the chimney effect cabinet 8 and the metal floor 14 through conduction, and then diffused to the entire all-steel building 9, and the entire building becomes a radiator. In addition, the airflow channel 82 inside each chimney effect cabinet 8 generates rising hot air flows that penetrate the floor slab due to the heating of cold air, forming a "chimney effect" of the entire building, which also assists in natural cooling.

[0162] Example 10

[0163] like Fig.11A , 11B As shown, embodiment 10 of the present invention discloses a data center that adopts the natural cooling electronic equipment 1 of the present invention. The data center is a four-layer structure of equipment layers, and the equipment layers are supported by pillars, forming an air intake space underneath (bottom floor) to facilitate the installation of various air intakes and auxiliary fans. The data center is implemented by an all-steel building 9, and its pillars and metal floor 14 are made of steel with high thermal conductivity. The chimney effect cabinets 8 of embodiment 7 are arranged in a room according to a specific layout. The room is ventilated on all four sides, and natural wind can pass through the room as lateral wind, and the metal floor 14 adopts the following method: Fig. 12C The mesh panels shown above are permeable, so that the air entering from the bottom floor passes through the internal airflow channel 82 of the chimney effect cabinet 8 and directly reaches the natural ventilator 10 on the roof. As a result, the heat generated by the heat-generating electronic components 2 in the data center is diffused to the chimney effect cabinet 8 and the metal floor 14 through conduction, and then diffused to the entire all-steel building 9, and the entire building becomes a radiator. In addition, the airflow channel 82 inside each chimney effect cabinet 8 generates rising hot air flows that penetrate the floor slab due to the heating of cold air, forming a "chimney effect" of the entire building, which also assists in natural cooling.

[0164] Embodiment 11

[0165] Embodiment 11 discloses a data center as described in Embodiment 10, except that Fig.13A , 13B As shown, the sunny side of the data center is equipped with solar panels 91. Fig.13A , 13B They are a side view and a stereoscopic view of the data center. As shown in the figure, the arrangement of the solar panels 91 of the data center cannot block the passage of natural wind, so the solar panels 91 are only arranged on the roof, the eaves space below the windows and on the ground brackets. The natural wind from the south can enter the all-steel building 9 unimpeded and blow through the chimney effect cabinets 8 in the room, thereby naturally cooling the naturally cooled electronic equipment 1 suspended on its side.

[0166] Example 12

[0167] Embodiment 12 discloses a data center as described in Embodiment 10, except that Fig.14 As shown, a rainwater collection pool 92 is arranged on the roof, and a cooling water storage pool 93 is arranged underground. The rainwater collection pool 92 can take away the heat of the chimney effect cabinet 8 and even the entire steel frame building 9 through a cold water channel (not shown in the figure) arranged in the air flow channel 82 of the chimney effect cabinet 8. After the cold water absorbs the heat, it can be naturally cooled by, for example, a heat exchange plate (not shown in the figure), or it can return to the upper part of the rainwater collection pool 92 on the roof after evaporation or boiling in the high-temperature area and condense into liquid. The cooling water storage pool 93 can take away the heat of the chimney effect cabinet 8 and even the entire steel frame building 9 through a cold water channel arranged in the air flow channel 82 of the chimney effect cabinet 8. After the cold water absorbs the heat, it can be naturally cooled by heat exchange with the low-temperature soil layer underground. The cold water channel can circulate by gravity or a micro-water pump to give a relatively small driving force, or realize circulation through phase change. The rainwater collection pool 92 and the cooling water storage pool 93 can circulate separately, or they can form a large cycle to achieve natural cooling together.

[0168] Through the above-mentioned embodiments, it can be seen that the naturally cooled electronic equipment, cabinets and data centers of the present invention do not rely on any external input energy, but only rely on the endogenous power generated by themselves, or only through micro-power assistance, to drive the heat energy to diffuse out of the equipment and exchange with the natural environment, which can greatly reduce the energy consumption of the data center and change its image as a "power tiger".

[0169] In addition, since the data center of the present invention can adopt an all-metal frame, the building structure has high strength and good energy absorption and deformation, and can withstand high-level typhoons and high-intensity earthquakes. Even a 14-level typhoon and a 7-level earthquake (intensity 8 degrees) are unlikely to affect the building structure. In addition, although the present invention is an open structure on all four sides, a metal expansion frame can be set on the outer wall, and a removable outer baffle or insulation layer can be flexibly set to block wind and rain during storms or extremely cold winters to limit the entry of wet rain and / or cold air. It can be seen that the naturally cooled electronic equipment, cabinets and data centers of the present invention are not only energy-saving, but also can be flexibly set and expanded as needed, can resist extreme weather attacks, and are easy to disassemble and maintain.

[0170] The specific embodiments described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A natural cooling electronic device, characterized in that: include: A closed housing, used to seal at least part of the electronic components of the naturally cooled electronic device to prevent water splashing, and to conduct heat generated inside the naturally cooled electronic device to the closed housing mainly by heat conduction; A device body cooling unit, located on the outer surface of the closed housing, for transferring at least part of the heat of the closed housing to the natural environment by means of natural wind cooling; The naturally cooled electronic device is cooled by natural cooling, and when the naturally cooled electronic device is running at maximum power, the heat flux density per unit area of ​​the closed housing can be controlled below a first threshold value; the first threshold value is 0.1 W / m 2 .

2. The natural cooling electronic device according to claim 1, characterized in that: The closed shell is made of a material with high thermal conductivity, and the thermal conductivity is greater than or equal to 10 W / m·K; the material with high thermal conductivity includes metal and / or non-metal.

3. The natural cooling electronic device according to claim 2, characterized in that: The material of the closed shell is selected from at least one of aluminum alloy, copper alloy, magnesium alloy, magnesium-lithium alloy, silver, carbon steel, stainless steel, high thermal conductivity ceramics, silicon carbide, aluminum-based silicon carbide, graphite composite material, diamond composite material, and graphene composite material.

4. The natural cooling electronic device according to claim 3, characterized in that: The closed shell includes a plurality of shells and an optional closed cover body matched therewith; the heat generating components of the naturally cooled electronic device are attached to the shells, or the heat generating components of the naturally cooled electronic device transfer heat to the closed shell through heat pipes, temperature averaging plates, and metal or non-metallic heat conducting structures with high thermal conductivity.

5. The natural cooling electronic device according to claim 4, characterized in that: Heat transfer is achieved between the heat pipe, the temperature plate, the metal or non-metal heat-conducting structure with high thermal conductivity and the heat-generating components of the naturally cooled electronic device, or between the closed housing and the heat-generating components of the naturally cooled electronic device, or between the closed housing and the heat pipe, the temperature plate, the metal or non-metal heat-conducting structure with high thermal conductivity, through a low thermal resistance thermal interface material, and the low thermal resistance thermal interface material is selected from liquid metal, phase change material, thermal grease, thermal adhesive, thermal pad and / or indium foil; The shell is an integrally formed aluminum alloy shell.

6. The natural cooling electronic device according to claim 1, characterized in that: The enclosed housing provides "three-proof" protection for the electronic components of the naturally cooling electronic device, namely, waterproof, dustproof, mildew-proof and salt-fog-proof; and / or The closed housing can provide airtight protection for the electronic components of the naturally cooled electronic device; and / or Heat is evenly distributed on the shell surface of the closed shell through heat pipes, temperature averaging plates, and metal or non-metal heat-conducting structures with high thermal conductivity.

7. The naturally cooling electronic device according to any one of claims 1 to 6, characterized in that: The equipment body cooling unit is integrally formed with the closed housing; The equipment body cooling unit is a finned radiator or an evaporative condenser driven by no external energy source; The outer surface of the cooling unit of the equipment body is provided with a thermal control coating with an emissivity greater than or equal to 0.8; The equipment body cooling unit includes a plurality of heat dissipation fins, and the distance between any two heat dissipation fins is between 5 and 20 mm; the thickness of the heat dissipation fins is between 0.5 and 5 mm; the height of the heat dissipation fins is between 10 and 200 mm; The heat dissipation fins are arranged vertically, in line with the direction of rising hot air; Heat is evenly distributed on the surface of the cooling unit of the equipment body through heat pipes, temperature averaging plates, and metal or non-metallic heat-conducting structures with high thermal conductivity.

8. The natural cooling electronic device according to claim 7, characterized in that: The distance between any two heat dissipation fins is 10 mm; the thickness of the heat dissipation fins is 2 mm.

9. The naturally cooling electronic device according to any one of claims 1 to 6, characterized in that: The naturally cooling electronic device also includes a contact heat-conducting surface, which is arranged on the outer surface of the closed shell and is used to conduct part of the heat on the closed shell to an equipment external cooling unit in contact with the contact heat-conducting surface; the equipment external cooling unit is located outside the naturally cooling electronic device and does not belong to the naturally cooling electronic device, and is used to transfer part of the heat on the closed shell of the naturally cooling electronic device to the natural environment in a natural cooling manner.

10. The natural cooling electronic device according to claim 9, characterized in that: The area of ​​the heat-conducting contact surface is between 1% and 90% of the total area of ​​the outer surface of the closed shell; The roughness Ra of the contact heat-conducting surface is better than 3.2 μm; The flatness of the contact heat-conducting surface is better than 0.3 mm / (100 mm*100 mm); The shape of the contact heat conduction surface is a plane, or a shape that matches the contour of the contact heat conduction part of the external cooling unit of the equipment; Heat transfer is achieved between the contact heat-conducting surface and the external cooling unit of the equipment through a low thermal resistance thermal interface material.

11. The natural cooling electronic device according to claim 10, characterized in that: The area of ​​the heat-conducting contact surface is between 16.7% and 50% of the total area of ​​the outer surface of the closed shell; The roughness Ra of the contact heat-conducting surface is less than 0.4 μm; The flatness of the contact heat-conducting surface is better than 0.1 mm / (100 mm*100 mm); Heat transfer is achieved between the contact heat-conducting surface and the external cooling unit of the device through liquid metal, phase change material, thermal grease, thermal adhesive, thermal pad and / or indium foil.

12. The natural cooling electronic device according to claim 9, characterized in that: The heat dissipated through the contact heat-conducting surface accounts for more than one tenth of the total heat generated inside the naturally cooled electronic device; and / or The naturally cooling electronic device further comprises a fan disposed adjacent to or closely to the device body cooling unit, for assisting heat dissipation by directly blowing or guiding airflow through the device body cooling unit; and / or The naturally cooled electronic device further comprises a liquid cooling plate arranged close to the contact heat conducting surface or a liquid cooling channel arranged inside the contact heat conducting surface, for assisting heat dissipation by allowing cooling liquid to flow through the liquid cooling plate or the liquid cooling channel; and / or The naturally cooling electronic equipment includes IT equipment and other functional equipment; the IT equipment includes at least one of computing equipment, storage equipment and network equipment; the other functional equipment includes at least one of power supply and distribution equipment, interface equipment and safety protection equipment; and / or A heating unit is also provided inside the naturally cooling electronic device, so as to enable the naturally cooling electronic device to start and stop normally even at low temperatures.

13. The natural cooling electronic device according to claim 12, characterized in that: The heat dissipated through the contact heat-conducting surface accounts for more than one third of the total heat generated inside the naturally cooled electronic device; and / or The first threshold is 0.04W / m 2 ; and / or The heating unit is a heating film, a PTC heating sheet, or a TEC semiconductor refrigerator.

14. A method for manufacturing a naturally cooling electronic device, characterized in that: The naturally cooled electronic device can be cooled by natural wind cooling, and when the naturally cooled electronic device is running at maximum power, the heat flux density per unit area of ​​the closed housing can be controlled below a first threshold value; the first threshold value is 0.1 W / m 2 ; The manufacturing method comprises the following steps: Manufacturing a closed housing for the naturally cooled electronic device; The heat generating components of the naturally cooled electronic device are attached to the closed housing, or the heat generating components of the naturally cooled electronic device and the inner wall of the closed housing are connected by heat pipes, temperature averaging plates, or metal or non-metal heat conducting structures with high thermal conductivity; The closed housing is sealed to be splashproof.

15. The manufacturing method according to claim 14, characterized in that: The closed shell includes a plurality of shells and optional covers that are matched and closed therewith.

16. The manufacturing method according to claim 14, characterized in that: In the sealing step, the sealing shell is integrally formed with the equipment body cooling unit; and / or The manufacturing method further comprises, after the sealing step, fixing a device body cooling unit on the closed housing by welding or screwing, so as to transfer at least part of the heat of the closed housing to the natural environment through the device body cooling unit; and / or The manufacturing method also includes a step of forming a contact heat-conducting surface on the closed shell after the sealing treatment step, wherein the contact heat-conducting surface is a part of the outer surface of the closed shell and is used to transfer part of the heat on the closed shell to an equipment external cooling unit that is in contact with the contact heat-conducting surface; the equipment external cooling unit is located outside the naturally cooled electronic device and is used to transfer part of the heat on the closed shell of the naturally cooled electronic device to the natural environment in a natural cooling manner.

17. The manufacturing method according to claim 16, characterized in that: The first threshold is 0.04W / m 2 .

18. A cluster of naturally cooling electronic devices, comprising at least two naturally cooling electronic devices according to any one of claims 1 to 13 working in collaboration, wherein the cluster of naturally cooling electronic devices can also achieve natural cooling.

19. A cabinet, characterized in that: The cabinet adopts an open structure; The cabinet includes a heat-conducting frame or a heat-conducting plate, and a contact fixing surface for fixing the naturally cooled electronic device; the contact fixing surface has an outer contour matching the contact heat-conducting surface of the naturally cooled electronic device, through which the heat transferred by the contact heat-conducting surface is conducted to the heat-conducting frame or the heat-conducting plate for natural cooling; wherein the naturally cooled electronic device is the naturally cooled electronic device as described in any one of claims 9 to 13.

20. The cabinet according to claim 19, characterized in that: The cabinet adopts a fully open structure with six sides without panels.

21. The cabinet according to claim 19, characterized in that: The cabinet further comprises a cabinet cooling unit, and the heat diffused onto the heat-conducting frame or the heat-conducting plate is further conducted to the cabinet cooling unit for natural cooling; Heat is evenly distributed on the surface of the adopted heat conduction frame, heat conduction plate and / or cabinet cooling unit through heat pipes, temperature averaging plates, and metal or non-metal heat conduction structures with high thermal conductivity; A contact fixing device is also provided between the contact fixing surface and the contact heat conducting surface, and the contact fixing device adopts a quick-install structure, which is convenient for quick installation and disassembly; The cabinet is a frame structure.

22. The cabinet according to claim 19, characterized in that: The cabinet has a chimney effect type structure, and the chimney effect type structure is an air flow channel inside the cabinet, or is located on the surface of the cabinet.

23. A data center, characterized in that: The data center adopts at least one natural cooling electronic device as described in any one of claims 1-13.

24. The data center according to claim 23, characterized in that: The data center comprises at least one accommodation space for accommodating the naturally cooled electronic equipment; The data center adopts an open structure; The main building structure of the data center is made of steel frame, aluminum alloy frame, wood structure, concrete structure, polymer membrane or polymer fiber.

25. The data center according to claim 23, characterized in that: The building structure of the data center is made of high thermal conductivity materials, so that part of the heat generated by the naturally cooled electronic equipment contained therein can be transferred to the building structure and transferred to the natural environment in a natural cooling manner; The data center adopts a modular structure and can be quickly built through assembly.

26. The data center according to any one of claims 23 to 25, characterized in that: A shielding structure is provided in at least one horizontal direction of the data center, and the shielding structure is any one of a rolling door structure, a rolling film structure, a window structure, a folding barrier, and a sliding barrier, and the shielding structure can be closed or opened to form an open structure; and / or Each floor of the data center adopts a floor with a through structure, so that the airflow under the floor can move upward through the through structure; and / or The bottom floor of the data center is provided with a plurality of air inlets; and / or The airflow channel of the data center further includes a valve or baffle capable of adjusting the airflow size, and the valve or baffle is at least arranged at the air inlet of the bottom layer; and / or The data center further includes an exhaust structure located on the roof, for exhausting the hot air flow penetrating from the roof; and / or The data center is further provided with a plurality of fans, which are used to directly blow the naturally cooled electronic equipment and / or cabinets for cooling, or, instead of directly blowing, assist in exhausting the hot air inside the data center; and / or The data center is further provided with a plurality of detachable air guide plates for guiding cold air to flow through the naturally cooled electronic equipment when the fan is working; and / or The data center is also equipped with solar panels to provide energy, and the arrangement of the solar panels does not block the path of natural wind entering the data center; and / or The data center further comprises a liquid cooling pipeline, wherein the liquid cooling pipeline is connected to a water source and is used to remove part of the heat generated by the naturally cooled electronic equipment by self-driving by gravity or driven by a water pump; and / or In the data center, free-cooling electronic equipment is located on the floor, cabinets, shelves, columns and / or facades.

27. The data center according to claim 26, characterized in that: A shutter-shaped baffle is installed in at least one horizontal direction of the data center, the rotation axis of the shutter-shaped baffle is a horizontal axis, and the air volume can be adjusted by adjusting the rotation angle of the shutter-shaped baffle; and / or The floor of the data center is made of a material with high thermal conductivity, wherein the material with high thermal conductivity includes metal and / or non-metal; and / or The exhaust structure is a natural ventilator / unpowered hood; and / or The fan is located under the floor or on the air inlet side of the vertical wall, and is used to blow air to form an airflow, and / or, the fan is located on the roof or on the air outlet side of the vertical wall, and is used to suck air to form an airflow; and / or The water source is a rainwater collection tank on the roof or an underground cooling water storage tank; and / or The naturally cooled electronic device conducts heat to the corresponding structure through contact with the heat-conducting surface to enhance heat dissipation.

28. The data center according to claim 27, characterized in that: A screen window or a filter is provided at the gap of the shielding structure; and / or The material with high thermal conductivity is at least one of stainless steel, carbon steel, aluminum alloy, magnesium alloy, magnesium-lithium alloy, copper alloy, silver, high thermal conductivity ceramics, silicon carbide, aluminum-based silicon carbide, graphite composite material, diamond composite material, and graphene composite material.

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