Method and device for vibration scribing of surface array microprotrusions

Abstract

The application relates to the technical field of vibration processing, in particular to a vibration scribing processing method and device for a surface array micro convex structure, wherein the method comprises the following steps: acquiring the shape, size and array characteristics of the surface array micro convex structure; selecting the optimal vibration cutting device based on the shape, size and array characteristics of the surface array micro convex structure; determining the working frequency and cutting depth of the optimal vibration cutting device based on the working principle of the vibration cutting device and the surface array micro convex structure; and selecting the optimal tool process parameters according to the shape, size and gradually changing size requirements of the surface array micro convex structure, so as to utilize the optimal vibration cutting device and tool process parameters to perform vibration scribing processing according to the working frequency and cutting depth, and generate the surface array micro convex structure. Therefore, the problems of the related art, such as the difficulty in forming the micro convex structure, the low forming efficiency and the like, are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vibration machining, and in particular to a vibration scribing machining method and device for surface array micro-convex structures. BACKGROUND

[0002] In recent years, surface micro-convex structures with periodic arrays have been widely used in many industrial fields such as aerospace, electronic devices, and biological medicine due to their unique wettability and larger surface area, which have significant advantages in condensation, heat transfer, biological antibacterial, and ice prevention and removal.

[0003] In related technologies, common manufacturing methods for material surface array micro-convex structures include photolithography, laser processing, electrical discharge machining, and chemical deposition. Among them, cutting machining has unique advantages in the field of metal surface micro-convex structure machining and manufacturing, such as high quality, low cost, and no pollution. In particular, high-frequency vibration of vibration cutting machining can significantly improve machining efficiency.

[0004] However, in related technologies, vibration cutting machining is basically a "pit" type material removal machining, which can process micro-pits or micro-grooves, but it is difficult to form micro-convex structures and has low forming efficiency, which needs to be improved. SUMMARY

[0005] The present application provides a vibration scribing machining method and device for surface array micro-convex structures to solve the problems in related technologies that vibration cutting machining is basically a "pit" type material removal machining, which can process micro-pits or micro-grooves, but it is difficult to form micro-convex structures and has low forming efficiency.

[0006] The first aspect embodiment of the present application provides a vibration scribing machining method for surface array micro-convex structures, including the following steps: obtaining the shape, size, and array characteristics of the surface array micro-convex structure; selecting the best vibration cutting device based on the shape, size, and array characteristics of the surface array micro-convex structure; determining the working frequency and cutting depth of the best vibration cutting device based on the working principle of the vibration cutting device and the surface array micro-convex structure; and selecting the best tool process parameters according to the shape, size, and gradual size requirements of the surface array micro-convex structure, to use the best vibration cutting device and the tool process parameters to perform vibration scribing machining according to the working frequency and the cutting depth, to generate the surface array micro-convex structure.

[0007] Optionally, in one embodiment of the present application, the tool process parameters include amplitude, relative motion speed, feed amount, and phase difference.

[0008] Optionally, in an embodiment of the present application, the selecting the optimal vibration cutting device based on the shape, size and array characteristics of the surface array micro-protrusions comprises: determining a vibration generation principle and a vibration dimension of the vibration cutting device according to the shape, size and array characteristics of the surface array micro-protrusions; and determining the optimal vibration cutting device according to the vibration generation principle and the vibration dimension.

[0009] Optionally, in an embodiment of the present application, the determining the working frequency and the cutting depth of the optimal vibration cutting device based on the working principle of the vibration cutting device and the surface array micro-protrusions comprises: determining the working frequency according to the vibration generation principle; and determining the cutting depth and time-varying information.

[0010] Optionally, in an embodiment of the present application, the surface array micro-protrusions comprise at least one of an approximately rhombic micro-protrusion, an approximately shell-shaped micro-protrusion and an approximately conical micro-protrusion.

[0011] A second aspect embodiment of the present application provides a vibration scribing processing device for surface array micro-protrusions, comprising: an obtaining module configured to obtain a shape, a size and array characteristics of a surface array micro-protrusion; a selecting module configured to select an optimal vibration cutting device based on the shape, size and array characteristics of the surface array micro-protrusion; a determining module configured to determine a working frequency and a cutting depth of the optimal vibration cutting device based on a working principle of the vibration cutting device and the surface array micro-protrusion; and a processing module configured to select optimal tool process parameters according to the shape, size and gradually changing size requirements of the surface array micro-protrusion, and to perform vibration scribing processing according to the working frequency and the cutting depth by using the optimal vibration cutting device and the tool process parameters, so as to generate the surface array micro-protrusion.

[0012] Optionally, in an embodiment of the present application, the tool process parameters comprise an amplitude, a relative motion speed, a feed amount and a phase difference.

[0013] Optionally, in an embodiment of the present application, the selecting module comprises: a first determining unit configured to determine a vibration generation principle and a vibration dimension of the vibration cutting device according to the shape, size and array characteristics of the surface array micro-protrusion; and a second determining unit configured to determine the optimal vibration cutting device according to the vibration generation principle and the vibration dimension.

[0014] Optionally, in an embodiment of the present application, the determining module comprises: a third determining unit configured to determine the working frequency according to the vibration generation principle; and a fourth determining unit configured to determine the cutting depth and time-varying information.

[0015] Optionally, in an embodiment of the present application, the surface array micro-convex structure comprises at least one of approximately rhombic micro-convex structure, approximately shell-shaped micro-convex structure and approximately conical micro-convex structure.

[0016] The third aspect embodiment of the present application provides an electronic device, comprising: a memory, a processor and a computer program stored in the memory and executable on the processor, and the processor executes the program to realize the surface array micro-convex structure vibration scribing processing method as described in the above embodiments.

[0017] The fourth aspect embodiment of the present application provides a computer readable storage medium, which stores a computer program, and the program is executed by a processor to realize the surface array micro-convex structure vibration scribing processing method as described above.

[0018] The embodiments of the present application can select appropriate vibration cutting devices and tool process parameters according to the shape, size and array characteristics of the surface array micro-convex structure, and then generate the best surface array micro-convex structure, improve the quality of vibration cutting processing surface array micro-convex structure, improve the processing efficiency, save the processing time and reduce the processing cost. Thus, the problems of vibration cutting processing basically being "pit" type material removal processing, being able to process micro-pits or micro-grooves, but being difficult to form micro-convex structures and having low forming efficiency, etc. in the related art are solved.

[0019] Additional aspects and advantages of the present application will be made apparent by the following description and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0020] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the accompanying drawings, wherein:

[0021] Figure 1 A flowchart of a surface array micro-convex structure vibration scribing processing method provided by an embodiment of the present application;

[0022] Figure 2 A principle diagram of one-dimensional simple harmonic vibration scribing processing surface array micro-convex structure provided by an embodiment of the present application;

[0023] Figure 3 A principle diagram of one-dimensional non-simple harmonic vibration scribing processing surface array micro-convex structure provided by an embodiment of the present application;

[0024] Figure 4 A principle diagram of two-dimensional "U" ellipse vibration scribing processing surface array micro-convex structure provided by an embodiment of the present application;

[0025] Figure 5A principle diagram of two-dimensional "O" elliptical vibration scribing processing of a surface array micro-convex structure is provided for an embodiment of the present application.

[0026] Figure 6 A principle diagram of two-dimensional elliptical vibration scribing processing of a surface array micro-convex structure is provided for an embodiment of the present application.

[0027] Figure 7 A flow chart of a vibration scribing processing step of a surface array micro-convex structure is provided for an embodiment of the present application.

[0028] Figure 8 A block diagram of a vibration scribing processing device of a surface array micro-convex structure is provided for an embodiment of the present application.

[0029] Figure 9 A structure diagram of an electronic device is provided for an embodiment of the present application. DETAILED DESCRIPTION

[0030] Embodiments of the present application are described in detail below with reference to the accompanying drawings, in which the same or similar elements or elements having the same or similar functions are denoted by the same or similar reference numerals throughout. The embodiments described below by reference to the accompanying drawings are exemplary and are intended to explain the present application, and cannot be understood as limiting the present application.

[0031] A vibration scribing processing method and device of a surface array micro-convex structure of an embodiment of the present application are described below with reference to the accompanying drawings. In view of the difficulty in forming a micro-convex structure and the low forming efficiency of vibration cutting processing mentioned in the background art, the present application provides a vibration scribing processing method of a surface array micro-convex structure, in which the shape, size and array characteristics of the surface array micro-convex structure are used to select appropriate vibration cutting devices and tool process parameters, and then the best surface array micro-convex structure is generated, thereby improving the quality of vibration cutting processing of the surface array micro-convex structure, improving the processing efficiency, saving the processing time, and reducing the processing cost. Thus, the problems of difficulty in forming a micro-convex structure and low forming efficiency of vibration cutting processing in the related art are solved.

[0032] Specifically, Figure 1 A flow chart of a vibration scribing processing method of a surface array micro-convex structure is provided for an embodiment of the present application.

[0033] As Figure 1 shown, the vibration scribing processing method of the surface array micro-convex structure includes the following steps:

[0034] In step S101, the shape, size and array characteristics of the surface array micro-convex structure are obtained.

[0035] It can be understood that the surface can be, but is not limited to, the surface of metal materials such as iron, copper, alloy, and stainless steel. The convex surface refers to a surface that is always below a tangent plane passing through any point on the surface.

[0036] Further, the embodiment of the present application can obtain the surface array micro-convex structure of the metal material through input, calibration, pre-setting, acquisition or identification of the technical personnel. The embodiment of the present application not only needs to obtain the shape of the surface array micro-convex structure, but also needs to obtain the size and array characteristics of the surface array micro-convex structure. The array characteristics of the surface array can be, but are not limited to, the phase difference between adjacent passes, the depth gradient, the size gradient, etc.

[0037] As a possible implementation, the embodiment of the present application can obtain the shape, size and array characteristics of the surface array micro-convex structure when the surface array micro-convex structure is processed.

[0038] The embodiment of the present application can improve the quality of the vibration cutting processing micro-convex structure, improve the processing efficiency, shorten the processing time, and save the processing cost by obtaining the shape, size and array characteristics of the surface array micro-convex structure.

[0039] Optionally, in an embodiment of the present application, the surface array micro-convex structure includes at least one of the approximately rhombic micro-convex structure, the approximately shell-shaped micro-convex structure and the approximately conical micro-convex structure.

[0040] It can be understood that the shape of the surface array micro-convex structure in the embodiment of the present application can be, but is not limited to, the approximately rhombic micro-convex structure, the approximately shell-shaped micro-convex structure and the approximately conical micro-convex structure.

[0041] In some embodiments, the vibration ruling processing method of the surface array micro-convex structure proposed by the present application can process one or several of the approximately rhombic micro-convex structure, the approximately shell-shaped micro-convex structure and the approximately conical micro-convex structure. The specific implementation mode can be processed according to the actual demand, and the present application does not make specific limitation.

[0042] In step S102, the best vibration cutting device is selected based on the shape, size and array characteristics of the surface array micro-convex structure.

[0043] It can be understood that the vibration cutting device is only a carrier for the implementation of the embodiment of the present application, and the embodiment of the present application can realize the effect of processing the surface array micro-convex structure on the material surface by controlling the trajectory of the tool. The vibration cutting device can be a one-dimensional vibration cutting device, a two-dimensional vibration cutting device and a three-dimensional vibration cutting device, etc.

[0044] Specifically, the approximately rhombic micro-convex structure can be processed using a one-dimensional vibration cutting device, a two-dimensional vibration cutting device, or a three-dimensional vibration cutting device, and the present application does not make specific limitations; the approximately shell-shaped micro-convex structure or the approximately conical micro-convex structure needs a two-dimensional vibration cutting device or a three-dimensional vibration cutting device, and the present application does not make specific limitations; and if the cutting depth is gradually changed, a vibration of one dimension needs to be added, that is, a vibration in the cutting depth direction.

[0045] In actual execution, different vibration cutting devices can be selected according to the shape, size and array characteristics of different surface array micro-convex structures, such as: at least one-dimensional vibration cutting device is needed for processing the approximately rhombic micro-convex structure, at least two-dimensional vibration cutting device is needed for processing the approximately shell-shaped micro-convex structure or the approximately conical micro-convex structure, and if the cutting depth is gradually changed, a vibration of one dimension needs to be added, that is, a vibration in the cutting depth direction.

[0046] The embodiments of the present application select different vibration cutting devices according to the shape, size and array characteristics of different surface array micro-convex structures, improve the efficiency of processing micro-convex structures, save processing time, and reduce unnecessary processing costs.

[0047] Optionally, in an embodiment of the present application, the best vibration cutting device is selected based on the shape, size and array characteristics of the surface array micro-convex structure, comprising: determining the vibration generation principle and vibration dimension of the vibration cutting device according to the shape, size and array characteristics of the surface array micro-convex structure; and determining the best vibration cutting device according to the vibration generation principle and vibration dimension.

[0048] It can be understood that the vibration cutting device used in the embodiments of the present application can be an ultrasonic frequency vibration generator based on ultrasonic resonance principle, or a low frequency vibration generator based on forced vibration principle, and the present application does not make specific limitations.

[0049] The input signal of the ultrasonic frequency vibration generator is generally a fixed frequency signal, which can be but is not limited to 20 kilohertz, 28 kilohertz, 40 kilohertz, 60 kilohertz, etc., and the present application does not make specific limitations. The frequency range of the low frequency vibration generator is generally between several hundred hertz and several thousand hertz, and the present application does not make specific limitations.

[0050] Further, the ultrasonic frequency vibration cutting device based on the ultrasonic resonance principle in the embodiments of the present application has a working frequency that is generally a fixed design parameter of the device and is not easy to adjust during processing. The working frequency of the low frequency vibration cutting device based on the forced vibration principle can be changed by adjusting the frequency of the input alternating current signal.

[0051] In actual implementation, the machining of approximately rhomboid micro-convex structures in this application embodiment is provided by one-dimensional vibration of the cutting tool. This one-dimensional vibration can be provided by a one-dimensional vibration cutting device, or by a two-dimensional or three-dimensional vibration cutting device; this application does not impose specific limitations. Machining of approximately shell-shaped or approximately conical micro-convex structures is provided by two-dimensional vibration of the cutting tool. This two-dimensional vibration can be provided by a two-dimensional vibration cutting device, or by a three-dimensional vibration cutting device; this application does not impose specific limitations. If a gradual depth of cut is required, an additional dimension of vibration, i.e., vibration in the depth of cut direction, is also needed. In machining surface array micro-convex structures, this application embodiment can select different vibration cutting devices by combining different vibration dimensions and different vibration principles.

[0052] The embodiments of this application can determine the vibration generation principle and vibration dimension of the vibration cutting device based on the shape, size and array characteristics of the surface array micro-convex structure, thereby improving the processing quality.

[0053] In step S103, based on the working principle of the vibration cutting device and the surface array micro-convex structure, the optimal working frequency and cutting depth of the vibration cutting device are determined.

[0054] As one possible approach, after determining the vibration generation principle and vibration dimension of the vibration cutting device, this application embodiment also needs to determine the operating frequency and cutting depth of the vibration cutting device.

[0055] Optionally, in one embodiment of this application, the optimal operating frequency and cutting depth of the vibration cutting device are determined based on the working principle of the vibration cutting device and the surface array micro-convex structure, including: determining the operating frequency according to the vibration generation principle; and determining the cutting depth and time-varying information.

[0056] It is understandable that, for different working principles of vibration cutting devices and surface array micro-protrusion structures, the embodiments of this application provide detailed explanations of the processing principles of one-dimensional vibration, two-dimensional vibration and three-dimensional vibration scribing of surface array micro-protrusion structures.

[0057] Specifically, such as Figure 2 As shown, Figure 2 A schematic diagram illustrating the principle of a one-dimensional simple harmonic vibration scribing surface array micro-convex structure provided in this application embodiment.

[0058] One-dimensional vibration can include, but is not limited to, simple harmonic vibration, triangular wave vibration, and vibrations of other shapes. The embodiments of this application use... Figure 2 Taking the one-dimensional simple harmonic motion shown as an example, and defining the one-dimensional vibration direction as the Y direction, the vibration expression of the knife tip can be:

[0059]

[0060] Wherein, A is the amplitude of the vibration cutting device, f is the working frequency of the vibration cutting device, is the initial phase of the tool vibration.

[0061] The embodiment of the present application applies a certain motion speed to the workpiece or the tool through the machine tool or the motion platform, so that the relative motion between the workpiece and the tool in the direction perpendicular to the vibration direction occurs, and then the actual motion expression of the tool tip point can be:

[0062]

[0063] The embodiment of the present application controls the relative motion between the tool and the workpiece to generate a certain cutting depth a p , and then the trajectory in formula (2) can be drawn and processed. After completing one processing, a certain distance is fed along the Y direction to perform the next drawing and processing. It should be noted that, in order to match the adjacent two drawing trajectories and form the micro convex structure together, the embodiment of the present application needs to satisfy that the feeding amount between the adjacent passes is 2 times of the amplitude, and the initial phase of the vibration of the adjacent passes differs by 180 degrees, that is, it needs to satisfy:

[0064]

[0065] At this time, the surface micro convex structure obtained by the embodiment of the present application is approximately rhombic, and the amplitude A and the relative motion speed v jointly determine the size of the micro convex structure. The expression of the length of the two diagonal lines at the bottom of the micro convex structure can be respectively:

[0066]

[0067] The ultrasonic frequency vibration cutting device based on the ultrasonic resonance principle in the embodiment of the present application has a working frequency which is usually a designed parameter of the device and is not easy to adjust in the processing process. However, for the low frequency vibration cutting device based on the forced vibration principle, the working frequency can be changed by adjusting the frequency of the input alternating current signal, so that the size control of the micro convex structure can be realized by adjusting the working frequency, and micro convex structures or gradually changing size micro convex structures of different sizes can be processed.

[0068] The low frequency vibration cutting device based on the forced vibration principle in the embodiment of the present application can not only have a simple harmonic vibration in one dimension, but also can have a triangular wave vibration, and can also have other waveform vibrations, such as Figure 3 As shown in the figure, the embodiment of the present application performs Fourier expansion on the obtained contour waveform, filters out high frequency signals according to the accuracy requirement, applies excitation signals of different frequencies and amplitudes on the vibration cutting device, and superimposes to obtain the required contour waveform trajectory. When adjacent two processes are performed, only the phase difference is required to be adjusted to make the extreme high point and the extreme low point of the adjacent passes coincide, so that the micro convex structure with accurate shape control can be processed.

[0069] As Figure 4 shown, Figure 4 The principle diagram of two-dimensional "U" elliptical vibration machining surface array micro-convex structure provided by the embodiment of the application.

[0070] In the embodiment of the application, the two-dimensional vibration of the tool can be provided by a two-dimensional vibration cutting device or a three-dimensional vibration cutting device. The tool of the embodiment of the application can make two-dimensional elliptical vibration under the driving of the vibration cutting device, the elliptical vibration plane is in the same plane as the surface to be machined, and the elliptical vibration trajectory can be a normal ellipse with the major axis and the minor axis parallel to the X direction and the Y direction, or a slant ellipse with a certain angle with the X direction and the Y direction. The embodiment of the application takes the counterclockwise normal elliptical vibration shown in Figure 4 as an example, and the expression of the vibration of the tool tip point can be:

[0071]

[0072] wherein, A X and A Y are the amplitudes of the X direction and the Y direction provided by the vibration cutting device for the tool, the positive and negative of A X and A Y determine the direction of the elliptical vibration trajectory, f is the working frequency of the vibration cutting device, is the initial phase of the tool vibration.

[0073] The embodiment of the application applies a certain motion speed to the workpiece or the tool through the machine tool or the motion platform, so that the relative motion occurs between the workpiece and the tool, the motion direction is defined as the X direction, and then the expression of the actual motion of the tool tip point can be:

[0074]

[0075] The embodiment of the application selects the relative motion speed v matched with the elliptical vibration parameters, so that the elliptical vibration trajectory is expanded to obtain a "U" shaped matching trajectory. The derivative of formula (6) in the X direction can be:

[0076]

[0077] The relative motion speed v can be obtained from formula (7), and the expression can be:

[0078] v=2πf|A X | (8)

[0079] The embodiment of the application controls the relative motion of the tool and the workpiece through the machine tool or the motion platform to generate a certain cutting depth a pThen, the scribe process can be performed according to the trajectory in formula (6). After completing one scribe process, feed a certain distance along the Y direction before performing the next scribe process. It should be noted that in order to match the scribe trajectories of adjacent scribe processes and form an array of micro-convex structures, the feed amount between adjacent scribe processes must be twice the amplitude of the Y direction, that is, the following must be satisfied:

[0080] Δy=2|A Y | (9)

[0081] The initial phase of vibration in adjacent passes in the embodiments of this application Choose according to actual needs, when the phase difference When the phase difference is 0 degrees, the micro-convex structures of adjacent passes are arranged in a straight line; when the phase difference is 0 degrees, the micro-convex structures of adjacent passes are arranged in a straight line. When the angle is 180 degrees, the micro-convex structures of adjacent passes are arranged in an alternating pattern.

[0082] The resulting surface micro-convex structure is approximately shell-shaped, with amplitude A. X and amplitude A Y Together, they determine the size of the micro-convex structure. The expressions for the lengths of the two diagonals at the bottom of the micro-convex structure can be as follows:

[0083]

[0084] In the embodiments of this application, the operating frequency does not affect the size of the micro-convex structure, but only the processing efficiency of the micro-convex structure. Therefore, in order to improve the processing efficiency, a larger operating frequency can be selected.

[0085] This application embodiment selects a relative motion velocity v that matches the elliptical vibration parameters, so that the unfolded elliptical vibration trajectory becomes a "U"-shaped trajectory. Similarly, a reasonably selected relative motion velocity v that matches the elliptical vibration parameters can also result in an "O"-shaped trajectory after the unfolded elliptical vibration trajectory, such as... Figure 5 As shown, this embodiment of the application takes a clockwise elliptical vibration trajectory as an example, wherein, Figure 5 A schematic diagram illustrating the principle of the two-dimensional “O” elliptical vibration processing surface array micro-convex structure provided in the embodiments of this application.

[0086] Depend on Figure 5 It can be seen that within one cycle, the velocity component along the X direction at the tip of the tool at the intersection of trajectories is equal to zero. That is, if we set the velocity component along the X direction to zero, its expression can be:

[0087]

[0088] Solving this problem yields the following results:

[0089]

[0090] Substitute equation (12) into equation (6), in order to make the trajectory overlap, the relative motion speed v should be selected:

[0091]

[0092] The embodiment of the application generates a certain cutting depth a by controlling the relative motion of the tool and the workpiece through the machine tool or the motion platform p Then, the processing can be performed according to the trajectory in equation (6). After completing one processing, a distance is fed along the Y direction, and the next processing is performed. It should be noted that, in order to match the adjacent two processing trajectories and form the array micro convex structure, the feeding amount between the adjacent passes needs to be 2 times the Y direction amplitude, that is, the following equation needs to be satisfied:

[0093] Δy = 2 |A Y | (14)

[0094] The vibration initial phase of the adjacent passes in the embodiment of the application The phase difference can be selected according to the actual requirement. When the phase difference is 0°, the micro convex structures of the adjacent passes are arranged in a straight line; when the phase difference is 180°, the micro convex structures of the adjacent passes are arranged in a staggered manner.

[0095] At this time, the surface micro convex structure obtained is approximately conical, and the amplitudes A X and A Y jointly determine the size of the micro convex structure, and the expression of the length of the two diagonal lines at the bottom of the micro convex structure can be respectively:

[0096]

[0097] In the embodiment of the application, the working frequency does not affect the size of the micro convex structure, but only affects the processing efficiency of the micro convex structure, so a larger working frequency can be selected to improve the processing efficiency.

[0098] In the method for processing the surface array micro convex structure through one-dimensional vibration scribing and the method for processing the surface array micro convex structure through two-dimensional vibration scribing, the cutting depth a p of the tool is provided by the relative position of the workpiece and the tool controlled by the machine tool or the motion platform.

[0099] Further, the tool can be installed on a three-dimensional vibration cutting device. At this time, the one-dimensional vibration or two-dimensional vibration of the tool is still in the plane of the workpiece surface, and the vibration in the Z direction can adjust the cutting depth a p in the scribing process at a high frequency. On this basis, the cutting depth gradually changes, and the surface array micro convex structure with an approximately rhombic shape, the surface array micro convex structure with an approximately shell shape, the surface array micro convex structure with an approximately conical shape, etc. can be processed. ​​

[0100] In addition, in the embodiment of the present application, by increasing the vibration in the cutting depth direction, not only the cutting depth gradient can be controlled, but also the lifting and falling of the tool can be controlled, thereby realizing two-dimensional elliptical vibration scribing to process discrete surface array micro-convex structures.

[0101] Specifically, when the tool falls, under the action of elliptical vibration, the tool contacts and scribes the surface material of the workpiece to generate a surface micro-convex structure, and the shape of the surface micro-convex structure is determined by the elliptical vibration trajectory of the tool; and when the tool is lifted, it is separated from the surface material of the workpiece and no scribing occurs, thereby realizing processing of discrete surface array micro-convex structures, as shown in FIG. 1, wherein, Figure 6 Figure 6 FIG. 1 is a schematic diagram of the principle of two-dimensional elliptical vibration scribing to process discrete surface array micro-convex structures according to an embodiment of the present application.

[0102] In the embodiment of the present application, compared with the processing method of processing surface array micro-convex structures, the processing method of two-dimensional elliptical vibration scribing to process discrete surface array micro-convex structures can independently scribe one by one micro-convex structures with different positions, different sizes and different depths to form different surface array micro-convex structures, and the adjacent two micro-convex structures obtained by scribing do not affect each other, and the processing method is more flexible.

[0103] As a possible implementation manner, the embodiment of the present application can determine the vibration generation principle and vibration dimension of the vibration cutting device according to the shape, size and array characteristics of the surface array micro-convex structure, and then select the best vibration cutting device to improve the processing efficiency and save the processing time.

[0104] In step S104, the best tool process parameters are selected according to the shape, size and gradient size requirements of the surface array micro-convex structure, so as to use the best vibration cutting device and tool process parameters to perform vibration scribing processing according to the working frequency and the cutting depth, and generate the surface array micro-convex structure.

[0105] It can be understood that the processing tool used in the embodiment of the present application can be but is not limited to a diamond sharp blade tool in the shape of a four-pyramid.

[0106] As a possible implementation manner, when processing the surface array micro-convex structure, the embodiment of the present application not only needs to determine the vibration cutting device of different dimensions, but also needs to select appropriate tool process parameters, thereby improving the processing quality, improving the processing efficiency and saving the processing cost.

[0107] Optionally, in an embodiment of the present application, the tool process parameters include amplitude, relative motion speed, feed amount and phase difference.

[0108] ​It is understood that, in the embodiments of this application, the indicators for measuring tool process parameters may be, but are not limited to, amplitude, relative motion speed, feed rate, and phase difference.

[0109] In some embodiments, appropriate tooling parameters can be selected for surface array micro-protrusion machining, which may include, but are not limited to, amplitude, relative motion speed, feed rate, and phase difference.

[0110] For example, in the one-dimensional vibration scribing process of this application, different amplitudes A and relative motion speeds v can be selected to process micro-convex structures of different sizes. Furthermore, the amplitude A and relative motion speed v can not only be constant values, but can also vary with time. That is, the embodiments of this application can process micro-convex structures of gradually varying sizes by reasonably selecting amplitudes A and relative motion speeds v that vary with time.

[0111] For two-dimensional vibration scribing with a cutting tool, different amplitudes A can be selected. X and amplitude A Y Fabricate micro-convex structures of different sizes. Simultaneously, amplitude A... X and amplitude A Y It can be a constant value, or it can vary over time. That is, the embodiments of this application can achieve this by appropriately selecting an amplitude A that varies with time. X and amplitude A Y Processing of micro-convex structures with gradually varying dimensions.

[0112] In this application embodiment, suitable tool process parameters can be selected for surface array micro-protrusion machining. Different amplitudes and speeds can machine micro-protrusion structures of different sizes. Furthermore, the tool amplitude and speed can not only be fixed values ​​but also vary over time. That is, this application embodiment can machine micro-protrusion structures of gradually varying sizes by reasonably selecting amplitudes and speeds that vary over time.

[0113] Combination Figure 7 As shown, the working principle of the vibration scribing method for surface array micro-convex structures according to embodiments of this application is explained in detail with multiple examples.

[0114] Example 1: Fabrication of Planar Surface Array Micro-convex Structures

[0115] like Figure 7 As shown, the process of fabricating an array of micro-convex structures on a plane according to embodiments of this application can be divided into the following steps:

[0116] Step S1: design the shape, size and array characteristics of the required surface array micro-convex structure, wherein the shape of the surface array micro-convex structure can be, but is not limited to, approximately rhombic, approximately conchiform, and approximately conical, the size of the surface array micro-convex structure can be, but is not limited to, transverse width, longitudinal width, and length of two diagonals, and the array characteristics of the surface array micro-convex structure can be, but is not limited to, phase difference between adjacent passes, depth of cut gradient, and size gradient, which are not specifically limited in the present application.

[0117] Step S2: select a suitable vibration cutting device. That is, the embodiment of the present application selects a suitable vibration cutting device according to the shape and array characteristics of the micro-convex structure, while also considering the vibration generation principle and vibration dimension of the vibration cutting device. Specifically, at least one-dimensional vibration of the tool is required for processing approximately rhombic micro-convex structures, which can be provided by a one-dimensional vibration cutting device, a two-dimensional vibration cutting device, or a three-dimensional vibration cutting device, which is not specifically limited in the present application. At least two-dimensional vibration of the tool is required for processing approximately conchiform micro-convex structures or approximately conical micro-convex structures, which can be provided by a two-dimensional vibration cutting device or a three-dimensional vibration cutting device, which is not specifically limited in the present application. If depth of cut gradient is required, an additional dimension of vibration, i.e., vibration in the depth of cut direction, is also required.

[0118] Step S3: select an appropriate working frequency. That is, the embodiment of the present application selects an appropriate working frequency f according to the vibration machining principle, and determines the depth of cut a p and whether it is time-varying.

[0119] Step S4: select appropriate tool process parameters (amplitude, relative motion speed, feed rate, phase difference). That is, the embodiment of the present application selects appropriate tool process parameters according to the shape and size of the micro-convex structure and the gradient size requirement, wherein the tool process parameters can include amplitude, relative motion speed, feed rate, and phase difference. For approximately rhombic micro-convex structures, the tool process parameters can be determined according to formulas (3) and (4). For approximately conchiform micro-convex structures, the tool process parameters can be determined according to formulas (8)-(10). For approximately conical micro-convex structures, the tool process parameters can be determined according to formulas (13)-(15).

[0120] Example Two: Processing of Surface Array Micro-Convex Structures on a Rotational Surface

[0121] The present application not only can process array micro-convex structures on a plane, but also can process array micro-convex structures on a rotational surface. The method for processing array micro-convex structures on a rotational surface is basically the same as the method for processing surface array micro-convex structures on a plane, and is specifically as follows.

[0122] This application embodiment uses the machining of an array of micro-convex structures on an outer cylindrical surface using a lathe as an example; the process is similar for the inner cylindrical surface. The cylindrical workpiece is fixed to the lathe spindle and rotates with it. Let the workpiece diameter be D, and the lathe spindle speed n and feed rate v be... f The following should be selected respectively:

[0123]

[0124] Formula (16) can be applied to the processing of micro-convex structures of different shapes.

[0125] For the approximately rhombic array micro-convex structure in this embodiment, since the nominal tool trajectory is a spiral when machining on a cylindrical surface, and there is no clear start and end point of each pass, the relative motion speed v should satisfy the following in order to achieve phase matching between adjacent passes:

[0126]

[0127] That is, the spindle speed n should satisfy:

[0128]

[0129] Where k is a positive integer.

[0130] According to the embodiments of this application, the tool process parameters for machining the array micro-convex structure on the rotating surface can be determined based on formulas (16)-(18), namely the spindle speed n and the feed rate v. f Other processing steps are the same as those for processing planar surface array micro-convex structures, such as... Figure 7 As shown.

[0131] The vibration scribing method for surface array micro-convex structures proposed in this application can select appropriate vibration cutting devices and tool process parameters based on the shape, size, and array characteristics of the surface array micro-convex structure, according to the vibration principle and vibration dimension. This results in the generation of optimal surface array micro-convex structures, improving the quality of vibration-cutting surface array micro-convex structures, increasing processing efficiency, saving processing time, and reducing processing costs. Therefore, it solves the problems in related technologies where vibration cutting is essentially a "pit-digging" material removal process, capable of processing micro-pits or micro-grooves, but facing difficulties in forming micro-convex structures and low forming efficiency.

[0132] Next, referring to the accompanying drawings, a vibration scribing apparatus for surface array micro-convex structures according to an embodiment of this application is described.

[0133] Figure 8 This is a block diagram of a vibration scribing apparatus for a surface array micro-convex structure according to an embodiment of this application.

[0134] like Figure 8As shown, the vibration cutting device 10 for the surface array micro-convex structure includes an obtaining module 100, a selecting module 200, a determining module 300 and a processing module 400.

[0135] Specifically, the obtaining module 100 is configured to obtain the shape, size and array characteristics of the surface array micro-convex structure.

[0136] The selecting module 200 is configured to select the optimal vibration cutting device based on the shape, size and array characteristics of the surface array micro-convex structure.

[0137] The determining module 300 is configured to determine the working frequency and cutting depth of the optimal vibration cutting device based on the working principle of the vibration cutting device and the surface array micro-convex structure.

[0138] The processing module 400 is configured to select the optimal tool process parameters according to the shape, size and gradual size requirements of the surface array micro-convex structure, and to generate the surface array micro-convex structure by using the optimal vibration cutting device and tool process parameters to perform vibration cutting processing according to the working frequency and cutting depth.

[0139] Optionally, in an embodiment of the present application, the tool process parameters include amplitude, relative motion speed, feed amount and phase difference.

[0140] Optionally, in an embodiment of the present application, the selecting module 200 includes a first determining unit and a second determining unit.

[0141] The first determining unit is configured to determine the vibration generation principle and vibration dimension of the vibration cutting device according to the shape, size and array characteristics of the surface array micro-convex structure.

[0142] The second determining unit is configured to determine the optimal vibration cutting device according to the vibration generation principle and vibration dimension.

[0143] Optionally, in an embodiment of the present application, the determining module 300 includes a third determining unit and a fourth determining unit.

[0144] The third determining unit is configured to determine the working frequency according to the vibration generation principle.

[0145] The fourth determining unit is configured to determine the cutting depth and time-varying information.

[0146] Optionally, in an embodiment of the present application, the surface array micro-convex structure includes at least one of an approximately rhombic micro-convex structure, an approximately shell-shaped micro-convex structure and an approximately conical micro-convex structure.

[0147] It should be noted that the foregoing explanation of the embodiment of the vibration scribing method of the surface array micro-protrusion structure is also applicable to the vibration scribing device of the surface array micro-protrusion structure of the embodiment, and will not be repeated here.

[0148] The vibration scribing device of the surface array micro-protrusion structure according to the embodiment of the present application can select appropriate vibration cutting devices and tool process parameters based on the vibration principle and vibration dimension according to the shape, size and array characteristics of the surface array micro-protrusion structure, and then generate the optimal surface array micro-protrusion structure, improve the quality of the vibration cutting processing of the surface array micro-protrusion structure, improve the processing efficiency, save the processing time, and reduce the processing cost. Thus, the problems of the related art, such as the vibration cutting processing basically being a "digging pit" type material removal processing, being able to process micro-pits or micro-slots, but being difficult to form micro-protrusion structures and having low forming efficiency, are solved.

[0149] Figure 9 The structure of the electronic device provided by the embodiment of the present application is shown in the schematic diagram. The electronic device can include:

[0150] The memory 901, the processor 902, and the computer program stored in the memory 901 and executable on the processor 902.

[0151] The processor 902 implements the vibration scribing method of the surface array micro-protrusion structure provided in the above embodiments when executing the program.

[0152] Further, the electronic device further includes:

[0153] The communication interface 903 is used for communication between the memory 901 and the processor 902.

[0154] The memory 901 is used to store the computer program executable on the processor 902.

[0155] The memory 901 can include a high-speed RAM memory, and can also include a non-volatile memory, such as at least one disk memory.

[0156] If the memory 901, the processor 902 and the communication interface 903 are implemented independently, the communication interface 903, the memory 901 and the processor 902 can be connected with each other through a bus and complete communication between each other. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For convenience of representation, Figure 9 Only one thick line is used to represent the bus in the figure, but it does not mean that there is only one bus or only one type of bus.

[0157] Optionally, in a specific implementation, if the memory 901, the processor 902 and the communication interface 903 are integrated on a chip, the memory 901, the processor 902 and the communication interface 903 can complete communication between each other through an internal interface.

[0158] The processor 902 can be a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement one or more embodiments of the present application.

[0159] The embodiment of the present application further provides a computer readable storage medium, which stores a computer program, and the program is executed by a processor to implement the surface array micro-protrusion vibration scribing processing method.

[0160] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or N embodiments or examples in a suitable manner. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of the different embodiments or examples without contradiction.

[0161] Moreover, the terms "first", "second", "third", etc. are used herein only to describe different steps or categories of steps. Thus, the use of the term "first" does not imply that different steps must be in a time sequence. Nor is it implied that a "first" step must precede a "second" step, that a "second" step, etc. must follow a "first" step, etc. Furthermore, when a process or method is described herein with several steps or several categories of steps, it should be understood that these are merely illustrative of the steps that can be employed in the process or method. Not all of the steps can be required, and in some cases, additional steps can be employed. The order of the steps can be varied, and some of the steps can be performed simultaneously. The steps can be performed in an order different than that described herein. The steps can be performed in any order, unless otherwise specified.

[0162] Any process or method described in flowcharts or otherwise described herein can be understood as representing code modules, segments, or portions of code that include one or more executable instructions for performing specific logic functions (or steps) or portions thereof, and the various embodiments of the application can include additional or fewer steps performing the same or equivalent functions. In some embodiments, the order of steps can be varied, and / or some steps can be performed simultaneously, unless otherwise specifically noted. The various embodiments of the application can be embodied in a number of different forms, all of which have been contemplated to be within the scope of the applicable patent princi¬ ples described herein.

[0163] Logic and / or steps represented in flowcharts or otherwise described herein, for example, can be embodied in computer-readable media, in which the sequences of instructions are permanently or transitorily stored or compiled in a static or dynamic manner. The computer-readable media can include one or more machine-accessible storage media, such as a fixed (hard) disk, diskette, optical storage media, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), flash memory, etc. The computer-readable media can also include one or more machine-accessible transitory media, such as electrical, optical, acoustical or other form of propagated signals, e.g., carrier waves, infrared signals, digital

[0164] It should be understood that parts of the present application can be realized in hardware, software, firmware, or a combination thereof. In the above embodiments, the N steps or methods can be realized by software or firmware stored in a memory and executed by a suitable instruction execution system. If realized in hardware and in another embodiment, any one or a combination of the following technologies known in the art can be used: discrete logic circuit with logic gate circuit for implementing logic functions on data signals, application specific integrated circuit with suitable combination logic gate circuit, programmable gate array (PGA), field programmable gate array (FPGA), etc.

[0165] Those skilled in the art of the present technology can understand that all or part of the steps carried out by the above-mentioned embodiments can be completed by a program instructing the relevant hardware, and the program can be stored in a computer readable storage medium. When the program is executed, it includes one of the steps of the method embodiment or a combination thereof.

[0166] In addition, each functional unit in each embodiment of the present application can be integrated into one processing module, or each unit can exist physically alone, or two or more units can be integrated into one module. The above-mentioned integrated module can be realized in the form of hardware or in the form of a software functional module. The integrated module, if realized in the form of a software functional module and sold or used as an independent product, can also be stored in a computer readable storage medium.

[0167] The above-mentioned storage medium can be a read-only memory, a magnetic disk or an optical disk, etc. Although the embodiments of the present application have been shown and described above, it should be understood that the above-mentioned embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above-mentioned embodiments within the scope of the present application.

Claims

1. A method for vibration scribing of a surface array of microprotrusions, characterized in that, The method comprises the following steps: acquiring the shape, size and array characteristics of the surface array micro-protrusions, wherein the surface array micro-protrusions comprise at least one of approximate rhombic micro-protrusions, approximate shell-shaped micro-protrusions and approximate conical micro-protrusions; selecting the optimal vibration cutting device based on the shape, size and array characteristics of the surface array micro-protrusions; determining the working frequency and cutting depth of the optimal vibration cutting device based on the working principle of the vibration cutting device and the surface array micro-protrusions; and selecting the optimal tool process parameters according to the shape, size and gradually changing size requirements of the surface array micro-protrusions, so as to perform vibration scribing processing on the surface array micro-protrusions by using the optimal vibration cutting device and the tool process parameters according to the working frequency and the cutting depth, thereby generating the surface array micro-protrusions. The selecting the optimal vibration cutting device based on the shape, size and array characteristics of the surface array micro-protrusions comprises: determining the vibration generation principle and vibration dimension of the vibration cutting device according to the shape, size and array characteristics of the surface array micro-protrusions; determining the optimal vibration cutting device according to the vibration generation principle and the vibration dimension.

2. The method of claim 1, wherein, The tool process parameters comprise amplitude, relative motion speed, feed rate and phase difference.

3. The method of claim 1, wherein, The determining the working frequency and cutting depth of the optimal vibration cutting device based on the working principle of the vibration cutting device and the surface array micro-protrusions comprises: determining the working frequency according to the vibration generation principle; determining the cutting depth and time-varying information.

4. A device for vibration scribing of a surface array of microprotrusions, characterized in that The method comprises: an acquiring module configured to acquire the shape, size and array characteristics of the surface array micro-protrusions, wherein the surface array micro-protrusions comprise at least one of approximate rhombic micro-protrusions, approximate shell-shaped micro-protrusions and approximate conical micro-protrusions; a selecting module configured to select the optimal vibration cutting device based on the shape, size and array characteristics of the surface array micro-protrusions; a determining module configured to determine the working frequency and cutting depth of the optimal vibration cutting device based on the working principle of the vibration cutting device and the surface array micro-protrusions; and a processing module configured to select the optimal tool process parameters according to the shape, size and gradually changing size requirements of the surface array micro-protrusions, so as to perform vibration scribing processing on the surface array micro-protrusions by using the optimal vibration cutting device and the tool process parameters according to the working frequency and the cutting depth, thereby generating the surface array micro-protrusions. The selecting module comprises: a first determining unit configured to determine the vibration generation principle and vibration dimension of the vibration cutting device according to the shape, size and array characteristics of the surface array micro-protrusions; a second determining unit configured to determine the optimal vibration cutting device according to the vibration generation principle and the vibration dimension.

5. The apparatus of claim 4, wherein, The tool process parameters comprise amplitude, relative motion speed, feed rate and phase difference.

6. An electronic device, comprising: The method comprises: a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the vibration scribing processing method of the surface array micro-protrusions according to any one of claims 1-3.

7. A computer-readable storage medium having stored thereon a computer program, characterized in that, The program is executed by the processor for implementing the vibration scribing method of the surface array micro-protrusions as claimed in any one of claims 1-3.

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