A forming apparatus for circumferentially distributed pins of electronic devices

Abstract

This invention discloses a forming device for circumferentially distributed pins of electronic devices, belonging to the field of automated production technology of electronic devices. It includes a forming cylinder (1), an upper forming module (2), a lower forming module (3), a mounting plate (4), a forming distance adjustment mechanism (5), a slide rail (6), a lower forming module mounting base (7), and a mounting base plate (8). The mounting plate (4) and the lower forming module mounting base (7) are respectively mounted on the mounting base plate (8), and the forming cylinder (1), the forming distance adjustment mechanism (5), and the slide rail (6) are distributed and mounted on the mounting plate (4). The product to be formed is placed in the designated position of the above device, and only one pressing is needed to form the circumferentially distributed pins, which can meet the forming requirements of multiple pins. Moreover, the forming efficiency is high and the consistency is good, thereby realizing the high-efficiency and high-performance production of the product.

Description

Technical Field

[0001] This invention relates to the field of automated production technology of electronic devices, and in particular to a forming device for circumferentially distributed pins of electronic devices. Background Technology

[0002] In the production of electronic components such as circulators / isolators, related parts (e.g., pins, connectors) need to be molded at specific angles to ensure reliable connection and grounding. Pins with a large number of data points are typically arranged linearly, making pin molding relatively easy with appropriate molding equipment. However, for circumferentially distributed pins in electronic components, molding each pin in a single operation is difficult. Existing linear molding equipment has unsatisfactory angles and results, impacting product yield. Furthermore, the circumferential distribution of the pins further increases the difficulty of manual molding, often leading to pin breakage and damage. Manual molding is also inefficient and inconsistent. Summary of the Invention

[0003] The purpose of this invention is to provide a forming apparatus for circumferentially distributed pins of electronic devices to solve the above-mentioned problems.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0005] A forming device for circumferentially distributed pins of an electronic device includes a forming cylinder, an upper forming module, a lower forming module, a mounting plate, a forming distance adjustment mechanism, a slide rail, a lower forming module mounting base, and a mounting base plate; wherein the mounting plate and the lower forming module mounting base are respectively mounted on the mounting base plate, and the forming cylinder, the forming distance adjustment mechanism, and the slide rail are distributed and mounted on the mounting plate.

[0006] As a preferred technical solution, the lower forming module consists of a lower forming module mounting base, a #1 pin forming lower mold, a #2 pin forming lower mold, a lower mold height positioning screw, a #3 pin forming lower mold, a lower mold forming height adjusting screw, a vacuum tube connector, and a lower mold adjusting block. The #1 pin forming lower mold, the #2 pin forming lower mold, and the #3 pin forming lower mold are installed in the contour cavity of the lower forming module mounting base, and the lower mold adjusting block is installed below the lower forming module mounting base.

[0007] As a further preferred technical solution, the #1 pin forming lower mold includes a #1 pin forming plane, a #1 pin forming lower mold limiting step, a product placement groove, and a product adsorption vacuum hole. The #1 pin forming plane is located on the upper end face of the #1 pin forming lower mold, the #1 pin forming lower mold limiting step is located on the lower part of one side of the #1 pin forming lower mold, the product placement groove is located at one corner of the #1 pin forming lower mold, and the product adsorption vacuum hole is located at the center of the product placement groove.

[0008] As a further preferred technical solution, the #2 pin forming lower mold includes a #2 pin forming plane, a #2 pin forming lower mold limiting step, and a #2 pin forming lower mold height adjustment surface. The #2 pin forming plane and the #2 pin forming lower mold height adjustment surface are located on the upper and lower end faces of the #2 pin forming lower mold, respectively, and the #2 pin forming lower mold limiting step is located on the lower part of one side of the #2 pin forming lower mold.

[0009] As a further preferred technical solution, the #3 pin forming lower mold includes a #3 pin forming plane and a #3 pin forming lower mold height adjustment surface located on its upper and lower end faces, respectively.

[0010] As a further preferred technical solution, the molding planes of pin 1, pin 2 and pin 3 are inclined surfaces with an inclination angle of 3-5°.

[0011] As a preferred technical solution, the upper forming module includes, from top to bottom, a forming cylinder connector, a pressure rod spring mounting block, a pressure rod mounting seat, a pressure rod, a base, and an upper mold forming assembly. A slider is provided on the back of the pressure rod mounting seat, and a positioning block is provided on the side of the base.

[0012] As a further preferred technical solution, the pressure rod spring mounting block is provided with a spring limiting screw mounting thread hole; the upper end of the pressure rod mounting base is provided with a pressure rod spring mounting block mounting thread hole and a pressure rod through hole respectively; the pressure rod consists of a pressure rod limiting section, a pressure rod guiding section and a pressure rod product contact section from top to bottom; the upper end of the base is provided with a pressure rod guiding hole that mates with the pressure rod, the side of the base is provided with a positioning block mounting hole for mounting the positioning block, and the lower part of the base is also provided with an upper pressure module height adjustment screw hole and a base mounting thread through hole.

[0013] As a further preferred technical solution, the upper mold forming assembly includes an upper mold height positioning screw located on its side wall, and a 2# pin forming upper mold, a 3# pin forming upper mold, and a 1# pin forming upper mold located on its upper end face.

[0014] As a further preferred technical solution, the upper mold for forming pin #1 is provided with an upper mold mounting cavity, a forming plane for upper mold #1, and a through hole for pressure rod; the upper mold for forming pin #2 is provided with a forming surface for upper mold #2 and a through hole for pressure rod #2; the upper mold for forming pin #3 is provided with a forming surface for upper mold #3 and a through hole for pressure rod #3.

[0015] Compared with the prior art, the advantages of the present invention are: the product to be formed is placed in the designated position of the above-mentioned device, and only one pressing is required to form the product, which can meet the forming requirements of multiple pins around the circumference; and the forming efficiency is high and the consistency is good, thereby realizing the production of products with high efficiency and high performance. Attached Figure Description

[0016] Figure 1 This is a pin state diagram of the product before molding according to an embodiment of the present invention;

[0017] Figure 2 This is an overall structural diagram of the forming device for circumferentially distributed pins of electronic devices according to an embodiment of the present invention;

[0018] Figure 3 for Figure 2 Structural diagram of the middle and lower molding module;

[0019] Figure 4 for Figure 3 Another perspective view;

[0020] Figure 5 for Figure 3 Structural diagram of the mounting base for the middle and lower molding modules;

[0021] Figure 6 for Figure 5 Diagram of the lower die structure for forming pin #1;

[0022] Figure 7 for Figure 5 Diagram of the lower die structure for forming pin #2;

[0023] Figure 8 for Figure 5 Diagram of the lower die structure for forming pin #3;

[0024] Figure 9 Figure 1 Structural diagram of the upper and middle molding modules;

[0025] Figure 10 for Figure 9 Assembly drawing of the pressure bar, base, and pressure bar spring mounting block;

[0026] Figure 11 Figure 9 Structural diagram of the intermediate pressure rod spring mounting block;

[0027] Figure 12 for Figure 9 Structural diagram of the upper and middle mold forming components;

[0028] Figure 13 for Figure 12 Diagram of the upper mold structure for forming pin #1;

[0029] Figure 14 for Figure 12 Diagram of the upper mold structure for pin #2;

[0030] Figure 15 for Figure 12 Diagram of the upper mold structure for forming pin #3;

[0031] Figure 16 This is a structural diagram of the forming distance adjustment mechanism;

[0032] Figure 17 This is a diagram showing the pin state of the product after molding, according to an embodiment of the present invention.

[0033] In the diagram: 1. Forming cylinder; 2. Upper forming module; 3. Lower forming module; 4. Mounting plate; 5. Forming distance adjustment mechanism; 501. Forming distance adjustment screw mounting plate; 502. Adjusting screw; 6. Slide rail; 7. Lower forming module mounting base; 8. Mounting base plate; 9. Lower forming module mounting base; 901. Contouring cavity; 10. Lower die for forming pin #1; 101. Forming plane for pin #1; 102. Limiting step for lower die for forming pin #1; 103. Product to be formed. 105. Placement groove; 11. Vacuum hole for product adsorption; 12. Lower mold for forming #2 pin; 13. Forming plane for #2 pin; 14. Limiting step for lower mold for forming #2 pin; 15. Height adjustment surface for lower mold for forming #2 pin; 16. Product to be formed; 17. Lower mold for forming #3 pin; 18. Forming plane for #3 pin; 19. Height adjustment surface for lower mold for forming #3 pin; 107. Lower mold forming height adjustment screw; 18. 17. Empty pipe connector; 18. Lower mold adjusting block; 19. Forming cylinder connecting piece; 10. Pressure rod spring mounting block; 1901. Spring limit screw mounting threaded hole; 20. Pressure rod mounting base; 2001. Pressure rod spring mounting block mounting threaded hole; 2002. Pressure rod through hole; 21. Pressure rod; 2101. Pressure rod limiting section; 2102. Pressure rod guide section; 2103. Pressure rod product contact section; 22. Base; 2201. Pressure rod guide hole; 2202. Positioning block mounting hole; 2203. 2204. Pressure module height adjustment screw hole; 23. Base mounting threaded through hole; 24. Upper mold forming assembly; 25. Slider; 26. Positioning block; 27. Upper mold height positioning screw; 28. Upper mold for forming pin #2; 29. ​​Upper mold for forming pin #2; 2001. Upper mold forming surface for pin #2; 2002. Through hole for pressure rod #2; 2003. Upper mold for forming pin #3; 2004. Upper mold for forming pin #1; 2005. Upper mold mounting contour cavity; 2006. Upper mold forming plane for pin #1; 2007. Through hole for pressure rod. Detailed Implementation

[0034] The invention will now be further described with reference to the accompanying drawings. Example

[0035] A forming apparatus for circumferentially distributed pins of an electronic device, see [reference] Figure 2 It includes a forming cylinder 1, an upper forming module 2, a lower forming module 3, a mounting plate 4, a forming distance adjustment mechanism 5, a slide rail 6, a lower forming module mounting base 7, and a mounting base plate 8; wherein, the mounting plate 4 and the lower forming module mounting base 7 are respectively mounted on the mounting base plate 8, and the forming cylinder 1, the forming distance adjustment mechanism 5, and the slide rail 6 are distributed and mounted on the mounting plate 4;

[0036] In this embodiment, the structure of the lower molding module 3 is as follows: Figure 3 and Figure 4As shown, the lower forming module mounting base 9, a lower forming mold 10 for pin 1, a lower forming mold 11 for pin 2, a lower mold height positioning screw 12, a lower forming mold 14 for pin 3, a lower mold forming height adjusting screw 15, a vacuum tube connector 16, and a lower mold adjusting block 17 are used. The lower forming molds 10, 11, and 14 are installed within the contour cavity 901 of the lower forming module mounting base 9. Figure 5 As shown, the lower mold adjustment block 17 is installed below the lower molding module mounting base 9;

[0037] In this embodiment, the structure of the lower die 10 for forming pin #1 is as follows: Figure 6 As shown, it includes a #1 pin forming plane 101, a #1 pin forming lower mold limiting step 102, a product placement groove 103, and a product adsorption vacuum hole 105. The #1 pin forming plane 101 is located on the upper end face of the #1 pin forming lower mold 10. The #1 pin forming lower mold limiting step 102 is located on the lower part of one side of the #1 pin forming lower mold 10. The product placement groove 103 is located at one corner of the #1 pin forming lower mold 10, and the product adsorption vacuum hole 105 is located at the center of the product placement groove 103.

[0038] In this embodiment, the structure of the lower mold 11 for forming pin #2 is as follows: Figure 7 As shown, it includes a 2# pin forming plane 1101, a 2# pin forming lower mold limiting step 1102, and a 2# pin forming lower mold height adjustment surface 1103. The 2# pin forming plane 1101 and the 2# pin forming lower mold height adjustment surface 1103 are located on the upper and lower end faces of the 2# pin forming lower mold 11, respectively. The 2# pin forming lower mold limiting step 1102 is located on the lower part of one side of the 2# pin forming lower mold 11.

[0039] In this embodiment, the structure of the lower die 14 for forming pin #3 is as follows: Figure 8 As shown, it includes a No. 3 pin forming plane 1401 and a No. 3 pin forming lower mold height adjustment surface 1402 located on its upper and lower end faces, respectively;

[0040] In this embodiment, the structure of the upper molding module 2 is as follows: Figure 9 As shown, the assembly includes, from top to bottom, a forming cylinder connector 18, a pressure rod spring mounting block 19, a pressure rod mounting seat 20, a pressure rod 21, a base 22, and an upper mold forming assembly 23. A slider 24 is provided on the back of the pressure rod mounting seat 20, and a positioning block 25 is provided on the side of the base 22. The assembly diagram of the pressure rod 21, the base 22, and the pressure rod spring mounting block 19 is shown below. Figure 10 As shown,

[0041] In this embodiment, the structure of the pressure rod spring mounting block 19 is as follows: Figure 11 As shown, the base 21 has a spring limiting screw mounting threaded hole 1901; the upper end of the pressure rod mounting base 20 has a pressure rod spring mounting block mounting threaded hole 2001 and a pressure rod through hole 2002; the pressure rod 21 consists of a pressure rod limiting section 2101, a pressure rod guide section 2102 and a pressure rod product contact section 2103 from top to bottom; the upper end of the base 22 has a pressure rod guide hole 2201 that mates with the pressure rod 21; the side of the base 22 has a positioning block mounting hole 2202 for mounting the positioning block 25; the lower part of the base 22 also has an upper pressure module height adjustment screw hole 2203 and a base mounting threaded through hole 2204.

[0042] In this embodiment, the structure of the upper mold forming component 23 is as follows: Figure 10 As shown, it includes an upper mold height positioning screw 26 located on its side wall, and a #2 pin forming upper mold 27, a #3 pin forming upper mold 28, and a pressure rod through hole 2903 located on its upper end face;

[0043] In this embodiment, the structure of the upper mold 29 for forming pin #1 is as follows: Figure 13 As shown, it is provided with an upper mold mounting cavity 2901 and a #1 pin upper mold forming plane 2902; the structure of the #2 pin forming upper mold 27 is as follows: Figure 14 As shown, it is provided with a #2 pin upper mold forming surface 2701 and a #2 pressure rod through hole 2702; the structure of the #3 pin forming upper mold 28 is as follows Figure 15 As shown, it is provided with a 3# pin upper mold forming surface 2801 and a 3# pressure rod through hole 2802;

[0044] The structure of the product to be formed 13 is as follows Figure 1 As shown, it includes three pins: pin 1 (1301), pin 2 (1302), and pin 3 (1303); its state before molding is as follows. Figure 1 As shown;

[0045] In use, the product to be formed 13 is installed in the groove 103 of the product placement mold 10 for the #1 pin forming lower mold. The #1 pin 1301, #2 pin 1302, and #3 pin 1303 of the product to be formed are distributed on the #1 pin forming plane 101 of the corresponding #1 pin forming lower mold 10, the #2 pin forming plane 1101 of the #2 pin forming lower mold 11, and the #3 pin forming plane 1401 of the #3 pin forming lower mold 14. The #1 pin forming plane 101, the #2 pin forming plane 1101, and the #3 pin forming plane 1401 are processed to a certain tilt angle to cooperate with the upper mold of the product, so as to finally realize the forming state and angle of each pin of the product to be formed 13. In this embodiment, the tilt angle of each forming plane is 5°, and the final processed product is as follows. Figure 17 The product shown;

[0046] The lower mold height positioning screw 12 is installed on the lower mold adjusting block 17. The end of the lower mold height positioning screw 12 is connected to the height adjustment surface 101 of the lower mold 10 for forming the 1# pin, the height adjustment surface 1103 of the lower mold 11 for forming the 2# pin, and the height adjustment surface 1402 of the lower mold 14 for forming the 3# pin. The corresponding height is adjusted according to the forming angle of the pin of the product 13 to be formed, and then locked by the lower mold height positioning screw 12.

[0047] The #1 pin forming lower mold 10 is designed with a product placement groove 103 for placing the product to be formed 13. The depth of the product placement groove 103 is determined by the distance between the angle and the bottom surface of the product to be formed after forming. The product adsorption vacuum hole 105 of the #1 pin forming lower mold 10 is connected to the vacuum tube connector 16 to ensure reliable positioning of the product to be formed 13 after loading.

[0048] The molding cylinder connector 18 of the upper molding module 2 is connected to the molding cylinder 1 to realize the up and down movement of the upper molding module 2; the pressure rod spring mounting block 19 is installed in the pressure rod spring mounting block mounting thread hole 2001 of the pressure rod mounting seat 20, and the pressure rod mounting seat 20 is installed on the base 22; under the action of the spring, the pressure rod 21's pressure rod limiting section 2101 contacts the upper surface of the pressure rod mounting seat 20, and the spring is installed in the spring limiting screw mounting thread hole 1901 of the pressure rod spring mounting block 19, and the spring is pre-compressed by thread locking; the pressure rod 21 realizes a certain range of axial movement through the pressure rod guide hole 2201; the positioning block 25 is installed in the positioning block mounting hole 2202 and works with the molding distance adjustment mechanism 5 to realize the up and down movement distance of the upper molding module 2; the slider 24 works with the slide rail 6 to realize the guidance of the up and down movement; the upper mold molding assembly 23 is installed on the base 22 through the base mounting thread through hole 2204;

[0049] The structure of the molding distance adjustment mechanism 5 is as follows: Figure 16 As shown, the molding distance adjustment mechanism 5 consists of a molding distance adjustment screw mounting plate 501 and an adjustment screw 502. The molding distance adjustment screw mounting plate 501 is mounted on the mounting plate 4, and the adjustment screws are mounted at both ends of the molding distance adjustment screw mounting plate 501. In use, the positioning block 25 moves between the adjustment screws 502, and the distance of movement is adjusted by rotating the adjustment screws 502 outwards.

[0050] The #2 pin forming upper mold 27 and #3 pin forming upper mold 28 of the upper mold forming assembly 23 are respectively installed in the upper mold mounting contour cavity 2901 and cooperate with the #1 pin forming plane 2902 to realize the pin forming function of the upper mold; the forming height of the #2 pin forming upper mold 27 and #3 pin forming upper mold 28 can be adjusted by the screw in the upper pressure module height adjusting screw hole 2203 and fixed by the upper mold height positioning screw 26;

[0051] The pressure rod 21 passes through the pressure rod through hole 2903. When the upper forming module 2 is pressed down, the pressure rod product contact section 2103 of the pressure rod 21 contacts the upper surface of the product 13 to be formed. Under the reaction force, the pressure rod 21 moves up and applies a certain force to the product under the action of the spring to ensure that the product position does not change, so as to facilitate the forming operation of its pins.

[0052] The pressure rod 21 forms the pressure rod through hole 2702 of the upper mold 27 through pin 2 and the pressure rod through hole 2802 of the upper mold 28 through pin 3;

[0053] The molding planes 2902 (pin #1), 2701 (pin #2), and 2801 (pin #3) of the upper molding module 2, and the molding planes 101 (pin #1), 1101 (pin #2), and 1401 (pin #3) of the lower molding module 3, are designed as corresponding planes or slopes according to the molding angle and shape requirements of the corresponding pins.

[0054] The pin forming of the final product relies on the upper forming module 2 and the lower forming module 3 under the force of the forming cylinder 1 to achieve the required forming angle and shape.

[0055] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A forming apparatus for circumferentially distributed pins of an electronic device, characterized in that, The system includes a forming cylinder (1), an upper forming module (2), a lower forming module (3), a mounting plate (4), a forming distance adjustment mechanism (5), a slide rail (6), a lower forming module mounting base (7), and a mounting base plate (8); wherein the mounting plate (4) and the lower forming module mounting base (7) are respectively mounted on the mounting base plate (8), and the forming cylinder (1), the forming distance adjustment mechanism (5), and the slide rail (6) are distributed and mounted on the mounting plate (4); wherein: The lower forming module (3) consists of a lower forming module mounting base (9), a 1# pin forming lower mold (10), a 2# pin forming lower mold (11), a lower mold height positioning screw (12), a 3# pin forming lower mold (14), a lower mold forming height adjustment screw (15), a vacuum tube connector (16), and a lower mold adjustment block (17). The 1# pin forming lower mold (10), the 2# pin forming lower mold (11), and the 3# pin forming lower mold (14) are installed in the contour cavity (901) of the lower forming module mounting base (9), and the lower mold adjustment block (17) is installed below the lower forming module mounting base (9). The #1 pin forming lower mold (10) includes a #1 pin forming plane (101), a #1 pin forming lower mold limiting step (102), a product placement groove (103), and a product adsorption vacuum hole (105). The #1 pin forming plane (101) is located on the upper end face of the #1 pin forming lower mold (10). The #1 pin forming lower mold limiting step (102) is located on the lower part of one side of the #1 pin forming lower mold (10). The product placement groove (103) is located at one corner of the #1 pin forming lower mold (10), and the product adsorption vacuum hole (105) is located at the center of the product placement groove (103). The #2 pin forming lower mold (11) includes a #2 pin forming plane (1101), a #2 pin forming lower mold limiting step (1102), and a #2 pin forming lower mold height adjustment surface (1103). The #2 pin forming plane (1101) and the #2 pin forming lower mold height adjustment surface (1103) are located on the upper and lower end faces of the #2 pin forming lower mold (11), respectively. The #2 pin forming lower mold limiting step (1102) is located on the lower part of one side of the #2 pin forming lower mold (11). The #3 pin forming lower die (14) includes a #3 pin forming plane (1401) and a #3 pin forming lower die height adjustment plane (1402) located on its upper and lower end faces respectively. The molding planes of pin 1 (101), pin 2 (1101) and pin 3 (1401) are inclined surfaces with an inclination angle of 3-5°.

2. The forming apparatus for circumferentially distributed pins of electronic devices according to claim 1, characterized in that, The upper forming module (2) includes a forming cylinder connector (18), a pressure rod spring mounting block (19), a pressure rod mounting seat (20), a pressure rod (21), a base (22), and an upper mold forming assembly (23) arranged sequentially from top to bottom. A slider (24) is provided on the back of the pressure rod mounting seat (20), and a positioning block (25) is provided on the side of the base (22).

3. The forming apparatus for circumferentially distributed pins of electronic devices according to claim 2, characterized in that, The spring mounting block (19) is provided with a spring limiting screw mounting thread hole (1901); the upper end of the spring mounting base (20) is provided with a spring mounting block mounting thread hole (2001) and a spring through hole (2002); the spring (21) consists of a spring limiting section (2101), a spring guiding section (2102), and a spring product contact section (2103) from top to bottom; the upper end of the base (22) is provided with a spring guiding hole (2201) that cooperates with the spring (21); the side of the base (22) is provided with a positioning block mounting hole (2202) for mounting the positioning block (25); the lower part of the base (22) is also provided with an upper pressure module height adjustment screw hole (2203) and a base mounting thread through hole (2204).

4. The forming apparatus for circumferentially distributed pins of electronic devices according to claim 2, characterized in that, The upper mold forming assembly (23) includes an upper mold height positioning screw (26) located on its side wall, and a 2# pin forming upper mold (27), a 3# pin forming upper mold (28), and a 1# pin forming upper mold (29) located on its upper end face.

5. The forming apparatus for circumferentially distributed pins of electronic devices according to claim 4, characterized in that, The #1 pin forming upper mold (29) is provided with an upper mold mounting cavity (2901), a #1 pin upper mold forming plane (2902), and a pressure rod through hole (2903); the #2 pin forming upper mold (27) is provided with a #2 pin upper mold forming surface (2701) and a #2 pressure rod through hole (2702); the #3 pin forming upper mold (28) is provided with a #3 pin upper mold forming surface (2801) and a #3 pressure rod through hole (2802).

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