A device for replacing and debugging an ejector pin

Abstract

The present invention provides a device for replacing and debugging an ejector pin, the device comprising at least: a base; a fixing member fixed on the base for fixing the ejector pin base; a lifting member fixed on the base for lifting the ejector pin in the ejector pin base; and a microscope for observing whether the ejector pin is in the correct position during the lifting process. The device for replacing and debugging an ejector pin of the present invention can stably fix the ejector pin base on the fixing member, and then lift the ejector pin inside the ejector pin base through the lifting member. During the lifting process, a microscope can be used to observe whether the ejector pin is in the center position of the ejector pin cap hole, which can achieve observation and correction at the same time, which is efficient and convenient. The present invention is easy to operate, convenient for observing and debugging the center position of the ejector pin, safe and labor-saving when replacing the ejector pin, avoids damage to the ejector pin during manual replacement, reduces costs and increases efficiency, and improves UPH.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor manufacturing, and in particular relates to a device for replacing and debugging an ejector pin. Background Art

[0002] A die bonder is a type of wafer bonding equipment widely used in post-chip packaging in the semiconductor industry. The die bonder's bonding process involves manually or by a loading mechanism transferring the substrate or PCB to the fixture's working position. A dispensing mechanism then dispenses glue onto the substrate or PCB where the wafer is to be bonded. The die bonder then moves from its origin to the wafer pickup position, where it is placed on a film-supported expander wafer tray. Once the die bonder is in place, the suction nozzle moves downward, while the ejector pins move upward to lift the wafer. After the wafer is picked up, the die bonder returns to the origin position, completing the bonding process.

[0003] As can be seen from the above, the ejector pin device is an indispensable device in the crystal bonder. It mainly plays the role of ejecting the wafer and separating the wafer from the crystal film. During the process, the ejector pin is prone to blunting or breaking, and at this time the ejector pin needs to be replaced. In the prior art, after replacing the ejector pin, when debugging the center position of the ejector pin, it is necessary to manually hold the ejector pin device and use the hexagon socket to lift the bottom of the ejector pin for direct observation. This debugging method is inconvenient to observe and is time-consuming and labor-intensive. In addition, when the ejector pin is not at the center of the hole in the ejector pin cap, continuing to use the hexagon socket to lift its bottom is likely to cause damage to the ejector pin.

[0004] Therefore, providing a new ejector pin replacement and debugging device is a problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a device for replacing and debugging an ejector pin, which is used to solve the problems in the prior art of difficult observation, long debugging time and easy damage to the ejector pin during ejector pin replacement and debugging.

[0006] To achieve the above-mentioned and other related purposes, the present invention provides a device for replacing and debugging an ejector pin, the device comprising at least:

[0007] base;

[0008] A fixing member, fixed on the base, for fixing the ejector base;

[0009] A lifting member, fixed on the base, for lifting the ejector pin in the ejector pin base;

[0010] A microscope is used to observe whether the ejector pin is in the correct position during the ejection process.

[0011] As an optimized solution of the ejector pin replacement and debugging device of the present invention, the fixing member includes a clamping portion and a supporting portion supported between the clamping portion and the base.

[0012] As an optimized solution of the thimble replacement and debugging device of the present invention, the thimble base includes at least a base body and a thimble cap located on the top of the base body, the base body has a recessed portion that cooperates with the clamping portion to clamp, and the thimble cap is provided with a hole for the thimble to pass through.

[0013] As an optimized solution of the ejector pin replacement and debugging device of the present invention, the thickness of the clamping portion and the recessed portion are equal.

[0014] As an optimized solution of the ejector pin replacement and debugging device of the present invention, the lifting member includes a guide rail, a lifting drive unit and a lifting platform connected to the lifting drive unit. The guide rail is vertically fixed on the base, and the lifting drive unit moves up and down along the guide rail, thereby driving the lifting platform to move up and down to lift the ejector pin in the ejector base.

[0015] As an optimized solution of the thimble replacement and debugging device of the present invention, the guide rail is provided with bar teeth, and the lifting drive unit includes a housing, a gear located in the housing, and a hand crank located outside the housing and connected to the gear. The gear is engaged with the bar teeth, and the jacking platform is driven up and down by the hand crank.

[0016] As an optimized solution of the ejector pin replacement and debugging device of the present invention, the microscope includes an observation part, a bottom and a connecting part, the base, the fixing part and the lifting part are all placed on the bottom, the observation part is located above the ejector pin base, and the connecting part is supported between the bottom and the observation part.

[0017] As an optimized solution of the ejector pin replacement and debugging device of the present invention, the ejector pin base, the base, the fixing member and the lifting member are made of stainless steel.

[0018] As described above, the thimble replacement and debugging device of the present invention includes: a base; a fixing member fixed on the base for fixing the thimble base; a lifting member fixed on the base for lifting the thimble in the thimble base; a microscope for observing whether the thimble is in the correct position during the lifting process. The thimble replacement and debugging device of the present invention can stably fix the thimble base on the fixing member, and then lift the thimble inside the thimble base through the lifting member. During the lifting process, a microscope can be used to observe whether the thimble is in the center position of the thimble cap hole, which can be corrected while observing, which is efficient and convenient. The present invention is easy to operate, convenient for observing and debugging the center position of the thimble, safe and labor-saving when replacing the thimble, and avoids damage to the thimble during manual replacement, thereby reducing costs and increasing efficiency, and improving UPH. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1This is a front view of the ejector pin replacement and debugging device of the present invention.

[0020] Figure 2 It is a side view of the ejector pin replacement and debugging device of the present invention.

[0021] Figure 3 This is a structural diagram of the ejector base of the present invention.

[0022] Figure 4 This is a schematic diagram of the ejector base of the present invention being placed on an ejector replacement and debugging device for debugging.

[0023] Component number description

[0024] 1 base

[0025] 2 fixings

[0026] 21 Clamping part

[0027] 22 Support

[0028] 3 lifting parts

[0029] 31 guide rails

[0030] 32 Lifting drive unit

[0031] 321 housing

[0032] 322 Hand Joystick

[0033] 33 Lifting platform

[0034] 34 bar teeth

[0035] 4 Microscope

[0036] 41 Observation Department

[0037] 42 bottom

[0038] 43 Connection

[0039] 5 Ejector base

[0040] 51 base body

[0041] 52 Thimble Cap

[0042] 53 recess

[0043] 6 thimbles DETAILED DESCRIPTION

[0044] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0045] Please refer to the accompanying drawings. It should be noted that the illustrations provided in this embodiment are merely schematic illustrations of the basic concept of the present invention. Therefore, the drawings only show components relevant to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be varied arbitrarily, and the component layout may also be more complex.

[0046] The ejector pins in a die bonder can become blunt or break after repeated wafer ejection. Conventional methods typically replace ejector pins manually, using a hexagon socket to adjust the pins. This method makes it difficult to observe the pin's position, is time-consuming and labor-intensive, and can easily damage the pin. In light of this, the present invention provides a novel ejector pin replacement and adjustment device to address this issue.

[0047] like Figures 1 to 4 As shown, the present invention provides a device for replacing and debugging an ejector pin, which comprises at least: a base 1, a fixing member 2, a lifting member 3 and a microscope 4; the fixing member 2 is fixed to the base 1 and is used to fix the ejector pin base 5; the lifting member 3 is fixed to the base 1 and is used to lift the ejector pin 6 in the ejector pin base 5; the microscope 4 is used to observe whether the ejector pin 4 is in the correct position during the lifting process.

[0048] like Figure 1 and Figure 2 As shown, as an example, the fixing member 2 includes a clamping portion 21 and a supporting portion 22 supported between the clamping portion 21 and the base 1. The clamping portion 21 is used to clamp and fix the ejector base 5 so that the ejector base 5 is stably fixed thereon, which facilitates the lifting member 3 to drive the ejector 6 inside the ejector base 5 to lift up, and the ejector 6 moves vertically upward without tilting, thereby reducing the risk of damage to the ejector 6. Of course, in other embodiments, the fixing member 2 may also be other suitable structures, as long as the ejector base 5 can be clamped stably and the ejector 6 can be ejected vertically. The fixing member 2 structure of this embodiment includes a clamping portion 21 and a supporting portion 22, and the structure is simple and easy to implement.

[0049] As an example, the material of the base 1 and the fixing member 2 includes but is not limited to stainless steel.

[0050] like Figure 3As shown, as an example, the ejector base 5 includes at least a base body 51 and an ejector cap 52 located on top of the base body 51. The base body 51 has a recess 53 that cooperates with the clamping portion 21 for clamping. The ejector cap 52 has a hole (not shown) for the ejector pin 6 to pass through. Of course, the interior of the ejector base 5 may also include a movable seat that directly contacts the ejector pin and a vacuum structure for adsorbing the wafer film, etc., which are not limited here.

[0051] As an example, the material of the ejector base 5 includes but is not limited to stainless steel.

[0052] like Figure 4 As shown, since the base body 51 has a recess 53 on its surface, this recess 53 can be directly embedded in the clamping portion 21, thereby securing the ejector base 5. Furthermore, the clamping portion 21 and the recess 53 have equal thickness. In this way, the recess 53 can be precisely embedded in the clamping portion 21. When the ejector pin 6 is lifted, the ejector base 5 does not move. After the ejector base 5 is clamped by the clamping portion 21, its axis is perpendicular to the horizontal plane. When the ejector pin 6 is lifted, it can move vertically upward through the center of the hole in the ejector cap 52 without tilting or damage.

[0053] As an example, the lifting member 3 includes a guide rail 31, a lifting drive unit 32, and a lifting platform 33 connected to the lifting drive unit 32. The guide rail 31 is vertically fixed to the base 1. The lifting drive unit 32 moves up and down along the guide rail 31, thereby driving the lifting platform 33 to move up and down, thereby lifting the ejector 6 in the ejector base 5. Of course, in other embodiments, the lifting member 3 can also be other suitable structures, as long as it can generate a vertical upward force to vertically eject the ejector 6. The lifting member 3 structure of this embodiment includes the guide rail 31, the lifting drive unit 32, and the lifting platform 33, and the structure is simple and easy to implement.

[0054] Furthermore, the guide rail 31 is provided with bar teeth 34. The lifting drive unit 32 includes a housing 321, a gear (not shown) located within the housing 321, and a hand crank 322 located outside the housing 321 and connected to the gear. The gear engages with the bar teeth 34, and the hand crank 322 drives the lift platform 33 up and down. The hand crank 322 drives the ejector pin 6 upward to lift the wafer, saving effort. The hand cranking process allows for controlled movement of the ejector pin 6, facilitating debugging while observing through the microscope 4 and further reducing the risk of damage to the ejector pin 6.

[0055] As an example, the material of the lifting member 3 includes but is not limited to stainless steel.

[0056] As an example, the microscope 4 includes an observation portion 41, a bottom portion 42, and a connecting portion 43. The base 1, the fixing member 2, and the lifting member 3 are all placed on the bottom portion 42. The observation portion 41 is located above the ejector base 5, and the connecting portion 43 is supported between the bottom portion 42 and the observation portion 41. The observation portion 41 of the microscope 4 can be used to observe whether the ejector 6 is centered in the hole of the ejector cap 52, allowing for simultaneous observation and correction, which is efficient, convenient, and time-saving.

[0057] The ejector pin replacement and debugging device of the present invention is applied to a flip-chip die bonder. Specifically, the device is used to replace and adjust the position of the ejector pin 6 in the ejector pin base 5 of the flip-chip die bonder, so that the ejector pin 6 can be smoothly ejected from the center position of the hole of the ejector pin cap 52 during the process, which helps to separate, pick up and transfer the subsequent wafer from the film, reduce costs and increase efficiency, and improve UPH (Units Per Hour).

[0058] In summary, the present invention provides a device for replacing and debugging an ejector pin, the device comprising at least: a base 1; a fixing member 2 fixed on the base 1 for fixing the ejector pin base 5; a lifting member 3 fixed on the base 1 for lifting the ejector pin 6 in the ejector pin base 5; a microscope 4 for observing whether the ejector pin 6 is in the correct position during the lifting process. The ejector pin replacement and debugging device of the present invention can stably fix the ejector pin base 5 on the fixing member 2, and then lift the ejector pin 6 inside the ejector pin base 5 through the lifting member 3. During the lifting process, the microscope 4 can be used to observe whether the ejector pin is in the center position of the hole in the ejector cap 52, which can be corrected while observing, which is efficient and convenient. Therefore, the present invention is easy to operate, convenient for observing and debugging the center position of the ejector pin 6, safe and labor-saving when replacing the ejector pin 6, and avoids damage to the ejector pin 6 during manual replacement, thereby reducing costs and increasing efficiency, and improving UPH.

[0059] Therefore, the present invention effectively overcomes various shortcomings of the prior art and has high industrial utilization value.

[0060] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A device for replacing and debugging an ejector pin, characterized in that: The device at least comprises: base; A fixing member, fixed on the base, for fixing the ejector base; A lifting member, fixed on the base, for lifting the ejector pin in the ejector pin base; A microscope is used to observe whether the ejector pin is in the correct position during the ejection process.

2. The ejector pin replacement and debugging device according to claim 1, characterized in that: The fixing member includes a clamping portion and a supporting portion supported between the clamping portion and the base.

3. The ejector pin replacement and debugging device according to claim 2, characterized in that: The thimble base at least includes a base body and a thimble cap located on the top of the base body, the base body has a recessed portion that cooperates with the clamping portion to clamp, and the thimble cap is provided with a hole for the thimble to pass through.

4. The ejector pin replacement and debugging device according to claim 3, characterized in that: The clamping portion and the recessed portion have the same thickness.

5. The ejector pin replacement and debugging device according to claim 1, characterized in that: The lifting member includes a guide rail, a lifting drive unit and a lifting platform connected to the lifting drive unit. The guide rail is vertically fixed on the base. The lifting drive unit moves up and down along the guide rail, thereby driving the lifting platform to move up and down to lift the ejector in the ejector base.

6. The ejector pin replacement and debugging device according to claim 5, characterized in that: The guide rail is provided with bar teeth, and the lifting drive unit includes a shell, a gear located in the shell, and a hand crank located outside the shell and connected to the gear. The gear is engaged with the bar teeth, and the lifting platform is driven to move up and down through the hand crank.

7. The ejector pin replacement and debugging device according to claim 1, characterized in that: The microscope includes an observation part, a bottom and a connecting part. The base, the fixing part and the lifting part are all placed on the bottom. The observation part is located above the ejector base, and the connecting part is supported between the bottom and the observation part.

8. The ejector pin replacement and debugging device according to claim 1, characterized in that: The ejector base, the base, the fixing member and the lifting member are made of stainless steel.

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